CN117425327A - Component mounting apparatus and component mounting method - Google Patents

Abstract

The invention provides a component mounting device and a component mounting method capable of mounting components on a substrate with good precision. The component mounting device (1) is provided with a mounting head (17) for mounting the component (3) on the substrate (2), a head moving device (14) for moving the mounting head (17), and a control device (C1) for controlling the driving of the head moving device (14), wherein the component (3) comprises a first component (3A), the first component (3A) comprises a planar part (50) and a protruding part (56) protruding downwards at a position different from the planar part (50), and the mounting head (17) comprises a holding part (71) for holding the planar part (50) of the first component (3A) and a press-in part (72) for pressing the protruding part (56) of the first component (3A) downwards and inserting the protruding part into an insertion hole (2B) of the substrate (2).

Description

Component mounting apparatus and component mounting method

Technical Field

The present invention relates to a component mounting apparatus and a component mounting method.

Background

Conventionally, a component mounting apparatus is known in which an electronic component such as a radial component or an axial component is held by a mounting head and mounted on a substrate (for example, refer to patent document 1).

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open publication No. 2019-50340

Disclosure of Invention

Problems to be solved by the invention

However, the present invention is not limited to the radial member and the axial member, and other members having special shapes may be the mounting targets, and it is required that even such members can be mounted on the substrate with high accuracy.

Accordingly, an object of the present invention is to solve the above-described conventional problems and to provide a component mounting apparatus and a component mounting method capable of mounting a component on a substrate with high accuracy.

Means for solving the problems

In order to achieve the above object, a component mounting apparatus of the present invention includes: a mounting head that mounts a component to a substrate; a head moving device that moves the mounting head; and a control device that controls driving of the head moving device, the member including a first member having a planar portion and a protruding portion protruding downward at a position different from the planar portion, the mounting head having: a holding portion that holds the planar portion of the first member; and a press-fit portion that presses the protruding portion of the first member downward and inserts the protruding portion into the insertion hole of the substrate.

In addition, the component mounting method of the present invention includes the steps of: holding the planar portion of the first member with a holding portion of the mounting head; and a protruding portion of the first member protruding downward at a position different from the planar portion is pressed downward by a press-fit portion of the mounting head, and is inserted into the insertion hole of the substrate.

Effects of the invention

According to the present invention, components can be mounted on a substrate with high accuracy.

Drawings

Fig. 1 is a schematic plan view of a component mounting apparatus according to an embodiment.

Fig. 2 is a schematic front view of the component mounting apparatus of the embodiment.

Fig. 3 is a perspective view of a first component of the embodiment.

Fig. 4A is a schematic side view (state before contact) of the first member of the embodiment.

Fig. 4B is a schematic side view (state after contact) of the first member of the embodiment.

Fig. 5 is a perspective view of the mounting head of the embodiment.

Fig. 6 is a perspective view of the mounting head of the embodiment.

Fig. 7 is a perspective view of the mounting head of the embodiment.

Fig. 8 is a perspective view showing a part of the mounting head of the embodiment in an enlarged manner.

Fig. 9A is a perspective view showing a vertical section of the mounting head of the embodiment.

Fig. 9B is a perspective view showing a longitudinal section of the mounting head of the embodiment.

Fig. 10 is a flowchart showing an example of a method of mounting a first component on a substrate using the component mounting apparatus according to the embodiment.

Fig. 11A is a schematic front view for explaining the operation of the flowchart shown in fig. 10.

Fig. 11B is a schematic front view for explaining the operation of the flowchart shown in fig. 10.

Fig. 11C is a schematic front view for explaining the operation of the flowchart shown in fig. 10.

Fig. 11D is a schematic front view for explaining the operation of the flowchart shown in fig. 10.

Fig. 11E is a schematic front view for explaining the operation of the flowchart shown in fig. 10.

Fig. 11F is a schematic front view for explaining the operation of the flowchart shown in fig. 10.

Fig. 11G is a schematic front view for explaining the operation of the flowchart shown in fig. 10.

Fig. 11H is a schematic front view for explaining the operation of the flowchart shown in fig. 10.

Fig. 12A is a perspective view (state before contact) for explaining an operation when the press-fitting portion of the embodiment is in contact with the first member.

Fig. 12B is a perspective view (state after contact) for explaining an operation when the press-fitting portion of the embodiment is in contact with the first member.

Fig. 13A is a schematic front view (state before contact) for explaining an operation of mounting a second component on a substrate using the component mounting apparatus of the embodiment.

Fig. 13B is a schematic front view (state after contact) for explaining an operation of mounting the second component on the substrate using the component mounting apparatus of the embodiment.

Description of the reference numerals

1 component mounting apparatus

2 substrate

2B insertion hole

3 parts

3A first part

3B second part

14-head moving device

17 mounting head

50 plane part

56 projection part

71 holding portion

72 press-in portion

And C1 control device.

Detailed Description

According to a first aspect of the present invention, there is provided a component mounting apparatus including: a mounting head that mounts a component to a substrate; a head moving device that moves the mounting head; and a control device that controls driving of the head moving device, the member including a first member having a planar portion and a protruding portion protruding downward at a position different from the planar portion, the mounting head having: a holding portion that holds the planar portion of the first member; and a press-fit portion that presses the protruding portion of the first member downward and inserts the protruding portion into the insertion hole of the substrate.

According to a second aspect of the present invention, there is provided a component mounting apparatus, on the basis of the component mounting apparatus described in the first aspect, the control apparatus performing: a first operation of moving the mounting head toward a mounting position in a state where the first member is held by the holding portion of the mounting head; and a second operation of pressing the protruding portion of the first member downward by the pressing portion to be inserted into the insertion hole of the substrate in a state where the first member held by the holding portion is pressed against the substrate after the first operation.

According to a third aspect of the present invention, there is provided the component mounting device according to the first or second aspect, wherein the holding portion is movable up and down relative to the press-in portion.

According to a fourth aspect of the present invention, in addition to the component mounting apparatus according to the third aspect, there is provided a component mounting apparatus in which the mounting head is movable between a first height position at which the holding portion holds the first component and the press-in portion is separated from the first component, and a second height position lower than the first height position, in which the holding portion is raised relative to the press-in portion in a state where the first component held by the holding portion is in contact with the substrate, and in which the press-in portion is in contact with the first component.

