CN117239046A - Micro-LED die bonding method and display substrate - Google Patents
Micro-LED die bonding method and display substrate Download PDFInfo
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- CN117239046A CN117239046A CN202311296168.7A CN202311296168A CN117239046A CN 117239046 A CN117239046 A CN 117239046A CN 202311296168 A CN202311296168 A CN 202311296168A CN 117239046 A CN117239046 A CN 117239046A
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- solder paste
- pcb substrate
- led
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- 238000000034 method Methods 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 title claims abstract description 48
- 229910000679 solder Inorganic materials 0.000 claims abstract description 58
- 238000005476 soldering Methods 0.000 claims abstract description 36
- 239000011241 protective layer Substances 0.000 claims abstract description 18
- 230000004907 flux Effects 0.000 claims abstract description 17
- 238000007639 printing Methods 0.000 claims abstract description 17
- 238000003466 welding Methods 0.000 claims abstract description 11
- 238000004381 surface treatment Methods 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 239000010410 layer Substances 0.000 claims description 14
- 229910000831 Steel Inorganic materials 0.000 claims description 9
- 238000007689 inspection Methods 0.000 claims description 9
- 239000010959 steel Substances 0.000 claims description 9
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 6
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 229910001245 Sb alloy Inorganic materials 0.000 claims description 3
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000002140 antimony alloy Substances 0.000 claims description 3
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 claims description 3
- 238000007650 screen-printing Methods 0.000 claims description 3
- 229910000969 tin-silver-copper Inorganic materials 0.000 claims description 3
- 229910000597 tin-copper alloy Inorganic materials 0.000 claims description 2
- 238000012536 packaging technology Methods 0.000 abstract description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 14
- 230000008569 process Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000003825 pressing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000007480 spreading Effects 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000003190 augmentative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Led Device Packages (AREA)
Abstract
The disclosure provides a Micro-LED die bonding method and a display substrate, and relates to the technical field of Micro-LEDs. The Micro-LED die bonding method comprises the following steps: step S1, performing surface treatment on each bonding pad of a PCB substrate to form a protective layer; step S2, solder paste printing is carried out on the protective layer of the bonding pad; step S3, solder paste printed on the bonding pad is subjected to furnace reflow soldering; s4, printing soldering flux on the PCB substrate; and S5, transferring and welding the LED chip to a die bonding area of the PCB substrate by using transfer equipment. The technical scheme of the application can solve the technical problems that in the Micro LED flip-chip packaging technology, the transfer time is limited and solder paste bridging short circuit is easy to cause during die bonding.
Description
Technical Field
The disclosure relates to the technical field of Micro-LEDs, in particular to a Micro-LED die bonding method and a display substrate.
Background
The size of the light emitting diode (Light Emitting Diode, LED) tends to be smaller and smaller, for example, the Micro light emitting diode (Micro Light Emitting Diode, micro LED) has advantages of high contrast, low power consumption, long lifetime, and fast response time, and has been widely focused in Micro display applications such as Augmented Reality (AR), virtual Reality (VR), and LIFI light sources.
In the Micro LED flip-chip packaging technology, the use time limit of solder paste limited by a tin brushing process has the technical problem of huge transfer, and the size of an integrated board for industrialization of Micro LEDs is severely limited, so that when a terminal is used for pasting a screen, a plurality of small-size integrated boards can only be selected to splice into a large-size screen group, and the problem of more joints when the large-size screen is assembled is caused; and because the size of the miniature light-emitting diode chip is smaller, the size of the bonding pad of the substrate and the distance between the anode and the cathode are smaller, and solder paste can be spread after the chip is subjected to die bonding and pressing, so that the solder paste is bridged to cause short circuit to cause failure.
Therefore, how to solve the problems of limited transfer time and solder bridging short circuit easily caused during die bonding is a current urgent problem to be solved.
Disclosure of Invention
One technical problem to be solved by the present disclosure is: in the Micro LED flip-chip packaging technology, the transfer time is limited, and the problem of solder paste bridging short circuit is easy to cause when the die is fixed.
