CN117457560A - Bonding device and method with system error compensation function - Google Patents

Bonding device and method with system error compensation function Download PDF

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Publication number
CN117457560A
CN117457560A CN202311689978.9A CN202311689978A CN117457560A CN 117457560 A CN117457560 A CN 117457560A CN 202311689978 A CN202311689978 A CN 202311689978A CN 117457560 A CN117457560 A CN 117457560A
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CN
China
Prior art keywords
bonding
stage
error compensation
systematic error
alignment
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Application number
CN202311689978.9A
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Chinese (zh)
Inventor
陶超
龙俊舟
王力
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Wuhan Xinxin Semiconductor Manufacturing Co Ltd
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Wuhan Xinxin Semiconductor Manufacturing Co Ltd
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Priority to CN202311689978.9A priority Critical patent/CN117457560A/en
Publication of CN117457560A publication Critical patent/CN117457560A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

Abstract

The application discloses bonding device with systematic error compensation function includes: a movable fetching stage configured to move the first element; a stage configured to move the second element; a first image pickup device configured to read alignment marks of the first element and the second element driven to the alignment position; a second image pickup device configured to read alignment marks of the first element and the second element driven to the bonding position in response to the bonding device performing a systematic error correction operation, to obtain a systematic error compensation value; wherein the bonding device performs a systematic error compensation operation based on the systematic error compensation value in response to the bonding device performing the bonding operation, aligning the first element and the second element driven to the bonding position. Related methods are also disclosed. The positioning accuracy of the bonding device is improved, so that the bonding efficiency is improved.

Description

Bonding device and method with system error compensation function
Technical Field
The disclosed embodiments of the present application relate to the field of semiconductor manufacturing, and more particularly, to a bonding apparatus and method with systematic error compensation function.
Background
With the entering of the post-molar age of semiconductor technology, chip structures are being developed toward three dimensions in order to meet the demands of high integration and high performance. Among these, the realization of manufacturing stacked chips by bonding techniques is one of the important technologies of "supermoore's law. The bonding accuracy is an important parameter of the bonding process and has an important influence on the application of the bonding process.
Disclosure of Invention
According to an embodiment of the present application, a bonding apparatus with a system error compensation function and a related method are provided to achieve high-precision positioning and improve quality.
A first aspect of the present application discloses a bonding apparatus with systematic error compensation function, comprising: a movable fetching stage configured to move the first element; a stage configured to move the second element; a first image pickup device configured to read alignment marks of the first element and the second element driven to alignment positions; a second image pickup device configured to read alignment marks of the first element and the second element driven to a bonding position in response to the bonding device performing a systematic error correction operation, to obtain a systematic error compensation value; wherein the bonding device performs a systematic error compensation operation based on the systematic error compensation value in response to the bonding device performing the bonding operation, aligning the first element and the second element driven to the bonding position.
In some embodiments, the bonding device is further configured to adjust the first element and the second element in an aligned position based on the alignment mark read by the first image capturing device to align the first element and the second element in an aligned position in a height direction.
In some embodiments, the first element is configured as a first correction patch and the second element is configured as a matching second correction patch in response to the bonding device performing the systematic error correction operation; in response to the bonding device performing the bonding operation, the first element is configured as a die or wafer to be bonded and the second element is configured as a wafer or die to be bonded.
In some embodiments, the first calibration sheet is a transparent, translucent, or through-hole calibration sheet.
In some embodiments, in response to the bonding device performing a system error correction operation, while the first and second elements aligned in an alignment position are configured to be moved in a height direction to the bonding position, the second image pickup device is configured to recognize the alignment marks of the first and second elements on the bonding position, acquire a difference between the alignment marks of the first and second elements as a system error value, to perform the system error correction operation.
In some embodiments, the bonding device performs the systematic error correction operation multiple times to obtain multiple systematic error values, and obtains the systematic error compensation value based on a mean of the multiple systematic error values.
In some embodiments, the second image acquisition device is detachably disposed on the movable retrieval table to perform the systematic error correction operation.
In some embodiments, the second image capture device includes at least one image capture unit to identify the alignment marks of the first and second elements on a bonding site.
In some embodiments, in response to the bonding device performing the bonding operation, the bonding device adjusts the movable fetch stage and/or the stage based on the systematic error compensation value to perform a systematic error compensation operation on the first element and the second element in the aligned position, and then moves the movable fetch stage and/or the stage in the height direction to cause the first element and the second element to be driven to the bonding position; in response to the bonding device performing the bonding operation, the bonding device moves the movable fetching stage and/or the carrying stage in the height direction so that the first element and the second element are driven to the bonding position while adjusting the movable fetching stage and/or the carrying stage based on the system error compensation value to perform the system error compensation operation on the first element and the second element.
In some embodiments, the bonding apparatus further comprises: a base and a machine frame, wherein the machine frame is arranged on the base, the movable fetching table is arranged on the machine frame, and the movable fetching table is configured to be movable along an X direction and a Y direction of a horizontal plane and movable along a height direction Z; the carrier is arranged on the base, can move along the X direction and/or the Y direction of the horizontal plane, and can rotate in a vertical plane perpendicular to the horizontal plane so as to adjust the horizontal state of the carrier.
In some embodiments, the first image acquisition device is a top-down view image acquisition device, comprising: a top view image acquisition unit configured to identify an alignment mark of the first element in response to the first image acquisition device being driven to a working position; a lower image acquisition unit configured to identify an alignment mark of the second element in response to the first image acquisition device being driven to the working position; the bonding device drives at least one of the movable fetching table or the carrying table to adjust so as to align the first element and the second element in the alignment position based on the alignment mark of the first element identified by the upper image acquisition unit and the alignment mark of the second element identified by the lower image acquisition unit.
In some embodiments, the first image capture device is driven to an initial position after aligning the first and second elements in the aligned position and before moving the first and/or second elements in a height direction.
The second aspect of the application discloses a bonding method applied to a bonding device, comprising: moving the first element and the second element to alignment positions respectively by utilizing a movable fetching table and/or a carrying table of the bonding device; reading the alignment marks of the first element and the second element which are in an alignment position by using a first image acquisition device of the bonding device so as to align the first element and the second element in the height direction; driving the first element and the second element to a bonding position in response to the bonding device performing a systematic error correction operation, and identifying the alignment marks of the first element and the second element on the bonding position by using a second image acquisition device of the bonding device to acquire a systematic error compensation value of the bonding device; in response to the bonding device performing a bonding operation, performing a systematic error compensation operation based on the systematic error compensation value, aligning the first element and the second element driven to the bonding bit.
In some embodiments, the first element is configured as a first correction patch and the second element is configured as a matching second correction patch in response to the bonding device performing the systematic error correction operation; the driving the first and second elements to bonding positions in response to the bonding device performing a systematic error correction operation, and identifying the alignment marks of the first and second elements on the bonding positions with a second image capture device of the bonding device to obtain systematic error compensation values of the bonding device, comprising: moving the first element and the second element to a bonding position by using the movable fetching stage and/or the carrying stage; and identifying a difference value between the alignment marks of the first element and the second element on the bonding bit by using the second image acquisition device as a system error value so as to acquire the system error compensation value.