According to a fifth aspect of the present invention, there is provided a component mounting apparatus, on the basis of the component mounting apparatus of the fourth aspect, the control apparatus performing: a third operation of lowering the mounting head toward the first member disposed at a predetermined position to bring the holding portion of the mounting head into contact with the first member; and a fourth operation of lowering the mounting head further, and raising the holding portion relative to the press-fit portion to bring the press-fit portion into contact with the first member.

According to a sixth aspect of the present invention, there is provided the component mounting device according to any one of the first to fifth aspects, wherein the first component further has a convex portion protruding upward on a back side of the protruding portion, and a guide groove for guiding the convex portion inward is provided at a lower end of the press-in portion.

According to a seventh aspect of the present invention, there is provided the component mounting apparatus as defined in the second aspect, wherein the mounting head further includes a head main body portion to which the holding portion is mounted so as to be movable up and down.

According to an eighth aspect of the present invention, there is provided the component mounting device according to the seventh aspect, wherein the press-fit portion is integrally formed with the head main body portion.

According to a ninth aspect of the present invention, there is provided the component mounting device according to the seventh aspect, wherein the press-fit portion is detachable from the head main body portion.

According to a tenth aspect of the present invention, there is provided the component mounting apparatus according to the second aspect, wherein the mounting head further includes a biasing member for biasing the holding portion downward.

According to an eleventh aspect of the present invention, there is provided the component mounting device as defined in the tenth aspect, wherein an adsorption hole for adsorbing the planar portion of the first component is provided at a lower end of the holding portion, wherein the mounting head has a negative pressure flow path communicating with the adsorption hole, and wherein the biasing member is provided in the negative pressure flow path.

According to a twelfth aspect of the present invention, there is provided the component mounting device according to any one of the first to eleventh aspects, wherein the component includes a second component different from the first component, and the control device activates the press-in operation of the press-in portion when the first component is mounted, and deactivates the press-in operation of the press-in portion when the second component is mounted.

According to a thirteenth aspect of the present invention, there is provided the component mounting apparatus as defined in the twelfth aspect, wherein the second component is a radial component.

According to a fourteenth aspect of the present invention, there is provided the component mounting device as defined in any one of the first to thirteenth aspects, wherein the holding portion is provided at a position offset in a first direction with respect to a center axis of the mounting head extending in a vertical direction, and the press-in portion is provided at a position offset in a second direction opposite to the first direction with respect to the center axis.

According to a fifteenth aspect of the present invention, there is provided the component mounting device according to any one of the first to fourteenth aspects, wherein the first component is a thermal fuse that fuses in response to an increase in temperature, and has a fusing portion between the planar portion and the protruding portion.

According to a sixteenth aspect of the present invention, there is provided a component mounting method comprising the steps of: holding the planar portion of the first member with a holding portion of the mounting head; and pressing a protruding portion of the first member protruding downward at a position different from the planar portion downward by a press-fit portion of the mounting head, and inserting the protruding portion into an insertion hole of a substrate.

Exemplary embodiments of a component mounting apparatus and a component mounting method according to the present invention are described below with reference to the drawings. The present invention is not limited to the specific configurations of the following embodiments, and configurations based on the same technical ideas are included in the present invention.

(embodiment)

First, the overall configuration of the component mounting apparatus 1 in the embodiment will be described with reference to fig. 1 and 2. The component mounting device 1 has a function of mounting the component 3 on the substrate 2. Fig. 1 is a plan view of the component mounting apparatus 1, and fig. 2 is a front view of the component mounting apparatus 1. Hereinafter, the horizontal conveyance direction of the substrate 2 is defined as an X direction, a direction orthogonal to the X direction in a horizontal plane is defined as a Y direction, and a direction perpendicular to the XY plane is defined as a Z direction.

As shown in fig. 1 and 2, the component mounting apparatus 1 includes a substrate transport mechanism 5, a component supply unit 6, a mounting head 17, a clamping unit 20, and a control device C1.

The substrate conveying mechanism 5 conveys and positions the substrate 2 at a predetermined operation position. The substrate conveying mechanism 5 is, for example, a pair of conveying conveyors extending in the X direction. The substrate conveying mechanism 5 is provided on the upper surface of the base 4.

The component supply unit 6 is a unit that supplies the components 3 mounted on the substrate 2. The component supply units 6 are provided, for example, at positions on both sides of the substrate transport mechanism 5 in the Y direction.

The component feeder 6 on the front side (lower side of the drawing sheet) is provided with a plurality of tape feeders 7 arranged in parallel in the X direction, for example. In fig. 2, the tape feeder 7 is disposed above the carriage 8. The tape feeder 7 intermittently feeds the carrier tape 9 holding the plurality of components 3, thereby supplying the components 3 to a predetermined component supply position. Examples of the component 3 supplied by the tape feeder 7 include a radial component and a chip component.

In fig. 1, a plurality of tape feeders 7 and tray feeders 10 are arranged in parallel in the X direction in the component supply section 6 on the rear side (upper side of the drawing sheet). In fig. 2, the tray feeder 10 includes a tray housing portion 12 and a tray holding portion 13. The tray housing 12 houses a plurality of trays 11 held by a tray (not shown). The tray holding portion 13 holds the tray 11 and is provided so as to be movable in the horizontal direction and the up-down direction.

A plurality of components 3 are stored in the tray 11. The tray feeder 10 has a function of pulling out the tray 11 from the tray housing portion 12 by the tray holding portion 13 and supplying the tray to a take-out position where the component 3 is taken out by a mounting head 17 described later. The component 3 supplied by the tray feeder 10 includes a first component 3A (fig. 3, 4A, and 4B) which is a thermal fuse to be described later.

The mounting head 17 is a head for taking out the component 3 supplied from the component supply unit 6 and mounting the component on the substrate 2. The mounting head 17 is configured to be horizontally movable above the substrate 2 by driving the head moving device 14 by the control device C1. The mounting head 17 inserts the lead wire into an insertion hole formed in the substrate 2 during mounting of the component 3 having the lead wire, such as a radial component.

