CN117435009A - Chip heat dissipation method, single board, electronic device, computer device and storage medium - Google Patents

Chip heat dissipation method, single board, electronic device, computer device and storage medium Download PDF

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Publication number
CN117435009A
CN117435009A CN202210896127.0A CN202210896127A CN117435009A CN 117435009 A CN117435009 A CN 117435009A CN 202210896127 A CN202210896127 A CN 202210896127A CN 117435009 A CN117435009 A CN 117435009A
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China
Prior art keywords
heat exchange
chip
mode
heat
heat dissipation
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陶成
刘帆
周晓东
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Zte Intelligent Technology Nanjing Co ltd
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Zte Intelligent Technology Nanjing Co ltd
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Priority to CN202210896127.0A priority Critical patent/CN117435009A/en
Priority to PCT/CN2023/079590 priority patent/WO2024021606A1/en
Publication of CN117435009A publication Critical patent/CN117435009A/en
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The embodiment of the invention provides a chip heat dissipation method, a single board, electronic equipment, computer equipment and a computer readable storage medium, wherein the method comprises the following steps: determining allowable thermal resistance values of the chips according to first characteristic parameters of the chips; determining heat exchange modes of all chips, wherein the heat exchange modes comprise a first heat exchange mode and a second heat exchange mode; under the condition that the heat exchange mode is a first heat exchange mode, determining a heat radiation mode of a corresponding chip according to the allowable thermal resistance value and a first thermal resistance threshold value; and under the condition that the heat exchange mode is the second heat exchange mode, determining the heat radiation mode of the corresponding chip according to the allowable heat resistance value and the second heat resistance threshold value. Through confirming the heat exchange mode of the chip, the magnitude relation between the allowable thermal resistance value of the chip and the corresponding preset thermal resistance threshold value under the heat exchange mode is compared, and based on the comparison result, which heat dissipation mode should be adopted by the chip is judged, so that the cost of the heat dissipation design of the chip is reduced under the condition that the heat dissipation requirement of the chip is met, and the design cost and the heat dissipation efficiency can be considered.

Description

Chip heat dissipation method, single board, electronic device, computer device and storage medium
Technical Field
Embodiments of the present invention relate to, but are not limited to, the field of heat dissipation technologies, and in particular, to a chip heat dissipation method, a board, an electronic device, a computer device, and a computer readable storage medium.
Background
In recent years, with the continuous development of internet technology, the integration level of electronic equipment in fields such as communication and IT is increasingly high, high-integration high-power consumption chips are increasingly applied to a single board system, and because a plurality of chips with different power consumption are integrated on a single board, the heat dissipation degree of each chip is different, so that the heat dissipation requirement is different, in the related technology, although the single-phase liquid cooling single board has high technical maturity, when the problem of uneven temperature exists under the multi-chip serial connection, the chip at the flowing end is easy to generate an overtemperature phenomenon, the two-phase liquid cooling single board has stronger heat dissipation capability, meanwhile, the temperature uniformity of the multi-chip serial connection can be ensured, but the design cost is higher, and due to the supercooling degree of cooling liquid, when the heat dissipated by the chip through which cooling liquid flows firstly is insufficient to enable the cooling liquid to generate phase change, the single-phase heat exchange risk exists, meanwhile, the two-phase liquid cooling single board cannot meet the heat dissipation requirement of the ultra-high-power density chip, and the design cost of the chip-level liquid cooling micro-channel heat dissipation technology is too high, various heat dissipation modes have advantages and disadvantages, and reasonable modes are selected for each chip in the design of the single board, so that the problem of how to solve the heat dissipation requirement is solved.
Disclosure of Invention
The following is a summary of the subject matter described in detail herein. This summary is not intended to limit the scope of the claims.
The embodiment of the invention provides a chip heat dissipation method, a single board, electronic equipment, computer equipment and a computer readable storage medium, wherein the heat dissipation mode of each chip is determined by comparing the allowable heat resistance of a plurality of chips on the single board with a corresponding heat resistance threshold value, the plurality of chips on the single board are subjected to heat dissipation through a composite liquid cooling heat dissipation scheme, and the heat dissipation design cost is reduced on the premise of meeting the heat dissipation requirements of the chips on the single board.
In a first aspect, an embodiment of the present invention provides a method for dissipating heat from a chip, where the method includes: determining allowable thermal resistance values of the chips according to first characteristic parameters of the chips; determining heat exchange modes of all chips, wherein the heat exchange modes comprise a first heat exchange mode and a second heat exchange mode; under the condition that the heat exchange mode is a first heat exchange mode, determining a heat radiation mode of a corresponding chip according to the allowable thermal resistance value and a first thermal resistance threshold value; and under the condition that the heat exchange mode is a second heat exchange mode, determining a heat radiation mode of the corresponding chip according to the allowable heat resistance value and a second heat resistance threshold, wherein the first heat resistance threshold is larger than the second heat resistance threshold.
In a second aspect, an embodiment of the present invention provides a board, on which a plurality of chips are disposed, and a heat dissipation mode of each of the chips is determined by applying the heat dissipation method of the chips according to the first aspect.
In a third aspect, an embodiment of the present invention provides an electronic device, including a board as described in the second aspect.
In a fourth aspect, an embodiment of the present invention provides a computer apparatus, including: the device comprises a memory, a processor and a computer program stored in the memory and capable of running on the processor, wherein the processor realizes the chip heat dissipation method according to the first aspect when executing the computer program.
