CN117438369B - Wafer tilting mechanism and wafer front end transmission equipment - Google Patents

Wafer tilting mechanism and wafer front end transmission equipment Download PDF

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Publication number
CN117438369B
CN117438369B CN202311750312.XA CN202311750312A CN117438369B CN 117438369 B CN117438369 B CN 117438369B CN 202311750312 A CN202311750312 A CN 202311750312A CN 117438369 B CN117438369 B CN 117438369B
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China
Prior art keywords
clamping
wafer
assembly
driving
connecting rod
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CN202311750312.XA
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CN117438369A (en
Inventor
薛增辉
孟亚东
张胜森
王文广
冯启异
叶莹
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Shanghai Guona Semiconductor Technology Co ltd
Zhejiang Kona Semiconductor Technology Co ltd
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Shanghai Guona Semiconductor Technology Co ltd
Zhejiang Kona Semiconductor Technology Co ltd
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Priority to CN202311750312.XA priority Critical patent/CN117438369B/en
Publication of CN117438369A publication Critical patent/CN117438369A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a wafer turnover mechanism and wafer front end transmission equipment. The clamping device comprises a fixed plate, clamping assemblies and driving assemblies, the fixed plate rotates under the driving of the turnover device, the two clamping assemblies are arranged, the two clamping assemblies synchronously turnover with the fixed plate and can move back to back or opposite to each other along the fixed plate, the two clamping assemblies are connected through a connecting rod assembly, and the wafer is clamped between the two clamping assemblies. The elastic piece is fixed on the fixed plate and connected with the clamping components, and the elastic piece always provides tension for the opposite movement of the two clamping components. The two clamping assemblies can be alternately spliced with the driving assembly, the driving assembly drives one clamping assembly spliced with the driving assembly to move up and down, and the connecting rod assembly drives the other clamping assembly to move reversely. Realize the stable centre gripping and upset of wafer.

Description

Wafer tilting mechanism and wafer front end transmission equipment
Technical Field
The invention relates to the technical field of wafer front end transmission equipment, in particular to a wafer overturning mechanism and wafer front end transmission equipment.
Background
In the manufacture of semiconductor wafers, hundreds or thousands of process steps, such as dicing, polishing, cleaning, photolithography, etching, ion implantation, metallization, packaging, etc., are required, and numerous wafer handling steps are also required. Some of these processes require processing of both sides of the wafer, such as double-sided cleaning, double-sided polishing, double-sided etching, and the like, which require flipping of the wafer prior to processing or during transport. Therefore, in some front end transfer equipment (e.g., EFEM Equipment Front End Module equipment front end modules and Sorter wafer Sorter) a wafer flipping mechanism is required for flipping individual wafers. In the wafer overturning process, the placement and positioning accuracy of the wafer are guaranteed, the protection of the wafer is also good, and the wafer is prevented from being broken. The existing wafer overturning mechanism generally adopts a negative pressure adsorption mode to realize overturning of a single wafer, but the negative pressure adsorption device is complex in structure, a negative pressure pipeline is difficult to manage and maintain, and a large amount of space is occupied in a wafer conveying device.
Disclosure of Invention
In order to overcome the defects, the invention aims to provide a wafer overturning mechanism which can realize clamping and overturning of a wafer by using a simple mechanical structure, and has a simple structure and small occupied space.
In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides a wafer tilting mechanism, includes turning device and clamping device who sets up on the mount pad, clamping device can centre gripping a wafer, clamping device turns over under turning device drive, clamping device includes:
the fixed plate is vertically arranged and connected with the turnover device, and the fixed plate is driven by the turnover device to rotate;
the wafer clamping device comprises two clamping assemblies, wherein the two clamping assemblies are synchronously overturned with the fixed plate and can move back to back or opposite to each other along the fixed plate, the two clamping assemblies are connected through a connecting rod assembly, and the wafer is clamped between the two clamping assemblies;
the elastic piece is fixed on the fixed plate and connected with the clamping assemblies, and the elastic piece always provides tension for the opposite movement of the two clamping assemblies, so that the wafer is always clamped between the two clamping assemblies in the overturning process;
the driving assembly is arranged on the mounting seat and located below the fixing plate, the two clamping assemblies can be alternately spliced with the driving assembly, and the driving assembly is used for driving one clamping assembly spliced with the driving assembly to move up and down and driving the other clamping assembly to move reversely through the connecting rod assembly.
The invention has the beneficial effects that:
1. when the wafer is O-degree or turned to 180-degree, the driving assembly is in butt joint with one clamping assembly, and when one clamping assembly is driven to move up and down, the other clamping assembly is driven to move in the opposite direction through force conduction of the connecting rod assembly, and at the moment, the clamping assembly loosens or clamps the wafer, so that the wafer is placed or carried by a mechanical arm conveniently, and automatic clamping and turning of the wafer are realized.
2. In the process of overturning the clamping assemblies, the two clamping assemblies can be pulled to move in opposite directions only through one elastic piece to clamp the wafer, and the clamping assemblies are in flexible contact with the wafer to buffer impact force when clamping the wafer because the clamping assemblies clamp the wafer by means of the elastic force of the elastic piece.
3. The driving component for pulling the two clamping components to move back to back is located below the fixed plate, namely, the driving component does not rotate synchronously with the fixed plate, so that the weight on the fixed plate is reduced, and the overturning stability of the fixed plate is improved, namely, the overturning stability of the two clamping components is improved.
Further, the driving assembly comprises a driving piece and a driving block, the driving piece is used for driving the driving block to move up and down along the mounting seat, a butt joint groove is formed in the driving block, and each clamping assembly comprises a butt joint part which can be inserted into the butt joint groove.
