CN117121508A

CN117121508A - Speaker having improved BL characteristics and electronic device including the same

Info

Publication number: CN117121508A
Application number: CN202180096829.4A
Authority: CN
Inventors: 梁成官; 金淇元; 赵俊来; 金明宣
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2021-02-01
Filing date: 2021-11-03
Publication date: 2023-11-24

Abstract

A speaker and/or an electronic device are provided. The electronic device includes: a vibrating diaphragm; a yoke disposed to face the diaphragm and having an avoidance groove formed on a surface facing the diaphragm; a coil mounted on one surface of the diaphragm and disposed between the diaphragm and the yoke; and a first magnet or a second magnet mounted to the yoke, the first magnet being disposed to be surrounded by at least a portion of the coil, the second magnet being disposed to surround at least a portion of the coil, wherein a surface of the coil facing the yoke is disposed to correspond to the avoidance groove and the coil is configured to linearly reciprocate the diaphragm according to an electric signal applied thereto.

Description

Speaker having improved BL characteristics and electronic device including the same

Technical Field

The present disclosure relates to an electronic device. More particularly, the present disclosure relates to an electronic device including a speaker.

Background

With the development of electronic, information and communication technologies, various functions are integrated in one electronic device. For example, a smart phone includes functions of an audio player, an imaging device, or an electronic notebook, as well as communication functions, and more various functions can be implemented in the smart phone by installing additional applications. Regardless of age or gender, the use of portable electronic devices, such as smartphones, is becoming widespread, and the level of integration of electronic devices has increased to meet various user demands.

As electronic devices are widely used in daily life, users' demands for convenience and portability may further increase. For example, when the mechanical keyboard is replaced with the touch screen function of the display, convenience of use can be improved. For example, since the space occupied by the mechanical keyboard is replaced with the display, a larger screen may be provided in the same size electronic device, or the electronic device may be miniaturized since the mechanical keyboard is not required to be installed. On the other hand, as the screen provided by the display becomes larger, the convenience of use can be increased. However, as the size of the display increases, portability may deteriorate. The electronic device may improve or maintain portability while providing a larger screen through a flexible display installed in the electronic device. For example, a flexible display or an electronic device including the flexible display may be carried in a folded or rolled state. The viewing area of the display may be expanded or expanded when desired.

The above information is presented merely as background information to aid in the understanding of the present disclosure. No determination is made as to whether any of the above is applicable as prior art with respect to the present disclosure, nor is any assertion made.

Disclosure of Invention

Technical problem

To improve portability, it may be considered to reduce the thickness and/or weight of the electronic device. In designing an electronic device, for example, the length or width of the electronic device is substantially determined by the viewing area of the display, which may limit miniaturization, and the degree of freedom in design of the thickness and/or weight of the electronic device may be higher than that of the length or width of the electronic device. However, miniaturization or thinning of electronic devices may limit sound quality or volume in view of that an acoustic component such as a speaker may provide good sound quality or rich volume while securing a sufficient resonance space.

Aspects of the present disclosure address at least the problems and/or disadvantages described above and provide at least the advantages described below. Accordingly, it is an aspect of the present disclosure to provide a speaker and/or an electronic device including the speaker, which can provide good sound quality and/or rich sound volume while being miniaturized or thinned.

Additional aspects will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the embodiments provided.

Technical proposal

According to an aspect of the present disclosure, a speaker and/or an electronic device are provided. The speaker and/or the electronic device comprises: a vibrating diaphragm; a yoke disposed to face the diaphragm and including an avoidance groove formed on a surface of the yoke facing the diaphragm; a coil mounted to one surface of the diaphragm and disposed between the diaphragm and the yoke; and a first magnet mounted to the yoke and arranged to be surrounded by at least a portion of the coil, or a second magnet arranged to surround at least a portion of the coil. The coil may be disposed such that a surface of the coil facing the yoke corresponds to the avoidance groove, and is configured to linearly reciprocate the diaphragm by receiving an electric signal.

According to another aspect of the present disclosure, a speaker and/or an electronic device is provided. The speaker and/or the electronic device comprises: a diaphragm including a height adjusting member protruding on one surface of the diaphragm and a bending groove recessed from the other surface of the diaphragm at a position corresponding to the height adjusting member; a yoke disposed to face the diaphragm and including an avoidance groove formed on a surface of the yoke facing the diaphragm; a coil mounted to the height adjuster on the one surface of the diaphragm and disposed between the diaphragm and the yoke; and a first magnet mounted to the yoke and arranged to be surrounded by at least a portion of the coil, or a second magnet arranged to surround at least a portion of the coil. The coil may have a smaller width than the avoidance groove on a surface of the coil facing the yoke, may be disposed such that the surface of the coil facing the yoke corresponds to the avoidance groove, and may be configured to linearly reciprocate the diaphragm by receiving an electric signal.

According to another aspect of the present disclosure, a speaker and/or an electronic device is provided. The speaker and/or the electronic device comprises: a housing including a first surface, a second surface facing in a direction opposite to that of the first surface, and a side surface at least partially surrounding a space between the first surface and the second surface; and at least one speaker disposed inside the housing and between the first surface and the second surface. The speaker may include: a vibrating diaphragm; a yoke disposed to face the diaphragm and including an avoidance groove formed on a surface of the yoke facing the diaphragm; a coil mounted to one surface of the diaphragm and disposed between the diaphragm and the yoke; and a first magnet mounted to the yoke and arranged to be surrounded by at least a portion of the coil, or a second magnet arranged to surround at least a portion of the coil. The coil may have a smaller width than the avoidance groove on a surface of the coil facing the yoke, may be disposed such that the surface of the coil facing the yoke corresponds to the avoidance groove, and may be configured to linearly reciprocate the diaphragm by receiving an electric signal.

Advantageous effects

According to various embodiments of the present disclosure, a speaker and/or an electronic device including the speaker may maximize a BL factor (or BL (x) or force factor) (e.g., a factor related to a magnetic flux density and a length of a coil disposed in a magnetic field), and contribute to increasing a volume by forming an avoidance slot and thus increasing a length of the coil or by disposing the coil in an appropriate position with respect to a magnet using a height adjuster. Further, an increase in the length of the coil or arrangement of the coil at an appropriate position can improve the asymmetry of the BL factor and suppress the uniform distortion of the speaker caused by the asymmetry of the BL factor. For example, even if the speaker and/or the electronic device become smaller or thinner, it can provide good sound quality and rich sound volume. Thus, the speaker and/or the electronic device including the speaker can be easily miniaturized while providing good sound quality and/or rich sound volume. Other various effects may be provided, either directly or indirectly, as understood from the present disclosure.

