CN117139518A - Efficient forming machine for MOS transistor processing - Google Patents
Efficient forming machine for MOS transistor processing Download PDFInfo
- Publication number
- CN117139518A CN117139518A CN202311006016.9A CN202311006016A CN117139518A CN 117139518 A CN117139518 A CN 117139518A CN 202311006016 A CN202311006016 A CN 202311006016A CN 117139518 A CN117139518 A CN 117139518A
- Authority
- CN
- China
- Prior art keywords
- frame
- fixedly connected
- mos transistors
- plate
- mos transistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 claims abstract description 17
- 238000003825 pressing Methods 0.000 claims description 24
- 230000001681 protective effect Effects 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims 9
- 239000010720 hydraulic oil Substances 0.000 claims 2
- 239000006096 absorbing agent Substances 0.000 claims 1
- 230000035939 shock Effects 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000007423 decrease Effects 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Shearing Machines (AREA)
Abstract
The invention discloses a high-efficiency forming machine for processing MOS transistors, which comprises a frame, wherein the bottom end inside the frame is fixedly connected with a bottom plate, one end of the top of the bottom plate is provided with a connecting frame, and the top end inside the frame is provided with a hydraulic cylinder. This high-efficient make-up machine that MOS transistor processing was used is through being provided with connecting block, the attenuator, articulated lever, buffer spring and installation piece, hydraulic cylinder drives protecting crust and clamp plate decline, the clamp plate descends to certain height and can carry out spacing fixed to MOS transistor and prevent the unexpected removal of MOS transistor, the clamp plate can extrude buffer spring through articulated lever and connecting block when supporting on MOS transistor, buffer spring can cushion the protecting crust through self elasticity, the attenuator can be spacing clamp plate and protecting crust, slow down the range of rocking, it is inconvenient to carry out spacing fixed to the MOS transistor that needs to cut to solve, influence the problem of cutting effect easily.
Description
Technical Field
The invention relates to the technical field of MOS transistor forming machines, in particular to a high-efficiency forming machine for processing an MOS transistor.
Background
The invention relates to a solid semiconductor device, which is provided with a plurality of functions such as detection, rectification, amplification, switching, voltage stabilization and signal modulation, wherein the transistor is of a plurality of types, MOS transistors are of a metal-oxide-semiconductor structure, the MOS transistors are of MOS transistors for short, in the processing process, because the length of pins is inconsistent, pins are required to be cut into the required length, according to application number CN201920830584.3, a MOS transistor forming machine is provided, the solid semiconductor device comprises a host platform, a mounting plate is welded on the right upper side of the host platform, a cylinder is fixedly connected onto the mounting plate, a vertical plate is welded on the left end of a piston rod of the cylinder, a cutter head mounting plate is welded on the left side of the vertical plate, a MOS transistor placing seat is arranged on the left upper side of the host platform, three grooves are formed in the upper portion of the MOS transistor placing seat, eight square through holes are formed in each groove, the MOS transistor forming machine is provided with grooves, pins of a MOS transistor workpiece can penetrate through the eight square through holes in the grooves, when the pins are required to be cut, a pedal is started, a cutter head can be driven by the pedal and the cutter head can be bent to move leftwards, and the cutter head can be bent. The cutting and bending are completed at one time, so that the production efficiency is greatly improved, and the product quality is ensured.
The pin cutting and bending are completed once in the technical scheme, the production efficiency is greatly improved, the product quality is guaranteed, but the problem that the efficient forming machine for processing the MOS transistor is improved because the efficient forming machine for processing the MOS transistor is inconvenient to limit and fix the MOS transistor to be cut and the cutting effect is easy to influence is solved.
Disclosure of Invention
The invention aims to provide an efficient forming machine for processing MOS transistors, which solves the problems that in the background technology, the limiting and fixing of the MOS transistors to be cut are inconvenient and the cutting effect is easily affected.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a high-efficient make-up machine that MOS transistor processing was used, includes the frame, the inside bottom fixedly connected with bottom plate of frame, the one end at bottom plate top is provided with the link, hydraulic cylinder is installed on the inside top of frame, hydraulic cylinder's bottom is provided with the protecting crust, the inside of protecting crust is provided with buffer spring, the both sides fixedly connected with connecting block between the buffer spring, the bottom of protecting crust is provided with the clamp plate, the top of clamp plate and the bottom of connecting block fixedly connected with installation piece respectively, swing joint has the articulated pole between the installation piece, the attenuator is installed to both sides between clamp plate and the protecting crust, the other end fixedly connected with connecting plate of protecting crust, the reservation groove has been seted up to one side of link inside.
