CN117278921A - Speaker module and electronic equipment - Google Patents

Speaker module and electronic equipment Download PDF

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Publication number
CN117278921A
CN117278921A CN202311438027.4A CN202311438027A CN117278921A CN 117278921 A CN117278921 A CN 117278921A CN 202311438027 A CN202311438027 A CN 202311438027A CN 117278921 A CN117278921 A CN 117278921A
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CN
China
Prior art keywords
sound
groove
speaker module
middle plate
channel
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Granted
Application number
CN202311438027.4A
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Chinese (zh)
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CN117278921B (en
Inventor
吴江
石伟杰
王传果
张羽
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Honor Device Co Ltd
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Honor Device Co Ltd
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Priority to CN202311438027.4A priority Critical patent/CN117278921B/en
Publication of CN117278921A publication Critical patent/CN117278921A/en
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Publication of CN117278921B publication Critical patent/CN117278921B/en
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Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00Loudspeakers
    • H04R2400/11Aspects regarding the frame of loudspeaker transducers

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

The application discloses speaker module and electronic equipment, including casing and sound generating unit. The housing has an interior cavity, an acoustic output channel, and an inverter channel. The sound generating unit is arranged in the inner cavity, and the shell and the sound generating unit are enclosed on two opposite sides of the sound generating unit to form a front sound cavity and a rear sound cavity. The front sound cavity is communicated with the sound outlet channel, the rear sound cavity is communicated with the sound outlet channel through the phase inversion channel, and the phase inversion channel is used for guiding out sound waves radiated by the rear sound cavity into the sound outlet channel so as to be mutually overlapped with the sound waves radiated by the front sound cavity. The loudspeaker module that this application provided, its phase inversion passageway is by casing direct shaping, need not to increase alone the phase inversion pipe among the similar correlation technique to can save phase inversion pipe and be used for fixed mounting phase inversion pipe's spare part, and then simplified loudspeaker module's overall structure, make loudspeaker module can satisfy the requirement of frivolous and miniaturized.

Description

Speaker module and electronic equipment
Technical Field
The present application relates to the technical field of speakers, and more particularly, to a speaker module and an electronic device.
Background
In addition to the speaker modules, box-type speakers generally have inverter tubes for enhancing sound effects. The inverter tube can utilize sound waves of the loudspeaker module in the front and the back, so that the sound effect of the loudspeaker box is improved.
In order to improve the performance of speakers on electronic devices such as cell phones, tablet computers, notebook computers, etc., the industry is currently also considering the combination of the inverter tubes of box-type speakers with speaker modules on such electronic devices. However, as the current electronic devices generally develop in the direction of light weight and miniaturization, the space inside the electronic devices is smaller, so that the overall size of the speaker module is limited, and thus a sufficient layout space cannot be provided for the inverter tube structure.
Disclosure of Invention
An object of the present application is to provide a speaker module and electronic equipment, through directly shaping be used for improving the phase inversion passageway of speaker sound effect on the casing to reduced spare part quantity, simplified the structure, made the speaker module can satisfy the development requirement of frivolous and miniaturization of electronic equipment.
In a first aspect, the present application provides a speaker module including a housing and a sound generating unit.
The housing has an interior cavity, an acoustic output channel, and an inverter channel.
The sound generating unit is arranged in the inner cavity, and the shell and the sound generating unit are enclosed on two opposite sides of the sound generating unit to form a front sound cavity and a rear sound cavity.
The front sound cavity is communicated with the sound outlet channel, the rear sound cavity is communicated with the sound outlet channel through the phase inversion channel, and the phase inversion channel is used for guiding out sound waves radiated by the rear sound cavity into the sound outlet channel so as to be mutually overlapped with the sound waves radiated by the front sound cavity.
The utility model provides a speaker module, its sound production unit is when sound cavity radiation sound wave forward, sound production unit's rear also can be to sound cavity radiation sound wave backward, be linked together back sound cavity and play sound passageway through setting up the phase inversion passageway, make the phase inversion passageway collect the sound wave that sound production unit was radiated to sound cavity backward and utilized, and adjust the sound wave phase place that is in it to the sound wave phase place unanimity with preceding sound cavity, retransmission is to going out in the sound passageway, simultaneously in the sound wave that the sound cavity sent has also got into play sound passageway, the sound wave of two sets of same phases overlaps each other in play sound passageway, make the sound effect that sends out from play sound passageway obtain strengthening, especially the listening to feel of low frequency band obtains showing the reinforcing, and then the bass effect of speaker module has been improved.
The sound outlet channel and the phase inversion channel are also communicated with the back sound cavity and the outside, so that the loudspeaker module can realize heat dissipation and air pressure adjustment of the back sound cavity through the sound outlet channel and the phase inversion channel, and a pressure release pore canal which is communicated with the back sound cavity and the outside is not required to be additionally arranged.
In addition, the phase inversion channel can be directly formed in the shell by laser etching, chemical solution etching and the like; or drilling by adopting a numerical control machine tool, and directly machining and forming the inside of the shell; or, designing the shell into a form of disassembling and assembling, adopting a numerical control machine tool to grind, cut, drill, turn, mill and the like on the surface of the shell part to form corresponding grooves, and then enclosing the shell part after assembling and forming to form a phase inversion channel; or, the shell part can be integrally formed through an injection molding process or through a 3D printing technology, corresponding grooves are directly formed, and then the shell part is assembled and formed to form the phase inversion channel in a surrounding mode.
In either case, the inverter channels in the present application are formed directly from the housing or spliced from the housing, and there is no need to separately add inverter tubes in the related art, so that the inverter tubes and parts for fixedly mounting the inverter tubes can be omitted, and the hardware structure of the speaker module is simplified, so that the overall appearance of the speaker module is compact, and the development requirements of lightening and miniaturization of electronic devices can be satisfied.
In addition, because the phase inversion channel in this application is by the direct shaping of casing, does not use the phase inversion pipe that is split type structure with the casing, so can avoid easily producing the problem of deformation and vibration because phase inversion pipe self intensity or installation intensity defect cause, compare the phase inversion pipe, the phase inversion channel in this application can reduce acoustic energy loss, can stop the abnormal sound that phase inversion pipe vibration brought, ensured the sound effect of speaker module.
In one possible design, the housing includes a first housing piece, a second housing piece, and a third housing piece;
the first shell comprises a first middle plate and a first frame which is arranged around the first middle plate in a circle, the second shell and the third shell are arranged on two opposite sides of the first middle plate, and the second shell, the first frame and the first middle plate are enclosed to form the inner cavity.
In one possible design, the first middle plate is provided with a first groove, a notch edge of the first groove is in sealing connection with the sounding unit, a groove wall of the first groove and the sounding unit are enclosed to form the front sound cavity, and the second shell piece, the first frame, the first middle plate and the sounding unit are enclosed to form the rear sound cavity.
In one possible design, the first middle plate is provided with a second groove, the notch edge of the second groove is in sealing connection with the third shell, and the groove wall of the second groove and the third shell are enclosed to form the phase inversion channel.
In one possible design, the second groove is arranged in a meandering manner.
In one possible design, the bottom wall of the second tank is provided with a first through hole that communicates the inverter channel with the rear sound cavity.
In one possible design, the hole axis of the first through hole is perpendicular to the plane of the bottom wall of the second groove.
In one possible design, the first middle plate and the first frame are provided with a third groove, the notch edge of the third groove is in sealing connection with the third shell, and the groove wall of the third groove and the third shell enclose to form the sound outlet channel.
In one possible design, the bottom wall of the third groove is provided with a second through hole which communicates the sound outlet channel with the front sound cavity.
In one possible design, the hole axis of the second through hole is perpendicular to the plane of the bottom wall of the third groove.