Other aspects, advantages, and salient features of the present disclosure will become apparent to those skilled in the art from the following detailed description, which, taken in conjunction with the annexed drawings, discloses various embodiments of the present disclosure.

Drawings

The above aspects and other aspects, features, and advantages of certain embodiments of the present disclosure will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

FIG. 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure;

fig. 2 is a perspective view illustrating an electronic device according to an embodiment of the present disclosure;

fig. 3 is a perspective view illustrating the electronic device of fig. 2 as seen from a rear surface thereof according to an embodiment of the present disclosure;

fig. 4 is an exploded perspective view illustrating an electronic device according to an embodiment of the present disclosure;

fig. 5 is a sectional view showing the configuration of a speaker in an electronic device according to an embodiment of the present disclosure;

FIG. 6 is an enlarged view illustrating portion "A" in FIG. 5 according to an embodiment of the present disclosure;

fig. 7 is a plan view illustrating magnets and/or coils in a speaker of an electronic device according to an embodiment of the present disclosure;

fig. 8 is a graph showing a relationship of BL factor to coil displacement measured in a general speaker according to an embodiment of the present disclosure;

fig. 9 is a graph showing a relationship of BL factor to coil displacement measured in a speaker of an electronic device according to an embodiment of the present disclosure;

Fig. 10 is a cross-sectional view showing the configuration of a speaker in an electronic device according to an embodiment of the present disclosure;

fig. 11 is a sectional view showing the configuration of a speaker in an electronic device according to an embodiment of the present disclosure;

fig. 12 is a cross-sectional view showing the configuration of a speaker in an electronic device according to an embodiment of the present disclosure;

fig. 13 is a cross-sectional view illustrating a yoke separated from the speaker shown in fig. 12 according to an embodiment of the present disclosure;

fig. 14 is a sectional view showing the configuration of a speaker in an electronic device according to an embodiment of the present disclosure; and

fig. 15 is a cross-sectional view showing the configuration of a speaker in an electronic device according to an embodiment of the present disclosure.

Like reference numerals are used to denote like elements throughout the figures.

Detailed Description

The following description with reference to the accompanying drawings is provided to assist in a comprehensive understanding of various embodiments of the disclosure defined by the claims and their equivalents. It includes various specific details to aid understanding, but these should be considered exemplary only. Accordingly, one of ordinary skill in the art will recognize that various changes and modifications of the various embodiments described herein can be made without departing from the scope and spirit of the present disclosure. In addition, descriptions of well-known functions and constructions may be omitted for clarity and conciseness.

The terms and words used in the following description and claims are not limited to written meanings, but are used only by the inventors to enable a clear and consistent understanding of the disclosure. Accordingly, it should be readily understood by those skilled in the art that the following descriptions of the various embodiments of the present disclosure are provided for illustration only and not for the purpose of limiting the disclosure as defined by the appended claims and their equivalents.

It is to be understood that the singular forms include the plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component surface" includes reference to one or more such surfaces.

Fig. 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment of the present disclosure. Referring to fig. 1, an electronic device 101 in a network environment 100 may communicate with the electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with at least one of the electronic device 104 or the server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an example embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to embodiments of the present disclosure, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a Subscriber Identity Module (SIM) 196, or an antenna module 197. In some embodiments of the present disclosure, at least one of the above-described components (e.g., connection end 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments of the present disclosure, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single component (e.g., display module 160).

The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 that is connected to the processor 120, and may perform various data processing or calculations. According to one embodiment of the present disclosure, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) into volatile memory 132, process commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134 as at least part of data processing or computation. According to embodiments of the present disclosure, the processor 120 may include a main processor 121 (e.g., a Central Processing Unit (CPU) or an Application Processor (AP)) or an auxiliary processor 123 (e.g., a Graphics Processing Unit (GPU), a Neural Processing Unit (NPU), an Image Signal Processor (ISP), a sensor hub processor, or a Communication Processor (CP)) that is operatively independent of or combined with the main processor 121. For example, when the electronic device 101 comprises a main processor 121 and a secondary processor 123, the secondary processor 123 may be adapted to consume less power than the main processor 121 or to be dedicated to a particular function. The auxiliary processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

The auxiliary processor 123 (instead of the main processor 121) may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) when the main processor 121 is in an inactive (e.g., sleep) state, or the auxiliary processor 123 may control at least some of the functions or states related to at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) with the main processor 121 when the main processor 121 is in an active state (e.g., running an application). According to embodiments of the present disclosure, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to embodiments of the present disclosure, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware structures dedicated to artificial intelligence model processing. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, by the electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include a plurality of artificial neural network layers. The artificial neural network may include a Deep Neural Network (DNN), a Convolutional Neural Network (CNN), a Recurrent Neural Network (RNN), a boltzmann machine limited (RBM), a Deep Belief Network (DBN), a bi-directional recurrent deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. The artificial intelligence model may additionally or alternatively include software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., program 140) and input data or output data for commands associated therewith. Memory 130 may include volatile memory 132 or nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an Operating System (OS) 142, middleware 144, or applications 146.

The input module 150 may receive commands or data from outside the electronic device 101 (e.g., a user) to be used by other components of the electronic device 101 (e.g., the processor 120). The input module 150 may include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons) or a digital pen (e.g., a stylus).

The sound output module 155 may output a sound signal to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. Speakers may be used for general purposes such as playing multimedia or playing a record. The receiver may be used to receive an incoming call. According to embodiments of the present disclosure, the receiver may be implemented separate from the speaker or as part of the speaker.

Display module 160 may visually provide information to the outside (e.g., user) of electronic device 101. The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to embodiments of the present disclosure, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

The audio module 170 may convert sound into electrical signals and vice versa. According to embodiments of the present disclosure, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or headphones of an external electronic device (e.g., the electronic device 102) that is directly (e.g., wired) or wirelessly connected to the electronic device 101.

