CN117334606A - Wafer cleaning device - Google Patents

Wafer cleaning device Download PDF

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Publication number
CN117334606A
CN117334606A CN202311344036.7A CN202311344036A CN117334606A CN 117334606 A CN117334606 A CN 117334606A CN 202311344036 A CN202311344036 A CN 202311344036A CN 117334606 A CN117334606 A CN 117334606A
Authority
CN
China
Prior art keywords
rod
fixedly connected
block
wafer
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311344036.7A
Other languages
Chinese (zh)
Inventor
李兆文
李兆彩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shangyou Wenfeng Electronic Technology Co ltd
Original Assignee
Shangyou Wenfeng Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shangyou Wenfeng Electronic Technology Co ltd filed Critical Shangyou Wenfeng Electronic Technology Co ltd
Priority to CN202311344036.7A priority Critical patent/CN117334606A/en
Publication of CN117334606A publication Critical patent/CN117334606A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/022Cleaning travelling work
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D29/00Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/01Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements
    • B01D29/03Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor with flat filtering elements self-supporting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D29/00Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/62Regenerating the filter material in the filter
    • B01D29/64Regenerating the filter material in the filter by scrapers, brushes, nozzles, or the like, acting on the cake side of the filtering element
    • B01D29/6469Regenerating the filter material in the filter by scrapers, brushes, nozzles, or the like, acting on the cake side of the filtering element scrapers
    • B01D29/6484Regenerating the filter material in the filter by scrapers, brushes, nozzles, or the like, acting on the cake side of the filtering element scrapers with a translatory movement with respect to the filtering element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D29/00Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor
    • B01D29/88Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor having feed or discharge devices
    • B01D29/94Filters with filtering elements stationary during filtration, e.g. pressure or suction filters, not covered by groups B01D24/00 - B01D27/00; Filtering elements therefor having feed or discharge devices for discharging the filter cake, e.g. chutes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02Cleaning by the force of jets or sprays
    • B08B3/024Cleaning by means of spray elements moving over the surface to be cleaned
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04Cleaning involving contact with liquid
    • B08B3/10Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The utility model discloses a wafer cleaning device, and belongs to the technical field of wafer cleaning. The wafer cleaning device comprises a cleaning box, wherein a limiting assembly used for positioning a wafer is arranged in the cleaning box, a uniform water spraying assembly and a water flow filtering assembly used for cleaning the wafer are also arranged in the cleaning box, and the limiting assembly, the uniform water spraying assembly and the water flow filtering assembly are mutually matched; the utility model realizes a limit effect on wafers with different diameters and different thicknesses, ensures that the wafers cannot deviate and fall off in the cleaning process, and ensures that the cleaning work can be smoothly carried out; the wafer can be uniformly cleaned without dead angles, the condition of cleaning the dead angles of the wafer due to shielding is avoided, and the overall cleaning efficiency is improved; can play a filtering effect on the cleaning water in the cleaning process, and can play a continuous cleaning effect on impurities attached to the surface of the filter screen.

Description

Wafer cleaning device
Technical Field
The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning device.
Background
A highly clean environment is required in the process of processing semiconductor wafers to reduce the influence of unnecessary particles on the process, but with the continuous improvement of precision, the continuous reduction of line width and the continuous improvement of cleanliness requirements, not only a clean environment with high cleanliness is required, but also the wafer surface is required to be cleaned in many cases to meet the requirements of the cleanliness of the processed wafer surface.
Through retrieving, the patent with publication number CN214718732U discloses a high-efficient multifunctional semiconductor wafer cleaning device, comprising: a filter box; the fixing structure is fixedly arranged in the filter box and is positioned at the central part; the utility model relates to the technical field of semiconductor wafer cleaning, in particular to an auxiliary structure which is fixedly arranged on the upper wall surface of a filter box and positioned at the central position.
However, the above patent documents have the following disadvantages in practical application:
the wafer is relatively poor in washing, and a washing dead angle is easy to appear, because in the patent document, the orientation of the water outlet pipe is relatively single, part of the wafer cannot be washed, and the clamp can shield the clamping end of the wafer due to the existence of the clamp, so that the washing dead angle appears; moreover, in the above patent document, although the impurity in the water flow can be filtered by using the filter plate, the effect of automatically cleaning and collecting the impurity on the surface of the filter plate in a concentrated manner can not be achieved when the filter plate is washed, the blocking of the filter plate is easily caused, the water flow passing efficiency is affected, and the filter plate is further required to be cleaned manually by a person, so that the time and the labor are wasted, and the degree of automation is poor.