The head moving device 14 has a Y-axis beam 14a and an X-axis beam 14b. As shown in fig. 1, the Y-axis beam 14a is provided at an end portion of the base 4 in the X direction. A plurality of X-axis beams 14b are provided on the Y-axis beam 14a so as to be movable in the Y-direction. A plate-like plate member 16 is slidably mounted to each X-axis beam 14b in the X-direction. A mounting head 17 is mounted on the plate member 16. The mounting head 17 can be moved in the XY directions by driving the Y-axis beam 14a and the X-axis beam 14b. The mounting head 17 is also configured to be movable up and down with respect to the plate member 16, and is configured to be movable up and down by driving of a head up and down movement device (not shown) by the control device C1.

The plate member 16 is provided with a first recognition camera 18 for directing the imaging field downward. The first recognition camera 18 photographs a substrate mark (not shown) or the like formed on the substrate 2 positioned at the working position. The base 4 is provided with a second recognition camera 19 for directing the imaging field upward between the substrate transport mechanism 5 and the component supply unit 6. The second recognition camera 19 photographs the component 3 held by the mounting head 17 moving above it from below.

The clamping unit 20 is a unit for clamping the lead wire protruding downward from the substrate 2 by inserting the head 17 into the insertion hole during the mounting of the component 3 having the lead wire. The component mounting apparatus 1 may be provided without the clamping unit 20.

Next, the structure of the first member 3A supplied by the tray feeder 10 will be described with reference to fig. 3, 4A, and 4B. Fig. 3 is a perspective view of the first member 3A, and fig. 4A and 4B are schematic side views of the first member 3A, respectively. Fig. 4A and 4B each show a state in which the suction nozzle 70 of the mounting head 17 holds the first component 3A, fig. 4A shows a state before the first component 3A contacts the substrate 2, and fig. 4B shows a state after the first component 3A contacts the substrate 2.

The first member 3A shown in fig. 3 is a thermal fuse that functions so as to fuse when the temperature reaches a predetermined temperature or higher. The first member 3A is made of a conductive material (for example, metal), and is mounted on the substrate 2 for use.

The first member 3A is manufactured by, for example, bending and punching a sheet of metal. The first member 3A includes a planar portion 50, a fuse portion 52, a convex portion 54, a protruding portion 56, and a support portion 58.

The planar portion 50 is a portion having a flat shape. The planar portion 50 is held by the suction nozzle 70 of the mounting head 17 and is mounted on the mounting surface 2A of the substrate 2 shown in fig. 4A and 4B. The planar portion 50 has an upper surface 50A and a lower surface 50B (fig. 4A and 4B). The upper surface 50A is a held surface that is sucked and held by the suction nozzle 70 of the mounting head 17 (see arrow A1 in fig. 3). The lower surface 50B is a mounted surface to be mounted on the mounting surface 2A of the substrate 2 by soldering or the like (see arrow A2 in fig. 4A).

The fusing part 52 fuses according to the temperature rise of the first member 3A. The fusing part 52 has a shape curved in an arc shape from an end of the planar part 50. As shown in fig. 3, a through hole 60 is formed from a middle portion of the fusing part 52, and the through hole 60 is continuously formed to the supporting part 58. The protruding portion 56 extending downward from the protruding portion 54 is accommodated in the through hole 60.

The convex portion 54 is a convex portion formed at a portion extending upward from the support portion 58 and folded back downward. A protruding portion 56 is connected to the tip end side of the protruding portion 54. The protruding portion 56 protrudes downward from the protruding portion 54. As shown in fig. 4A, the protruding portion 56 extends downward from the lower surface 50B (see the broken line A3 in fig. 4A) of the planar portion 50, terminates, and is inserted into the insertion hole 2B of the substrate 2 (see arrow A4). As shown in fig. 4B, the protruding portion 56 is attached to the substrate 2 by brazing or the like in a state of being inserted into the insertion hole 2B of the substrate 2.

The support portion 58 is a portion that supports the protruding portion 54 and the protruding portion 56. The support portion 58 is provided at a position facing the planar portion 50, and the planar portion 50 and the support portion 58 are disposed at a distance in the horizontal direction (see arrow A5 shown in fig. 3). The fusing portion 52 is disposed between the planar portion 50 and the supporting portion 58.

In the contact state shown in fig. 4B, the planar portion 50 and the protruding portion 56 are both attached to the substrate 2, and the first member 3A is configured to flow electric power. When the temperature of the first member 3A increases when the electric power flows to the first member 3A, and when the temperature of the first member 3A reaches a predetermined temperature or higher, the fusing part 52 fuses to interrupt the current.

Here, in order to accurately mount the first member 3A on the substrate 2, the protruding portion 56 of the first member 3A needs to be accurately inserted into the insertion hole 2B of the substrate 2. On the other hand, the protruding portion 56 is located at a position separated from the flat portion 50 held by the suction nozzle 70 of the mounting head 17 in the lateral direction (horizontal direction), and the protruding portion 56 cannot be strongly pressed downward only by pressing the flat portion 50 against the substrate 2 by the suction nozzle 70. Therefore, there is a possibility that the protruding portion 56 is not normally inserted into the insertion hole 2B of the substrate 2 and the mounting of the first member 3A fails.

Therefore, as shown in fig. 4A and 4B, the mounting head 17 of the present embodiment is provided with a press-fit portion 72 for pressing the protruding portion 56 of the first member 3A downward, in addition to the holding portion 71 for holding the planar portion 50 of the first member 3A. By forcibly pressing the protruding portion 56 downward by the press-fitting portion 72 (see arrow A6 in fig. 4B), the protruding portion 56 can be inserted into the insertion hole 2B of the substrate 2 with high accuracy, and the component mounting accuracy can be improved.

Next, a detailed configuration of the mounting head 17 of the present embodiment will be described with reference to fig. 5 to 8. Fig. 5 to 7 are perspective views of the mounting head 17 from different angles, and fig. 8 is a perspective view of a part of the mounting head 17 enlarged. Fig. 5 and 6 show a state in which the mounting head 17 holds the first member 3A, and fig. 7 and 8 show a state in which the first member 3A is not held.