The sensor module 176 may detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101 and then generate an electrical signal or data value corresponding to the detected state. According to embodiments of the present disclosure, the sensor module 176 may include, for example, a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an Infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

Interface 177 may support one or more specific protocols that will be used to connect electronic device 101 with an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly. According to embodiments of the present disclosure, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital (SD) card interface, or an audio interface.

The connection end 178 may include a connector via which the electronic device 101 may be physically connected with an external electronic device (e.g., the electronic device 102). According to embodiments of the present disclosure, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

The haptic module 179 may convert the electrical signal into a mechanical stimulus (e.g., vibration or motion) or an electrical stimulus that may be recognized by the user via his sense of touch or kinesthetic sense. According to embodiments of the present disclosure, haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrostimulator.

The camera module 180 may capture still images or moving images. According to embodiments of the present disclosure, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flash lamps.

The power management module 188 may manage power supply to the electronic device 101. According to embodiments of the present disclosure, the power management module 188 may be implemented as at least part of, for example, a Power Management Integrated Circuit (PMIC).

Battery 189 may power at least one component of electronic device 101. According to embodiments of the present disclosure, battery 189 may include, for example, a primary non-rechargeable battery, a rechargeable battery, or a fuel cell.

The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently of the processor 120 (e.g., an Application Processor (AP)) and supporting direct (e.g., wired) or wireless communication. According to embodiments of the present disclosure, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a Global Navigation Satellite System (GNSS) communication module) or a wired communication module 194 (e.g., a Local Area Network (LAN) communication module or a Power Line Communication (PLC) module). A respective one of these communication modules may communicate with external electronic devices via a first network 198 (e.g., a short-range communication network such as bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a conventional cellular network, a 5 th generation (5G) network, a next generation communication network, the internet, or a computer network (e.g., a LAN or Wide Area Network (WAN)). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components (e.g., multiple chips) separate from each other. The wireless communication module 192 may identify or authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

The wireless communication module 192 may support a 5G network following a 4 th generation (4G) network as well as next generation communication technologies (e.g., new Radio (NR) access technologies). NR access technologies may support enhanced mobile broadband (eMBB), large-scale machine type communication (mctc), or Ultra Reliable Low Latency Communication (URLLC). The wireless communication module 192 may support a high frequency band (e.g., millimeter wave band) to achieve, for example, a high data transmission rate. The wireless communication module 192 may support various techniques for ensuring performance over high frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199). According to embodiments of the present disclosure, the wireless communication module 192 may support a peak data rate (e.g., 20Gbps or greater) for implementing an embbc, a lost coverage (e.g., 164dB or less) for implementing an emtc, or a U-plane delay (e.g., 0.5ms or less, or 1ms or less round trip for each of the Downlink (DL) and Uplink (UL)) for implementing a URLLC.

The antenna module 197 may transmit signals or power to the outside of the electronic device 101 (e.g., an external electronic device) or receive signals or power from the outside of the electronic device 101 (e.g., an external electronic device). According to embodiments of the present disclosure, the antenna module 197 may include an antenna including a radiating element including a conductive material or conductive pattern formed in or on a substrate, such as a Printed Circuit Board (PCB). According to embodiments of the present disclosure, the antenna module 197 may include a plurality of antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190. Signals or power may be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to embodiments of the present disclosure, further components (e.g., a Radio Frequency Integrated Circuit (RFIC)) other than radiating elements may additionally be formed as part of the antenna module 197.

Antenna module 197 may form a millimeter-wave antenna module in accordance with various embodiments of the present disclosure. According to embodiments of the present disclosure, a millimeter wave antenna module may include a printed circuit board, an RFIC disposed on a first surface (e.g., a bottom surface) of the printed circuit board or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., a millimeter wave band), and a plurality of antennas (e.g., array antennas) disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

At least some of the above components may be interconnected and signals (e.g., commands or data) communicated between them via an inter-peripheral communication scheme (e.g., bus, general Purpose Input Output (GPIO), serial Peripheral Interface (SPI), or Mobile Industrial Processor Interface (MIPI)).

According to embodiments of the present disclosure, commands or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be the same type of device as the electronic device 101 or a different type of device from the electronic device 101. According to embodiments of the present disclosure, all or some of the operations to be performed at the electronic device 101 may be performed at one or more of the external electronic device 102, the external electronic device 104, or the external electronic device 108. For example, if the electronic device 101 should automatically perform a function or service or should perform a function or service in response to a request from a user or another device, the electronic device 101 may request one or more external electronic devices to perform at least part of the function or service instead of or in addition to the function or service, or the electronic device 101 may request one or more external electronic devices to perform at least part of the function or service. The one or more external electronic devices that received the request may perform the requested at least part of the function or service or perform another function or another service related to the request and transmit the result of the performing to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request with or without further processing of the result. For this purpose, for example, cloud computing technology, distributed computing technology, mobile Edge Computing (MEC) technology, or client-server computing technology may be used. The electronic device 101 may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In embodiments of the present disclosure, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to embodiments of the present disclosure, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to smart services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology or IoT-related technology.

The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to the embodiments of the present disclosure, the electronic device is not limited to those described above.

It should be understood that the various embodiments of the disclosure and the terminology used therein are not intended to limit the technical features set forth herein to the particular embodiments, but rather include various modifications, equivalents or alternatives to the respective embodiments. For the description of the drawings, like reference numerals may be used for like or related elements. As used herein, terms such as "a or B", "at least one of a and B", "at least one of a or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B or C" may include any or all of the possible combinations of terms listed together in a respective one of the plurality of phrases. As used herein, terms such as "1 st" and "2 nd" or "first" or "second" may be used to simply distinguish a corresponding component from another component and not to otherwise limit the components (e.g., importance or order). It will be understood that if the term "operatively" or "communicatively" is used or the term "operatively" or "communicatively" is not used, an element (e.g., a first element) is referred to as being "associated with," "coupled to," "connected to," or "connected to" another element (e.g., a second element), it is intended that the one element can be directly (e.g., wired) associated with, wirelessly associated with, or coupled to the other element via a third element.