Preferably, the hinge rod is movably hinged between the pressing plate and the protective shell through the mounting block, and the connecting block is movably arranged in the protective shell.
Preferably, the dampers are arranged in two groups, and the dampers are symmetrically distributed about the vertical center line of the pressing plate.
Preferably, the reservation grooves are provided with a plurality of groups, and the reservation grooves are arranged at equal intervals at the other end of the inside of the connecting frame.
Preferably, the both sides fixedly connected with connecting rod on protecting crust top, one side fixedly connected with stopper of connecting rod, the both sides fixedly connected with limiting plate on the inside top of frame, spacing spout has been seted up to one side of limiting plate inside.
Preferably, the limiting block is embedded in the limiting chute, and the limiting block slides up and down in the limiting chute.
Preferably, the other end of the bottom plate is provided with a cavity, a collecting box is arranged in the cavity, and handles are fixedly connected to two sides of the other end of the collecting box.
Preferably, the collection box is mounted inside the bottom plate through a cavity.
Preferably, the handles are provided in two groups.
Preferably, a cutting blade is arranged at the bottom end of the connecting plate
Compared with the prior art, the invention has the beneficial effects that: the efficient forming machine for processing the MOS transistor not only realizes the convenience of limiting one end of the MOS transistor, improves the lifting stability of the protective shell, but also realizes the convenience of cleaning scraps generated by processing;
(1) Through being provided with connecting block, attenuator, articulated lever, buffer spring and installation piece, start hydraulic cylinder when cutting MOS transistor, hydraulic cylinder drives protective housing and clamp plate decline, the clamp plate descends to certain height and can carry out spacing fixed to MOS transistor and prevent the unexpected removal of MOS transistor, the clamp plate can extrude buffer spring through articulated lever and connecting block when supporting on MOS transistor, buffer spring can cushion the protective housing through self elasticity, the attenuator can carry out spacing to clamp plate and protective housing, slow down the range of rocking;
(2) Through being provided with connecting rod, stopper, spacing spout and limiting plate, the stopper of connecting rod one side can slide from top to bottom in the inside of spacing spout when hydraulic cylinder drives the protecting crust and goes up and down to can carry out spacingly to the protecting crust when the protecting crust goes up and down, carry out spacingly to the protecting crust can improve the stability that the protecting crust goes up and down, prevent protecting crust and cutting blade can deviate from the inside of leading to cutting blade break away from the link when going up and down;
(3) Through being provided with bottom plate, handle, cavity and collecting box, the pin that cuts out can drop the inside of collecting box to can unify the collection to the pin that cuts out, prevent that the pin that cuts out from polluting the environment, pulling handle when need carrying out unified processing to the pin that cuts out, the handle drives the collecting box and breaks away from the inside other end of bottom plate, thereby conveniently unified processing pin that cuts out.
Drawings
FIG. 1 is a schematic cross-sectional elevation view of the present invention;
FIG. 2 is a schematic elevational view of the present invention;
FIG. 3 is a schematic top view of the collection box of the present invention;
FIG. 4 is an enlarged cross-sectional view of FIG. 1A according to the present invention;
FIG. 5 is an enlarged schematic view of the front section of the limiting plate of the present invention;
fig. 6 is an enlarged schematic top view of the connector of the present invention.
