CN117269739B - Chip detection equipment and detection method - Google Patents
Chip detection equipment and detection method Download PDFInfo
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- CN117269739B CN117269739B CN202311568580.XA CN202311568580A CN117269739B CN 117269739 B CN117269739 B CN 117269739B CN 202311568580 A CN202311568580 A CN 202311568580A CN 117269739 B CN117269739 B CN 117269739B
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- 238000001514 detection method Methods 0.000 title claims abstract description 64
- 230000007246 mechanism Effects 0.000 claims abstract description 15
- 238000013519 translation Methods 0.000 claims description 15
- 238000007689 inspection Methods 0.000 claims description 8
- 238000012360 testing method Methods 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 238000011900 installation process Methods 0.000 claims description 3
- 230000005389 magnetism Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 230000006978 adaptation Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 17
- 238000000034 method Methods 0.000 description 23
- 230000008569 process Effects 0.000 description 21
- 230000005540 biological transmission Effects 0.000 description 16
- 238000013461 design Methods 0.000 description 9
- 230000009471 action Effects 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- 230000001174 ascending effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
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- 239000004065 semiconductor Substances 0.000 description 2
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- 230000010354 integration Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Reciprocating Conveyors (AREA)
Abstract
The invention relates to the technical field of chip detection, in particular to chip detection equipment and a chip detection method, comprising a support frame, wherein a pair of conveying plates, namely a first conveying plate and a second conveying plate, are arranged in the support frame, embedded frames are arranged in the middle of the conveying plates, a detector is arranged on one side of the support frame, a conveying assembly is arranged in the support frame, and the conveying assembly is used for conveying the conveying plates up and down in a reciprocating manner; the conveying assembly comprises a plurality of pairs of conveying rollers, conveying belts are arranged outside the pairs of conveying rollers, the conveying assembly further comprises two pairs of sliding blocks fixedly connected to the conveying belts, one pair of sliding blocks is fixedly connected to the outer part of the conveying plate, and a lifting mechanism is fixedly connected between the other pair of sliding blocks; according to the invention, through the transportation assembly, the alternate operation of the first conveying plate and the second conveying plate in the vertical space is realized, so that the effect of saving the occupied space is achieved.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to chip detection equipment and a chip detection method.
Background
VCSEL Chinese translation is a new generation semiconductor laser which is well developed in recent years, the traditional semiconductor laser adopts an edge emission mode, namely, the laser emitting direction is parallel to the surface of a substrate, and compared with the edge emission laser, the VCSEL has the advantages of good beam quality, single-mode output, high modulation bandwidth, long service life, easiness in integration and testing and the like, and therefore, the VCSEL has been widely applied to the fields of optical communication, optical display, optical sensing and the like.
VCSEL (vertical cavity surface emitting laser) chips are often required to be subjected to quality inspection after being manufactured, the common quality inspection mode is to place the chips on detection equipment, then the equipment is electrified and operates to automatically detect functions of the chips, and in order to improve detection efficiency, the chip detection equipment is mostly double-station.
The common chip detection machine is mostly double-station type, and the parallel arrangement is between two stations to this kind of double-station chip detection machine, and this just leads to this equipment when in actual use, needs to occupy the space of two stations, to some places narrower producer, if want to use the cost of automatic chip detection machine great.
Disclosure of Invention
Therefore, the invention aims to solve the technical problems that the traditional chip detection machine in the prior art needs to occupy two working positions, and the cost is high if an automatic chip detection machine is used for some factories with narrow places.
In order to solve the technical problems, the invention provides chip detection equipment, which comprises a support frame, wherein a pair of conveying plates, namely a first conveying plate and a second conveying plate, are arranged in the support frame, the middle parts of the first conveying plate and the second conveying plate are respectively provided with a jogging frame, one side of the support frame is provided with a detection machine, the inside of the support frame is provided with a conveying assembly, and the conveying assembly is used for conveying the conveying plates in a reciprocating manner.
In one embodiment of the invention, the conveying assembly comprises a plurality of pairs of conveying rollers, a conveying belt is arranged outside the conveying rollers, the conveying assembly further comprises two pairs of sliding blocks fixedly connected to the conveying belt, a pair of sliding blocks is fixedly connected to the outer portion of the conveying plate I, a lifting mechanism is fixedly connected between the other pair of sliding blocks, a conveying plate II is arranged at the top end of the lifting mechanism, and the lifting mechanism is used for driving the conveying plate II to lift.