As used herein, the term "module" may include units implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion" or "circuitry"). A module may be a single integrated component adapted to perform one or more functions or a minimal unit or portion of the single integrated component. For example, according to embodiments of the present disclosure, a module may be implemented in the form of an Application Specific Integrated Circuit (ASIC).

The various embodiments set forth herein may be implemented as software (e.g., a program) comprising one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., an electronic device). For example, a processor (e.g., a processor) of the machine (e.g., an electronic device) may invoke and execute at least one of the one or more instructions stored in the storage medium under control of the processor, with or without one or more other components. This enables the machine to operate to perform at least one function in accordance with the at least one instruction invoked. The one or more instructions may include code generated by a compiler or code capable of being executed by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" may only mean that the storage medium is a tangible device and does not include a signal (e.g., electromagnetic waves), but the term does not distinguish between data being semi-permanently stored in the storage medium and data being temporarily stored in the storage medium.

According to embodiments of the present disclosure, methods according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be used as a product for conducting transactions between sellers and buyers. The computer program product may be distributed in the form of a machine-readable storage medium, such as a compact disk read only memory (CD-ROM), or may be distributed via an application store (e.g., playStore ^TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or may be published (e.g., downloaded or uploaded) directly between two user devices (e.g., smartphones). At least a portion of the computer program product may be temporarily generated if published online, or at least a portion of the computer program product may be at least temporarily stored in a machine-readable storage medium, such as a memory of a manufacturer's server, an application store's server, or a relay server.

Each of the above-described components (e.g., modules or programs) may include a single entity or multiple entities according to various embodiments of the present disclosure. One or more of the above components may be omitted, or one or more other components may be added, according to various embodiments of the present disclosure. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In such cases, the integrated component may perform the one or more functions of each of the plurality of components in the same or similar manner as the corresponding one of the plurality of components performed the one or more functions prior to integration, in accordance with various embodiments of the present disclosure. Operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or in a heuristic manner, or one or more of the operations may be performed in a different order or omitted, or one or more other operations may be added, in accordance with various embodiments of the present disclosure.

Fig. 2 is a perspective view illustrating an electronic device 200 according to an embodiment of the present disclosure. Fig. 3 is a perspective view illustrating the electronic device 200 of fig. 2 as seen from a rear surface thereof according to an embodiment of the present disclosure.

Referring to fig. 2 and 3, the electronic device 200 according to an embodiment may include a housing 210, the housing 210 including a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface (or sidewall) 210C surrounding a space between the first surface 210A and the second surface 210B. In another embodiment (not shown), the housing 210 may refer to a structure that partially forms the first surface 210A, the second surface 210B, and the side surface 210C shown in fig. 2.

According to embodiments of the present disclosure, the first surface 210A may be formed from an at least partially substantially transparent front plate 202 (e.g., a glass plate or a polymer plate including various coatings). According to some embodiments of the present disclosure, the front plate 202 may include a curved surface portion at least at a side edge portion thereof, the curved surface portion being curved and extending seamlessly from the first surface 210A toward the rear plate 211.

According to various embodiments of the present disclosure, the second surface 210B may be formed from a substantially opaque back plate 211. The rear plate 211 may be formed using, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of these materials. According to some embodiments of the present disclosure, the rear plate 211 may include a curved surface portion at least at a side edge portion thereof, the curved surface portion being curved and extending seamlessly from the second surface 210B toward the front plate 202.

According to various embodiments of the present disclosure, the side surface 210C may be bonded to the front and rear plates 202 and 211 and formed of a side structure (or side member or sidewall) 218 comprising metal and/or polymer. In some embodiments of the present disclosure, the rear plate 211 and the side structures 218 may be integrally formed and include the same material (e.g., a metallic material such as aluminum).

According to embodiments of the present disclosure, the electronic device 200 may include at least one of a display 201, audio modules 203 and 214, a sensor module, an open area 205 (e.g., optical aperture 305 in fig. 4), a key input device 217, or a connector aperture 208. In embodiments of the present disclosure, the electronic device 200 may include a built-in optical module (e.g., a camera module, a light source, a proximity sensor, or an illuminance sensor) disposed corresponding to the opening area 205. The opening region 205 may be located at a top end portion of the electronic device 200 and formed at a center of a front surface (e.g., the first surface 210A) in a width direction (e.g., an X direction in fig. 4) or a length direction (e.g., a Y direction in fig. 4). According to embodiments of the present disclosure, the open area 205 may be in the form of an aperture at least partially surrounded by an active area or viewing area VA of the display 201. In another embodiment of the present disclosure, the opening region 205 may be formed in a recess region formed in the active region VA. For example, the opening region 205 may be defined as a portion of a notch region, or may be formed as a hole surrounded by a notch region. In another embodiment of the present disclosure, the optical module may be disposed under the display 201 and receive light transmitted through a portion of the active area VA of the display 201 or emit light to the outside of the electronic device 200. In this case, the opening region 205 (e.g., the optical aperture 305 in fig. 4) may be omitted, or the opening region 205 may be substantially a portion of the active area VA of the display 201. In some embodiments of the present disclosure, at least one of the components (e.g., key input device 217) may be omitted from electronic apparatus 200, or other components may be added in electronic apparatus 200. For example, the electronic device 200 may include a sensor module (not shown). For example, a sensor such as a proximity sensor or an illuminance sensor may be included in the display 201 or disposed adjacent to the display 201 in an area provided by the front plate 202. In some embodiments of the present disclosure, the electronic device 200 may further include a light emitting device, and the light emitting device may be disposed adjacent to the display 201 in an area provided by the front plate 202. For example, the light emitting device may provide status information about the electronic device 200 through light. In another embodiment of the present disclosure, the light emitting device may, for example, provide a light source that operates according to the operation of an optical module (e.g., a camera module) disposed in the opening region 205. The light emitting device may include, for example, a Light Emitting Diode (LED), an IR LED, and a xenon lamp.