In the figure: 1. a frame; 2. a bottom plate; 3. a connecting frame; 4. a pressing plate; 5. a protective shell; 6. a hydraulic cylinder; 7. a connecting block; 8. a connecting rod; 9. a limiting block; 10. limiting sliding grooves; 11. a limiting plate; 12. a damper; 13. a hinge rod; 14. a reserved groove; 15. a handle; 16. a cavity; 17. a connecting plate; 18. a cutting blade; 19. a collection box; 20. a buffer spring; 21. and (5) installing a block.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1: referring to fig. 1-4 and fig. 6, an efficient forming machine for processing a mos transistor includes a frame 1, a bottom plate 2 is fixedly connected to the bottom end inside the frame 1, a connecting frame 3 is provided at one end of the top of the bottom plate 2, a hydraulic cylinder 6 is mounted at the top end inside the frame 1, a protecting shell 5 is provided at the bottom end of the hydraulic cylinder 6, a buffer spring 20 is provided inside the protecting shell 5, connecting blocks 7 are fixedly connected to two sides between the buffer spring 20, a pressing plate 4 is provided at the bottom end of the protecting shell 5, mounting blocks 21 are fixedly connected to the top end of the pressing plate 4 and the bottom end of the connecting blocks 7 respectively, a hinge rod 13 is movably hinged between the mounting blocks 21, dampers 12 are mounted at two sides between the pressing plate 4 and the protecting shell 5, a connecting plate 17 is fixedly connected to the other end of the protecting shell 5, a cutting blade 18 is mounted at the bottom end of the connecting plate 17, and a reserved groove 14 is formed in one side inside the connecting frame 3;
the hinging rod 13 is movably hinged between the pressing plate 4 and the protective shell 5 through the mounting block 21, the connecting block 7 is movably arranged in the protective shell 5, two groups of dampers 12 are arranged, the dampers 12 are symmetrically distributed about the vertical center line of the pressing plate 4, a plurality of groups of reserved grooves 14 are arranged, and the reserved grooves 14 are arranged at the other end of the inside of the connecting frame 3 at equal intervals;
specifically, as shown in fig. 1 and 4, when cutting the MOS transistor, the hydraulic cylinder 6 is started, the hydraulic cylinder 6 drives the protecting shell 5 and the pressing plate 4 to descend, the pressing plate 4 descends to a certain height to limit and fix the MOS transistor to prevent the MOS transistor from moving accidentally, when the pressing plate 4 is propped against the MOS transistor, the pressing plate 4 extrudes the buffer spring 20 through the hinging rod 13 and the connecting block 7, the buffer spring 20 can buffer the protecting shell 5 through self elasticity, and the damper 12 can limit the pressing plate 4 and the protecting shell 5 to slow down the shaking amplitude.
Example 2: as shown in fig. 5, two sides of the top end of the protective shell 5 are fixedly connected with connecting rods 8, one side of each connecting rod 8 is fixedly connected with a limiting block 9, two sides of the top end inside the frame 1 are fixedly connected with limiting plates 11, one side inside each limiting plate 11 is provided with a limiting chute 10, each limiting block 9 is embedded in the corresponding limiting chute 10, and each limiting block 9 slides up and down in the corresponding limiting chute 10;
specifically, as shown in fig. 1 and 2, when the hydraulic cylinder 6 drives the protecting shell 5 to lift, the limiting block 9 on one side of the connecting rod 8 can slide up and down in the limiting chute 10, so that the protecting shell 5 can be limited when the protecting shell 5 lifts, the lifting stability of the protecting shell 5 can be improved by limiting the protecting shell 5, and the protecting shell 5 and the cutting blade 18 are prevented from being deviated when lifted, so that the cutting blade 18 is separated from the inside of the connecting frame 3.
Example 3: the other end of the inside of the bottom plate 2 is provided with a cavity 16, the inside of the cavity 16 is provided with a collecting box 19, two sides of the other end of the collecting box 19 are fixedly connected with handles 15, the collecting box 19 is arranged in the inside of the bottom plate 2 through the cavity 16, and the handles 15 are provided with two groups;
specifically, as shown in fig. 1, 2 and 3, the cut pins can fall into the collecting box 19, so that the cut pins can be collected uniformly, the environment pollution caused by the cut pins is prevented, the handle 15 is pulled when the cut pins are required to be uniformly processed, the handle 15 drives the collecting box 19 to be separated from the other end of the inside of the bottom plate 2, and the cut pins are convenient to uniformly process.
