CN117192153A - Acceleration sensor sensitive component and acceleration sensor chip structure - Google Patents
Acceleration sensor sensitive component and acceleration sensor chip structure Download PDFInfo
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- CN117192153A CN117192153A CN202311041079.8A CN202311041079A CN117192153A CN 117192153 A CN117192153 A CN 117192153A CN 202311041079 A CN202311041079 A CN 202311041079A CN 117192153 A CN117192153 A CN 117192153A
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- 244000126211 Hericium coralloides Species 0.000 claims abstract description 41
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- 238000005485 electric heating Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 8
- 230000035945 sensitivity Effects 0.000 abstract description 18
- 230000008859 change Effects 0.000 abstract description 7
- 239000003990 capacitor Substances 0.000 description 15
- 238000005516 engineering process Methods 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000000034 method Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 230000005484 gravity Effects 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical group [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
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Abstract
The invention provides an acceleration sensor sensitive component and an acceleration sensor chip structure, wherein the acceleration sensor sensitive component comprises: the device comprises a substrate, an elastic beam and an electric heating driving beam, wherein the elastic beam is arranged on the substrate and fixedly connected with a frame, the frame is provided with a first comb tooth part, the first comb tooth part comprises a plurality of first sub comb teeth which are arranged at intervals, and comb tooth grooves are formed between any adjacent first sub comb teeth; the electric heating driving beam is arranged on the base plate and is positioned in the frame, the electric heating driving beam is fixedly connected with a bracket, the bracket is provided with a second comb tooth part, the second comb tooth part comprises a plurality of second sub comb teeth which are arranged at intervals, and the second sub comb teeth are respectively positioned in the comb tooth grooves. The acceleration sensitive component provided by the invention realizes the change of the comb tooth gap, so that the comb tooth gap is reduced to hundreds of nanometers or even tens of nanometers, and the sensitivity of the acceleration sensor is improved; zero offset calibration of the acceleration sensor sensitive component can be realized; in addition, the structure design is compact, and the cost is low.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to an acceleration sensor sensitive component and an acceleration sensor chip structure.
Background
The capacitive acceleration sensor chip is an acceleration sensor based on a micro-nano manufacturing process, and can measure the acceleration of an object and convert the acceleration into an electric signal to be output. The capacitive acceleration sensing chip is widely applied to the fields of consumer electronics, automotive electronics, industry, national defense and the like.
The working principle of the capacitive acceleration sensing chip is based on the detection of capacitance changes. It is typically composed of a mems chip and signal processing circuitry. The chip contains a tiny mechanical structure, and a common capacitive acceleration sensing chip structure comprises: micro comb tooth capacitance, micro plate capacitance, etc. When subjected to acceleration, these microstructures undergo a slight displacement, resulting in a change in capacitance between the electrodes. This change can be measured and processed by the circuit to obtain information on the acceleration.
In the comb-tooth capacitor structure of the acceleration sensing chip, the comb-tooth gaps play a role in determining the capacitance value. The comb structure is composed of two groups of mutually nested electrodes, wherein one group of electrodes is provided with a series of comb teeth, and the other group of electrodes is provided with a corresponding number of comb teeth. The comb gap is a series of parallel capacitance gaps formed between two groups of electrodes. The size of the comb gap directly influences the size of the capacitance value. A smaller comb gap results in a larger capacitance value, and thus a higher structural sensitivity, without changing the structural rigidity. Therefore, for capacitive acceleration sensor chips, the smaller the comb gap is, the better.
In order to improve the sensitivity of the capacitive acceleration sensor chip, in the prior art, a photolithography technology with higher precision and an etching technology with higher aspect ratio are adopted in the first mode. In this way, comb gaps of about 1 to 5 microns and comb capacitances of about 10 to 20 aspect ratios can be processed with good control of process conditions. However, comb capacitance structures with comb gaps less than 1 micron are difficult to process by this method. In the second mode, a high aspect ratio polysilicon-monocrystalline silicon composite etching process is adopted, and the process can realize a comb tooth capacitor structure with a comb tooth gap of hundreds of nanometers by manufacturing a polysilicon and silicon oxide structure layer on a monocrystalline silicon structure. However, this manufacturing method is complicated in process flow, high in manufacturing cost, and requires very fine control of the processing process.