The display 201 may be visually exposed, for example, through a substantial portion of the front panel 202. In some embodiments of the present disclosure, corners of the display 201 may be integrally formed in the same shape as that of adjacent peripheral portions of the front plate 202. In another embodiment (not shown), the gap between the periphery of the display 201 and the periphery of the front plate 202 may be equal as a whole to increase the exposed area of the display 201. For example, when viewed from above the front panel 202, the display area VA of the display 201 and the peripheral area PA (e.g., black matrix area) formed around the display area VA may substantially form the front surface (e.g., the first surface 210A) of the electronic device 200, and the viewing area VA may occupy 90% or more, substantially 100%, of the area of the first surface 210A. In another embodiment of the present disclosure (not shown), a recess or opening (e.g., opening region 205) may be formed in a portion of the display region VA, and other electronic components (e.g., a camera module, a proximity sensor, or an illuminance sensor (not shown)) may be aligned with the recess or opening (e.g., opening region 205). In another embodiment of the present disclosure, other electronic components aligned with the recess or opening may include at least one of an IR projector, an iris sensor, a gesture sensor, an IR sensor, a temperature sensor, a humidity sensor, or an atmospheric pressure sensor.

In another embodiment (not shown) of the present disclosure, the electronic device 200 may include at least one of the camera modules 212 and 213, the fingerprint sensor 216, or the flash 206 disposed to face in a direction opposite to the viewing area VA of the display 201. In another embodiment (not shown), the display 201 may be provided adjacent to or in combination with a touch sensing circuit, a pressure sensor that measures the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field based stylus.

The audio modules 203 and 214 may include microphone holes and speaker holes. A microphone for obtaining external sound may be provided in the microphone aperture, and in some embodiments of the present disclosure, a plurality of microphones may be provided to detect the direction of sound. In some embodiments of the present disclosure, the speaker aperture and microphone aperture may be implemented as a single aperture (e.g., an aperture in an audio module represented by reference numeral 203), or may include a speaker without a speaker aperture (e.g., a piezoelectric speaker). The speaker holes may include external speaker holes and receiver holes for calls (e.g., holes in an audio module represented by reference numeral "214").

Since the electronic device 200 includes a sensor module (not shown), the sensor module may generate an electrical signal or a data value corresponding to an internal operation state or an external environment state of the electronic device 200. The sensor module may also include, for example, a proximity sensor disposed on the first surface 210A of the housing 210, a fingerprint sensor incorporated in the display 201 or disposed adjacent to the display 201, and/or a biometric sensor (e.g., a Heart Rate Monitor (HRM) sensor) disposed on the second surface 210B of the housing 210. The electronic device 200 may further include a sensor module (not shown), for example, at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

The camera modules 212 and 213 may include a first camera module disposed on the first surface 210A of the electronic device 200 (e.g., a camera module disposed corresponding to the open area 205), and a second camera module 212 and 213 and/or a flash 206 disposed on the second surface 210B of the electronic device 200. The camera modules 212 and 213 may include one or more lenses, image sensors, and/or image signal processors. Flash 206 may comprise, for example, an LED or a xenon lamp. In some embodiments of the present disclosure, three or more lenses (IR camera, wide angle lens, and telephoto lens) and an image sensor may be disposed on one surface of the electronic device 200.

The key input device 217 may be disposed on the side surface 210C of the housing 210. In another embodiment of the present disclosure, the electronic device 200 may not include some or any of the key input devices 217 described above, and the key input devices 217 that are not included may be implemented in other forms (such as soft keys) on the display 220. In some embodiments of the present disclosure, the key input device may include at least a portion of a fingerprint sensor 216 disposed on the second surface 210B of the housing 210.

The connector aperture 208 may house a connector for transmitting and receiving power and/or data to and from an external electronic device, and a connector for transmitting and receiving audio signals to and from an external electronic device. For example, the connector aperture 208 may include a USB connector or a headphone jack.

Fig. 4 is an exploded perspective view illustrating an electronic device according to an embodiment of the present disclosure.

Referring to fig. 4, the electronic device 300 may include a side structure 310 (e.g., the side structure 218 of fig. 2), a middle plate (e.g., the support member 311 (e.g., the bracket)), a front plate 320 (e.g., the front plate 202 of fig. 2), a display 330 (e.g., the display 201 of fig. 2), a printed circuit board 340, a battery 350, and a rear plate 380 (e.g., the rear plate 211 of fig. 3). According to one embodiment of the present disclosure, the display 330 may be disposed between the front plate 320 and the rear plate 380, and the printed circuit board 340 may be disposed behind the display 330 (e.g., between the display 330 and the rear plate 380) in the thickness direction Z of the electronic device 300. In embodiments of the present disclosure, the support member 311 may be disposed between the display 330 and the printed circuit board 340 to provide an electromagnetic isolation structure between the display 330 and the printed circuit board 340. In some embodiments of the present disclosure, the electronic device 300 may omit at least one of the components (e.g., the support member 311) or may also include other components. At least one of the components of the electronic device 300 may be the same or similar to at least one of the components of the electronic device 200 in fig. 2 or 3, and redundant descriptions will be avoided herein.

In an embodiment of the present disclosure, an opening area or optical hole 305 (e.g., opening area 205 in fig. 2) formed on the display 330 may be located at a top end portion of the electronic device 300 when seen from above the front plate 320, and may be formed at a center of the electronic device 300 in the width direction X, for example. In various embodiments of the present disclosure, the term "open area" may refer to an area formed by an aperture formed through display 330 (e.g., display 201 in fig. 2) in viewing area VA. In some embodiments of the present disclosure, the term "open area" may refer to a transparent area without any pixels surrounded by the viewing area VA. For example, the open area or optical aperture 305 may provide a path for light to enter from the exterior of the front plate 320 inward. In another embodiment of the present disclosure, the open area or optical aperture 305 may provide a path for light to be emitted from the interior of the front plate 320 to the exterior. In another embodiment of the present disclosure, an "open area (e.g., open area 205 in fig. 2 or optical aperture 305 in fig. 4)" may have a structure that transmits light but separates an inner space and an outer space of the electronic device 200 or 300. In another embodiment of the present disclosure, the "open area" may be in the form of a physical or mechanical hole that connects the internal space and the external space of the electronic device 200 or 300 and transmits light. For example, when the electronic device 200 or 300 includes a temperature sensor or a humidity sensor, information about the surrounding environment of the electronic device 200 or 300 may be detected through the opening area 205 or the optical hole 305. According to some embodiments of the present disclosure, the open area 205 or the optical aperture 305 may not be visually exposed, and a camera module (not shown) may be disposed below the viewing area and thus hidden. For example, the electronic device 200 or 300 may include an under-display camera (UDC) that captures objects through the display 330 while hidden by the display 330. In a structure including the UDC, the arrangement density of pixels in a region corresponding to the UDC may be smaller than that in other regions.

