CN117457598A - Electronic element heat dissipation packaging structure, manufacturing process and terminal equipment - Google Patents

Electronic element heat dissipation packaging structure, manufacturing process and terminal equipment Download PDF

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Publication number
CN117457598A
CN117457598A CN202311774942.0A CN202311774942A CN117457598A CN 117457598 A CN117457598 A CN 117457598A CN 202311774942 A CN202311774942 A CN 202311774942A CN 117457598 A CN117457598 A CN 117457598A
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CN
China
Prior art keywords
heat dissipation
substrate
enclosure
enclosing
electronic component
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Pending
Application number
CN202311774942.0A
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Chinese (zh)
Inventor
刘亚磊
董行行
朱爱兰
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Honor Device Co Ltd
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Honor Device Co Ltd
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Application filed by Honor Device Co Ltd filed Critical Honor Device Co Ltd
Priority to CN202311774942.0A priority Critical patent/CN117457598A/en
Publication of CN117457598A publication Critical patent/CN117457598A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The embodiment of the application relates to the technical field of terminal equipment and provides an electronic element heat dissipation packaging structure, a manufacturing process and terminal equipment, wherein the electronic element heat dissipation packaging structure comprises a substrate, a first enclosing piece and a heat dissipation cover, and the substrate is provided with an electronic element; the first enclosing piece is arranged on the substrate and encloses the electronic element; the heat dissipation cover is covered on the substrate and is abutted to one side, far away from the substrate, of the first enclosing member, the heat dissipation cover, the first enclosing member and the substrate enclose to form a first sealing cavity, the electronic element is arranged in the first sealing cavity, and the first sealing cavity is filled with heat conduction medium. According to the electronic element heat dissipation packaging structure, the first enclosing piece is arranged on the periphery of the electronic element needing to conduct work heat dissipation to form the first sealing cavity, so that independent packaging of the electronic element is met, the electronic element is rapidly transmitted to the heat dissipation cover through the heat conduction medium and then is transmitted to the outside through the heat dissipation cover, and the whole structure is simpler.

Description

Electronic element heat dissipation packaging structure, manufacturing process and terminal equipment
Technical Field
The present disclosure relates to the field of terminal devices, and particularly to a heat dissipation package structure for an electronic component, a manufacturing process for the heat dissipation package structure for an electronic component, and a terminal device.
Background
With the progress of technology, demands of terminals are increasing, for example, high performance, high reliability, ultra-thin, etc., so that the integration of electronic components in the terminals is also increasing, and meanwhile, the high integration is accompanied by high power consumption, which results in a large amount of heat generated in the operation process of the terminals. In order to ensure that the terminal device can operate normally, heat dissipation is required for each electronic component therein.
In the related art, according to different heat dissipation objects, a heat dissipation plate, a heat dissipation fan, a heat conducting medium, etc. may be generally used to dissipate heat, and in particular, the space size of an electronic component is limited, and the heat conducting medium is filled in the corresponding gap to accelerate the heat conduction.
The liquid metal has better heat dissipation performance, and the heat dissipation efficiency is about several times that of the heat conduction silica gel, so that the liquid metal is used for filling the corresponding gap of the electronic element in equipment with higher heat dissipation requirement, and the heat dissipation effect of the electronic element can be greatly improved. However, the liquid metal is also a good electrical conductor, so when the liquid metal is used for conducting heat and dissipating heat, the corresponding heat dissipating packaging structure has complex and tedious process and higher material cost.
Disclosure of Invention
The embodiment of the application provides an electronic element heat dissipation packaging structure, a manufacturing process and terminal equipment, which are used for solving the technical problem that the whole structure of the corresponding electronic element heat dissipation packaging structure in the terminal equipment is complex.
In order to achieve the above purpose, the embodiment of the present application adopts the following technical scheme:
in a first aspect, an embodiment of the present application provides a heat dissipation packaging structure for an electronic component, including a substrate, a first enclosure, and a heat dissipation cover, where the substrate is provided with the electronic component, and the substrate is used as a carrier, and the electronic component is a main heating component on the substrate and needs to dissipate heat; the first enclosing piece is arranged on the substrate and encloses the electronic element, wherein the first enclosing piece encloses the periphery of the electronic element, so that the electronic element has independent and separated areas relative to other elements on the substrate; the heat dissipation cover is arranged on one side of the substrate, far away from the substrate, of the first enclosing member in a butt mode, the heat dissipation cover is a structural member with a heat dissipation function, after the heat dissipation cover is packaged and covered with the substrate, the heat dissipation cover, the first enclosing member and the substrate enclose to form a first sealing cavity, the electronic element is arranged in the first sealing cavity, and the first sealing cavity is filled with a heat conducting medium which has good heat conduction performance, the electronic element is completely wrapped by the heat conducting medium, and working heat generated by the electronic element can be quickly transmitted to the heat dissipation cover through the heat conducting medium and then transmitted to the outside through the heat dissipation cover.
Wherein the thermal conductive medium includes, but is not limited to, liquid metal, graphene, silica gel, silicone grease, plastic, etc.; meanwhile, the heat dissipation cover can be made of metal, ceramic, resin and the like.
In view of the heat conduction effect and shielding effect of the heat dissipation cover, the heat dissipation cover may be a metal cover, and the material of the metal cover includes, but is not limited to, stainless steel, cupronickel, magnesium aluminum alloy, and the like.
The first enclosing member is a structural member with a blocking effect, for example, according to actual use requirements, the first enclosing member can be a plastic member, a rubber member, a metal member, a ceramic member and the like, and according to the molding mode, the first enclosing member can be directly arranged on the substrate as a complete molding finished product, and can also be formed on the substrate in a gradual molding mode.
The manner of filling the heat conductive medium in the first sealing cavity can be as follows: before the heat dissipation cover is arranged on the substrate, injecting a heat conduction medium into a space surrounded by the first surrounding baffle piece, and then covering the heat dissipation cover; or, the heat dissipation cover is arranged on the substrate to form a first sealing cavity in a surrounding manner, then an opening corresponding to the first sealing cavity is formed in the heat dissipation cover, a heat conduction medium is injected into the first sealing cavity through the opening, and then the opening is sealed.
The number of the first enclosing parts can be determined by the electronic components needing to be enclosed, and one electronic component corresponds to one first enclosing part or a plurality of electronic components correspond to one first enclosing part; similarly, the number of the heat dissipation covers is also related to the number of the first enclosing members, and one heat dissipation cover can correspond to one first enclosing member or a plurality of first enclosing members.
The technical scheme in the embodiment of the application has at least the following technical effects or advantages:
according to the electronic element heat dissipation packaging structure, the first enclosing piece is arranged on the periphery of the electronic element needing to conduct work heat dissipation, the heat dissipation cover, the first enclosing piece and the substrate enclose to form the first sealing cavity, the electronic element is packaged in the independent space, then the heat conduction medium is filled in the first sealing cavity, the electronic element is completely covered by the heat conduction medium, so that work heat generated by the electronic element is quickly transmitted to the heat dissipation cover through the heat conduction medium, and then the heat is transmitted to the outside through the heat dissipation cover. According to the electronic element heat dissipation packaging structure, the requirement of independent heat dissipation of the electronic element can be met only through the first enclosing piece, and the overall structure is simpler.
In some embodiments, the first enclosure member is disposed between the substrate and the heat dissipation cover in an interference fit manner, so as to promote a pressing force of the heat dissipation cover on the first enclosure member, so that the first enclosure member is stably disposed between the substrate and the heat dissipation cover, and promote tightness of the first sealing cavity.
Specifically, the height of the first enclosure member placed on the substrate should be greater than the distance between the surface of the substrate and the inner wall of the heat dissipation cover, and at the same time, the height of the first enclosure member can be adaptively adjusted according to the actual packaging requirement and the stability requirement.
In some embodiments, the ratio of the height of the first enclosure to the height of the inner wall of the heat dissipation cover from the surface of the substrate is 1.1-1.25, it is understood that the ratio of the height of the first enclosure to the height of the surface of the substrate may be 1.1, 1.15, 1.2, 1.25, and the like, and in this numerical range, the heat dissipation cover may apply a more suitable pressing force to the first enclosure, and, at the same time, may maintain the structural stability of the first enclosure, and reduce the probability of the first enclosure being deformed by extrusion to cause enclosure failure.
In some embodiments, the height of the first enclosure is 0.5mm to 0.62mm; that is, the height of the first enclosure may be 0.5mm, 0.51mm, 0.52mm, 0.53mm, 0.54mm, 0.55mm, 0.56mm, 0.57mm, 0.58mm, 0.59mm, 0.60mm, 0.61mm, 0.62mm, etc.; alternatively, the thickness of the first enclosure may be 0.15mm to 0.35mm, i.e., the thickness of the first enclosure may be 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.20mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.30mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, etc.; or the height of the first enclosing piece is 0.5 mm-0.62 mm; and the thickness of the first enclosure piece is 0.15 mm-0.35 mm.
In some embodiments, the first enclosure includes a plurality of first colloids stacked along a height direction thereof, and it is understood that the number of the first colloids is one, two, three or more, so as to be adaptively adjusted according to a height of the electronic component placed on the substrate; meanwhile, when the number of the first colloids is more than two, the heights of the first colloids can be the same or different, and the height direction of the first colloids is the same as that of the first enclosure.