In one embodiment of the invention, the lifting mechanism comprises a translation plate, limiting slide bars are connected at four corners of the interior of the translation plate in a penetrating way, the top ends of the limiting slide bars are fixedly connected with the bottom surface of the second conveying plate, limiting plates are fixedly connected with the bottom ends of the limiting slide bars on the same side, two sides of the translation plate are fixedly connected with sliding blocks, guide rods are fixedly connected between a pair of limiting plates, and guide components are arranged outside the guide rods and used for limiting the running track of the guide rods.
In one embodiment of the invention, the guide assembly comprises a guide plate, wherein a lifting groove is formed in the guide plate, and the middle part of the lifting groove is lower than the two ends of the lifting groove.
In one embodiment of the invention, a pair of clamping plates, namely a pair of first clamping plates and a pair of second clamping plates, are arranged outside the two jogging frames, the first conveying plate is in sliding connection with the pair of first clamping plates, the second conveying plate is in sliding connection with the pair of second clamping plates, a pair of first guide components and a pair of second guide components are arranged on the conveying plates, and the first guide components and the second guide components are used for driving the clamping plates to be close to or far away from each other.
In one embodiment of the present invention, the first guiding assembly includes a guiding post rotatably connected to the second clamping plate, and a pair of guiding grooves formed on a bottom surface of the first conveying plate, where the guiding grooves are adapted to the guiding post.
In an embodiment of the invention, the second guide assembly comprises a second guide groove formed in the top surface of the second conveying plate, and further comprises a connecting rod fixedly connected with the outer portion of the first clamping plate, wherein a limit sliding block is fixedly connected to one end, away from the first clamping plate, of the connecting rod, the limit sliding block is slidably connected to the inner portion of the first conveying plate, a limit column is rotatably connected to the bottom end of the limit sliding block, and the limit column is matched with the second guide groove.
In one embodiment of the present invention, a pair of clamping plates are fixedly connected with a sealing magnet at one side close to each other, and magnetism between the pair of sealing magnets is opposite.
In an embodiment of the invention, a detection jack is formed on one side of the conveying plate, which is close to the detection machine, a detection socket is fixedly connected to the inside of the support frame and positioned below the detection machine, the detection socket is matched with the detection jack, and a plurality of elastic sheets are fixedly connected to the inside of the conveying plate and positioned outside the detection jack.
A chip testing method, which is suitable for use in a chip testing apparatus as described in any one of the above, comprising the steps of:
s1, placing a chip to be detected on a first conveying plate, and then starting a conveying assembly;
s2, conveying the conveying assembly back to the conveying plate II in an up-down alternating mode, and conveying the conveying plate I to a detection machine for detection;
s3, manually installing the chip on the second conveying plate, and simultaneously detecting the chip on the first conveying plate in the installation process.
Compared with the prior art, the technical scheme of the invention has the following advantages:
according to the invention, through the transportation assembly, the alternating operation of the first conveying plate and the second conveying plate in the vertical space is realized, so that the effect of saving the occupied space is achieved;
according to the invention, the first guide component and the second guide component start to move, so that the first clamping plate and the second clamping plate are driven to move, and the clamping or loosening of the chip is realized, so that the effect of automatically limiting the chip is achieved, and the detection efficiency of the chip is improved.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a schematic view of a support frame structure according to the present invention;
FIG. 3 is a schematic view of a support structure according to another embodiment of the present invention;
FIG. 4 is a schematic view of a guide plate structure according to the present invention;
FIG. 5 is a schematic view of a transfer plate according to the present invention;
FIG. 6 is a schematic view of a transfer plate according to another embodiment of the present invention;
FIG. 7 is a schematic view of a limit slider structure in the present invention;
fig. 8 is a flow chart of the method of the present invention.