In one possible design, the groove side wall of the third groove is provided with a first notch that communicates the inverter channel with the sound outlet channel.
In one possible design, the third groove includes a sound amplifying region and a sound mixing region, the sound amplifying region includes a narrow-mouth end and a flared end, the flared end is connected with the sound mixing region, and a cross section of the sound amplifying region gradually increases from the narrow-mouth end toward the flared end.
In one possible design, the first notch and the flared end are located on the same side groove wall of the sound mixing region.
In one possible design, the first middle plate is provided with a limiting structure for limiting the sound generating unit.
In one possible design, the housing includes a fourth housing piece and a fifth housing piece;
the fourth shell comprises a middle plate component and a second frame which is arranged around the middle plate component in a circle, the fifth shell covers the second frame, and the fifth shell, the second frame and the middle plate component are enclosed to form the inner cavity.
In one possible design, the middle plate component is provided with a fourth groove, a notch edge of the fourth groove is in sealing connection with the sounding unit, a groove wall of the fourth groove and the sounding unit are enclosed to form the front sound cavity, and the fifth shell component, the second frame, the middle plate component and the sounding unit are enclosed to form the rear sound cavity.
In one possible design, the middle plate assembly includes a second middle plate and a cover plate, the second middle plate is provided with the fourth groove, a fifth groove is further provided at a position adjacent to the fourth groove, a notch edge of the fifth groove is in sealing connection with the cover plate, and a groove wall of the fifth groove and the cover plate enclose to form the phase inversion channel.
In one possible design, the fifth slot is arranged in a meandering manner.
In one possible design, the cover plate has a second notch that communicates the inverter channel with the rear acoustic cavity.
In one possible design, the second frame is provided with a sixth groove for forming the sound outlet channel, and a groove wall of the sixth groove is provided with a fourth through hole communicated with the front sound cavity and a fifth through hole communicated with the phase inversion channel.
In one possible design, the fourth and fifth through holes are located on the same side slot wall as the sixth slot.
In one possible design, the surface of the second frame having the sixth groove is gradually inclined outward from the second middle plate toward the fifth housing member.
In one possible design, the sixth slot is gradually inclined from the second middle plate to the direction of the fifth housing member.
In a second aspect, the present application further provides an electronic device, including the speaker module set described in any one of the above.
The electronic equipment provided by the application has any one of the loudspeaker modules, and the phase inversion channel of the loudspeaker module is formed by the shell directly without separately adding the phase inversion tube similar to the phase inversion tube in the related technology, so that the phase inversion tube and parts for fixedly mounting the phase inversion tube can be omitted, the integral structure of the loudspeaker module is further simplified, the loudspeaker module can meet the requirements of light weight and miniaturization, and the manufacturing cost of the loudspeaker module and even the electronic equipment is reduced. In addition, because the phase inversion channel in this application is by the direct shaping of casing, does not use the phase inversion pipe that is split type structure with the casing, so can avoid easily producing the problem of deformation and vibration because phase inversion pipe self intensity or installation intensity defect cause, compare the phase inversion pipe, the phase inversion channel in this application can reduce acoustic energy loss, can stop the abnormal sound that phase inversion pipe vibration brought, ensured the sound effect of speaker module on the electronic equipment.
Drawings
Fig. 1 is a schematic back view of an example of a smart phone according to an embodiment of the present application;
FIG. 2 is a schematic front view of the smartphone of FIG. 1;
FIG. 3 is an exploded view of the smartphone of FIG. 1;
FIG. 4 is an exploded view of the smartphone of FIG. 2;
fig. 5 is a perspective view of a smart phone provided in an embodiment of the present application;
FIG. 6 is a cross-sectional view of A-A of FIG. 5;
fig. 7 is an enlarged view at C in fig. 6;
FIG. 8 is a cross-sectional view of B-B in FIG. 5;
fig. 9 is an enlarged view of D in fig. 8;
fig. 10 is an enlarged view at E in fig. 3;
fig. 11 is an enlarged view at F in fig. 4;
fig. 12 is a schematic back view of another example of a smart phone according to an embodiment of the present disclosure;
fig. 13 is a schematic diagram of a speaker module according to an embodiment of the present disclosure;
fig. 14 is an exploded view of the speaker module of fig. 13;
fig. 15 is a perspective view of a speaker module provided in an embodiment of the present application;
FIG. 16 is a cross-sectional view of G-G of FIG. 15;
FIG. 17 is a cross-sectional view of H-H of FIG. 15;
FIG. 18 is a cross-sectional view of a second midplane provided by an embodiment of the application;
FIG. 19 is a schematic view of a fourth housing member and sound emitting unit provided in an embodiment of the present application;
fig. 20 is an assembled schematic diagram of a speaker module and a housing provided in the present application.
Reference numerals:
10. a housing; 11. an inner cavity; 111. a front sound cavity; 112. a rear sound cavity; 12. a sound outlet channel; 13. a phase inversion channel;
14. A first housing member; 141. a first middle plate; 142. a first frame; 143. a first groove; 144. a limit structure; 145. a second groove; 146. a first through hole; 147. a third groove; 147a, a sound amplifying region; 147b, a sound mixing region; 147c, a narrow mouth end; 147d, flared end; 148. a second through hole; 149. a first notch;
15. a second housing member; 16. a third housing member; 17. a fourth housing member; 18. a fifth housing member;
171. a middle plate assembly; 171a, a second middle plate; 171b, cover plate; 172. a second frame; 173. a fourth groove; 174. a fifth groove; 175. a second notch; 176. a sixth groove; 177. a fourth through hole; 178. a fifth through hole;
20. a sound generating unit; 21. sealing glue; 22. a breathable barrier;
100. a speaker module; 200. a housing; 201. and a sound outlet hole.
Detailed Description
The following is an exemplary description of relevant content that may be relevant to embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In the description of the present application, it should be understood that the terms "upper," "lower," "side," "inner," "outer," "top," "bottom," and the like indicate an orientation or positional relationship based on installation, and are merely for convenience of description and to simplify the description, rather than to indicate or imply that the devices or elements being referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application.
It should be further noted that, in the embodiments of the present application, the same reference numerals denote the same components or the same parts, and for the same parts in the embodiments of the present application, reference numerals may be given to only one of the parts or the parts in the drawings by way of example, and it should be understood that, for other same parts or parts, the reference numerals are equally applicable.
In the description of the present application, it should be noted that the term "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone.
The speaker module is used for restoring audio electric signals such as music, voice and the like into sound, and is widely applied to electronic equipment such as sound equipment, mobile phones, tablet computers and the like.
The loudspeaker module mainly comprises a magnetic circuit structure, a voice coil, a vibrating diaphragm bracket and other parts. The magnetic circuit structure is used for generating a constant magnetic field, and the constant magnetic field means that the field intensity at any position does not change along with time in the magnetic field generated by the magnetic circuit structure. The voice coil is arranged in the constant magnetic field, and after the voice coil is electrified with current decoded by the audio signal, the voice coil generates regular motion under the action of ampere force in the magnetic field.
In addition to the speaker modules, box-type speakers generally have inverter tubes for enhancing sound effects. The working principle of the phase inversion tube is as follows: the back sound cavity of the box-type sound box is communicated with the outside through the phase inversion tube, the size and the hole shape of the phase inversion tube are adjusted to change the sound wave phase of the back sound cavity, the back sound wave is conducted to the front side of the sound box, and the back sound wave and the front sound wave are mutually overlapped and enhanced and then accepted by a user, so that the sound waves of the front side and the back side of the loudspeaker module are utilized, the sound quality of the sound box is improved, particularly, the low-frequency components are effectively increased, and the low-frequency sound effect of the sound box is improved.