Specifically, the first colloid is formed by a dispensing process, and thus relates to the size of a corresponding dispensing machine, a dispensing needle head and the performance of glue, wherein the materials of the first colloid include, but are not limited to, organic silica gel, hot melt adhesive, two-component glue, water-based glue and the like, and the first colloids with different heights, thicknesses and corresponding hardness are obtained by setting corresponding dispensing amounts, dispensing speeds and curing times. Meanwhile, when the first surrounding baffle is formed by stacking a plurality of first colloids, the adhesive dispensing interval time between two first colloids is also needed to be considered, so that corresponding bonding connection relation is formed between two adjacent first colloids.
The first enclosing member is manufactured by adopting a dispensing process, the forming process is simpler, the forming cost is lower, the connection stability between the first enclosing member and the substrate can be correspondingly improved, and meanwhile, the connection reliability between the first enclosing member and the heat dissipation cover can be further improved.
In some embodiments, the end of the first colloid facing the heat dissipation cover is arc-shaped, and it can be understood that, taking the first colloid facing the heat dissipation cover and having the first position as an example, the end of the first colloid facing the heat dissipation cover is arc-shaped, the contact area between the first colloid and the heat dissipation cover can be reduced by using the arc-shaped arrangement, and the tightness between the first enclosure and the heat dissipation cover can be further improved on the basis of interference fit of the first colloid and the heat dissipation cover.
Here, the arc-shaped end portion of the first colloid may mean that the flatness of the end portion of the first colloid is worse than that of the other end portion, and a certain shape undulation exists, so that the existence of a corresponding structural undulation at the end portion of the first colloid may be regarded as an arc shape.
In some embodiments, the electronic component heat dissipation packaging structure further includes a second enclosure member, the forming process and the shape of the second enclosure member may be the same as or different from those of the first enclosure member, the second enclosure member is disposed on the substrate and is disposed around the first enclosure member, so that the second enclosure member, the heat dissipation cover, the first enclosure member and the substrate form a second sealed cavity, the second sealed cavity is independent relative to the first sealed cavity, and the second sealed cavity and the first sealed cavity are not communicated with each other, the substrate further includes an energizing element, and the energizing element is disposed in the second sealed cavity.
The energizing element is a component which is in an energized state during operation and has an energized part exposed, so that the energizing element also needs to be packaged to reduce the influence of the outside on the energizing element.
Therefore, the design of the double sealing cavities and mutual opposition is adopted, so that the later maintenance is convenient. For example, when the heat dissipation cover is removed from the substrate, the heat conducting medium can be further surrounded by the first surrounding member, and particularly when the heat conducting medium has corresponding conductive characteristics, the design of the independent sealing cavity is adopted, so that the energizing element can be correspondingly protected.
Similarly, the second enclosure member is also a structural member with a blocking effect, for example, according to actual use requirements, the second enclosure member can be a plastic member, a rubber member, a metal member, a ceramic member and the like, and according to the molding mode, the second enclosure member can be directly arranged on the substrate as a complete molding finished product, and can also be formed on the substrate in a gradual molding mode.
The number of the second enclosing members can be determined by the electrifying elements needing to be enclosed, one electrifying element corresponds to one second enclosing member, and a plurality of electrifying elements correspond to one second enclosing member; similarly, the number of the heat dissipation covers is also related to the number of the second enclosing members, and one heat dissipation cover can correspond to one second enclosing member or a plurality of second enclosing members.
Furthermore, for the power-on element and the electronic element arranged on the same substrate, the same heat dissipation cover can be adopted to extrude and push the first enclosure and the second enclosure, namely, the heat dissipation cover needs to form two sealing cavities through one covering action, so that the height of the first enclosure arranged on the substrate is the same as the height of the second enclosure arranged on the substrate.
In some embodiments, the second enclosure is disposed between the substrate and the heat dissipation cover in an interference fit manner, so as to promote a pressing force of the heat dissipation cover on the second enclosure, so that the second enclosure is stably disposed between the substrate and the heat dissipation cover, and promote tightness of the second sealing cavity.
In some embodiments, the ratio of the height of the second enclosure to the height of the inner wall of the heat dissipation cover from the surface of the substrate is 1.1-1.25, it is understood that the ratio of the height of the second enclosure to the height of the surface of the substrate may be 1.1, 1.15, 1.2, 1.25, and the like, and in this numerical range, the heat dissipation cover may apply a more suitable pressing force to the second enclosure, and, at the same time, may maintain the structural stability of the second enclosure, and reduce the probability of the second enclosure being deformed by extrusion to cause enclosure failure.
Meanwhile, in order to meet the requirement that the heat dissipation cover is covered on one time to form two sealing cavities, the height of the first enclosing member arranged on the substrate should be the same as the height of the second enclosing member arranged on the substrate, that is, the ratio of the two groups should be the same.
In some embodiments, the substrate is provided with a frame body, the frame body is arranged on the periphery of the energizing element, the second enclosing member is arranged on the substrate through the frame body, the second enclosing member, the heat dissipation cover, the first enclosing member and the substrate enclose to form a second sealing cavity, and it is understood that in the embodiment, the second enclosing member is indirectly connected with the substrate, that is, the second enclosing member is connected with the substrate through the frame body, here, the frame body can be integrally formed on the substrate, belongs to a part of the substrate, or can be connected with the substrate through the modes of plugging, clamping, threaded connection, welding, bonding and the like, that is, the two belong to relatively independent structural members.
The frame body is additionally arranged on the base plate, so that the height setting of the second enclosing member can be reduced, and especially, when the second enclosing member is formed on the base plate in a gradual forming mode, the forming process of the second enclosing member can be reduced or the corresponding material cost can be saved.
In the same way, for the energizing element and the electronic element arranged on the same substrate, the same heat dissipation cover can be adopted to extrude and push the first enclosing member and the second enclosing member, namely, the heat dissipation cover needs to be covered once to form two sealing cavities, so that the height of the first enclosing member arranged on the substrate is the same as the sum of the heights of the second enclosing member and the frame body arranged on the substrate.
In some embodiments, the second enclosure member is disposed between the frame body and the heat dissipation cover in an interference fit manner, so as to promote the pressing force of the heat dissipation cover to the second enclosure member, so that the second enclosure member is stably disposed between the frame body and the heat dissipation cover, and promote the tightness of the second sealing cavity.
In some embodiments, the ratio of the sum of the heights of the second enclosure and the frame to the height from the inner wall of the heat dissipation cover to the surface of the substrate is 1.1-1.25, it can be understood that the ratio of the sum of the heights can be 1.1, 1.15, 1.2, 1.25, and the like, and in the numerical range, the heat dissipation cover can apply a relatively proper pressing force to the second enclosure, and meanwhile, the structural stability of the second enclosure can be maintained, so that the probability of enclosure failure caused by extrusion deformation of the second enclosure is reduced.
Meanwhile, in order to meet the requirement that the heat dissipation cover is covered on one time to form two sealing cavities, the height of the first enclosing member arranged on the substrate should be the same as the sum of the heights of the second enclosing member and the frame body arranged on the substrate, that is, the ratio of the two groups should be the same.
In some embodiments, the height of the second enclosure is 0.3mm to 0.42mm; that is, the height of the second enclosure may be 0.3mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, 0.36mm, 0.37mm, 0.38mm, 0.39mm, 0.40mm, 0.41mm, 0.42mm, etc.; or the thickness of the second enclosure piece is 0.15 mm-0.35 mm; that is, the thickness of the second enclosure may be 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.20mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.30mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, etc.; or the height of the second enclosure piece is 0.3 mm-0.42 mm; and the thickness of the second enclosure piece is 0.15 mm-0.35 mm.
In some embodiments, the second enclosure includes a plurality of second colloids stacked along a height direction thereof, and it is understood that the number of the second colloids is one, two, three or more, so as to be adaptively adjusted according to a height of the first enclosure placed on the substrate; meanwhile, when the number of the second colloids is more than two, the heights of the second colloids can be the same or different, and the height direction of the second colloids is the same as that of the second enclosure.
Specifically, the molding process of the second colloid is the same as that of the first colloid, that is, the second colloid is molded by a dispensing process, so that the size of a corresponding dispensing machine, a dispensing needle head and the performance of glue are related, wherein the materials of the second colloid include but are not limited to organic silica gel, hot melt adhesive, two-component glue, aqueous glue and the like, and the second colloid with different heights, thicknesses and corresponding hardness is obtained by setting corresponding dispensing amount, dispensing speed and curing time. Meanwhile, when the second surrounding baffle is formed by stacking a plurality of second colloids, the adhesive dispensing interval time between two second colloids is also needed to be considered, so that the adjacent two second colloids form corresponding bonding connection relation.
The second enclosing member is manufactured by adopting a dispensing process, the forming process is simpler, the forming cost is lower, and the connection stability between the second enclosing member and the substrate is improved; or, the connection stability between the second enclosing member and the frame body can be correspondingly improved, and meanwhile, the connection reliability between the second enclosing member and the heat dissipation cover can be further improved.
In some embodiments, the end portion of the second colloid facing the heat dissipation cover is arc-shaped, and it can be understood that, taking the second colloid facing the heat dissipation cover and having the first position as an example, the end portion of the second colloid facing the heat dissipation cover is arc-shaped, and the contact area between the second colloid and the heat dissipation cover can be reduced by using the arc-shaped arrangement of the second colloid, and on the basis of interference fit of the second colloid and the heat dissipation cover, the tightness between the second enclosure member and the heat dissipation cover can be further improved.
Here, the arc-shaped end portion of the second colloid may mean that the flatness of the end portion of the second colloid is worse than that of the other end portion, and a certain shape undulation exists, so that the existence of a corresponding structural undulation at the end portion of the second colloid may be regarded as an arc shape.
