CN117141037B - Electric power fitting processing technology - Google Patents
Electric power fitting processing technology Download PDFInfo
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- CN117141037B CN117141037B CN202311416567.2A CN202311416567A CN117141037B CN 117141037 B CN117141037 B CN 117141037B CN 202311416567 A CN202311416567 A CN 202311416567A CN 117141037 B CN117141037 B CN 117141037B
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- 238000012545 processing Methods 0.000 title claims abstract description 23
- 238000005516 engineering process Methods 0.000 title claims abstract description 12
- 230000002159 abnormal effect Effects 0.000 claims abstract description 66
- 238000009826 distribution Methods 0.000 claims abstract description 58
- 238000001816 cooling Methods 0.000 claims abstract description 44
- 238000001514 detection method Methods 0.000 claims abstract description 38
- 238000003825 pressing Methods 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 58
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- 238000004519 manufacturing process Methods 0.000 claims description 21
- 230000008569 process Effects 0.000 claims description 18
- 230000009467 reduction Effects 0.000 claims description 11
- 239000011229 interlayer Substances 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 8
- 239000002356 single layer Substances 0.000 claims description 7
- 238000007723 die pressing method Methods 0.000 claims description 5
- 238000003754 machining Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
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- 238000009413 insulation Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B30—PRESSES
- B30B—PRESSES IN GENERAL
- B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
- B30B15/26—Programme control arrangements
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Abstract
The invention relates to the field of electric power fitting processing, in particular to an electric power fitting processing technology, which comprises the following steps: performing thickness matching according to the required thickness to determine the thickness distribution state of the target hardware fitting, wherein the number of plate layers corresponding to each thickness distribution state is different; when the cooling difference is in a preset threshold range, adjusting the thickness of the outer layer; detecting the thickness average degree of a vertical region of the target hardware fitting to determine a detection mode; in a first detection mode, detecting the distribution state of thickness abnormal points of a target hardware fitting, and adjusting the mould pressing speed corresponding to a thickness abnormal region when the thickness abnormal points are in a preset distribution state; in the second detection mode, detection is performed according to the thickness reference value of the bottom area of the target hardware fitting, and when the thickness reference value of the bottom area of the target hardware fitting is smaller than the preset thickness reference value range, the position height of the inclined wedge is adjusted.
Description
Technical Field
The invention relates to the field of electric power fitting machining, in particular to an electric power fitting machining process.
Background
In the laying process of high-altitude power transmission wires for transmitting electric energy, a large number of power transmission towers are required to be erected, the power transmission towers are connected with the power transmission wires through a large number of hardware fittings for ensuring enough insulation conditions and mechanical strength, and a large number of right-angle hanging plates are required to be used in the connection of the hardware fittings. Because the performance of the traditional right-angle hanging plate formed by a single metal material is difficult to meet the requirement of actual use, different metal plates are manufactured into a composite multi-layer right-angle hanging plate through a special process, but at present, the quality problems of uneven thickness, rebound and the like of the prepared hardware fitting are frequently encountered in the production of the multi-layer right-angle hanging plate, and the problem to be solved is how to improve the preparation quality of the multi-layer right-angle hanging plate.
Chinese patent publication No. CN111515301B discloses a right angle link plate processing apparatus and punching system, comprising: the device comprises a die body and a lower die body, wherein a conveying channel is arranged on the lower die body; the first mold core group is arranged on the upper mold body and the lower mold body and is positioned in the middle of the conveying channel; the second mold core group is arranged on the upper mold body and the lower mold body and is positioned at the tail end of the conveying channel; the pushing assembly is arranged at the tail end of the conveying channel and pushes the right-angle hanging plate to the receiving groove from the tail end of the conveying channel. Through set up first mold core group, second mold core group and pushing component on the route of conveying channel, when the raw materials piece moved on conveying channel, by first mold core group and second mold core group stamping forming in proper order into predetermined shape, and after stamping forming, by the inside of pushing component propelling movement to receiving the silo, realized the effect of automatic pushing. The technical scheme discloses replacing traditional right-angle hanging plate forming process through stamping process, but when this scheme is applied to the production processing technology of multilayer integrated formed right-angle hanging plate, can't adjust stamping system's operating parameter according to actual working condition and lead to the right-angle hanging plate that the preparation obtained to have the uneven or panel resilience's problem.