Disclosure of Invention
The utility model aims to solve the problems that the wafer is relatively poor in washing, dead angles are easy to appear in washing, and impurities on the surface of a filter plate cannot be automatically cleaned and collected in a concentrated mode while washing in the prior art.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the wafer cleaning device comprises a cleaning box, wherein a through hole plate is fixedly connected to the middle part of the inner cavity wall of the cleaning box, a limiting assembly used for positioning a wafer is arranged in the cleaning box, a uniform water spraying assembly and a water flow filtering assembly used for cleaning the wafer are also arranged in the cleaning box, and the limiting assembly, the uniform water spraying assembly and the water flow filtering assembly are mutually matched;
the uniform water spraying assembly comprises a reciprocating plate, the lower end of the reciprocating plate is connected with a through hole plate in a sliding manner through a groove, the upper end of the reciprocating plate is connected with a first sliding rod in a sliding manner, the front end surface of the first sliding rod is fixedly connected with a connecting rod, and the lower side of the front end surface of the connecting rod is fixedly connected with a water outlet pipe;
the limiting assembly comprises a fixed ring, four corners of the fixed ring are fixedly connected to a through hole plate, the lower end face of the fixed ring is distributed along the radial direction and is fixedly connected with a mounting block, two ends of the mounting block are respectively connected with a first connecting rod through a pin shaft in a rotating mode, one end, far away from the mounting block, of the first connecting rod is connected with a second connecting rod through a pin shaft in a rotating mode, and one end, far away from the first connecting rod, of the second connecting rod is connected with a placement block through a pin shaft in a rotating mode;
the water flow filtering assembly comprises a filter screen, a lifting block is slidably connected to the middle of the rear side of the left end face of the inner cavity wall of the cleaning box, a third sliding rod is fixedly connected to the right end face of the lifting block, a lifting rod is slidably connected to the third sliding rod, and a hairbrush plate is fixedly connected to the lower end face of the lifting rod.
Preferably, the fixed ring is connected with the gear ring in a rotating way, the middle part of the left end of the gear ring is embedded with the guide post through the groove and is connected with the guide post in a sliding way, the lower end face of the guide post is fixedly connected with the threaded block, the middle part of the threaded block is connected with the first threaded rod in a threaded way, the front end and the rear end of the first threaded rod are connected with the through hole plate in a rotating way, the joint of the first connecting rod and the mounting block is fixedly connected with the first gear through the pin shaft on any side, and the first gear is meshed with the gear ring.
Preferably, the middle part of the lower end of the placing block is rotationally connected with a rotating block through a pin shaft, the middle part of the placing block is slidably connected with a compressing block through a groove, a second threaded rod is in threaded connection with the compressing block, the upper end and the lower end of the second threaded rod are rotationally connected with the placing block, worm wheels are sleeved at the upper end of the second threaded rod and fixedly connected with the upper end and the lower end of the second threaded rod, first lug rods are rotationally connected with the upper end of the placing block on the left side and the right side, first groove drums are rotationally connected with first groove drums on the upper end and the lower end of the placing block, the first groove drums are connected with the first lug rods through key grooves in an inserting mode, the first lug rods and the rear side and the front side right end can also slide relatively when rotating simultaneously, worms are arranged on the first groove drums, the worm is meshed with the worm wheels, bevel gears are sleeved on the first lug rods at the front end and the left end and the right end and the first groove drums on the front side, and adjacent bevel gears are meshed with each other.
Preferably, the middle part fixedly connected with biax motor in the up end rear side of orifice plate, biax motor rear side output is through round pin axle fixedly connected with second crank, second crank upper end is connected with the second rectangle piece through the round pin axle rotation, the second rectangle piece is embedded in the reciprocating plate and is linked to each other rather than the slip through the recess, reciprocating plate rear side lower extreme is connected with gear and first crank through the round pin axle rotation, the gear is connected with the slide through the round pin axle rotation, the slide lower extreme is connected with the washbox through recess sliding connection, orifice plate up end rear side fixedly connected with rack, rack and gear intermeshing, first crank upper end left side is connected with first rectangle piece through the round pin axle rotation, first rectangle piece utilizes the recess to embed in the spout pole and links to each other rather than the slip, spout pole front end and first slide bar are fixed to each other.
Preferably, the middle part of the upper end of the water outlet pipe is communicated with a hose, a plurality of nozzles are arranged on the upper side and the lower side of the water outlet pipe, the nozzles on the upper side and the lower side face each other, the lower end of the hose is communicated with a water pump, and the water inlet end of the water pump is communicated with the bottom of the cleaning box.
Preferably, the rear side still be provided with the pushing component who is used for promoting the wafer on placing the piece, the pushing component includes L type pole, L type pole rear side lower extreme fixed connection is in placing the piece, both ends are connected with the third connecting rod through second lug pole and round pin axle rotation respectively about the L type pole front side, the third connecting rod upper end is connected with the rectangle piece through the round pin axle rotation, both ends all sliding connection has the second slide bar about the rectangle piece, terminal surface fixedly connected with pushing plate under the second slide bar, the left side second slide bar lower extreme cover is equipped with the spring, the spring upper end links to each other with the rectangle piece is fixed, the spring lower extreme links to each other with the pushing plate is fixed, second lug pole grafting and sliding connection have a second recess section of thick bamboo, second recess section of thick bamboo rear end links to each other with biax motor front side output is fixed.
Preferably, both ends all are connected with the second sprocket through the round pin axle rotation about the terminal surface downside behind the cleaning tank inner chamber wall, the second sprocket meshing is connected with the second chain, second chain lower extreme middle part is rotated with the lifter through the round pin axle and is linked to each other.
Preferably, a collecting box is mounted in the middle of the left end face of the inner cavity wall of the cleaning box through bolts, and filtering holes with the same specification as that of the filtering net are formed in the bottom of the collecting box.