The butt joint groove is provided with a front end opening positioned in front and side openings at the left side and the right side, the butt joint part moves along the circumference in the process of synchronously overturning with the fixed plate, the butt joint part is inserted into the butt joint groove from one side opening in the circumferential movement process, and at the moment, the driving block can pull the clamping assembly in butt joint with the driving block to move up and down.
Furthermore, an upper locating plate and a lower locating plate which are arranged at intervals up and down are further arranged in the butt joint groove, the upper locating plate and the lower locating plate can move up and down along the butt joint part, springs are arranged between the upper locating plate and the upper wall of the butt joint groove and between the lower locating plate and the lower wall of the butt joint groove, and the butt joint part can be inserted between the upper locating plate and the lower locating plate.
The upper locating plate and the lower locating plate can move up and down, so that after the butt joint part is inserted between the upper locating plate and the lower locating plate, the driving block plays a role in buffering when driving the first clamping assembly or the second clamping assembly to move up and down, and is used for buffering when clamping a wafer, and rigid contact with the wafer is avoided.
Furthermore, the upper positioning plate and the lower positioning plate are respectively provided with an abutting surface capable of abutting against the abutting part, and a horizontal tester is respectively fixed at the left end and the right end of each abutting surface and is used for collecting pressure on the abutting surfaces. And judging whether the wafer is turned in place or not through the pressure value of the horizontal tester.
Further, the connecting rod assembly comprises a first connecting rod, a second connecting rod and a third connecting rod which swing in a vertical plane, two ends of the third connecting rod are respectively hinged with the first connecting rod and the second connecting rod, the center point of the third connecting rod is hinged with the fixed plate, the other end of the first connecting rod is hinged with one clamping assembly, and the other end of the second connecting rod is hinged with the other clamping assembly.
The third connecting rod forms a teeterboard structure, one of the first connecting rod and the second connecting rod is pulled to drive the other of the first connecting rod and the second connecting rod to swing, and then the opposite or opposite movement of the two clamping assemblies is realized.
Further, the elastic piece comprises two tension springs corresponding to the clamping assemblies, one end of each tension spring is fixedly connected with the fixing plate, the other end of each tension spring is fixedly connected with the corresponding clamping assembly, the tension springs are always in a stretching state, and the tension springs provide tension force for the corresponding clamping assemblies to move towards the other clamping assemblies. In the overturning process, the clamping force of the two clamping assemblies is completely provided by the two tension springs, so that the flexible clamping of the wafer is truly realized, and the wafer is prevented from being damaged.
Furthermore, each clamping assembly comprises clamping jaws and clamping modules which are fixedly connected, the wafer is clamped between the clamping jaws of the two clamping assemblies, and the clamping modules of the two clamping assemblies are symmetrical relative to the hinge point center of the third connecting rod and the fixing plate. The center symmetry's structure lets two centre gripping modules also the same distance of every turn removal under the drive of link assembly.
Furthermore, each clamping module comprises a fixing piece, the end part of the fixing piece, far away from the fixing plate, is fixedly connected with the clamping jaw, and the fixing plate is provided with a sliding rail for the fixing piece to slide. The slide rail defines the clamping module to move only in a straight line. The connecting piece comprises a guide part penetrating through the fixing plate, a guide hole is formed in the fixing plate, and the guide part moves up and down in the guide hole. The guide hole and the guide part are matched to further guide and also play a role in limiting the moving distance of the clamping assembly.
Further, a third sliding rail for guiding the movement of the driving block is fixed on the mounting seat, and the driving piece is fixed on the mounting seat and connected with the driving block through the eccentric assembly. The third slide rail limits the driving block to move up and down only, and improves the movement stability.
Further, the eccentric assembly comprises a turntable and a crank, the turntable is vertically arranged and driven by the driving piece to rotate along the axis of the turntable, one end of the crank is hinged with the turntable, the hinging point of the crank and the turntable is eccentrically arranged on the turntable, and the other end of the crank is hinged with the driving block. The turntable and the crank are adopted to form an eccentric structure, the driving block is driven to do linear motion, rotation is converted into linear motion, the linear motion range is limited, namely the lifting range of the driving block is limited, and the excessive moving distance of the lifting block is avoided. Meanwhile, the driving piece is horizontally arranged, the driving piece is perpendicular to the driving block, and space is saved.
Further, the clamping device further comprises a position detection assembly, the position detection assembly is used for detecting the moving distance of the clamping assembly in butt joint with the driving assembly, the position detection assembly comprises a first correlation sensor and a second correlation sensor which are fixed on the mounting seat, the first correlation sensor and the second correlation sensor are arranged at intervals up and down, each clamping assembly is provided with a light shielding sheet, the light shielding sheet can shield correlation light rays of the first correlation sensor and the second correlation sensor in the up-and-down moving process, and the first correlation sensor and the second correlation sensor are linked with the driving assembly.
Further, the turnover device comprises a turnover motor and a rotating shaft, the turnover motor is used for driving the rotating shaft to rotate along the axis of the turnover motor, and the rotating shaft is fixedly connected with the fixing plate.
Further, the turnover device further comprises a limiting rod and an induction piece which rotate synchronously with the rotating rod, a semicircular limiting groove is formed in the mounting seat, the limiting rod moves in the limiting groove, third sensors fixed with the fixing seat are respectively arranged at two ends of the limiting groove, the third sensors can sense the position of the induction piece, and the third sensors are in linkage with the turnover motor. Triple limiting in the overturning process is realized.
The invention also discloses wafer front-end transmission equipment which comprises the wafer overturning mechanism.