In some embodiments, the bonding device performs the systematic error correction operation multiple times to obtain multiple systematic error values, and obtains the systematic error compensation value based on a mean of the multiple systematic error values.
In some embodiments, the first calibration sheet is a transparent, translucent, or through-hole calibration sheet.
In some embodiments, in response to the bonding device performing the bonding operation, the first element is configured as a die or wafer to be bonded and the second element is configured as a wafer or die to be bonded; the performing a bonding operation based on the systematic error compensation value in response to the bonding device, aligning the first and second elements driven to the bonding position, includes: the first and second components are moved to a bonding position using the movable pick-up stage and/or the carrier stage and the systematic error compensation operation is performed to align the first and second components driven to the bonding position.
In some embodiments, the moving the first and second elements to bonding locations with the movable pick-up table and/or the carrier table and performing the systematic error compensation operation to align the first and second elements driven to the bonding locations includes: adjusting the movable pick-up stage and/or the carrier stage based on the system error compensation value to perform a system error compensation operation on the first and second elements in the alignment position, and then moving the movable pick-up stage and/or the carrier stage in the height direction so that the first and second elements are driven to the bonding position; or adjusting the movable pick-up table and/or the stage based on the system error compensation value to perform a system error compensation operation on the first element and the second element while moving the movable pick-up table and/or the stage in the height direction so that the first element and the second element are driven to the bonding position.
In some embodiments, before the first image capturing device using the bonding device reads the alignment marks of the first element and the second element in the alignment position to align the first element and the second element in the height direction, the bonding method further includes: driving the first image acquisition device to move from an initial position to a working position so as to read alignment marks of the first element and the second element which are positioned in an alignment position; after the first image pickup device using the bonding device reads the alignment marks of the first element and the second element in the aligned position to align the first element and the second element in the height direction, the bonding method further includes: and driving the first image acquisition device to move from the working position to the initial position so as to execute the subsequent system error correction operation or the bonding operation.
In some embodiments, the first image acquisition device is a top-down view image acquisition device.
In the structural design of the bonding device, the second image acquisition device is used for identifying the alignment marks of the first element and the second element which move along the height direction, namely, the second image acquisition device is used for identifying the alignment marks of the first correction sheet which move along the height direction and/or are subjected to bonding operation, the first correction sheet is used for identifying the alignment marks of the second correction sheet, and further, the difference value between the first element and the alignment marks of the second element which move along the height direction and/or are subjected to bonding operation is used for obtaining a system error compensation value, and bonding operation is performed based on the system error compensation value, so that the positioning accuracy of the bonding device is improved, and the bonding efficiency is improved.
Drawings
For a clearer description of the technical solutions in the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art, wherein:
FIG. 1 is a schematic diagram of a bonding apparatus according to an embodiment of the present application;
FIG. 2 is a top view of a first image capture device according to an embodiment of the present application;
FIG. 3 is a top view of a second image capture device according to an embodiment of the present application;
FIG. 4 is a schematic diagram illustrating the state of an alignment bit according to an embodiment of the present application;
FIG. 5 is a schematic diagram illustrating a state of a misalignment bit according to an embodiment of the present application;
fig. 6 is a flow chart of a bonding method according to an embodiment of the present application.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
The terms "first," "second," "third," and the like in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", and "a third" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. All directional indications (such as up, down, left, right, front, back … …) in the embodiments of the present application are merely used to explain the relative positional relationship, movement, etc. between the components in a particular gesture (as shown in the drawings), and if the particular gesture changes, the directional indication changes accordingly. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
The present application is described in detail below with reference to the accompanying drawings and examples.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a bonding apparatus according to an embodiment of the present application, specifically, the bonding apparatus 100 may include: a movable object taking table 10, a carrying table 20, a first image acquisition device 30 and a second image acquisition device 40.
Wherein the movable picking station 10 is configured to move the first element 11; stage 20 is configured to move second element 21.
The first image capturing device 30 is configured to read the alignment marks of the first element 11 and the second element 21 driven to the alignment position, i.e. the alignment marks of the first element 11 and the second element 21 appear within the field of view of the first image capturing device 30, wherein the bonding device 100 is further configured to adjust the first element 11 and the second element 21 in the alignment position based on the alignment marks read by the first image capturing device 30 such that the first element 11 and the second element 21 in the alignment position are aligned in the height direction, e.g. the bonding device 100 drives the movable fetching stage 10 and/or the stage 20 to adjust to align the first element 11 and the second element 21, i.e. the alignment marks of the first element 11 and the alignment marks of the second element 21 are aligned in the height direction based on the information of the alignment marks read by the first image capturing device 30, i.e. when the first element 11 and the second element 21 are located at the bonding start position. And a second image pickup device 40, in response to the bonding device 100 performing a system error correction operation, the second image pickup device 40 being configured to read the alignment marks of the first and second elements 11 and 21 driven to the bonding position, i.e., the region where the first and second elements 11 and 21 perform the bonding operation, for example, the movable stage 10 moves the first element 11 and/or the stage 20 moves the second element 21 in the height direction to the bonding position where the first and second elements 11 and 21 are bonded, to acquire a system error compensation value, the second image pickup device 40 being configured to recognize the alignment marks of the first and second elements 11 and 21 driven to the bonding position, and to acquire the system error compensation value.
Further, in response to the bonding apparatus 100 performing the bonding operation, the bonding apparatus 100 performs the systematic error compensation operation based on the systematic error compensation value, so that the first member 11 and the second member 21 driven to the bonding position are aligned, for example, the bonding apparatus 100 adjusts the movable fetching stage 10 and/or the carrying stage 20 based on the systematic error compensation value so that the first member 11 and the second member 21 after being moved in the height direction and the bonding is completed are aligned.
The system error compensation value is a correction compensation value, that is, the bonding device 100 drives the first element 11 and/or the carrier 20 to drive the second element 21 to move along the height direction by the movable fetching platform 10 to a compensation value that causes an alignment deviation due to displacement in the vertical direction in the process of bonding the first element 11 and the second element 21, and in some embodiments, the system error compensation value further includes a compensation value that causes an alignment deviation due to the bonding force applied to the first element and the second element in the process of bonding, so that the bonding operation is performed based on the system error compensation value, thereby improving the positioning accuracy and the bonding efficiency of the bonding device.