In a fifth aspect, an embodiment of the present invention provides a computer-readable storage medium storing a computer-executable program for causing a computer to execute the chip heat dissipation method according to the first aspect.
The embodiment of the invention provides a chip heat dissipation method, a single board, electronic equipment, computer equipment and a computer readable storage medium, wherein the method comprises the following steps: determining allowable thermal resistance values of the chips according to first characteristic parameters of the chips; determining heat exchange modes of all chips, wherein the heat exchange modes comprise a first heat exchange mode and a second heat exchange mode; under the condition that the heat exchange mode is a first heat exchange mode, determining a heat radiation mode of a corresponding chip according to the allowable thermal resistance value and a first thermal resistance threshold value; and under the condition that the heat exchange mode is a second heat exchange mode, determining a heat radiation mode of the corresponding chip according to the allowable heat resistance value and a second heat resistance threshold, wherein the first heat resistance threshold is larger than the second heat resistance threshold. Through confirming the heat exchange mode of chip, compare the magnitude relation of the allowable thermal resistance value of chip and the corresponding preset thermal resistance threshold value under this heat exchange mode again, based on this comparison result, judge which kind of heat dissipation mode should be adopted to the chip, dispel the heat to a plurality of chips on the veneer through compound liquid cooling heat dissipation scheme, realize reducing the cost of chip heat dissipation design under the prerequisite that satisfies each chip heat dissipation demand on the veneer, can effectively compromise design cost and radiating efficiency.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
FIG. 1 is a flow chart of a method for dissipating heat from a chip according to an embodiment of the present invention;
FIG. 2 is a sub-flowchart for step S102 of FIG. 1;
fig. 3 is a sub-flowchart for step S203 in fig. 2;
FIG. 4a is a schematic structural diagram of a single board according to an embodiment of the present invention;
FIG. 4b is a schematic diagram of another structure of a single board according to an embodiment of the present invention;
FIG. 4c is a schematic diagram of another structure of a single board according to an embodiment of the present invention;
FIG. 4d is a schematic diagram of another embodiment of a board according to the present invention;
FIG. 4e is a schematic diagram of another structure of a single board according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of a computer device according to an embodiment of the present invention.
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate and do not limit the invention.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It should be understood that in the description of the embodiments of the present invention, plural (or multiple) means two or more, and that greater than, less than, exceeding, etc. are understood to not include the present number, and that greater than, less than, within, etc. are understood to include the present number. If any, the terms "first," "second," etc. are used for distinguishing between technical features only, and should not be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
The embodiment of the invention provides a chip heat dissipation method, a single board, electronic equipment, computer equipment and a computer readable storage medium, wherein the method comprises the following steps: determining allowable thermal resistance values of the chips according to first characteristic parameters of the chips; determining heat exchange modes of all chips, wherein the heat exchange modes comprise a first heat exchange mode and a second heat exchange mode; under the condition that the heat exchange mode is a first heat exchange mode, determining a heat radiation mode of a corresponding chip according to the allowable thermal resistance value and a first thermal resistance threshold value; and under the condition that the heat exchange mode is a second heat exchange mode, determining a heat radiation mode of the corresponding chip according to the allowable heat resistance value and a second heat resistance threshold, wherein the first heat resistance threshold is larger than the second heat resistance threshold. Through determining the heat exchange mode of the chip, the magnitude relation between the allowable thermal resistance value of the chip and the preset thermal resistance threshold value in the heat exchange mode is compared, and based on the comparison result, the heat radiation mode of the chip is judged. Therefore, a reasonable heat dissipation mode is selected for each chip, and each chip on the single board is subjected to heat dissipation through the composite liquid cooling heat dissipation scheme, so that the heat dissipation design cost of the chip is reduced under the condition that the heat dissipation requirement of each chip on the single board is met.
Referring to fig. 1, fig. 1 is a flowchart of a method for cooling a chip according to an embodiment of the present invention. The chip heat dissipation method includes, but is not limited to, the following steps:
step S101, determining allowable thermal resistance values of all chips according to first characteristic parameters of a plurality of chips, wherein the chips are integrated on the same single board;
step S102, determining a heat exchange mode of each chip, wherein the heat exchange mode comprises a first heat exchange mode and a second heat exchange mode;
step S103, determining a heat radiation mode of a corresponding chip according to the allowable thermal resistance value and the first thermal resistance threshold value under the condition that the heat exchange mode is the first heat exchange mode;
step S104, determining a heat dissipation mode of the corresponding chip according to the allowable heat resistance value and a second heat resistance threshold value when the heat exchange mode is the second heat exchange mode, wherein the first heat resistance threshold value is greater than the second heat resistance threshold value
It can be understood that the first heat exchange mode refers to a single-phase heat exchange mode, that is, a heat exchange mode in which the cooling liquid is always kept in a liquid state and is not converted into a gaseous state by the heat emitted by the chip.
It can be understood that the second heat exchange mode refers to a two-phase heat exchange mode, that is, a heat exchange mode in which the cooling liquid is changed from a liquid state to a gas state due to heat emitted by the chip in the heat dissipation process, and then condensed and liquefied again in the heat dissipation pipeline to become a liquid state.