Preferably, the novel cleaning device further comprises a first chain wheel, the left side is fixedly connected with a third chain wheel through a pin shaft at the joint of the second chain wheel and the cleaning box, the middle part of the left side of the rear end of the cleaning box is rotationally connected with the third chain wheel through a pin shaft, the third chain wheel is in meshed connection with a third chain, the left side is fixedly connected with the third chain wheel through a pin shaft, and the right side is sleeved with the first chain wheel and fixedly connected with the second groove drum.
Preferably, the through hole plate is provided with a plurality of through holes for water to pass through.
Compared with the prior art, the utility model provides a wafer cleaning device, which has the following beneficial effects:
1. according to the wafer cleaning device, a person can manually rotate a first threaded rod to drive a threaded block to move back and forth, the threaded block utilizes the cooperation of a guide post and a groove to enable a gear ring to rotate, when the gear ring rotates, a plurality of first gears can be enabled to rotate, a first connecting rod and a second connecting rod are enabled to rotate, the included angle between the first connecting rod and the second connecting rod is enabled to change, a plurality of placing blocks can be enabled to be mutually close to or far away from each other along the radial direction, the rotating blocks are enabled to be in contact with the edge of a wafer, meanwhile, when the placing blocks move, the first protruding block rod and the first groove cylinder relatively slide, then according to the thickness of the wafer, the person manually rotates a handle at the first protruding block rod at the left side, and enables a plurality of worms and worm gears to rotate under the cooperation of the first groove cylinder, the first protruding block rod and the bevel gears, so that the second threaded rod can be enabled to rotate, the pressing block is enabled to descend to the degree that the wafer is enabled to be attached to the wafer, and therefore a movable space to a certain extent can be provided for the wafer, but the wafer cannot be shifted and dropped, and therefore the wafer can be limited, and the wafer can be smoothly cleaned.
2. This wafer belt cleaning device, through starting biax motor and water pump, the water pump will wash the bottom of the case portion is taken out, reach the outlet pipe behind the hose, and spout the wafer surface from the nozzle of the upper and lower both sides of outlet pipe, wash, then make the second crank rotate under the effect of biax motor rear side output, can utilize the second rectangular piece to drive reciprocal board effect reciprocating motion, make the outlet pipe control reciprocating motion, expand the spraying range of control direction, simultaneously, when reciprocal board removes, make first crank rotation under rack and gear's cooperation, first crank utilizes first rectangular piece drive spout pole back-and-forth reciprocating motion, make first slide bar drive connecting rod and outlet pipe back-and-forth movement, can make the outlet pipe be controlled reciprocal compound motion, can evenly wash the front and back two sides of wafer, simultaneously, make second groove drum and second lug pole rotate under the effect of biax motor front side output, can make the third connecting rod rotate, when rectangular piece descends to the deflector and wafer contact, the rectangular piece continues to the bottommost point, the rectangular piece is driven by the rectangular piece, the second slider, and the wafer is contacted with the wafer, then, the wafer is washed down, and the wafer is washed, and is washed down, and the wafer is washed down, and the effect is not had the corner is washed, and is realized, and the wafer is washed, and is washed and is in the whole and is in the condition is washed.
3. This wafer belt cleaning device, through the bottom that the through-hole through the orifice plate was continued to flow back to the washing case in the cleaning process, utilize the filter screen to filter dust and impurity in the rivers, but with guaranteed the water cyclic utilization of bottom, simultaneously, because the last rotation of second grooved drum makes first chain and first sprocket rotate, can make second sprocket clockwise rotation make the lifter remove under the effect of third chain under the cooperation of third sprocket and third chain, and, because the lifter slides about on the third slide bar, the lifter slides from top to bottom, can make the brush board remain straight throughout, and, when the brush board is in the lower extreme, from right side left side removal, sweep dust and impurity into the collection box, then rise back to the initial position again, can not cause reverse promotion to dust and impurity like this, can be sustainable scrape the clearance to the filter screen, finally, the device is when not using, personnel can open the chamber door of case, will collect the box and take out impurity and dust, thereby can be in the cleaning process, water is had to a filter screen, and the filter screen is polluted, and the filter screen is carried out to the manual cleaning effect has been avoided, and the manual cleaning process is high, and the manual cleaning effect has been avoided, the filter screen has been removed and the manual cleaning effect has been carried out.
Drawings
FIG. 1 is a schematic view of a partial sectional perspective structure of a purge bin according to the present utility model;
FIG. 2 is a schematic diagram of a partial perspective view of the present utility model;
FIG. 3 is an enlarged view of portion A of FIG. 2 in accordance with the present utility model;
FIG. 4 is an enlarged view of portion B of FIG. 2 in accordance with the present utility model;
FIG. 5 is an enlarged view of portion C of FIG. 2 in accordance with the present utility model;
FIG. 6 is a schematic diagram of a partial perspective view of the present utility model;
FIG. 7 is an enlarged view of portion D of FIG. 6 in accordance with the present utility model;
FIG. 8 is an enlarged view of portion E of FIG. 6 in accordance with the present utility model;
FIG. 9 is a schematic diagram of a partial perspective view of a third embodiment of the present utility model;
FIG. 10 is a schematic diagram of a partial perspective view of the present utility model;
FIG. 11 is a schematic diagram showing a partial perspective view of the present utility model;
FIG. 12 is a schematic view of a partial perspective view of the present utility model;
fig. 13 is a schematic diagram of a complete three-dimensional structure of the present utility model.