Working principle: when the MOS transistor cutting device is used, MOS transistors to be formed are placed in the connecting frame 3, pins are placed in the reserved groove 14 when the MOS transistors are placed, the hydraulic cylinder 6 is started after the MOS transistors are placed, the hydraulic cylinder 6 drives the protecting shell 5 and the pressing plate 4 to descend, the pressing plate 4 descends to a certain height to limit and fix the MOS transistors so as to prevent the MOS transistors from accidentally moving, the pressing plate 4 presses the buffer spring 20 through the hinging rod 13 and the connecting block 7 when the pressing plate 4 abuts against the MOS transistors, the buffer spring 20 can buffer the protecting shell 5 through own elasticity, the damper 12 can limit the pressing plate 4 and the protecting shell 5, the shaking amplitude is slowed down, the cutting blade 18 cuts the pins when the pressing plate 4 descends, the hydraulic cylinder 6 drives the limiting block 9 on one side of the connecting rod 8 to slide up and down in the limiting chute 10 when the protecting shell 5 ascends and descends, the cut pins can drop into the collecting box 19, the cut pins can be collected uniformly, the cut pins can be prevented from polluting the cut pins, the cut pins can be polluted, the handle 15 is driven to be pulled out uniformly, and the cut pins are required to be separated from the collecting box 15 conveniently, and the handle 15 is pulled uniformly, and the cut pins are required to be processed.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (10)
- High-efficient make-up machine of MOS transistor processing usefulness, including frame (1), its characterized in that: the novel hydraulic shock absorber is characterized in that the bottom end of the frame (1) is fixedly connected with the bottom plate (2), one end of the top of the bottom plate (2) is provided with the connecting frame (3), the hydraulic oil cylinder (6) is installed at the top end of the inside of the frame (1), the bottom end of the hydraulic oil cylinder (6) is provided with the protecting shell (5), the buffer springs (20) are arranged in the protecting shell (5), connecting blocks (7) are fixedly connected to two sides between the buffer springs (20), the bottom end of the protecting shell (5) is provided with the pressing plate (4), the top end of the pressing plate (4) and the bottom end of the connecting blocks (7) are fixedly connected with the installing blocks (21) respectively, hinge rods (13) are movably hinged between the installing blocks (21), dampers (12) are installed at two sides between the pressing plate (4) and the protecting shell (5), the other end of the protecting shell (5) is fixedly connected with the connecting plate (17), and one side of the inside of the connecting frame (3) is provided with the reserved groove (14).
- 2. The efficient molding machine for processing MOS transistors according to claim 1, wherein: the hinge rod (13) is movably hinged between the pressing plate (4) and the protective shell (5) through the mounting block (21), and the connecting block (7) is movably arranged in the protective shell (5).
- 3. The efficient molding machine for processing MOS transistors according to claim 1, wherein: the dampers (12) are arranged in two groups, and the dampers (12) are symmetrically distributed about the vertical center line of the pressing plate (4).
- 4. The efficient molding machine for processing MOS transistors according to claim 1, wherein: the reservation grooves (14) are provided with a plurality of groups, and the reservation grooves (14) are arranged at the other end of the inside of the connecting frame (3) at equal intervals.
- 5. The efficient molding machine for processing MOS transistors according to claim 1, wherein: the utility model discloses a frame, including frame (1), shell (5), connecting rod (8) are connected with in both sides fixedly connected with on top of shell (5), one side fixedly connected with stopper (9) of connecting rod (8), both sides fixedly connected with limiting plate (11) on the inside top of frame (1), spacing spout (10) have been seted up to one side of limiting plate (11) inside.
- 6. The efficient molding machine for processing MOS transistors according to claim 5, wherein: the limiting block (9) is embedded in the limiting chute (10), and the limiting block (9) slides up and down in the limiting chute (10).
- 7. The efficient molding machine for processing MOS transistors according to claim 1, wherein: the other end of the bottom plate (2) is provided with a cavity (16), a collecting box (19) is arranged in the cavity (16), and handles (15) are fixedly connected to two sides of the other end of the collecting box (19).
- 8. The efficient molding machine for processing MOS transistors according to claim 7, wherein: the collecting box (19) is arranged inside the bottom plate (2) through the cavity (16).
- 9. The efficient molding machine for processing MOS transistors according to claim 7, wherein: the handles (15) are provided with two groups.