In some embodiments, the electronic component heat dissipation package structure further includes a main circuit board, the substrate is disposed on the main circuit board, and the heat dissipation cover is connected to the main circuit board; it will be appreciated that the main circuit board is a carrier for mounting the substrate and that the connection between the heat sink and the main circuit board includes, but is not limited to, plugging, clamping, bonding, soldering, threaded connection, and the like.
In some embodiments, the heat dissipation cover includes a cover body covering the substrate and a connection portion disposed on the cover body, the connection portion being connected to the main circuit board; here, in the setting position, the cover body corresponds to the substrate, that is, the cover body should be abutted against the first enclosure member and the second enclosure member to enclose and form the first sealing cavity and the second sealing cavity, and the connection part corresponds to the main circuit board, and the connection mode between the connection part and the main circuit board includes but is not limited to plugging, clamping, bonding, welding, threaded connection and the like.
In some embodiments, the connecting portion is screwed to the main circuit board, and as can be appreciated, a first mounting hole is formed in the connecting portion, a second mounting hole is formed in the main circuit board, and then screws are used to penetrate through the first mounting hole and the second mounting hole so as to connect the connecting portion and the main circuit board;
alternatively, the connection portion is adhesively connected to the main circuit board, and it is understood that an adhesive layer is provided on the connection portion; or, setting an adhesive layer on the main circuit board; or, the connecting part and the main circuit board are both provided with adhesive layers, and the connecting part and the main circuit board are connected by utilizing the characteristic that the adhesive layers are adhered;
Alternatively, the connection part is welded to the main circuit board, and it is understood that the connection part and the main circuit board are made of the same metal material, so that the connection can be achieved through a welding process.
In some embodiments, the thermally conductive medium comprises a liquid metal.
As will be appreciated, liquid metal refers to metal that is liquid at normal temperature (typically 25 ℃) and has a low thermal resistance and a high heat dissipation power.
In a second aspect, an embodiment of the present application further provides a manufacturing process of a heat dissipation packaging structure of an electronic component, where the manufacturing process includes the following steps:
dispensing once, forming a first enclosing member on the substrate in a dispensing mode, wherein the first enclosing member encloses the electronic element on the substrate;
it will be appreciated that the dispensing process is typically performed using automated equipment, and that during the production process, precise positioning, uniform coating, and efficient curing may be achieved by controlling parameters such as the movement track of the dispenser, the flow rate and pressure of the glue, etc.
The first enclosing member is formed through a dispensing process, the forming process is short and simple, and the material cost is lower.
Secondary dispensing, namely forming a second enclosing member on the substrate in a dispensing mode, wherein the second enclosing member is enclosed on the first enclosing member;
Similarly, the second enclosure part is also formed through a dispensing process, so that the forming process is short and simple in time consumption and low in material cost.
Filling a heat conduction medium, and filling the heat conduction medium in the area of the first enclosing member enclosing the substrate;
the heat conducting medium is filled into the area formed by the first enclosing member before packaging, so that the impact of the heat conducting medium on the first enclosing member can be reduced, and the risk of separation of the first enclosing member and the substrate is further reduced.
And packaging, wherein the heat dissipation cover is arranged on the substrate and connected to the main circuit board, and the inner wall of the heat dissipation cover is in interference fit with the first enclosing piece and the second enclosing piece.
The heat dissipation cover is covered once to realize enclosing the fender piece with first enclosing and second and enclose the fender piece encapsulation simultaneously, and encapsulation efficiency is higher.
The embodiment of the application also provides a manufacturing process of the electronic element heat dissipation packaging structure, which comprises the following steps:
dispensing once, forming a first enclosing member on the substrate in a dispensing mode, wherein the first enclosing member encloses the electronic element on the substrate;
secondary dispensing, namely forming a second enclosing member on the substrate in a dispensing mode, wherein the second enclosing member is enclosed on the first enclosing member;
packaging, wherein the heat dissipation cover is arranged on the substrate and connected with the main circuit board, and the inner wall of the heat dissipation cover is in interference fit with the first enclosing piece and the second enclosing piece;
And injecting a heat conduction medium, enclosing the heat dissipation cover, the first enclosing piece and the substrate to form a first sealing cavity for accommodating the electronic element, and injecting the heat conduction medium into the first sealing cavity in an injection mode.
The manufacturing process provided in this embodiment is different from the above manufacturing process in the order of packaging and filling the thermal conductive medium, and the thermal conductive medium is filled after packaging, so that the filling degree of the thermal conductive medium is better.
The technical scheme in the embodiment of the application has at least the following technical effects or advantages:
the manufacturing process of the electronic element heat dissipation packaging structure provided by the embodiment of the application has fewer working procedures, low process difficulty and lower manufacturing cost.
In a third aspect, an embodiment of the present application further provides a terminal device, including the above electronic element heat dissipation package structure.
It will be appreciated that the advantages of the third aspect may be found in the relevant description of the first aspect, and are not described in detail herein.
Drawings
Fig. 1 is a schematic structural diagram of a terminal device provided in an embodiment of the present application;
fig. 2 is a cross-sectional view of a heat dissipation package structure (excluding a heat dissipation cover) for an electronic device according to an embodiment of the disclosure;
fig. 3 is a cross-sectional view of a heat dissipation package structure for electronic components according to an embodiment of the present disclosure;
Fig. 4 is a cross-sectional view of a heat dissipation package structure (excluding a heat dissipation cover) for an electronic component according to a second embodiment of the present disclosure;
fig. 5 is a cross-sectional view of a heat dissipation package structure for an electronic device according to a second embodiment of the present disclosure;
fig. 6 is a cross-sectional view of a heat dissipating package structure (excluding a heat dissipating cap) for an electronic component according to a third embodiment of the present disclosure;
fig. 7 is a cross-sectional view of a heat dissipation package structure for an electronic component according to a third embodiment of the present disclosure;
fig. 8 is a flowchart of a manufacturing process of the electronic component heat dissipation package structure according to the first embodiment of the present disclosure;
FIG. 9 is a diagram illustrating a molding process of the heat dissipation package structure of the electronic device in FIG. 8;
fig. 10 is a flowchart of a manufacturing process of the electronic component heat dissipation package structure according to the second embodiment of the present application.
Wherein, each reference sign in the figure:
1000. a terminal device;
100. the electronic component dispels the heat and encapsulates the structure;
10. a substrate; 11. an electronic component; 12. a frame; 13. an energizing element;
20. a first enclosure; 21. a first colloid; 30. a second enclosure; 31. a second colloid;
40. a heat dissipation cover; 41. a cover body; 42. a connection part;
50. a main circuit board;
60. a thermal conductive medium;
100a, a first sealed cavity; 100b, a second sealed cavity.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and intended for the purpose of explaining the present application and are not to be construed as limiting the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions.
In the description of the present application, it should be understood that the terms "length," "width," "thickness," "top," "bottom," "inner," "outer," "upper," "lower," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application.
The terms "first," "second," "third," "fourth," "fifth," "sixth," and the like are used solely for distinguishing between descriptions and not necessarily for indicating or implying a relative importance or implicitly indicating the number of features indicated. For example, the first deformation space and the second deformation space are merely for distinguishing between the different deformation spaces, and are not limited in their order, and the first deformation space may also be named as the second deformation space, and the second deformation space may also be named as the first deformation space, without departing from the scope of the various described embodiments. And the terms "first," "second," and the like, do not necessarily denote different quantities.
In the present application, unless explicitly specified and limited otherwise, the terms "coupled," "connected," and the like are to be construed broadly, and may be fixedly attached, detachably attached, or integrally formed, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In the present application, "and/or" is merely one association relationship describing the association object, meaning that three relationships may exist; for example, a and/or B may represent: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
It is noted that in this application, words such as "in some embodiments," "illustratively," "for example," and the like are used to indicate examples, illustrations, or descriptions. Any embodiment or design described herein as "in some embodiments," "illustratively," "for example," should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "in some embodiments," "illustratively," "for example," and the like are intended to present related concepts in a concrete fashion.
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail with reference to the accompanying drawings and examples.
An electronic component is a basic component in an electronic circuit, having two or more leads or metal contacts. The electronic components are interconnected to form a circuit having a specific function. In general, electronic components are mounted on a substrate, and the substrate has functions of carrying, mounting, and connecting the electronic components. The electronic components may be packaged individually, e.g., resistors, capacitors, inductors, transistors, diodes, etc., or in various different complexity groups, e.g., integrated circuits (Integrated Circuit, ICs), chips, etc.
The terminal equipment is composed of various electronic components such as an integrated circuit, a transistor, an electronic tube and the like, and is used for playing roles by applying electronic technology software. The terminal device may be a cell phone, tablet computer, laptop (Laptop), notebook (Notebook PC), personal digital assistant (Personal Digital Assistant, PDA), wearable device (e.g., watch), vehicle-mounted device, augmented Reality (Augmented Reality, AR)/Virtual Reality (VR) device, point of sale (POS, point of sales terminal), automobile data recorder, interphone, video camera, display, etc., but is not limited thereto.
With the progress of technology, demands of terminals are increasing, for example, high performance, high reliability, ultra-thin, etc., so that the integration of electronic components in the terminals is also increasing, and meanwhile, the high integration is accompanied by high power consumption, which results in a large amount of heat generated in the operation process of the terminals. In order to ensure that the terminal device can operate normally, heat dissipation is required for each electronic component therein.