It can be understood that the first characteristic parameter may include a temperature requirement of the chip, a liquid inlet temperature of the single board, a power consumption value of the chip, an interface thermal resistance between the chip and the single board, and a crust thermal resistance of the chip. The total limit value of the thermal resistance between the chip and the outside can be calculated according to the temperature requirement of the chip, the single board liquid inlet temperature and the power consumption value of the chip, and on the basis, the part of the interface thermal resistance and the crust thermal resistance is subtracted from the total limit value of the thermal resistance, so that the allowable thermal resistance value of the cold plate under the condition of meeting the heat dissipation requirement of the chip can be calculated.
It is understood that the first thermal resistance threshold is a thermal resistance limit value of the single-phase conventional cold plate, i.e., a minimum value of thermal resistance of the single-phase conventional cold plate. The second thermal resistance threshold is the minimum value of the thermal resistance of the two-phase conventional cold plate, and it should be noted that, when the single-phase conventional cold plate is used for liquid cooling and heat dissipation, the heat required to be dissipated by the chip and conducted to the cooling liquid cannot cause the cooling liquid to generate phase change, i.e. in the heat dissipation mode, the heat dissipation capacity is poor, so that the requirement on the thermal resistance of the cold plate is low, and the thermal resistance threshold of the single-phase conventional cold plate is larger than the thermal resistance threshold of the two-phase conventional cold plate, i.e. the first thermal resistance threshold is larger than the second thermal resistance threshold.
It may be appreciated that in some embodiments, in a case where the heat exchange mode is the first heat exchange mode, determining the heat dissipation mode of the corresponding chip according to the allowable thermal resistance value and the first thermal resistance threshold value includes: when the allowable thermal resistance value is larger than a first thermal resistance threshold value, determining that the corresponding chip adopts a first heat dissipation mode; and when the allowable thermal resistance value is smaller than the first thermal resistance threshold value, determining that the corresponding chip adopts a second heat dissipation mode. The first heat exchange mode is a single-phase micro-channel cold plate liquid cooling heat dissipation mode, and the second heat exchange mode is a single-phase micro-channel cold plate liquid cooling heat dissipation mode, and the single-phase micro-channel cold plate liquid cooling heat dissipation mode has better heat dissipation capacity compared with the single-phase cold plate liquid cooling heat dissipation mode, but at the same time, higher design cost is required. Specifically, when the allowable thermal resistance value of the chip is greater than the first thermal resistance threshold, it is indicated that the heat dissipation capability of the single-phase cold plate liquid cooling heat dissipation mode can also meet the heat dissipation requirement of the corresponding chip, the chip is in the single-phase cold plate liquid cooling heat dissipation mode, and when the allowable thermal resistance value of the chip is greater than the first thermal resistance threshold, it is indicated that the heat dissipation capability of the single-phase cold plate liquid cooling heat dissipation mode cannot meet the heat dissipation requirement of the chip, in this case, the single-phase cold plate liquid cooling heat dissipation mode may cause damage to the chip, and therefore, the single-phase micro-channel cold plate liquid cooling heat dissipation mode must be adopted. Based on the above, the heat dissipation is carried out on each chip on the single board through the composite liquid cooling heat dissipation scheme, so that the heat dissipation design cost of the chip is reduced under the condition that the heat dissipation requirement of each chip on the single board is met.
It may be appreciated that in some embodiments, in a case where the heat exchange mode is the second heat exchange mode, determining the heat dissipation mode of the corresponding chip according to the allowable thermal resistance value and the second thermal resistance threshold value includes: when the allowable thermal resistance value is larger than a second thermal resistance threshold value, determining that the corresponding chip adopts a second heat dissipation mode; and when the allowable thermal resistance value is smaller than the second thermal resistance threshold value, determining that the corresponding chip adopts a second heat dissipation mode. The second heat exchange mode is a two-phase micro-channel cold plate liquid cooling heat dissipation mode, and the two-phase micro-channel cold plate liquid cooling heat dissipation mode has better heat dissipation capacity compared with the two-phase cold plate liquid cooling heat dissipation mode, but at the same time, higher design cost is required. Specifically, when the allowable thermal resistance value of the chip is greater than the second thermal resistance threshold, it is indicated that the heat dissipation capability of the two-phase cold plate liquid cooling heat dissipation mode can also meet the heat dissipation requirement of the corresponding chip, the chip is only required to use the two-phase cold plate liquid cooling heat dissipation mode, and when the allowable thermal resistance value of the chip is greater than the second thermal resistance threshold, it is indicated that the heat dissipation capability of the two-phase cold plate liquid cooling heat dissipation mode cannot meet the heat dissipation requirement of the chip, in this case, the two-phase cold plate liquid cooling heat dissipation mode may cause damage to the chip, and therefore, the two-phase micro-channel cold plate liquid cooling heat dissipation mode must be used. Based on the above, the composite liquid cooling heat dissipation scheme is used for dissipating heat of a plurality of chips on the single board, so that the heat dissipation design cost of the chips is reduced under the condition that the heat dissipation requirements of the chips on the single board are met.
It can be understood that in the embodiment of the invention, by comparing the allowable thermal resistance value of the chip with the corresponding thermal resistance limit value in the heat exchange mode where the chip is located, each chip on the single board is determined to respectively adopt different heat dissipation modes, so that the temperatures of a plurality of chips on the single board can be maintained within the working temperature range, the problem that the local chips on the single board generate serious heat, and the temperature of each chip is uneven is effectively solved, and the temperature uniformity among the chips is effectively improved.