Disclosure of Invention
Therefore, the invention provides an electric power fitting processing technology, which is used for solving the problems that in the prior art, the production and processing technology of the multilayer integrally formed right-angle hanging plate cannot adjust the working parameters of a stamping system according to actual working conditions, so that the prepared right-angle hanging plate has uneven thickness or rebound of a plate.
In order to achieve the above object, the present invention provides a power fitting processing technology, including:
performing thickness matching according to the required thickness to determine a thickness distribution state of the target hardware fitting, wherein the thickness distribution state comprises a first thickness distribution state and a second thickness distribution state, and the number of plate layers corresponding to the thickness distribution states is different;
calculating the cooling difference degree, and adjusting the thickness of the outer layer when the cooling difference degree is in a preset threshold range;
detecting the thickness average degree of the vertical region of the target hardware fitting to determine a detection mode, wherein the detection mode comprises a first detection mode for detecting an abnormal region according to the distribution state of thickness abnormal points of the vertical region of the target hardware fitting,
and a second detection mode for detecting a thickness reference value of the bottom region of the target hardware;
in a first detection mode, detecting the distribution state of thickness abnormal points of a target hardware fitting, and adjusting the mould pressing speed corresponding to a thickness abnormal region when the thickness abnormal points are in a preset distribution state;
in the second detection mode, detection is performed according to the thickness reference value of the bottom area of the target hardware fitting, and when the thickness reference value of the bottom area of the target hardware fitting is smaller than a preset thickness reference value range, the position height of the inclined wedge is adjusted.
Further, performing thickness matching according to the required thickness under the thickness matching condition to determine a thickness distribution state of the target hardware, wherein the thickness distribution state comprises: the number of layers of the target hardware fitting is 3 in the first thickness distribution state, the thickness of each layer is the same, and the number of layers of the target hardware fitting is 2 in the second thickness distribution state, and the thickness of each layer is the same;
and if the required thickness is in a second required thickness range, the target hardware fitting is in a second thickness distribution state.
Further, under the first production detection condition, detecting the temperature of each layer of the target hardware fitting, calculating the cooling difference degree, and reducing and adjusting the thickness of the outer layer when the cooling difference degree is in a first preset cooling difference range;
the reduction of the thickness of the outer layer and the cooling difference degree are in positive correlation;
and the first production detection condition is that the production of the target hardware fitting is completed.
Further, detecting the thickness average degree of the vertical region of the target hardware fitting under the second production detection condition, and if the thickness average degree is in a first preset thickness average degree range, detecting a thickness reference value of the bottom region of the target hardware fitting;
if the thickness average degree is in the second preset thickness average degree, detecting an abnormal region according to the distribution state of thickness abnormal points of the vertical region of the target hardware fitting;
wherein the second production detection condition is that the judging process of the cooling difference degree of the target hardware fitting is completed.
Further, when the thickness average degree is in a second preset thickness average degree range, detecting the distribution state of thickness abnormal points of the target hardware fitting, if the thickness abnormal points are in a first preset distribution state, determining a thickness abnormal region according to the thickness abnormal points, and adjusting the die pressing speed corresponding to the thickness abnormal region;
if the average thickness value of the abnormal thickness region is larger than the required thickness, reducing and adjusting the mould pressing speed corresponding to the abnormal thickness region;
and if the average thickness value of the abnormal thickness region is smaller than the required thickness, increasing and adjusting the die pressing speed corresponding to the abnormal thickness region.
Further, the calculation formula of the thickness average degree is:
。
n points randomly selected from the surface of the vertical region of the target hardware fitting are measurement points, hi is the thickness of the i-th measurement point, i=1, 2,3, … … and n;
h0 is the average value of the thickness,。
further, if the thickness average degree is in a first preset thickness average degree range, detecting according to a thickness reference value of a bottom area of the target hardware fitting, and reducing and adjusting the position height of the wedge when the thickness reference value of the bottom area of the target hardware fitting is smaller than any value in the preset thickness reference value range;
the reduction of the position height of the wedge and the thickness reference value are in negative correlation.