Description of the specification reference numerals: 1. a support frame; 201. a first conveying plate; 202. a second conveying plate; 3. a jogging frame; 4. a detecting machine; 5. a conveying roller; 6. a conveyor belt; 7. a sliding block; 8. a limit slide bar; 9. a limiting plate; 10. a translation plate; 11. a guide rod; 12. a guide plate; 13. a lifting groove; 1401. a clamping plate I; 1402. a clamping plate II; 15. a guide post; 16. a first guide groove; 17. a connecting rod; 18. a limit sliding block; 19. a limit column; 20. a second guide groove; 21. a closing magnet; 22. detecting a socket; 23. detecting the jack; 24. an elastic sheet.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
As shown in fig. 1 to 5, the chip detection device according to the embodiment of the invention includes a support frame 1, a pair of conveying plates, namely a first conveying plate 201 and a second conveying plate 202, are arranged in the support frame 1, a jogging frame 3 is installed in the middle of each of the pair of conveying plates, a detector 4 is installed at one side of the support frame 1, and a transport assembly is installed in the support frame 1 and is used for reciprocally conveying the conveying plates; during operation, the first conveying plate 201 and the second conveying plate 202 are designed, and the double-station space is saved while the double-station space is realized through the design of the conveying assembly, and the reason is that the first conveying plate 201 and the second conveying plate 202 are alternately operated in the vertical space through the conveying assembly, so that the effect of saving the space is achieved.
As shown in fig. 1 to 5, the transport assembly includes a plurality of pairs of transport rollers 5, a plurality of pairs of transport rollers 5 are externally provided with a transport belt 6, the transport assembly further includes two pairs of sliding blocks 7 fixedly connected to the transport belt 6, a pair of sliding blocks 7 are fixedly connected to the outside of a first transport plate 201, a lifting mechanism is fixedly connected between the other pair of sliding blocks 7, a second transport plate 202 is mounted at the top end of the lifting mechanism, and the lifting mechanism is used for driving the second transport plate 202 to lift; during operation, it is to be noted that, in the prior art, a servo motor is arranged outside the transmission roller 5, and meanwhile, a driving roller is correspondingly arranged among the plurality of transmission rollers 5 positioned at two sides of the support frame 1, which is not shown in the drawings of the application; in the running process of the conveying assembly, firstly, a servo motor outside the conveying roller 5 is started to drive the conveying roller 5 to rotate, the conveying roller 5 rotates to drive the conveying belt 6 to move, the conveying belt 6 moves to drive the sliding block 7 to move, the sliding block 7 moves to drive the conveying plate I201 to reciprocate, and the conveying plate II 202 can lift in the moving process under the action of a lifting mechanism, so that the conveying plate I201 is staggered, and the effect of alternate operation is achieved.
As shown in fig. 2 to 3, the lifting mechanism comprises a translation plate 10, wherein limit slide bars 8 are connected at four corners of the interior of the translation plate 10 in a penetrating manner, the top ends of the limit slide bars 8 are fixedly connected with the bottom surface of a second conveying plate 202, limit plates 9 are fixedly connected with the bottom ends of the limit slide bars 8 on the same side, two sides of the translation plate 10 are fixedly connected with sliding blocks 7, guide rods 11 are fixedly connected between a pair of limit plates 9, guide components are arranged outside the guide rods 11, and the guide components are used for limiting the running track of the guide rods 11; during operation, in the process that the sliding block 7 moves along with the transmission belt 6, the sliding block can drive the translation plate 10 to move, the translation plate 10 moves to drive the limiting plate 9 to move, the limiting plate 9 moves to drive the guide rod 11 to move along the guide assembly, and the guide assembly is limited to ensure that the downward movement process exists when the guide rod 11 moves, so that the guide rod 11 can drive the limit sliding rod 8 to pull the transmission plate II 202 to slide downwards under the action of the guide assembly, and the design of the guide assembly needs to be noted to avoid the occurrence of the situation that the transmission plate II 202 collides with the transmission plate I201 in the descending process, so that the effect of alternate operation of the transmission plate I201 and the transmission plate II 202 is achieved.
As shown in fig. 3, the guide assembly comprises a guide plate 12, wherein a lifting groove 13 is formed in the guide plate 12, and the middle part of the lifting groove 13 is lower than two ends of the lifting groove; during operation, the guide rod 11 slides along the lifting groove 13 inside the guide plate 12 during the movement, and the middle part of the lifting groove 13 is lower than the two ends of the lifting groove 13, so that the guide rod 11 moves in the lifting groove 13 for translating a distance before descending, translating a distance after ascending, and the lifting groove 13 is designed to avoid the collision between the conveying plate two 202 and the conveying plate one 201 during the descending and ascending processes, so that the lifting effect of the conveying plate two 202 is achieved.