In summary, the prior art also has the following disadvantages: the comb teeth processing technology has high requirements, complex processing technology, high manufacturing cost and poor sensitivity of the acceleration sensor.
Disclosure of Invention
The first aspect of the present invention provides an acceleration sensor sensing assembly, which is used for solving the technical problems of high requirements on comb teeth processing technology, complex processing technology, high manufacturing cost and poor sensitivity of an acceleration sensor in the prior art.
A first aspect of the present invention provides an acceleration sensor sensitive assembly comprising:
a substrate;
the elastic beam is arranged on the base plate and fixedly connected with a frame, the frame is provided with a first comb tooth part, the first comb tooth part comprises a plurality of first sub-comb teeth which are arranged at intervals, and comb tooth grooves are formed between any adjacent first sub-comb teeth;
the electric heating driving beam is arranged on the base plate and is positioned in the frame, the electric heating driving beam is fixedly connected with a support, the support is provided with second comb teeth parts, each second comb teeth part comprises a plurality of second sub-comb teeth which are arranged at intervals, and the second sub-comb teeth are respectively positioned in the comb tooth grooves.
According to the acceleration sensitive component provided by the invention, the change of the comb teeth clearance is realized by arranging the first comb teeth part connected with the elastic beam and the second comb teeth part connected with the electric heating driving beam, so that the comb teeth clearance is reduced to hundreds of nanometers or even tens of nanometers, the sensitivity of the comb teeth capacitance to external acceleration is improved by 2-3 orders of magnitude, and the acceleration sensitive component can be used for realizing the acceleration sensitive component for 10 -6 -10 -8 The sensitivity of the acceleration sensor is improved by sensing the gravity acceleration; the zero offset calibration of the acceleration sensor sensitive component can be realized by adjusting the driving voltage of the electrothermal driving beam; in addition, the structure design is compact, the cost is low, and the processing and manufacturing process is simpleThe single and processing technology requirements are low.
Further, the number of the elastic beams is 2 and the elastic beams are oppositely arranged, and two ends of the frame are fixedly connected with the elastic beams respectively.
Further, the frame is of a square-shaped structure or an I-shaped structure, and comprises a first connecting plate, a second connecting plate and a supporting frame fixedly connected between the first connecting plate and the second connecting plate, wherein one elastic beam is fixedly connected with the first connecting plate; the other elastic beam is fixedly connected with the second connecting plate; the plurality of first sub-comb teeth are fixedly arranged on the supporting frame.
Further, the support frame is fixedly provided with a first comb tooth mounting plate, and a plurality of first sub-comb teeth are fixedly arranged on the first comb tooth mounting plate.
Further, the number of the electrothermal driving beams is 2 and the electrothermal driving beams are oppositely arranged, and two ends of the bracket are fixedly connected with the 2 electrothermal driving beams respectively;
and/or the section shape of the electrothermal driving beam is at least one of V type, N type and A type;
and/or the electrothermal driving beams comprise a plurality of groups of electrothermal sub driving beams which are arranged in parallel.
A second aspect of the present invention provides an acceleration sensor chip structure, including a housing and an acceleration sensor sensing assembly according to any one of claims, where the acceleration sensor sensing assembly is disposed in the housing, and a temperature control assembly and a controller are further disposed in the housing, where the temperature control assembly includes a temperature sensor and a temperature control component, the temperature sensor and the temperature control component are both electrically connected to the controller, the temperature sensor is used to detect a temperature value in the housing, and the controller is used to receive the temperature value and control the temperature control component so that the temperature value is within a preset temperature range.
According to the acceleration sensor chip structure provided by the embodiment of the invention, the temperature in the shell can be controlled within the preset temperature range by arranging the temperature sensor and the temperature control component which are electrically connected with the controller, so that the sensitivity of the sensitive component of the acceleration sensor is ensured; the temperature drift calibration of the acceleration sensor chip structure can be realized; in addition, the acceleration sensor sensitive component realizes the change of the comb teeth clearance by arranging the first comb teeth part connected with the elastic beam and the second comb teeth part connected with the electric heating driving beam, so that the comb teeth clearance is reduced to hundreds of nanometers or even tens of nanometers, the sensitivity of the comb teeth capacitance to external acceleration is improved by 2-3 orders of magnitude, the sensing of gravity acceleration can be realized, and the sensitivity of the acceleration sensor is improved; the zero offset calibration of the acceleration sensor sensitive component can be realized by adjusting the driving voltage of the electrothermal driving beam; the structure design is compact, the cost is low, the processing and manufacturing process is simple, and the processing technology requirement is low.
Further, the temperature control means comprises heating means for increasing the temperature within the housing.
Further, a capacitance reading circuit component is further arranged in the shell and used for converting the capacitance value of the acceleration sensitive component into a voltage value.
Further, the controller is mounted on the substrate;
and/or the temperature sensor is mounted on the substrate;
and/or the heating component is mounted on the substrate;
and/or a capacitance sensing circuit assembly is mounted on the substrate.
Further, the temperature sensor is mounted on the acceleration sensor sensitive component.
Drawings
FIG. 1 is a schematic diagram of an explosion structure of an acceleration sensor sensing assembly according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of an acceleration sensor sensing assembly according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of an N-type electrothermal driving beam in an acceleration sensor sensing assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of an a-type electrothermal driving beam in an acceleration sensor sensing assembly according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an acceleration sensor chip structure according to an embodiment of the present invention;
reference numerals illustrate:
10. an acceleration sensor sensitive component; 100. a substrate; 110. an elastic beam; 120. a frame; 121. a first connection plate; 122. a second connecting plate; 123. a support frame; 124. a first comb mounting plate; 130. a first comb tooth part; 131. a first sub-comb; 132. comb tooth grooves; 140. an electrothermal driving beam; 150. a bracket; 160. a second comb tooth part; 161. a second sub-comb; 1. a housing; 21. a temperature sensor; 30. a controller; 40. a capacitance sensing circuit assembly; 50. a resistive-capacitive device.
Detailed Description
In order that the above objects, features and advantages of the present invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
The embodiment of the invention provides an acceleration sensor sensitive component. Referring to fig. 1 and 2, the acceleration sensor sensing assembly 10 includes: a base plate 100, an elastic beam 110, and an electrothermal driving beam 140; the elastic beam 110 is mounted on the substrate 100 and fixedly connected with the frame 120, the frame 120 is provided with a first comb tooth part 130, the first comb tooth part 130 comprises a plurality of first sub-comb teeth 131 arranged at intervals, and comb tooth grooves 132 are formed between any adjacent first sub-comb teeth 131; the electrothermal driving beam 140 is mounted on the substrate 100 and is located in the frame 120, the electrothermal driving beam 140 is fixedly connected with a support 150, the support 150 is provided with a second comb tooth portion 160, the second comb tooth portion 160 comprises a plurality of second sub-comb teeth 161 which are arranged at intervals, and the second sub-comb teeth 161 are respectively located in the comb tooth grooves 132.
It should be noted that, the second sub-comb teeth 161 are respectively located in the comb tooth grooves 132 to form a first capacitor and a second capacitor, and the first capacitor and the second capacitor form a differential capacitor; under the action of external acceleration, the elastic beam 110 can drive the frame 120 to generate elastic displacement to drive the first sub-comb teeth 131 to move, so that one of the first capacitor and the second capacitor is increased, and the other capacitor is reduced, thereby changing the size of the differential comb tooth capacitor and playing an acceleration sensitive role.
It should be noted that, if the electrothermal driving beam 140 is in the low-sensitivity working state and the high-sensitivity working state, the electrothermal driving beam 140 does not apply electrothermal driving voltage, the second sub-comb teeth 161 do not move, the second sub-comb teeth 161 have a larger stroke, that is, the acceleration sensor has a larger range and lower sensitivity; if the electric heating driving beam 140 is in a high-sensitivity working state, the electric heating driving beam 140 is heated by joule heat to drive the second sub-comb teeth 161 to move, so that the gap between the second sub-comb teeth 161 and the comb teeth grooves 132 is changed, the comb teeth gap is reduced to hundreds or even tens of nanometers, one of the first capacitor and the second capacitor is further increased, the other capacitor is further reduced, the initial capacitance of the differential comb teeth capacitor is increased, and the sensitivity of the acceleration sensor structure is improved.
It should be noted that, the electrothermal driving beam 140 drives the second sub-comb teeth 161 to move, so as to further reduce the gap between the second sub-comb teeth 162 and the comb teeth grooves 132, and compared with the prior art that relies on a high processing technology to process the comb teeth gap of 1 to 5 micrometers, the processing technology has low requirements and simple processing and manufacturing technology.
It should be noted that, when the acceleration sensor is in a static state, whether the acceleration sensor has zero offset at this time can be detected, and if the acceleration sensor has zero offset, the driving voltage of the electrothermal driving beam 140 can be adjusted to make the acceleration sensor sensitive component 10 be in a zero potential position, so as to realize zero offset calibration of the acceleration sensor.
Therefore, in the acceleration sensor sensing assembly 10 provided by the embodiment of the present invention, by providing the first comb teeth 130 connected to the elastic beam 110 and the second comb teeth 160 connected to the electrothermal driving beam 140, the change of the comb teeth gap is realized, so that the comb teeth gap is reduced to hundreds of nanometers or even tens of nanometers, the sensitivity of the comb teeth capacitance to external acceleration is improved by 2-3 orders of magnitude, and the acceleration sensor sensing assembly can realize the acceleration sensor sensing assembly 10 -6 -10 -8 The sensitivity of the acceleration sensor is improved by sensing the gravity acceleration; zero offset of the acceleration sensor sensitive component 10 can be realized by adjusting the driving voltage of the electrothermal driving beam 140Is used for the calibration of (a); in addition, the structure design is compact, the cost is low, the processing and manufacturing process is simple, and the processing technology requirement is low.
Referring to fig. 1, in the embodiment of the present invention, the number of elastic beams 110 is 2 and the elastic beams are disposed opposite to each other, and two ends of the frame 120 are fixedly connected to the 2 elastic beams 110, respectively. By doing so, the rebound pressure can be ensured, and the stability of the position of the frame 120 can be maintained.
In the embodiment of the present invention, the frame 120 has a square or i-shaped structure, and the frame 120 includes a first connecting plate 121, a second connecting plate 122, and a supporting frame 123 fixedly connected therebetween, wherein one elastic beam 110 is fixedly connected to the first connecting plate 121; the other elastic beam 110 is fixedly connected to the second connecting plate 122; the first sub-comb teeth 131 are fixedly arranged on the supporting frame 123.
Referring to fig. 1, in the embodiment of the present invention, a supporting frame 123 is fixedly provided with a first comb tooth mounting plate 124, and a plurality of first sub-comb teeth 131 are fixedly provided with the first comb tooth mounting plate 124.
Referring to fig. 1, in the embodiment of the present invention, the number of electrothermal driving beams 140 is 2 and oppositely arranged, and two ends of a bracket 150 are respectively fixedly connected to 2 electrothermal driving beams 140.
Referring to fig. 1, 2, 3 and 4, in an embodiment of the present invention, the electrothermal driving beam 140 has at least one of V-type, N-type and a-type cross-sectional shape. So set up, electrothermal drive roof beam 140 structural stability is high, and the actuating force is strong.
In an embodiment of the present invention, electrothermal driving beams 140 include a plurality of groups of electrothermal sub driving beams arranged in parallel. So set up, electrothermal drive roof beam 140 structural stability is high, and the driving force is strong, is applicable to high accuracy acceleration sensing's broach drive.
Referring to fig. 5, an embodiment of the present invention provides an acceleration sensor chip structure, including a housing 1 and the above acceleration sensor sensitive component 10, where the acceleration sensor sensitive component is disposed in the housing 1, and a temperature control component and a controller 30 are further disposed in the housing 1, the temperature control component includes a temperature sensor 21 and a temperature control component, the temperature sensor 21 and the temperature control component are both electrically connected with the controller 30, the temperature sensor 21 is used for detecting a temperature value in the housing 1, and the controller 30 is used for receiving the temperature value and controlling the temperature control component so that the temperature value is within a preset temperature range.
It should be noted that, because the acceleration sensor sensitive component can obtain the best precision in the preset temperature range, if the temperature is greater than the preset temperature range, the quality of the sensing signal is reduced due to the increase of noise; if the temperature is less than the preset temperature range, a decrease in the sensitivity of the sensor may result.
It should be noted that, if temperature drift exists in the acceleration sensor chip structure, when the acceleration sensor chip structure is in a static state, the temperature is adjusted to be within a preset temperature range, an output value of the acceleration sensor at the moment is detected, the value is used as the temperature drift at the current temperature, and in the working process of the acceleration sensor, the temperature drift value of the preset temperature range is subtracted from the output value of the acceleration sensor, so that the temperature drift calibration of the acceleration sensor chip structure is realized.
Therefore, in the acceleration sensor chip structure provided by the embodiment of the invention, the temperature in the shell 1 can be controlled within the preset temperature range by arranging the temperature sensor 21 and the temperature control component which are electrically connected with the controller 30, so that the sensitivity of the acceleration sensor sensitive component 10 is ensured; the temperature drift calibration of the acceleration sensor chip structure can be realized; in addition, the acceleration sensor sensing assembly 10 realizes the change of the comb gap by arranging the first comb tooth part 130 connected with the elastic beam 110 and the second comb tooth part 160 connected with the electrothermal driving beam 140, so that the comb gap is reduced to hundreds of nanometers or even tens of nanometers, the sensitivity of the comb tooth capacitance to external acceleration is improved by 2-3 orders of magnitude, and the sensor can realize the sensor sensing assembly for 10 -6 -10 -8 The sensitivity of the acceleration sensor is improved by sensing the gravity acceleration; calibration of the zero offset of the acceleration sensor sensitive component 10 can be achieved by adjusting the driving voltage of the electrothermal driving beam 140; the structure design is compact, the cost is low, the processing and manufacturing process is simple, and the processing technology requirement is low.
In an embodiment of the invention, the temperature control means comprises heating means for increasing the temperature within the housing 1.
If the temperature sensor 21 detects that the temperature in the housing 1 is less than the preset temperature range, the controller controls the heating component to operate so as to raise the temperature in the housing 1 to the preset temperature range; if the temperature sensor 21 detects that the temperature in the housing 1 is greater than the preset temperature range, the heating means is not operated.
Referring to fig. 5, in the embodiment of the present invention, a capacitance sensing circuit assembly 40 is further disposed in the housing 1, and is used for converting the capacitance value of the acceleration sensitive component 10 into a voltage value, where the voltage value may be an analog quantity or a digital quantity.
In the embodiment of the present invention, the controller 30 is mounted on the substrate 100.
In the embodiment of the present invention, the temperature sensor 21 is mounted on the substrate 100.
In the embodiment of the present invention, the heating member is mounted on the substrate 100.
In the embodiment of the present invention, the capacitance sensing circuit assembly 40 is mounted on the substrate 100.
In the embodiment of the present invention, the temperature sensor 21 is mounted on the acceleration sensor sensitive component 10.
In the embodiment of the present invention, the shell 1 is made of plastic, ceramic or metal.
In the embodiment of the present invention, the substrate 100 is an organic substrate, a ceramic substrate, or a metal substrate.