In the figure: 1. a cleaning box; 2. a water pump; 3. a hose; 4. a gear ring; 5. a guide post; 6. a screw block; 7. a first threaded rod; 8. a mounting block; 9. a fixing ring; 10. a first gear; 11. a first link; 12. a second link; 13. placing a block; 14. a first groove drum; 15. a worm; 16. a worm wheel; 17. bevel gears; 18. a compaction block; 19. a rotating block; 20. a first bump bar; 21. a second threaded rod; 22. a water outlet pipe; 23. a first chain; 24. a first sprocket; 25. a connecting rod; 26. a first slide bar; 27. a chute rod; 28. a first crank; 29. a first rectangular block; 30. a gear; 31. a slide plate; 32. a rack; 33. a shuttle plate; 34. a second crank; 35. a second rectangular block; 36. a biaxial motor; 37. an L-shaped rod; 38. a second bump lever; 39. a third link; 40. a pushing plate; 41. a second slide bar; 42. rectangular blocks; 43. a second grooved drum; 44. a spring; 45. a filter screen; 46. a collection box; 47. a second chain; 48. a second sprocket; 49. a third slide bar; 50. a lifting block; 51. a lifting rod; 52. a brush plate; 53. a third chain; 54. a third sprocket; 55. a through hole plate.
Description of the embodiments
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1-13, a wafer cleaning device comprises a cleaning box 1, wherein a through hole plate 55 is fixedly connected to the middle part of the inner cavity wall of the cleaning box 1, a limiting component for positioning wafers is arranged in the cleaning box 1, a uniform water spraying component and a water flow filtering component for cleaning the wafers are also arranged in the cleaning box 1, and the limiting component, the uniform water spraying component and the water flow filtering component are mutually matched;
the uniform water spraying assembly comprises a reciprocating plate 33, the lower end of the reciprocating plate 33 is connected with a through hole plate 55 in a sliding manner through a groove, the upper end of the reciprocating plate 33 is connected with a first slide rod 26 in a sliding manner, the front end surface of the first slide rod 26 is fixedly connected with a connecting rod 25, and the lower side of the front end surface of the connecting rod 25 is fixedly connected with a water outlet pipe 22;
the limiting assembly comprises a fixed ring 9, four corners of the fixed ring 9 are fixedly connected to through hole plates 55, the lower end face of the fixed ring 9 is distributed along the radial direction and is fixedly connected with a mounting block 8, two ends of the mounting block 8 are respectively connected with a first connecting rod 11 through pin shafts in a rotating mode, one end, away from the mounting block 8, of the first connecting rod 11 is connected with a second connecting rod 12 through pin shafts in a rotating mode, and one end, away from the first connecting rod 11, of the second connecting rod 12 is connected with a placing block 13 through pin shafts in a rotating mode;
the water flow filtering component comprises a filter screen 45, a lifting block 50 is slidably connected to the middle part of the rear side of the left end face of the inner cavity wall of the cleaning box 1, a third sliding rod 49 is fixedly connected to the right end face of the lifting block 50, a lifting rod 51 is slidably connected to the third sliding rod 49, and a hairbrush plate 52 is fixedly connected to the lower end face of the lifting rod 51.
In this embodiment, as shown in fig. 10 and fig. 5, the inner side of the fixed ring 9 is rotatably connected with a gear ring 4, the middle part of the left end of the gear ring 4 is embedded with a guide post 5 through a groove and is slidably connected with the guide post, the lower end surface of the guide post 5 is fixedly connected with a threaded block 6, the middle part of the threaded block 6 is in threaded connection with a first threaded rod 7, the front end and the rear end of the first threaded rod 7 are rotatably connected with a through hole plate 55, the joint of a first connecting rod 11 on any side and a mounting block 8 is fixedly connected with a first gear 10 through a pin shaft, and the first gear 10 is meshed with the gear ring 4;
the middle part of the lower end of the placement block 13 is rotationally connected with a rotating block 19 through a pin shaft, the middle part of the placement block 13 is slidingly connected with a compressing block 18 through a groove, the compressing block 18 is in threaded connection with a second threaded rod 21, the upper end and the lower end of the second threaded rod 21 are rotationally connected with the placement block 13, the upper end of the second threaded rod 21 is sleeved with and fixedly connected with a worm wheel 16, the upper ends of the placement blocks 13 on the left side and the right side are rotationally connected with a first bump rod 20, the upper ends of the placement blocks 13 on the front side and the rear side are rotationally connected with a first groove drum 14, the first groove drum 14 and the first bump rod 20 are spliced through a key groove, the two simultaneously rotate and simultaneously can also relatively slide, the first bump rods 20 on the left side and the right side and the first groove drum 14 on the rear side and the right side are respectively provided with a worm 15, the worm 15 is meshed with the worm wheel 16, the first bump rods 20 on the front side and the left side and the right side are sleeved with a bevel gear 17 fixedly connected with the first groove drum 14, and the adjacent bevel gears 17 are meshed with each other;
during the use, through the diameter according to the wafer that waits to wash, personnel can manually rotate first threaded rod 7 and drive screw thread piece 6 and reciprocate, screw thread piece 6 utilizes the cooperation of guide post 5 and recess to make ring gear 4 rotate, when ring gear 4 rotates, can make a plurality of first gears 10 rotate, make first connecting rod 11 and second connecting rod 12 rotate, make the contained angle between the two change, can make a plurality of placing block 13 along radial mutual approaching or keeping away from, make the edge contact laminating of rotating block 19 and wafer, simultaneously, when placing block 13 removes, first lug pole 20 and first recess section of thick bamboo 14 take place the relative slip, then according to the thickness of wafer, personnel manually rotate the handle of left side first lug pole 20 department, make a plurality of worms 15, worm wheel 16 rotate under the cooperation of first recess section of thick bamboo 14, first lug pole 20, bevel gear 17, can make second threaded rod 21 rotate, make compact heap 18 descend, and descend to the degree of being about to laminating with the wafer, can provide the activity space to a certain extent for the wafer, but can not deviate from each other, and can not drop to the wafer thickness, and different thickness can be in order to carry out the washing smoothly in the wafer, and washing process can be guaranteed to different to the wafer.