In order to improve the performance of speakers on electronic devices such as mobile phones, tablet computers, notebook computers, and the like, the current industry is also considering the combination of a phase inversion tube of a box-type sound with a speaker module on such electronic devices, but since the current electronic devices generally develop towards the direction of light weight and miniaturization, the internal space of the current electronic devices is smaller, so that the overall size of the speaker module is limited, and further, sufficient layout space cannot be provided for the phase inversion tube structure.
Therefore, how to improve the sound effect of the speaker module in a limited space is one of the problems to be solved in the current industry.
In view of this, the embodiment of the application provides a speaker module and electronic equipment, through directly shaping be used for improving the phase inversion passageway of speaker sound effect on the casing to reduced spare part quantity, simplified the structure, made the speaker module can satisfy the development requirement of frivolousness and miniaturization of electronic equipment.
The embodiment of the application firstly provides an electronic device, which can be also called a mobile device, a terminal device mobile terminal or a terminal. Including but not limited to a handheld device, an in-vehicle device, a wearable device, a computing device, or other processing device connected to a wireless modem. For example, the electronic device may include a smart watch (smart watch), a smart bracelet (smart wstband), a smart phone (smart phone), an earphone (ear), a personal digital assistant (personal digital assistant, PDA) computer, a tablet, a notebook, a car-mounted computer, smart glasses (smart glasses), a pedometer (pedometer), an intercom (two way radio), and other electronic devices having speaker modules and requiring an acoustic optimization design of the speaker modules.
In order to more conveniently illustrate the electronic device provided in the embodiments of the present application, by way of example, but not by way of limitation, the technical solution of the present application will be described in detail below by taking the electronic device as an example of a smart phone.
Fig. 1 is a schematic back view of an example of a smart phone according to an embodiment of the present application. Fig. 2 is a schematic front view of the smartphone of fig. 1.
As shown in fig. 1-2, the smart phone provided in the embodiment of the present application includes a display screen and a casing 200, where the casing 200 further includes a middle frame and a rear cover. The middle frame is of a hollow ring-shaped structure, the front end face of the middle frame is fixedly provided with a display screen, and the rear end face of the middle frame is fixedly provided with a rear cover. The display screen, the middle frame and the rear cover together define a receiving space of the smart phone, where the receiving space is used for installing various functional elements of the smart phone, such as the speaker module 100 and other functional elements such as a battery, a microphone, and a processor in the embodiment described below.
In the embodiment of the application, the cross-sectional shape of the middle frame (corresponding to the shapes of the display screen and the rear cover) is rectangular, square, racetrack-shaped, oval or the like. The middle frame provides mechanical support and protection for the whole intelligent mobile phone, and is made of materials with enough hardness, and the materials for forming the middle frame can be stainless steel, ceramics, titanium alloy, aluminum alloy, copper alloy or hard plastic.
The rear cover is covered on the rear end face of the middle frame, and can be made of stainless steel, titanium alloy, glass, ceramics, aluminum alloy, copper alloy, plastics and other materials.
Optionally, the rear cover can be covered on the middle frame in a threaded connection, a clamping connection and other modes, and a sealing ring can be arranged between the rear cover and the middle frame so as to improve the sealing waterproof effect of the joint of the rear cover and the middle frame. The seal ring may be formed of a highly elastic material such as silicone or rubber.
Alternatively, the rear cover and the middle frame may be bonded by a sealant 21 such as a double-sided tape, a cured adhesive, etc., so that the rear cover and the middle frame are bonded while sealing and waterproof effects are also achieved.
Optionally, the speaker module 100 and the smart phone provided in the embodiments of the present application, the housing 10 of the speaker module 100 and the display screen and the casing 200 of the smart phone may be assembled. For example, the speaker module 100 has its own independent housing 10 (e.g., the fourth housing member 17 and the fifth housing member 18 in the embodiment described below), and the housing 10 of the speaker module 100 is connected to the casing 200 of the smart phone by means of an adhesive, a bolt, a fastening structure, a socket structure, or the like.
Optionally, the speaker module 100 and the smart phone provided in the embodiments of the present application, the housing 10 of the speaker module 100 and the display screen and the housing 200 of the smart phone may also be an integral structure. For example, fig. 3 is an exploded view of the smart phone in fig. 1, fig. 4 is an exploded view of the smart phone in fig. 2, and as shown in fig. 3 to fig. 4, the housing 10 of the speaker module 100 includes a first housing member 14, a second housing member 15, and a third housing member 16, and the middle frame of the smart phone and the first housing member 14 are integrally configured, that is, the middle frame of the smart phone directly forms the first housing member 14 of the speaker module 100; the rear cover of the smart phone and the second housing 15 are arranged as an integral structure, that is, the rear cover of the smart phone is directly formed as the second housing 15 of the speaker module 100; the display screen of the smart phone and the third housing member 16 are provided as an integral structure, so to speak, the display screen of the smart phone directly constitutes the third housing member 16 of the speaker module 100.
In addition, the smart phone may further include: processor, universal serial bus (universal serial bus, USB) interface, charge management module, power management module, battery, microphone, mobile communication module, antenna, wireless communication module, audio module, earphone interface, sensor module, keys, camera, user identification module (subscriber identificationmodule, SIM) card interface, etc.
These functional elements may be modified according to the needs of the user, and it is to be understood that the specific embodiment described above is only one specific implementation of the present application, and other ways that may implement the solution of the present application are also the scope of protection of the present application, which is not described herein.
The speaker module 100 provided in the present application will now be described in detail with reference to the accompanying drawings.
Fig. 5 is a perspective view of a smart phone provided in an embodiment of the present application. Fig. 6 is a cross-sectional view of A-A in fig. 5. Fig. 7 is an enlarged view at C in fig. 6. Fig. 8 is a cross-sectional view of B-B in fig. 5. Fig. 9 is an enlarged view at D in fig. 8.
As shown in fig. 5 to 9, a speaker module 100 according to an embodiment of the present application includes a housing 10 and a sound generating unit 20.
The sound generating unit 20 is mainly composed of a voice coil, a diaphragm and a magnetic circuit structure. The magnetic circuit structure comprises a central magnet and a plurality of side magnets arranged around the central magnet. The magnetic circuit structure may also have only a central magnet.
Alternatively, the number of the side magnets is not limited, and may be two or four, or more than four, which are disposed opposite to each other, and may be disposed around the center magnet in a ring shape.
The side magnets and the central magnet are arranged at intervals to form a magnetic gap, the voice coil is suspended in the magnetic gap, and after the voice coil is electrified with current decoded by the audio signal, ampere force is generated under the action of a magnetic field in the magnetic gap to drive the voice coil to form regular movement, and the voice coil drives the vibrating diaphragm to vibrate along with the regular movement of the voice coil and pushes air around the vibrating diaphragm to radiate sound waves outwards.
Optionally, an elastic buffer member such as foam is further disposed at the connection between the sound generating unit 20 and the housing 10, and the foam can play a role of buffering to prevent the sound generating unit 20 from being damaged when falling or the like occurs.
Optionally, the sound generating unit 20 may further comprise a magnetically conductive member, such as a magnetically conductive sheet or a magnetically conductive bowl. The magnetic conduction piece is used as a paramagnetic material, has the functions of changing the direction of a magnetic field, converging the magnetic field and reducing magnetic leakage in a magnetic circuit, and can enable the magnetic field to be converged in the magnetic gap more so as to strengthen the magnetic field in the magnetic gap, thereby enabling the sensitivity of the voice coil and the vibrating diaphragm to be higher.
Alternatively, the magnetic structure may be made by sintering soft magnetic powder. The soft magnetic material has the characteristics of easy magnetization and easy demagnetization.
Specifically, the soft magnetic powder material includes, but is not limited to, alloy powder materials such as ferrosilicon chromium, ferrosilicon aluminum, ferronickel molybdenum, amorphous soft magnetic, ultra-microcrystalline soft magnetic, pure iron, manganese zinc ferrite, and nickel zinc ferrite.