In the related art, according to different heat dissipation objects, a heat dissipation plate, a heat dissipation fan, a heat conducting medium, etc. are generally used for heat dissipation, and particularly, the space size of an electronic component is limited, and heat conduction can be accelerated by filling the heat conducting medium in the corresponding gap.
The liquid metal has better heat dissipation performance, and the heat dissipation efficiency is about several times that of the heat conduction silica gel, so that the liquid metal is used for filling the corresponding gap of the electronic element in equipment with higher heat dissipation requirement, and the heat dissipation effect of the electronic element can be greatly improved. However, the liquid metal is also a good electrical conductor, so when the liquid metal is used for conducting heat and dissipating heat, the corresponding heat dissipating packaging structure is complex and tedious in process and high in material cost.
The application of the liquid metal as a thermal interface material with high thermal conductivity in the fields of computers, mobile phones, tablet computers and the like is taken as an example, the packaging of the liquid metal needs to rely on auxiliary materials such as foam, silicone rings, silicone grease, back glue and the like, the packaging procedures are numerous, the packaging structure is complex, and the material and processing cost is higher.
In view of this, the embodiment of the application provides an electronic component heat dissipation packaging structure, set up a first on the base plate and enclose the fender piece, enclose the electronic component that will dispel the heat to, and, heat dissipation cover, first enclose fender piece and base plate enclose and close and form first sealed chamber, encapsulate electronic component in independent space, then fill thermal conductance medium in this first sealed chamber for thermal conductance medium is with electronic component cladding completely, in order to realize that electronic component's work heat production is transmitted to heat dissipation cover department through thermal conductance medium fast, is transmitted to outside by the heat dissipation cover again. According to the electronic element heat dissipation packaging structure, the requirement of independent heat dissipation of the electronic element can be met only through the first enclosing piece, and the overall structure is simpler.
Referring to fig. 2 and 3, fig. 2 is a cross-sectional view of a heat dissipation package structure (excluding a heat dissipation cover) for an electronic device according to an embodiment of the disclosure; fig. 3 is a cross-sectional view of a heat dissipation package structure for an electronic device according to an embodiment of the present application.
The embodiment of the application provides a heat dissipation package structure 100 for electronic components, which includes a substrate 10, a first enclosure 20 and a heat dissipation cover 40.
The substrate 10 is provided with an electronic component 11, wherein the substrate 10 is used as a carrier and a mounting object, has the functions of carrying, mounting and connecting the electronic component 11, and the electronic component 11 is a main heating component on the substrate 10 and needs to radiate heat. Here, the electronic component 11 may be a central processing unit (Central Processing Unit, CPU), a graphic processor (Graphics Processing Unit, GPU), a radio frequency amplifier, a Power Management Chip (PMIC), a universal flash memory (Universal Flah Storage, UFS), a System in package (System In Package, SIP), a package antenna (Antenna In Package, AIP), a System On Chip (SOC), a Double data Rate memory (DDR), a radio frequency Chip (Radio Frequency Integrate Circuit, RFIC), an embedded multimedia card (Embedded Multimedia Card, EMMC), or the like, but is not limited thereto.
The first enclosure 20 is disposed on the substrate 10 and encloses the electronic component 11, where the first enclosure 20 encloses the electronic component 11, so that the electronic component 11 has independent and separated areas relative to other components on the substrate 10. The first enclosure 20 is a closed structure with a blocking effect, for example, according to practical use requirements, the first enclosure 20 may be a plastic part, a rubber part, a metal part, a ceramic part, etc., and according to the molding mode, the first enclosure 20 may be directly disposed on the substrate 10 as a complete molded product, or may be formed on the substrate 10 in a step-by-step molding mode.
The connection manner between the first enclosure 20 and the substrate 10 may be adhesion, plugging, welding, etc., or the first enclosure 20 may be directly placed on the substrate 10 without connection relationship between the first enclosure 20 and the substrate 10.
The first enclosure 20 is, for example, a finished piece of silicone, which first enclosure 20 is placed directly on the base plate 10 and can be connected to the base plate 10 by means of an adhesive connection.
The first enclosure 20 is also a semi-finished glue, and is formed on the substrate 10 by a dispensing process.
The heat dissipation cover 40 is covered on the substrate 10 and abuts against one side of the first enclosure 20 away from the substrate 10.
The heat dissipation cover 40 is a structural member with a heat dissipation function, after the heat dissipation cover 40 is encapsulated with the substrate 10, the heat dissipation cover 40, the first enclosure 20 and the substrate 10 are enclosed to form a first sealed cavity 100a, the electronic component 11 is placed in the first sealed cavity 100a, the first sealed cavity 100a is filled with a thermal conductive medium 60, the thermal conductive medium 60 has good heat conduction performance, the thermal conductive medium 60 completely wraps the electronic component 11, and working heat generated by the electronic component 11 can be quickly transmitted to the heat dissipation cover 40 through the thermal conductive medium 60 and then transmitted to the outside through the heat dissipation cover 40.
The connection manner between the first enclosure 20 and the heat dissipation cover 40 may be adhesion, plugging, clamping, or the like, or the first enclosure 20 may have no connection relationship with the heat dissipation cover 40, and the heat dissipation cover 40 directly presses against the first enclosure 20.
The material of the heat dissipation cover 40 includes, but is not limited to, metal, graphene, silica gel, silicone grease, plastic, etc. In view of the heat conduction effect and shielding effect of the heat dissipation cover 40, the heat dissipation cover 40 may be a metal cover, and the material of the metal cover includes, but is not limited to, stainless steel, cupronickel, magnesium aluminum alloy, and the like. In addition, if the heat dissipation cover 40 is a metal cover, the heat dissipation cover can be picked up and transferred by a magnetic mechanical arm, which is beneficial to the operation of the assembly link.
Meanwhile, the heat dissipation cover 40 may be directly connected to the substrate 10, for example, when the size of the substrate 10 is sufficiently large, the heat dissipation cover 40 and the substrate 10 may be connected by means of adhesion, welding, bolting, clamping, or the like, or may be indirectly connected to the substrate 10, that is, there is no direct connection relationship between the substrate 10 and the heat dissipation cover 40, but only a spatial arrangement relationship.
The outer shape of the heat dissipation cover 40 may be adapted to the shape and structure of the electronic component 11 enclosed by the first enclosure 20.
When the electronic component 11 has a rectangular shape, the shape enclosed by the first enclosure member 20 is also rectangular, and then the heat dissipation cover 40 is a rectangular cover; when the electronic component 11 is circular in shape, the shape enclosed by the first enclosure 20 is also circular, and then the heat dissipation cover 40 is a circular cover. In this way, the structure of the heat dissipation package structure 100 of the electronic component 11 is more compact and reasonable.
Of course, in other embodiments, the shape and structure of the heat dissipation cover 40 may be different from that of the electronic component 11, so long as the heat dissipation cover 40 can cover the substrate 10.
The first sealed cavity 100a is a cavity enclosed and having tightness, so that the thermal conductive medium 60 enclosed in the first sealed cavity 100a is not easy to leak out.
Thermally conductive media 60 includes, but is not limited to, liquid metal, graphene, silica gel, silicone grease, plastic, and the like.
The thermal conductive medium 60 may be filled in the first sealed cavity 100a in the following manner: before the heat dissipation cover 40 is covered on the substrate 10, injecting a heat conduction medium 60 into the space surrounded by the first surrounding baffle 20, and then covering the heat dissipation cover 40; or, the heat dissipation cover 40 is first covered on the substrate 10 to form a first sealed cavity 100a, then an opening corresponding to the first sealed cavity 100a is opened on the heat dissipation cover 40, the heat conduction medium 60 is injected into the first sealed cavity 100a through the opening, and then the opening is sealed.
The number of the first enclosure members 20 may be determined by the electronic components 11 to be enclosed, and one electronic component 11 may correspond to one first enclosure member 20, or a plurality of electronic components 11 may correspond to one first enclosure member 20; similarly, the number of heat dissipation caps 40 is also related to the number of first surrounding members 20, and one heat dissipation cap 40 may correspond to one first surrounding member 20, or one heat dissipation cap 40 may correspond to a plurality of first surrounding members 20.
According to the electronic component heat dissipation packaging structure 100 provided by the embodiment of the application, the first enclosure piece 20 is arranged on the periphery of the electronic component 11 needing to conduct work heat dissipation, so that the heat dissipation cover 40, the first enclosure piece 20 and the substrate 10 are enclosed to form the first sealing cavity 100a, the electronic component 11 is packaged in an independent space, and then the first sealing cavity 100a is filled with the heat conducting medium 60, so that the electronic component 11 is completely covered by the heat conducting medium 60, and the work heat generated by the electronic component 11 is quickly transmitted to the heat dissipation cover 40 through the heat conducting medium 60 and then is transmitted to the outside through the heat dissipation cover 40. According to the electronic component heat dissipation packaging structure 100, the requirement of independent heat dissipation of the electronic component 11 can be met only through the first enclosing member 20, and the overall structure is simpler.
In some embodiments, the first enclosure 20 is disposed between the base plate 10 and the heat sink cap 40 in an interference fit.
It will be appreciated that the first enclosure 20 is disposed between the base 10 and the heat dissipation cover 40 mainly by clamping the base 10 and the heat dissipation cover 40 therebetween, so that, in terms of assembly, the height dimension of the first enclosure 20 on the base 10 is in interference fit with the space between the base 10 and the heat dissipation cover 40.
Meanwhile, the assembling form of interference fit is adopted, so that the connection stability of the first enclosure piece 20 between the substrate 10 and the heat dissipation cover 40 can be improved, and the tightness of the first sealing cavity 100a can be improved.