In this embodiment, as shown in fig. 6-9, a double-shaft motor 36 is fixedly connected to the middle part of the rear side of the upper end surface of the through hole plate 55, a second crank 34 is fixedly connected to the rear output end of the double-shaft motor 36 through a pin shaft, a second rectangular block 35 is rotatably connected to the upper end of the second crank 34 through a pin shaft, the second rectangular block 35 is embedded in the reciprocating plate 33 through a groove and slidably connected with the reciprocating plate 33, a gear 30 and a first crank 28 are rotatably connected to the lower end of the rear side of the reciprocating plate 33 through a pin shaft, the gear 30 is rotatably connected with a sliding plate 31 through a pin shaft, the lower end of the sliding plate 31 is slidably connected to the cleaning box 1 through a groove, a rack 32 is fixedly connected to the rear side of the upper end surface of the through hole plate 55, the rack 32 is meshed with the gear 30, a first rectangular block 29 is rotatably connected to the left side of the upper end of the first crank 28 through a pin shaft, the first rectangular block 29 is embedded in the sliding rod 27 through a groove and slidably connected with the sliding rod 27, and the front end surface of the sliding rod 27 is fixedly connected with the first sliding rod 26.
The middle part of the upper end of the water outlet pipe 22 is communicated with a hose 3, a plurality of nozzles are arranged on the upper side and the lower side of the water outlet pipe 22, the nozzles on the upper side and the lower side face each other, the lower end of the hose 3 is communicated with a water pump 2, and the water inlet end of the water pump 2 is communicated with the bottom of the cleaning box 1;
the pushing assembly for pushing the wafer is further arranged on the rear side placing block 13 and comprises an L-shaped rod 37, the lower end of the rear side of the L-shaped rod 37 is fixedly connected to the placing block 13, the left end and the right end of the front side of the L-shaped rod 37 are respectively and rotatably connected with a third connecting rod 39 through a second bump rod 38 and a pin shaft, the upper end of the third connecting rod 39 is rotatably connected with a rectangular block 42 through the pin shaft, the left end and the right end of the rectangular block 42 are both and slidably connected with a second sliding rod 41, the lower end face of the second sliding rod 41 is fixedly connected with a pushing plate 40, the lower end of the left second sliding rod 41 is sleeved with a spring 44, the upper end of the spring 44 is fixedly connected with the rectangular block 42, the lower end of the spring 44 is fixedly connected with the pushing plate 40, the second bump rod 38 is inserted and is slidably connected with a second groove cylinder 43, and the rear end of the second groove cylinder 43 is fixedly connected with the front side output end of the double-shaft motor 36;
when in use, the double-shaft motor 36 and the water pump 2 are started, the water at the bottom of the washing tank 1 is pumped out by the water pump 2, reaches the water outlet pipe 22 after passing through the hose 3, is sprayed to the surface of a wafer from nozzles at the upper side and the lower side of the water outlet pipe 22 for washing, then the second crank 34 is rotated under the action of the output end at the rear side of the double-shaft motor 36, the second rectangular block 35 drives the reciprocating plate 33 to reciprocate, the water outlet pipe 22 moves left and right to expand the spraying range in the left and right direction, simultaneously, when the reciprocating plate 33 moves, the first crank 28 rotates under the cooperation of the rack 32 and the gear 30, the first crank 28 drives the chute rod 27 to reciprocate back and forth by the first rectangular block 29, so that the first slide rod 26 drives the connecting rod 25 and the water outlet pipe 22 to reciprocate back and forth, the water outlet pipe 22 can reciprocate back and forth, and forth the front and back sides of the wafer can be uniformly washed, simultaneously, the second groove drum 43 and the second bump rod 38 are rotated under the action of the front output end of the double-shaft motor 36, the third connecting rod 39 can be rotated to drive the rectangular block 42 to do circular motion, when the rectangular block 42 descends to the contact of the pushing plate 40 and the wafer, the rectangular block 42 continues to descend to the lowest point, the second sliding rod 41 slides with the rectangular block 42 and compresses the spring 44 to compress the pushing plate 40 and the wafer, then when the rectangular block 42 continues to ascend, the pushing plate 40 can transversely move to push the wafer, and the wafer is rotated by a certain angle under the lamination of the rotating block 19 to enable the contact of the wafer and the placing block 13 and the shielding part of the pressing block 18 to move, so that the dead angle is avoided being washed, the wafer can be evenly washed without dead angle, the situation of washing dead angle caused by shielding is avoided, the overall cleaning efficiency is improved.