In order to solve the above technical problems, an embodiment of the present disclosure provides a die bonding method for Micro-LEDs, including: step S1, performing surface treatment on each bonding pad of a PCB substrate to form a protective layer;
step S2, solder paste printing is carried out on the protective layer of the bonding pad;
step S3, solder paste printed on the bonding pad is subjected to furnace reflow soldering;
s4, printing soldering flux on the PCB substrate;
and S5, transferring and welding the LED chip to a position corresponding to the bonding pad of the PCB substrate by using transfer equipment.
In some embodiments, the protective layer in step S1 is a nickel-gold plating layer.
In some embodiments, the nickel layer in the nickel-gold plating layer has a thickness of 90-150 aThe thickness of the gold layer is 1-3 +.>。
In some embodiments, step S2 is specifically: and (5) performing solder paste printing on the protective layer by utilizing steel screen printing.
In some embodiments, the steel mesh has openings corresponding to each pad, the area of each opening accounting for 60-80% of the area of each pad.
In some embodiments, step S2 further comprises, after:
and S21, placing the PCB substrate printed with the solder paste into SPI full-inspection equipment for SPI full-inspection.
In some embodiments, the solder paste in step S2 is one of tin-silver-copper alloy, tin-antimony alloy.
In some embodiments, step S3 is followed by:
and S31, removing residual solder paste on the PCB substrate.
In some embodiments, the welding in step S5 is laser welding.
The embodiment of the disclosure also provides a display substrate which is manufactured by the Micro-LED die bonding method.
Through the technical scheme, the Micro-LED die bonding method and the display substrate provided by the application have the advantages that through carrying out surface treatment and solder paste printing on each bonding pad of the PCB substrate, carrying out furnace reflow soldering on the solder paste on the bonding pad, and carrying out LED chip transfer soldering after printing soldering flux, the solder paste can be formed into solder balls with certain hardness by adopting a reflow soldering mode, and the soldering flux is adopted to assist in transferring and adhering the LED chips to finally finish the soldering, in the process of die bonding and pressing of the LED chips, the problem that short circuit failure caused by solder spreading due to pressing does not exist due to bridging of solder balls formed by reflow soldering, the problems that the soldering flux in the solder paste is easy to volatilize and the LED transfer time is limited are solved, the size of the substrate can be made larger, so that the number of the joints of a large-size screen group during assembly is reduced, and the display effect of the large-size screen group is promoted.
Drawings
In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.
FIG. 1 is a flow diagram of a method for die bonding of Micro-LEDs as disclosed in embodiments of the present disclosure;
fig. 2 is a schematic structural diagram of a PCB substrate in step S1 of a die bonding method of Micro-LEDs according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a Micro-LED die bonding method according to an embodiment of the present disclosure after the solder paste printing is completed in step S2;
fig. 4 is a schematic structural diagram of a Micro-LED die bonding method according to an embodiment of the present disclosure after step S3 of the reflow soldering process is completed;
fig. 5 is a schematic structural diagram of a Micro-LED die bonding method according to an embodiment of the present disclosure after finishing the soldering flux printing in step S4;
fig. 6 is a schematic structural diagram of an LED chip transferring process in step S5 of the die bonding method of Micro-LEDs according to an embodiment of the present disclosure;
fig. 7 is a schematic structural diagram of a Micro-LED die bonding method according to an embodiment of the present disclosure after completing LED die transfer soldering in step S5.
Reference numerals illustrate:
1. a PCB substrate; 2. a bonding pad; 3. solder paste; 4. soldering flux; 5. an LED chip; 6. a material carrying structure; 7. an adhesive layer.
Detailed Description
Embodiments of the present disclosure are described in further detail below with reference to the drawings and examples. The following detailed description of the embodiments and the accompanying drawings are provided to illustrate the principles of the disclosure and not to limit the scope of the disclosure, which may be embodied in many different forms and not limited to the specific embodiments disclosed herein, but rather to include all technical solutions falling within the scope of the claims.
The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully convey the scope of the disclosure to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.
In the description of the present disclosure, unless otherwise indicated, the meaning of "plurality" is greater than or equal to two; the terms "upper," "lower," "left," "right," "inner," "outer," and the like indicate an orientation or positional relationship merely for convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the present disclosure. When the absolute position of the object to be described is changed, the relative positional relationship may be changed accordingly.
Furthermore, the use of the terms first, second, and the like in this disclosure do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The "vertical" is not strictly vertical but is within the allowable error range. "parallel" is not strictly parallel but is within the tolerance of the error. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements.