Drawings
FIG. 1 is a schematic perspective view of a turnover mechanism according to an embodiment of the present invention;
FIG. 2 is an exploded view of an embodiment of the tilting mechanism of the present invention;
FIG. 3 is a schematic perspective view of a clamping device according to an embodiment of the present invention;
FIG. 4 is a schematic view of another perspective view of a clamping device according to an embodiment of the present invention;
FIG. 5 is an enlarged view of FIG. 3 at A;
FIG. 6 is a front view of a clamping device according to an embodiment of the present invention;
FIG. 7 is an enlarged view of FIG. 6 at B;
FIG. 8 is a schematic perspective view of a driving block according to an embodiment of the present invention;
FIG. 9 is a schematic perspective view of a first fixing member according to an embodiment of the present invention;
FIG. 10 is a schematic structural view of a fixing plate according to an embodiment of the present invention;
FIG. 11 is a schematic perspective view of a turnover device according to an embodiment of the invention;
fig. 12 is a schematic perspective view of a front end wafer transfer apparatus according to an embodiment of the present invention.
In the figure:
1. a mounting base; 11. a third slide rail;
2. a first clamping assembly; 21. a first jaw; 22. a first clamping module; 221. a first fixing member; 2211. a connection part; 2212. a sliding part; 2213. a butt joint part; 222. a first connector; 2221. a guide part;
3. a second clamping assembly; 31. a second jaw; 32. a second clamping module; 321. a second fixing member; 322. a second connector;
4. a fixing plate; 41. a first slide rail; 42. a second slide rail; 43. a first guide hole; 44. a second guide hole; 45. a key slot;
5. a drive assembly; 51. a driving member; 52. a driving block; 521. a butt joint groove; 522. an upper positioning plate; 523. a lower positioning plate; 524. a spring; 53. an eccentric assembly; 531. a turntable; 532. a crank;
6. a connecting rod assembly; 61. a first link; 62. a second link; 63. a third link;
71. a first tension spring; 72. a second tension spring;
8. a position detection assembly; 81. a first correlation sensor; 82. a second correlation sensor; 83. a light shielding sheet;
9. a turnover device; 91. a rotation shaft; 92. a turnover motor; 93. a drive gear; 941. a limit rod; 942. a limit groove; 951. a third sensor; 952. an induction piece;
100. wafer turnover mechanism.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
Referring to fig. 1 and 2, a wafer turning mechanism of the present invention includes a turning device 9 and a holding device, the holding device can hold a wafer, and the holding device is turned under the driving of the turning device 9.
The clamping device comprises a fixed plate 4, wherein the fixed plate 4 is vertically arranged and connected with a turnover device 9, and the fixed plate 4 is driven by the turnover device 9 to rotate. The fixing plate 4 is provided with two clamping assemblies and an elastic piece, the two clamping assemblies and the fixing plate 4 can synchronously turn over and can slide up and down along the fixing plate 4, the elastic piece is fixed on the fixing plate 4, and the elastic piece provides tension for the relative movement of the two clamping assemblies so that the wafer is clamped between the two clamping assemblies. A driving component 5 is arranged below the fixed plate 4, and the two clamping components are in butt joint with the driving component 5 in sequence in the overturning process. The two clamping assemblies are connected through the connecting rod assembly 6, the driving assembly 5 drives one clamping assembly in butt joint with the driving assembly to move up and down, and the connecting rod assembly 6 drives the other clamping assembly to move reversely, so that the two clamping assemblies move oppositely or back to clamp or release a wafer.
In this embodiment, when the wafer is turned over to 180 ° at O °, the driving component 5 is abutted with one clamping component, and when one clamping component is driven to move up and down, the other clamping component is driven to move in the opposite direction through the force conduction of the connecting rod component 6, and at this time, the clamping component loosens or clamps the wafer, so that the robot is convenient to place or transport the wafer. In the process of overturning the clamping assemblies, the two clamping assemblies can be pulled to move in opposite directions only through one elastic piece to clamp the wafer, and the clamping assemblies are in flexible contact with the wafer to buffer impact force when clamping the wafer because the clamping assemblies clamp the wafer by means of the elastic force of the elastic piece. Simultaneously, the driving component 5 which pulls the two clamping components to move back to back or opposite to each other is positioned below the fixed plate 4, namely, the driving component is not synchronously rotated with the fixed plate 4, so that the weight on the fixed plate 4 is reduced, and the overturning stability of the fixed plate 4 is further improved, namely, the overturning stability of the two clamping components is improved.
Referring to fig. 4, the fixing plate 4 is provided with a first slide rail 41 and a second slide rail 42 which are positioned on the same vertical plane, and the two clamping assemblies slide along the first slide rail 41 and the second slide rail 42 respectively. Due to the definition of the first 41 and second 42 slide rails, the two clamping assemblies can only slide up and down along the fixed plate 4. The two clamping assemblies are a first clamping assembly 2 and a second clamping assembly 3 respectively, the first clamping assembly 2 slides along a first sliding rail 41, and the second clamping assembly 3 slides along a second sliding rail 42.
Referring to fig. 4, the link assembly 6 includes a first link 61, a second link 62, and a third link 63, both ends of the third link 63 are respectively hinged to the first link 61 and the second link 62, a center point of the third link 63 is hinged to the fixing plate 4, the other end of the first link 61 is hinged to the first clamping assembly 2, and the other end of the second link 62 is hinged to the second clamping assembly 3.
Referring to fig. 6, the fixing plate 4 is turned forward and backward along the direction of the hollow arrow in the figure, when the first clamping assembly 2 is abutted with the driving assembly 5, the driving assembly 5 drives the first clamping assembly 2 to move downward, the acting force of the driving assembly 5 is larger than the acting force of the elastic member, the first clamping assembly 2 drives the left end of the third connecting rod 63 (the hinge point of the first connecting rod 61 and the third connecting rod 63) to swing downward through the first connecting rod 61, the third connecting rod 63 forms a teeterboard structure, the right end of the third connecting rod 63 (the hinge point of the second connecting rod 62 and the third connecting rod 63) swings upward, the second connecting rod 62 drives the second clamping assembly 3 connected with the second clamping assembly to move upward, and the two clamping assemblies move oppositely at the moment and are in an open state. When the driving component 5 drives the first clamping component 2 to move upwards, the elastic component can provide restoring force at the same time, the first clamping component 2 is restored to the initial position, the connecting rod component 6 drives the second clamping component 3 to move downwards to the initial position, the two clamping components move relatively, and the wafer is clamped between the two clamping components in a clamping state.