Specifically, in response to the bonding apparatus 100 performing the bonding operation, the bonding apparatus 100 adjusts the movable fetching stage 10 and/or the stage 20 based on the system error compensation value to perform the system error compensation operation on the first element 11 and the second element 21 in the aligned position, and then moves the movable fetching stage 10 and/or the stage 20 in the height direction to cause the first element 11 and the second element 21 to be driven to the bonding position; alternatively, in response to the bonding device 100 performing the bonding operation, the bonding device 100 moves the movable fetching stage 10 and/or the stage 20 in the height direction so that the first element 11 and the second element 21 are driven to the bonding position while adjusting the movable fetching stage 10 and/or the stage 20 based on the system error compensation value to perform the system error compensation operation on the first element 11 and the second element 21.
Further, the bonding apparatus 100 further includes a base 51 and a stage frame 52, wherein the movable fetching stage 10 is configured to be movable in the X-direction and the Y-direction of the horizontal plane and movable in the height direction Z; the stage 20 is configured to be movable in X and Y directions of a horizontal plane and rotatable in a vertical plane perpendicular to the horizontal plane to adjust a horizontal state of the stage 20, wherein the rotation angle θ is a horizontal adjustment angle of the stage 20.
It should be noted that fig. 1 only shows an embodiment in which the movable fetching stage 10 is disposed at the top end of the machine frame 52 and the carrying stage 20 is disposed on the base 51, in another embodiment, the movable fetching stage 10 may also be disposed on the base 51 and the carrying stage 20 may be disposed at the top end of the machine frame 52, specifically, the first element 11 and the second element 21 may be moved to the bonding position, so the positions of the movable fetching stage 10 and the carrying stage 20 are not limited in this application.
Specifically, in some embodiments, the base 51 and the machine frame 52 together form a structure having a cavity, wherein the machine frame 52 has a top plate 521 and a plurality of side plates 522 respectively connected to the top plate 521. The base 51 has a substantially planar structure, and the ends of the plurality of side plates 522 of the machine frame 52 are respectively disposed on the base 51. The machine 50 further comprises a displacement acquisition member 53, wherein the displacement acquisition member can be a component for realizing high-precision positioning by a laser interferometer, a plane grating or the like, and further, the displacement acquisition member 53 is configured to determine displacement information of the carrying platform 20 and the movable fetching platform 10 along the first direction Y and the second direction X; based on the displacement information in the first direction Y, the second direction X, the displacement acquisition member 53 is further configured to determine the coordinate information of the second member 21 and the first member 11 in the first direction Y and the coordinate information in the second direction X.
In some embodiments, the movable stage 10 may have a macro-micro dual stage motion mechanism that includes macro drives capable of sub-micron coarse positioning and micro drives capable of sub-micron precision positioning, such that the movable stage may move in a "coarse adjustment + fine adjustment" manner in X, Y, Z and rotational directions. Specifically, the movable fetching stage 10 may be laminated by a combination of the first driving member 111, the second driving member 112, the rotary driving member 113, and the bonding pickup head 114 to pick up and move the first element 11, wherein the bonding pickup head 114 is connected with the rotary driving member 113 with the tip of the bonding pickup head 114 facing the first element 11. The first drive 111 is configured to move the second drive 112 and the rotary drive 113 in the first direction Y and/or the second direction X in a horizontal plane, and thereby to move the bond head 114 in the first direction Y and/or the second direction X in a horizontal plane. Further, the second driving member 112 is configured to move the rotary driving member 113 in the third direction Z in a plane perpendicular to the horizontal plane, thereby moving the bonding pick-up head 114 in the third direction Z, and the rotary driving member 113 is configured to rotate the bonding pick-up head 114 so that the bonding pick-up head 114 picks up the first element 11 and drives the first element 11 to move in the height direction until bonding with the second element 21 is completed.
Accordingly, the second driving member 112 moves the rotary driving member 113 along the third direction Z, so that the precise positioning of the bonding pick-up head 114 can be realized in the third direction Z. Wherein, the rotary driving member 113 can realize micro radian level positioning accuracy.
Note that, the first driving member 111/the second driving member 112/the rotation driving member 113 may further include: a motor, such as a linear motor or a rotary motor, to power the corresponding driving member, respectively. It can be understood that the structural design of the macro-micro dual-stage motion mechanism of the first driving member 111 in the embodiment of the present application may refer to a specific structure in the related art, so long as the bonding pick-up head 114 can be moved along the first direction Y in the horizontal plane and the sub-micron precision positioning function can be achieved, which is not limited in this application. Accordingly, the structural design of the macro-micro dual stage motion mechanism of the second driving member 112 and the structural design of the macro-micro dual stage motion mechanism of the rotation driving member 113 may refer to the specific structure in the related art as long as the corresponding functions thereof can be realized.
The first direction Y, the second direction X and the third direction Z intersect each other two by two to establish a spatial coordinate system, preferably two by two, as shown in fig. 1. Specifically, if the direction of the Y axis is parallel to the first direction Y, the direction of the X axis is parallel to the second direction X, and the direction of the Z axis is parallel to the third direction Z, the first driving member 111 may be referred to as a Y axis or an X axis driving member, and the second driving member 112 may be referred to as a Z axis driving member.
Alternatively, the movable fetching stage 10 may be a single-stage motion mechanism or other types of motion mechanisms, so long as the first element 11 to be bonded can be moved to the preset surface position of the second element 21 to be bonded under the condition of meeting specific precision requirements, and the first element 11 is subjected to high-precision displacement operation according to the system error compensation value and bonded to the preset surface position of the second element 21 to be bonded.
In some embodiments, the carrier 20 includes a chuck 211 and a third driving member 212, the chuck 211 is configured to carry the second element 21 to be bonded, the carrier 20 may also have a macro-micro dual stage motion mechanism, and the third driving member 212 is configured to move the chuck 211 in the first direction Y and/or the second direction X in the horizontal plane and may rotate in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the carrier 20, wherein the rotation angle θ is a horizontal adjustment angle of the carrier 20.
It will be appreciated that the plurality of drives that can move the movable picking stage 10/carriage 20 in the horizontal direction, the height direction, and the rotation direction can also be controlled by one drive with various positional angle adjustments.
Wherein, the third driving member 212 may include: a first direction driving member configured to move the chuck 211 in the first direction Y in a horizontal plane, a second direction driving member configured to move the chuck 211 in the second direction X in the horizontal plane, and a horizontal adjusting member configured to rotate in a vertical plane perpendicular to the horizontal plane to adjust the horizontal state of the stage 20, wherein the rotation angle θ is a horizontal adjustment angle of the stage 20.
In some embodiments, the first image capturing device 30 is configured to capture an alignment mark of the first element 11 and an alignment mark of the second element, for example, the first image capturing device 30 includes an upper image capturing unit and a lower image capturing unit, the upper image capturing unit has a first viewing angle configured to identify the alignment mark of the first element 11, the lower image capturing unit has a second viewing angle configured to identify the alignment mark of the second element 21, wherein the upper image capturing unit and the lower image capturing unit may be disposed opposite to each other, for example, when the alignment mark is identified, the upper image capturing unit may be located on a side of the base 51 facing the top plate 521 of the machine frame 52, and the lower image capturing unit may be located on a side of the top plate 521 of the machine frame 52 facing the base 51; alternatively, the upper image capturing unit and the lower image capturing unit may be provided as a single unit, for example, as upper and lower image capturing units, which are located in a cavity formed by the base 51 and the machine frame 52 together when the alignment marks are recognized.