As shown in fig. 5 to 8, the mounting head 17 includes: a suction nozzle 70 having a holding portion 71; a head body portion 74 having a press-fit portion 72; a suction nozzle holding plate 76; a head mounting portion 78.

The holding portion 71 is a portion having a function of holding the first component 3A, and is provided at the lower end portion of the suction nozzle 70. As shown in fig. 7 and 8, the holding portion 71 has a suction hole 73 at a lower end portion, and the first member 3A is sucked and held by a negative pressure supplied to the suction hole 73.

The press-fitting portion 72 has a function of pressing the protruding portion 56 of the first component 3A downward, and has a shape protruding downward like the suction nozzle 70. The holding portion 71 and the press-fitting portion 72 are provided at positions separated in the horizontal direction, and are engaged with different portions of the first member 3A independently.

As shown in fig. 7 and 8, the press-fitting portion 72 of the present embodiment includes a pair of claw portions 75 protruding downward. The pair of claw portions 75 are provided at a distance from each other, and a guide groove 77 recessed upward and a pressing surface 79 (fig. 8) are provided between the claw portions 75.

The guide groove 77 is a groove portion (concave portion) for guiding the convex portion 54 of the first member 3A inward. The guide groove 77 guides the protruding portion 54 of the first member 3A inward, so that the relative rotational position of the mounting head 17 having the press-fitting portion 72 and the first member 3A having the protruding portion 54 can be made nearly constant. In order to improve the guiding function of the guiding groove 77, the inner side walls of the pair of claw portions 75 have a tapered shape inclined inward toward the upper side. The protruding portion 54 accommodated in the guide groove 77 contacts the pressing surface 79.

The pressing surface 79 is a surface that contacts the protruding portion 54 of the first member 3A from above and can press the protruding portion 54 and the protruding portion 56 downward. The pressing surface 79 constitutes the guide groove 77 and is provided at a position recessed upward from the lower end portion of the claw portion 75.

The head main body 74 is a block-shaped member that supports the suction nozzle 70 and the press-fitting portion 72. The head main body 74 of the present embodiment holds the suction nozzle 70 in a vertically movable state. Fig. 5 to 8 illustrate a state (default state) in which the suction nozzle 70 protrudes downward. In the present embodiment, the head main body 74 is integrally formed with the press-fitting portion 72, and the press-fitting portion 72 does not have a function of moving relatively to the head main body 74.

The nozzle holding plate 76 is a plate-like member for attaching and holding the nozzle 70 to the head main body 74 in a vertically movable state. The suction nozzle 70 is inserted in a vertically movable state in the center of the suction nozzle holding plate 76. As shown in fig. 6 and 7, two screws 80 are inserted into the nozzle holding plate 76, and the screws 80 are screwed into the head main body 74, whereby the nozzle holding plate 76 is fixed to the head main body 74.

The head mounting portion 78 is a portion for mounting the mounting head 17 to another block (not shown). The other block is attached to the plate member 16 shown in fig. 1, 2, and the like, and functions as an integral attachment head together with the attachment head 17.

The head mounting portion 78 has a flange portion 82, an upper protruding portion 84, and a negative pressure connection member 86.

The flange portion 82 is a portion having a shape protruding in the horizontal direction. The flange 82 functions as a background when the second recognition camera 19 shown in fig. 1 is used to recognize the component.

The upper protruding portion 84 is a substantially cylindrical portion protruding upward from the central position of the flange portion 82, and is attached to the other block. As shown in fig. 5 and 6, the negative pressure connection member 86 is inserted from above into the upper protruding portion 84. The negative pressure connection member 86 is a connection member for supplying negative pressure to the suction hole 73 of the suction nozzle 70, and a connection opening 88 is provided at an upper end of the negative pressure connection member 86. When the head mounting portion 78 is mounted on another block, the connection opening 88 is connected to a suction source, not shown, and negative pressure can be supplied to the suction hole 73 of the holding portion 71. The control device C1 controls the opening and closing of a valve, not shown, to switch between supply and stop of the negative pressure to the suction hole 73.

Fig. 9A and 9B are perspective views showing a vertical section of the mounting head 17. Fig. 9A shows a protruding state (default state) in which the suction nozzle 70 protrudes downward, and fig. 9B shows a retracted state (operating state) in which the suction nozzle 70 is retracted upward.

As shown in fig. 9A and 9B, a negative pressure flow path 90 for supplying negative pressure to the suction holes 73 is provided inside the mounting head 17. The negative pressure flow path 90 is a flow path that extends continuously from the connection opening 88 to the suction hole 73, and extends from the upstream side to the inside of the negative pressure connection member 86, the head main body 74, and the suction nozzle 70 in this order. In fig. 9A, the direction of negative pressure acting on the negative pressure flow path 90 is indicated by an arrow.

The suction nozzle 70 has an enlarged diameter portion 92 as an upper end portion in addition to the holding portion 71 as a lower end portion. The enlarged diameter portion 92 is a portion of the suction nozzle 70 that protrudes in a horizontal direction in a manner opposed to the holding portion 71, and is disposed in the head main body portion 74 in a state of preventing the detachment. The expanded portion 92 is disposed in an arrangement space 94 that constitutes a part of the negative pressure flow path 90.

A biasing member 96 is also disposed in the disposition space 94. The urging member 96 is a member that contacts the enlarged diameter portion 92 of the suction nozzle 70 from above and urges the suction nozzle 70 downward. The urging member 96 of the present embodiment is a spring. The urging member 96 applies a downward urging force F1 to the suction nozzle 70. By applying the force F1 to the suction nozzle 70, a protruding position (see fig. 9A) where the suction nozzle 70 protrudes downward with respect to the head main body 74 becomes a default position.

As shown in fig. 9B, when an upward pressing force F2 opposite to the urging force F1 acts on the suction nozzle 70, the urging member 96 contracts and the suction nozzle 70 can move to the retracted position retracted upward.