Alternatively, the magnetic conductive member may be made of a material including, but not limited to, a cold rolled carbon steel sheet, a ferrite stainless steel sheet, and a silicon steel sheet.
Optionally, when the magnetic conductive member is fixedly connected with the magnet, the magnet can be adhered by an adhesive, or locked by a screw, or inserted by a socket structure, or clamped by a buckle structure, or a groove is formed on the opposite surface of the magnetic conductive member to the magnet, and the magnet is embedded and fixed in the groove.
As further shown in fig. 7 and 9, the housing 10 has an inner chamber 11, an acoustic output channel 12, and an inverter channel 13.
The sounding unit 20 is disposed in the inner cavity 11, and a front sound cavity 111 and a rear sound cavity 112 are formed by enclosing the housing 10 and the sounding unit 20 on two opposite sides of the sounding unit 20.
The front sound cavity 111 is communicated with the sound outlet channel 12, the rear sound cavity 112 is communicated with the sound outlet channel 12 through the phase inversion channel 13, and the phase inversion channel 13 is used for guiding out sound waves radiated by the rear sound cavity 112 into the sound outlet channel 12 so as to be overlapped with the sound waves radiated by the front sound cavity 111.
Alternatively, the cross-sectional shape of the inverter channels 13 may be a circular, rectangular, elliptical, triangular, or other regular or irregular closed pattern. In practice, the phase of the acoustic wave can be adjusted by changing the cross-sectional shape and the channel length of the inverter channel 13.
Alternatively, the housing 10 may be a semi-closed unitary structure. Wherein, the inner cavity 11, the sound outlet channel 12 and the phase inversion channel 13 of the shell 10 can be directly processed and molded in the shell 10 by means of laser etching, chemical solution etching and the like; alternatively, drilling may be performed by using a numerical control machine (Computer Numerical Control, CNC), and the inside of the casing 10 may be directly machined and molded; alternatively, the printing device can be integrally formed by a 3D printing technology.
Alternatively, the housing 10 may also be assembled from parts. Namely, the shell 10 is designed into a form of disassembling and assembling, the surface of the shell part is processed and molded into corresponding grooves by adopting a numerical control machine tool for grinding, cutting, drilling, turning, milling and other processes, and then the shell part is assembled and molded and then is enclosed to form a channel for sound output and phase inversion; or the shell part can be integrally formed through an injection molding process or through a 3D printing technology, corresponding grooves are directly formed, and then the shell part is assembled and formed to form a channel for sound output and phase inversion. For a more detailed description, reference is made to the examples described below.
In either case, the inverter channels 13 in the embodiments of the present application are directly molded from the housing 10 or are spliced from the housing 10 without adding a separate inverter tube structure like that in the related art.
The working principle of the speaker module 100 in the embodiment of the present application is as follows.
As shown in fig. 7, wherein the arrows in fig. 7 indicate the transmission direction of the sound wave, the speaker module 100 provided in this embodiment of the present application has the sound generating unit 20 radiating the sound wave toward the front sound cavity 111, and the back of the sound generating unit 20 also radiating the sound wave toward the back sound cavity 112. As shown in fig. 9, the arrows in fig. 9 also indicate the transmission direction of the sound wave, and the back sound cavity 112 is communicated with the sound outlet channel 12 by setting the phase inversion channel 13, so that the phase inversion channel 13 collects and utilizes the sound wave radiated from the sound generating unit 20 to the back sound cavity 112, adjusts the phase of the sound wave in the phase inversion channel to be consistent with that of the sound wave in the front sound cavity 111, and transmits the sound wave into the sound outlet channel 12, meanwhile, the sound wave emitted from the front sound cavity 111 also enters the sound outlet channel 12, and the two groups of sound waves with the same phase are mutually overlapped in the sound outlet channel 12, so that the sound effect emitted from the sound outlet channel 12, particularly the hearing of the low frequency band, is remarkably enhanced, and the bass effect of the speaker module 100 is further improved.
Since the sound outlet channel 12 and the phase inversion channel 13 are also communicated with the rear sound cavity 112 and the outside, the speaker module 100 can realize the heat dissipation and the air pressure adjustment of the rear sound cavity 112 through the sound outlet channel 12 and the phase inversion channel 13, and therefore, a pressure release duct which is communicated with the rear sound cavity 112 and the outside is not required to be additionally arranged.
In addition, the inverter channel 13 in the embodiment of the present application is directly formed by the housing 10 or spliced by the housing 10, and there is no need to separately add an inverter tube similar to those in the related art, so that the inverter tube and parts for fixedly mounting the inverter tube can be omitted, and further the hardware structure of the speaker module 100 is simplified, so that the overall appearance of the speaker module 100 is compact, and the development requirements of light weight and miniaturization of electronic devices can be satisfied.
In addition, when the sound generating unit 20 radiates sound waves to the inverter tube, the coupling between the sound waves and the tube body of the inverter tube may cause the inverter tube to vibrate, if the intensity of the inverter tube is insufficient or the inverter tube is unstable, the inverter tube may shake in the electronic device, which not only causes sound energy loss, but also affects the adjustment effect of the sound wave phase, and meanwhile, if the shake amplitude is too large, the inverter tube collides with the housing 10, thereby causing abnormal sound, and further affecting the sound generating effect of the speaker module 100. Since the inverter path 13 in the embodiment of the present application is directly molded from the housing 10, the inverter tube having a separate structure from the housing 10 is not used, so that the problem of easy deformation and vibration due to the defect of the strength of the inverter tube itself or the mounting strength can be avoided. Therefore, the inverter path 13 in the embodiment of the present application can reduce acoustic energy loss, eliminate abnormal sound caused by vibration of the inverter tube, and ensure sound effect of the speaker module 100, as compared with the inverter tube.
As mentioned above, the housing 10 may be in the form of a disassembled assembly, as is the case in the embodiments described below.
As further shown in fig. 3 and 7, in one embodiment provided herein, the housing 10 includes a first housing member 14, a second housing member 15, and a third housing member 16. The first shell 14 includes a first middle plate 141 and a first frame 142 disposed around the first middle plate 141, the second shell 15 and the third shell 16 are disposed on opposite sides of the first middle plate 141, and the second shell 15, the first frame 142 and the first middle plate 141 enclose to form the inner cavity 11.
In this embodiment, the housing 10 is assembled by the first housing member 14, the second housing member 15 and the third housing member 16, and compared with the integrally formed housing 10, the assembled housing 10 in this embodiment has the advantages of less processing difficulty, lower cost, high processing efficiency and the like. The concrete implementation is as follows: the fault tolerance of the integrally formed shell 10 is low, any machining error in the machining link can possibly lead to the whole scrapping of the shell 10 blank, and in contrast to the embodiment, each shell part (the first shell part 14, the second shell part 15 and the third shell part 16) is assembled after being respectively formed, the fault tolerance is high, the scrapping of other shell parts can not be caused due to the machining error of a single shell part, the material loss can be reduced, a plurality of shell parts can be synchronously machined at different stations, and the machining and manufacturing efficiency is high.
Fig. 10 is an enlarged view at E in fig. 3.
As shown in fig. 3, 7 and 10, in one embodiment provided in the present application, a first groove 143 is disposed on a surface of the first middle plate 141 facing the second shell 15, a notch edge of the first groove 143 is connected with the sounding unit 20 in a sealing manner, a groove wall of the first groove 143 and the sounding unit 20 are enclosed to form a front sound cavity 111, and the second shell 15, the first frame 142, the first middle plate 141 and the sounding unit 20 are enclosed to form a rear sound cavity 112.