As shown in fig. 2, in some embodiments, step S102 includes, but is not limited to, the following steps:
step S201, obtaining a second characteristic parameter;
step S202, determining a heat exchange power consumption threshold according to a second characteristic parameter;
step S203, determining heat exchange modes of the chips according to the heat exchange power consumption threshold.
It is understood that the heat exchange modes include a single-phase heat exchange mode and a two-phase heat exchange mode.
It will be appreciated that the second characteristic parameters include: latent heat of physical properties of the working medium, total power consumption of the single plate, dryness requirement, supercooling degree of liquid inlet of the single plate and specific heat capacity of physical properties of the working medium. The working medium refers to a medium substance for mutually converting heat energy and mechanical energy, in the application, the working medium refers to cooling liquid, latent heat refers to heat absorbed or released by the working medium under the condition that the temperature does not change, the supercooling degree of the single plate liquid inlet refers to the difference between the temperature at which the cooling liquid is condensed into liquid under a certain pressure and the saturation temperature under the pressure, and due to the existence of the supercooling degree, after the cooling liquid takes away heat emitted by a chip, when the heat emitted by the chip is insufficient to offset the supercooling degree, the cooling liquid can maintain the liquid state and does not change phase. In some embodiments, step S202 may include: determining flow according to the physical property latent heat of the working medium, the total power consumption of the single plate and the dryness requirement; and determining the heat exchange power consumption threshold according to the flow, the liquid inlet supercooling degree of the single plate and the physical specific heat capacity of the working medium. Specifically, the total heat generated by the single board can be estimated according to the total power consumption of the single board, the heat dissipation capacity required for keeping the single board in a normal working state can be estimated based on the total heat dissipation capacity, and the total flow of the required cooling liquid can be calculated by combining the physical property latent heat and the dryness requirement of the working medium. Based on the flow of the cooling liquid, the supercooling degree of the single plate liquid inlet and the specific heat capacity of the working medium can calculate a heat threshold which can be taken away under the condition that the cooling liquid is maintained in a liquid state and does not generate phase change, and the corresponding chip heat exchange power consumption threshold can be determined based on the heat threshold. Based on the heat exchange power consumption threshold value, the heat exchange power consumption threshold value can be compared with the total power consumption of the chips, namely the heat exchange mode which the chips should take can be determined, specifically, the first N chips are determined to adopt a single-phase heat exchange mode, and the first N+1st chips start to adopt a two-phase heat exchange mode.
It can be understood that when the cooling liquid flows through the heat dissipation device corresponding to the front N chips, that is, the front half section of the pipeline, the cooling liquid can be maintained within a certain temperature range due to the existence of supercooling degree, and when the cooling liquid flows through the heat dissipation device corresponding to the tail end chip from the n+1th chip, the cooling liquid is cooled in a phase change mode due to the adoption of a two-phase heat exchange mode, so that the cooling liquid can still be maintained within a certain temperature range when flowing through the rear half section of the pipeline, and the design cost is reduced on the premise of ensuring higher heat dissipation efficiency.
As shown in fig. 3, in some embodiments, step S203 includes, but is not limited to, the following steps:
step S301, determining chip ordering according to the connection relation of the heat dissipation devices corresponding to the chips;
step S302, calculating a first power consumption sum of the front N chips and a second power consumption sum of the front N+1 chips according to chip ordering and power consumption values of the chips, wherein N is a positive integer greater than 0;
step S303, comparing the first power consumption sum and the second power consumption sum with heat exchange power consumption thresholds respectively;
step S304, when the first power consumption sum is smaller than the heat exchange power consumption threshold and the second power consumption sum is larger than the heat exchange power consumption threshold, determining the heat exchange mode of the first N chips as a first heat exchange mode, and determining the heat exchange mode of the chips after the Nth chip in the chip sequencing as a second heat exchange mode.
It is understood that the heat dissipating device may be a cold plate or a micro-channel cold plate, and in particular, is further determined according to step S103 or step S104.
It can be appreciated that a plurality of chips are integrated on the single board, the heat dissipation devices corresponding to the chips are designed in series-parallel connection through metal pipelines, hoses and the like, in some embodiments, the metal pipelines are connected with the metal pipelines through welding, in other embodiments, barb interfaces can be adopted for liquid inlets and liquid outlets of the cold plates, interference fit connection is carried out through rubber pipelines such as Teflon, and based on the barb interfaces and the cross pipelines, clamp reinforcing connection can be further added. Based on the above, the cooling liquid can sequentially flow through the heat dissipation devices corresponding to the chips according to a certain sequence, namely, the flowing sequence of the cooling liquid can be determined according to the connection relation among the heat dissipation devices, and the ordering of the chips on the single board can be determined according to the flowing sequence.
It can be understood that the chip ordering can represent the sequence of cooling liquid flowing through the heat dissipation devices corresponding to the chips, and when the cooling liquid flows through the heat dissipation devices, a part of heat emitted by the chips passing through the heat dissipation devices can be taken away, so that the cooling liquid is heated, the total heat emitted by the N chips into the cooling liquid can be determined by calculating the total power consumption sum of the N chips, after the total heat emitted by the N chips into the cooling liquid reaches a certain threshold value, the total heat is enough to offset the supercooling degree of the single-plate liquid, the cooling liquid is raised to a certain temperature, when the heat emitted by the N+1th chip is taken away, the phase change is met, the phase change is gasified from the liquid state to the gaseous state, based on the fact that the first power consumption sum of the N chips and the second power consumption sum of the N+1th chip are calculated, the first power consumption sum and the second power consumption sum are respectively compared with the heat exchange power consumption threshold value, so that the cooling liquid can be maintained after the cooling liquid flows through the heat dissipation devices corresponding to the N chips and the heat is taken away, the cooling liquid can be gasified from the N+1th chip after the heat is taken away, and the phase change can be determined to be in a phase change mode from the liquid state to the liquid state, and the phase change mode can be started from the liquid state to the 1 chip.