In the embodiment of the invention, a resistive-capacitive device 50 is further arranged in the shell 1, and the necessary resistive-capacitive device 50 is formed for the functional circuits such as power supply, signal processing, signal output, protection and the like of the acceleration sensing chip.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (10)
1. An acceleration sensor sensitive assembly, comprising:
a substrate (100);
the elastic beam (110) is arranged on the substrate (100) and fixedly connected with the frame (120), the frame (120) is provided with a first comb tooth part (130), the first comb tooth part (130) comprises a plurality of first sub comb teeth (131) which are arranged at intervals, and comb tooth grooves (132) are formed between any adjacent first sub comb teeth (131);
the electric heating driving beam (140) is arranged on the substrate (100) and is located in the frame (120), the electric heating driving beam (140) is fixedly connected with the support (150), the support (150) is provided with a second comb tooth part (160), the second comb tooth part (160) comprises a plurality of second sub comb teeth (161) which are arranged at intervals, and the second sub comb teeth (161) are respectively located in the comb tooth grooves (132).
2. The acceleration sensor sensing assembly according to claim 1, characterized in that the number of the elastic beams (110) is 2 and oppositely arranged, and two ends of the frame (120) are fixedly connected to 2 elastic beams (110), respectively.
3. The acceleration sensor sensing assembly according to claim 2, characterized in, that the frame (120) is of a square or i-shaped structure, the frame (120) comprising a first connection plate (121), a second connection plate (122) and a supporting frame (123) fixedly connected therebetween, wherein one of the elastic beams (110) is fixedly connected to the first connection plate (121) ； The other elastic beam (110) is fixedly connected with the second connecting plate (122); the plurality of first sub-comb teeth (131) are fixedly arranged on the supporting frame (123).
4. An acceleration sensor sensing assembly according to claim 3, characterized in, that the supporting frame (123) is fixedly provided with a first comb mounting plate (124), and a plurality of the first sub-comb teeth (131) are fixedly provided with the first comb mounting plate (124).
5. The acceleration sensor sensing assembly according to claim 1, wherein the number of electrothermal driving beams (140) is 2 and the electrothermal driving beams are arranged oppositely, and two ends of the bracket (150) are fixedly connected to 2 electrothermal driving beams (140) respectively;
and/or the section shape of the electrothermal driving beam (140) is at least one of V type, N type and A type;
and/or, the electrothermal driving beams (140) comprise a plurality of groups of electrothermal sub driving beams which are arranged in parallel.
6. An acceleration sensor chip structure, characterized by comprising a shell (1) and an acceleration sensor sensitive component (10) according to any one of claims 1-5, wherein the acceleration sensor sensitive component is arranged in the shell (1), a temperature control component and a controller (30) are further arranged in the shell (1), the temperature control component comprises a temperature sensor (21) and a temperature control component, the temperature sensor (21) and the temperature control component are electrically connected with the controller (30), the temperature sensor (21) is used for detecting a temperature value in the shell (1), and the controller (30) is used for receiving the temperature value and controlling the temperature control component so that the temperature value is in a preset temperature range.
7. The acceleration sensor chip structure according to claim 6, characterized in, that the temperature control means comprises heating means for increasing the temperature inside the housing (1).
8. The acceleration sensor chip structure according to claim 6, characterized in, that a capacitance sensing circuit assembly (40) is further arranged in the housing (1) for converting the capacitance value of the acceleration sensitive assembly into a voltage value.
9. The acceleration sensor chip structure of claim 8, characterized in, that the controller (30) is mounted on the substrate (100);
and/or the temperature sensor (21) is mounted on the substrate (100);
and/or the heating component is mounted on the substrate (100);
and/or the capacitance sensing circuit assembly (40) is mounted on the substrate (100).
10. The acceleration sensor chip structure of claim 9, characterized in, that the temperature sensor (21) is mounted on the acceleration sensor sensitive component (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311041079.8A CN117192153A (en) | 2023-08-17 | 2023-08-17 | Acceleration sensor sensitive component and acceleration sensor chip structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311041079.8A CN117192153A (en) | 2023-08-17 | 2023-08-17 | Acceleration sensor sensitive component and acceleration sensor chip structure |
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| Publication Number | Publication Date |
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| CN117192153A true CN117192153A (en) | 2023-12-08 |
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| CN202311041079.8A Pending CN117192153A (en) | 2023-08-17 | 2023-08-17 | Acceleration sensor sensitive component and acceleration sensor chip structure |
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