In this embodiment, the forming scheme of the front sound cavity 111 and the rear sound cavity 112 is further defined, and compared with the case where the front sound cavity 111 and the rear sound cavity 112 are directly formed in the housing 10, the forming scheme of the front sound cavity 111 and the rear sound cavity 112 by enclosing the first housing member 14, the second housing member 15 and the sound generating unit 20 is easier to implement and has lower processing and manufacturing difficulty.
Alternatively, the notch edges of the sound emitting unit 20 and the first groove 143 may be sealed by a material having elasticity such as foam, sealant, or the like.
Alternatively, the first groove 143 may be concavely formed at the surface of the first middle plate 141; alternatively, the first groove 143 may be defined by a protrusion protruding from the surface of the first middle plate 141.
In order to accurately position the installation position of the sound generating unit 20 on the first middle plate 141, as further shown in fig. 10, in one embodiment provided in the present application, the first middle plate 141 is provided with a limiting structure 144 for limiting the sound generating unit 20.
Alternatively, the limit structure 144 may be a plurality of limit blocks disposed around the notch of the first slot 143; alternatively, two spacing bars may be provided.
Alternatively, the spacing between the plurality of stoppers may be slightly smaller than the size of the sound emitting unit 20, so that the stoppers may clamp and fix the sound emitting unit 20 to the notch of the first groove 143.
Fig. 11 is an enlarged view at F in fig. 4.
As shown in fig. 4, 9 and 11, in one embodiment provided in the present application, a surface of the first middle plate 141 facing the third casing 16 is provided with a second groove 145, a notch edge of the second groove 145 is connected with the third casing 16 in a sealing manner, and a groove wall of the second groove 145 and the third casing 16 are enclosed to form the inverter channel 13.
In this embodiment, the inverter channel 13 is further defined, and the inverter channel 13 is formed by enclosing the first middle plate 141 and the third housing member 16 in this embodiment, rather than directly forming the inverter channel 13 in the housing 10.
Alternatively, the second groove 145 may be formed concavely at the surface of the first middle plate 141; alternatively, the second groove 145 may be formed by surrounding a protruding block protruding from the surface of the first middle plate 141.
Alternatively, the notch edge of the second groove 145 may be provided with a sealant 21, and is in sealing connection with the third shell 16; alternatively, the rim of the slot of the second groove 145 may be provided with a sealing ring, against which the third shell member 16 is pressed to achieve sealing of the second groove 145.
In one embodiment provided herein, the orthographic projection profile of the first slot 143 and the second slot 145 on the first middle plate 141 has no overlapping area, that is, the first slot 143 and the second slot 145 are arranged on two side surfaces of the first middle plate 141 in a staggered manner, so that the first middle plate 141 can be ensured to have relatively complete structural strength, and the problem that the local position of the first middle plate 141 is too thin due to the overlapping of the first slot 143 and the second slot 145, so that the structural strength of the first middle plate 141 is affected to easily deform, break and the like is avoided.
Alternatively, the second groove 145 may be a straight strip-like extension.
In one embodiment provided herein, the second slot 145 is circuitously disposed. For example, the second groove 145 is extended in an L-shape, a U-shape, an S-shape, a spiral shape, or the like.
In this embodiment, the second slot 145 that forms the inverter channel 13 is designed to be extended and arranged in an L-shape, a U-shape, an S-shape, a spiral shape, or the like, so that the overall structure of the second slot 145 can be compact and occupy less space when a sufficiently long sound wave passing path of the inverter channel 13 is ensured, thereby being more beneficial to being arranged on the first middle plate 141.
In addition, if the second groove 145 is L-shaped as a whole, the second groove 145 can be disposed at a corner position of the electronic device, and for example, when the electronic device is a smart phone, a case member forming the L-shaped second groove 145 can be disposed at any one of four corners of the phone, so that the internal space of the phone can be fully and reasonably utilized.
If the second slot 145 is S-shaped as a whole, the second slot 145 may be disposed in a gap between components of an electronic device, for example, when the electronic device is a notebook computer, the housing member forming the S-shaped second slot 145 may be disposed in a gap between components such as a fan module, an optical drive module, and a hard disk module, so that an internal space of the notebook computer can be fully and reasonably utilized.
If the second groove 145 is entirely spiral, since the spiral shape is always in a smooth arc shape, the second groove 145 with such a structure can smoothly propagate sound waves from one end of the inverter channel 13 to the other end, has a smaller blocking effect on the sound waves, has smaller energy loss when the sound waves propagate in the inverter channel 13, and finally has better superposition with the sound waves propagating in the front sound cavity 111, and better quality improvement on the speaker module 100.
As shown in fig. 10 and 11, in one embodiment provided herein, the groove bottom wall of the second groove 145 is provided with a first through hole 146 that communicates the inverter channel 13 with the rear sound chamber 112.
In this embodiment, a scheme of communicating the inverter channel 13 with the rear sound cavity 112 is further defined, and the inverter channel 13 is directly communicated with the rear sound cavity 112 through the first through hole 146, so that there is no need to separately add a structural member such as a communicating conduit, and the inverter channel has the advantages of simple structure, easy implementation, small occupied space and the like.
Optionally, the first through-holes 146 are provided with a breathable barrier 22 such as a breathable film, mesh, sponge sheet, etc. towards the aperture of the inverter channel 13.
The ventilation barrier 22 is mainly used to prevent foreign matters in the environment from entering the inside of the apparatus through the sound outlet channel 12 and the inverter channel 13, and can effectively protect the speaker module 100.
In one embodiment provided herein, the hole axis of the first through hole 146 is perpendicular to the plane of the bottom wall of the second groove 145.
As mentioned above, the shell parts may be integrally formed by an injection molding process, which is capable of mass production after the mold is manufactured, or by a 3D printing technique, with higher production efficiency and lower production cost. Therefore, in order to reduce the production cost of the shell parts, the first shell member 14 in this embodiment is preferably integrally formed by an injection molding process. The axis of the first through hole 146 is perpendicular to the plane of the bottom wall of the second slot 145, so that the first shell 14 can be easily injection molded, and the mold can be conveniently removed after the first through hole 146 and the second slot 145 are molded to realize demolding, so that the first shell 14 in the embodiment can be easily injection molded without designing a complicated mold structure.
As further shown in fig. 11, in an embodiment provided in the present application, the first frame 142 and the first middle plate 141 are provided with a third groove 147, a groove edge of the third groove 147 is connected with the third shell 16 in a sealing manner, and a groove wall of the third groove 147 and the third shell 16 enclose to form the sound outlet channel 12.
In the present embodiment, the forming scheme of the sound outlet channel 12 is further defined, and compared with the scheme of directly forming the sound outlet channel 12 in the housing 10, the forming scheme of the sound outlet channel 12 by enclosing the first frame 142, the first middle plate 141 and the third housing 10 is easier to implement in the present embodiment.
Alternatively, the third groove 147 may be concavely formed at the surface of the first middle plate 141; alternatively, the third groove 147 may be formed by surrounding a protruding block protruding from the surface of the first middle plate 141.
Alternatively, the notch edge of the third groove 147 may be provided with a sealant 21, and be in sealing connection with the third shell 16; alternatively, the notch edge of the third groove 147 may be provided with a sealing ring against which the third housing piece 16 is pressed to achieve sealing of the third groove 147.
As further shown in fig. 11, in one embodiment provided herein, the groove bottom wall of the third groove 147 is provided with a second through hole 148 that communicates the sound outlet passage 12 with the front sound chamber 111.
In this embodiment, the scheme of communicating the sound outlet channel 12 with the front sound cavity 111 is further defined, and the sound outlet channel 12 is directly communicated with the front sound cavity 111 through the second through hole 148, so that no structural member such as a communicating conduit is required to be separately added, and the device has the advantages of simple structure, easy implementation, small occupied space and the like.