The first link 61 is hinged with the third link 63 through a first hinge rod, the second link 62 is hinged with the third link 63 through a second hinge rod, the third link 63 is hinged with the fixing plate 4 through a third hinge rod, and the third hinge rod is fixed with the fixing plate 4. The first link 61 is hinged with the first clamping assembly 2 through a fourth hinge rod, and the second link 62 is hinged with the second clamping assembly 3 through a fifth hinge rod. The first hinging rod, the third hinging rod, the fourth hinging rod and the fifth hinging rod are parallel. Referring to fig. 7, a vertical distance d1 from the axis of the first hinge rod to the axis of the third hinge rod is equal to a vertical distance d2 from the axis of the second hinge rod to the axis of the third hinge rod, and a vertical distance d3 from the axis of the fourth hinge rod to the axis of the first hinge rod is equal to a vertical distance d4 from the axis of the fifth hinge rod to the axis of the second hinge rod. The third link 63 is ensured to move the first clamping assembly 2 and the second clamping assembly 3 by the same distance in the vertical direction during the swinging. At this time, the link assembly 6 is centrally symmetrical with respect to the hinge point of the third link 63 and the fixed plate 4.
Referring to fig. 1 and 2, the first clamping assembly 2 includes a first clamping jaw 21 and a first clamping module 22 which are fixedly connected, the first clamping jaw 21 is fixed at an end of the first clamping module 22 away from the fixing plate 4, the second clamping assembly 3 includes a second clamping jaw 31 and a second clamping module 32 which are fixedly connected, and the second clamping jaw 31 is fixed at an end of the second clamping module 32 away from the fixing plate 4. The wafer is clamped between the first clamping jaw 21 and the second clamping jaw 31, and the first clamping module 22 and the second clamping module 32 are symmetrical to the hinge point of the fixed plate 4 relative to the third connecting rod 63.
Referring to fig. 3 and 4, the first clamping module 22 includes a first fixing member 221 and a first connecting member 222, the first clamping jaw 21 is fixed at an end of the first fixing member 221 away from the fixing plate 4, the first connecting member 222 fixes a side edge of the first fixing member 221 near the end of the fixing plate 4, and a first slider sliding along the first sliding rail 41 is fixed on the first fixing member 221. The second clamping assembly 3 has the same structure as the first clamping assembly 2, and comprises a second fixing piece 321 and a second connecting piece 322, wherein a second sliding block sliding along a second sliding rail 42 is fixed on the second fixing piece 321.
The first fixing member 221 and the second fixing member 321 have the same structure, and the first fixing member 221 and the second fixing member 321 are distributed in a mirror image manner, and are also symmetrical with respect to the center of the hinge point of the third connecting rod 63 and the fixing plate 4. The first and second fixtures 221 and 321 are disposed at intervals in the vertical direction when the wafer is at O ° or flipped to 180 °. Referring to fig. 9, the first fixing member 221 includes a connection portion 2211, a sliding portion 2212, and a butt joint portion 2213, the connection portion 2211 and the sliding portion 2212 are vertically disposed, the connection portion 2211 extends in a horizontal direction, and the sliding portion 2212 extends in a vertical direction. The docking portion 2213 is L-shaped and includes a docking unit and a connection unit, one end of the docking unit can be inserted into the docking slot, and the other end extends out of the docking slot and is connected with the sliding portion through the connection unit. The end of the connecting portion 2211 away from the fixing plate is fixed to the first clamping jaw 21, the first slider is fixed to the sliding portion 2212, and the first connecting piece 222 is fixed to a side edge of the sliding portion 2212. The slide portion 2212 forms a butt joint portion 2213 at an end in the vertical direction, and the butt joint portion 2213 can be inserted into the driving assembly 5. When the abutting portion 2213 of the first fixing piece 221 is inserted into the driving assembly 5, the driving assembly 5 can pull the first fixing piece 221 to move up and down, that is, pull the first clamping assembly 2 to move up and down.
The first fixing member 221 is connected in a split manner, and the connection portion 2211, the sliding portion 2212 and the butt portion 2213 are fixedly connected, or the first fixing member 221 is in an integrated structure.
The first connecting piece 222 and the second connecting piece 322 have the same structure, the first connecting piece 222 and the second connecting piece 322 are symmetrical relative to the center of the hinge point of the third connecting rod 63 and the fixed plate 4, the first connecting rod 61 is hinged with the first connecting piece 222, and the second connecting rod 62 is hinged with the second connecting piece 322. Referring to fig. 10, the first link 222 includes a guide portion 2221 passing through the fixing plate 4 in the front-rear direction, and the fixing plate 4 is provided with a first guide hole 43 through which the guide portion 2221 of the first link 222 passes and moves up and down. The first guide hole 43 is a waist-shaped hole, and the first guide hole 43 guides the first link 222 while defining a vertical movement distance of the first guide, that is, a vertical movement distance of the first clamping assembly 2. The fixing plate 4 is further provided with a second guide hole 44 corresponding to the guide portion 2221 of the second connector. Of course, the guide portion 2221 may not pass through the first guide hole 43 and the second guide hole 44, but may be embedded in the first guide hole 43 and the second guide hole 44, and in this case, the first guide hole 43 and the second guide hole 44 may not pass through the fixing plate 4, and may perform a guiding function.