The support member 311 may be disposed inside the electronic device 300 and coupled to the side structure 310, or may be integrally formed with the side structure 310. The support member 311 may be formed using, for example, a metallic material and/or a non-metallic (e.g., polymeric) material. The support member 311 may be coupled with the display 330 on one surface thereof and the printed circuit board 340 on the other surface thereof. The processor, memory, and/or interface (e.g., processor 120, memory 130, and/or interface 177 in fig. 1) may be mounted on a printed circuit board 340. The processor may include, for example, at least one of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a High Definition Multimedia Interface (HDMI), a USB interface, a Secure Digital (SD) card interface, and/or an audio interface. The interface may, for example, electrically or physically couple the electronic device 300 to an external electronic device, and may include a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector.

The battery 350 is a device for powering at least one component of the electronic device 300 and may include, for example, a primary non-rechargeable battery, a rechargeable battery, or a fuel cell. At least a portion of the battery 350 may be disposed on the same plane as, for example, the printed circuit board 340. The battery 350 may be integrally provided inside the electronic device 300, or may be detachably provided from the electronic device 300.

According to embodiments of the present disclosure, the electronic device 300 may include a speaker 321a coupled to a receiver (e.g., a hole in an audio module represented by reference numeral 214 in fig. 2), and an electronic component 321b disposed corresponding to the open area or optical hole 305 (e.g., the open area 205 in fig. 2). For example, the speaker 321a may be provided inside the electronic device 300 (e.g., the housing 210 in fig. 2), and output sound (e.g., voice of a received call or sound) to the outside of the electronic device 300 through the receiver.

According to embodiments of the present disclosure, the electronic component 321b housed in the housing 210 may emit an optical signal (e.g., IR light) through the open area or the optical aperture 305, or may receive or obtain an external optical signal. For example, the electronic component 321b disposed corresponding to the open area or the optical aperture 305 may include at least one of an IR projector, a gesture sensor, a proximity sensor, an illuminance sensor, a camera, an IR sensor, or a face or iris sensor. In some embodiments of the present disclosure, the electronic component 321b disposed corresponding to the open area or the optical aperture 305 may include at least one of a temperature sensor, a humidity sensor, or an atmospheric pressure sensor. When the electronic component 321b includes at least one of a temperature sensor, a humidity sensor, or an atmospheric pressure sensor, the opening area or the optical hole 305 may have a through-hole structure, and the electronic component 321b may detect an environment (e.g., temperature, humidity, or air pressure) outside the electronic device 300 using air as a medium.

The electronic device 300 may further include a plurality of through holes 311a and 311b formed on the support member 311. Among the through holes, the first through hole 311a may be formed corresponding to the speaker 321 a. For example, the speaker 321a may be disposed closer to the rear of the electronic device 300 than the support member 311 (e.g., between the support member 311 and the rear plate 380), and radiate sound forward from the support member 311 through the first through hole 311 a. Among the through holes, the second through hole 311b may be formed corresponding to the electronic component 321 b. For example, the electronic component 321b may be located between a sound hole (e.g., a hole formed by the side structure 310 and the front plate 320 in fig. 4, which is a speaker hole corresponding to the audio module 214 in fig. 2) and the speaker 321a (e.g., disposed between the support member 311 and the rear plate 380) and disposed closer to the rear of the electronic device 300 than the support member 311, and may radiate an optical signal forward from the support member 311 through the second through hole 311b, or receive or obtain various information about the external environment from the front of the support member 311.

The following description will present various embodiments of the present disclosure, it being understood that the same or no reference numerals are given to the components that are readily understood above with respect to the electronic devices 200 and 300 depicted in the drawings, and detailed descriptions of the components may be avoided. In the following description of embodiments of the present disclosure, reference may be made to the drawings or components of the foregoing embodiments of the present disclosure for conciseness of the drawings or detailed description.

Fig. 5 is a cross-sectional view illustrating a configuration of a speaker 400 (e.g., the sound output module 155 in fig. 1 or the speaker 321a in fig. 4) of an electronic device (e.g., the electronic devices 101, 102, 104, 200, and 300 in fig. 1 to 4) according to an embodiment of the present disclosure. Fig. 6 is an enlarged view illustrating a portion "a" in fig. 5 according to an embodiment of the present disclosure. Fig. 7 is a plan view illustrating an arrangement of magnets 404a and 404b and/or coils 403 in a speaker 400 of an electronic device 300 according to an embodiment of the present disclosure.

Referring to fig. 5 to 7, a speaker 400 (e.g., speaker 321a in fig. 4) may include a diaphragm 401, a yoke (e.g., first yoke 402 a), a coil 403, and/or at least one magnet 404a and 404b, and the coil 403 may be disposed on one surface of the diaphragm 401 and correspond to an avoidance groove (avoidance groove) 421 formed on the first yoke 402 a. The coil 403 may be disposed in a magnetic field provided by the magnets 404a and 404b, and may generate an electric field by receiving an electric signal. For example, interaction between the magnetic field and the electric field may move the coil 403 relative to the magnets 404a and 404b, whereby the coil 403 may linearly reciprocate the diaphragm 401 over the first yoke 402a and/or the magnets 404a and 404 b.

According to various embodiments of the present disclosure, the speaker 400 may further include a frame 405 or a suspension 406 coupling the diaphragm 401 to the yoke 402a and/or the magnets 404a and 404b, and the diaphragm 401 may linearly reciprocate by electromagnetic force from the magnets 404a and 404b and the coil 403 and elasticity force from the suspension 406. In another embodiment of the present disclosure, the suspension 406 may be directly coupled to the diaphragm 401, while the frame 405 may not be directly coupled to the magnets 404a and 404b or the first yoke 402a. For example, the speaker 400 may further include additional structures (not shown) that couple the frame 405 to the magnets 404a and 404b or the first yoke 402a.