As shown in fig. 4 to 6, a pair of clamping plates, namely a pair of first clamping plates 1401 and a pair of second clamping plates 1402, are respectively arranged outside the two jogging frames 3, the first conveying plate 201 is slidably connected with the pair of first clamping plates 1401, the second conveying plate 202 is slidably connected with the pair of second clamping plates 1402, a first guiding component and a second guiding component are respectively arranged on the pair of conveying plates, and the first guiding component and the second guiding component are respectively used for driving the clamping plates to be close to or far from each other; during operation, in the process of alternately operating the pair of conveying plates, the first guide assembly and the second guide assembly start to move, so that the first clamping plate 1401 and the second clamping plate 1402 are driven to move, the chip is clamped or loosened, the effect of automatically limiting the chip is achieved, and the detection efficiency of the chip is improved.
As shown in fig. 4 to 6, the first guide assembly includes a guide post 15 rotatably connected to the second clamping plate 1402, and a pair of guide grooves 16 formed on the bottom surface of the first conveying plate 201, where the guide grooves 16 are adapted to the guide post 15; during operation, the specific principle of the first guide component is as follows: taking the example that the second conveying plate 202 is located below the detector 4, the chip detection on the second conveying plate 202 is completed, the conveying assembly is started, the second conveying plate 202 translates for a certain distance under the action of the lifting groove 13 and then descends, the second conveying plate 202 is staggered with the first conveying plate 201 after descending, when the second conveying plate 202 and the first conveying plate 201 are about to be staggered, the guide post 15 on the clamping plate 1402 is opposite to the first guiding groove 16, and along with the movement of the second conveying plate 202 and the first conveying plate 201, the guide post 15 is finally inserted into the first guiding groove 16, and slide along the first guide slot 16, through the shape design of the first guide slot 16, the guide post 15 will deviate along the shape of the first guide slot 16 in the process of moving the second conveying plate 202 and the first conveying plate 201, so the guide post 15 will drive the second clamping plates 1402 to separate from each other, and after the detection of the first conveying plate 201 is completed, the guide post 15 will drive the second clamping plates 1402 to approach each other under the action of the first guide slot 16, and it should be noted that the shape of the first guide slot 16 is splayed from the output end of the support frame 1 to the direction of the detector 4.
As shown in fig. 4 to 7, the second guiding assembly comprises a second guiding groove 20 formed in the top surface of the second conveying plate 202, and a connecting rod 17 fixedly connected to the outside of the first clamping plate 1401, wherein a limit slide block 18 is fixedly connected to one end of the connecting rod 17 away from the first clamping plate 1401, the limit slide block 18 is slidably connected to the inside of the first conveying plate 201, a limit post 19 is rotatably connected to the bottom end of the limit slide block 18, and the limit post 19 is matched with the second guiding groove 20; during operation, the specific principle of the second guide component is as follows: taking the example that the second conveying plate 202 is located below the detecting machine 4, the process is similar to the principle of the first guiding component, except that when the second conveying plate 202 and the first conveying plate 201 are about to be staggered, the limiting post 19 below the first clamping plate 1401 is about to be inserted into the second guiding groove 20, so that the limiting post 19 is offset along the shape of the second guiding groove 20 in the moving process of the second conveying plate 202 and the first conveying plate 201, so that the limiting post 19 drives the limiting slide block 18 and the connecting rod 17 to move, and further drives the first clamping plate 1401 to clamp each other, and similarly, the first clamping plate 1401 is separated from each other after the detection of the first conveying plate 201 is completed, the shape of the second guiding groove 20 is the same as the shape of the first guiding groove 16, and the shape of the second guiding groove 20 is splayed when seen from the output end of the supporting frame 1 to the direction of the detecting machine 4.
As shown in fig. 7, a pair of holding plates are fixedly connected with a closing magnet 21 at one side close to each other, and magnetism between the pair of closing magnets 21 is different; during operation, through design a pair of closed magnet 21 of mutual attraction on the grip block, can improve the centre gripping effect of a pair of grip block, further spacing the chip.
As shown in fig. 1 to 6, a detection jack 23 is formed on one side of the conveying plate, which is close to the detection machine 4, a detection socket 22 is fixedly connected to the inside of the support frame 1 and below the detection machine 4, the detection socket 22 is matched with the detection jack 23, and a plurality of elastic sheets 24 are fixedly connected to the inside of the conveying plate and outside of the detection jack 23; during operation, through the detection jack 23 that begins on the transfer plate, so when the transfer plate moves to the below of detecting machine 4, detection jack 23 can peg graft each other with detection socket 22, and then make detecting machine 4 and transfer plate intercommunication, detect the chip, reach automated inspection's effect, and the design of elastic sheet 24 can cushion detection jack 23 and detection socket 22 when pegging graft, avoid the impact force too big to cause the damage to equipment.