In one embodiment provided herein, the hole axis of the second through hole 148 is perpendicular to the plane of the bottom wall of the third groove 147.
In order to reduce the production cost of the shell parts, the first shell 14 in this embodiment is preferably integrally formed by an injection molding process. The hole axis of the second through hole 148 is perpendicular to the plane of the bottom wall of the third groove 147, so that the first shell 14 can be easily injection molded, and the mold can be conveniently removed after the second through hole 148, the third groove 147 and the first groove 143 are molded to realize demolding, so that the first shell 14 in the embodiment can be easily injection molded without designing a complicated mold structure.
In one embodiment provided herein, the slot sidewall of the third slot 147 is provided with a first notch 149 that communicates the inverter channel 13 with the outlet channel 12.
In this embodiment, a scheme of communicating the inverter channel 13 with the sound outlet channel 12 is further defined, and the inverter channel 13 is directly communicated with the sound outlet channel 12 through the first notch 149, so that no structural member such as a communicating conduit is required to be separately added, and the inverter has the advantages of simple structure, easy implementation, small occupied space and the like.
As further shown in fig. 11, in one embodiment provided herein, the third groove 147 includes a flared region 147a and a mixed region 147b, the flared region 147a includes a narrow mouth end 147c and a flared end 147d, the flared end 147d is connected to the mixed region 147b, and the cross section of the flared region 147a gradually increases from the narrow mouth end 147c toward the flared end 147 d.
In this embodiment, the cross section of the sound amplifying region 147a gradually increases from the narrow opening end 147c to the flaring end 147d, so that the sound amplifying region 147a is shaped like a flaring horn, which can achieve the effect similar to that of a horn loudspeaker, further increase the air quantity of the sound outlet channel 12, improve the sound load of the loudspeaker, and improve the efficiency of the electro-acoustic conversion of the loudspeaker module 100 under the driving of the same power, so that the sound pressure level of the loudspeaker module 100 in each audio frequency band is improved, and particularly, the sound effect performance is better for the middle-low frequency band.
Alternatively, the sound-amplifying regions 147a of the third grooves 147 are all disposed on the first middle plate 141, and the sound-mixing regions 147b of the third grooves 147 are all disposed on the first frame 142; alternatively, the sound amplifying region 147a may be partially located on the first frame 142 and partially located on the first middle plate 141; alternatively, the sound mixing region 147b may be partially located on the first frame 142 and partially located on the first middle plate 141.
As further shown in fig. 11, in one embodiment provided herein, the first notch 149 and the flared end 147d are located on the same side groove wall of the mixing region 147 b.
In this embodiment, the first notch 149 and the flared end 147d are located on the same side of the groove wall of the sound mixing region 147b, so that after the sound waves of the middle and low frequency bands in the front sound cavity 111 are enhanced, the sound waves of the low frequency bands are overlapped with the sound waves in the phase inversion channel 13 in the sound mixing region 147b, thereby secondarily enhancing the sound waves of the low frequency bands and further improving the bass effect of the speaker module 100.
In addition, the first notch 149 and the flared end 147d are located on the same side groove wall of the sound mixing region 147b, so that the sound wave from the front sound cavity 111 and the sound wave from the phase inversion channel 13 can propagate in a uniform direction, two groups of sound waves can be fully overlapped with each other, overlapping dead zones of the two groups of sound waves are avoided, and maximized overlapping of the two groups of sound waves can be achieved.
Fig. 12 is a schematic back view of another example of a smart phone according to an embodiment of the present application.
As shown in fig. 12, another example of a smart phone provided in the embodiments of the present application includes a casing 200 and a speaker module 100, where the speaker module 100 is installed inside the casing 200, and a connection relationship is established between a housing 10 of the speaker module 100 and the casing 200 of an electronic device by using an assembly manner such as an adhesive, a bolt, a fastening structure, a socket structure, etc.
Fig. 13 is a schematic diagram of a speaker module 100 according to an embodiment of the present application. Fig. 14 is an exploded view of the speaker module 100 of fig. 13.
As shown in fig. 13 and 14, in one embodiment provided herein, the housing 10 includes a fourth housing member 17 and a fifth housing member 18; the fourth shell 17 includes a middle plate assembly 171, a second frame 172 disposed around the middle plate assembly 171, the fifth shell 18 covers the second frame 172, and the fifth shell 18, the second frame 172 and the middle plate assembly 171 enclose the inner cavity 11.
In this embodiment, the housing 10 is assembled by the fourth housing member 17 and the fifth housing member 18, and compared with the integrally formed housing 10, the assembled housing 10 in this embodiment has the advantages of less processing difficulty, lower cost, high processing efficiency, and the like. The concrete implementation is as follows: the fault tolerance of integrated into one piece's casing 10 is lower, and arbitrary processing error in the processing link all is likely to lead to the whole scrapping of casing 10 blank, and the contrary view this embodiment assembles after shaping respectively every shell part, and fault tolerance is higher, and the processing error of single shell part can not lead to other shell parts scrapping, can reduce material loss to a plurality of shell parts can be in the synchronous processing of different stations, and processing manufacturing's efficiency is higher.
Fig. 15 is a perspective view of a speaker module 100 provided in an embodiment of the present application. Fig. 16 is a sectional view of G-G in fig. 15.
As shown in fig. 14 to 16, in one embodiment provided in the present application, a fourth groove 173 is disposed on a surface of the middle plate assembly 171 facing the fifth shell 18, a notch edge of the fourth groove 173 is connected with the sound generating unit 20 in a sealing manner, a groove wall of the fourth groove 173 and the sound generating unit 20 enclose to form the front sound cavity 111, and the fifth shell 18, the second frame 172, the middle plate assembly 171 and the sound generating unit 20 enclose to form the rear sound cavity 112.
In the present embodiment, the forming scheme of the front sound cavity 111 and the rear sound cavity 112 is further defined, and compared with the forming scheme of the front sound cavity 111 and the rear sound cavity 112 directly in the housing 10, the forming scheme of the front sound cavity 111 by enclosing the middle plate assembly 171 and the sound generating unit 20 and the forming scheme of the rear sound cavity 112 by enclosing the fifth housing 18, the second frame 172, the middle plate assembly 171 and the sound generating unit 20 is easier to implement.
Fig. 17 is a cross-sectional view of H-H of fig. 15. Fig. 18 is a cross-sectional view of a second middle plate 171a provided in an embodiment of the present application.
As shown in fig. 14 and 17-18, in one embodiment provided in the present application, the middle plate assembly 171 includes a second middle plate 171a and a cover plate 171b, where the second middle plate 171a is provided with a fourth groove 173 and a fifth groove 174 is further provided adjacent to the fourth groove 173, a notch edge of the fifth groove 174 is in sealing connection with the cover plate 171b, and a groove wall of the fifth groove 174 and the cover plate 171b enclose to form the inverter channel 13.
In this embodiment, the molding scheme of the inverter channel 13 is further defined, and the inverter channel 13 is formed by enclosing the second middle plate 171a and the cover plate 171b in this embodiment, compared to the case where the inverter channel 13 is molded directly in the housing 10.
The working principle of the speaker module 100 in the embodiment of the present application is as follows.