According to various embodiments of the present disclosure, since the suspension 406 has an elastic force, the suspension 406 may support the linear reciprocation of the diaphragm 401. In some embodiments of the present disclosure, the suspension 406 may accumulate or provide an elastic force that moves the diaphragm 401 to an initial assembled position as the diaphragm 401 reciprocates linearly. In an embodiment of the present disclosure, the suspension 406 may include a curved portion 461 protruding toward the first yoke 402a and/or the magnets 404a and 404 b. Suspension 406 may be formed by machining a flat plate made of a metallic material or a polymeric material. Since the suspension 406 includes the curved portion 461 protruding at a portion thereof, the suspension 406 can have a high elastic modulus. In embodiments of the present disclosure, the frame 405 may be coupled with an edge of the suspension 406 and mounted to any other structure, such as a yoke (e.g., the second yoke 402 b) and one of the magnets 404a and 404 b. For example, the frame 405 and/or the suspension 406 may support the diaphragm 401 such that the diaphragm 401 may reciprocate linearly toward the yoke (e.g., the first yoke 402 a).

According to various embodiments of the present disclosure, the diaphragm 401 and the first yoke 402a may be disposed to at least partially face each other, and the diaphragm 401 may linearly reciprocate toward or away from the first yoke 402a (e.g., linearly reciprocate in the Z-axis direction). The first yoke 402a may include an avoidance groove 421 formed on a surface thereof facing the diaphragm 401, and a thickness t2 of the first yoke 402a at a position where the avoidance groove 421 is formed may be smaller than thicknesses t1 and t3 of the first yoke 402a at positions where the avoidance groove 421 is not formed. In some embodiments of the present disclosure, the first yoke 402a may have different thicknesses t1 and t3 in part even at a position where the avoidance groove 421 is not formed. According to embodiments of the present disclosure, the magnets 404a and 404b may be disposed at one side of the first yoke 402a, thus being substantially located between the diaphragm 401 and the first yoke 402a, and the first yoke 402a may be aligned with the direction or distribution of the magnetic field generated by the magnets 404a and 404 b. In some embodiments of the present disclosure, the speaker 400 may further include a second yoke 402b disposed between the diaphragm 401 and the magnets 404a and 404 b. The second yoke 402b may be disposed substantially on the surfaces of the magnets 404a and 404b, and may be aligned with the first yoke 402a in the direction or distribution of the magnetic field generated by the magnets 404a and 404 b.

According to various embodiments of the present disclosure, the coil 403 may be mounted on one surface of the diaphragm 401 to be substantially located between the diaphragm 401 and the first yoke 402 a. In some embodiments of the present disclosure, among the magnets, the first magnet 404a may be disposed to be surrounded by at least a portion of the coil 403. In another embodiment of the present disclosure, among the magnets, the second magnet 404b may be disposed to surround at least a portion of the coil 403. In the illustrated embodiment of the present disclosure, when seen from the Z-axis direction, as an example, one first magnet 404a is provided to be surrounded by the coil 403, and a plurality of (e.g., four) second magnets 404b are arranged around the coil 403. The shape, number, and/or arrangement of magnets 404a and 404b may vary depending on the specifications required for the actual manufactured speaker 400 and/or electronic device 300 including the same.

According to various embodiments of the present disclosure, a surface 431 of the coil 403 facing the first yoke 402a may be provided to correspond to the avoidance groove 421, and a first width d1 of the coil 403 (e.g., a width of the surface 431 facing the first yoke 402 a) measured in the X-axis direction (or the Y-axis direction) may be smaller than a second width d2 of the avoidance groove 421. For example, coil 403 may have a size and shape sufficient to be partially received in avoidance slot 421. Considering the range of linear reciprocation of the coil 403 and/or the diaphragm 401, a specified distance between the coil 403 and the first yoke 402a (e.g., the bottom surface of the avoidance groove 421) may be ensured. For example, when the speaker 400 outputs sound, a sufficient gap between the coil 403 and the first yoke 402a (e.g., the bottom of the avoidance groove 421) may be ensured so that the coil 403 is not in direct contact with the first yoke 402 a.

According to various embodiments of the present disclosure, as the speaker 400 becomes smaller or thinner, it may be difficult to secure a gap between the coil 403 and the first yoke 402 a. The speaker 400 according to various embodiments of the present disclosure may include an avoidance groove 421 formed on the first yoke 402a, thereby ensuring a gap between the coil 403 and the first yoke 402 a. In embodiments of the present disclosure, the amplitude of the coil 403 or the diaphragm 401 of the speaker 400 according to various embodiments of the present disclosure may be greater than a speaker of the same thickness without the avoidance grooves 421. In another embodiment of the present disclosure, for the coil 403 or the diaphragm 401 of the same amplitude, the thickness of the speaker 400 according to various embodiments of the present disclosure may reduce the depth of the avoidance groove 421 as compared to a speaker having the same gap between the first yoke 402a and the coil 403 without the avoidance groove 421. For example, by further securing the amplitude of the coil 403 or the diaphragm 401 using the avoidance groove 421, sound can be more easily tuned and/or the thickness of the speaker 400 can be reduced by the depth of the avoidance groove 421.

According to various embodiments of the present disclosure, the coil 403 may be shifted in the-Z axis direction by the depth of the avoidance groove 421 in the case where the gap between the first yoke 402a and the coil 403 is the same, as compared to a speaker without the avoidance groove 421. For example, the thickness of speaker 400 may reduce the-Z-axis displacement of coil 403. In some embodiments of the present disclosure, as the coil 403 moves further in the-Z axis direction while maintaining the position of the first yoke 402a and the magnets 404a and 404b, more of the coil 403 may be located in the magnetic field generated by the magnets 404a and 404 b. For example, the coil 403 may be stably operated (e.g., output sound) in alignment with the magnets 404a and 404b at a suitable location.