Further, if the thickness reference value of the bottom area of the target hardware fitting is in the range of the preset thickness reference value, the position height of the wedge is not required to be adjusted, the rebound degree of the target hardware fitting is detected, and if the rebound degree is larger than the preset rebound degree, the position height of the wedge is reduced and adjusted according to the rebound degree difference;
the reduction of the position height of the wedge and the rebound degree difference are in negative correlation.
Further, if the thickness of the outer layer is reduced, the thickness of the interlayer is increased and adjusted by 2 times the thickness of the single outer layer, wherein the thickness of the outer layer is adjusted to be equal to the thickness of the plates of the two outer layers.
Further, the thickness of the single-layer plate of the target hardware fitting is correspondingly provided with a maximum allowable thickness and a minimum allowable thickness.
Compared with the prior art, the method has the beneficial effects that in the technical scheme, the thickness matching is carried out according to the required thickness to determine the thickness distribution state of the target hardware, so that the number of layers of the target hardware is selected to be more in accordance with the actual production requirement, the temperature of each layer of the target hardware is detected and the cooling difference degree is calculated for the target hardware with 3 layers, when the cooling difference degree is in a first preset cooling difference range, the external layer thickness is reduced and regulated, the problem that the interlayer cooling speed is influenced by the excessive thickness of the external layer is low, the problem that the strength of a final product is low is solved, when the thickness average degree is in the first preset thickness average degree range, the thickness abnormal region is determined according to the thickness abnormal point, the mould pressing speed corresponding to the thickness abnormal region is regulated, the pressing speed of the mould is more in accordance with the actual working scene, the thickness of the prepared hardware is more uniform, and when the thickness reference value of the bottom region of the target hardware is smaller than any numerical value in a preset thickness reference value range, the position height of the wedge is reduced and regulated, and the bottom thickness of the prepared target hardware cannot be too deep due to the excessive bottom thickness in the vertical direction; furthermore, the invention improves the preparation efficiency of the production and processing process of the multilayer right-angle hanging plate and the preparation quality of the formed part.
Drawings
Fig. 1 is a schematic diagram of a power fitting processing process according to an embodiment of the present invention;
fig. 2 is a schematic diagram of an electric power fitting processing apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a target hardware fitting according to an embodiment of the present invention;
in the figure: the device comprises a sliding block 1, a limiting block 2, an upper die 3, a wedge 4, a lifting device 5, a cooling pipeline 6, an outer layer 7, an interlayer 8, a reference point 9, a vertical area 10, a bottom area 11 and a central axis 12.
Detailed Description
In order that the objects and advantages of the invention will become more apparent, the invention will be further described with reference to the following examples; it should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are merely for explaining the technical principles of the present invention, and are not intended to limit the scope of the present invention.
It should be noted that, in the description of the present invention, terms such as "upper," "lower," "left," "right," "inner," "outer," and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the apparatus or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those skilled in the art according to the specific circumstances.
Referring to fig. 1, which is a schematic diagram of a power fitting processing process according to an embodiment of the present invention, the present invention provides a power fitting processing process, including:
performing thickness matching according to the required thickness to determine a thickness distribution state of the target hardware fitting, wherein the thickness distribution state comprises a first thickness distribution state and a second thickness distribution state, and the number of plate layers corresponding to the thickness distribution states is different;
calculating the cooling difference degree, and adjusting the thickness of the outer layer when the cooling difference degree is in a preset threshold range;
detecting the thickness average degree of the vertical region of the target hardware fitting to determine a detection mode, wherein the detection mode comprises a first detection mode for detecting an abnormal region according to the distribution state of thickness abnormal points of the vertical region of the target hardware fitting,
and a second detection mode for detecting a thickness reference value of the bottom region of the target hardware;
in a first detection mode, detecting the distribution state of thickness abnormal points of a target hardware fitting, and adjusting the mould pressing speed corresponding to a thickness abnormal region when the thickness abnormal points are in a preset distribution state;
in the second detection mode, detection is performed according to the thickness reference value of the bottom area of the target hardware fitting, and when the thickness reference value of the bottom area of the target hardware fitting is smaller than a preset thickness reference value range, the position height of the inclined wedge is adjusted.