Preferably, the first image capturing device 30 is taken as an upper and lower image capturing device for illustration, as shown in fig. 2, fig. 2 is a top view of the first image capturing device according to an embodiment of the present application, the first image capturing device 30 includes an upper image capturing unit 31 and a lower image capturing unit 32, the upper image capturing unit 31 is adjacent to the lower image capturing unit 32, the distance between the two can be adjusted according to the product requirement, and the bonding device 100 drives at least one of the movable object capturing table 10 or the carrier 20 to adjust so as to align the first element 11 and the second element 21 in the aligned position, so that the alignment mark of the first element 11 is aligned with the alignment mark of the second element 21 in the height direction based on the alignment mark of the first element 11 and the alignment mark of the second element 21 identified by the upper image capturing unit 31 and the alignment mark of the second element 21 identified by the lower image capturing unit 32.
After aligning the first element 11 and the second element 21 in the aligned position and before the first element 11 and/or the second element 21 are moved in the height direction, the first image capturing device 30 is driven to an initial position, for example, the first image capturing device 30 further includes a capturing device rotation drive 33 to drive the whole first image capturing device 30 to rotate, so as to realize a transition between the initial position and a working position, that is, the first image capturing device 30 to a bonding position area, so that an alignment mark of the first element 11 and the second element 21 in the bonding start position appears in the field of view of the first image capturing device 30, and the initial position, that is, the first image capturing device 30 is moved out of the bonding position area so that the first element 11 and the second element 21 can perform bonding.
The upper image capturing unit 31 includes an upper image processing member 311 and an upper image capturing member 312, and the upper image capturing unit 31 has a first viewing angle, which is an upper viewing angle, and is configured to identify the alignment mark of the first element 11. The lower image capturing unit 32 includes a lower image processing unit 321 and a lower image capturing unit 322, and the lower image capturing unit 32 has a second viewing angle, which is a lower viewing angle, configured to identify the alignment mark of the second element 21. Alternatively, the upper image capturing element 312 and the lower image capturing element 322 may be cameras, for example, the upper image capturing element 312 may be referred to as an upper view camera and the lower image capturing element 322 may be referred to as a lower view camera.
In some embodiments, both the upper image capturing unit 31 and the lower image capturing unit 32 may include image capturing element components, a prism and objective lens system, etc. to identify alignment marks of the first element 11 and the second element 21.
It will be appreciated that the center points of the upper image capturing unit 31 and the lower image capturing unit 32 are the centers of the fields of view of the upper and lower image capturing devices. Specifically, the positional information corresponding to the alignment mark of the first element 11 read by the upper image capturing unit 31 and the positional information corresponding to the alignment mark of the second element 21 read by the lower image capturing unit 32 may be converted into positional coordinates in the same coordinate system.
In some embodiments, the second image capturing device 40 is disposed around the bonding position, and the second image capturing device 40 has a third viewing angle for identifying the alignment marks of the first element 11 and the second element 21 after being moved and/or bonded in the height direction, wherein the third viewing angle may be an upper viewing angle or a lower viewing angle. The movable fetching stage 10 drives the first element 11 and/or the carrier 20 to drive the second element 21 to move along the height direction to a bonding position where the first element 11 and the second element 21 are bonded, and the second image capturing device 40 is configured to identify alignment marks of the first element 11 and the second element 21 after moving along the height direction and/or performing the bonding operation, that is, after the movable fetching stage 10 drives the first element 11 and/or the carrier 20 drives the second element 21 to move along the height direction to enable the first element 11 and the second element 21 to be bonded, identify alignment marks of the first element 11 and the second element 21 after moving along the height direction and performing the bonding operation, so as to obtain a system error compensation value.
Preferably, in some embodiments, as shown in fig. 1, the second image capturing device 40 is disposed on the second driving member 112 by a cantilever, so as to follow the displacement of the movable fetching platform 10 carrying the first element 11 in the first direction Y, the second direction X and the third direction Z, where the first direction Y and the second direction X are different directions intersecting in a horizontal plane, and the third direction Z is a height direction perpendicular to the horizontal plane, so that the position information after the alignment marks of the first element 11 and the second element 21 are bonded can be conveniently and quickly obtained, and at this time, the viewing angle of the second image capturing device 40 is the downward viewing angle, and is configured to identify the alignment marks of the first element 11 and the second element 21 after the downward movement and/or the bonding operation is performed, that is, identify the alignment marks of the first element 11 and the second element 21 after the downward movement, and the alignment marks of the first element 11 and the second element 21 after the bonding.
Wherein, in response to the bonding apparatus 100 performing the systematic error correction operation, the second image pickup apparatus 40 recognizes the alignment mark when the first element 11 is located at the bonding start position; the bonding device 100 drives the movable fetching platform 10 to drive the first element 11 and/or the carrying platform 20 to bear the second element 21 to move along the height direction and perform the bonding operation of the first element 11 and the second element 21; after the second image capturing device 40 recognizes the alignment marks of the first element 11 and the second element 21 after bonding, that is, after the first element 11 and the second element 21 are bonded, the second image capturing device 40 recognizes the alignment marks of the first element 11 and recognizes the alignment marks of the second element 21 through the first element 11, it can be understood that, since the first element 11 moves down and the first element 11 and the second element 21 are bonded, the positions of the alignment marks of the first element 11 and the second element 21 after bonding are offset compared with the positions of the alignment marks at the bonding start position, that is, the alignment marks of the first element 11 and the second element 21 after the second image capturing device 40 recognizes the move down and/or performs the bonding operation, the system error compensation value is obtained, that is, the displacement compensation value for the alignment position generated when the movable fetching table 10 drives the first element 11 and/or the carrying table 20 to carry the second element 21 along the height direction to complete the bonding process of the first element 11 and the first element 21 is obtained.
In some embodiments, the second image capturing device 40 includes at least one image capturing unit to identify alignment marks of the first element 11 and the second element 21 on the bonding sites, for example, the second image capturing device 40 may include one image capturing unit configured to simultaneously identify alignment marks of the first element 11 and the second element 21 after performing the bonding operation.