Of course, in other embodiments, the first enclosure 20 may be disposed between the substrate 10 and the heat dissipation cover 40 in other manners, for example, opposite ends of the first enclosure 20 are adhesively connected to the substrate 10 and the heat dissipation cover 40, or the first enclosure 20 may be connected to the substrate 10 or the heat dissipation cover 40 by plugging, clamping, welding, and the like.
Referring to fig. 2 and 3, in some embodiments, a ratio of the height H1 of the first enclosure 20 to the height H from the inner wall of the heat dissipation cover 40 to the surface of the substrate 10 is 1.1-1.25.
It will be appreciated that the height H1 of the first enclosure 20 is the height at which the first enclosure 20 is placed on the substrate 10, and the inner wall of the heat dissipating cover 40 and the surface of the substrate 10 are surface structures that are respectively contacted with opposite ends of the first enclosure 20 in the direction of the height H1 of the first enclosure 20, so that the height H from the inner wall of the heat dissipating cover 40 to the surface of the substrate 10 refers to the minimum distance between the inner wall of the heat dissipating cover 40 contacted by the first enclosure 20 and the surface of the substrate 10 contacted by the first enclosure 20.
The ratio of the two may be 1.1, 1.15, 1.2, 1.25, etc., and in this numerical range, the heat dissipation cover 40 may apply a relatively suitable pressing force to the first enclosure 20, and may also maintain the structural stability of the first enclosure 20, so as to reduce the probability of the first enclosure 20 being deformed by extrusion to generate enclosure failure.
Specifically, the height of the first enclosure 20 placed on the substrate 10 should be greater than the distance between the surface of the substrate 10 and the inner wall of the heat dissipating cover 40, and at the same time, the height h1 of the first enclosure 20 can be adaptively adjusted according to the actual packaging requirements and stability requirements.
Referring to fig. 2, in some embodiments, the height h1 of the first enclosure 20 is 0.5mm to 0.62mm.
It is understood that the height h1 of the first enclosure 20 refers to the height of the first enclosure 20 placed on the substrate 10, and the height h1 of the first enclosure 20 may be 0.5mm, 0.51mm, 0.52mm, 0.53mm, 0.54mm, 0.55mm, 0.56mm, 0.57mm, 0.58mm, 0.59mm, 0.60mm, 0.61mm, 0.62mm, etc.
Alternatively, the thickness m1 of the first enclosure 20 is 0.15mm to 0.35mm.
It is understood that the thickness m1 of the first enclosure 20 refers to a thickness in the enclosure direction for the electronic component 11, and the thickness m1 of the first enclosure 20 may be 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.20mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.30mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, and the like.
Alternatively, the height h1 of the first enclosure 20 is 0.5mm to 0.62mm; and, the thickness m1 of the first enclosure 20 is 0.15mm to 0.35mm.
The above height and thickness dimensions of the first enclosure 20 can be achieved by a dispensing process, that is, the height h1 and thickness of the first enclosure 20 can be adjusted by adjusting the size of the dispensing needle, the dispensing amount, the dispensing speed, etc.
Referring to fig. 2, in some embodiments, the first enclosure 20 includes a plurality of first colloids 21 stacked along a height direction thereof.
It can be appreciated that the number of the first colloids 21 is one, two, three, and more, so as to be adaptively adjusted according to the height of the electronic component 11 placed on the substrate 10; meanwhile, when the number of the first colloids 21 is two or more, the heights of the first colloids 21 may be the same or different, and here, the height direction of the first colloids 21 is the same as the height h1 direction of the first enclosure 20.
Meanwhile, the first colloids 21 may be finished silica gel pieces, and are sequentially arranged in a lamination manner to form the first enclosure piece 20, and the first colloids 21 are connected by bonding, inserting, clamping and the like.
Or, the first colloid 21 is a semi-finished product colloid, that is, the molding is performed by a dispensing process, and the dispensing process involves the size of a corresponding dispensing machine, a dispensing needle and the performance of glue, wherein the materials of the first colloid 21 include, but are not limited to, organic silica gel, hot melt adhesive, two-component glue, aqueous glue and the like, and the first colloid 21 with different heights, thicknesses and corresponding hardness is obtained by setting corresponding dispensing amounts, dispensing speeds and curing times. Meanwhile, when the first enclosure member 20 is formed by stacking a plurality of first colloids 21, the dispensing interval time between two first colloids 21 needs to be considered, so that a corresponding bonding connection relationship is formed between two adjacent first colloids 21. And, the first enclosure 20 is manufactured by adopting a dispensing process, the molding process is simpler, the molding cost is lower, the connection stability between the first enclosure 20 and the substrate 10 can be correspondingly improved, and meanwhile, the connection reliability between the first enclosure 20 and the heat dissipation cover 40 can be further improved.
As shown in fig. 2, the number of the first colloids 21 is two, the two first colloids 21 are formed by the dispensing process, and the heights and the thicknesses of the two first colloids 21 are the same, so that dispensing parameters such as dispensing material, dispensing amount, dispensing speed, curing time and the like in the two dispensing processes can be kept consistent, so as to improve the forming rate of the first enclosure 20.
In some embodiments, the end of the first gel 21 facing the heat sink cap 40 is curved.
It can be understood that the first colloid 21 facing the heat dissipation cover 40 is the first colloid 21 directly contacting and connected with the heat dissipation cover 40, so that two ends of the first colloid 21 respectively face the adjacent first colloid 21 or the substrate 10, and face the heat dissipation cover 40, and the end facing the heat dissipation cover 40 is arc-shaped, the contact area between the arc-shaped end and the inner wall of the heat dissipation cover 40 is smaller, and the sealing performance between the arc-shaped end and the heat dissipation cover 40 is better under the same extrusion abutting force.
Here, the arc-shaped end portion of the first colloid 21 may mean that the flatness of the end portion of the first colloid 21 is worse than that of the other end portion, and there is a certain shape fluctuation, and thus, the existence of a corresponding structural fluctuation at the end portion of the first colloid 21 may be regarded as an arc shape.
And, the arc-shaped design of the end portion of the first colloid 21 may be achieved by a dispensing process, that is, when the end of the molding of the first colloid 21 is completed by the dispensing process, dispensing parameters such as a dispensing speed, a dispensing amount, etc. are adjusted to form the arc-shaped end portion.
Referring to fig. 4 and fig. 5, in some embodiments, the electronic component heat dissipation package structure 100 further includes a second enclosure member 30, the second enclosure member 30 is disposed on the substrate 10 and is enclosed on the periphery of the first enclosure member 20, the second enclosure member 30, the heat dissipation cover 40, the first enclosure member 20, and the substrate 10 enclose to form a second sealed cavity 100b, the substrate 10 further includes an energizing element 13, and the energizing element 13 is located in the second sealed cavity 100 b.
It will be appreciated that the energizing element 13 is a component which is in an energized state during operation and has an energized portion exposed, and thus the energizing element 13 also needs to be packaged to reduce the influence of the outside. For example, the energizing element 13 may be a pin, a terminal, an electrode, or the like formed on the substrate 10.
The second enclosure 30 is also a structural member with a blocking effect, and the forming process and shape of the second enclosure 30 may be the same as the first enclosure 20 or may be different from the first enclosure. For example, the second enclosure member 30 may be a finished silica gel member, a rubber member, a metal member, a ceramic member, etc., and after the dimensional parameters are determined, the second enclosure member 30 may be directly laid on the substrate 10, or the second enclosure member 30 may be a semi-finished gel, that is, may be formed on the substrate 10 by using a dispensing process, etc.
The number of the second enclosure members 30 may be determined by the energizing elements 13 to be enclosed, and one energizing element 13 may correspond to one second enclosure member 30, or a plurality of energizing elements 13 may correspond to one second enclosure member 30; similarly, the number of the heat dissipation caps 40 is also related to the number of the second surrounding members 30, and one heat dissipation cap 40 may correspond to one second surrounding member 30, or one heat dissipation cap 40 may correspond to a plurality of second surrounding members 30.
Furthermore, for the power-on element 13 and the electronic element 11 disposed on the same side of the same substrate 10, the same heat dissipation cover 40 can be used to press and support the first enclosure and the second enclosure 30, that is, the heat dissipation cover 40 needs to form two sealing cavities through one covering operation, so that the height of the first enclosure 20 disposed on the substrate 10 should be the same as the height of the second enclosure 30 disposed on the substrate 10.
The second seal chamber 100b is independent from the first seal chamber 100a and is not in communication with each other. The design of the double sealing cavities and mutual opposition is adopted, so that the later maintenance is convenient. For example, when the heat dissipating cover 40 is removed from the substrate 10, the heat conducting medium 60 may be further surrounded by the first surrounding member 20, especially when the heat conducting medium 60 has corresponding conductive properties, and the separate sealing cavity is designed to provide a corresponding protection function for the energizing element 13.
In some embodiments, the second enclosure 30 is disposed between the base plate 10 and the heat sink cap 40 in an interference fit.
It will be appreciated that the second enclosure 30 is disposed between the base 10 and the heat sink 40 mainly by means of the base 10 and the heat sink 40 being clamped therebetween, so that, in terms of assembly, the height dimension of the second enclosure 30 on the base 10 is in interference fit with the space between the base 10 and the heat sink 40.
Meanwhile, the assembling form of interference fit is adopted, so that the connection stability of the second enclosure member 30 between the substrate 10 and the heat dissipation cover 40 can be improved, and the tightness of the second sealing cavity 100b can be improved.