According to the configuration shown in fig. 9A and 9B, the suction nozzle 70 can move up and down relative to the head main body 74, and thus various operations can be performed by integrally moving the mounting head 17 up and down. Specifically, by lowering the mounting head 17, the operation of bringing the holding portion 71 into contact with the first member 3A to hold the first member 3A, the operation of pressing the first member 3A held by the holding portion 71 against the substrate 2, and the operation of bringing the press-in portion 72 into contact with the protruding portion 56 of the first member 3A and pressing it downward can be performed, respectively.

As shown in fig. 9B, the suction nozzle 70 and the press-fitting portion 72 are provided at positions symmetrical with respect to a central axis Ax of the mounting head 17 extending in the up-down direction. Specifically, the suction nozzle 70 is disposed at a position offset from the central axis Ax in a first direction D1 along the horizontal direction, and the press-fitting portion 72 is disposed at a position offset from the central axis Ax in a second direction D2 along the horizontal direction opposite to the first direction D1. Accordingly, the suction nozzle 70 and the press-fitting portion 72 are provided at different positions, but can be arranged in a well-balanced manner so as not to be a shape in which the horizontal dimension of the mounting head 17 is biased in one direction about the central axis Ax, contributing to downsizing of the mounting head 17.

An example of the operation of mounting the first member 3A on the substrate 2 using the mounting head 17 having the above-described configuration will be described with reference to fig. 10, 11A to 11H, and 12A and 12B. Fig. 10 is a flowchart relating to an example of the operation of the mounting head 17, and fig. 11A to 11H are schematic front views for explaining the operation of the flowchart shown in fig. 10. Fig. 12A and 12B are perspective views for explaining the operation when the press-fitting portion 72 of the mounting head 17 contacts the first member 3A.

Each process of the flowchart shown in fig. 10 is executed by the control device C1, for example.

First, the control device C1 moves the mounting head 17 upward of the tray 11 (S1). Specifically, as shown in fig. 11A, the mounting head 17 is moved in the horizontal direction (see arrow B1) and is disposed above the tray 11. A plurality of first members 3A are mounted on the tray 11, and one first member 3A to be mounted is illustrated in fig. 11A to 11H. The tray 11 is schematically illustrated, and the plurality of first members 3A are disposed in a socket or the like, not shown, and the positions and orientations thereof are controlled to a certain extent.

The storage unit of the component mounting apparatus 1 stores in advance positional information of each of the plurality of first components 3A placed on the tray 11. The control device C1 moves the mounting head 17 in the horizontal direction to a position where the first member 3A as the mounting target can be suctioned and held, based on the positional information stored in the storage unit.

As shown in fig. 11A, the mounting head 17 is moved in the horizontal direction so that the holding portion 71 of the mounting head 17 is located directly above the planar portion 50 of the first member 3A, and the press-in portion 72 of the mounting head 17 is located directly above the convex portion 54 and the protruding portion 56 of the first member 3A.

The control device C1 lowers the mounting head 17 to bring the holding portion 71 into contact with the first member 3A (S2). Specifically, as shown in fig. 11B, the mounting head 17 is integrally lowered (arrow B2), and the lower end portion of the holding portion 71 of the mounting head 17 is brought into contact with the planar portion 50 of the first member 3A. At this time, no negative pressure is supplied to the suction holes 73 of the holding portion 71, and the holding portion 71 does not suction-hold the first member 3A.

As shown in fig. 11B, when the holding portion 71 comes into contact with the planar portion 50, the press-fit portion 72 is positioned above the convex portion 54 and is not yet engaged with the first member 3A. In this way, the lower end positions of the holding portion 71 and the press-in portion 72 at the default position are set in advance so that the holding portion 71 contacts the first member 3A earlier than the press-in portion 72.

The control device C1 further lowers the mounting head 17 to bring the press-fit portion 72 into contact with the first member 3A (S3). Specifically, the mounting head 17 is integrally lowered from the state shown in fig. 11B, and the press-fit portion 72 of the mounting head 17 is brought into contact with the convex portion 54 of the first member 3A as shown in fig. 11C (see arrow B3). Since the first member 3A is pressed against the tray 11, the holding portion 71 that contacts the first member 3A is raised relative to the press-in portion 72 and the head main body portion 74 when the mounting head 17 is integrally lowered (see arrow C1). In this way, the press-fitting portion 72 can be brought into contact with the first member 3A while maintaining the state in which the first member 3A is pressed downward.

The operation when the press-fitting portion 72 is in contact with the first member 3A will be described with reference to fig. 12A and 12B. Fig. 12A shows a state before the press-in portion 72 is in contact with the first member 3A, and fig. 12B shows a state after the press-in portion 72 is in contact with the first member 3A.

As shown in fig. 12A, the horizontal position of the mounting head 17 is set so that the guide groove 77 is located directly above the convex portion 54 of the first member 3A. When the mounting head 17 is integrally lowered from the state shown in fig. 12A, the press-fit portion 72 provided in the mounting head 17 is lowered together with the mounting head 17 as shown in fig. 12B, and is brought into contact with the convex portion 54 of the member 3 (see arrow D). At this time, the protruding portion 54 is guided to the inside of the guide groove 77, and the relative rotational position of the mounting head 17 and the first member 3A is adjusted. Even when the relative positional displacement between the mounting head 17 and the first member 3A occurs, the positional displacement can be eliminated, and thereafter, the protruding portion 56 can be pressed accurately when the pressing portion 72 presses the protruding portion 56 downward.

The control device C1 turns on the suction performed by the holding unit 71 (S4). Specifically, by supplying negative pressure to the suction holes 73 of the holding portion 71, the holding portion 71 suctions and holds the planar portion 50 of the first member 3A. Since the relative posture of the mounting head 17 and the first member 3A is corrected in step S3, the first member 3A can be held in a desired orientation in step S4.

The control device C1 lifts the mounting head 17 (S5). Specifically, as shown in fig. 11D, the mounting head 17 is integrally raised (arrow B4) while the holding portion 71 is holding the first member 3A by suction. Thereby, the first member 3A is taken out of the tray 11. Since the biasing force F1 (see fig. 9A and 9B) of the biasing member 96 acts, the suction nozzle 70 returns to the protruding position (arrow C2) protruding downward with respect to the head main body 74.