Preferably, the second image capturing device 40 may include two image capturing units, as shown in fig. 3, fig. 3 is a top view of the second image capturing device 40 in this embodiment, the second image capturing device 40 is a bottom view image capturing device, including an image capturing unit 41 and an image capturing unit 42, where the image capturing unit 41 and the image capturing unit 42 are configured to identify alignment marks of the first element 11 and the second element 21 on the bonding position, for example, the alignment marks of the first element 11 and the second element 21 after moving in the height direction and/or performing the bonding operation, for example, the alignment mark A1 and the alignment mark A2 of the first element 11 are identified by the second image capturing device 40, and the alignment mark B1 and the alignment mark B2 of the second element 21 matched with the first element 11, where the alignment mark A1 is matched with the alignment mark B1, the image capturing unit 41 may be used to identify the alignment mark A1 of the first element 11 and the alignment mark B1 of the second element 21, and the image capturing unit 42 may be used to identify the alignment mark A1 of the first element 11 and the alignment mark B2 of the second element 21, so that the two alignment marks can be aligned with sufficient visual field of view is ensured. It will be appreciated by those skilled in the art that the lower view image acquisition device may also include three or more lower view image acquisition units to ensure that a sufficient field of view enables accurate identification of the alignment marks. Alternatively, the lower image capturing unit 41 and the lower image capturing unit 42 include cameras to recognize alignment marks of the first member 11 and the second member 21 after being moved in the height direction and/or performing the bonding operation.
In some embodiments, in response to the bonding apparatus 100 performing a systematic error correction operation, the first element 11 is configured as a first correction patch and the second element 21 is configured as a matched second correction patch, i.e., the first correction patch is matched with the second correction patch, having thereon at least one pair of alignment marks, e.g., alignment mark A1 and alignment mark A2 of the first correction patch, alignment mark B1 and alignment mark B2 of the second correction patch matched with the first correction patch, wherein the alignment mark A1 is matched with the alignment mark B1 and the alignment mark A2 is matched with the alignment mark B2, i.e., the first correction patch is considered to be aligned with the second correction patch when the alignment mark A1 is aligned with the alignment mark B1 and the alignment mark A2 is aligned with the alignment mark B2. In response to the bonding apparatus 100 performing the bonding operation, the first element 11 is configured as a chip or wafer to be bonded, and accordingly, the second element 21 is configured as a wafer or chip to be bonded, at this time, the bonding apparatus 100 may move the movable fetching stage 10 and/or the carrier stage 20 in the height direction based on the system error compensation value, so as to align the chip or wafer to be bonded after the movement in the height direction with the wafer or chip to be bonded, to achieve the movement of the first element 11 to be bonded to a predetermined surface position of the second element 21 to be bonded, and bond at the predetermined surface position of the second element 21 to be bonded.
As can be understood, a systematic error correction operation, i.e., a process of acquiring, as systematic error compensation values, coordinate deviation values generated in the vertical direction thereof by reading alignment marks of the first element 11 and the second element 21 moved to bonding positions in the height direction, wherein the first element 11 is configured as a first correction patch and the second element 21 is configured as a matched second correction patch; the system error compensation operation, i.e. the bonding apparatus 100 adjusts the movable fetching stage 10 and/or the carrying stage 20 based on the system error compensation value to perform the bonding process of the first component 11 and the second component 21, wherein the first component 11 is configured as a chip or wafer to be bonded, and the second component 21 is configured as a wafer or chip to be bonded.
Further, in some embodiments, the first calibration sheet is a transparent, semitransparent or calibration sheet with a through hole structure, that is, the second image capturing device 40 may identify an alignment mark of the second calibration sheet through the first calibration sheet, for example, the transparent calibration sheet may be a glass sheet, the semitransparent calibration sheet may be a semitransparent glass sheet, the movable object taking table 10 drives the first calibration sheet and/or the carrier table to drive the second calibration sheet to move in the height direction to make the first calibration sheet contact with and bond with the second calibration sheet in response to the bonding device 100 performing the system error correction operation, and the second image capturing device 40 is configured to identify the alignment marks of the first calibration sheet and the second calibration sheet after moving in the height direction and/or performing the bonding operation, so as to obtain the system error compensation value.
In some embodiments, in response to the first image capturing device 30 being driven to the alignment position, as shown in fig. 4, fig. 4 is a schematic state diagram of the alignment position in an embodiment of the present application, the upper image capturing unit 31 is configured to identify the alignment mark of the first element 11, that is, the alignment mark of the first element 11 located at the bonding start position by the upper image processing unit 311; the lower image capturing unit 32, in response to the first image capturing device 30 being driven to the alignment position, the lower image capturing unit 32 is configured to identify the alignment mark of the second element 21, that is, the alignment mark of the second element 21 located at the bonding start position by the lower image processing unit 321.
Wherein, the bonding device 100 drives at least one of the movable fetching stage 10 or the carrying stage 20 to adjust to align the first element 11 and the second element 21 based on the alignment mark of the first element 11 identified by the upper image capturing unit 31 and the alignment mark of the second element 21 identified by the lower image capturing unit 32, that is, the first element 11 and the second element 21 are both present in the camera field of view of the first image capturing device 30, and performs difference calculation according to the coordinate data of the alignment marks of the first element 11 and the second element 21, to obtain an X/Y/θ difference value, and performs adjustment compensation by driving at least one of the movable fetching stage 10 or the carrying stage 20 to realize the alignment of the first element 11 and the second element 21.
Further, in some embodiments, after aligning the first element 11 and the second element 21, for example, in response to the system error correction/bonding operation performed by the bonding device 100, after aligning the first element 11 and the second element 21, the movable fetching stage 10 drives the first element 11 and/or the carrying stage to carry the second element 21 to move in the height direction to a bonding position where the first element 11 and the second element 21 are bonded, before the movable fetching stage 10 drives the first element 11 to move in the height direction, the first image capturing device 30 is driven to a non-aligned position, for example, an initial position of the first image capturing device 30, as shown in fig. 5, and fig. 5 is a schematic view of a state of the non-aligned position in accordance with an embodiment of the present application, so as to avoid blocking during the movement of the first element 11 and/or the second element 21 in the height direction, thereby realizing that the first element 11 and/or the second element 21 is moved in the height direction to a preset surface position where the first element 11 contacts the surface of the second element 21, and the first element 11 and the second element 21 are bonded to the preset surface position.
In some embodiments, the second image capturing device 40 is a lower view image capturing device, and is disposed on the movable object capturing table 10, where when the bonding device 100 performs a system error correction operation, the first element and the second element aligned at the alignment position are configured to move to the bonding position in the height direction, the second image capturing device 40 is configured to identify an alignment mark of the first element 11 and the second element 21 on the bonding position, for example, the second image capturing device 40 may identify an alignment mark of the first element 11 and the second element 21 moving in the height direction, obtain a difference between the alignment marks of the first element and the second element, where the difference between the alignment marks includes a difference between the X direction and the Y direction in a coordinate system established by the second image capturing device 40, for example, the first element 11 is a transparent first correction piece, the second element 21 is a matched first correction piece, and the movable object capturing table 10 drives the first element 11 and/or the carrier to move in the height direction to enable the second element 21 to move in the height direction until the first element 11 and the second element 21 is aligned in the height direction, and the second correction piece is a difference between the first element 11 and the second element 21 is performed by the first correction piece and the second correction piece is performed in the height direction, and the second correction piece is performed based on the difference between the first element and the second element 21 and the second correction piece, and the second correction piece is performed by performing a system error correction operation, and a correction operation based on the difference between the first correction piece and the second correction piece is performed after the first correction piece has been performed and the second correction piece.
