CN117202497B - Circuit board with crimping structure and manufacturing method thereof - Google Patents
Circuit board with crimping structure and manufacturing method thereof Download PDFInfo
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- CN117202497B CN117202497B CN202311389435.5A CN202311389435A CN117202497B CN 117202497 B CN117202497 B CN 117202497B CN 202311389435 A CN202311389435 A CN 202311389435A CN 117202497 B CN117202497 B CN 117202497B
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- 238000002788 crimping Methods 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000003825 pressing Methods 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 15
- 229920003002 synthetic resin Polymers 0.000 claims description 15
- 239000000057 synthetic resin Substances 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 13
- 230000006835 compression Effects 0.000 claims description 12
- 238000007906 compression Methods 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 12
- 238000005498 polishing Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 239000002994 raw material Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 description 6
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 2
- 235000017491 Bambusa tulda Nutrition 0.000 description 2
- 241001330002 Bambuseae Species 0.000 description 2
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 2
- 239000011425 bamboo Substances 0.000 description 2
- 238000003801 milling Methods 0.000 description 2
- 238000013475 authorization Methods 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- Combinations Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board with a crimping structure and a manufacturing method thereof, the circuit board comprises a circuit board body, the circuit board body comprises a first circuit board layer and a second circuit board layer, a plurality of crimping top pieces are fixedly arranged at the bottom of the first circuit board layer, rubber gaskets are adhered to two sides of the bottom of the crimping top pieces, elastic outer frames are uniformly formed at two sides of the outer parts of the rubber gaskets, slots are formed at two sides of the bottom of the crimping top pieces, a layer slot is formed at the bottom of the crimping top pieces, a plurality of crimping bottom pieces are fixedly arranged in the second circuit board layer, a layer plug-in unit is integrally formed at the outer parts of the crimping bottom pieces, and a conductive piece is welded at one side of the top of the first circuit board layer.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a circuit board with a crimping structure and a manufacturing method thereof.
Background
The circuit board is mainly used for connecting various electronic components in electronic equipment and plays a role of a structural support, and is a typical electronic assembly mode, and the circuit board is formed by matching elastically deformable pins or rigid pins of the crimping device with metallized holes of the printed circuit board, so that the circuit board is electrically connected with the conductive components by using a crimping process.
The circuit board crimping structure with the authorization bulletin number of CN106304631A comprises a first connecting part, a second connecting part and conductive colloid formed between the first connecting part and the second connecting part, wherein the first connecting part comprises a plurality of first wires.
When the circuit board is processed and manufactured, the circuit board layers of the circuit board are integrally bonded through adhesive and the like, the situation of adhesive opening easily occurs in the circuit board, the circuit board cannot be used continuously, if most of crimping operations are adopted, only pins are inserted and matched, and the connection and combination of the board layers or the conductive ends of the circuit board are not tight enough, so that a circuit board with a crimping structure and a manufacturing method thereof are needed to solve the problems.
Disclosure of Invention
The invention aims to provide a circuit board with a crimping structure and a manufacturing method thereof, so as to solve the defects in the prior art.
In order to achieve the above object, the present invention provides the following technical solutions:
The utility model provides a circuit board with crimping structure, includes the circuit board body, the circuit board body includes circuit board layer one and circuit board layer two, the bottom fixed mounting of circuit board layer one has a plurality of crimping top piece, the bottom both sides of crimping top piece all bond the cushion, the outside both sides uniform body shaping of cushion has elastic outer frame, the slot has all been seted up to the bottom both sides of crimping top piece, and the layer slot has been seted up to the bottom of crimping top piece, the inside fixed mounting of circuit board layer two has a plurality of crimping bottom piece, and the outside integrated into one piece of crimping bottom piece has the layer plug-in components, the top one side welding of circuit board layer one has the electrically conductive piece, one side of circuit board layer one is provided with the external connection board, one side inside of external connection board has the urceolus through the bolt mounting, the bottom welding of urceolus has the spring, and the bottom welding of spring has the fly leaf, the top fixed mounting of fly leaf has an epitaxial cylinder, and the inside swing joint of fly leaf has the crimping pole, one side welding of crimping pole has the slider, and the crimping pole top is provided with the chuck.
Preferably, a pressing strip is sleeved between the clamping head and the compression joint rod, and an anti-slip film is adhered to the bottom of the pressing strip.
Preferably, an outer sliding opening is formed in one side of the outer portion of the outer cylinder, and the sliding block is slidably clamped in the outer sliding opening.
Preferably, a threaded hole is formed in one side of the movable plate, and a fastening bolt is inserted into the internal thread of the threaded hole.
Preferably, a connecting plate is welded on one side of the second circuit board layer, and the fastening bolt is inserted into the connecting plate in a threaded manner.
Preferably, a vertical frame is fixedly arranged on one side of the top of the outer connecting plate, and a pressing sheet is arranged on one side of the vertical frame through a torsion spring.
Preferably, the inner core piece is adhered to the inside of the press-connection piece, the layer insert is inserted into the inside of the layer slot, and the elastic outer frame is clamped in the inside of the press-connection bottom piece.
The manufacturing method of the circuit board with the crimping structure comprises the following steps:
s1, preparing raw materials: preparing copper-clad plates and a synthetic resin substrate main material, and then preparing a film and a conductive film auxiliary material;
S2, cutting and polishing: cutting and polishing the copper-clad plate and the synthetic resin substrate main material into a first circuit board layer and a second circuit board layer, and cutting and polishing the used residual synthetic resin substrate into a press-connection top piece and a press-connection bottom piece;
S3, bonding grooving: bonding a rubber pad and an elastic outer frame on the compression joint top piece, and opening a slot and a layer slot in the compression joint top piece by using slotting equipment to press the compression joint top piece into the compression joint bottom piece;
s4, processing parts: the conductive piece is made into a conductive piece and welded on the first circuit board layer, the rest synthetic resin substrate is cut into parts such as a pressing strip, a pressing rod, a sliding block, an outer cylinder, an outer extension cylinder and the like, after holes are milled in the outer cylinder, the pressing rod is assembled into the outer extension cylinder through a movable bearing;
S5, mounting and crimping: the spring is welded to the lower end of the outer cylinder, the movable plate is arranged under the spring, the anti-slip rubber sheet is adhered under the pressing strip by adopting an adhesive, and the pressing strip is rotated and pressed from the left side to enable the movable plate to be pressed downwards, so that the conductive piece under the inner chip is pressed together with an external circuit.
Preferably, in the step S2, the cutting speed of the copper-clad sheet and the synthetic resin substrate main material is 120-400 rpm, and the polishing speed is 200-550 rpm.
Preferably, in the step S3, the slotting device slots at a stroke of 300 mm/min, and in the step S4, the rotating speed of the milling holes in the outer cylinder is 180-650 revolutions/min.
According to the circuit board with the crimping structure and the manufacturing method thereof, after the crimping top piece is pressed into the crimping bottom piece, the elastic outer frame is movably pressed on the outer side of the slot through the rubber pad, so that the elastic outer frame is crimped in the crimping bottom piece, the layer plug is clamped into the layer slot, the layer plug is prevented from sliding out of the layer slot, and the first circuit board layer and the second circuit board layer are crimped and combined; the anti-skid rubber sheet, the outer cylinder and the outer cylinder are arranged, the pressing strip on the anti-skid rubber sheet rotates in the outer cylinder by the pressure welding rod, and the sliding block moves in the outer sliding port, so that the position of the anti-skid rubber sheet is convenient to transfer, and the inner chip is used for tightly integrating the conductive piece with the external circuit in a pressure welding way; through the spring, fly leaf and the connecting plate that set up, the crimping pole can be with the spring pulling in the inside pivoted of extension section of thick bamboo, extension section of thick bamboo for the spring extends, and fly leaf and connecting plate laminate mutually, and the anti-skidding film of being convenient for is pressed on the inner chip, strengthens the crimping intensity of electrically conductive piece and external circuit.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present application, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
Fig. 1 is a schematic perspective view of a circuit board with a press-connection structure and a manufacturing method thereof according to an embodiment of the present invention.
Fig. 2 is a schematic cross-sectional view of a circuit board with a press-connection structure and a manufacturing method thereof according to an embodiment of the invention.
Fig. 3 is a schematic partial cross-sectional view of a circuit board with a press-connection structure and a manufacturing method thereof according to an embodiment of the invention.
Fig. 4 is a schematic diagram of a press-fit top member according to an embodiment of the present invention.
Fig. 5 is a schematic front view of an outer cylinder provided by an embodiment of a circuit board with a press-connection structure and a method for manufacturing the same.
Fig. 6 is a schematic cross-sectional view of an outer barrel of a circuit board with a press-connection structure and a manufacturing method thereof according to an embodiment of the present invention.
Reference numerals illustrate:
The circuit board comprises a circuit board body 1, a circuit board layer I, a circuit board layer II, a 4 conductive piece, a 5 vertical frame, a 6 crimping piece, a 7 pressing strip, an 8 movable plate, a 9 connecting plate, a 10 crimping top piece, a 11 crimping bottom piece, a 12 anti-slip film, a 13 inner chip, a 14 outer connecting plate, a 15 outer cylinder, a 16 slot, a 17 rubber pad, a 18 elastic outer frame, a 19-layer slot, a 20 fastening bolt, a 21 crimping rod, a 22 clamping head, a 23 outer sliding port, a 24 sliding block, a 25 outer cylinder, a 26 spring, a 27 movable bearing, a 28 threaded hole and a 29-layer plug-in.
Detailed Description
In order to make the technical scheme of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1-6, a circuit board with a press-connection structure provided in the embodiment of the invention comprises a circuit board body 1, wherein the circuit board body 1 comprises a first circuit board layer 2 and a second circuit board layer 3, a plurality of press-connection top pieces 10 are fixedly mounted at the bottom of the first circuit board layer 2, rubber pads 17 are adhered to both sides of the bottom of the press-connection top pieces 10, elastic outer frames 18 are uniformly formed at the outer sides of the rubber pads 17, slots 16 are formed at both sides of the bottom of the press-connection top pieces 10, layer slots 19 are formed at the bottom of the press-connection top pieces 10, a plurality of press-connection bottom pieces 11 are fixedly mounted in the second circuit board layer 3, a layer plug 29 is integrally formed at the outer side of the press-connection bottom pieces 11, a conductive piece 4 is welded at one side of the top of the first circuit board layer 2, an outer connecting plate 14 is arranged at one side of the outer connecting plate 14, an outer cylinder 15 is mounted at the inner side of the outer cylinder 15 through bolts, springs 26 are welded at the bottom ends of the outer cylinder 15, movable plates 8 are welded at the bottoms of the springs 26, an extension cylinder 25 is fixedly mounted at the top of the movable plate 8, movable bearings 27 are arranged at the inner sides of the extension cylinder 25, a movable connecting rod 21 is movably connected to the movable connecting rod 21, and a connecting rod 21 is welded at the top end 22 is welded at one side of the connecting rod 21.
Specifically, in this embodiment, the circuit board comprises a circuit board body 1, the circuit board body 1 comprises a first circuit board layer 2 and a second circuit board layer 3, a plurality of press-connection top pieces 10 are fixedly arranged at the bottom of the first circuit board layer 2, rubber pads 17 are adhered to two sides of the bottom of the press-connection top piece 10, elastic outer frames 18 are uniformly formed on two sides of the outer portion of the rubber pads 17, slots 16 are formed on two sides of the bottom of the press-connection top piece 10, a layer slot 19 is formed on the bottom of the press-connection top piece 10, a plurality of press-connection bottom pieces 11 are fixedly arranged in the second circuit board layer 3, the press-connection top piece 10 is pressed into the press-connection bottom pieces 11, the rubber pads 17 are pressed onto the slots 16 by the elastic force of the rubber pads 17, after the elastic outer frames 18 are inserted into the press-connection bottom pieces 11, the elastic outer frames 18 can be clamped into the press-connection bottom pieces 11, the press-connection top pieces 10 and the press-connection bottom pieces 11 are press-connected, and a layer insert 29 is integrally formed on the outer portion of the press-connection bottom pieces 11, after the layer insert 29 is combined with the press-connection top piece 10 and the press-connection bottom piece 11, the layer insert 29 can be inserted into the layer insert 19, the layer insert 29 is stably clamped by the multiple conical groove structures of the layer insert 19, the layer insert 29 is prevented from falling out of the lower end of the layer insert 19, the circuit board layer I2 and the circuit board layer II 3 are combined together, the conductive piece 4 is welded on one side of the top of the circuit board layer I2, the conductive piece 4 can be connected and communicated with an external circuit, the external connecting plate 14 is arranged on one side of the circuit board layer I2, the outer barrel 15 is arranged in the external connecting plate 14 through bolts, the bottom end of the outer barrel 15 is welded with the spring 26, the bottom of the spring 26 is welded with the movable plate 8, the top of the movable plate 8 is fixedly provided with the extension barrel 25, the movable bearing 27 is arranged in the extension barrel 25, the press-connection rod 21 is movably connected in the movable bearing 27, the press rod 21 can move in the movable bearing 27, one side of the press rod 21 is welded with the sliding block 24, the top end of the press rod 21 is provided with the clamping head 22, the press bar 7 is arranged on the top end of the press rod 21 and in the clamping head 22, after a person rotates the press bar 7 from the left side to the right side, the press rod 21 can move in the extension tube 25 during rotation, meanwhile, the sliding block 24 on the press rod 21 can move in the outer tube 15, the sliding block 24 is clamped in the outer sliding port 23 in a sliding mode, and the extension tube 25 is pushed downwards after the press rod 21 rotates.
According to the circuit board with the press-connection structure, after the press-connection top piece 10, the elastic outer frame 18 and the layer plug-in piece 29 are arranged, the elastic outer frame 18 is movably pressed on the outer side of the slot 16 through the rubber pad 17 after the press-connection top piece 10 is pressed into the press-connection bottom piece 11, so that the elastic outer frame 18 is press-connected in the press-connection bottom piece 11, the layer plug-in piece 29 is clamped into the layer slot 19, the layer plug-in piece 29 is prevented from sliding out of the layer slot 19, and the circuit board layer I2 and the circuit board layer II 3 are press-connected.
In another embodiment provided by the invention, as shown in fig. 1,2,3 and 5, a pressing strip 7 is sleeved between a clamping head 22 and a pressing rod 21, an anti-slip film 12 is adhered to the bottom of the pressing strip 7, and the anti-slip film 12 can be rotated after the pressing strip 7 rotates, so that the anti-slip film 12 is transferred to an inner core piece 13.
In another embodiment of the present invention, as shown in fig. 1, 2, 3 and 5, an outer sliding opening 23 is formed on one side of the outer portion of the outer cylinder 15, a sliding block 24 is slidably clamped inside the outer sliding opening 23, the outer sliding opening 23 is of an inclined structure, and the sliding block 24 can move in the outer sliding opening 23.
In another embodiment provided by the invention, as shown in fig. 1, 2,3 and 5, a threaded hole 28 is formed on one side of the movable plate 8, a fastening bolt 20 is inserted into the threaded hole 28 in a threaded manner, and the fastening bolt 20 is inserted into the threaded hole 28 in a rotating manner.
In another embodiment provided by the invention, as shown in fig. 1, 2, 3 and 5, a connecting plate 9 is welded on one side of the second circuit board layer 3, a fastening bolt 20 is inserted into the connecting plate 9 in a threaded manner, and after the fastening bolt 20 rotates into the movable plate 8 and the connecting plate 9, the fastening bolt 20 is clamped in a threaded hole 28, so that the pressing bar 7 on the pressing bar 21 is stabilized above the inner chip 13.
In another embodiment provided by the invention, as shown in fig. 1,2 and 3, a vertical frame 5 is fixedly arranged at one side of the top of an external connecting plate 14, a compression joint piece 6 is arranged at one side of the vertical frame 5 through a torsion spring, the compression joint piece 6 is movably arranged at one side of the vertical frame 5 through the torsion spring, the compression joint piece 6 is downwards pressed at one end of a conductive piece 4, an external connecting wire is attached to one end of the conductive piece 4, and after the internal connecting wire 13 is pressed, the internal connecting wire is pressed together with one end of the conductive piece 4 through the internal connecting wire 13, so that the circuit board body 1 is successfully compressed.
In another embodiment provided by the invention, as shown in fig. 1,2,3 and 4, the inner core 13 is adhered to the inside of the press-connection piece 6, the layer insert 29 is inserted into the inside of the layer slot 19, the layer insert 29 has a plurality of conical structures, the layer insert 29 can be snapped into the inside of the layer slot 19, the connection tightness between the press-connection top piece 10 and the press-connection bottom piece 11 is enhanced, and the elastic outer frame 18 is snapped into the inside of the press-connection bottom piece 11.
The manufacturing method of the circuit board with the crimping structure comprises the following steps:
s1, preparing raw materials: preparing copper-clad plates and a synthetic resin substrate main material, and then preparing a film and a conductive film auxiliary material;
S2, cutting and polishing: cutting and polishing the copper-clad plate and the synthetic resin substrate main material into a first circuit board layer 2 and a second circuit board layer 3, and cutting and polishing the used residual synthetic resin substrate into a press-connection top piece 10 and a press-connection bottom piece 11;
s3, bonding grooving: bonding a rubber pad 17 and an elastic outer frame 18 on the press-connection top piece 10, and opening a slot 16 and a layer slot 19 in the press-connection top piece 10 by using a slotting device to press the press-connection top piece 10 into the press-connection bottom piece 11;
S4, processing parts: the conductive piece is made into a conductive piece 4 and welded on the first circuit board layer 2, the rest synthetic resin substrate is cut into parts such as a pressing strip 7, a pressing rod 21, a sliding block 24, an outer cylinder 15, an outer cylinder 25 and the like, after holes are milled in the outer cylinder 15, the pressing rod 21 is arranged in the outer cylinder 25 through a movable bearing 27;
S5, mounting and crimping: the spring 26 is welded to the lower end of the outer cylinder 15, the movable plate 8 is arranged under the spring 26, the anti-slip film 12 is adhered under the pressing strip 7 by adopting adhesive, the pressing strip 7 is rotated and pressed from the left side to enable the movable plate 8 to be pressed downwards, and the conductive piece 4 under the inner chip 13 is pressed and connected with an external circuit.
Preferably, in S2, the cutting speed of the copper-clad sheet and the synthetic resin substrate main material is 240 rpm, and the polishing speed is 380 rpm.
Preferably, in S3, the slotting device slots at a stroke of 300 mm/min, and in S4, the rotation speed of the milling holes in the outer cylinder 15 is 300 revolutions/min.