The first component 3A held by the suction nozzle 70 also relatively descends, and therefore the convex portion 54 of the first component 3A is separated from the press-fitting portion 72 of the mounting head 17 to release contact. Since the holding portion 71 holds the first member 3A by suction, the relative positional relationship between the mounting head 17 and the first member 3A in a plan view does not change.

The control device C1 moves the mounting head 17 upward of the substrate 2 (S6). Specifically, as shown in fig. 11E, the mounting head 17 is moved in the horizontal direction (see arrow B5) and is disposed above the substrate 2 (mounting position). The mounting head 17 is moved in the horizontal direction so that the protruding portion 56 of the first member 3A and the press-fit portion 72 of the mounting head 17 are positioned directly above the insertion hole 2B of the substrate 2.

The control device C1 lowers the mounting head 17 to bring the first member 3A into contact with the substrate 2 (S7). Specifically, as shown in fig. 11F, the mounting head 17 is integrally lowered (arrow B6), and the planar portion 50 of the first member 3A held by the holding portion 71 of the mounting head 17 is brought into contact with the mounting surface 2A of the substrate 2. At this time, the protruding portion 56 of the first member 3A starts to be inserted into the insertion hole 2B of the substrate 2.

The control device C1 further lowers the mounting head 17, and presses the first member 3A by the press-fitting portion 72 (S8). Specifically, the mounting head 17 is further integrally lowered from the state shown in fig. 11F, and the press-fit portion 72 of the mounting head 17 is brought into contact with the convex portion 54 of the first member 3A as shown in fig. 11G (arrow B7). As shown in fig. 12B, the pressing surface 79 of the press-fitting portion 72 is brought into contact with the upper end portion of the protruding portion 54, so that the protruding portion 54 and the protruding portion 56 can be integrally pressed downward, similarly to the operation shown in fig. 12A and 12B. In addition, even when the pair of claw portions 75 contact the supporting portion 58, the supporting portion 58 that supports the protruding portion 54 and the protruding portion 56 can be pushed downward. As a result, as shown in fig. 11G, the press-fitting portion 72 can press-fit the protruding portion 56 downward (see arrow B8), and can be accurately inserted into the insertion hole 2B of the substrate 2. This makes it possible to easily maintain the state in which the protruding portion 56 is inserted into the insertion hole 2B and reduce mounting errors.

The control device C1 turns off the suction performed by the holding unit 71 (S9). Specifically, the suction and holding of the first member 3A by the holding portion 71 is released by stopping the supply of the negative pressure to the suction hole 73 of the holding portion 71.

The control device C1 lifts the mounting head 17 (S10). Specifically, as shown in fig. 11H, the mounting head 17, which releases the suction holding of the first member 3A, is integrally lifted (arrow B9). The mounting head 17 is detachable from the first component 3A and the substrate 2, and is transferred to pick-up and mounting of the first component 3A as a next mounting target. The suction nozzle 70 returns to a protruding position (arrow C4) protruding downward with respect to the head main body portion 74.

According to the above operation, the protruding portion 56 of the first component 3A is pressed downward by the press-fitting portion 72 provided at a position different from the holding portion 71 of the suction nozzle 70, and the insertion hole 2B of the substrate 2 can be inserted with high accuracy. Accordingly, even the first member 3A having a special shape in which the planar portion 50 and the protruding portion 56 are located at separate positions can be mounted on the substrate 2 with high accuracy, and the component mounting accuracy can be improved.

Further, by attaching the suction nozzle 70 having the holding portion 71 to the head main body portion 74 in a vertically movable state, when the attachment head 17 is lowered, the operation of bringing the first component 3A held in the holding portion 71 into contact with the attachment surface 2A of the substrate 2 and the operation of bringing the press-in portion 72 into contact with the first component 3A and pressing in the state where the first component 3A is pressed against the substrate 2 can be continuously performed.

The press-fitting portion 72 has a function of pressing the first member 3A, and also has a function of guiding the protruding portion 54 of the first member 3A inward by providing the guide groove 77 between the pair of claw portions 75. This makes it possible to adjust the relative rotational position of the mounting head 17 and the first member 3A when the mounting head 17 holds the first member 3A, and thereafter stabilize the position of the press-fitting portion 72 in contact with the first member 3A when the first member 3A is pressed, thereby stabilizing the press-fitting operation.

The mounting head 17 having the above-described structure can be used not only for mounting the first member 3A having the planar portion 50 and the protruding portion 56, but also for mounting different kinds of members 3. Specific examples will be described with reference to fig. 13A and 13B.

Fig. 13A and 13B are schematic front views each for explaining an operation of mounting the second member 3B, which is a radial member, supplied as one type of member 3 by the tape feeder 7 shown in fig. 1 to the substrate 2. Fig. 13A and 13B each show a state in which the holding portion 71 of the mounting head 17 holds the second member 3B, fig. 13A shows a state before the second member 3B contacts the substrate 2, and fig. 13B shows a state after the second member 3B contacts the substrate 2.

As shown in fig. 13A, the second member 3B, which is a radial member, has a member main body 100 and two leads 102, and the upper surface of the member main body 100 is sucked and held by the holding portion 71 of the mounting head 17.

When the mounting head 17 is integrally lowered from the state shown in fig. 13A, the lead 102 of the second member 3B is inserted into the insertion hole 2C of the substrate 2 as shown in fig. 13B (see arrow E1). When the mounting head 17 is further pushed in, the component body 100 of the second component 3B is pressed against the mounting surface 2A of the substrate 2, and the suction nozzle 70 relatively rises (arrow F1). The urging member 96 shown in fig. 9A and 9B contracts, and absorbs an impact when the component main body 100 of the second component 3B is pressed against the substrate 2.

Thereafter, the suction holding by the holding portion 71 is released, and the mounting head 17 is lifted up and retracted, thereby completing the assembly and mounting of the second component 3B.

When the mounting head 17 holds the second component 3B, the component main body 100, which is the holding object, and the lead 102, which is the insertion object, are located at positions (positions having the same XY coordinates) overlapping each other in a plan view. Accordingly, the lead 102 of the second component 3B can be pushed into the insertion hole 2C of the substrate 2 without using the pushing operation of the pushing portion 72 by simply lowering the mounting head 17 to lower the suction nozzle 70.