It can be understood that in the embodiment of the invention, the heat exchange power consumption threshold is calculated and compared with the total power consumption of the front N chips, so that the total heat emitted by the front N chips is determined to be insufficient to cause the cooling liquid to generate a phase change, and therefore, the front N chips are determined to adopt a single-phase heat exchange mode, based on the phase change, the allowable thermal resistance value of each chip is compared with the thermal resistance threshold of the single-phase cold plate liquid cooling heat dissipation mode, when the allowable thermal resistance value of the chip is greater than the thermal resistance threshold of the single-phase cold plate liquid cooling heat dissipation mode, the heat dissipation capacity of the single-phase cold plate liquid cooling heat dissipation mode is indicated to meet the heat dissipation requirement of the corresponding chip, and therefore, the chip adopts the single-phase micro-channel cold plate liquid cooling heat dissipation mode. According to the method provided by the embodiment of the invention, on one hand, the total power consumption of the front N chips is compared with the heat exchange power consumption threshold value to determine that the front N chips adopt a single-phase heat exchange mode, so that the risk that when the front end chip adopts the two-phase heat exchange mode, heat emitted by the front end chip is insufficient to enable cooling liquid to change phase due to the supercooling degree of single-plate liquid inlet is avoided, and on the other hand, the allowable thermal resistance value of the chip is compared with the thermal resistance threshold value of the single-phase cold plate liquid cooling heat dissipation mode to determine that the chip adopts the single-phase cold plate liquid cooling heat dissipation mode with lower design cost or adopts the single-phase micro-channel cold plate liquid cooling heat dissipation mode with better heat dissipation capability. Therefore, the composite liquid cooling heat dissipation scheme is used for dissipating heat of the chips on the single board, so that the heat dissipation efficiency and the design cost of the chips on the single board are effectively considered.
It can be understood that, because each chip on the veneer corresponds and makes the coolant liquid need flow through the radiator that a plurality of chips correspond and take away heat through the series connection design, and take away the heat back coolant liquid and also can take place the intensification, from this, if the terminal chip that is in coolant liquid flow adopts single-phase heat transfer mode, can exist because coolant liquid temperature is too high, the difference in temperature is less between chip and the coolant liquid, the coolant liquid can't take away the heat that the chip distributes or can only take away the heat that a small amount of chips distribute, thereby lead to radiating efficiency low, the unable problem that satisfies the chip heat dissipation demand of radiating capacity. In the embodiment of the invention, the heat exchange power consumption threshold value is calculated and compared with the total power consumption of the front N+1 chips, when the total power consumption of the front N+1 chips is larger than the heat exchange power consumption threshold value, namely, the cooling liquid supercooling degree is lower from the N+1 chip, and the heat emitted by the chips is enough to enable the cooling liquid to generate phase change, so that the following chips can adopt a two-phase heat exchange mode, in the two-phase heat exchange mode, the cooling liquid is vaporized from a liquid state to a gaseous state after taking away the heat emitted by the chips, and then condensed and liquefied again in a pipeline, thereby realizing cooling of the cooling liquid, and effectively avoiding the problem that the cooling liquid has poor heat dissipation effect on the tail end chips due to higher temperature of the cooling liquid caused by the heat emitted by the front N chips when the cooling liquid flows to the tail end of the pipeline. Based on the above, the allowable thermal resistance value of the chip is compared with the thermal resistance threshold value of the two-phase cold plate liquid cooling heat dissipation mode, when the allowable thermal resistance value of the chip is larger than the thermal resistance threshold value, the heat dissipation requirement of the chip can be met by adopting the two-phase cold plate liquid cooling heat dissipation mode, and when the allowable thermal resistance value of the chip is smaller than the thermal resistance threshold value, the heat dissipation requirement of the chip cannot be met by adopting the two-phase cold plate liquid cooling heat dissipation mode, and the chip needs to adopt the two-phase micro-channel cold plate liquid cooling heat dissipation mode. On the one hand, the method provided by the embodiment of the invention compares the total power consumption of the front N+1 chips with the heat exchange power consumption threshold value, so that the problem that the temperature of each chip on a single board is uneven because the temperature of the cooling liquid is higher and the heat dissipation efficiency is low due to the heat emitted by the front chip when the cooling liquid flows to the tail end pipeline in the single-phase heat exchange mode is avoided because the two-phase heat exchange mode can be adopted to make the cooling liquid generate phase change so as to reduce the temperature of the cooling liquid from the N+1 chips; on the other hand, the allowable thermal resistance value of the chip is compared with the thermal resistance threshold value of the two-phase cold plate liquid cooling heat dissipation mode, so that the chip is determined to adopt the two-phase cold plate liquid cooling heat dissipation mode with lower design cost or the two-phase micro-channel cold plate liquid cooling heat dissipation mode with better heat dissipation capability. Based on the above, the composite liquid cooling heat dissipation scheme is used for dissipating heat of a plurality of chips on the single board, so that the heat dissipation efficiency and the design cost of the plurality of chips on the single board are effectively considered.