Referring to fig. 2, which is a schematic diagram of an electric power fitting processing apparatus according to an embodiment of the present invention, an electric power fitting processing apparatus for an embodiment of the present invention is provided, including:
the lower die is arranged on the base and is provided with two sliding blocks 1, and a limiting spring connected with a limiting block 2 is arranged inside the sliding blocks 1;
a plurality of cooling pipelines 6 which are arranged in the two sliding blocks 1 of the lower die at intervals and used for cooling the matched plate;
the upper die 3 is connected with a pressure device, and is provided with a forming convex structure for stamping and forming the plate arranged on the lower die by moving downwards to be matched with the lower die;
the wedge 4 is arranged at one end of the upper die 3 close to the lower die through the lifting device 5, and converts the pressure in the vertical direction of the upper die 3 into the pushing force in the horizontal direction so as to push the sliding block 1 to squeeze in the direction perpendicular to the central axis;
the height of the wedge 4 can be adjusted, but it is noted that the height adjustment of the wedge 4 needs to be satisfied, when the upper die 3 and the lower die are closed, the two sliding blocks 1 can contact the plate, the force applied to the plate in the horizontal direction of the two sliding blocks 1 meets the user requirement, as can be understood by those skilled in the art, whether the force applied to the plate in the horizontal direction of the two sliding blocks 1 meets the user requirement or not is determined according to the actual working scene.
The plate placed on the lower die is a plate heated from a heating furnace.
Referring to fig. 3, which is a schematic structural diagram of a target hardware according to an embodiment of the present invention, the number of layers of the target hardware is 3, and the interlayer 8 is located between two outer layers 7, wherein a flat plate area is denoted as a vertical area 10, an arc area is denoted as a bottom area 11, a distance between two ends of the target hardware along a central axis 12 is denoted as a hardware length, and a point at which the bottom of the target hardware intersects with the central axis 12 is denoted as a reference point 9.
With continued reference to fig. 1 to 3, thickness matching is performed according to a required thickness under a thickness matching condition to determine a thickness distribution state of the target hardware, where the thickness distribution state includes: the number of layers of the target hardware fitting is 3 in the first thickness distribution state, the thickness of each layer is the same, and the number of layers of the target hardware fitting is 2 in the second thickness distribution state, and the thickness of each layer is the same;
and if the required thickness is in a second required thickness range, the target hardware fitting is in a second thickness distribution state.
Specifically, under the first production detection condition, detecting the temperature of each layer of the target hardware fitting, calculating the cooling difference degree, and reducing and adjusting the thickness of the outer layer when the cooling difference degree is in a first preset cooling difference range;
the reduction of the thickness of the outer layer and the cooling difference degree are in positive correlation;
the first production detection condition is that the production of the target hardware is completed and the number of layers of the target hardware is 3.
Specifically, the required thickness is the thickness of a vertical area where a user needs to produce the target hardware fitting, the values in the first required thickness range are all larger than the preset required thickness, the values in the second required thickness range are all smaller than or equal to the preset required thickness, the sum of the maximum allowable thickness and the minimum allowable thickness is recorded as L, the preset required thickness is (L/2) multiplied by 3, and the problem that the structural strength is poor due to the fact that the single-layer thickness is thinner in the production process of the target hardware fitting with a three-layer structure due to the fact that the required thickness is too thin is avoided, so that if the required thickness is in the second required thickness range, the target hardware fitting is in a second thickness distribution state;
the method for detecting the temperature of each layer of the target hardware fitting comprises the steps of using an infrared temperature measuring instrument to measure the temperature of a single-layer plate in a non-contact manner and monitoring the temperature change of the single-layer plate in real time in the forming process, or using a thermocouple detecting method to install a thermocouple sensor on the surface of the single-layer plate and monitoring the temperature change by measuring a temperature voltage signal generated by a thermocouple, which is common knowledge in the prior art and is not described in detail herein.