According to the mounting operation shown in fig. 13A and 13B, the second component 3B (for example, a radial component) of a different type can be mounted on the substrate 2 using the mounting head 17 capable of mounting the first component 3A. The press-fitting portion 72 of the mounting head 17 does not engage with the second member 3B, and does not exert the press-fitting function or the alignment function of the second member 3B. That is, the function of the press-in portion 72 is invalidated. Even when there are a plurality of types of components 3 supplied to the component mounting apparatus 1, one type of mounting head 17 can be used.

As described above, the component mounting device 1 of the present embodiment includes: a mounting head 17 for mounting the component 3 on the substrate 2; a head moving device 14 that moves the mounting head 17; and a control device C1 that controls driving of the head moving device 14, the member 3 including a first member 3A, the first member 3A having a planar portion 50 and a protruding portion 56 protruding downward at a position different from the planar portion 50, the mounting head 17 having: a holding portion 71 that holds the planar portion 50 of the first member 3A; and a press-fit portion 72 for pressing the protruding portion 56 of the first member 3A downward and inserting the protruding portion into the insertion hole 2B of the substrate 2.

According to this structure, even if the component 3 is a member having a special shape to be mounted, the mounting head 17 formed by combining the holding portion 71 and the press-fitting portion 72 can be used, and thus the component can be inserted into and mounted on the substrate 2 with high accuracy.

In the component mounting apparatus 1 of the present embodiment, the control apparatus C1 executes: a first operation (S6) of moving the mounting head 17 toward the mounting position while the first member 3A is held by the holding portion 71 of the mounting head 17; and a second operation (S8) of pressing the protruding portion 56 of the first member 3A downward by the pressing portion 72 into the insertion hole 2B of the substrate 2 in a state where the first member 3A held by the holding portion 71 is pressed against the substrate 2 after the first operation. According to this structure, the operation of inserting the protruding portion 56 of the first member 3A into the insertion hole 2B of the substrate 2 can be performed quickly and easily.

In the component mounting device 1 of the present embodiment, the holding portion 71 is movable up and down relative to the press-fit portion 72. According to this configuration, the mounting head 17 is moved up and down in a state in which the first member 3A held by the holding portion 71 is pressed against the substrate 2, and the relative position of the press-in portion 72 with respect to the first member 3A can be changed.

In the component mounting apparatus 1 of the present embodiment, the mounting head 17 is movable between a first height position (fig. 11D, 11E, etc.) at which the holding portion 71 holds the first component 3A and the press-fitting portion 72 is separated from the first component 3A, and a second height position (fig. 11G, etc.) lower than the first height position. In the second height position, the holding portion 71 is raised relative to the press-in portion 72 in a state where the first member 3A held by the holding portion 71 is in contact with the substrate 2, and the press-in portion 72 is in contact with the first member 3A. According to this configuration, the operation of pressing the first member 3A against the substrate 2 and inserting the protruding portion 56 of the first member 3A into the insertion hole 2B of the substrate 2 can be performed only by lowering the mounting head 17.

In the component mounting apparatus 1 of the present embodiment, the control apparatus C1 executes: a third operation (S2) of lowering the mounting head 17 toward the first member 3A disposed on the tray 11 (at a predetermined position) and bringing the holding portion 71 of the mounting head 17 into contact with the first member 3A; and a fourth operation (S3) of further lowering the mounting head 17, and raising the holding portion 71 relative to the press-fitting portion 72 to bring the press-fitting portion 72 into contact with the first member 3A. According to this configuration, the press-fit portion 72 is brought into contact with the first member 3A when the first member 3A is held, and the relative alignment of the mounting head 17 and the first member 3A is enabled.

In the component mounting device 1 of the present embodiment, the first component 3A further includes a protruding portion 54 protruding upward on the back side of the protruding portion 56, and a guide groove 77 for guiding the protruding portion 54 inward is provided at the lower end of the press-fitting portion 72. According to this configuration, when the press-fitting portion 72 is in contact with the protruding portion 54 of the first member 3A, the protruding portion 54 can be guided to the inside of the guide groove 77, and the relative alignment of the mounting head 17 and the first member 3A can be performed with high accuracy.

In the component mounting apparatus 1 of the present embodiment, the mounting head 17 further includes a head body 74 to which the holding portion 71 is attached so as to be movable up and down. With this structure, the holding portion 71 can be stably held.

In the component mounting device 1 of the present embodiment, the press-fit portion 72 is integrally formed with the head main body portion 74. According to this structure, the structure of the mounting head 17 can be simplified.

In the component mounting apparatus 1 of the present embodiment, the mounting head 17 further includes a biasing member 96 that biases the holding portion 71 downward. With this configuration, the impact when the first member 3A is mounted by bringing the first member 3A into contact with the substrate 2 when the holding portion 71 is brought into contact with the first member 3A can be alleviated.

In the component mounting apparatus 1 of the present embodiment, the suction hole 73 for sucking the planar portion 50 of the first component 3A is provided at the lower end of the holding portion 71, the mounting head 17 incorporates the negative pressure flow path 90 communicating with the suction hole 73, and the biasing member 96 is provided in the negative pressure flow path 90. According to this structure, the urging member 96 can be disposed by effectively using the internal space in the mounting head 17, contributing to downsizing of the mounting head 17.

In the component mounting device 1 of the present embodiment, the component 3 includes a second component 3B different from the first component 3A, and the control device C1 validates the press-fitting operation of the press-fitting portion 72 at the time of mounting the first component 3A, and invalidates the press-fitting operation of the press-fitting portion 72 at the time of mounting the second component 3B. With this configuration, the mounting head 17 capable of mounting the first member 3A can be used for mounting the second member 3B without requiring the press-fitting operation by the press-fitting portion 72.

In the component mounting apparatus 1 of the present embodiment, the second component 3B includes a radial component. According to this structure, the mounting head 17 can be applied also in the mounting of the radial member.