As shown in fig. 4a to fig. 4e, the embodiment of the present invention further provides a board, on which a plurality of chips are disposed, and the heat dissipation modes of the chips are determined by applying the heat dissipation method of the chips provided by the embodiment of the present invention, which is described below with reference to fig. 4a to fig. 4 e.
Referring to fig. 4a, in some embodiments, heat dissipation devices corresponding to chips 1 to 5 are all connected in series, wherein the sum of power consumption of chips 1 and 2 is smaller than a heat exchange power consumption threshold, the sum of power consumption of chips 1 to 3 is larger than a heat exchange power consumption threshold, the allowable thermal resistance of chip 1 is larger than a first thermal resistance threshold, the allowable thermal resistance of chip 2 is smaller than a first thermal resistance threshold, the allowable thermal resistance of chips 3 and 4 is larger than a second thermal resistance threshold, and the allowable thermal resistance of chip 5 is smaller than a second thermal resistance threshold, based on which, chip 1 adopts a single-phase cold plate liquid cooling heat dissipation mode, chip 2 adopts a single-phase micro-channel cold plate liquid cooling heat dissipation mode, chip 3 and chip 4 both adopt a two-phase cold plate liquid cooling heat dissipation mode, and cooling liquid sequentially flows through heat dissipation devices corresponding to chips 1 to 5 from a left connector into a pipeline.
Referring to fig. 4b, in some embodiments, heat dissipation devices corresponding to chips 1 to 5 are all connected in series, wherein the sum of power consumption of chips 1 and 2 is smaller than a heat exchange power consumption threshold, the sum of power consumption of chips 1 to 3 is larger than a heat exchange power consumption threshold, the allowable thermal resistance of chips 1 is larger than a first thermal resistance threshold, the allowable thermal resistance of chips 2 is smaller than a first thermal resistance threshold, the allowable thermal resistance of chips 3 to 5 is smaller than a second thermal resistance threshold, based on this, chip 1 adopts a single-phase cold plate liquid cooling heat dissipation mode, chip 2 adopts a single-phase micro-channel cold plate liquid cooling heat dissipation mode, chips 3, 4 and 5 all adopt a two-phase cold plate liquid cooling heat dissipation mode, and a cooling liquid enters a pipeline from a left connector and sequentially flows through the heat dissipation devices corresponding to chips 1 to 5.
Referring to fig. 4c, in some embodiments, the heat dissipation devices corresponding to the chips 1 and 2 are installed based on a single-board structure, and are connected in series with the heat dissipation devices corresponding to the chips 3, 4 and 5, where the sum of the power consumption of the chips 1 and 2 is smaller than a heat exchange power consumption threshold, the sum of the power consumption of the chips 1 to 3 is greater than a heat exchange power consumption threshold, the allowable thermal resistance of the chip 1 is greater than a first thermal resistance threshold, the allowable thermal resistance of the chip 2 is smaller than a first thermal resistance threshold, the allowable thermal resistance of the chips 3 and 4 is greater than a second thermal resistance threshold, the allowable thermal resistance of the chip 5 is smaller than a second thermal resistance threshold, based on which, the chip 1 adopts a single-phase cold plate liquid cooling heat dissipation mode, the chip 2 adopts a single-phase microchannel cold plate liquid cooling heat dissipation mode, the chips 3 and 4 each adopt a two-phase microchannel cold plate liquid cooling heat dissipation mode, and the cooling liquid enters a pipeline from a left connector, and flows through the heat dissipation devices corresponding to the chips 3 to 5 sequentially. In the parallel design, the flow resistance is low when the cooling liquid flows through the chips 1 and 2.
Referring to fig. 4d, in some embodiments, the heat dissipation devices corresponding to the chips 3 and 4 adopt a parallel structure and are connected in series with the heat dissipation devices corresponding to the chips 1, 2 and 5, wherein the sum of the power consumption of the chips 1 and 2 is smaller than a heat exchange power consumption threshold, the sum of the power consumption of the chips 1, 2 and 3 is larger than the heat exchange power consumption threshold, the sum of the power consumption of the chips 1, 2 and 4 is larger than the heat exchange power consumption threshold, the allowable thermal resistance of the chip 1 is larger than a first thermal resistance threshold, the allowable thermal resistance of the chip 2 is smaller than the first thermal resistance threshold, the allowable thermal resistance of the chip 3 and 4 is larger than a second thermal resistance threshold, the allowable thermal resistance of the chip 5 is smaller than the second thermal resistance threshold, based on this, the chip 1 adopts a single-phase cold plate liquid cooling heat dissipation mode, the chip 2 adopts a single-phase micro-channel cold plate liquid cooling heat dissipation mode, the chips 3 and 4 both adopt a two-phase micro-channel cold plate liquid cooling heat dissipation mode, and the cooling liquid enters the pipeline from the left end connector, flows through the heat dissipation devices corresponding to the chips 1 and 2 in turn, flows through the heat dissipation devices corresponding to the chips 3 and 4, and then flows through the corresponding heat dissipation devices to the chips 5. In the parallel design, the flow resistance is low when the cooling liquid flows through the chips 3 and 4.