In some embodiments, the bonding apparatus 100 may perform the system error correction operation multiple times to obtain multiple system error values, that is, the movable fetching stage 10 is obtained multiple times to drive the first element 11 and/or the carrying stage 20 located at the bonding start position to carry the second element 21 located at the bonding start position to move in the height direction to the bonding position where the first element 11 and the second element 21 are bonded, the second image capturing device 40 completes the alignment mark identifying the first element 11 and the second element 21 moving in the height direction, the multiple system error compensation values are obtained through the difference calculation, and the system error compensation value is obtained based on the average value of the multiple system error values, and the bonding apparatus 100 sets the moving path of the movable fetching stage 10 and/or the carrying stage 20 based on the system error compensation value before performing the bonding operation, and then performs the bonding operation, so as to achieve the alignment of the first element 11 and the second element 21 that are finally bonded.
In some embodiments, the second image capturing device 40 is detachably disposed on the movable retrieving table 10 to perform the system error correction operation, and it is understood that by disposing the second image capturing device 40 on the movable retrieving table 10 to perform the system error correction operation, after acquiring the system error compensation value, the second image capturing device 40 is detachable, and in response to the bonding device 100 performing the bonding operation, the bonding device 100 moves the movable retrieving table 10 and/or the stage 20 in the height direction based on the system error compensation value such that the first member 11 and the second member 21 after being moved in the height direction are aligned and bonded.
Referring to fig. 6, fig. 6 is a flowchart of a bonding method according to an embodiment of the present application, where the method is applied to the bonding apparatus 100, as shown in fig. 6, and the method may include the following steps:
s61: the movable fetching stage and/or the carrying stage of the bonding device are used for respectively moving the first element and the second element to the alignment position.
The movable fetching stage 10 and/or the carrier stage 20 of the bonding apparatus 100 are used to move the first element 11 and the second element 21, respectively, to an alignment position, which includes a starting position of the first element 11 and the second element 21 when bonding is performed, and may also include a position where the first element 11 and the second element 21 appear within the field of view of the first image capturing apparatus 30 of the bonding apparatus 100.
S62: the first image acquisition device of the bonding device is used for reading the alignment marks of the first element and the second element which are in the alignment position so as to align the first element and the second element in the height direction.
The first image pickup device 30 of the bonding device 100 is used for reading the alignment marks of the first element 11 and the second element 21 in the aligned position, and driving the movable fetching stage 10 and/or the carrying stage 20 based on the alignment marks to perform adjustment so as to align the first element 11 and the second element 21, that is, to align the alignment marks of the first element 11 and the second element 21 in the vertical direction.
S63: and responding to the bonding device to execute the system error correction operation, driving the first element and the second element to the bonding position, and utilizing the second image acquisition device of the bonding device to identify the alignment marks of the first element and the second element on the bonding position so as to acquire the system error compensation value of the bonding device.
In response to the bonding apparatus 100 performing the system error correction operation, the first element 11 and the second element 21 are driven to the bonding position, for example, the movable fetching stage 10 and/or the carrying stage 20 is used to drive the first element 11 and/or the second element 21 to move in the height direction until the bonding is completed, and then the second image capturing apparatus 40 of the bonding apparatus 100 is used to identify the alignment marks 21 of the first element 11 and the second element after the movement in the height direction and/or the bonding operation is performed, that is, to identify the alignment marks of the first element 11 and the alignment marks of the second element 21 before the movement in the height direction and/or the alignment marks of the first element 11 and the alignment marks of the second element 21 after the movement in the height direction and/or the bonding operation is performed, so as to complete the performing the system error correction operation by performing the system error correction operation multiple times, and the system error compensation value of the bonding apparatus 100 can be obtained based on the average value of the multiple system error values.
S64: in response to the bonding device performing a bonding operation, performing a systematic error compensation operation based on the systematic error compensation value, aligning the first element and the second element driven to the bonding position.
When the bonding apparatus 100 performs the bonding operation, the system error compensation operation is performed based on the obtained system error compensation value, so that the first element 11 and the second element 21 driven to the bonding position are aligned, that is, the bonding apparatus 100 sets the compensation value in the process of moving the movable fetching table 10 and/or the carrying table 20 in the height direction to finish the bonding and the bonding based on the system error compensation value, so as to successfully move the first element 11 to be bonded to the preset surface position of the bonded second element 21 in the height direction, and bond the first element 11 to the preset surface position of the second element 21.
In some embodiments, in response to the bonding apparatus 100 performing a systematic error correction operation, the first element 11 is configured as a first correction patch and the second element 21 is configured as a matched second correction patch, i.e., the first correction patch is matched with the second correction patch, having thereon at least one pair of alignment marks, e.g., alignment mark A1 and alignment mark A2 of the first correction patch, alignment mark B1 and alignment mark B2 of the second correction patch matched with the first correction patch, wherein the alignment mark A1 is matched with the alignment mark B1 and the alignment mark A2 is matched with the alignment mark B2, i.e., the first correction patch is considered to be aligned with the second correction patch when the alignment mark A1 is aligned with the alignment mark B1 and the alignment mark A2 is aligned with the alignment mark B2.
Further, in response to the bonding apparatus 100 performing a systematic error correction operation, driving the first and second elements 11 and 21 to bonding positions, and recognizing alignment marks of the first and second elements 11 and 21 on the bonding positions by the second image pickup device 40 of the bonding apparatus 100 to obtain a systematic error compensation value of the bonding apparatus 100, comprising: moving the first element 11 and the second element 21 to the bonding position using the movable fetching stage 10 and/or the carrying stage 20; the difference between the alignment marks of the first element 11 and the second element 21 on the bonding bit is recognized as a system error value by the second image pickup device 40 to obtain a system error compensation value.
For example, the first element 11 is a transparent first correction sheet, the second element 21 is a matched second correction sheet, after the movable fetching stage 10 drives the first element 11 and/or the carrying stage to carry the second element 21 to move to a bonding position for bonding the first element 11 and the second element 21, the alignment mark of the first correction sheet can be identified by the second image acquisition device 40, and the alignment mark of the second correction sheet can be identified by the first correction sheet, so that the difference between the alignment marks of the first element 11 and the second element 21 after moving in the height direction and performing bonding processing is calculated based on the difference between the alignment marks of the first element 11 and the second element 21 after moving in the height direction and/or performing bonding operation, so as to be a system error value, and further perform a system error correction operation.
In some embodiments, the bonding apparatus 100 performs the system error correction operation multiple times to obtain multiple system error values, and obtains the system error compensation value based on a mean value of the multiple system error values.