Specifically, under the second production detection condition, detecting the thickness average degree of the vertical region of the target hardware fitting, and if the thickness average degree is in a first preset thickness average degree range, detecting a thickness reference value of the bottom region of the target hardware fitting;
if the thickness average degree is in the second preset thickness average degree, detecting an abnormal region according to the distribution state of thickness abnormal points of the vertical region of the target hardware fitting;
wherein the second production detection condition is that the judging process of the cooling difference degree of the target hardware fitting is completed.
And when the cooling difference degree is in a first preset cooling difference range and the reduction adjustment of the outer layer thickness is completed or when the cooling difference degree is in a second preset cooling difference range, recording that the judging process of the cooling difference degree of the target hardware fitting is completed.
The method comprises the steps of extracting the temperature falling duration required by the temperature of each layer of plate to be reduced to the allowable temperature, recording the value obtained by subtracting the temperature falling duration with the smallest value from the temperature falling duration with the largest value as the cooling difference, recording 10% of the temperature falling duration with the smallest value as the preset cooling difference, wherein the value in the average value range of the first preset thickness is larger than or equal to the preset cooling difference, the value in the average value range of the second preset thickness is smaller than the preset cooling difference, allowing the temperature to be set by a user, providing a value allowing the temperature to be 400 ℃, and enabling the cooling rate of the high-temperature plate to be slower, so that the material can be deformed continuously in the cooling process. This can affect the dimensional and shape accuracy of the final product and some materials may undergo phase changes or grain growth during cooling, while slower cooling rates can facilitate these processes and can easily affect the texture and properties of the material.
Specifically, when the thickness average degree is in a second preset thickness average degree range, detecting the distribution state of thickness abnormal points of the target hardware fitting, if the thickness abnormal points are in a first preset distribution state, determining a thickness abnormal region according to the thickness abnormal points, and adjusting the die pressing speed corresponding to the thickness abnormal region;
if the average thickness value of the abnormal thickness region is larger than the required thickness, reducing and adjusting the mould pressing speed corresponding to the abnormal thickness region;
and if the average thickness value of the abnormal thickness region is smaller than the required thickness, increasing and adjusting the die pressing speed corresponding to the abnormal thickness region.
When the mould pressing speed corresponding to the abnormal thickness region is regulated, the speed of the movement process between the abnormal thickness region and the abnormal thickness region is regulated aiming at the lowest point in the vertical direction of the forming convex structure.
The thickness abnormal point is a corresponding measurement point with the thickness larger or smaller than the required thickness, and the area of the target hardware fitting in the horizontal direction corresponding to the point with the highest height of the thickness abnormal point in the numerical direction and the point with the lowest height of the thickness abnormal point is recorded as a thickness abnormal area; the first preset distribution state is that the absolute value of the difference value of the bottom distance between the thickness abnormal point with the largest bottom distance and the thickness abnormal point with the smallest bottom distance is smaller than 10% of the hardware length, the second preset distribution state is that the absolute value of the difference value of the bottom distance between the thickness abnormal point with the largest bottom distance and the thickness abnormal point with the smallest bottom distance is larger than or equal to 10% of the target hardware length, and if the thickness abnormal point is in the second preset distribution state, a user performs fault detection on the electric power hardware processing equipment.
Specifically, the calculation formula of the thickness average degree is:
。
wherein, n points randomly selected from the surface of the vertical region of the target hardware are measurement points, hi is the thickness of the i-th measurement point, i=1, 2,3, … …, n, and it is noted that Hi is the sum of the thicknesses of the interlayer and the two outer layers corresponding to the i-th measurement point.
Specifically, H0 is the average value of the thickness,
。
the values in the first preset thickness average degree range are all smaller than 3% of H0, and the values in the second preset thickness average degree range are all larger than or equal to 3% of H0.
Specifically, if the thickness average degree is in a first preset thickness average degree range, detecting according to a thickness reference value of a bottom area of the target hardware fitting, and when the thickness reference value of the bottom area of the target hardware fitting is smaller than any value in the preset thickness reference value range, reducing and adjusting the position height of the inclined wedge;
the reduction of the position height of the wedge and the thickness reference value are in negative correlation.