Referring to fig. 4e, in some embodiments, heat dissipation devices corresponding to chips 1 to 5 are all connected in series, the sum of power consumption of chips 1 to 5 is smaller than a heat exchange power consumption threshold, allowable thermal resistances of chips 2 and 5 are smaller than a first thermal resistance threshold, allowable thermal resistances of chips 1, 3 and 4 are larger than the first thermal resistance threshold, based on this, chips 2 and 5 adopt a single-phase micro-channel cold plate liquid cooling heat dissipation mode, chips 1, 3 and 4 adopt a single-phase cold plate liquid cooling heat dissipation mode, and a cooling liquid enters a pipeline from a left connector and sequentially flows through heat dissipation devices corresponding to chips 1 to 5.
It can be understood that in the embodiment of the invention, the heat exchange mode of the chip is determined according to the connection relation of the heat dissipation devices corresponding to each chip, the power consumption value of each chip and the power consumption threshold value, and then the heat dissipation mode of the chip is determined according to the allowable heat resistance of the chip and the heat resistance threshold value under the corresponding heat dissipation mode, so that different heat dissipation modes are respectively adopted for a plurality of chips on the single board, and the heat dissipation is carried out on the plurality of chips on the single board through the composite liquid cooling heat dissipation scheme, thereby effectively considering the heat dissipation efficiency and the design cost of the plurality of chips on the single board.
It will be understood that fig. 4a to fig. 4e and the related parts of the description are only for illustration, and are not limiting to the embodiments of the present invention, and any modification made by those skilled in the art on the basis of the connection relation of the heat dissipating device, the size relation between the heat exchanging power consumption threshold and the sum of the power consumption of the chip, and the size relation between the allowable thermal resistance of the chip and the corresponding thermal resistance threshold are all within the scope of the present application.
The embodiment of the invention also provides electronic equipment comprising the single board provided by the embodiment of the invention.
As shown in FIG. 5, an embodiment of the present invention also provides a computer device 500.
Specifically, the computer device 500 includes: one or more processors 520 and memory 510, with one processor 520 and memory 510 being illustrated in fig. 5. Processor 520 and memory 510 may be connected by bus 530 or otherwise, as illustrated in FIG. 5 by a bus.
The memory 410 is used as a non-transitory computer readable storage medium for storing non-transitory software programs and non-transitory computer executable programs, such as the chip heat dissipation method in the above-described embodiments of the invention. The processor 420 implements the chip heat dissipation method in the above-described embodiments of the present invention by running a non-transitory software program stored in the memory 410 as well as the program. For example, the above steps S101 to S104 in fig. 1, steps S201 to S203 in fig. 2, and steps S301 to S304 in fig. 3 are performed. Determining allowable thermal resistance values of the chips according to first characteristic parameters of the chips; determining heat exchange modes of all chips, wherein the heat exchange modes comprise a first heat exchange mode and a second heat exchange mode; under the condition that the heat exchange mode is a first heat exchange mode, determining a heat radiation mode of a corresponding chip according to the allowable thermal resistance value and a first thermal resistance threshold value; and under the condition that the heat exchange mode is a second heat exchange mode, determining a heat radiation mode of the corresponding chip according to the allowable heat resistance value and a second heat resistance threshold, wherein the first heat resistance threshold is larger than the second heat resistance threshold. Through confirming the heat exchange mode of the chip, then comparing the magnitude relation between the allowable thermal resistance value of the chip and the preset thermal resistance threshold value under the heat exchange mode, and judging which heat dissipation mode should be adopted by the chip based on the comparison result, thereby selecting a reasonable heat dissipation mode for each chip, and dissipating heat of a plurality of chips on a single board through a composite liquid cooling heat dissipation scheme, so that the design cost of heat dissipation of the chips is reduced on the premise of meeting the heat dissipation requirement.
Memory 510 may include a storage program area that may store an operating system, at least one application program required for functionality, and a storage data area; the storage data area may store data and the like required to perform the chip heat dissipation method in the above-described embodiment of the present invention. In addition, memory 510 may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some implementations, the memory optionally includes memory remotely located relative to the processor, the remote memory being connectable to the computer device through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The non-transitory software programs and programs required to implement the chip heat dissipation method in the embodiments of the present invention described above are stored in the memory 510, and when executed by one or more processors, perform the chip heat dissipation method in the embodiments of the present invention described above.
In addition, the embodiment of the present invention also provides a computer-readable storage medium storing a computer-executable program that is executed by one or more control processors, for example, executing steps S101 to S104 in fig. 1, steps S201 to S203 in fig. 2, and steps S301 to S304 in fig. 3. Determining allowable thermal resistance values of the chips according to first characteristic parameters of the chips; determining heat exchange modes of all chips, wherein the heat exchange modes comprise a first heat exchange mode and a second heat exchange mode; under the condition that the heat exchange mode is a first heat exchange mode, determining a heat radiation mode of a corresponding chip according to the allowable thermal resistance value and a first thermal resistance threshold value; and under the condition that the heat exchange mode is a second heat exchange mode, determining a heat radiation mode of the corresponding chip according to the allowable heat resistance value and a second heat resistance threshold, wherein the first heat resistance threshold is larger than the second heat resistance threshold. Through confirming the heat exchange mode of the chip, the magnitude relation between the allowable thermal resistance value of the chip and the preset thermal resistance threshold value under the heat exchange mode is compared, and based on the comparison result, which heat dissipation mode should be adopted by the chip is judged, so that a reasonable heat dissipation mode is selected for each chip, and the design cost of heat dissipation of the chip is reduced on the premise of meeting the heat dissipation requirement.