The bonding apparatus 100 performs a plurality of system error correction operations to obtain a plurality of system error values, that is, obtains a plurality of system error compensation values by obtaining the movable fetching stage 10 to drive the first element 11 and/or the carrying stage 20 positioned at the alignment position to carry the second element 21 positioned at the alignment position to move to the bonding position where the first element 11 and the second element 21 are bonded, the second image capturing apparatus 40 completes the alignment mark identifying the first element 11 and the second element 21 moving in the height direction, obtains a plurality of system error compensation values by calculating the difference value, and obtains a system error compensation value based on the average value of the plurality of system error values, the bonding apparatus 100 sets the moving path of the movable fetching stage 10 and/or the carrying stage 20 based on the system error compensation value before performing the bonding operation, and performs the bonding operation to enable the first element 11 and the second element 21 which are finally bonded to achieve higher-precision alignment.
In some embodiments, the first calibration sheet is a transparent, translucent, or through-hole calibration sheet.
The first calibration sheet is a transparent calibration sheet, a semitransparent calibration sheet or a calibration sheet with a through hole structure, that is, the second image acquisition device 40 can identify the alignment mark of the second calibration sheet through the first calibration sheet, for example, the transparent calibration sheet may be a glass sheet, the semitransparent calibration sheet may be a semitransparent glass sheet, the movable object taking table 10 drives the first calibration sheet and/or the carrying table to drive the second calibration sheet to move along the height direction so as to enable the first calibration sheet to be in contact with and bonded with the second calibration sheet in response to the bonding device 100 executing the system error correction operation, and the second image acquisition device 40 is configured to identify the alignment marks of the first calibration sheet and the second calibration sheet after moving along the height direction and/or executing the bonding operation, so as to obtain the system error compensation value.
In some embodiments, in response to the bonding apparatus 100 performing a bonding operation, the first element 11 is configured as a die or wafer to be bonded and the second element 21 is configured as a wafer or die to be bonded.
Further, in response to the bonding apparatus 100 performing the bonding operation, performing the systematic error compensation operation based on the systematic error compensation value to align the first element 11 and the second element 21 driven to the bonding position, comprising: the first and second components 11 and 21 are moved to the bonding position by the movable pick-up table 10 and/or the stage 20, and a systematic error compensation operation is performed to align the first and second components driven to the bonding position.
The first and second components 11 and 21 are moved to the bonding position by the movable picking stage 10 and/or the loading stage 20, and a systematic error compensation operation is performed, that is, the first and second components 11 and 21 in the aligned position are adjusted based on the acquired systematic error compensation value of the bonding apparatus 100, and moved to the bonding position so that the first and second components driven to the bonding position are aligned for the bonding operation.
In some embodiments, moving the first element 11 and the second element 21 to the bonding position with the movable stage 10 and/or the stage 20 and performing a systematic error compensation operation to align the first element 11 and the second element 21 driven to the bonding position includes: adjusting the movable fetching stage 10 and/or the stage 20 based on the system error compensation value to perform a system error compensation operation on the first element 11 and the second element 21 in the aligned position, and then moving the movable fetching stage 10 and/or the stage 20 in the height direction so that the first element 11 and the second element 21 are driven to the bonding position; or the movable fetch stage 10 and/or the stage 20 is adjusted based on the system error compensation value to perform the system error compensation operation on the first element 11 and the second element 21 while the movable fetch stage 10 and/or the stage 20 is moved in the height direction so that the first element 11 and the second element 21 are driven to the bonding position.
In some embodiments, before the first image pickup device 30 of the bonding device 100 is used to read the alignment marks of the first and second elements 11 and 21 in the aligned position to align the first and second elements 11 and 21 in the height direction, the first image pickup device 30 is driven to move from the initial position to the working position to read the alignment marks of the first and second elements 11 and 21 in the aligned position. The working position is the bonding position area from the first image capturing device 30 to the bonding position area, so that the alignment marks of the first element 11 and the second element 21 positioned at the bonding start position appear in the field of view of the first image capturing device 30, and the initial position is the first image capturing device 30 moves out of the bonding position area.
Further, after the alignment marks of the first member 11 and the second member 21 in the aligned position are read by the first image pickup device 30 of the bonding device 100 to align the first member 11 and the second member 21 in the height direction, the first image pickup device 30 is driven to move from the working position to the initial position so as to perform the subsequent systematic error correction operation or bonding operation.
In some embodiments, the first image acquisition device 30 is a top-down view image acquisition device.
The first image capturing device 30 is configured to capture an alignment mark of the first element 11 and an alignment mark of the second element, for example, the first image capturing device 30 includes an upper image capturing unit and a lower image capturing unit, the upper image capturing unit has a first viewing angle and is configured to identify the alignment mark of the first element 11, the lower image capturing unit has a second viewing angle and is configured to identify the alignment mark of the second element 21, wherein the upper image capturing unit and the lower image capturing unit may be disposed opposite to each other, for example, when the alignment mark is identified, the upper image capturing unit may be located on a side of the base 51 facing the top plate 521 of the machine frame 52, and the lower image capturing unit may be located on a side of the top plate 521 of the machine frame 52 facing the base 51; alternatively, the upper image capturing unit and the lower image capturing unit may be provided as a single unit, for example, as upper and lower image capturing units, which are located in a cavity formed by the base 51 and the machine frame 52 together when the alignment marks are recognized.
The foregoing is only the embodiments of the present application, and not the patent scope of the present application is limited by the foregoing description, but all equivalent structures or equivalent processes using the contents of the present application and the accompanying drawings, or directly or indirectly applied to other related technical fields, which are included in the patent protection scope of the present application.

Claims (20)

1. A bonding apparatus with systematic error compensation function, comprising:
a movable fetching stage configured to move the first element;
a stage configured to move the second element;
a first image pickup device configured to read alignment marks of the first element and the second element driven to alignment positions;
a second image pickup device configured to read alignment marks of the first element and the second element driven to a bonding position in response to the bonding device performing a systematic error correction operation, to obtain a systematic error compensation value;
wherein the bonding device performs a systematic error compensation operation based on the systematic error compensation value in response to the bonding device performing the bonding operation, aligning the first element and the second element driven to the bonding position.
2. A bonding apparatus according to claim 1, wherein the bonding apparatus comprises a plurality of bonding pads,
the bonding device is further configured to adjust the first element and the second element in an aligned position based on the alignment mark read by the first image pickup device to align the first element and the second element in an aligned position in a height direction.
3. A bonding apparatus according to claim 1, wherein the bonding apparatus comprises a plurality of bonding pads,
performing the systematic error correction operation in response to the bonding apparatus, the first element being configured as a first correction patch and the second element being configured as a matching second correction patch;
in response to the bonding device performing the bonding operation, the first element is configured as a die or wafer to be bonded and the second element is configured as a wafer or die to be bonded.
4. A bonding apparatus according to claim 3, wherein the bonding apparatus comprises a plurality of bonding pads,
the first calibration sheet is transparent, semitransparent or calibration sheet with through holes.