As shown in fig. 8, a chip inspection method, which is applicable to a chip inspection apparatus as described in any one of the above, comprises the steps of:
s1, placing a chip to be detected on a first conveying plate 201, and then starting a conveying assembly;
s2, conveying the conveying assembly back to the conveying plate II 202 in an up-down alternating mode, and conveying the conveying plate I201 to the detecting machine 4 for detection;
s3, manually installing the chip on the second conveying plate 202, and simultaneously detecting the chip on the first conveying plate 201 in the installation process.
Working principle: the common chip detection machine is mainly a double-station type chip detection machine, and the two stations are arranged in parallel, so that the equipment needs to occupy the space of the two stations when in actual use, and for some factories with narrow places, the cost is high if the automatic chip detection machine is used; the embodiment of the invention realizes the double-station operation of the first conveying plate 201 and the second conveying plate 202 through the design of the conveying assembly, and simultaneously saves the occupied space of the equipment, and the reason is that the embodiment of the invention realizes the alternate operation of the first conveying plate 201 and the second conveying plate 202 in the vertical space through the conveying assembly, thereby achieving the effect of saving the occupied space;
it should be noted that, in the prior art, a servo motor is disposed outside the transmission roller 5, and a driving roller is correspondingly installed between the plurality of transmission rollers 5 located at two sides of the support frame 1, which is not shown in the drawings of the present application; in the running process of the transport assembly, a servo motor outside the transport roller 5 is started firstly, so that the transport roller 5 is driven to rotate by the transport assembly, the transport roller 5 rotates to drive the transport belt 6 to move, the transport belt 6 moves to drive the sliding block 7 to move, the sliding block 7 moves to drive the first transport plate 201 to reciprocate, and the second transport plate 202 is lifted and lowered in the moving process under the action of the lifting mechanism, so that the first transport plate 201 is staggered, and the alternating operation effect is achieved;
in the process that the sliding block 7 moves along with the transmission belt 6, the sliding block can drive the translation plate 10 to move, the translation plate 10 moves to drive the limiting plate 9 to move, the limiting plate 9 moves to drive the guide rod 11 to move along the guide assembly, and the guide assembly is limited to ensure that the downward movement process exists when the guide rod 11 moves, so that under the action of the guide assembly, the guide rod 11 can drive the limiting slide rod 8 to pull the transmission plate II 202 to slide downwards, and the design of the guide assembly should be noted to avoid the occurrence of the collision of the transmission plate II 202 with the transmission plate I201 in the descending process, so that the effect of alternate operation of the transmission plate I201 and the transmission plate II 202 is achieved;
the guide rod 11 slides along the lifting groove 13 in the guide plate 12 in the moving process, and the middle part of the lifting groove 13 is lower than the two ends of the lifting groove 13, so that the guide rod 11 moves in the lifting groove 13 for translating a distance, then descends, then ascends after translating a distance, and finally moves a distance, and the lifting groove 13 is designed to avoid the collision of the conveying plate two 202 with the conveying plate one 201 in the descending and ascending processes, so that the lifting effect of the conveying plate two 202 is achieved;
in the process of alternately operating the pair of conveying plates, the first guide component and the second guide component start to move, so that the first clamping plate 1401 and the second clamping plate 1402 are driven to move, and the clamping or loosening of the chip is realized, so that the effect of automatically limiting the chip is achieved, and the detection efficiency of the chip is improved;
the specific principle of the first guide component is as follows: taking the example that the second conveying plate 202 is located below the detecting machine 4, at this moment, the chip on the second conveying plate 202 is detected, the conveying assembly is started, at this moment, the second conveying plate 202 is translated for a certain distance under the action of the lifting groove 13 and then descends, after the second conveying plate 202 descends, the second conveying plate 202 is staggered with the first conveying plate 201, when the second conveying plate 202 and the first conveying plate 201 are about to be staggered, the guide post 15 on the second clamping plate 1402 is opposite to the position of the first guiding groove 16, along with the movement of the second conveying plate 202 and the first conveying plate 201, the guide post 15 is finally inserted into the first guiding groove 16 and slides along the first guiding groove 16, and through the shape design of the first guiding groove 16, the guide post 15 is deviated along the shape of the first guiding groove 16 in the movement process of the second conveying plate 202 and the first conveying plate 201, so that the guide post 15 drives the pair of clamping plates 1402 to be mutually separated, after the detection of the first conveying plate 201 is completed, the guide post 15 drives the pair of clamping plates 1402 to be mutually close to each other under the action of the first guiding groove 16, and the shape of the first clamping plate 1402 is required to be the shape of the first supporting frame 1, and the shape of the first supporting frame is the eighth supporting frame is required to be the shape of the first supporting frame and the eighth supporting frame is the first supporting frame and the machine is the eighth supporting frame and the machine is the end, and the first is required to be the end, and the machine is the outputting the shape is the direction from the direction is the direction 1;