Referring to fig. 4, the elastic member includes a first tension spring 71 and a second tension spring 72, one end of the first tension spring 71 is fixedly connected with the first clamping assembly 2, the other end is fixedly connected with the fixing plate 4, one end of the second tension spring 72 is fixedly connected with the second clamping assembly 3, and the other end is also fixedly connected with the fixing plate 4. The first tension spring 71 is always in a stretched state during the up-and-down movement of the first clamping assembly 2, and provides a force for the first clamping assembly 2 to move towards the second clamping assembly 3; the second tension spring 72 is always in a stretched state during the up-and-down movement of the second clamping assembly 3, and provides a force for the second clamping assembly 3 to move toward the first clamping assembly 2.
In the overturning process of the fixing plate 4, the first clamping assembly 2 and the second clamping assembly 3 are not in butt joint with the driving assembly 5, at the moment, the first tension spring 71 and the second tension spring 72 are in a stretching state, and the tension of the tension springs is converted into acting forces of the first clamping assembly 2 and the second clamping assembly 3, which are close to each other, so that the wafer is clamped between the two clamping assemblies. In the process, the clamping force is completely provided by two tension springs, so that the flexible clamping of the wafer is truly realized, and the wafer is prevented from being damaged. When the driving component 5 drives the clamping component which is in butt joint with the driving component 5 after the first clamping component 2 or the second clamping component 3 is in butt joint with the driving component 5, the acting force of the driving component 5 is larger than the pulling force of the first tension spring 71 and the second tension spring 72, and the first tension spring 71 and the second tension spring 72 are in a continuous stretching state. Meanwhile, the first tension spring 71 and the second tension spring 72 also store the restoring force of the first clamping assembly 2 and the second clamping assembly 3.
The first tension spring 71 and the second tension spring 72 are parallel to each other, and when the wafer is positioned at O ° or turned over to 180 °, the first tension spring 71 and the second tension spring 72 are both in a vertical state. Referring to fig. 4, when the first clamping assembly 2 is docked with the driving assembly 5, the lower end of the first tension spring 71 is fixed to the side of the sliding portion 2212 of the first fixing member 221, and the upper end of the first tension spring 71 is fixed to the fixing plate 4. The upper end of the second tension spring 72 is fixed to the side of the sliding portion 2212 of the second fixing member 321, and the lower end of the second tension spring 72 is fixed to the fixing plate 4.
Referring to fig. 3 and 4, the driving assembly 5 includes a driving member 51 and a driving block 52, and the driving block 52 is capable of moving up and down by the driving member 51. The driving block 52 is provided with a docking slot 521, and the docking portion 2213 can be inserted into the docking slot 521. The docking groove 521 has a front opening at the front and side openings at the left and right sides, the docking portion 2213 moves in a circular motion during the simultaneous turning with the fixing plate 4, and the docking portion 2213 is inserted into the docking groove 521 from one side opening during the circular motion, and at this time, the driving block 52 can pull the clamping assembly docked therewith to move up and down. After the wafer is placed, the fixing plate 4 drives the docking portion 2213 to move continuously, the docking portion 2213 slides out of the docking groove 521 from the other side opening, and at this time, the clamping assembly is separated from the driving assembly 5.
In this embodiment, the driving component 5 is disposed below the fixing plate 4, and does not rotate synchronously with the fixing plate 4, so as to reduce the weight of the fixing plate 4, but only when the first clamping component 2 or the second clamping component 3 is inserted into the docking slot 521 of the driving component 5, the first clamping component 2 or the second clamping component 3 can be pushed to move up and down, so as to realize the opening of the clamping jaw, and when the angle of O or 180 degrees is reached, the wafer is placed on the clamping jaw or the wafer on the clamping jaw is taken out.
The driving block 52 moves up and down along the mounting seat 1, a third sliding rail 11 for guiding the movement of the driving block 52 is fixed on the mounting seat 1, and the third sliding rail 11 is vertically arranged. The fixing plate 4 is parallel to the mounting base 1 and can rotate relative to the mounting base 1 to realize wafer overturning, and the driving piece 51 is fixed on the mounting base 1.
In one embodiment, the driving member 51 may be a linear driving module, and directly drives the driving block 52 to move up and down.
In one embodiment, referring to fig. 3 and 4, the driving member 51 is coupled to the driving block 52 by an eccentric assembly 53, the eccentric assembly 53 including a turntable 531 and a crank 532. The carousel 531 is vertical to be set up and is driven by driving piece 51 and rotate along self axis, and the one end and the carousel 531 of crank 532 are articulated and the pin joint eccentric setting of crank 532 and carousel 531 is on carousel 531, and the other end and the drive piece 52 of crank 532 are articulated. When the driving member 51 drives the turntable 531 to rotate, the driving block 52 is pushed to linearly reciprocate by the crank 532. In this embodiment, the turntable 531 and the crank 532 form an eccentric structure, so as to drive the driving block 52 to perform linear motion, and convert the rotation into linear motion, so as to define the range of linear motion, that is, the lifting range of the driving block 52, and avoid the excessive moving distance of the lifting block. Meanwhile, the driving piece 51 is horizontally arranged, the driving piece 51 is vertical to the driving block 52, and space is saved.
Referring to fig. 6, the hinge point of the crank 532 and the driving block 52 is located right below the hinge point of the third link 63 and the fixing plate 4, which are on the same vertical line. In practice, the up-and-down movement distance of the driving block 52 does not need to be excessively large during use, and thus the driving member 51 is arranged to deviate from this vertical line, and the up-and-down movement distance of the driving block 52 is reduced relative to the case where the driving member 51 is arranged on this vertical line.
In one embodiment, referring to fig. 8, an upper locating plate 522 and a lower locating plate 523 are further disposed in the docking slot 521 at an upper and lower interval, the upper locating plate 522 and the lower locating plate 523 can move up and down along the docking portion 2213, and a spring 524 is disposed between the upper locating plate 522 and the upper wall of the docking slot 521 and between the lower locating plate 523 and the lower wall of the docking slot 521, and the spring 524 provides a force for resetting the upper locating plate 522 and the lower locating plate 523. The abutting portion 2213 can be inserted between the upper positioning plate 522 and the lower positioning plate 523.
The upper positioning plate 522 and the lower positioning plate 523 can move up and down, so that after the butt joint part 2213 is inserted between the upper positioning plate 522 and the lower positioning plate 523, the driving block 52 plays a role in buffering when driving the first clamping assembly 2 or the second clamping assembly 3 to move up and down, and is used for buffering when clamping a wafer, so that rigid contact with the wafer is avoided.
The upper and lower positioning plates 522 and 523 can ensure stability and accuracy of the wafer flipping mechanism when flipped.
The upper guide post and the lower guide post corresponding to the upper positioning plate 522 and the lower edge plate are fixed in the butt joint groove 521, and a space is reserved between the upper guide post and the lower guide post in the vertical direction, so that the insertion of the butt joint part 2213 is not interfered. The upper locating plate 522 slides along the upper guide post, the lower locating plate 523 slides along the lower guide post, and springs 524 are sleeved on the upper guide post and the lower guide post.
The clamping device further comprises a position detection assembly 8, the position detection assembly 8 is used for detecting the moving distance of the clamping assembly in butt joint with the driving assembly 5, namely, whether the clamping jaws are in an open or combined state, the detection assembly is linked with the driving piece 51, and the driving piece 51 can stop when receiving signals of the detection assembly.
Referring to fig. 3, the position detecting assembly 8 includes a first correlation sensor 81 and a second correlation sensor 82, and the first correlation sensor 81 and the second correlation sensor 82 are fixed to the mounting base 1 and are disposed at an upper and lower interval. The first correlation sensor 81 is located below the second correlation sensor 82. The first correlation sensor 81 and the second correlation sensor 82 each include a transmitting end and a receiving end, which are respectively located at left and right sides of the driving block 52, and the first correlation sensor 81 and the second correlation sensor 82 respectively have a first correlation light and a second correlation light which are horizontally arranged. The butt joint parts 2213 of the first clamping assembly 2 and the second clamping assembly 3 are respectively provided with a shading sheet 83, and the shading sheets 83 and the corresponding butt joint parts 2213 synchronously move and can shade the first correlation light rays or the second correlation light rays.
After the first clamping assembly 2 is spliced with the driving block 52, when the clamping jaw is opened, namely the driving block 52 drives the first clamping assembly 2 to move downwards, and when the shading sheet 83 on the first clamping assembly 2 shields the first correlation light, the clamping jaw is opened to the maximum position, and the operation of the driving piece 51 is stopped. When the clamping jaws are combined, namely the driving block 52 moves upwards, and the shading sheet 83 on the first clamping assembly 2 shields the second correlation light, the clamping jaws are completely closed, and the operation of the driving piece 51 is stopped.
Referring to fig. 5, the light shielding plate 83 is L-shaped and includes a vertical portion and a horizontal portion, wherein the vertical portion is fixedly connected with one side of the docking portion 2213 away from the driving block 52, and the horizontal portion can extend out of the docking slot 521 from the front end opening and shield the first or the second correlation light. The vertical position of the light shielding sheet 83 relative to the butt joint portion 2213 is adjustable, and after the light shielding sheet 83 is adjusted to a proper position, the light shielding sheet 83 is fixed on the butt joint portion 2213.
Referring to fig. 2 and 11, the turning device 9 is located at the rear of the clamping device, and the turning device 9 includes a turning motor 92 and a rotating shaft 91, where the turning motor 92 is fixed on the mounting base 1 and drives the rotating shaft 91 to rotate along its own axis, and the rotating shaft 91 is fixedly connected with the fixing plate 4 to drive the fixing plate 4 to turn.
In one embodiment, the third hinge rod is disposed coaxially with the rotation shaft 91, and the third hinge shaft may be fixed to the rotation shaft 91, that is, the end of the rotation shaft 91 passing through the fixing portion is the third hinge rod. At this time, that is, the third link 63 is sleeved on the rotation shaft 91 and can rotate around the rotation shaft 91, the position where the third link 63 is sleeved on the rotation shaft 91 is the center point of the third link 63. Thus, before and after overturning, the positions of the first fixing piece 221 and the second fixing piece 321 are overlapped, namely the positions of the wafers are overlapped, so that the manipulator is convenient to pick and place.
Referring to fig. 10, a key groove 45 through which the rotation shaft 91 passes and which is coupled to the rotation shaft 91 is provided in the fixing plate 4, and the key groove 45 is located at the center of the fixing plate 4, so that the rotation shaft 91 is uniformly stressed.
Referring to fig. 11, a driving gear 93 is fixed to an output end of the flipping motor 92, a rotation shaft 91 is fixed to a center position of a driven gear, and the driving gear 93 and the driven gear are connected by a gear belt. The driving gear 93 is also fixed with a limit rod 941, the mounting seat 1 is provided with a circular arc-shaped limit groove 942, and the limit rod 941 moves in the limit groove 942. The limit groove 942 serves to limit the moving distance of the limit lever 941, that is, the rotation angle of the driving gear 93 and the rotation shaft 91. The limit groove 942 is a semicircular arc, and when the limit rod 941 abuts against the end of the limit groove 942, the rotation shaft 91 just rotates 180 degrees, that is, the wafer turns 180 degrees.
Referring to fig. 11, the turning device 9 further includes two third sensors 951 further fixed on the mounting base 1, where the two third sensors 951 are located at two ends of the limit groove 942 and are used for sensing the position of the driving gear 93, and the driving gear 93 is provided with a sensing piece 952 corresponding to the third sensors 951. When the third sensor 951 senses the sensing piece 952, the driving gear 93 (the rotation shaft 91) rotates in place. The third sensor 951 is coupled to the flipping motor 92, and when the flipping motor 92 receives a signal from the third sensor 951 to sense the sensing piece 952, the flipping motor 92 stops operating.