- 10. The efficient molding machine for processing MOS transistors according to claim 1, wherein: the bottom end of the connecting plate (17) is provided with a cutting blade (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311006016.9A CN117139518A (en) | 2023-08-10 | 2023-08-10 | Efficient forming machine for MOS transistor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311006016.9A CN117139518A (en) | 2023-08-10 | 2023-08-10 | Efficient forming machine for MOS transistor processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117139518A true CN117139518A (en) | 2023-12-01 |
Family
ID=88905226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311006016.9A Pending CN117139518A (en) | 2023-08-10 | 2023-08-10 | Efficient forming machine for MOS transistor processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117139518A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113245617A (en) * | 2021-04-09 | 2021-08-13 | 陈强 | Processing equipment for textile machinery |
| CN215816784U (en) * | 2021-09-10 | 2022-02-11 | 苏州丰矩电子科技有限公司 | Automatic terminal crimping mechanism for production of connecting wire |
| KR20220035625A (en) * | 2020-09-14 | 2022-03-22 | (주)지우텍 | PVC floor tile cutting equipment |
| CN216181002U (en) * | 2021-10-21 | 2022-04-05 | 苏州璟福鑫汽车零部件股份有限公司 | Cutting equipment is used in flexible rubber hose processing |
| CN216263228U (en) * | 2021-11-07 | 2022-04-12 | 深圳市诠方半导体有限公司 | MOS pipe make-up machine |
| CN216370371U (en) * | 2021-11-24 | 2022-04-26 | 苏州宽窄机械设备有限公司 | Intelligent plate shearing machine for producing metal plate cabinet shell |
| CN217046730U (en) * | 2021-10-08 | 2022-07-26 | 常州市恒鑫包装彩印有限公司 | But full-automatic cutting device of self-propelled |
-
2023
- 2023-08-10 CN CN202311006016.9A patent/CN117139518A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220035625A (en) * | 2020-09-14 | 2022-03-22 | (주)지우텍 | PVC floor tile cutting equipment |
| CN113245617A (en) * | 2021-04-09 | 2021-08-13 | 陈强 | Processing equipment for textile machinery |
| CN215816784U (en) * | 2021-09-10 | 2022-02-11 | 苏州丰矩电子科技有限公司 | Automatic terminal crimping mechanism for production of connecting wire |
| CN217046730U (en) * | 2021-10-08 | 2022-07-26 | 常州市恒鑫包装彩印有限公司 | But full-automatic cutting device of self-propelled |
| CN216181002U (en) * | 2021-10-21 | 2022-04-05 | 苏州璟福鑫汽车零部件股份有限公司 | Cutting equipment is used in flexible rubber hose processing |
| CN216263228U (en) * | 2021-11-07 | 2022-04-12 | 深圳市诠方半导体有限公司 | MOS pipe make-up machine |
| CN216370371U (en) * | 2021-11-24 | 2022-04-26 | 苏州宽窄机械设备有限公司 | Intelligent plate shearing machine for producing metal plate cabinet shell |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN117139518A (en) | Efficient forming machine for MOS transistor processing | |
| CN208231993U (en) | A kind of bamboo stick positioning-cutting device | |
| CN219851601U (en) | Aluminum plate stamping forming machine | |
| CN214517472U (en) | Core-pulling demoulding device with stabilizing function | |
| CN219598156U (en) | Compression type drilling equipment for pulling-off block processing | |
| CN219684305U (en) | Waste removing device for laser cutting plates for evaporator | |
| CN112372859B (en) | Plain type stone material board fly-cutting device | |
| CN211729935U (en) | Supporting device for electric cylinder press | |
| CN219837047U (en) | Full-automatic high-efficient stamping workpiece processing equipment | |
| CN112823964A (en) | Tin ingot demoulding mechanism | |
| CN210703308U (en) | Automatic change fixing device for welding | |
| CN213615860U (en) | Novel glass bottle mould dust remover of polishing | |
| CN212577551U (en) | Fast cutting and punching equipment for sieve plate | |
| CN215216951U (en) | Quick drying device for tobacco shred production | |
| CN221109614U (en) | Stamping die capable of being maintained quickly | |
| CN215965892U (en) | Stamping die for automobile cross beam | |
| CN209773913U (en) | Static press-mounting machine for building engineering | |
| CN218504728U (en) | Perforating machine capable of conveniently fixing glass plate | |
| CN213136829U (en) | Production of semiconductor ceramic capacitor chip is with cutting equipment | |
| CN213729171U (en) | Stamping device is used in chain production | |
| CN213646098U (en) | Metal cutter with garbage collection mechanism | |
| CN220931773U (en) | Lifting grate vibrator | |
| CN220112082U (en) | Novel high-efficient forging punching equipment of track fishplate | |
| CN209134244U (en) | Armature bearing press-fitting device | |
| CN221242630U (en) | Manual nut extrusion tapping machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |