CN117174643A - Mechanical arm - Google Patents
Mechanical arm Download PDFInfo
- Publication number
- CN117174643A CN117174643A CN202311285784.2A CN202311285784A CN117174643A CN 117174643 A CN117174643 A CN 117174643A CN 202311285784 A CN202311285784 A CN 202311285784A CN 117174643 A CN117174643 A CN 117174643A
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- Prior art keywords
- assembly
- rod
- clamping
- wafer
- connecting rod
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Links
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000000712 assembly Effects 0.000 claims abstract description 4
- 238000000429 assembly Methods 0.000 claims abstract description 4
- 238000001514 detection method Methods 0.000 claims description 16
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 61
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a mechanical arm which comprises a bottom plate, a supporting component, a driving component, a connecting component and a clamping component, wherein the bottom plate is arranged on the bottom plate; the driving assembly is movably connected with the connecting assembly, the clamping assembly is movably connected with the connecting assembly, the connecting assembly and the clamping assembly are both arranged into two groups, the clamping part of the clamping assembly is arranged into an arc structure, the radian of the clamping assembly is matched with that of a wafer, and the driving assembly drives the two groups of the clamping assemblies to synchronously move along the direction close to or far away from the wafer. According to the scheme, the centering step and the transporting step are combined, the process time is reduced, the clamping stability is high, the wafer is clamped in an auxiliary mode in the transporting process, the wafer can be stably transported to the target position, and the problem of flying chips is avoided.
Description
Technical Field
The invention relates to the technical field of wafer transportation of glue coating and developing equipment, in particular to a mechanical arm.
Background
The photoresist coating and developing device is a wafer processing device matched with photoresist, and is used for coating photoresist, developing and the like on a wafer. In the gumming and developing equipment, a centering device which is arranged independently is arranged to center the wafer obtained from the wafer box, so that the position of the wafer on the mechanical arm is controllable; after the wafer is grabbed from the centering device, the wafer is transported to various process treatment units, such as gluing and developing; in order to improve the productivity of the glue coating and developing device, the running speed of the mechanical arm is improved.
The separately provided centering device has the following disadvantages: the wafer occupies process time in the centering device for centering, resulting in lower production efficiency of the equipment. Meanwhile, the operation speed of the mechanical arm is increased, so that the mechanical arm cannot grasp the wafer firmly enough, and the wafer moves or flies in the transportation process. The movement of the wafer in the transportation process can cause that the equipment cannot accurately acquire the position of the wafer, so that the deviation of the position of the subsequent process flow occurs, and the yield of the wafer is reduced; flying wafers during transportation can cause equipment to stop and even safety accidents.
In addition, due to errors in wafer production, the actual sizes of wafers with the same size are inconsistent, and the gaps between the wafers and the process device need to be controlled to be a proper distance in the following processes of gluing, developing and the like. In the prior art, aiming at the same size, the center and the peripheral position of the wafer are set to be fixed values, and when the sizes of the wafers are inconsistent, the distances between the peripheral edges of the wafers and the process device are different, so that all the wafers cannot meet the proper distance, and the coating effect of the wafers is poor.
Disclosure of Invention
The invention aims to provide a mechanical arm which is used for solving the technical problems in the background technology.
The technical scheme of the invention discloses a mechanical arm which comprises a bottom plate, a supporting component, a driving component, a connecting component and a clamping component;
the driving assembly is movably connected with the connecting assembly, the clamping assembly is movably connected with the connecting assembly, the connecting assembly and the clamping assembly are both arranged into two groups, the clamping part of the clamping assembly is arranged into an arc structure, the radian of the clamping assembly is matched with that of a wafer, and the driving assembly drives the two groups of the clamping assemblies to synchronously move along the direction close to or far away from the wafer.
In a preferred embodiment, the driving assembly comprises a driving cylinder and a connecting block connected with a push rod of the driving cylinder, and the connecting assembly is movably connected with the connecting block.
In a preferred embodiment, waist-shaped grooves are formed in two sides of the connecting block, a protruding structure is arranged at one end, close to the connecting block, of the connecting assembly, and the protruding structure extends into the waist-shaped grooves.
In a preferred embodiment, the connecting assembly comprises a first connecting rod, a second connecting rod and a fixed rod which are connected with each other, wherein the first connecting rod is movably connected with the second connecting rod, and the second connecting rod passes through the fixed rod to be arranged, and the first connecting rod and the second connecting rod are connected in a sliding way; two limiting rods are arranged at one side, far away from the clamped wafer, of the clamping assembly at intervals, one limiting rod penetrates through the fixing rod to be movably connected with the second connecting rod, and the other limiting rod is movably connected with the fixing rod.
In a preferred embodiment, a straight line section is provided on the second link, the straight line section passing through the fixing rod and being slidably connected to the fixing rod.
In a preferred embodiment, protruding structures are disposed at two ends of the first connecting rod, waist-shaped grooves are disposed at two ends of the second connecting rod, protruding structures at one end of the first connecting rod extend into waist-shaped grooves on the connecting block, protruding structures at the other end extend into waist-shaped grooves at one end of the second connecting rod, protruding structures are disposed on the limiting rod penetrating through the fixing rod, and protruding structures extend into waist-shaped grooves at the other end of the second connecting rod.
In a preferred embodiment, the clamping assembly is an arcuate clamping block.
In a preferred embodiment, a plurality of detection holes are sequentially formed in the bottom plate and below the connecting block, the plurality of detection holes are sequentially formed in the moving path of the connecting block, and the detection holes are in a semi-vacuum state during detection.
The technical scheme of the invention has the beneficial effects that:
1, this scheme combines centering step and transportation step, reduces process time, and the stability of centre gripping is high, supplementary centre gripping wafer in the transportation, makes the wafer can stably transmit to the target position, avoids appearing the problem of flying the piece.
2. The mechanical arm of the scheme can judge the size of the wafer and provide assistance for subsequent process treatment.
Drawings
Figure 1 is a top view of the present invention,
figure 2 is a schematic diagram of the overall structure of the invention,
figure 3 is a schematic view of the structure of the clamping assembly, the connecting assembly and the driving assembly of the invention,
figure 4 is an enlarged view of section a of figure 1 in accordance with the present invention,
FIG. 5 is a view showing the arrangement of the detection holes according to the present invention.
Reference numerals illustrate: 1 bottom plate, 2 drive cylinder, 3 connecting blocks, 4 first connecting rods, 5 second connecting rods, 6 dead levers, 7 protruding structures, 8 waist type grooves, 9 arc clamp splice, 10 arc supporting blocks, 11 detection holes, 12 wafers and 13 limiting rods.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description. The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
As shown in fig. 1-3, the technical scheme of the invention discloses a mechanical arm, which comprises a bottom plate 1, a supporting component, a driving component, a connecting component and a clamping component. The drive assembly with coupling assembling swing joint, the clamping assembly with coupling assembling swing joint, the coupling assembling subassembly with the clamping assembly all sets up to two sets of, the clamping position of clamping assembly sets up to the arc structure, and the radian suits with the radian of wafer 12, the drive assembly drive two sets of clamping assembly moves along being close to or keeping away from the wafer 12 direction in step.
The wafer 12 is supported by the support assemblies, which are arranged in four groups and are located on the same circumference, each group comprises an arc-shaped support block 10, and the wafer 12 is supported by the support surface damaged by the support blocks. The driving assembly and the connecting assembly cooperate to drive the clamping assembly, thereby realizing clamping and automatic centering of the wafer 12. The centering step and the transporting step are combined, the process time is reduced, the clamping stability is high, the wafer 12 is clamped in an auxiliary mode in the transporting process, the wafer 12 can be stably transported to the target position, and the problem of flying chips is avoided.
The driving assembly comprises a driving air cylinder 2 and a connecting block 3 connected with a push rod of the driving air cylinder 2, and the connecting assembly is movably connected with the connecting block 3. Waist type groove 8 has all been seted up to connecting block 3 both sides, coupling assembling is close to connecting block 3 one end is provided with protruding structure 7, protruding structure 7 stretches into in the waist type groove 8, waist type groove 8 provides the displacement space for coupling assembling's removal in the drive process, through the swing joint mode that sets up waist type groove 8 and protruding structure, and then realizes the cooperation of moving each other between drive assembly, coupling assembling, fixed subassembly and the clamping assembly, finally realizes the steady firm centering and the centre gripping to wafer 12.
The connecting assembly comprises a first connecting rod 4, a second connecting rod 5 and a fixed rod 6 which are connected with each other, the first connecting rod 4 is movably connected with the second connecting rod 5, the second connecting rod 5 is slidably connected with the fixed rod 6, two limiting rods 13 are arranged on one side of the clamping assembly, which is far away from the clamped wafer, at intervals, one limiting rod 13 penetrates through the fixed rod 6 and is movably connected with the second connecting rod 5, the other limiting rod 13 is movably connected with the fixed rod 6, and the other limiting rod 13 is used for assisting in stabilizing the posture of the clamping assembly when the clamping assembly is far away from or close to the wafer. A straight line section is arranged on the second connecting rod 5, passes through the fixed rod 6 and is in sliding connection with the fixed rod 6.
The two ends of the first connecting rod 4 are provided with protruding structures 7, the two ends of the second connecting rod are provided with waist-shaped grooves 8, the protruding structures 7 at one end of the first connecting rod 4 extend into the waist-shaped grooves 8 on the connecting block 3, the protruding structures 7 at the other end extend into the waist-shaped grooves 8 at one end of the second connecting rod 5, protruding structures 7 are arranged on the limiting rods penetrating through the fixing rods 6, and the protruding structures extend into the waist-shaped grooves 8 at the other end of the second connecting rod 5. The clamping assembly comprises an arc-shaped clamping block 9, and the radian of the arc-shaped clamping block 9 is matched with that of a wafer 12.
When the wafer 12 is clamped, the wafer 12 is firstly placed on the mechanical arm and supported by the supporting component, then the driving cylinder 2 pushes the connecting block 3 to move towards the direction close to the wafer 12, at the moment, the connecting block 3 can transfer acting force to the first connecting rod 4 through the waist-shaped groove 8, the first connecting rod 4 is transferred to the second connecting rod 5, the second connecting rod 5 moves upwards to drive the arc-shaped clamping block 9 connected with the fixing rod 6 to move towards the wafer 12, and therefore the wafer 12 is clamped from two ends.
It should be noted that the shape of the waist-shaped grooves 8 at two ends of the second connecting rod 5 is different, the waist-shaped grooves 8 penetrated by the protruding structures 7 on the limiting rods 13 have a certain radian, and are obliquely arranged towards the direction close to the wafer 12, as shown in fig. 4, which is a state diagram when the arc-shaped clamping blocks clamp the wafer 12. During clamping, the protruding structure 7 on the limiting rod 13 is located at the upper end of the waist-shaped groove 8, when the second connecting rod 5 is driven to move upwards, the second connecting rod 5 is limited in position due to the fixing rod 6, so that the second connecting rod moves upwards along a straight line, the position of the protruding structure 7 on the limiting rod 13 is changed to be changed from the upper end of the waist-shaped groove 8 to the lower end of the waist-shaped groove 8, and the waist-shaped groove 8 is obliquely arranged, namely the arc-shaped clamping block 9 moves towards the direction close to the wafer 12, so that the wafer 12 is clamped. The limiting rod 13 and the fixed rod 5 on the outer side of the arc-shaped clamping block 9 are also in sliding connection, and in the linear motion process of the second connecting rod 5, the limiting rod 13 horizontally slides by taking the fixed rod 6 as a basis, so that the posture of the arc-shaped clamping block is stabilized in an auxiliary manner, the arc-shaped clamping block 9 can be ensured to move smoothly, and then a wafer is clamped.
Because the two groups of arc-shaped clamping blocks 9 are symmetrically arranged, the centering is automatically realized after clamping, and in the wafer moving process, the arc-shaped clamping blocks are not loosened, so that the wafer is kept in an auxiliary manner, and the wafer can be prevented from being offset or flying disc caused by too fast movement of the mechanical arm; when the cylinder is released, the cylinder 2 is driven to move reversely.
As shown in fig. 5, in this solution, a plurality of detection holes 11 are sequentially disposed on the bottom plate 1 and below the connection block 3, and a plurality of detection holes 11 are sequentially disposed on a movement path of the connection block 3, and a semi-vacuum state is set in the detection holes 11 during detection. When the connection block 3 covers the detection hole 11, the vacuum degree of the detection hole 11 changes, and at this time, the position of the connection block 3 can be determined. In this scheme, the moving distance of the connecting block 3 and the moving distance of the arc clamping block 9 are in a certain proportional relationship, specifically: connecting block movement path: the movement path of the arc-shaped clamping blocks=5:1, and the movement path S from the initial position to the wafer clamping can be judged according to the relation between the movement path of the connecting blocks 3 and the proportion. The distance S can be used for judging whether the wafer is bigger or smaller and the deviating value, and then the situation is sent to the control center to be adjusted by the control center.
For example, a standard 300mm wafer is placed in the robot arm of the present embodiment, covering the third hole (in the outward direction from the wafer); if during the process, the holding wafer 12 is the second hole, this means that the wafer 12 is smaller. In this way, it can be determined whether the wafer 12 is larger or smaller than the standard size, which can help the subsequent process.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (8)
1. A mechanical arm comprises a bottom plate and a supporting component arranged on the bottom plate ， The method is characterized in that: the device also comprises a driving assembly, a connecting assembly and a clamping assembly;
the driving assembly is arranged on the bottom plate, the driving assembly is movably connected with the connecting assembly, the clamping assembly is movably connected with the connecting assembly, the connecting assembly and the clamping assembly are two groups, and the driving assembly drives the two groups of the clamping assemblies to synchronously move along the direction close to or far away from the wafer.
2. A robotic arm as claimed in claim 1, wherein: the driving assembly comprises a driving cylinder and a connecting block connected with a push rod of the driving cylinder, and the connecting assembly is movably connected with the connecting block.
3. A robotic arm as claimed in claim 2, wherein: waist type groove has all been seted up to the connecting block both sides, coupling assembling is close to connecting block one end is provided with protruding structure, protruding structure stretches into in the waist type groove.
4. A robotic arm as claimed in claim 3, wherein: the connecting assembly comprises a first connecting rod, a second connecting rod and a fixed rod which are connected with each other, wherein the first connecting rod is movably connected with the second connecting rod, and the second connecting rod passes through the fixed rod and is connected with the fixed rod in a sliding way; two limiting rods are arranged at one side, far away from the clamped wafer, of the clamping assembly at intervals, one limiting rod penetrates through the fixing rod to be movably connected with the second connecting rod, and the other limiting rod is movably connected with the fixing rod.
5. A robotic arm as claimed in claim 4, wherein: a straight line section is arranged on the second connecting rod and penetrates through the fixing rod.
6. A robotic arm as claimed in claim 4, wherein: the two ends of the first connecting rod are provided with protruding structures, the two ends of the second connecting rod are provided with waist-shaped grooves, the protruding structures at one end of the first connecting rod extend into the waist-shaped grooves on the connecting block, the protruding structure at the other end stretches into the waist-shaped groove at one end of the second connecting rod, the limiting rod penetrating through the fixing rod is provided with the protruding structure, and the protruding structure stretches into the waist-shaped groove at the other end of the second connecting rod.
7. A robotic arm as claimed in claim 1, wherein: the clamping part of the clamping component is of an arc-shaped structure, and the radian is adapted to the radian of the wafer ， The clamping assembly comprises an arc-shaped clamping block.
8. A robotic arm as claimed in claim 1, wherein: the bottom plate is provided with a plurality of detection holes below the connecting block, the detection holes are sequentially arranged on the moving path of the connecting block, and the detection holes are in a semi-vacuum state during detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311285784.2A CN117174643A (en) | 2023-10-07 | 2023-10-07 | Mechanical arm |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311285784.2A CN117174643A (en) | 2023-10-07 | 2023-10-07 | Mechanical arm |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117174643A true CN117174643A (en) | 2023-12-05 |
Family
ID=88936126
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311285784.2A Pending CN117174643A (en) | 2023-10-07 | 2023-10-07 | Mechanical arm |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117174643A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030175106A1 (en) * | 2001-04-28 | 2003-09-18 | Karsten Urban | Holding device for wafers |
| KR20070069952A (en) * | 2005-12-28 | 2007-07-03 | 동부일렉트로닉스 주식회사 | Wafer align fail detector in the turn over module |
| CN106158706A (en) * | 2015-05-15 | 2016-11-23 | 苏斯微技术光刻有限公司 | For the method operating alignment wafer pair |
| CN213519916U (en) * | 2020-12-30 | 2021-06-22 | 无锡奇众电子科技有限公司 | Wafer clamping device |
-
2023
- 2023-10-07 CN CN202311285784.2A patent/CN117174643A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030175106A1 (en) * | 2001-04-28 | 2003-09-18 | Karsten Urban | Holding device for wafers |
| KR20070069952A (en) * | 2005-12-28 | 2007-07-03 | 동부일렉트로닉스 주식회사 | Wafer align fail detector in the turn over module |
| CN106158706A (en) * | 2015-05-15 | 2016-11-23 | 苏斯微技术光刻有限公司 | For the method operating alignment wafer pair |
| CN213519916U (en) * | 2020-12-30 | 2021-06-22 | 无锡奇众电子科技有限公司 | Wafer clamping device |
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