In the component mounting device 1 of the present embodiment, the holding portion 71 is provided at a position offset in the first direction D1 from the central axis Ax of the mounting head 17 extending in the vertical direction, and the press-fitting portion 72 is provided at a position offset in the second direction D2 opposite to the first direction D1 from the central axis Ax. With this configuration, the holding portion 71 and the press-fitting portion 72 can be arranged in good balance, and the deviation in the horizontal dimension of the mounting head 17 can be reduced.

In the component mounting device 1 of the present embodiment, the first component 3A is a thermal fuse that fuses in response to an increase in temperature, and has the fusing portion 52 between the planar portion 50 and the protruding portion 56. This structure can be applied to the mounting of a special component 3 such as a thermal fuse.

The component mounting method according to the present embodiment includes steps (S2 to S4) of holding the planar portion 50 of the first component 3A by the holding portion 71 of the mounting head 17 and steps (S7, S8) of inserting the protruding portion 56 of the first component 3A protruding downward at a position different from the planar portion 50 into the insertion hole 2B of the board 2 by the press-fitting portion 72 of the mounting head 17.

According to this method, even if the component 3 is a component having a special shape to be mounted, the component can be inserted into and mounted on the substrate 2 with high accuracy by using the mounting head 17 in which the holding portion 71 and the press-fitting portion 72 are combined.

The present invention has been described above by referring to the above embodiments, but the present invention is not limited to the above embodiments. For example, in the embodiment, the case where the first member 3A as the mounting object of the mounting head 17 is a thermal fuse is described, but the present invention is not limited to this case. As the first component, other types of components may be used as long as the component has a "flat surface portion" held by the suction nozzle 70 of the mounting head 17 and a "protruding portion" pressed downward by the press-fitting portion 72 of the mounting head 17. The "flat portion" need not be entirely flat, but may have at least a flat surface that can be held by the holding portion 71.

In the embodiment, the case where the press-fitting portion 72 is integrally formed with the head main body portion 74 has been described, but the present invention is not limited to this case. For example, the press-fitting portion may be detachably attached to the head main body portion 74, or the press-fitting portion itself may be operable. According to this configuration, even when the first member 3A is changed to a member of a different specification or shape, the same mounting head 17 can be used.

The present invention has been fully described in connection with preferred embodiments with reference to the accompanying drawings, and it is obvious to those skilled in the art that various modifications and corrections can be made. Such variations and modifications are to be understood as included within the scope of the present invention as defined by the appended claims. Further, the combination of elements and the change of the order in the embodiments can be realized without departing from the scope and spirit of the present invention.

Industrial applicability

The component mounting apparatus and the component mounting method of the present invention can be applied to any apparatus and method for mounting a component on a substrate.

Claims (16)

1. A component mounting apparatus, wherein,

the component mounting device includes:

a mounting head that mounts a component to a substrate;

a head moving device that moves the mounting head; and

control means for controlling the driving of the head moving means,

the member includes a first member having a planar portion and a protruding portion protruding downward at a position different from the planar portion,

the mounting head has: a holding portion that holds the planar portion of the first member; and a press-fit portion that presses the protruding portion of the first member downward and inserts the protruding portion into the insertion hole of the substrate.

2. The component mounting apparatus of claim 1, wherein,

the control device performs:

a first operation of moving the mounting head toward a mounting position in a state where the first member is held by the holding portion of the mounting head; and

and a second operation of pressing the protruding portion of the first member downward by the pressing portion and inserting the protruding portion into the insertion hole of the substrate in a state where the first member held by the holding portion is pressed against the substrate after the first operation.

3. The component mounting apparatus of claim 1, wherein,

the holding portion is movable up and down relative to the press-in portion.

4. The component mounting apparatus as claimed in claim 3, wherein,

the mounting head is movable between a first height position at which the holding portion holds the first member and the press-in portion is separated from the first member, and a second height position lower than the first height position, and in the second height position, the holding portion is raised relatively to the press-in portion in a state where the first member held by the holding portion is in contact with the substrate, and the press-in portion is in contact with the first member.

5. The component mounting apparatus of claim 4, wherein,

the control device performs:

a third operation of lowering the mounting head toward the first member disposed at a predetermined position to bring the holding portion of the mounting head into contact with the first member; and

and a fourth operation of lowering the mounting head further, and raising the holding portion relative to the press-fitting portion to bring the press-fitting portion into contact with the first member.

6. The component mounting apparatus of claim 1, wherein,

the first member further has a convex portion protruding upward on the back side of the protruding portion,

a guide groove for guiding the convex portion inward is provided at the lower end of the press-in portion.

7. The component mounting apparatus according to claim 2, wherein,

the mounting head further includes a head main body portion to which the holding portion is mounted so as to be movable up and down.

8. The component mounting apparatus of claim 7, wherein,

the press-in portion is integrally formed with the head main body portion.

9. The component mounting apparatus of claim 7, wherein,

the press-in portion is detachable from the head main body portion.

10. The component mounting apparatus according to claim 2, wherein,

The mounting head further includes a biasing member that biases the holding portion downward.

11. The component mounting apparatus of claim 10 wherein,

an adsorption hole for adsorbing the planar portion of the first member is provided at a lower end of the holding portion,

the mounting head is internally provided with a negative pressure flow path communicated with the adsorption hole, and the force application member is arranged in the negative pressure flow path.

12. The component mounting apparatus of claim 1, wherein,

the component comprises a second component different from the first component,

the control device enables the press-in operation of the press-in portion when the first component is mounted, and disables the press-in operation of the press-in portion when the second component is mounted.

13. The component mounting apparatus of claim 12 wherein,

the second component is a radial component.

14. The component mounting apparatus of claim 1, wherein,

the holding portion is provided at a position offset in a first direction with respect to a center axis of the mounting head extending in a vertical direction,

the press-in portion is provided at a position offset from the center axis in a second direction opposite to the first direction.

15. The component mounting apparatus of claim 1, wherein,

the first member is a thermal fuse that fuses in response to an increase in temperature, and has a fusing portion between the planar portion and the protruding portion.

16. A component mounting method, wherein,

the component mounting method includes the steps of:

holding the planar portion of the first member with a holding portion of the mounting head; and

and a pressing portion of the mounting head presses a protruding portion of the first member protruding downward at a position different from the planar portion downward, and the protruding portion is inserted into the insertion hole of the substrate.