The method comprises the steps that a point where the bottom area of a target hardware fitting is intersected with a central axis is marked as a reference point, the thicknesses of two outer layers and an interlayer corresponding to the reference point are marked as thickness reference values, the value in a preset thickness reference value range is more than 97% of the required thickness and less than 103% of the required thickness, and the obvious thickness reduction of a round corner part in U-shaped stamping is common knowledge, so that when the thickness reference value of the bottom area of the target hardware fitting is less than any value in the preset thickness reference value range, the position height of an inclined wedge is reduced and adjusted, and the problem that the thickness of the bottom area is lower than the required value due to overlarge force received in a single vertical direction in the forming process of the target hardware fitting is avoided.
If the thickness reference value of the bottom area of the target hardware fitting is larger than any value in the preset thickness reference value range, the pressing speed of the upper die needs to be increased and adjusted.
Specifically, if the thickness reference value of the bottom area of the target hardware fitting is in the range of the preset thickness reference value, the position height of the wedge is not required to be adjusted, the rebound degree of the target hardware fitting is detected, and if the rebound degree is larger than the preset rebound degree, the position height of the wedge is reduced and adjusted according to the rebound degree difference value;
the reduction of the position height of the wedge and the rebound degree difference are in negative correlation.
By reducing the height of the wedge, the conversion amount of the pressure of the upper die into the extrusion force in the horizontal direction is increased, so that the horizontal pressure of the target hardware is increased, and the rebound degree of the target hardware is reduced.
The rebound degree is obtained by randomly selecting a point which is farthest from the reference point and a point which is closest to the reference point on the vertical region of the target hardware fitting, respectively extracting the distances between the two points and the central axis, calculating the absolute value of the difference value of the two distances, recording the absolute value as the rebound degree, and presetting the rebound degree to be 3% of the distance between the point which is farthest from the reference point and the central axis.
If the rebound degree is smaller than or equal to the preset rebound degree, the rebound degree is qualified.
Specifically, if the outer layer thickness is reduced, the interlayer thickness is increased by 2 times as much as the thickness of a single outer layer, wherein the outer layer thickness is adjusted to be equal to the thickness of the sheet material of both outer layers.
Specifically, the thickness of the single-layer plate of the target hardware fitting is correspondingly provided with a maximum allowable thickness and a minimum allowable thickness.
Thus far, the technical solution of the present invention has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present invention is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present invention, and such modifications and substitutions will be within the scope of the present invention.
The foregoing description is only of the preferred embodiments of the invention and is not intended to limit the invention; various modifications and variations of the present invention will be apparent to those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The electric power fitting processing technology is characterized by comprising the following steps of:
performing thickness matching according to the required thickness to determine a thickness distribution state of the target hardware fitting, wherein the thickness distribution state comprises a first thickness distribution state and a second thickness distribution state, and the number of plate layers corresponding to the thickness distribution states is different;
calculating the cooling difference degree, and adjusting the thickness of the outer layer when the cooling difference degree is in a preset threshold range;
detecting the thickness average degree of the vertical region of the target hardware fitting to determine a detection mode, wherein the detection mode comprises a first detection mode for detecting an abnormal region according to the distribution state of thickness abnormal points of the vertical region of the target hardware fitting,
and a second detection mode for detecting a thickness reference value of the bottom region of the target hardware;
in a first detection mode, detecting the distribution state of thickness abnormal points of a target hardware fitting, and adjusting the mould pressing speed corresponding to a thickness abnormal region when the thickness abnormal points are in a preset distribution state;
in the second detection mode, detection is carried out according to a thickness reference value of the bottom area of the target hardware fitting, and when the thickness reference value of the bottom area of the target hardware fitting is smaller than a preset thickness reference value range, the position height of the inclined wedge is adjusted;
and performing thickness matching according to the required thickness under the thickness matching condition to determine the thickness distribution state of the target hardware fitting, wherein the thickness distribution state comprises: the number of layers of the target hardware fitting is 3 in the first thickness distribution state, the thickness of each layer is the same, and the number of layers of the target hardware fitting is 2 in the second thickness distribution state, and the thickness of each layer is the same;
