CN117192703B - Optical chip, laser radar and mobile device - Google Patents
Optical chip, laser radar and mobile device Download PDFInfo
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- CN117192703B CN117192703B CN202311221840.6A CN202311221840A CN117192703B CN 117192703 B CN117192703 B CN 117192703B CN 202311221840 A CN202311221840 A CN 202311221840A CN 117192703 B CN117192703 B CN 117192703B
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- 230000003287 optical effect Effects 0.000 title claims abstract description 185
- 238000005253 cladding Methods 0.000 claims abstract description 29
- 239000013307 optical fiber Substances 0.000 claims description 73
- 238000001514 detection method Methods 0.000 claims description 51
- 230000010355 oscillation Effects 0.000 claims description 30
- 239000000523 sample Substances 0.000 claims description 5
- 230000035559 beat frequency Effects 0.000 description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 14
- 230000005693 optoelectronics Effects 0.000 description 14
- 229910052710 silicon Inorganic materials 0.000 description 14
- 239000010703 silicon Substances 0.000 description 14
- 238000010168 coupling process Methods 0.000 description 11
- 238000005859 coupling reaction Methods 0.000 description 11
- 230000008878 coupling Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000001427 coherent effect Effects 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
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Abstract
The embodiment of the application discloses an optical chip, a laser radar and movable equipment, wherein the optical chip comprises a cladding, an edge coupler array, a first connecting waveguide module and a second connecting waveguide module. The edge coupler array comprises a first coupler array, a second coupler array and a third coupler array which are respectively positioned on two opposite sides of the first coupler array, and the second coupler array and the third coupler array comprise two edge couplers. The first connecting waveguide module is respectively connected with two edge couplers in the second coupler array. The second connecting waveguide modules are respectively connected with two edge couplers in the third coupler array. Compared with the prior art, the optical paths of the two edge couplers in the edge coupler array are conducted through the waveguide, the first connecting waveguide module and the second connecting waveguide module can be designed to be shorter, the occupied area is smaller, the area utilization rate of the optical chip can be improved, and the cost is reduced.
Description
Technical Field
The application relates to the technical field of laser detection equipment, in particular to an optical chip, a laser radar and movable equipment.
Background
The frequency modulation continuous wave (Frequency Modulated Continuous Wave, FMCW) laser radar is a high-performance laser radar based on a linear frequency modulation light source and a coherent receiving technology, and has the advantages of high receiving sensitivity, environmental light interference resistance and the like. In an FMCW lidar system, how to realize the optical modulation coupling of a silicon optical chip and an optical signal outside the silicon optical chip is a research hotspot of an FMCW lidar.
FMCW lidar employs a high integration silicon optical chip to achieve multi-channel coherent detection, typically requiring multiple optical coupling into the silicon optical chip. The currently used multi-channel in-coupling scheme is edge coupling, i.e. each channel couples light into the channel via one edge coupler, and uses Fiber Array (FA) to perform coupling alignment with each edge coupler of the silicon optical chip, so that the optical signals in the Fiber Array enter the silicon optical chip and implement coherence. In the related art, a longer waveguide is generally required to be added on the silicon optical chip to connect the edge couplers at two side edge positions, so as to detect the assembly angle of the FA and the silicon optical chip, and ensure the dimming accuracy of each channel. However, adding waveguides to the silicon photonics chip that bridge the edge couplers on both side edge locations, while effective in reducing the coupling step, the waveguide structure occupies too much area on the silicon photonics chip, increases the cost of the silicon photonics chip, and may affect the layout of other devices on the silicon photonics chip.
Disclosure of Invention
The embodiment of the application provides an optical chip, a laser radar and movable equipment, which are used for improving the defect that the waveguide structure occupies too much area on a silicon optical chip by adding a waveguide of an edge coupler bridged at the edge positions of two sides on the silicon optical chip to carry out light modulation.
In a first aspect, embodiments of the present application provide an optical chip including a cladding, an edge coupler array, a first connecting waveguide module, and a second connecting waveguide module. The edge coupler array is arranged on the cladding and comprises a plurality of edge couplers arranged at intervals along a first direction, the edge coupler array comprises a first coupler array, a second coupler array and a third coupler array, the first coupler array comprises at least two edge couplers, the second coupler array and the third coupler array comprise two edge couplers, and the second coupler array and the third coupler array are respectively positioned on two opposite sides of the first coupler array along the first direction. The first connecting waveguide module is arranged on the cladding layer and is respectively connected with the two edge couplers in the second coupler array so as to conduct the light paths of the two edge couplers in the second coupler array. The second connecting waveguide module is arranged on the cladding layer and is respectively connected with the two edge couplers in the third coupler array so as to conduct the light paths of the two edge couplers in the third coupler array.
In a second aspect, an embodiment of the present application provides a laser radar, including the optical chip and an optical fiber array, where the optical fiber array includes a plurality of optical fibers disposed at intervals along the first direction, and each optical fiber corresponds to each edge coupler.
In a third aspect, embodiments of the present application provide a mobile device including a mobile body and a lidar as described above.