Of course, in other embodiments, the second enclosure 30 may be disposed between the substrate 10 and the heat dissipation cover 40 in other manners, for example, two opposite ends of the second enclosure 30 are adhesively connected to the substrate 10 and the heat dissipation cover 40, or the second enclosure 30 may be connected to the substrate 10 or the heat dissipation cover 40 by plugging, clamping, welding, or other connection manners.
And, in other embodiments, to enable a dual seal chamber design of the first seal chamber 100a and the second seal chamber 100b, the height of the first enclosure 20 on the substrate 10 should be the same as the height of the second enclosure 30 on the substrate 10.
Referring to fig. 4 and 5, in some embodiments, a ratio of the height H2 of the second enclosure 30 to the height H of the inner wall of the heat dissipation cover 40 to the surface of the substrate 10 is 1.1-1.25.
It will be understood that the height H2 of the second enclosure 30 refers to the height of the second enclosure 30 on the substrate 10, the inner wall of the heat dissipating cover 40 and the surface of the substrate 10 are surface structures respectively contacting opposite ends of the second enclosure 30 in the direction of the height H2 of the second enclosure 30, and thus, the height H from the inner wall of the heat dissipating cover 40 to the surface of the substrate 10 refers to the minimum distance between the inner wall of the heat dissipating cover 40 contacting the second enclosure 30 and the surface of the substrate 10 contacting the second enclosure 30.
The ratio of the two may be 1.1, 1.15, 1.2, 1.25, etc., and in this numerical range, the heat dissipation cover 40 may apply a relatively suitable pressing force to the second enclosure 30, and may also maintain the structural stability of the second enclosure 30, so as to reduce the probability of the second enclosure 30 being deformed by extrusion to generate enclosure failure.
Specifically, the height of the second enclosure 30 placed on the substrate 10 should be greater than the distance between the surface of the substrate 10 and the inner wall of the heat dissipating cover 40, and at the same time, the height h2 of the second enclosure 30 may be adaptively adjusted according to the actual packaging requirements and stability requirements.
And, in other embodiments, in order to achieve the dual-seal design of the first seal chamber 100a and the second seal chamber 100b, the ratio of the height H2 of the second enclosure 30 to the height H of the inner wall of the heat dissipation cover 40 to the surface of the substrate 10 should be the same or similar to the ratio of the height H1 of the first enclosure 20 to the height H of the inner wall of the heat dissipation cover 40 to the surface of the substrate 10.
Referring to fig. 6 and 7, in some embodiments, the substrate 10 is provided with a frame 12, the frame 12 is disposed around the power-on element 13, the second enclosure 30 is disposed on the substrate 10 through the frame 12, and the frame 12, the second enclosure 30, the heat dissipation cover 40, the first enclosure 20, and the substrate 10 enclose to form a second sealed cavity 100b.
It will be appreciated that the frame 12 is a structural member formed on the substrate 10 and functions as a corresponding connection, for example, the frame 12 may be connected to the heat sink 40.
In this embodiment, the second enclosure member 30 is indirectly connected to the substrate 10, that is, the second enclosure member 30 is connected to the substrate 10 through the frame body 12, where the frame body 12 may be integrally formed on the substrate 10, and belongs to a part of the substrate 10, or may be connected to the substrate 10 through plugging, fastening, screwing, welding, bonding, or the like, that is, the frame body 12 and the substrate 10 belong to relatively independent structural members.
The frame 12 is added on the substrate 10 to reduce the height h2 of the second enclosure member 30, and especially, when the second enclosure member 30 is formed on the substrate 10 by a step-by-step forming method such as a dispensing process, the forming process of the second enclosure member 30 can be reduced or the corresponding material cost can be saved. Meanwhile, compared with the second sealing cavity 100b formed by directly adopting the second enclosure member 30, the second sealing cavity 100b formed by adopting the combination mode of the frame body 12 and the second enclosure member 30 has higher space tightness and stability.
And, for the energizing element 13 and the electronic element 11 disposed on the same side of the same substrate 10, the same heat dissipation cover 40 may be used to press and abut against the first enclosure and the second enclosure 30, that is, the heat dissipation cover 40 needs to form two sealing cavities through one covering action, and in order to realize the design of the dual sealing cavities of the first sealing cavity 100a and the second sealing cavity 100b, the height of the first enclosure 20 placed on the substrate 10 should be the same as the sum of the heights of the second enclosure 30 and the frame 12 placed on the substrate 10.
In some embodiments, the second enclosure 30 is disposed between the frame 12 and the heat sink housing 40 in an interference fit.
It will be appreciated that the second enclosure 30 is disposed between the frame 12 and the heat sink 40 mainly by clamping the frame 12 and the heat sink 40, so that the height of the second enclosure 30 on the frame 12 is in an interference fit with the space between the frame 12 and the heat sink 40.
Meanwhile, the assembling form of interference fit is adopted, so that the connection stability of the second enclosure part 30 between the frame body 12 and the heat dissipation cover 40 can be improved, and the tightness of the second sealing cavity 100b can be improved.
Of course, in other embodiments, the second enclosure 30 may be disposed between the frame 12 and the heat dissipation cover 40 in other manners, for example, two opposite ends of the second enclosure 30 are adhesively connected to the frame 12 and the heat dissipation cover 40, or the second enclosure 30 may be connected to the frame 12 or the heat dissipation cover 40 in a plugging manner, a clamping manner, a welding manner, or the like.
Referring to fig. 6 and 7, in some embodiments, a ratio of a height H3 of the second enclosure 30 and the frame 12 to a height H from an inner wall of the heat dissipation cover 40 to a surface of the substrate 10 is 1.1 to 1.25.
It is to be understood that the sum H3 of the heights of the second enclosure 30 and the frame 12 refers to the sum of the heights at which the second enclosure 30 and the frame 12 are stacked on the substrate 10, and the inner wall of the heat dissipation cover 40 and the surface of the substrate 10 are the surface structures respectively contacting the end of the second enclosure 30 and the surface structures connected to the frame 12 in the direction of the height H2 of the second enclosure 30, and therefore, the height H of the inner wall of the heat dissipation cover 40 to the surface of the substrate 10 refers to the minimum distance between the inner wall of the heat dissipation cover 40 contacting the second enclosure 30 and the surface of the substrate 10 contacting the frame 12.
The ratio of the two may be 1.1, 1.15, 1.2, 1.25, etc., and in this numerical range, the heat dissipation cover 40 may apply a relatively suitable pressing force to the second enclosure 30, and may also maintain the structural stability of the second enclosure 30, so as to reduce the probability of the second enclosure 30 being deformed by extrusion to generate enclosure failure.
Specifically, the sum h3 of the heights of the second enclosure 30 and the frame 12 should be greater than the distance between the surface of the substrate 10 and the inner wall of the heat dissipation cover 40, and at the same time, the height h2 of the second enclosure 30, the height of the frame 12, and both heights may be adaptively adjusted according to the actual packaging requirements and stability requirements.
And, in other embodiments, in order to enable the design of the dual sealing chambers of the first sealing chamber 100a and the second sealing chamber 100b, the ratio of the sum H3 of the heights of the second enclosure 30 and the frame 12 to the height H of the inner wall of the heat dissipation cover 40 to the surface of the substrate 10 should be the same as or similar to the ratio of the height H1 of the first enclosure 20 to the height H of the inner wall of the heat dissipation cover 40 to the surface of the substrate 10.
Referring to fig. 6, in some embodiments, the height h4 of the second enclosure 30 is 0.3mm to 0.42mm.
It is understood that the height h4 of the second enclosure 30 refers to the height of the second enclosure 30 placed on the frame 12, and the height h4 of the second enclosure 30 may be 0.3mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, 0.36mm, 0.37mm, 0.38mm, 0.39mm, 0.40mm, 0.41mm, 0.42mm, etc.
Alternatively, the thickness m2 of the second enclosure 30 is 0.15mm to 0.35mm.
It is understood that the thickness m2 of the second enclosure 30 refers to the thickness in the enclosure direction to the energizing element 13, and the thickness m2 of the second enclosure 30 may be 0.15mm, 0.16mm, 0.17mm, 0.18mm, 0.19mm, 0.20mm, 0.21mm, 0.22mm, 0.23mm, 0.24mm, 0.25mm, 0.26mm, 0.27mm, 0.28mm, 0.29mm, 0.30mm, 0.31mm, 0.32mm, 0.33mm, 0.34mm, 0.35mm, and the like.
Or, the height h4 of the second enclosure member 30 is 0.3 mm-0.42 mm; and, the thickness m2 of the second enclosure 30 is 0.15mm to 0.35mm.
The above height and thickness dimensions of the second enclosure 30 can be achieved by a dispensing process, that is, the height h4 and thickness of the second enclosure 30 can be adjusted by adjusting the size of the dispensing needle, the dispensing amount, the dispensing speed, etc.
Referring to fig. 4 and 6, in some embodiments, the second enclosure 30 includes a plurality of second colloids 31 stacked along the height direction thereof.
It will be appreciated that the number of second colloids 31 is one, two, three and more, to be adaptively adjusted according to the height of the first enclosure 20 placed on the substrate 10; meanwhile, when the number of the second colloids 31 is two or more, the heights of the second colloids 31 may be the same or different, and here, the height direction of the second colloids 31 is the same as the height h4 direction of the second enclosure 30.
Meanwhile, the second colloids 31 may be finished silica gel pieces, and are sequentially arranged in a lamination manner to form the second enclosure piece 30, and the second colloids 31 are connected by bonding, inserting, clamping and the like.