In this embodiment, as shown in fig. 1, 11 and 12, the left and right ends of the lower side of the rear end face of the inner cavity wall of the cleaning tank 1 are both rotatably connected with a second sprocket 48 through a pin shaft, the second sprocket 48 is in meshed connection with a second chain 47, and the middle part of the lower end of the second chain 47 is rotatably connected with a lifting rod 51 through a pin shaft;
the middle part of the left end surface of the inner cavity wall of the cleaning box 1 is provided with a collecting box 46 through a bolt, and the bottom of the collecting box 46 is provided with a filtering hole with the same specification as a filtering net 45;
the cleaning box comprises a cleaning box 1, a left side first sprocket 48, a right side first sprocket 24, a third sprocket 54, a third chain 53, a left side first sprocket 24, a right side first sprocket 24, a second groove drum 43 and a third chain 53, wherein the first sprocket 24 is fixedly connected with the connecting part of the left side second sprocket 48 and the cleaning box 1 through a pin shaft;
the through hole plate 55 is provided with a plurality of through holes for water flow to pass through;
during the use, through the through-hole through the orifice plate 55 in the cleaning process continues to flow back to the bottom of wasing case 1, utilize filter screen 45 to filter dust and impurity in the rivers, but in order to guaranteed the rivers cyclic utilization of bottom, simultaneously, because the continuous rotation of second recess section of thick bamboo 43 makes first sprocket 23 and first sprocket 24 rotate, can make second sprocket 48 clockwise rotation under the cooperation of third sprocket 54 and third chain 53 make lifter 51 remove under the effect of third chain 53, and, because lifter 51 slides about on third slide bar 49, lifter 50 slides from top to bottom, can make brush plate 52 remain straight throughout, and, when brush plate 52 is in the bottom, from right side to left side removes dust and impurity to sweep into collecting box 46, then the back to the initial position, can not cause reverse promotion to dust and impurity, can be sustainable scrape the chamber door of getting to filter screen 45, finally, the device is when not using, personnel can open collecting box 46 and take out, can remove and filter screen 45 and clean the filter screen 45, thereby the effect is removed in the manual work degree is high to the filter screen 45, and the filter screen is removed, and the filter screen is cleaned up by the manual work is removed, and the effect is removed, the filter screen is removed and the manual cleaning is high to the filter screen is removed, and the surface is cleaned to the filter screen is removed and the surface is polluted, and the effect is washed and is removed to the manual the surface is washed and is polluted.
The working principle of the utility model is as follows: according to the diameter of a wafer to be cleaned, a person can manually rotate the first threaded rod 7 to drive the threaded block 6 to move back and forth, the threaded block 6 utilizes the cooperation of the guide post 5 and the groove to enable the gear ring 4 to rotate, when the gear ring 4 rotates, the plurality of first gears 10 can be enabled to rotate, the first connecting rod 11 and the second connecting rod 12 can be enabled to rotate, the included angle between the first connecting rod 11 and the second connecting rod is enabled to change, the plurality of placing blocks 13 can be enabled to be mutually close to or far away from each other along the radial direction, the rotating blocks 19 are enabled to be in contact with the edge of the wafer, meanwhile, when the placing blocks 13 move, the first bump rod 20 and the first groove cylinder 14 relatively slide, then according to the thickness of the wafer, the person manually rotates the handle at the left side first bump rod 20, and the worm wheel 16 are enabled to rotate under the cooperation of the first groove cylinder 14, the first bump rod 20 and the bevel gear 17, the second threaded rod 21 can be enabled to rotate, the compressing blocks 18 can be enabled to descend, the degree of being enabled to be attached to the wafer to be enabled to be the wafer to be enabled to be a degree, and the movable space to be provided to a certain degree, but the wafer cannot deviate and drop, and the wafer can be smoothly limited in the wafer can be cleaned in the wafer due to the fact that the wafer is enabled to be smoothly to fall due to the different thickness and the wafer to the wafer is not to be smoothly caused to the wafer to be cleaning process due to the wafer; the double-shaft motor 36 and the water pump 2, the water pump 2 pumps the water at the bottom of the cleaning tank 1, reaches the water outlet pipe 22 after passing through the hose 3, sprays the water from the nozzles at the upper side and the lower side of the water outlet pipe 22 to the surface of the wafer for cleaning, then rotates the second crank 34 under the action of the output end at the rear side of the double-shaft motor 36, and can drive the reciprocating plate 33 to reciprocate left and right by the second rectangular block 35, so that the water outlet pipe 22 reciprocates left and right, and expands the spraying range in the left and right direction, simultaneously, when the reciprocating plate 33 moves, the first crank 28 rotates under the cooperation of the rack 32 and the gear 30, the first crank 28 drives the chute rod 27 to reciprocate back and forth by the first rectangular block 29, so that the first slide rod 26 drives the connecting rod 25 and the water outlet pipe 22 to reciprocate back and forth, and the water outlet pipe 22 can perform the compound motion of reciprocating left and right and front and