the specific principle of the second guide component is as follows: taking the example that the second conveying plate 202 is located below the detecting machine 4, the process is similar to the principle of the first guiding component, except that when the second conveying plate 202 and the first conveying plate 201 are about to be staggered, the limiting column 19 below the first clamping plate 1401 is about to be inserted into the second guiding groove 20, so that the limiting column 19 is offset along the shape of the second guiding groove 20 in the process that the second conveying plate 202 and the first conveying plate 201 move, the limiting column 19 drives the limiting sliding block 18 and the connecting rod 17 to move, and then drives the first clamping plate 1401 to clamp each other, and similarly, the first clamping plate 1401 is separated from the second guiding groove 16 after the detection of the first conveying plate 201 is completed, the shape of the second guiding groove 20 is splayed as seen from the output end of the supporting frame 1 to the direction of the detecting machine 4;
the clamping effect of the pair of clamping plates can be improved by designing the pair of mutually attracted sealing magnets 21 on the clamping plates, and the chip is further limited;
through starting to detect jack 23 on the transfer plate, so when the transfer plate moves to the below of detecting machine 4, detect jack 23 can peg graft mutually with detection socket 22, and then make detecting machine 4 and transfer plate intercommunication, detect the chip, reach automated inspection's effect, and the design of elastic sheet 24 can cushion when detecting jack 23 and detection socket 22 peg graft, avoid the impact force too big to cause the damage to equipment.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (4)
1. A chip testing device, characterized in that: the device comprises a support frame (1), wherein a pair of conveying plates, namely a first conveying plate (201) and a second conveying plate (202), are arranged in the support frame (1), an embedded frame (3) is arranged in the middle of each pair of conveying plates, a detector (4) is arranged on one side of the support frame (1), a conveying assembly is arranged in the support frame (1), and the conveying assembly is used for conveying the conveying plates in a reciprocating mode;
the conveying assembly comprises a plurality of pairs of conveying rollers (5), a plurality of pairs of conveying rollers (5) are externally provided with a conveying belt (6), the conveying assembly further comprises two pairs of sliding blocks (7) fixedly connected to the conveying belt (6), a pair of sliding blocks (7) are fixedly connected to the outer part of a first conveying plate (201), a lifting mechanism is fixedly connected between the other pair of sliding blocks (7), a second conveying plate (202) is arranged at the top end of the lifting mechanism, the lifting mechanism is used for driving the second conveying plate (202) to lift, the lifting mechanism comprises a translation plate (10), limit sliding rods (8) are connected to the inner four corners of the translation plate (10) in a penetrating way, the top ends of the limit sliding rods (8) are fixedly connected with the bottom surface of the second conveying plate (202), the bottom ends of the limit sliding rods (8) are fixedly connected with limit plates (9), two sides of the translation plate (10) are fixedly connected with the sliding blocks (7), a guide rod (11) is fixedly connected between the pair of limit plates (9), a guide assembly is arranged at the outer part of the guide rod (11), the guide assembly is arranged on the guide rod (12), the guide assembly is arranged at the two ends of the guide assembly, the guide assembly is arranged at the middle part (13) and is provided with a guide groove (13), the clamping device comprises a first clamping plate pair (1401) and a second clamping plate pair (1402), wherein the first conveying plate (201) is in sliding connection with the first clamping plate pair (1401), the second conveying plate (202) is in sliding connection with the second clamping plate pair (1402), a first guide component and a second guide component are arranged on the first conveying plate pair, and the first guide component and the second guide component are used for driving the clamping plates to be close to or far away from each other;
the first guide assembly comprises a guide post (15) rotationally connected to the second clamping plate (1402), and further comprises a pair of first guide grooves (16) formed in the bottom surface of the first conveying plate (201), wherein the first guide grooves (16) are matched with the guide post (15);
the second guide assembly comprises a second guide groove (20) formed in the top surface of the second conveying plate (202), and further comprises a connecting rod (17) fixedly connected with the outer portion of the first clamping plate (1401), one end, far away from the first clamping plate (1401), of the connecting rod (17) is fixedly connected with a limiting slide block (18), the limiting slide block (18) is slidably connected inside the first conveying plate (201), the bottom end of the limiting slide block (18) is rotationally connected with a limiting column (19), and the limiting column (19) is matched with the second guide groove (20).