Or, the second colloid 31 is a semi-finished product colloid, that is, the second colloid 31 is formed by a dispensing process, and the dispensing process involves the size of a corresponding dispensing machine, a dispensing needle and the performance of glue, wherein the materials of the second colloid 31 include, but are not limited to, organic silica gel, hot melt adhesive, two-component glue, water-based glue, and the like, and the second colloid 31 with different heights, thicknesses and corresponding hardness is obtained by setting corresponding dispensing amount, dispensing speed and curing time. Meanwhile, when the second enclosure member 30 is formed by stacking a plurality of second colloids 31, the dispensing interval time between two second colloids 31 needs to be considered, so that the two adjacent second colloids 31 form a corresponding bonding connection relationship. In this way, the second enclosure member 30 is manufactured by using the dispensing process, the molding process is simpler, the molding cost is lower, the connection stability between the second enclosure member 30 and the substrate 10 or the frame 12 can be correspondingly improved, and meanwhile, the connection reliability between the second enclosure member 30 and the heat dissipation cover 40 can be further improved.
As shown in fig. 4, the number of the second colloids 31 is two, the two second colloids 31 are formed by the dispensing process, and the heights and thicknesses of the two second colloids 31 are the same, so that dispensing parameters such as dispensing material, dispensing amount, dispensing speed, curing time and the like in the two dispensing processes can be kept consistent, so as to improve the forming rate of the second enclosure 30. And the sum of the heights of the two second colloids 31 is the same as the height of the first enclosure 20.
As shown in fig. 6, the number of the second colloids 31 is one, the second colloids 31 are also formed by a dispensing process, and the second colloids 31 are formed by controlling dispensing parameters such as dispensing material, dispensing amount, dispensing speed, curing time and the like in the dispensing process. And the sum of the heights of the second colloid 31 and the frame 12 is the same as the height of the first enclosure 20.
In some embodiments, the end of the second gel 31 facing the heat dissipation cover 40 is arc-shaped.
It can be understood that the second colloid 31 facing the heat dissipation cover 40 is the second colloid 31 in direct contact with the heat dissipation cover 40, so that two ends of the second colloid 31 face the adjacent first colloid 21, the substrate 10 or the frame 12, and face the heat dissipation cover 40 respectively, and the end facing the heat dissipation cover 40 is arc-shaped, the contact area between the arc-shaped end and the inner wall of the heat dissipation cover 40 is smaller, and the sealing performance between the arc-shaped end and the heat dissipation cover 40 is better under the same extrusion abutting force.
Here, the arc-shaped end of the second colloid 31 may mean that the flatness of the end of the second colloid 31 is worse than that of the other two ends, and there is a certain shape fluctuation, so that the existence of corresponding structure fluctuation at the end of the second colloid 31 may be regarded as an arc shape.
And, the arc-shaped design of the end portion of the second glue 31 may be achieved by a dispensing process, that is, when the end of the molding of the second glue 31 is completed by the dispensing process, dispensing parameters such as a dispensing speed, a dispensing amount, etc. are adjusted to form the arc-shaped end portion.
Referring to fig. 2 and 3, in some embodiments, the electronic component heat dissipation package structure 100 further includes a main circuit board 50, the substrate 10 is disposed on the main circuit board 50, and the heat dissipation cover 40 is connected to the main circuit board 50.
It will be appreciated that the main circuit board 50 is a carrier for mounting the substrate 10, and the connection between the heat sink 40 and the main circuit board 50 includes, but is not limited to, plugging, clamping, bonding, soldering, screwing, etc.
For example, the main circuit board 50 may be a motherboard of a mobile phone, a tablet computer or a computer, and the substrate 10 is disposed on and electrically connected to the motherboard.
Referring to fig. 3, in some embodiments, the heat dissipation cover 40 includes a cover 41 covering the substrate 10 and a connection portion 42 disposed on the cover 41, where the connection portion 42 is connected to the main circuit board 50.
It will be appreciated that in the set position, the cover 41 corresponds to the base plate 10, i.e. the cover 41 should be in contact with the first enclosure 20 and the second enclosure 30 to enclose the first seal chamber 100a and the second seal chamber 100b.
The connection portion 42 corresponds to the main circuit board 50, and the connection manner between the connection portion 42 and the main circuit board 50 includes, but is not limited to, plugging, clamping, bonding, welding, threaded connection, and the like.
In some embodiments, the connection portion 42 is threadably connected to the main circuit board 50.
As can be appreciated, a first mounting hole is formed in the connection portion 42, a second mounting hole is formed in the main circuit board 50, and then screws are inserted through the first and second mounting holes to connect the connection portion 42 and the main circuit board 50;
alternatively, the connection portion 42 is adhesively connected to the main circuit board 50.
It will be appreciated that an adhesive layer is provided on the connection portion 42; alternatively, an adhesive layer is provided on the main circuit board 50; alternatively, an adhesive layer is provided on both the connection portion 42 and the main circuit board 50, and the connection portion 42 and the main circuit board 50 are connected by using the adhesive layer having the adhesion property;
alternatively, the connection portion 42 is solder-connected to the main circuit board 50.
It will be appreciated that the connection portion 42 and the main circuit board 50 are made of the same metal material, and thus the connection may be achieved by a soldering process.
In some embodiments, thermally conductive media 60 comprises a liquid metal.
As will be appreciated, liquid metal refers to metal that is liquid at normal temperature (typically 25 ℃) and has a low thermal resistance and a high heat dissipation power.
Specifically, the heat dissipation power of the liquid metal is about 40 W.m -1 k -1 ~80W·m -1 k -1 The heat dissipation power of the heat conducting pad and the heat conducting silicone grease which are currently used in large quantity is about 3 W.m -1 k -1 ~80W·m -1 k -1 Therefore, the liquid metal has better heat dissipation performance, and the heat dissipation efficiency is about 10 times that of the heat conduction silicone grease, so that the liquid metal can be used as the heat conduction medium 60 to meet the requirements of equipment with higher heat dissipation requirements.
Referring to fig. 6 and 7, in a specific embodiment, the electronic component heat dissipation package structure 100 includes a substrate 10, a first enclosure 20, a second enclosure 30, and a heat dissipation cover 40.
The substrate 10 is provided with an electronic component 11, an energizing component 13, and a housing 12. The first enclosure 20 is disposed on the substrate 10 and encloses the electronic component 11. The frame 12 encloses the energizing element 13, and the second enclosure member 30 is disposed on the frame 12.
The heat dissipation cover 40 is covered on the substrate 10 and abuts against one side of the first enclosure 20 away from the substrate 10, and abuts against one side of the second enclosure 30 away from the frame 12. The heat dissipation cover 40, the first enclosure 20 and the substrate 10 are enclosed to form a first sealed cavity 100a, the electronic component 11 is placed in the first sealed cavity 100a, and the first sealed cavity 100a is filled with liquid metal. The second enclosure 30, the frame body 12, the heat dissipation cover 40, the first enclosure 20 and the substrate 10 are enclosed to form a second sealed cavity 100b, the energizing element 13 is located in the second sealed cavity 100b, and the first sealed cavity 100a and the second sealed cavity 100b are independent and not communicated with each other.
The first enclosure 20 is formed by a dispensing process, and the second enclosure 30 is also formed by a dispensing process.
In a second aspect, please refer to fig. 8 and 9, fig. 8 is a flowchart illustrating a manufacturing process of the electronic component heat dissipation package structure according to an embodiment of the present application, and fig. 9 is a forming process diagram of the electronic component heat dissipation package structure in fig. 8.
The embodiment of the application also provides a manufacturing process of the electronic element heat dissipation packaging structure, which comprises the following steps:
s001, dispensing once, forming a first enclosing member 20 on the substrate 10 in a dispensing mode, wherein the first enclosing member 20 encloses the electronic element 11 on the substrate 10;
it will be appreciated that the dispensing process is typically performed using automated equipment, and that during the production process, precise positioning, uniform coating, and efficient curing may be achieved by controlling parameters such as the movement track of the dispenser, the flow rate and pressure of the glue, etc.
The first enclosure 20 is formed by a dispensing process, which is time-consuming and simple and has lower material costs.
Specifically, as shown in fig. 9, fig. 9 (a) is a schematic structural view of the substrate on which the first enclosure is not formed, and fig. 9 (b) is a schematic structural view of the substrate on which the first enclosure is formed by dispensing.
S002, secondary dispensing, wherein a second enclosing member 30 is formed on the substrate 10 in a dispensing mode, and the second enclosing member 30 is enclosed on the first enclosing member 20;
similarly, the second enclosure 30 is also formed by a dispensing process, which is time-consuming, simple, and low in material cost.
Specifically, as shown in fig. 9, fig. 9 (c) is a schematic structural view of forming a second enclosure on the frame.
S003, filling a thermal conduction medium 60, and filling the thermal conduction medium 60 in the area of the first enclosing member 20 enclosing the substrate 10;
filling the thermal conductive medium 60 into the region formed by the first enclosure 20 before packaging can reduce the impact of the thermal conductive medium 60 on the first enclosure 20, thereby reducing the risk of separation of the first enclosure 20 from the substrate 10.
Specifically, as shown in fig. 9, fig. 9 (d) is a schematic structural view of the first enclosure enclosing the substrate without being filled with the thermal conductive medium, and fig. 9 (e) is a schematic structural view of the first enclosure enclosing the substrate with being filled with the thermal conductive medium.