back, and back sides of the wafer can be evenly washed, the second groove drum 43 and the second bump rod 38 are rotated under the action of the front output end of the double-shaft motor 36, the third connecting rod 39 can be rotated to drive the rectangular block 42 to do circular motion, when the rectangular block 42 descends to the point that the pushing plate 40 contacts with the wafer, the rectangular block 42 continues to descend to the lowest point, the second sliding rod 41 slides with the rectangular block 42 and compresses the spring 44 to compress the pushing plate 40 and the wafer, then when the rectangular block 42 continues to ascend, the pushing plate 40 can transversely move to push the wafer, and under the fitting of the rotating block 19, the wafer is rotated by a certain angle to enable the contact part of the wafer and the placing block 13 and the shielding part of the pressing block 18 to move, so as to avoid the flushing dead angle, thereby playing a uniform cleaning effect without dead angle on the wafer, avoiding the situation of cleaning dead angle on the wafer due to shielding, the overall cleaning efficiency is improved; in the cleaning process, water flows through the through hole of the through hole plate 55 and continuously flows back to the bottom of the cleaning box 1, dust and impurities in the water flow are filtered by the filter screen 45, so that the water flow at the bottom can be recycled, meanwhile, the first chain 23 and the first chain wheel 24 are enabled to rotate due to the continuous rotation of the second groove drum 43, the second chain wheel 48 can be enabled to rotate clockwise under the cooperation of the third chain wheel 54 and the third chain 53 to enable the lifting rod 51 to move under the action of the third chain 53, and the lifting rod 51 slides left and right on the third sliding rod 49, the brush plate 52 can be enabled to always keep straight by sliding the lifting block 50 up and down, and when the brush plate 52 is at the lowest end, the dust and the impurities are swept into the collecting box 46 from right to left, and then the initial position is lifted again, so that the dust and the impurities can not be pushed reversely, the cleaning box door of the cleaning box 1 can be opened by a person when the device is not used, the dust and the impurities can be cleaned, the dust can be cleaned by the manual cleaning box 45, the dust and the dust can be continuously cleaned by the manual cleaning box 45, and the water can be prevented from being polluted by the manual cleaning process, and the water can be continuously cleaned by the filter screen 45, and the water can be cleaned by the manual cleaning process.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims (10)

1. The wafer cleaning device comprises a cleaning box (1), and is characterized in that a through hole plate (55) is fixedly connected to the middle of the inner cavity wall of the cleaning box (1), a limiting component used for positioning wafers is arranged inside the cleaning box (1), a uniform water spraying component and a water flow filtering component used for cleaning the wafers are also arranged inside the cleaning box (1), and the limiting component, the uniform water spraying component and the water flow filtering component are mutually matched;
the uniform water spraying assembly comprises a reciprocating plate (33), the lower end of the reciprocating plate (33) is connected to a through hole plate (55) in a sliding manner through a groove, the upper end of the reciprocating plate (33) is connected with a first sliding rod (26) in a sliding manner, the front end face of the first sliding rod (26) is fixedly connected with a connecting rod (25), and the lower side of the front end face of the connecting rod (25) is fixedly connected with a water outlet pipe (22);
the limiting assembly comprises a fixed ring (9), four corners of the fixed ring (9) are fixedly connected to a through hole plate (55), the lower end face of the fixed ring (9) is distributed along the radial direction and is fixedly connected with a mounting block (8), two ends of the mounting block (8) are respectively connected with a first connecting rod (11) through pin shafts in a rotating mode, one end, far away from the mounting block (8), of the first connecting rod (11) is connected with a second connecting rod (12) through pin shafts in a rotating mode, and one end, far away from the first connecting rod (11), of the second connecting rod (12) is connected with a placing block (13) through pin shafts in a rotating mode;
the water flow filtering assembly comprises a filter screen (45), a lifting block (50) is slidably connected in the middle of the rear side of the left end face of the inner cavity wall of the cleaning box (1), a third sliding rod (49) is fixedly connected to the right end face of the lifting block (50), a lifting rod (51) is slidably connected to the third sliding rod (49), and a hairbrush plate (52) is fixedly connected to the lower end face of the lifting rod (51).
2. The wafer cleaning device according to claim 1, wherein a gear ring (4) is rotationally connected to the inner side of the fixing ring (9), a guide post (5) is embedded in the middle of the left end of the gear ring (4) through a groove and is slidably connected with the gear ring, a threaded block (6) is fixedly connected to the lower end face of the guide post (5), a first threaded rod (7) is in threaded connection with the middle of the threaded block (6), the front end and the rear end of the first threaded rod (7) are rotationally connected to a through hole plate (55), a first gear (10) is fixedly connected to the joint of the first connecting rod (11) and the mounting block (8) on any side through a pin shaft, and the first gear (10) is meshed with the gear ring (4).