As shown in fig. 16, wherein the arrows in fig. 16 indicate the transmission direction of the sound wave, the speaker module 100 provided in this embodiment of the present application has the sound generating unit 20 radiating the sound wave toward the front sound cavity 111, and the back of the sound generating unit 20 also radiating the sound wave toward the back sound cavity 112. As shown in fig. 17, the arrow in fig. 17 indicates the transmission direction of the sound wave, and the back sound cavity 112 is communicated with the sound outlet channel 12 by setting the phase inversion channel 13, so that the phase inversion channel 13 collects and utilizes the sound wave radiated from the sound generating unit 20 to the back sound cavity 112, adjusts the phase of the sound wave in the phase inversion channel to be consistent with the phase of the sound wave of the front sound cavity 111, and transmits the sound wave into the sound outlet channel 12, meanwhile, the sound wave emitted from the front sound cavity 111 also enters the sound outlet channel 12, and the two groups of sound waves with the same phase are mutually overlapped in the sound outlet channel 12, so that the sound effect emitted from the sound outlet channel 12, particularly the hearing of the low frequency band, is remarkably enhanced, and the bass effect of the speaker module 100 is further improved.
As further shown in fig. 14, in one embodiment provided herein, the fifth slot 174 is circuitously disposed. For example, the fifth groove 174 is extended in an L-shape, a U-shape, an S-shape, a spiral shape, or the like.
In this embodiment, the fifth groove 174 forming the inverter channel 13 is designed to be extended and arranged in an L-shape, a U-shape, an S-shape, a spiral shape, etc., so that the overall structure of the fifth groove 174 can be compact and occupy less space when the inverter channel 13 is ensured to have a sufficiently long sound wave passing path, thereby being more beneficial to realizing the light and thin and miniaturization of the speaker module 100.
In addition, if the fifth groove 174 is entirely spiral, the fifth groove 174 with such a structure can smoothly transmit sound waves from one end of the inverter channel 13 to the other end, has a smaller blocking effect on sound waves, has smaller energy loss when sound waves are transmitted in the inverter channel 13, and finally has better superposition with sound waves transmitted in the front sound cavity 111, and has better sound quality improvement for the speaker module 100.
As further shown in fig. 14, in one embodiment provided herein, cover plate 171b has a second notch 175 that communicates inverter channel 13 with rear cavity 112.
In this embodiment, a scheme of communicating the inverter channel 13 with the rear sound cavity 112 is further defined, and the inverter channel 13 is directly communicated with the rear sound cavity 112 through the second notch 175, so that no structural member such as a communicating conduit is required to be separately added, and the inverter channel has the advantages of simple structure, easy implementation, small occupied space and the like.
In one embodiment provided in the present application, the second frame 172 is provided with a sixth groove 176 for forming the sound outlet channel 12, and the groove wall of the sixth groove 176 is provided with a fourth through hole 177 communicating with the front sound cavity 111, and a fifth through hole 178 communicating with the inverter channel 13.
In this embodiment, the scheme of communicating the sound outlet channel 12 with the front sound cavity 111 and the sound outlet channel 12 with the inverter channel 13 is further defined, and the fourth through hole 177 communicating with the front sound cavity 111 and the fifth through hole 178 communicating with the inverter channel 13 are provided on the wall of the sixth slot 176, so that there is no need to separately add a structural member such as a communicating pipe, so that the speaker module 100 in this embodiment has the advantages of simple structure, easy implementation, small occupation, and the like.
Fig. 19 is a schematic view of a fourth housing member 17 and a sound generating unit 20 provided in an embodiment of the present application.
As shown in fig. 19, in one embodiment provided herein, the fourth through hole 177 and the fifth through hole 178 are located on the same side wall of the sixth slot 176.
In this embodiment, the positions of the fourth through hole 177 and the fifth through hole 178 are defined, so that the sound wave coming out of the front sound cavity 111 and the sound wave coming out of the inverter channel 13 propagate in a uniform direction, so that two sets of sound waves can be fully overlapped with each other, a blind area of overlapping of the two sets of sound waves is avoided, and sound waves received by a user are enhanced.
As further shown in fig. 16-17, in one embodiment provided herein, the surface of the second rim 172 having the sixth groove 176 therein is gradually sloped outwardly from the second middle plate 171a toward the fifth housing member 18.
The direction of the second middle plate 171a toward the fifth housing member 18 may also be understood as the Z direction as shown in fig. 16 to 17. The surface of the second frame 172 having the sixth groove 176 is gradually inclined outward, and it can be also understood that the surface of the sixth groove 176 is gradually inclined in the X direction as shown in fig. 16 to 17.
In the present embodiment, the surface of the second frame 172 having the sixth groove 176 is designed to be inclined, mainly for facilitating the sealing and mounting of the speaker module 100 inside the electronic device, for the following reasons.
Fig. 20 is an assembly schematic diagram of the speaker module 100 and the enclosure 200 provided in the present application. Wherein (a) in fig. 20 is a schematic view when the speaker module 100 and the cabinet 200 are not assembled together; fig. 20 (b) is a schematic diagram of the speaker module 100 and the cabinet 200 assembled together.
As shown in fig. 20 (a), an air-permeable blocking member 22, such as foam, needs to be added in the casing 200 at the position corresponding to the sound outlet hole 201 of the sound outlet channel 12, so as to ensure sealing between the sound outlet channel 12 of the speaker module 100 and the sound outlet hole 201 of the casing 200, and in addition, prevent foreign objects from entering the sound outlet channel 12. Because the surface of the sixth slot 176 is designed to be inclined outwards, so that the speaker module 100 is in a shape of 'small bottom and big top', when the speaker module 100 is installed, the speaker module 100 is inserted into the installation slot on the casing 200 from top to bottom, the size of the lower side (or the insertion end) of the speaker module 100 is slightly smaller, the downward extrusion effect on the air-permeable barrier 22 can be reduced, and thus the situation that the air-permeable barrier 22 is folded and deformed can be avoided, and the air-permeable barrier 22 can be arranged in a gap between the surface of the sixth slot 176 and the casing 200 in a preset posture. As shown in fig. 20 (b), after the speaker module 100 is completely inserted into the mounting groove, the ventilation blocking member 22 is reset and fills the gap between the face of the sixth groove 176 and the cabinet 200 sufficiently to ensure sealing between the sound outlet channel 12 of the speaker module 100 and the sound outlet hole 201 of the cabinet 200.
Since the fourth groove 173 constituting the front sound chamber 111 and the fifth groove 174 constituting the inverter channel 13 are both provided in the second middle plate 171a, that is, biased toward the lower side of the speaker module 100, assuming that the sixth groove 176 constituting the sound outlet channel 12 extends horizontally outward, there is a large overlap area between the upper portion of the channel opening of the sound outlet channel 12 and the cabinet 200, and a small overlap area between the lower portion and the cabinet 200, the ventilation barrier 22 cannot form substantially the same sealing surface at the channel opening of the sound outlet channel 12, that is, the sealing effect below the channel opening of the sound outlet channel 12 is poor.
Accordingly, in order to solve the above-described problem, as shown in fig. 16 to 17, in an embodiment provided in the present application, the sixth groove 176 is gradually inclined from the second middle plate 171a toward the fifth housing member 18.
The direction of the second middle plate 171a toward the fifth housing member 18 may also be understood as the Z direction as shown in fig. 16 to 17. The sixth groove 176 is gradually inclined in the direction of the fifth housing member 18, and it can also be understood that the sixth groove 176 is gradually inclined in the Z direction as shown in fig. 16 to 17.
In this embodiment, the channel opening of the sound outlet channel 12 and the casing 200 have substantially the same overlapping area, so that substantially the same sealing surface can be formed at the upper and lower positions of the channel opening of the sound outlet channel 12, as shown in fig. 20 (b), the ventilation barrier 22 has substantially the same sealing surface at the upper and lower positions of the channel opening of the sound outlet channel 12, so that the sealing effect of the upper and lower sides of the channel opening of the sound outlet channel 12 is the same, and the sealing effect of the ventilation barrier 22 can be fully exerted.