S004, packaging, wherein the heat dissipation cover 40 is covered on the substrate 10 and connected to the main circuit board 50, and the inner wall of the heat dissipation cover 40 is in interference fit with the first enclosure member 20 and the second enclosure member 30.
It can be appreciated that the heat dissipation cover 40 is covered once to realize packaging with the first enclosure 20 and the second enclosure 30 at the same time, so that the packaging efficiency is higher.
Specifically, as shown in fig. 9, fig. 9 (f) is a schematic structural diagram of the heat dissipating cover disposed on the substrate and connected to the main circuit board.
The manufacturing process of the electronic element heat dissipation packaging structure 100 provided by the embodiment of the application has fewer working procedures, low process difficulty and lower manufacturing cost.
Referring to fig. 10, in another embodiment, the present application provides a manufacturing process of a heat dissipation package structure 100 for electronic components, the manufacturing process includes the following steps:
s001, dispensing once, forming a first enclosing member 20 on the substrate 10 in a dispensing mode, wherein the first enclosing member 20 encloses the electronic element 11 on the substrate 10;
s002, secondary dispensing, wherein a second enclosing member 30 is formed on the substrate 10 in a dispensing mode, and the second enclosing member 30 is enclosed on the first enclosing member 20;
s003, packaging, wherein the heat dissipation cover 40 is covered on the substrate 10 and connected to the main circuit board 50, and the inner wall of the heat dissipation cover 40 is in interference fit with the first enclosure piece 20 and the second enclosure piece 30;
s004, injecting a thermal conduction medium 60; the heat dissipation cover 40, the first enclosure 20 and the substrate 10 are enclosed to form a first sealed cavity 100a for accommodating the electronic component 11, and the heat conduction medium 60 is injected into the first sealed cavity 100a in an injection mode.
It can be appreciated that the heat dissipation cover 40 may be provided with through holes communicating with the first sealing cavity 100a, and the number of the through holes may be one or more.
When the number of the through holes is one, a gap should be left between the device injecting the thermal conductive medium 60 and the walls of the through holes so that the gas in the first sealing chamber 100a is discharged to the outside from the reserved gap; alternatively, when the number of through holes is two, one through hole is used for the injection of the heat-supplying conductive medium 60 and the other through hole is used for the exhaust.
The manufacturing process provided in this embodiment is different from the manufacturing process of the above embodiment in the order of packaging and filling the thermal conductive medium 60, and is to perform the packaging before the filling of the thermal conductive medium 60, so that the filling degree of the thermal conductive medium 60 is better.
In a third aspect, referring to fig. 1, an embodiment of the present application further provides a terminal device 1000, including the above-mentioned electronic component heat dissipation package structure 100.
It will be appreciated that terminal device 1000 is a device made up of a plurality of electronic components 11, such as integrated circuits, transistors, tubes, etc., which function using electronic technology software. Terminal device 1000 can be, but is not limited to, a cell phone, tablet, laptop (Laptop), notebook (Notebook PC), personal digital assistant (Personal Digital Assistant, PDA), wearable device (e.g., watch), vehicle mounted device, augmented Reality (Augmented Reality, AR)/Virtual Reality (VR) device, point of sale (POS, point of sales terminal), automobile data recorder, interphone, video camera, display, etc.
The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes or substitutions are intended to be covered by the scope of the present application.

Claims (22)

1. The utility model provides an electronic component heat dissipation packaging structure which characterized in that includes:
a substrate provided with an electronic component;
the first enclosing piece is arranged on the substrate and encloses the electronic element;
the heat dissipation cover is covered on the substrate and is abutted against one side, far away from the substrate, of the first surrounding baffle piece;
the heat dissipation cover, the first enclosing piece and the base plate enclose to form a first sealing cavity, the electronic element is arranged in the first sealing cavity, and the first sealing cavity is filled with heat conduction medium.
2. The electronic component heat dissipation package as defined in claim 1, wherein: the first surrounding baffle piece is arranged between the base plate and the heat dissipation cover in an interference fit mode.
3. The electronic component heat dissipation package as defined in claim 2, wherein: the ratio of the height of the first enclosure part to the height from the inner wall of the heat dissipation cover to the surface of the substrate is 1.1-1.25.
4. The electronic component heat dissipation package as defined in claim 3, wherein: the height of the first enclosing piece is 0.5 mm-0.62 mm; and/or the thickness of the first enclosure piece is 0.15 mm-0.35 mm.
5. The electronic component heat dissipation package as defined in any one of claims 1-4, wherein: the first surrounding baffle comprises a plurality of first colloids which are mutually overlapped along the height direction of the first surrounding baffle.
6. The electronic component heat dissipation package as defined in claim 5, wherein: the end part of the first colloid facing the heat dissipation cover is arc-shaped.
7. The electronic component heat dissipation package as defined in claim 1, wherein: the electronic component heat dissipation packaging structure further comprises a second enclosing part, the second enclosing part is arranged on the substrate and encloses the periphery of the first enclosing part, the second enclosing part, the heat dissipation cover, the first enclosing part and the substrate enclose to form a second sealing cavity, the substrate is provided with an electrifying element, and the electrifying element is positioned in the second sealing cavity.
8. The electronic component heat dissipation package as defined in claim 7, wherein: the second enclosure piece is arranged between the base plate and the heat dissipation cover in an interference fit mode.
9. The electronic component heat dissipation package as defined in claim 8, wherein: the ratio of the height of the second enclosure part to the height from the inner wall of the heat dissipation cover to the surface of the substrate is 1.1-1.25.
10. The electronic component heat dissipation package as defined in claim 7, wherein: the base plate is equipped with the framework, the framework encloses and locates the periphery of circular telegram component, the second encloses the fender piece through the framework set up in on the base plate, the framework the second enclose keep off the piece the radiator cover the first encloses fender piece and the base plate encloses and closes and form the second sealed chamber.
11. The electronic component heat dissipation package as defined in claim 10, wherein: the second enclosing piece is arranged between the frame body and the heat dissipation cover in an interference fit mode.
12. The electronic component heat dissipation package as defined in claim 11, wherein: the ratio of the sum of the heights of the second enclosure piece and the frame body to the height from the inner wall of the heat dissipation cover to the surface of the substrate is 1.1-1.25.
13. The electronic component heat dissipation package as defined in claim 12, wherein: the height of the second enclosing member is 0.3 mm-0.42 mm; and/or the thickness of the second enclosure piece is 0.15 mm-0.35 mm.
14. The electronic component heat dissipation package as defined in claim 7 or 10, wherein: the second enclosure piece comprises a plurality of second colloids which are mutually overlapped along the height direction of the second enclosure piece.
15. The electronic component heat dissipation package as defined in claim 14, wherein: the end part of the second colloid facing the heat dissipation cover is arc-shaped.
16. The electronic component heat dissipation package as defined in any one of claims 1, 7, and 10, wherein: the electronic element heat dissipation packaging structure further comprises a main circuit board, the substrate is arranged on the main circuit board, and the heat dissipation cover is connected with the main circuit board.
17. The electronic component heat dissipation package as defined in claim 16, wherein: the heat dissipation cover comprises a cover body and a connecting part, wherein the cover body is covered on the substrate, the connecting part is arranged on the cover body, and the connecting part is connected with the main circuit board.
18. The electronic component heat dissipation package as defined in claim 17, wherein: the connecting part is connected with the main circuit board in a threaded manner; or the connecting part is adhered to the main circuit board; or the connecting part is welded and connected to the main circuit board.
19. The electronic component heat dissipation package as defined in any one of claims 1, 7, and 10, wherein: the thermally conductive medium comprises a liquid metal.
20. The manufacturing process of the electronic element heat dissipation packaging structure is characterized by comprising the following steps of:
dispensing once, forming a first enclosing member on the substrate in a dispensing mode, wherein the first enclosing member encloses the electronic element on the substrate;
secondary dispensing, namely forming a second enclosing member on the substrate in a dispensing mode, wherein the second enclosing member is enclosed on the first enclosing member;
filling a heat conduction medium, and filling the heat conduction medium in the area of the first enclosing member enclosing the substrate;
and packaging, wherein the heat dissipation cover is arranged on the substrate and connected to the main circuit board, and the inner wall of the heat dissipation cover is in interference fit with the first enclosing piece and the second enclosing piece.
21. The manufacturing process of the electronic element heat dissipation packaging structure is characterized by comprising the following steps of:
dispensing once, forming a first enclosing member on the substrate in a dispensing mode, wherein the first enclosing member encloses the electronic element on the substrate;
secondary dispensing, namely forming a second enclosing member on the substrate in a dispensing mode, wherein the second enclosing member is enclosed on the first enclosing member;
packaging, wherein the heat dissipation cover is arranged on the substrate and connected with the main circuit board, and the inner wall of the heat dissipation cover is in interference fit with the first enclosing piece and the second enclosing piece;
And injecting a heat conduction medium, enclosing the heat dissipation cover, the first enclosing piece and the substrate to form a first sealing cavity for accommodating the electronic element, and injecting the heat conduction medium into the first sealing cavity in an injection mode.
22. A terminal device, characterized by: a heat dissipation package comprising an electronic element as recited in any one of claims 1-19.
CN202311774942.0A 2023-12-22 2023-12-22 Electronic element heat dissipation packaging structure, manufacturing process and terminal equipment Pending CN117457598A (en)

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Application Number Priority Date Filing Date Title
CN202311774942.0A CN117457598A (en) 2023-12-22 2023-12-22 Electronic element heat dissipation packaging structure, manufacturing process and terminal equipment

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Application Number Priority Date Filing Date Title
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