3. The wafer cleaning device according to claim 1, wherein the middle part of the lower end of the placing block (13) is rotationally connected with a rotating block (19) through a pin shaft, the middle part of the placing block (13) is slidably connected with a pressing block (18) through a groove, the pressing block (18) is in threaded connection with a second threaded rod (21), the upper end and the lower end of the second threaded rod (21) are rotationally connected with the placing block (13), the upper end of the second threaded rod (21) is sleeved with and fixedly connected with a worm wheel (16), the upper ends of the placing block (13) are rotationally connected with a first bump rod (20), the upper ends of the placing block (13) are rotationally connected with a first groove cylinder (14) at the front side and the rear side, the first groove cylinder (14) and the first bump rod (20) are in plug-in connection through a key groove, the two parts can also relatively slide when simultaneously rotating, the left side and the rear end of the first bump rod (20) and the rear side and the front side are both the right end of the first groove cylinder (14), worm wheels (15) are respectively arranged on the first groove cylinder (14), the worm wheels (15) are rotationally connected with the front side bevel gear (17) and the two adjacent bevel gears (17).
4. The wafer cleaning device according to claim 1, wherein a double-shaft motor (36) is fixedly connected to the middle part of the rear side of the upper end face of the through hole plate (55), a second crank (34) is fixedly connected to the rear side output end of the double-shaft motor (36) through a pin shaft, a second rectangular block (35) is rotatably connected to the upper end of the second crank (34) through a pin shaft, the second rectangular block (35) is embedded in the reciprocating plate (33) through a groove and is slidably connected with the reciprocating plate, a gear (30) and a first crank (28) are rotatably connected to the rear side lower end of the reciprocating plate (33) through a pin shaft, a sliding plate (31) is rotatably connected to the gear (30) through a pin shaft, the lower end of the sliding plate (31) is slidably connected to the cleaning box (1) through a groove, a rack (32) is fixedly connected to the rear side of the upper end face of the through hole plate (55), the rack (32) is meshed with the gear (30) through a pin shaft, a first rectangular block (29) is rotatably connected to the left side of the upper end of the first crank (28) through a pin shaft, and the first rectangular block (29) is embedded in the groove and is connected to the sliding groove (27) through the sliding groove and is fixedly connected to the sliding groove (27).
5. The wafer cleaning device according to claim 1, wherein a hose (3) is communicated with the middle part of the upper end of the water outlet pipe (22), a plurality of nozzles are arranged on the upper side and the lower side of the water outlet pipe (22), the nozzles on the upper side and the lower side face each other, a water pump (2) is communicated with the lower end of the hose (3), and the water inlet end of the water pump (2) is communicated with the bottom of the cleaning box (1).
6. The wafer cleaning device according to claim 1, wherein a pushing component for pushing the wafer is further arranged on the placement block (13) at the rear side, the pushing component comprises an L-shaped rod (37), the lower end of the rear side of the L-shaped rod (37) is fixedly connected to the placement block (13), the left end and the right end of the front side of the L-shaped rod (37) are respectively and rotatably connected with a third connecting rod (39) through a second bump rod (38) and a pin shaft, the upper end of the third connecting rod (39) is rotatably connected with a rectangular block (42) through the pin shaft, the left end and the right end of the rectangular block (42) are both slidably connected with a second sliding rod (41), the lower end face of the second sliding rod (41) is fixedly connected with a pushing plate (40), the lower end of the second sliding rod (41) at the left side is sleeved with a spring (44), the upper end of the spring (44) is fixedly connected with the rectangular block (42), the lower end of the spring (44) is fixedly connected with the pushing plate (40), the upper end of the second bump rod (38) is slidably connected with a second groove (43), and the lower end of the second groove (43) is fixedly connected with the front end of the second groove (36).
7. The wafer cleaning device according to claim 1, wherein the left end and the right end of the lower side of the rear end face of the inner cavity wall of the cleaning box (1) are respectively connected with a second sprocket (48) through a pin shaft in a rotating mode, the second sprocket (48) is connected with a second chain (47) in a meshed mode, and the middle portion of the lower end of the second chain (47) is connected with a lifting rod (51) in a rotating mode through a pin shaft.
8. The wafer cleaning device according to claim 1, wherein a collecting box (46) is mounted in the middle of the left end face of the inner cavity wall of the cleaning box (1) through a bolt, and filtering holes with the same specification as a filtering net (45) are formed in the bottom of the collecting box (46).
9. The wafer cleaning device according to claim 7, further comprising a first sprocket (24), wherein a third sprocket (54) is fixedly connected to a joint of the second sprocket (48) and the cleaning tank (1) through a pin shaft, a middle part of the left side of the rear end of the cleaning tank (1) is rotatably connected with the third sprocket (54) through a pin shaft, the third sprocket (54) is meshed with a third chain (53), the first sprocket (24) on the left is fixedly connected with the third sprocket (54) through a pin shaft, and the first sprocket (24) on the right is sleeved and fixedly connected with the second groove drum (43).
10. A wafer cleaning apparatus according to claim 1, characterized in that the through-hole plate (55) is provided with a plurality of through-holes for water flow.
CN202311344036.7A 2023-10-17 2023-10-17 Wafer cleaning device Pending CN117334606A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311344036.7A CN117334606A (en) 2023-10-17 2023-10-17 Wafer cleaning device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311344036.7A CN117334606A (en) 2023-10-17 2023-10-17 Wafer cleaning device

Publications (1)

Publication Number Publication Date
CN117334606A true CN117334606A (en) 2024-01-02

Family

ID=89276976

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311344036.7A Pending CN117334606A (en) 2023-10-17 2023-10-17 Wafer cleaning device

Country Status (1)

Country Link
CN (1) CN117334606A (en)

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