It should also be noted that, in the description of the present disclosure, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the terms in the present disclosure may be understood as appropriate by those of ordinary skill in the art. When a particular device is described as being located between a first device and a second device, there may or may not be an intervening device between the particular device and either the first device or the second device.
All terms used in the present disclosure have the same meaning as understood by one of ordinary skill in the art to which the present disclosure pertains, unless specifically defined otherwise. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.
Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques, methods, and apparatus should be considered part of the specification.
Example 1
Referring to fig. 1-7, a first embodiment of the present application provides a die bonding method for Micro-LEDs, which mainly includes the following steps:
step S1, performing surface treatment on each bonding pad 2 of a PCB substrate 1 to form a protective layer;
specifically, as the same surface of the bonding pad 2 of the PCB substrate 1 is easily oxidized, in the technical scheme adopted by the application, the surface treatment is firstly carried out on the bonding pad 2 of the PCB substrate 1 to form a protective layer, which can play a role in protecting the exposed copper circuit on one hand and can provide a flat and non-easily oxidized solderable surface for subsequent soldering on the other hand.
Step S2, printing solder paste 3 on the protective layer of the bonding pad 2;
specifically, referring to fig. 3, in step S2, the solder paste 3 may be printed on the protective layer of the bonding pad 2 by using a steel screen printing method, and before the step or the method is performed, a steel screen for printing the solder paste 3 may be manufactured according to the position, shape, size, etc. of each bonding pad 2 on the PCB substrate 1, and the steel screen has openings corresponding to each bonding pad 2, and the area of each opening may be set to 60-80% of the area of each bonding pad 2. For example: the area of each opening may be set to 70% of the area of each pad 2; when the solder paste 3 is printed, the openings on the steel mesh are aligned with each bonding pad 2 on the PCB substrate 1, the solder paste 3 is coated on the steel mesh, the solder paste 3 is in the form of a screen on the protective layer of the bonding pad 2, and tools such as a scraper can be used for uniformly coating the solder paste 3 on the bonding pad 2; the powder diameter of the solder paste 3 used in the step S2 may be No. 7, and the solder paste 3 may be one of a tin-silver-copper alloy, a tin-copper alloy, and a tin-antimony alloy.
Step S3, solder paste 3 printed on the bonding pad 2 is subjected to furnace reflow soldering;
step S4, printing soldering flux 4 on the PCB substrate 1;
specifically, because the size of the bonding pad 2 on the PCB substrate 1 of the Micro-LED module is smaller, that is, the interval between the positive electrode and the negative electrode is also smaller, and the soldering flux 4 in the solder paste 3 is easy to volatilize, and the solder paste 3 is easy to spread out to cause bridging short circuit, the technical scheme is different from the method of brushing tin, fixing crystal and then reflow soldering adopted in the current crystal fixing technology.
After step S3, step S31 may be further performed to remove the solder paste 3 remaining on the PCB substrate 1, so that the surface of the PCB substrate 1 can be cleaner, so as to avoid the influence between the LED chips 5 remaining on the PCB substrate 1 and causing fine pitches.
Step S5, transferring and soldering the LED chip 5 to the corresponding position of the pad 2 of the PCB substrate 1 by using a transferring device (not shown in the figure).
Specifically, the LED chip 5 is transferred to the bonding pad 2 of the PCB substrate 1 by the transfer device, the LED chip 5 is adhered by the soldering flux 4 on the bonding pad 2, and the mechanical and electrical stable connection between the LED chip 5 and the bonding pad 2 of the PCB substrate 1 can be realized by, but not limited to, laser welding or reflow welding, i.e. the die bonding process is completed, as shown in fig. 7. Of course, after step S5 is completed, the steps of removing the flux 4 remaining on the PCB substrate 1, performing the subsequent test, and the like may be performed, which is not particularly limited herein.