5. A bonding apparatus according to claim 2, wherein,
in response to the bonding device performing a systematic error correction operation, while the first and second elements aligned at an alignment position are configured to be moved in a height direction to the bonding position, the second image pickup device is configured to recognize the alignment marks of the first and second elements on the bonding position, acquire a difference between the alignment marks of the first and second elements as a systematic error value, to perform the systematic error correction operation.
6. The bonding apparatus according to claim 5, wherein the bonding apparatus comprises a plurality of bonding pads,
the bonding device performs the systematic error correction operation a plurality of times to obtain a plurality of systematic error values, and obtains the systematic error compensation value based on a mean value of the plurality of systematic error values.
7. The bonding apparatus according to claim 5, wherein the bonding apparatus comprises a plurality of bonding pads,
the second image acquisition device is detachably arranged on the movable fetching table to execute the system error correction operation.
8. The bonding apparatus according to claim 5, wherein the bonding apparatus comprises a plurality of bonding pads,
the second image capture device includes at least one image capture unit to identify the alignment marks of the first and second elements on a bonding bit.
9. The bonding apparatus according to claim 5, wherein the bonding apparatus comprises a plurality of bonding pads,
in response to the bonding device performing the bonding operation, the bonding device adjusts the movable fetching stage and/or the carrying stage based on the system error compensation value to perform a system error compensation operation on the first element and the second element in the alignment position, and then moves the movable fetching stage and/or the carrying stage in the height direction so that the first element and the second element are driven to the bonding position;
In response to the bonding device performing the bonding operation, the bonding device moves the movable fetching stage and/or the carrying stage in the height direction so that the first element and the second element are driven to the bonding position while adjusting the movable fetching stage and/or the carrying stage based on the system error compensation value to perform the system error compensation operation on the first element and the second element.
10. The bonding apparatus according to claim 1, further comprising:
the movable fetching platform is arranged on the base, the carrying platform is arranged on the base, the movable fetching platform and/or the carrying platform is configured to move along the X direction, the Y direction and the height direction Z and can rotate in a vertical plane perpendicular to the horizontal plane so as to adjust the horizontal state of the movable fetching platform and/or the carrying platform.
11. A bonding apparatus according to claim 1, wherein the bonding apparatus comprises a plurality of bonding pads,
the first image acquisition device is an upper and lower view image acquisition device, and comprises:
a top view image acquisition unit configured to identify an alignment mark of the first element in response to the first image acquisition device being driven to a working position;
A lower image acquisition unit configured to identify an alignment mark of the second element in response to the first image acquisition device being driven to the working position;
the bonding device drives at least one of the movable fetching table or the carrying table to adjust so as to align the first element and the second element in the alignment position based on the alignment mark of the first element identified by the upper image acquisition unit and the alignment mark of the second element identified by the lower image acquisition unit.
12. The bonding apparatus according to claim 11, wherein the bonding apparatus comprises a plurality of bonding pads,
after aligning the first and second elements in the aligned position and before moving the first and/or second elements in a height direction, the first image capturing device is driven to an initial position.
13. A bonding method applied to a bonding apparatus, comprising:
moving the first element and the second element to alignment positions respectively by utilizing a movable fetching table and/or a carrying table of the bonding device;
reading the alignment marks of the first element and the second element which are in an alignment position by using a first image acquisition device of the bonding device so as to align the first element and the second element in the height direction;
Driving the first element and the second element to a bonding position in response to the bonding device performing a systematic error correction operation, and identifying the alignment marks of the first element and the second element on the bonding position by using a second image acquisition device of the bonding device to acquire a systematic error compensation value of the bonding device;
in response to the bonding device performing a bonding operation, performing a systematic error compensation operation based on the systematic error compensation value, aligning the first element and the second element driven to the bonding bit.
14. The bonding method according to claim 13, wherein,
performing the systematic error correction operation in response to the bonding apparatus, the first element being configured as a first correction patch and the second element being configured as a matching second correction patch;
the driving the first and second elements to bonding positions in response to the bonding device performing a systematic error correction operation, and identifying the alignment marks of the first and second elements on the bonding positions with a second image capture device of the bonding device to obtain systematic error compensation values of the bonding device, comprising:
Moving the first element and the second element to a bonding position by using the movable fetching stage and/or the carrying stage;
and identifying a difference value between the alignment marks of the first element and the second element on the bonding bit by using the second image acquisition device as a system error value so as to acquire the system error compensation value.
15. The bonding method according to claim 14, wherein,
the bonding device performs the systematic error correction operation a plurality of times to obtain a plurality of systematic error values, and obtains the systematic error compensation value based on a mean value of the plurality of systematic error values.
16. The bonding method according to claim 14, wherein,
the first calibration sheet is transparent, semitransparent or calibration sheet with through holes.
17. The bonding method according to claim 13, wherein,
in response to the bonding device performing the bonding operation, the first element is configured as a die or wafer to be bonded, and the second element is configured as a wafer or die to be bonded;
the performing a bonding operation based on the systematic error compensation value in response to the bonding device, aligning the first and second elements driven to the bonding position, includes:
The first and second components are moved to a bonding position using the movable pick-up stage and/or the carrier stage and the systematic error compensation operation is performed to align the first and second components driven to the bonding position.
18. The bonding method according to claim 17, wherein,
the moving the first and second elements to bonding locations with the movable pick-up table and/or the carrier and performing the systematic error compensation operation to align the first and second elements driven to the bonding locations includes:
adjusting the movable pick-up stage and/or the carrier stage based on the system error compensation value to perform a system error compensation operation on the first and second elements in the alignment position, and then moving the movable pick-up stage and/or the carrier stage in the height direction so that the first and second elements are driven to the bonding position; or alternatively
And adjusting the movable fetching stage and/or the carrying stage based on the system error compensation value to perform a system error compensation operation on the first element and the second element while moving the movable fetching stage and/or the carrying stage in the height direction so that the first element and the second element are driven to the bonding position.
19. The bonding method according to claim 13, wherein,
before the first image pickup device using the bonding device reads the alignment marks of the first element and the second element in the aligned position to align the first element and the second element in the height direction, the bonding method further includes:
driving the first image acquisition device to move from an initial position to a working position so as to read alignment marks of the first element and the second element which are positioned in an alignment position;
after the first image pickup device using the bonding device reads the alignment marks of the first element and the second element in the aligned position to align the first element and the second element in the height direction, the bonding method further includes:
and driving the first image acquisition device to move from the working position to the initial position so as to execute the subsequent system error correction operation or the bonding operation.
20. The bonding method according to claim 19, wherein,
the first image acquisition device is an upper and lower view image acquisition device.
CN202311689978.9A 2023-12-07 2023-12-07 Bonding device and method with system error compensation function Pending CN117457560A (en)

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CN202311689978.9A CN117457560A (en) 2023-12-07 2023-12-07 Bonding device and method with system error compensation function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311689978.9A CN117457560A (en) 2023-12-07 2023-12-07 Bonding device and method with system error compensation function

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CN117457560A true CN117457560A (en) 2024-01-26

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