Finally, it should be noted that: the foregoing is merely a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any changes or substitutions within the technical scope of the present disclosure should be covered in the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (24)

1. A loudspeaker module characterized by comprising a housing (10) and a sound generating unit (20):
the shell (10) is provided with an inner cavity (11), an audio output channel (12) and a phase inversion channel (13);
the sound generating unit (20) is arranged in the inner cavity (11), and a front sound cavity (111) and a rear sound cavity (112) are formed by enclosing the shell (10) and the sound generating unit (20) at two opposite sides of the sound generating unit (20);
the front sound cavity (111) is communicated with the sound outlet channel (12), the rear sound cavity (112) is communicated with the sound outlet channel (12) through the phase inversion channel (13), and the phase inversion channel (13) is used for guiding out sound waves radiated by the rear sound cavity (112) into the sound outlet channel (12) so as to be overlapped with the sound waves radiated by the front sound cavity (111).
2. The speaker module according to claim 1, wherein the housing (10) comprises a first housing part (14), a second housing part (15) and a third housing part (16);
the first shell (14) comprises a first middle plate (141) and a first frame (142) which is arranged around the first middle plate (141) in a circle, the second shell (15) and the third shell (16) are arranged on two opposite sides of the first middle plate (141), and the second shell (15), the first frame (142) and the first middle plate (141) are enclosed to form the inner cavity (11).
3. The speaker module according to claim 2, wherein the first middle plate (141) is provided with a first groove (143), a notch edge of the first groove (143) is in sealing connection with the sound generating unit (20), a groove wall of the first groove (143) and the sound generating unit (20) are enclosed to form the front sound cavity (111), and the second shell (15), the first frame (142), the first middle plate (141) and the sound generating unit (20) are enclosed to form the rear sound cavity (112).
4. A loudspeaker module according to claim 2 or 3, wherein the first middle plate (141) is provided with a second groove (145), a groove edge of the second groove (145) is in sealing connection with the third housing part (16), and a groove wall of the second groove (145) and the third housing part (16) enclose to form the inverter channel (13).
5. The speaker module according to claim 4, wherein the second slot (145) is arranged curvingly.
6. The speaker module according to claim 4, wherein a bottom wall of the second groove (145) is provided with a first through hole (146) that communicates the inverter channel (13) with the rear sound chamber (112).
7. The speaker module according to claim 6, wherein the hole axis of the first through hole (146) is perpendicular to the plane of the groove bottom wall of the second groove (145).
8. The speaker module according to any one of claims 2-3, 5-7, wherein the first middle plate (141) and the first frame (142) are provided with a third groove (147), a groove opening edge of the third groove (147) is in sealing connection with the third shell (16), and a groove wall of the third groove (147) and the third shell (16) enclose to form the sound outlet channel (12).
9. The speaker module according to claim 8, wherein a bottom wall of the third groove (147) is provided with a second through hole (148) that communicates the sound outlet passage (12) with the front sound chamber (111).
10. The speaker module according to claim 9, wherein the hole axis of the second through hole (148) is perpendicular to the plane of the bottom wall of the third groove (147).
11. The speaker module according to claim 8, wherein a groove side wall of the third groove (147) is provided with a first notch (149) that communicates the inverter channel (13) with the sound outlet channel (12).
12. The speaker module according to claim 11, wherein the third groove (147) comprises a sound amplifying region (147 a) and a sound mixing region (147 b), the sound amplifying region (147 a) comprises a narrow-mouth end (147 c) and a flared end (147 d), the flared end (147 d) is connected to the sound mixing region (147 b), and a cross section of the sound amplifying region (147 a) gradually increases from the narrow-mouth end (147 c) toward the flared end (147 d).
13. The speaker module according to claim 12, wherein the first notch (149) and the flared end (147 d) are located on a same side groove wall of the sound mixing region (147 b).
14. A loudspeaker module according to claim 3, wherein the first middle plate (141) is provided with a limiting structure (144) for limiting the sound generating unit (20).
15. The speaker module according to claim 1, wherein the housing (10) comprises a fourth housing part (17) and a fifth housing part (18);
the fourth shell (17) comprises a middle plate component (171) and a second frame (172) which is arranged around the middle plate component (171) in a circle, the fifth shell (18) covers the second frame (172), and the fifth shell (18), the second frame (172) and the middle plate component (171) are enclosed to form the inner cavity (11).
16. The speaker module according to claim 15, wherein the middle plate assembly (171) is provided with a fourth groove (173), a notch edge of the fourth groove (173) is in sealing connection with the sound generating unit (20), a groove wall of the fourth groove (173) forms the front sound cavity (111) with the sound generating unit (20), and the fifth shell (18), the second frame (172), the middle plate assembly (171) and the sound generating unit (20) form the rear sound cavity (112).
17. The speaker module according to claim 16, wherein the middle plate assembly (171) comprises a second middle plate (171 a) and a cover plate (171 b), the second middle plate (171 a) is provided with the fourth groove (173), and a fifth groove (174) is further provided at a position adjacent to the fourth groove (173), a notch edge of the fifth groove (174) is in sealing connection with the cover plate (171 b), and a groove wall of the fifth groove (174) and the cover plate (171 b) are enclosed to form the inverter channel (13).
18. The speaker module of claim 17, wherein the fifth slot (174) is circuitously arranged.
19. The speaker module according to claim 17 or 18, wherein the cover plate (171 b) has a second cutout (175) that communicates the inverter path (13) with the rear sound chamber (112).
20. The speaker module according to claim 17 or 18, wherein the second rim (172) is provided with a sixth groove (176) for forming the sound outlet channel (12), and a groove wall of the sixth groove (176) is provided with a fourth through hole (177) communicating with the front sound chamber (111), and a fifth through hole (178) communicating with the inverter channel (13).
21. The speaker module according to claim 20, wherein the fourth through hole (177) and the fifth through hole (178) are located at a same side wall of the sixth slot (176).
22. The speaker module according to claim 20, wherein a surface of the second rim (172) having the sixth groove (176) thereon is gradually inclined outward from the second middle plate (171 a) toward the fifth housing member (18).
23. The speaker module according to claim 22, wherein the sixth groove (176) is gradually inclined toward the fifth housing member (18) from the second middle plate (171 a) toward the fifth housing member (18).
24. An electronic device comprising a speaker module (100) according to any of claims 1-23.
CN202311438027.4A 2023-11-01 2023-11-01 Electronic equipment Active CN117278921B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103491481A (en) * 2013-10-10 2014-01-01 深圳雷柏科技股份有限公司 Radiation type bass reflex
CN103686550A (en) * 2013-11-18 2014-03-26 歌尔声学股份有限公司 Loudspeaker module group
CN103686556A (en) * 2013-11-19 2014-03-26 歌尔声学股份有限公司 Miniature loudspeaker module group and method for enhancing frequency response of miniature loudspeaker module group, and electronic device
CN203537552U (en) * 2013-09-17 2014-04-09 富祐鸿科技股份有限公司 Loudspeaker sound box with circuit opening and diaphragm being at same side
CN216357288U (en) * 2021-11-30 2022-04-19 深圳市明悦达电声科技有限公司 Combined type speaker and sound generating mechanism

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203537552U (en) * 2013-09-17 2014-04-09 富祐鸿科技股份有限公司 Loudspeaker sound box with circuit opening and diaphragm being at same side
CN103491481A (en) * 2013-10-10 2014-01-01 深圳雷柏科技股份有限公司 Radiation type bass reflex
CN103686550A (en) * 2013-11-18 2014-03-26 歌尔声学股份有限公司 Loudspeaker module group
CN103686556A (en) * 2013-11-19 2014-03-26 歌尔声学股份有限公司 Miniature loudspeaker module group and method for enhancing frequency response of miniature loudspeaker module group, and electronic device
CN216357288U (en) * 2021-11-30 2022-04-19 深圳市明悦达电声科技有限公司 Combined type speaker and sound generating mechanism

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