Those of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable programs, data structures, program modules or other data, as known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable programs, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.
While the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit and scope of the present invention, and these equivalent modifications or substitutions are included in the scope of the present invention as defined in the appended claims.

Claims (15)

1. A method of heat dissipation for a chip, the method comprising:
determining allowable thermal resistance values of the chips according to first characteristic parameters of the chips, wherein the chips are integrated on the same single board;
determining a heat exchange mode of each chip, wherein the heat exchange mode comprises a first heat exchange mode and a second heat exchange mode;
under the condition that the heat exchange mode is the first heat exchange mode, determining a heat radiation mode corresponding to the chip according to the allowable thermal resistance value and a first thermal resistance threshold value;
and under the condition that the heat exchange mode is the second heat exchange mode, determining a heat radiation mode corresponding to the chip according to the allowable heat resistance value and a second heat resistance threshold, wherein the first heat resistance threshold is larger than the second heat resistance threshold.
2. The method of claim 1, wherein the first heat exchange mode is a single-phase heat exchange mode and the second heat exchange mode is a two-phase heat exchange mode.
3. The method of claim 1, wherein the first characteristic parameter comprises: chip temperature requirements, single board liquid inlet temperature, chip power consumption value, interface thermal resistance between chip and single board, and chip crust thermal resistance.
4. The method of claim 1, wherein determining a heat dissipation mode corresponding to the chip based on the allowable thermal resistance value and a first thermal resistance threshold value if the heat exchange mode is the first heat exchange mode comprises:
when the allowable thermal resistance value is larger than the first thermal resistance threshold value, determining that a corresponding chip adopts a first heat dissipation mode;
and when the allowable thermal resistance value is smaller than the first thermal resistance threshold value, determining that the corresponding chip adopts a second heat dissipation mode.
5. The method of claim 4, wherein the first heat dissipation mode is a single-phase cold plate liquid-cooled heat dissipation mode and the second heat dissipation mode is a single-phase microchannel cold plate liquid-cooled heat dissipation mode.
6. The method of claim 1, wherein the determining the heat dissipation mode corresponding to the chip according to the allowable thermal resistance value and a second thermal resistance threshold when the heat exchange mode is the second heat exchange mode, wherein the first thermal resistance threshold is greater than the second thermal resistance threshold comprises:
when the allowable thermal resistance value is larger than the second thermal resistance threshold value, determining that a third heat dissipation mode is adopted by the corresponding chip;
and when the allowable thermal resistance value is smaller than the second thermal resistance threshold value, determining that the corresponding chip adopts a fourth heat radiation mode.
7. The method of claim 6, wherein the third heat dissipation mode is a two-phase cold plate liquid cooled heat dissipation mode and the fourth heat dissipation mode is a two-phase microchannel cold plate liquid cooled heat dissipation mode.
8. The method of claim 1, wherein said determining a heat exchange pattern for each of said chips comprises:
acquiring a second characteristic parameter;
determining a heat exchange power consumption threshold according to the second characteristic parameter;
and determining the heat exchange modes of the chips according to the heat exchange power consumption threshold.
9. The method of claim 8, wherein the second characteristic parameter comprises: latent heat of physical properties of the working medium, total power consumption of the single plate, dryness requirement, supercooling degree of liquid inlet of the single plate and specific heat capacity of physical properties of the working medium.
10. The method of claim 9, wherein said determining the heat exchange power consumption threshold from the second characteristic parameter comprises:
determining flow according to the physical latent heat of the working medium, the total power consumption of the single board and the dryness requirement;
and determining the heat exchange power consumption threshold according to the flow, the supercooling degree of the single plate liquid inlet and the specific heat capacity of the physical property of the working medium.
11. The method of claim 8, wherein the first characteristic parameter comprises power consumption values of a plurality of chips, and wherein determining a heat exchange pattern of the plurality of chips based on the heat exchange power consumption threshold comprises:
determining chip ordering according to the connection relation of the heat dissipation devices corresponding to the chips;
calculating a first power consumption sum of the first N chips and a second power consumption sum of the first N+1 chips according to the chip ordering and the power consumption value of the chips, wherein N is a positive integer greater than 0;
comparing the first power consumption sum and the second power consumption sum with the heat exchange power consumption threshold value respectively;
when the first power consumption sum is smaller than the heat exchange power consumption threshold and the second power consumption sum is larger than the heat exchange power consumption threshold, determining that the heat exchange mode of the first N chips is a first heat exchange mode, and determining that the heat exchange mode of the chips positioned behind the Nth chip in the chip sorting is a second heat exchange mode.
12. A board, wherein a plurality of chips are provided on the board, and a heat dissipation mode of each of the chips is determined by applying the chip heat dissipation method according to any one of claims 1 to 11.
13. An electronic device comprising the single board of claim 12.
14. A computer device, comprising: memory, a processor and a computer program stored on the memory and executable on the processor, characterized in that the processor implements the chip heat dissipation method according to any one of claims 1 to 11 when executing the computer program.
15. A computer-readable storage medium storing a computer-executable program for causing a computer to execute the chip heat dissipation method according to any one of claims 1 to 11.
CN202210896127.0A 2022-07-27 2022-07-27 Chip heat dissipation method, single board, electronic device, computer device and storage medium Pending CN117435009A (en)

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US9307674B2 (en) * 2011-05-06 2016-04-05 International Business Machines Corporation Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component
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