2. The chip inspection apparatus according to claim 1, wherein: and a pair of clamping plates are fixedly connected with a sealing magnet (21) at one side close to each other, and magnetism between the pair of sealing magnets (21) is different.
3. The chip inspection apparatus according to claim 1, wherein: detection jack (23) have all been seted up to one side that the delivery board is close to detection machine (4), the inside of support frame (1) just is located the below rigid coupling of detection machine (4) and has detected socket (22), detection socket (22) and detection jack (23) looks adaptation, the outside rigid coupling that just is located detection jack (23) inside the delivery board has a plurality of elastic sheets (24).
4. A chip testing method, which is suitable for a chip testing apparatus according to any one of the preceding claims 1-3, characterized in that the testing method comprises the steps of:
s1, placing a chip to be detected on a first conveying plate (201), and then starting a conveying assembly;
s2, conveying the conveying assembly back to the conveying plate II (202) in an up-down alternating mode, and conveying the conveying plate I (201) to a detection machine (4) for detection;
s3, manually installing the chip on the second conveying plate (202), and simultaneously detecting the chip on the first conveying plate (201) in the installation process.
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020087319A (en) * | 2001-05-15 | 2002-11-22 | 주식회사 쓰리비 시스템 | method of manufacturing IC chip installed cards, a pallet and a clamping table used therefor |
CN113625020A (en) * | 2021-08-04 | 2021-11-09 | 徐梓杨 | Integrated circuit chip testing method and equipment |
WO2022141166A1 (en) * | 2020-12-30 | 2022-07-07 | 广州奥松电子有限公司 | Pcb testing machine |
CN217212206U (en) * | 2021-12-29 | 2022-08-16 | 惠州市盈帆实业有限公司 | IC card chip packaging quality detection equipment |
CN217616120U (en) * | 2022-03-25 | 2022-10-21 | 通富微电子股份有限公司 | Appearance detection device for tube-mounted chip |
CN115902596A (en) * | 2023-02-27 | 2023-04-04 | 杭州朗迅科技股份有限公司 | Non-contact chip quality detection device and detection method |
CN116413278A (en) * | 2023-04-24 | 2023-07-11 | 深圳格芯集成电路装备有限公司 | Chip appearance detection equipment |
CN116666300A (en) * | 2023-07-18 | 2023-08-29 | 江苏海纳电子科技有限公司 | Semiconductor chip wafer defect detection device and defect detection method |
-
2023
- 2023-11-23 CN CN202311568580.XA patent/CN117269739B/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020087319A (en) * | 2001-05-15 | 2002-11-22 | 주식회사 쓰리비 시스템 | method of manufacturing IC chip installed cards, a pallet and a clamping table used therefor |
WO2022141166A1 (en) * | 2020-12-30 | 2022-07-07 | 广州奥松电子有限公司 | Pcb testing machine |
CN113625020A (en) * | 2021-08-04 | 2021-11-09 | 徐梓杨 | Integrated circuit chip testing method and equipment |
CN217212206U (en) * | 2021-12-29 | 2022-08-16 | 惠州市盈帆实业有限公司 | IC card chip packaging quality detection equipment |
CN217616120U (en) * | 2022-03-25 | 2022-10-21 | 通富微电子股份有限公司 | Appearance detection device for tube-mounted chip |
CN115902596A (en) * | 2023-02-27 | 2023-04-04 | 杭州朗迅科技股份有限公司 | Non-contact chip quality detection device and detection method |
CN116413278A (en) * | 2023-04-24 | 2023-07-11 | 深圳格芯集成电路装备有限公司 | Chip appearance detection equipment |
CN116666300A (en) * | 2023-07-18 | 2023-08-29 | 江苏海纳电子科技有限公司 | Semiconductor chip wafer defect detection device and defect detection method |
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