According to the optical chip, the laser radar and the movable equipment, the two edge coupler light paths in the second coupler array are conducted through the first connecting waveguide module, and the alignment condition of the two edge couplers in the second coupler array and corresponding optical fibers can be monitored. The second connecting waveguide module is used for conducting the light paths of the two edge couplers in the third coupler array, so that the alignment condition of the two edge couplers in the third coupler array and the corresponding optical fibers can be monitored. Based on the monitored alignment condition, the relative positions of the optical chip and the optical fiber array can be adjusted, so that the two edge couplers in the second coupler array and the corresponding optical fibers and the two edge couplers in the third coupler array and the corresponding optical fibers are at or near the optimal positions, and then the optical chip and the optical fiber array are fixed at the positions, the optical alignment of the optical chip and the optical fiber array can be realized, and the coupling loss between each edge coupler and the corresponding optical fiber is the lowest.
In addition, in the embodiment of the application, the first connecting waveguide module is used for conducting the light paths of the two edge couplers in the second edge coupler array, the second connecting waveguide module is used for conducting the light paths of the two edge couplers in the third edge coupler array, compared with the prior art that the light paths of the two edge couplers in the edge coupler array are conducted through a waveguide and the waveguide spans all the edge couplers, the first connecting waveguide module and the second connecting waveguide module can be designed to be shorter, the occupied area of the optical chip is smaller, the area utilization rate of the optical chip can be improved, and the manufacturing cost of the optical chip is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a lidar according to an embodiment of the present application;
Fig. 2 is a schematic structural diagram of an optical chip according to a first embodiment of the present application;
fig. 3 is a schematic structural diagram of an optical chip according to a second embodiment of the present application;
fig. 4 is a schematic structural diagram of an optical chip according to a third embodiment of the present application;
fig. 5 is a schematic structural diagram of an optical chip according to a fourth embodiment of the present application;
fig. 6 is a schematic structural diagram of an optical chip according to a fifth embodiment of the present application;
fig. 7 is a schematic structural diagram of an optical chip according to a sixth embodiment of the present application;
fig. 8 is a schematic structural view of an optical chip according to a seventh embodiment of the present application;
fig. 9 is a schematic structural diagram of an optical chip according to an eighth embodiment of the present application;
fig. 10 is a schematic structural diagram of a mobile device according to an embodiment of the present application.
Reference numerals illustrate:
1. a laser radar; 2. a removable device; 3. a main body;
10. an optical chip;
11. a cladding layer;
12. an array of edge couplers; 121a, a first coupler array; 121b, a second coupler array; 121c, a third coupler array; 121. an edge coupler; 1211. a first coupler; 1212. a second coupler;
13. a first connection waveguide module; 131. a first beam splitter; 1311. a first input; 1312. a first output terminal; 1313. a second output terminal;
14. A second connecting waveguide module; 141. a second beam splitter; 1411. a second input terminal; 1412. a third output; 1413. a fourth output terminal;
151. the first photoelectric detection module; 152. the second photoelectric detection module; 153. the third photoelectric detection module; 154. a fourth photoelectric detection module;
16. a third beam splitter; 161. a third input; 162. a fifth output terminal;
17. a fourth beam splitter; 171. a fourth input; 172. a sixth output terminal;
18. a wave-division multiplexer; 181. an incident end; 182. a first exit end; 183. a second exit end;
19. a launch waveguide; 110. a receiving waveguide;
20. an optical fiber array; 21. an optical fiber;
x, first direction.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the following detailed description of the embodiments of the present application will be given with reference to the accompanying drawings.
When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the accompanying claims.
Referring to fig. 1, an embodiment of a laser radar 1 is provided, where the laser radar 1 includes an optical chip 10 and an optical fiber array 20. The optical chip 10 includes a cladding layer 11 and an edge coupler array 12 disposed on the cladding layer 11, and the edge coupler array 12 includes a plurality of edge couplers 121 disposed at intervals along a first direction x. The optical fiber array 20 includes a plurality of optical fibers 21 spaced along the first direction x, and each optical fiber 21 corresponds to each edge coupler 121. The edge coupler 121 is used to receive the optical signal transmitted from the optical fiber 21 outside the optical chip 10, so that the optical signal enters the optical chip 10. The optical fiber array 20 includes a plurality of optical fibers 21 arranged at intervals along the first direction x means that: the plurality of optical fibers 21 in the optical fiber array 20 are arranged at intervals along the first direction x at one end near the edge coupler 121, and the other ends of the optical fibers 21 may be arranged in any shape such as curved, straight, or the like as required, which is not limited. The correspondence between each optical fiber 21 and each edge coupler 121 means that: one end of each optical fiber 21 near the edge coupler 121 corresponds to each edge coupler 121.
Further, the optical chip 10 further includes a first connecting waveguide module 13 and a second connecting waveguide module 14 disposed on the cladding 11. The edge coupler array 12 includes a first coupler array 121a, a second coupler array 121b, and a third coupler array 121c, where the first coupler array 121a includes at least two edge couplers 121, the second coupler array 121b, and the third coupler array 121c each include two edge couplers 121, and the second coupler array 121b and the third coupler array 121c are respectively located at opposite sides of the first coupler array 121a along a first direction x. The first connecting waveguide module 13 is connected to the two edge couplers 121 in the second coupler array 121b, respectively, so as to make the two edge couplers 121 in the second coupler array 121b optically conduct. The second connecting waveguide module 14 is connected to the two edge couplers 121 in the third coupler array 121c, respectively, so as to make the two edge couplers 121 in the third coupler array 121c optically conductive.
In this embodiment, the first connecting waveguide module 13 conducts the optical paths of the two edge couplers 121 in the second coupler array 121b, so that the alignment condition between the two edge couplers 121 in the second coupler array 121b and the corresponding optical fibers 21 can be monitored. For example, the optical fibers 21 corresponding to the two edge couplers 121 in the second coupler array 121b are respectively connected to a first light source and a first light detector, and the first light detector can feed back the optical power of the received optical signal in real time so as to obtain the maximum value of the optical power, and then the optimal positions of the two edge couplers 121 and the corresponding optical fibers 21 in the second coupler array 121b can be determined according to the maximum value of the optical power. The first photo detector may feed back the optical power of the optical signal through the photo current, if the photo current reaches the maximum value, it is considered that the optical power of the optical signal received by the first photo detector reaches the maximum value, and the two edge couplers 121 in the second coupler array 121b and the corresponding optical fibers 21 are adjusted to the optimal positions, so that the coupling loss is the lowest.
The alignment of the two edge couplers 121 in the third coupler array 121c with the corresponding optical fibers 21 can be monitored by the second connecting waveguide module 14 making the two edge couplers 121 in the third coupler array 121c optically conductive. For example, the optical fibers 21 corresponding to the two edge couplers 121 in the third coupler array 121c are respectively connected to a second light source and a second light detector, and the second light detector can feed back the optical power of the received optical signal in real time so as to obtain the maximum value of the optical power, and then the optimal positions of the two edge couplers 121 and the corresponding optical fibers 21 in the third coupler array 121c can be determined according to the maximum value of the optical power. The second photodetector may feed back the optical power of the optical signal through the photocurrent, and if the photocurrent reaches the maximum value, it is considered that the optical power of the optical signal received by the second photodetector reaches the maximum value, and the two edge couplers 121 in the third coupler array 121c and the corresponding optical fibers 21 are adjusted to the optimal positions, so that the coupling loss is the lowest.
Based on the above-mentioned monitored alignment conditions, the relative positions of the optical chip 10 and the optical fiber array 20 may be adjusted, so that the two edge couplers 121 in the second coupler array 121b and the corresponding optical fibers 21, and the two edge couplers 121 in the third coupler array 121c and the corresponding optical fibers 21 are both at or near the optimal positions, and then the optical chip 10 and the optical fiber array 20 are fixed at the positions, so that the optical alignment of the optical chip 10 and the optical fiber array 20 may be achieved, and the coupling loss between each edge coupler 121 and the corresponding optical fiber 21 is the lowest.
Note that, the spacing between every two adjacent edge couplers 121 in the optical chip 10 is equal to the spacing between two adjacent optical fibers 21 in the optical fiber array 20, so that after the two edge couplers 121 in the second coupler array 121b located at the edge and the corresponding optical fibers 21 are adjusted to the optimal position or near the optimal position, the two edge couplers 121 in the third coupler array 121c located at the edge and the corresponding optical fibers 21 are adjusted to the optimal position or near the optimal position, almost all the edge couplers 121 in the optical chip 10 and the corresponding optical fibers 21 are adjusted to the optimal position or near the optimal position. The edge couplers 121 in the optical chip 10 may be equally spaced along the first direction x, and the optical fibers 21 in the optical fiber array 20 may be equally spaced along the first direction x.
The equal interval between every two adjacent edge couplers 121 in the optical chip 10 and the corresponding adjacent optical fibers 21 in the optical fiber array 20 means that: among the plurality of optical fibers 21 in the optical fiber array 20, the pitch between one end of each adjacent two optical fibers 21 near the edge coupler 121 is equal to the pitch between the corresponding adjacent two edge couplers 121. The optical fibers 21 in the optical fiber array 20 are equally spaced along the first direction x: the plurality of optical fibers 21 in the optical fiber array 20 are equally spaced apart along the first direction x at one end near the edge coupler 121.
Based on the existing processing technology, the high processing precision of the optical chip 10 and the high processing precision of the optical fiber array 20 can be realized, the distance between every two adjacent edge couplers 121 in the optical chip 10 is equal to the distance between two corresponding adjacent optical fibers 21 in the optical fiber array 20, and the alignment precision of the edge couplers 121 in the optical chip 10 and the optical fibers 21 in the optical fiber array 20 is ensured.
According to the embodiment of the application, only the alignment condition of the two edge couplers 121 in the second coupler array 121b and the corresponding optical fibers 21 and the alignment condition of the two edge couplers 121 in the third coupler array 121c and the corresponding optical fibers 21 are monitored, so that the alignment accuracy of all the edge couplers 121 in the optical chip 10 and the corresponding optical fibers 21 in the optical fiber array 20 can be ensured without monitoring the coupling loss of all the channels, the packaging efficiency is improved, and the packaging cost is reduced.
In addition, in the embodiment of the present application, the first connecting waveguide module 13 is used for conducting the optical paths of the two edge couplers 121 in the second edge coupler array 121b, and the second connecting waveguide module 14 is used for conducting the optical paths of the two edge couplers 121 in the third edge coupler array 121c, so that compared with the related art in which the optical paths of the two edge couplers in the edge coupler array are conducted by a waveguide and the waveguide spans all the edge couplers, the first connecting waveguide module 13 and the second connecting waveguide module 14 can be designed to be shorter, the occupied area of the optical chip 10 is smaller, the area utilization rate of the optical chip 10 can be improved, and the manufacturing cost of the optical chip 10 is reduced. Meanwhile, since the second coupler array 121b, the first connecting waveguide module 13, the third coupler array 121c and the second connecting waveguide module 14 are all located at the outermost side of the whole coupler array 12, the layout of the devices does not affect the layout of the devices on the optical path where the middle first coupler array 121a is located.
Referring to fig. 1 to 4, the first connecting waveguide module 13 may include an input end and at least one output end, wherein the input end may be connected to one edge coupler 121 in the second coupler array 121b, and the output end may be connected to another edge coupler 121 in the second coupler array 121b, so as to implement optical conduction between the two edge couplers 121 in the second coupler array 121 b. When the first connecting waveguide module 13 includes at least two output ends, one of the output ends is connected to another edge coupler 121 in the second coupler array 121b, and the other output ends can be connected to an optoelectronic device (e.g., a photodetection module) on the optical chip 10, so that the edge coupler 121 in the second coupler array 121b can serve other purposes besides monitoring the alignment with the optical fibers 21 in the optical fiber array 20, and can improve the utilization of the optical chip 10, which will be described in more detail below.
Referring to fig. 1, if the first connecting waveguide module 13 includes an input end and an output end, the first connecting waveguide module 13 may include a connecting waveguide, and two ends of the connecting waveguide are respectively configured as an input end and an output end of the first connecting waveguide module 13.
Referring to fig. 2 to 4, if the first connecting waveguide module 13 includes an input end and at least two output ends, the first connecting waveguide module 13 may include a first optical splitter 131, and the first optical splitter 131 includes a first input end 1311, a first output end 1312, and a second output end 1313. The first input end 1311 is connected to one edge coupler 121 in the second coupler array 121b, the first output end 1312 is connected to another edge coupler 121 in the second coupler array 121b, and the second output end 1313 can be connected to a corresponding optoelectronic device according to an actual application scenario. Among the optical signals output by the first optical splitter 131, a very small portion of the optical signals are output through the first output end 1312, and a large portion of the optical signals are output through the second output end 1313, so that the arrangement of the first connection waveguide module 13 has little influence on the light receiving power of the optoelectronic device connected to the second output end 1313.
Referring to fig. 2 and 3, the first optical splitter 131 may be a directional coupler. For example, the directional coupler may include at least two connection waveguides, wherein both ends of one connection waveguide may be respectively configured as a first input end 1311 and an output end (one of the first output end 1312 and the second output end 1313) of the first connection waveguide module 13, and the remaining connection waveguides are directionally coupled to the connection waveguides, and one end of the remaining connection waveguide may be configured as the remaining output end (the other of the first output end 1312 and the second output end 1313) of the first connection waveguide module 13. It should be noted that, referring to fig. 2 and fig. 3, as shown in fig. 2, two ends of a connection waveguide may be provided to form the first input end 1311 and the first output end 1312, one end of another connection waveguide is coupled to the previous connection waveguide, and the other end of the other connection waveguide is the second output end 1313; as shown in fig. 3, two ends of a connection waveguide may be configured as a first input end 1311 and a second output end 1313, respectively, that is, two ends of the connection waveguide are connected to one edge coupler 121 in the second coupler array 121b and the optoelectronic device on the optical chip 10, respectively, while one end of another connection waveguide is coupled to the previous connection waveguide, and the other end of the other connection waveguide is configured as a first output end 1312, that is, the other connection waveguide is connected to the other edge coupler 121 in the second coupler array 121 b. Thus, the optical signal received by one edge coupler 121 in the second coupler array 121b may be mainly transmitted to the optoelectronic devices such as the photodetection element on the optical chip 10, and a very small portion of the optical signal is coupled into the other edge coupler 121 and then transmitted to the first photodetector, so as to monitor the optical power of the optical signal. Since most of the optical signal will be transmitted to the above-mentioned optoelectronic device on the optical chip 10, the arrangement of the first connection waveguide module 13 in the embodiment of the present application has little influence on the signal detection of the above-mentioned optoelectronic device.
Referring to fig. 4, the first optical splitter 131 in the embodiment of the present application may also be a multimode interference coupler, where the multimode interference coupler includes the first input end, the first output end, and the second output end, and the specific selection of the first optical splitter 131 in the embodiment of the present application is not limited.
Referring to fig. 1 to 4, the second connecting waveguide module 14 may include an input end and at least one output end, wherein the input end may be connected to one edge coupler 121 in the third coupler array 121c, and the output end may be connected to another edge coupler 121 in the third coupler array 121c, so as to implement optical path conduction between the two edge couplers 121 in the third coupler array 121 c. When the second connecting waveguide module 14 includes at least two output ends, one of the output ends is connected to another edge coupler 121 in the third coupler array 121c, and the other output ends can be connected to an optoelectronic device on the optical chip 10, so that the edge coupler 121 in the third coupler array 121c can serve other purposes besides monitoring the alignment with the optical fiber 21 in the optical fiber array 20, and can improve the utilization of the optical chip 10, which will be described in more detail below.
Referring to fig. 1, if the second connecting waveguide module 14 includes an input end and an output end, the second connecting waveguide module 14 may include a connecting waveguide, and two ends of the connecting waveguide are respectively configured as an input end and an output end of the second connecting waveguide module 14.
Referring to fig. 2 to 4, if the second connecting waveguide module 14 includes an input end and at least two output ends, the second connecting waveguide module 14 may include a second optical splitter 141, and the second optical splitter 141 includes a second input end 1411, a third output end 1412 and a fourth output end 1413. The second input 1411 is connected to one edge coupler 121 in the third coupler array 121c, the third output 1412 is connected to another edge coupler 121 in the third coupler array 121c, and the fourth output 1413 can be connected to a corresponding optoelectronic device according to the actual application scenario. Among the optical signals output by the second optical splitter 141, a very small portion of the optical signals are output via the third output terminal 1412, and a large portion of the optical signals are output via the fourth output terminal 1413, so that the arrangement of the second connection waveguide module 14 has little influence on the optical power of the optoelectronic device connected to the fourth output terminal 1413.
Referring to fig. 2 and 3, the second beam splitter 141 may be a directional coupler. For example, the directional coupler may include at least two connection waveguides, wherein both ends of one connection waveguide may be respectively configured as the second input end 1411 and one output end (one of the third output end 1412 and the fourth output end 1413) of the second connection waveguide module 14, and the remaining connection waveguide may be coupled thereto, and one end of the remaining connection waveguide may be configured as the remaining output end (the other of the third output end 1412 and the fourth output end 1413) of the second connection waveguide module 14. It should be noted that, referring to fig. 2 and fig. 3, as shown in fig. 2, two ends of a connecting waveguide may be provided to form the second input end 1411 and the third output end 1412, one end of another connecting waveguide is coupled to the previous connecting waveguide, and the other end of the other connecting waveguide is the fourth output end 1413; as shown in fig. 3, two ends of a connection waveguide may be configured as a second input end 1411 and a fourth output end 1413, respectively, that is, two ends of the connection waveguide are connected to one edge coupler 121 in the third coupler array 121c and the optoelectronic device on the optical chip 10, respectively, while one end of another connection waveguide is coupled to the previous connection waveguide, and the other end of the other connection waveguide is configured as a third output end 1412, that is, the other connection waveguide is connected to the other edge coupler 121 in the third coupler array 121 c. Thus, the optical signal received by one edge coupler 121 in the third coupler array 121c is mainly transmitted to the optoelectronic devices such as the photodetection element on the optical chip 10, and a very small portion of the optical signal is coupled into the other edge coupler 121 and is further transmitted to the second photodetector, so as to monitor the optical power of the optical signal. Since most of the optical signals will be transmitted to the above-described optoelectronic devices and the like on the optical chip 10, the arrangement of the second connecting waveguide module 14 in the embodiment of the present application has little influence on the signal detection of the optoelectronic devices such as the photodetection element.
Referring to fig. 4, the second optical splitter 141 in the embodiment of the present application may also be a multimode interference coupler, where the multimode interference coupler includes the second input end, the third output end, and the fourth output end, and the specific selection of the second optical splitter 141 in the embodiment of the present application is not limited. The combination of the first beam splitter 131 and the second beam splitter 141 in the embodiment of the present application is not limited to the combination of fig. 2 to 4, and can be flexibly adjusted according to actual requirements.
Next, the structure of the optical chip 10 when the first connection waveguide module 13 includes the first beam splitter 131 and the second connection waveguide module 14 includes the second beam splitter 141 will be described in detail.
In an exemplary embodiment, referring to fig. 4 and 5, the optical chip 10 further includes at least two first photoelectric detection modules 151 disposed on the cladding 11. Each first photo-detecting module 151 is connected to two components of all the edge couplers 121, the second output end 1313 and the fourth output end 1413 in the first coupler array 121a, respectively, and the components connected to different first photo-detecting modules 151 are different. It should be noted that, the first photoelectric detection module 151 is configured to receive the local oscillation light and the echo light, so that the local oscillation light and the echo light perform beat frequency, and convert beat frequency signals of the local oscillation light and the echo light into electrical signals; that is, one of the two components connected to the first photoelectric detection module 151 is used for transmitting local oscillation light, and the other is used for transmitting echo light.
In the present exemplary embodiment, referring to fig. 4 and 5, each two adjacent components among all the edge couplers 121, the second output port 1313, and the fourth output port 1413 in the first coupler array 121a are connected to the same first photo detection module 151. That is, one of every two adjacent components is used for transmitting local oscillation light and one is used for transmitting return wave light, so that the device layout on the optical chip 10 can be made more regular, and the manufacturing cost of the optical chip 10 can be reduced. Further, among the above-mentioned all components, a component for transmitting the echo light is provided between two adjacent components for transmitting the local oscillation light, and a component for transmitting the local oscillation light is provided between two adjacent components for transmitting the echo light, i.e. the component for transmitting the echo light, the component for transmitting the local oscillation light and the component for transmitting the echo light are alternately arranged.
In this exemplary scenario, referring to fig. 5, one edge coupler 121 of the second coupler array 121b, which is close to the first coupler array 121a, may be connected to the first input end 1311 of the first beam splitter 131, and one edge coupler 121 of the third coupler array 121c, which is close to the first coupler array 121a, may be connected to the second input end 1411 of the second beam splitter 141. The light receiving ends corresponding to every two adjacent parts in all the parts can be distributed at equal intervals along the first direction x.
In another exemplary embodiment, referring to fig. 6, the optical chip 10 further includes a third optical splitter 16 disposed on the cladding 11, at least two second photoelectric detection modules 152, a fourth optical splitter 17, and at least two third photoelectric detection modules 153. The third optical splitter 16 includes a third input end 161 and at least two fifth output ends 162, the third input end 161 is connected to a second output end 1313, and each second photo-detection module 152 is connected to a fifth output end 162 and an edge coupler 121 in the first coupler array 121 a. The fourth optical splitter 17 includes a fourth input end 171 and at least two sixth output ends 172, the fourth input end 171 is connected to the fourth output end 1413, and each third photo-detection module 153 is connected to a sixth output end 172 and an edge coupler 121 in the first coupler array 121 a. Wherein the edge coupler 121 connected to the first input 1311 is configured to receive the local oscillation, the edge coupler connected to the second input 1411 is configured to receive the local oscillation, and the edge coupler 121 in the first coupler array 121a is configured to receive the reflected oscillation.
In this exemplary embodiment, referring to fig. 6, in the first coupler array 121a, the edge coupler 121 connected to the second photo-detection module 152 is disposed closer to the second coupler array 121b than the edge coupler 121 connected to the third photo-detection module 153, so that the layout of devices on the optical chip 10 is more regular, and the manufacturing cost of the optical chip 10 can be reduced.
In still another exemplary embodiment, referring to fig. 7, the optical chip 10 is applied to a dual laser lidar, and the optical chip 10 further includes a plurality of wavelength division multiplexers 18, a third beam splitter 16, a fourth beam splitter 17, a plurality of second photo-detection modules 152, and a plurality of third photo-detection modules 153 disposed on the cladding 11. The wavelength division multiplexer 18 includes an incident end 181, a first exit end 182 and a second exit end 183, the incident end 181 is connected to the edge coupler 121 in the first coupler array 121a, each wavelength division multiplexer 18 is configured to demultiplex the echo light transmitted by the edge coupler 121 into a first echo light with a first wavelength and a second echo light with a second wavelength, so that the first echo light is output through the first exit end 182, and the second echo light is output through the second exit end 183, where each edge coupler 121 in the first coupler array 121a is connected to one wavelength division multiplexer 18. The third splitter 16 comprises a third input 161 and at least two fifth outputs 162, the third input 161 being connected to a second output 1313. The fourth beam splitter 17 comprises a fourth input 171 and at least two sixth outputs 172, the fourth input 171 being connected to a fourth output 1413. Each of the second photoelectric detection modules 152 is respectively connected to a fifth output end 162 and a first output end 182. Each third photoelectric detection module 153 is respectively connected to a sixth output end 172 and a second output end 183. The edge coupler 121 connected to the first input end 1311 is configured to receive a first local oscillation of a first wavelength, the edge coupler 121 connected to the second input end 1411 is configured to receive a second local oscillation of a second wavelength, and the edge coupler 121 in the first coupler array 121a is configured to receive echo light, where the echo light includes a first echo light of the first wavelength and a second echo light of the second wavelength. In the embodiment of the application, the optical chip 10 is demultiplexed, and compared with the optical chip external demultiplexing, the optical chip external demultiplexing is simpler in structural design and beneficial to reducing the size of the laser radar 1.
Note that, although fig. 2 to 7 illustrate the case where the optical signal transmitted by the edge coupler 121 in the second coupler array 121b and/or the third coupler array 121c can reach the photodetection module, the present application is not limited thereto. In still another exemplary embodiment, referring to fig. 8, when the first connecting waveguide module 13 is provided with only one output end and the second connecting waveguide module 14 is provided with only one output end, the optical chip 10 further includes at least two first photo-detecting modules 151 disposed on the cladding 11, and each first photo-detecting module 151 is connected to two edge couplers 121 in the first coupler array 121a, and the edge couplers 121 to which different first photo-detecting modules 151 are connected are different. The first photoelectric detection module 151 is configured to receive the local oscillation light and the echo light, so that beat frequencies of the local oscillation light and the echo light occur, and convert beat frequency signals of the local oscillation light and the echo light into electrical signals; that is, one of the two edge couplers 121 connected to the first photo-detecting module 151 is used for transmitting local oscillation light, and the other is used for transmitting echo light. In this exemplary embodiment, the edge couplers 121 in the second and third coupler arrays 121b and 121c are used only for light modulation between the optical chip 10 and the optical fiber array 20.
In this exemplary embodiment, referring to fig. 8, two edge couplers 121 corresponding to the same first photo-detection module 151 may be two adjacent edge couplers 121 in all the edge couplers 121 of the first coupler array 121 a. The device layout on the optical chip 10 is made more regular, and the manufacturing cost of the optical chip 10 can be reduced. Further, among all the edge couplers 121 of the first coupler array 121a, an edge coupler 121 for transmitting the echo light is disposed between two adjacent edge couplers 121 for transmitting the echo light, and an edge coupler 121 for transmitting the echo light is disposed between two adjacent edge couplers 121 for transmitting the echo light, that is, all the components for transmitting the echo light are alternately disposed with the component for transmitting the echo light and the component for transmitting the echo light.
Note that, the edge coupler 121 in the first coupler array 121a described in the embodiment corresponding to fig. 2 to 8 is used for transmitting local oscillation light or echo light, and in other embodiments, the edge coupler 121 in the first coupler array 121a may also be used for transmitting probe light. For example, referring to fig. 9, in still another exemplary embodiment, the optical chip 10 further includes a plurality of transmitting waveguides 19, a plurality of receiving waveguides 110, and a plurality of fourth photo-detecting modules 154 disposed on the cladding 11. The edge couplers 121 in the first coupler array 121a are divided into a first coupler 1211 and a second coupler 1212; the first coupler 1211 is connected to a transmitting waveguide 19, the first coupler 1211 is used for receiving and transmitting the probe light, so that the probe light exits through the transmitting waveguide 19 to detect the target object, and the second coupler 1212 is used for receiving and transmitting the local oscillation light. The receiving waveguides 110 and the transmitting waveguides 19 are disposed at intervals, the receiving waveguides 110 are used for receiving the echo light, each transmitting waveguide 19 corresponds to at least one receiving waveguide 110, and the echo light is formed by reflecting the probe light through the target object. Each fourth photo-detection module 154 is connected to a second coupler 1212 and a receiving waveguide 110 corresponding to the transmitting waveguide 19, respectively.
In this exemplary embodiment, referring to fig. 9, the first coupler 1211 and the second coupler 1212 corresponding to the same fourth photo-detection module 154 may be all the edge couplers 121 of the first coupler array 121a, and two adjacent edge couplers 121. The device layout on the optical chip 10 is made more regular, and the manufacturing cost of the optical chip 10 can be reduced. Further, a second coupler 1212 is provided between two adjacent first couplers 1211, and a first coupler 1211 is provided between two adjacent second couplers 1212.
Any one of the first, second, third and fourth photoelectric detection modules 151, 152, 153 and 154 is used for receiving local oscillation light and echo light to realize coherent detection; the specific structure is not limited in this application. The structure of the first photo-detecting module 151 is described below, and the structures of the second photo-detecting module 152, the third photo-detecting module 153 and the fourth photo-detecting module 154 may refer to the first photo-detecting module 151. In some embodiments, the first photo-detection module 151 includes an optical mixer and a balanced photo-detector. The optical mixer is provided with two input ports, one input port is used for receiving the local oscillation light, and the other input port is used for receiving the echo light; thus, the local oscillation light and the echo light can generate beat frequency in the optical mixer to obtain two beat frequency signals, namely a first beat frequency optical signal and a second beat frequency optical signal. Optionally, the optical mixer is a 180-degree optical mixer, and the phase difference between the two output optical signals is 180 degrees. The balanced photoelectric detector is connected with two output ends of the optical mixer and is used for carrying out balanced detection on the first beat frequency optical signal and the second beat frequency optical signal and outputting a first beat frequency signal, wherein the first beat frequency signal is an electric signal and the frequency of the first beat frequency signal is consistent with that of the first beat frequency optical signal and the second beat frequency optical signal. It should be understood that, even though the first photoelectric detection module 151 includes the optical mixer and the balanced photoelectric detector in the embodiment is described as an example, the application is not limited thereto, and it is only required to ensure that the first photoelectric detection module 151 can receive the local oscillation light and the echo light and convert the beat signals of the two into electrical signals. For example, in some other embodiments of the present application, the first photo-detection module 151 includes a photo-detector; the photoelectric detector is used for receiving the local oscillation light and the echo light so as to make the local oscillation light and the echo light beat, and is also used for converting the obtained beat frequency optical signal into an electric signal, namely a first beat frequency signal.
Referring to fig. 10, the embodiment of the present application further provides a mobile device 2, where the mobile device 2 includes a mobile body 3 and the above-mentioned lidar 1. The lidar 1 is mounted on the main body 3. In some embodiments, the mobile device 2 is an automobile, the main body 3 is an automobile body, and the lidar 1 is mounted on the automobile body; it should be understood that, in other implementations of the present application, the mobile device 2 may be a device that is equipped with the laser radar 1, such as a drone, a robot, or the like, which is not limited in this application.
In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context. Furthermore, in the description of the present application, unless otherwise indicated, "a plurality" means at least two, for example, two, three, four, and the like. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.
The foregoing disclosure is only illustrative of the preferred embodiments of the present application and is not intended to limit the scope of the claims herein, as the equivalent of the claims herein shall be construed to fall within the scope of the claims herein.
Claims (10)
1. An optical chip, comprising:
a cladding layer;
the edge coupler array is arranged on the cladding and comprises a plurality of edge couplers which are arranged at intervals along a first direction, the edge coupler array comprises a first coupler array, a second coupler array and a third coupler array, the first coupler array comprises at least two edge couplers, the second coupler array and the third coupler array each comprise two edge couplers, and the second coupler array and the third coupler array are respectively positioned on two opposite sides of the first coupler array along the first direction;
the first connecting waveguide module is arranged on the cladding layer and is respectively connected with the two edge couplers in the second coupler array so as to conduct the light paths of the two edge couplers in the second coupler array; and
and the second connecting waveguide module is arranged on the cladding layer and is respectively connected with the two edge couplers in the third coupler array so as to conduct the light paths of the two edge couplers in the third coupler array.
2. The optical chip of claim 1, further comprising at least two first photo-detection modules disposed in the cladding layer;
each first photoelectric detection module is connected with two edge couplers in the first coupler array, and the edge couplers connected with different first photoelectric detection modules are different.
3. The optical chip of claim 1, wherein the first connection waveguide module comprises a first optical splitter;
the first optical splitter comprises a first input end, a first output end and a second output end, wherein the first input end is connected with one edge coupler in the second coupler array, and the first output end is connected with the other edge coupler in the second coupler array.
4. The optical chip of claim 3, wherein the second connection waveguide module comprises a second optical splitter;
the second optical splitter comprises a second input end, a third output end and a fourth output end, wherein the second input end is connected with one edge coupler in the third coupler array, and the third output end is connected with the other edge coupler in the third coupler array.
5. The optical chip of claim 4, further comprising at least two first photo-detection modules disposed in the cladding layer;
each first photoelectric detection module is respectively connected with all edge couplers in the first coupler array, the second output end and two parts in the fourth output end, and the parts connected with different first photoelectric detection modules are different.
6. The optical chip of claim 4, wherein:
the optical chip further comprises a third optical splitter and at least two second photoelectric detection modules, wherein the third optical splitter is arranged on the cladding and comprises a third input end and at least two fifth output ends, the third input end is connected with the second output ends, and each second photoelectric detection module is respectively connected with one fifth output end and one edge coupler in the first coupler array;
the optical chip further comprises a fourth optical splitter and at least two third photoelectric detection modules, wherein the fourth optical splitter is arranged on the cladding and comprises a fourth input end and at least two sixth output ends, the fourth input end is connected with the fourth output end, and each third photoelectric detection module is respectively connected with one sixth output end and one edge coupler in the first coupler array;
The edge coupler connected with the first input end is used for receiving local oscillation light, the edge coupler connected with the second input end is used for receiving local oscillation light, and the edge coupler in the first coupler array is used for receiving echo light.
7. The optical chip of claim 4, wherein the optical chip is applied to a twin laser lidar, the optical chip further comprising:
the wavelength division multiplexers are arranged on the cladding and comprise an incident end, a first emergent end and a second emergent end, the incident end is connected with the edge couplers in the first coupler array, each wavelength division multiplexer is used for demultiplexing echo light transmitted by the edge coupler into first echo light with a first wavelength and second echo light with a second wavelength so that the first echo light is output through the first emergent end, the second echo light is output through the second emergent end, and each edge coupler in the first coupler array is connected with one wavelength division multiplexer;
the third light splitter is arranged on the cladding and comprises a third input end and at least two fifth output ends, and the third input end is connected with the second output ends;
The fourth optical splitter is arranged on the cladding and comprises a fourth input end and at least two sixth output ends, and the fourth input end is connected with the fourth output ends;
the second photoelectric detection modules are arranged on the cladding, and each second photoelectric detection module is correspondingly connected with one fifth output end and one first emergent end respectively; and
the third photoelectric detection modules are arranged on the cladding, and each third photoelectric detection module is correspondingly connected with one sixth output end and one second emergent end respectively;
the edge coupler connected with the first input end is used for receiving first local oscillation light with a first wavelength, the edge coupler connected with the second input end is used for receiving second local oscillation light with a second wavelength, the edge coupler in the first coupler array is used for receiving echo light, and the echo light comprises first echo light with the first wavelength and second echo light with the second wavelength.
8. The optical chip of claim 4, further comprising:
the edge couplers in the first coupler array are divided into a first coupler and a second coupler, the first coupler is connected with the emitting waveguide, the first coupler is used for receiving and transmitting detection light so that the detection light exits through the emitting waveguide to detect a target object, and the second coupler is used for receiving and transmitting local oscillation light;
The receiving waveguides are arranged between the cladding and the transmitting waveguides at intervals, the receiving waveguides are used for receiving the echo light, each transmitting waveguide corresponds to at least one receiving waveguide, and the echo light is formed by reflecting the probe light through a target object; and
and the fourth photoelectric detection modules are arranged on the cladding layer, and each fourth photoelectric detection module is respectively connected with one second coupler and one receiving waveguide corresponding to the transmitting waveguide.
9. A lidar, comprising:
the optical chip of any one of claims 1 to 8; and
The optical fiber array comprises a plurality of optical fibers which are arranged at intervals along the first direction, and each optical fiber corresponds to each edge coupler.
10. A mobile device comprising a mobile body and the lidar of claim 9.
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