Working principle: the operator presses the first circuit board layer 2 on the second circuit board layer 3, the pressing top piece 10 presses into the pressing bottom piece 11, after the rubber cushion 17 and the elastic outer frame 18 are pressed inwards towards the slot 16, the elastic outer frame 18 outside the rubber cushion 17 can be clamped into the pressing bottom piece 11, the layer plug 29 in the pressing bottom piece 11 is inserted into the layer slot 19 in the pressing top piece 10, the pressing top piece 10 is tightly attached to the pressing bottom piece 11, the first circuit board layer 2 and the second circuit board layer 3 are pressed, the conductive piece 4 is arranged on one side of the first circuit board layer 2, the torsion spring beside the vertical frame 5 can enable the pressing piece 6 to be pressed at one end of the conductive piece 4, the operator pushes the pressing bar 7, the pressing bar 7 is rotated and pressed from the left side, the pressing bar 21 is connected under the pressing bar 7, after the pressing rod 21 rotates, the sliding block 24 on the pressing rod 21 slides on the outer sliding opening 23 on the outer cylinder 15, the sliding block 24 slides from the upper side of the outer sliding opening 23 to the lower side of the outer sliding opening 23, the pressing rod 21 rotates in the outer cylinder 25 through the movable bearing 27, after the sliding block 24 slides to the lower side of the outer sliding opening 23, the pressing rod 21 rotates in the outer cylinder 25 and simultaneously presses downwards, the spring 26 extends, the movable plate 8 also presses downwards, after the movable plate 8 is attached to the connecting plate 9, the fastening bolt 20 rotates and is inserted into the threaded hole 28 to fixedly connect the movable plate 8 with the connecting plate 9, the anti-slip film 12 under the pressing strip 7 can be attached to the inner core piece 13 in the pressing piece 6, one end of the conductive piece 4 under the inner core piece 13 is pressed together with an external circuit, and one end of the conductive piece 4 is connected with the external circuit.
While certain exemplary embodiments of the present invention have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the invention, which is defined by the appended claims.
Claims (10)
1. The circuit board with the crimping structure comprises a circuit board body (1), and is characterized in that the circuit board body (1) comprises a first circuit board layer (2) and a second circuit board layer (3), a plurality of crimping top pieces (10) are fixedly arranged at the bottom of the first circuit board layer (2), rubber pads (17) are adhered to two sides of the bottom of the first circuit board layer (2), elastic outer sleeves (18) are uniformly formed on two sides of the outer sides of the rubber pads (17), slots (16) are formed on two sides of the bottom of the crimping top pieces (10), layer slots (19) are formed on the bottom of the crimping top pieces (10), a plurality of crimping bottom pieces (11) are fixedly arranged in the second circuit board layer (3), a layer plug-in piece (29) is fixedly arranged on the outer side of the crimping bottom pieces (11), a conductive piece (4) is welded on one side of the top of the first circuit board layer (2), an outer sleeve (14) is internally provided with an outer sleeve (15) through bolts, a bottom end (26) of the outer sleeve (15) is fixedly arranged on the bottom of the spring (26), an extension sleeve (25) is welded on the bottom of the spring (8), an extension sleeve (25) is fixedly arranged on the bottom of the spring (26), the inside of the movable bearing (27) is movably connected with a press-connection rod (21), one side of the press-connection rod (21) is welded with a sliding block (24), and the top end of the press-connection rod (21) is provided with a clamping head (22); after the press-connection top piece (10) is pressed into the press-connection bottom piece (11), the elastic outer frame (18) is movably pressed on the outer side of the slot (16) through the rubber pad (17), so that the elastic outer frame (18) is pressed in the press-connection bottom piece (11), the layer insert (29) is clamped into the layer slot (19), the layer insert (29) is prevented from sliding out of the layer slot (19), and the circuit board layer I (2) and the circuit board layer II (3) are pressed and combined.
2. The circuit board with the crimping structure according to claim 1, wherein a pressing strip (7) is sleeved between the clamping head (22) and the crimping rod (21), and an anti-slip film (12) is adhered to the bottom of the pressing strip (7).
3. The circuit board with the crimping structure according to claim 1, wherein an outer sliding opening (23) is formed on one side of the outer cylinder (15), and the sliding block (24) is slidably clamped in the outer sliding opening (23).