Referring to fig. 6, a plurality of LED chips 5 are arranged on the bottom surface of the material carrying structure 6, the bottom layer of the material carrying structure 6 is an adhesive layer 7, the transferring device moves the material carrying structure 6 and the plurality of LED chips 5 to the upper side of the PCB substrate 1, the positions of the plurality of LED chips 5 correspond to the positions of the bonding pads 2 on the PCB substrate 1, when the pressing head of the transferring device is pressed down, the LED chips 5 are fully contacted with the soldering flux 4 on the corresponding bonding pads 2, the contact area is increased, and the adhesion force of the soldering flux 4 to the LED chips 5 is greater than the adhesion force of the adhesive layer 7 to the LED chips 5, so that the transfer of the LED chips 5 is completed.
According to the above listed embodiments of the present application, a die bonding method for Micro-LEDs is provided, by performing surface treatment and solder paste 3 printing on each solder pad 2 of a PCB substrate 1, then performing oven reflow soldering on the solder paste 3 on the solder pad 2, and performing transfer soldering on the LED chip 5 after printing the soldering flux 4, by adopting such a first reflow soldering manner, the solder paste 3 can form solder balls with a certain hardness, and by adopting the soldering flux 4 to assist, the LED chip 5 can transfer and adhere to finally complete soldering, in the die bonding pressing process of the LED chip 5, the problem of short circuit failure caused by bridging due to solder spreading caused by pressing is avoided due to the fact that solder balls formed by reflow soldering have a certain hardness, and the problems of easy volatilization of the soldering flux 4 and limited LED transfer time in the solder paste 3 are solved, so that the size of the substrate can be made larger, the number of the assembly of the large-size panel assembly is reduced, and the display effect of the large-size panel assembly is facilitated to be improved.
In a specific implementation, the protective layer in step S1 is a nickel-gold plating layer.
Specifically, at present, in order to overcome the problems that the size of a Micro-LED chip 5 is small, the size of a bonding pad 2 and the interval between positive and negative electrodes are small, and the solder paste 3 spreads out and bridges when the LED chip 5 is transferred and pressed to cause short circuit failure, most of substrates of the Micro-LED module adopt substrates with tin deposited on the bonding pad 2, but tin deposited plates need better storage conditions, otherwise, the bonding pad 2 loses weldability, in addition, the defects of loose tin surface structure, small hardness, easy scratch, oxidation, liquid medicine residue and the like are caused, so after welding treatment, the problems of yellowing, blackening and the like of a tin surface are easy to occur, the attractiveness of a printed board is influenced, and the welding strength of the printed board is greatly influenced; in addition, the existing base plate also adopts a tin spraying process to add tin, namely, the base plate is immersed into a molten tin pool, so that all exposed copper surfaces are covered by tin, then the superfluous tin on the base plate is removed through a hot air cutter, the high temperature process is easy to cause the explosion of the base plate, the surface flatness of the tin spraying plate is poor, in addition, tin balls are easy to generate in the processing process, short circuits are easy to cause on thin-gap pin components, in order to avoid the problems of the two processes, the protective layer formed by surface treatment in the step S1 is a nickel-gold coating, the protective layer comprises a two-step process, a thin nickel coating is formed on the copper surface, a thin gold coating is formed, the nickel coating is used as a barrier for copper and is a surface which is welded actually, a barrier layer is formed between the tin and the copper, the gold coating is used for protecting nickel in a storage part, nickel oxidation is prevented, the storage condition is simple, the gold process can form good surface flatness, no sedimentation and no problem exists in the quality guarantee process; wherein the thickness of the nickel layer in the nickel-gold plating layer can beIs 90 to 150The thickness of the gold layer may be 1-3 +.>Specifically, the method can be determined according to actual process.
In a specific implementation, step S2 further includes:
and S21, placing the PCB substrate 1 printed with the solder paste 3 into SPI full inspection equipment for SPI full inspection.
Specifically, in the technical scheme adopted by the application, after the solder paste 3 printed in the step S2 is finished, the PCB substrate 1 printed with the solder paste 3 is put into SPI full inspection equipment for PI full inspection, and whether the size and thickness of the solder paste 3 printed on the bonding pad 2 are qualified or not is specifically checked, and after the solder paste 3 is qualified through the SPI full inspection, the solder paste is subjected to reflow soldering in the step S3.
Example two
The second embodiment of the application provides a display substrate which is manufactured by the Micro-LED die bonding method.
Thus, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concepts of the present disclosure, some details known in the art are not described. How to implement the solutions disclosed herein will be fully apparent to those skilled in the art from the above description.
Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It will be understood by those skilled in the art that the foregoing embodiments may be modified and equivalents substituted for elements thereof without departing from the scope and spirit of the disclosure. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict.
Claims (10)
1. The die bonding method of the Micro-LED is characterized by comprising the following steps of:
step S1, performing surface treatment on each bonding pad (2) of a PCB substrate (1) to form a protective layer;
s2, printing solder paste (3) on the protective layer of the bonding pad (2);
s3, performing furnace reflow soldering on the solder paste (3) printed on the bonding pad (2);
s4, printing soldering flux (4) on the PCB substrate (1);
and S5, transferring and welding the LED chip (5) to the corresponding position of the bonding pad (2) of the PCB substrate (1) by using transfer equipment.
2. The method for die bonding Micro-LEDs according to claim 1, wherein,
the protective layer in the step S1 is a nickel-gold plating layer.
3. The method for die bonding Micro-LEDs according to claim 2, wherein,
the thickness of the nickel layer in the nickel-gold plating layer is 90-150The thickness of the gold layer is 1-3 +.>。
4. The method for die bonding Micro-LEDs according to claim 1, wherein,
the step S2 specifically comprises the following steps: and printing solder paste (3) on the protective layer by utilizing steel screen printing.
5. The method for die bonding Micro-LEDs according to claim 4, wherein,
the steel mesh has openings corresponding to each of the pads (2), the area of each of the openings accounting for 60-80% of the area of each of the pads (2).
6. The method for die bonding Micro-LEDs according to claim 1, wherein,
the step S2 further includes:
and S21, placing the PCB substrate (1) printed with the solder paste (3) into SPI full inspection equipment for SPI full inspection.
7. The method for die bonding Micro-LEDs according to claim 1, wherein,
and the solder paste (3) in the step S2 is one of tin-silver-copper alloy, tin-copper alloy and tin-antimony alloy.
8. The method for die bonding Micro-LEDs according to claim 1, wherein,
the step S3 further includes:
and S31, removing the residual solder paste (3) on the PCB substrate (1).
9. The method for die bonding Micro-LEDs according to claim 1, wherein,
the welding in the step S5 is laser welding.
10. A display substrate, characterized in that it is manufactured by applying the die bonding method of Micro-LED according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311296168.7A CN117239046A (en) | 2023-10-09 | 2023-10-09 | Micro-LED die bonding method and display substrate |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311296168.7A CN117239046A (en) | 2023-10-09 | 2023-10-09 | Micro-LED die bonding method and display substrate |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103889160A (en) * | 2012-12-20 | 2014-06-25 | 深南电路有限公司 | Nickel gold processing method for printed circuit board |
| CN108091750A (en) * | 2017-12-26 | 2018-05-29 | 鸿利智汇集团股份有限公司 | A kind of COB die-bonding methods |
| CN109874237A (en) * | 2019-03-11 | 2019-06-11 | 深圳市海能达通信有限公司 | SMT welding procedure and steel mesh for SMT welding procedure |
| CN112331619A (en) * | 2020-11-04 | 2021-02-05 | 华天科技(南京)有限公司 | Gravity magnetic induction chip side-mounting structure and method for improving side-mounting yield |
| CN113613408A (en) * | 2021-08-16 | 2021-11-05 | 重庆金美通信有限责任公司 | Technological method applied to BGA (ball grid array) packaged device |
-
2023
- 2023-10-09 CN CN202311296168.7A patent/CN117239046A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103889160A (en) * | 2012-12-20 | 2014-06-25 | 深南电路有限公司 | Nickel gold processing method for printed circuit board |
| CN108091750A (en) * | 2017-12-26 | 2018-05-29 | 鸿利智汇集团股份有限公司 | A kind of COB die-bonding methods |
| CN109874237A (en) * | 2019-03-11 | 2019-06-11 | 深圳市海能达通信有限公司 | SMT welding procedure and steel mesh for SMT welding procedure |
| CN112331619A (en) * | 2020-11-04 | 2021-02-05 | 华天科技(南京)有限公司 | Gravity magnetic induction chip side-mounting structure and method for improving side-mounting yield |
| CN113613408A (en) * | 2021-08-16 | 2021-11-05 | 重庆金美通信有限责任公司 | Technological method applied to BGA (ball grid array) packaged device |
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