the target hardware fitting is in a first thickness distribution state if the required thickness is in a first required thickness range, and in a second thickness distribution state if the required thickness is in a second required thickness range;
under the first production detection condition, detecting the temperature of each layer of the target hardware fitting, calculating the cooling difference degree, and reducing and adjusting the thickness of the outer layer when the cooling difference degree is in a first preset cooling difference range;
the reduction of the thickness of the outer layer and the cooling difference degree are in positive correlation;
the first production detection condition is that the production of the target hardware fitting is finished and the number of layers of the target hardware fitting is 3;
detecting the thickness average degree of the vertical region of the target hardware fitting under the second production detection condition, and detecting a thickness reference value of the bottom region of the target hardware fitting if the thickness average degree is in a first preset thickness average degree range;
if the thickness average degree is in the second preset thickness average degree, detecting an abnormal region according to the distribution state of thickness abnormal points of the vertical region of the target hardware fitting;
the second production detection condition is that the judging process of the cooling difference degree of the target hardware fitting is completed;
detecting the distribution state of thickness abnormal points of the target hardware fitting when the thickness average degree is in a second preset thickness average degree range, determining a thickness abnormal region according to the thickness abnormal points if the thickness abnormal points are in a first preset distribution state, and adjusting the die pressing speed corresponding to the thickness abnormal region;
if the average thickness value of the abnormal thickness region is larger than the required thickness, reducing and adjusting the mould pressing speed corresponding to the abnormal thickness region;
if the average thickness value of the abnormal thickness region is smaller than the required thickness, increasing and adjusting the pressing speed of the die corresponding to the abnormal thickness region;
the electric power fitting processing equipment applying the electric power fitting processing technology comprises:
the lower die is arranged on the base and is provided with two sliding blocks, and a limiting spring connected with a limiting block is arranged inside each sliding block;
the cooling pipelines are arranged in the two sliding blocks of the lower die at intervals and used for cooling the matched plate;
the upper die is connected with a pressure device, and is provided with a forming convex structure for stamping and forming a plate arranged on the lower die by moving downwards to be matched with the lower die;
the wedge is arranged at one end of the upper die, which is close to the lower die, through the lifting device, and the pressure in the vertical direction of the upper die is converted into the pushing force in the horizontal direction so as to push the sliding block to squeeze towards the direction vertical to the central axis.
2. The power fitting process according to claim 1, wherein the thickness average degree is calculated by the formula:the method comprises the steps of carrying out a first treatment on the surface of the N points randomly selected from the surface of the vertical region of the target hardware fitting are measurement points, hi is the thickness of the i-th measurement point, i=1, 2,3, … … and n; h0 is the thickness average, < > in->。
3. The power fitting processing technology according to claim 2, wherein if the thickness average degree is within a first preset thickness average degree range, detecting according to a thickness reference value of a bottom area of the target fitting, and when the thickness reference value of the bottom area of the target fitting is smaller than any value within the preset thickness reference value range, reducing and adjusting the position height of the wedge;
the reduction of the position height of the wedge and the thickness reference value are in negative correlation.
4. The power fitting processing technology according to claim 3, wherein if the thickness reference value of the bottom area of the target power fitting is within a preset thickness reference value range, the position height of the wedge is not required to be adjusted, the rebound degree of the target power fitting is detected, and if the rebound degree is greater than the preset rebound degree, the position height of the wedge is reduced and adjusted according to the rebound degree difference;
the reduction of the position height of the wedge and the rebound degree difference are in negative correlation.
5. The power tool processing technology according to claim 4, wherein if the thickness of the outer layers is reduced, the thickness of the interlayer is increased by 2 times as much as the thickness of the single outer layer, and wherein the thickness of the outer layers is adjusted to be equal to the thickness of the plates of the two outer layers.
6. The power fitting machining process according to claim 5, wherein the thickness of the single-layer plate of the target fitting is provided with a maximum allowable thickness and a minimum allowable thickness, respectively.
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