On the one hand, the stroke of the turnover motor 92 can limit the rotation angle of the rotation shaft 91, on the other hand, the limit of the rotation angle of the rotation shaft 91 is realized through the cooperation of the limit groove 942 and the limit rod 941, and meanwhile, the limit of the rotation angle of the rotation shaft 91 is realized through the action of the third sensor 951 for controlling the turnover motor 92, so that the triple limit of the turnover process is realized.
In one embodiment, to improve the precise positioning of the flip angle, two horizontal testers are fixed on the abutting surface of the upper positioning plate 522 and the lower positioning plate 523, where the abutting portion 2213 abuts against, and the two horizontal testers on one positioning plate are respectively disposed at the left and right ends of the abutting surface, that is, near the two ends of the two side openings, where the horizontal testers may be pressure sensors or others.
When the overturning is completed, the second fixing member 321 or the abutting portion 2213 of the second fixing member 321 is inserted between the upper positioning plate 522 and the lower positioning plate 523. If the turn is in place, i.e., the turn is just 180 °, the abutting portion 2213 should be kept horizontal, not inclined, the driving block 52 descends or ascends, and the two horizontal testers abut against the left and right horizontal testers of the upper positioning plate 522 or the lower positioning plate 523, and the test pressures of the two horizontal testers are equal. If it is detected that one end of the upper positioning plate 522 or the lower positioning plate 523 generates pressure first and the other end generates pressure later, it is indicated that the flip angle is not equal to 180 °, and the flip rotation angle is determined to be less than 180 ° or greater than 180 ° according to which end of the upper positioning plate 522 or the lower positioning plate 523 the horizontal tester generates pressure first or the pressure is greater. The driving block 52 is continuously raised or lowered to the limit, and whether the turnover device 9 is horizontally corrected is determined by whether the pressures of the horizontal testers at both sides of the upper positioning plate 522 or the lower positioning plate 523 are equal or not when the upper positioning plate 522 or the lower positioning plate 523 is compressed to the limit.
In the working process of the wafer overturning mechanism 100, initially, the butt joint part 2213 of the first fixing piece 221 is inserted between the upper locating plate 522 and the lower locating plate 523, the driving piece 51 drives the driving piece 52 to move downwards, the driving piece 52 drives the first fixing piece 221, the first clamping jaw 21 and the first connecting piece 222 to move downwards synchronously, the first connecting piece 222 drives the right end of the third connecting rod 63 to swing downwards through the first connecting rod 61, the left end of the third connecting rod 63 swings upwards, the second connecting rod 62 drives the second connecting piece 322, the second fixing piece 321 and the second clamping jaw 31 connected with the second connecting rod upwards to move, and at the moment, the two clamping assemblies move backwards and are in an open state. The wafer is placed between the two clamping jaws, the driving piece 51 drives the driving block 52 to move upwards, the first fixing piece 221 is reset to the initial position, the connecting rod assembly 6 drives the second clamping assembly 3 to move downwards to the initial position, the two clamping assemblies move relatively, and the wafer is clamped between the two clamping jaws in a clamping state. Then the turnover motor 92 drives the rotation shaft 91 to rotate 180 degrees, and in the process, the clamping device synchronously rotates, so that the wafer can be turned 180 degrees. After the overturning is completed, the butt joint part 2213 of the second fixing piece 321 is inserted between the upper locating plate 522 and the lower locating plate 523, the driving piece 51 drives the driving block 52 to move downwards, the two clamping assemblies move back to back, the two clamping assemblies are in an open state, the overturned wafer is taken out from between the two clamping jaws and is put into the next wafer to be overturned, and after the clamping device clamps the wafer, the overturning motor 92 reversely rotates to realize overturning of the next wafer.
Referring to fig. 12, in one embodiment, the invention discloses a wafer front end transmission device, which is used for transmitting wafers. The wafer overturning mechanism 100 is further arranged in the transmission cavity, and the wafer can be overturned in the wafer overturning mechanism 100 by 180 degrees. The wafer in the wafer box of the wafer loading mechanism can be placed on the wafer overturning mechanism to overturn, and the wafer is transported to processing equipment which is in butt joint with the front end transmission equipment of the wafer for processing after overturning.
The above embodiments are only for illustrating the technical concept and features of the present invention, and are intended to enable those skilled in the art to understand the content of the present invention and to implement the same, but are not intended to limit the scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be included in the scope of the present invention.

Claims (14)

1. The utility model provides a wafer tilting mechanism, includes turning device and clamping device who sets up on the mount pad, clamping device can centre gripping a wafer, clamping device turns over its characterized in that under turning device drive: the clamping device comprises:
the fixed plate is vertically arranged and connected with the turnover device, and the fixed plate is driven by the turnover device to rotate;
the wafer clamping device comprises two clamping assemblies, wherein the two clamping assemblies are synchronously overturned with the fixed plate and can move back to back or opposite to each other along the fixed plate, the two clamping assemblies are connected through a connecting rod assembly, and the wafer is clamped between the two clamping assemblies;
the elastic piece is fixed on the fixed plate and is connected with the clamping assemblies, the elastic piece always provides pulling force for the opposite movement of the two clamping assemblies, and in the overturning process of the clamping assemblies, the two clamping assemblies are pulled to move in opposite directions only through the elastic piece so as to clamp a wafer, so that the wafer is always clamped between the two clamping assemblies in the overturning process;
the driving assembly is arranged on the mounting seat and located below the fixing plate, the two clamping assemblies can be alternately spliced with the driving assembly, the driving assembly is spliced with one clamping assembly only when a wafer is turned to 180 degrees or at an angle of O degrees, and the driving assembly is used for driving one clamping assembly spliced with the driving assembly to move up and down and driving the other clamping assembly to move reversely through the connecting rod assembly.