4. The circuit board with the crimping structure according to claim 1, wherein a threaded hole (28) is formed in one side of the movable plate (8), and a fastening bolt (20) is inserted into the threaded hole (28) in an internal thread manner.
5. The circuit board with the crimping structure according to claim 4, wherein a connecting plate (9) is welded on one side of the second circuit board layer (3), and the fastening bolt (20) is in threaded connection with the inside of the connecting plate (9).
6. The circuit board with the crimping structure according to claim 1, characterized in that a vertical frame (5) is fixedly installed on one side of the top of the external board (14), and a crimping piece (6) is arranged on one side of the vertical frame (5) through a torsion spring.
7. A circuit board with a press-fit structure according to claim 6, characterized in that the inner core (13) is adhered to the inside of the press-fit sheet (6), the layer insert (29) is inserted into the inside of the layer slot (19), and the elastic outer frame (18) is stuck inside the press-fit base (11).
8. A method for manufacturing a circuit board with a press-fit structure, comprising the circuit board with a press-fit structure according to any one of claims 1 to 7, characterized by comprising the steps of:
s1, preparing raw materials: preparing copper-clad plates and a synthetic resin substrate main material, and then preparing a film and a conductive film auxiliary material;
S2, cutting and polishing: cutting and polishing the copper-clad plate and the synthetic resin substrate main material into a first circuit board layer (2) and a second circuit board layer (3), and cutting and polishing the used residual synthetic resin substrate into a press-connection top piece (10) and a press-connection bottom piece (11);
S3, bonding grooving: bonding a rubber pad (17) and an elastic outer frame (18) on the compression joint top piece (10), and opening a slot (16) and a layer slot (19) in the compression joint top piece (10) by using slotting equipment to press the compression joint top piece (10) into the compression joint bottom piece (11);
S4, processing parts: the conductive piece is made into a conductive piece (4) and welded on a first circuit board layer (2), the rest synthetic resin substrate is cut into parts such as a pressing strip (7), a press connection rod (21), a sliding block (24), an outer cylinder (15), an outer extension cylinder (25) and the like, after holes are milled in the outer cylinder (15), the press connection rod (21) is arranged in the outer extension cylinder (25) through a movable bearing (27);
s5, mounting and crimping: the spring (26) is welded to the lower end of the outer cylinder (15), the movable plate (8) is arranged under the spring (26), the anti-slip rubber sheet (12) is adhered under the pressing bar (7) by adopting an adhesive, the pressing bar (7) rotates and presses from the left side to enable the movable plate (8) to downwards press, and the conductive piece (4) under the inner core piece (13) is in press connection with an external circuit.
9. The method of manufacturing a circuit board with a press-fit structure according to claim 8, wherein in S2, the cutting speed of the copper-clad sheet material and the synthetic resin substrate main material is 120-400 rpm, and the polishing speed is 200-550 rpm.
10. The method for manufacturing a circuit board with a press-connection structure according to claim 8, wherein in S3, the slotting device slots with a stroke of 300 mm/min, and in S4, the rotation speed of the milled holes in the outer cylinder (15) is 180-650 rpm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311389435.5A CN117202497B (en) | 2023-10-24 | 2023-10-24 | Circuit board with crimping structure and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311389435.5A CN117202497B (en) | 2023-10-24 | 2023-10-24 | Circuit board with crimping structure and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN117202497A CN117202497A (en) | 2023-12-08 |
| CN117202497B true CN117202497B (en) | 2024-05-28 |
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| CN202311389435.5A Active CN117202497B (en) | 2023-10-24 | 2023-10-24 | Circuit board with crimping structure and manufacturing method thereof |
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| CN114126255A (en) * | 2021-11-17 | 2022-03-01 | 广德宝达精密电路有限公司 | Manufacturing process of novel high-heat-conductivity high-order high-density printed circuit board |
| KR20220096616A (en) * | 2020-12-31 | 2022-07-07 | 주식회사 유라코퍼레이션 | PCB multilayer connection structure |
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