2. The wafer flipping mechanism of claim 1, wherein: the driving assembly comprises a driving piece and a driving block, the driving piece is used for driving the driving block to move up and down along the mounting seat, a butt joint groove is formed in the driving block, and each clamping assembly comprises a butt joint part which can be inserted into the butt joint groove.
3. The wafer flipping mechanism of claim 2, wherein: the butt joint groove is internally provided with an upper locating plate and a lower locating plate which are arranged at intervals up and down, the upper locating plate and the lower locating plate can move up and down along the butt joint part, springs are arranged between the upper locating plate and the upper wall of the butt joint groove and between the lower locating plate and the lower wall of the butt joint groove, and the butt joint part can be inserted between the upper locating plate and the lower locating plate.
4. A wafer flipping mechanism according to claim 3, wherein: the upper positioning plate and the lower positioning plate are respectively provided with an abutting surface capable of abutting against the abutting part, and a horizontal tester is respectively fixed at the left end and the right end of each abutting surface and used for collecting pressure on the abutting surfaces.
5. The wafer flipping mechanism of any one of claims 1 to 4, wherein: the connecting rod assembly comprises a first connecting rod, a second connecting rod and a third connecting rod which swing in a vertical plane, two ends of the third connecting rod are respectively hinged with the first connecting rod and the second connecting rod, the center point of the third connecting rod is hinged with the fixed plate, the other end of the first connecting rod is hinged with one clamping assembly, and the other end of the second connecting rod is hinged with the other clamping assembly.
6. The wafer flipping mechanism of any one of claims 1 to 4, wherein: the elastic piece comprises two tension springs corresponding to the clamping assemblies, one end of each tension spring is fixedly connected with the fixing plate, the other end of each tension spring is fixedly connected with the corresponding clamping assembly, the tension springs are always in a stretching state, and the tension springs provide tension force for the corresponding clamping assembly to move towards the other clamping assembly.
7. The wafer flipping mechanism of claim 5, wherein: each clamping assembly comprises clamping jaws and clamping modules which are fixedly connected, the wafer is clamped between the clamping jaws of the two clamping assemblies, and the clamping modules of the two clamping assemblies are centrally symmetrical relative to the hinge point of the third connecting rod and the fixing plate.
8. The wafer flipping mechanism of claim 7, wherein: each of the clamping modules includes:
the end part of the fixing piece, which is far away from the fixing plate, is fixedly connected with the clamping jaw, and the fixing plate is provided with a sliding rail for the fixing piece to slide;
the connecting piece comprises a guide part penetrating through the fixing plate, a guide hole is formed in the fixing plate, and the guide part moves up and down in the guide hole.
9. The wafer flipping mechanism of any one of claims 2 to 4, wherein: the mounting seat is fixedly provided with a third sliding rail for guiding the movement of the driving block, and the driving piece is fixed on the mounting seat and connected with the driving block through an eccentric assembly.
10. The wafer flipping mechanism of claim 9, wherein: the eccentric assembly comprises a turntable and a crank, the turntable is vertically arranged and driven by the driving piece to rotate along the axis of the turntable, one end of the crank is hinged with the turntable, the hinge point of the crank and the turntable is eccentrically arranged on the turntable, and the other end of the crank is hinged with the driving block.
11. The wafer flipping mechanism of claim 1, wherein: the clamping device further comprises a position detection assembly, wherein the position detection assembly is used for detecting the moving distance of the clamping assembly in butt joint with the driving assembly, the position detection assembly comprises a first correlation sensor and a second correlation sensor which are fixed on the mounting seat, and the first correlation sensor and the second correlation sensor are arranged at intervals up and down;
each clamping assembly is provided with a shading sheet, the shading sheets can shade the correlation light rays of the first correlation sensor and the second correlation sensor in the up-and-down movement process, and the first correlation sensor and the second correlation sensor are linked with the driving assembly.
12. The wafer flipping mechanism of claim 1, wherein: the turnover device comprises a turnover motor and a rotating shaft, wherein the turnover motor is used for driving the rotating shaft to rotate along the axis of the turnover motor, and the rotating shaft is fixedly connected with the fixed plate.
13. The wafer flipping mechanism of claim 12, wherein: the turnover device further comprises a limiting rod and an induction piece which rotate synchronously with the rotating rod, a semicircular limiting groove is formed in the mounting seat, the limiting rod moves in the limiting groove, third sensors fixed with the fixing seat are respectively arranged at two end parts of the limiting groove, the third sensors can sense the position of the induction piece, and the third sensors are linked with the turnover motor.
14. The utility model provides a wafer front end transmission equipment which characterized in that: a wafer flipping mechanism comprising any one of claims 1 to 13.
CN202311750312.XA 2023-12-19 2023-12-19 Wafer tilting mechanism and wafer front end transmission equipment Active CN117438369B (en)

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CN116177206A (en) * 2023-03-20 2023-05-30 华天科技(宝鸡)有限公司 High-precision 180-degree turn-over actuator
CN116313990A (en) * 2023-02-27 2023-06-23 宁波芯丰精密科技有限公司 Wafer clamping mechanism and wafer transmission device
CN116313996A (en) * 2023-04-04 2023-06-23 沈阳芯源微电子设备股份有限公司 Clamping and turning device for wafer

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030026451A (en) * 2001-09-25 2003-04-03 한국디엔에스 주식회사 Wafer reverse unit for semicondutor device fabrication equipment
CN111029273A (en) * 2018-10-10 2020-04-17 沈阳芯源微电子设备股份有限公司 Low contact wafer upset system
KR20210098573A (en) * 2020-01-31 2021-08-11 에이피시스템 주식회사 Apparatus for flipping substrate and transfer system having the same
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