According to various embodiments of the present disclosure, since the magnets 404a and 404b are disposed on a yoke (e.g., the first yoke 402 a) and the coil 403 is disposed on the diaphragm 401, there may be a Z-axis directional deviation between the positions of the magnets 404a and 404b and the position of the coil 403. For example, in a simple assembled state (hereinafter, referred to as an initial position), the centers of the magnets 404a and 404b and the center of the coil 403 may be misaligned in the Z-axis direction. The BL factor or the vibration force generated by the electromagnetic force (e.g., the vibration force generated by the interaction between the magnets 404a and 404b and the coil 403) can be maximized at a position where the centers of the magnets 404a and 404b coincide with the center of the coil 403 in the Z-axis direction, and when the BL factor based on the +z-direction displacement and the BL factor based on the-Z-direction displacement are symmetrical with respect to the point where the BL factor is maximized, good sound quality can be easily achieved. In some embodiments of the present disclosure, the "BL factor (or force factor)" may be defined by an integral of the magnetic flux density and the length of a coil positioned in a magnetic field according to the vibration of the diaphragm 401. "+Z/-Z direction displacement" may refer to the distance that the coil 403 and/or diaphragm 401 move from an initial position along the Z axis direction. The asymmetry or nonlinearity of the BL factor or the vibration force may be proportional to the positional deviation between the magnets 404a and 404b and the coil 403 in the Z-axis direction, and since the speaker 400 and/or the electronic device 300 including the speaker 400 according to various embodiments of the present disclosure include the avoidance groove 421, the positional deviation between the magnets 404a and 404b and the coil 403 in the Z-axis direction may be reduced, and the asymmetry or nonlinearity of the BL factor or the vibration force may be improved. The asymmetry or nonlinearity of the positional deviation between the magnets 404a and 404b and the coil 403 in the Z-axis direction or the BL factor caused by the positional deviation will be further described with reference to fig. 8 and 9.

According to various embodiments of the present disclosure, the suspension 406 may be deformed due to vibration of the diaphragm 401 (e.g., linear reciprocation of the diaphragm 401). For example, the curved portion 461 may move away from or toward the yokes 402a and 402b or the magnets 404a and 404b according to the linear reciprocation of the diaphragm 401. Similar to ensuring a specified gap between the coil 403 and the yoke (e.g., the first yoke 402 a), another specified gap between the suspension 406 (e.g., the bent portion 461) and other structures (e.g., the second magnet 404b or the second yoke 402 b) may be ensured. The gap between the suspension 406 and other structures may substantially limit the gap between the first yoke 402a and the diaphragm 401, or serve as an obstacle to reducing positional deviation between the magnets 404a, 404b and the coil 403 in the Z-axis direction. According to various embodiments of the present disclosure, the speaker 400 (e.g., the diaphragm 401) may further include a height adjuster 411 to reduce positional deviation between the magnets 404a and 404b and the coil 403 in the Z-axis direction.

According to various embodiments of the present disclosure, the diaphragm 401 may have a shape of a partially bent flat plate. For example, the diaphragm 401 may include a height adjuster 411 protruding from one surface thereof. In an embodiment of the present disclosure, the height adjustment member 411 may have a closed curve shape extending along an edge of one surface of the diaphragm 401, and the coil 403 may be substantially mounted on the height adjustment member 411. In some embodiments of the present disclosure, when the diaphragm 401 is in the shape of a bent flat plate, the other surface of the diaphragm 401 may include a bending groove 413 formed at a position corresponding to the height adjuster 411. For example, the height adjuster 411 may protrude from one surface of the diaphragm 401 in the-Z direction corresponding to the depth to which the bending groove 413 is recessed on the other surface of the diaphragm 401. In some embodiments of the present disclosure, the height at which the height adjustment 411 protrudes may be substantially equal to, for example, the depth of the avoidance slot 421 (e.g., t1-t2 or t3-t 2).

According to the various embodiments of the present disclosure, since the coil 403 is disposed on the height adjusting piece 411, positional deviation in the Z-axis direction with respect to the magnets 404a and 404b can be improved. For example, the coil 403 may be aligned at a proper position with respect to the magnets 404a and 404b while ensuring a gap between the suspension 406 (e.g., the bent portion 461) and other structures (e.g., the second magnet 404b or the second yoke 402 b). "a suitable position at which the coil 403 is disposed" may mean a position at which the centers of the magnets 404a and 404b coincide with the center of the coil 403 in the Z-axis direction. In another embodiment of the present disclosure, considering the arrangement structure of the yokes 402a and 402b, the magnets 404a and 404b, the diaphragm 401 and/or the coil 403, and the amplitude of the diaphragm 401 and/or the coil 403, it may not be possible to practically arrange the centers of the magnets 404a and 404b and the center of the coil 403 at the same position in the Z-axis direction in the actually manufactured speaker 400. For example, the "setting a proper position of the coil 403" may refer to a position where a positional deviation in the Z-axis direction between the centers of the magnets 404a and 404b and the center of the coil 403 may be reduced by using the avoidance groove 421 and/or the height adjuster 411. In another embodiment of the present disclosure, "the centers of magnets 404a and 404b and the center of coil 403" may not refer to the centers of magnets 404a and 404b and the center of coil 403 in terms of shape, but rather to the center of the magnetic and/or electric field distribution.

According to various embodiments of the present disclosure, the speaker 400 may further include a filler 499 disposed in the bending groove 413. The filler 499 may include, for example, an adhesive and act as a reinforcement to maintain or improve the rigidity of the diaphragm 401. The filler 499 may be used to avoid rupture-up modes that may occur in the diaphragm 401 of the loudspeaker 400. According to embodiments of the present disclosure, suspension 406 may be coupled to at least a portion of an edge of diaphragm 401. For example, an inner edge of the suspension 406 (e.g., the portion denoted by reference numeral "469" in fig. 5) may be joined to another surface of the diaphragm 401 (e.g., the surface on which the bending groove 413 is formed), and according to some embodiments of the present disclosure, the inner edge of the suspension 406 is disposed to cover at least a portion of the bending groove 413. In another embodiment of the present disclosure, the suspension 406 may seal the bending groove 413 with the filler 499 disposed in the bending groove 413. In a structure in which the suspension 406 seals the bending groove 413, the filler 499 may be used as an adhesive for maintaining the engaged state between the suspension 406 and the diaphragm 401.

Fig. 8 is a graph illustrating a relationship of BL factor to coil displacement measured in a general speaker according to an embodiment of the present disclosure. Fig. 9 is a graph illustrating a relationship of BL factor measured in a speaker (e.g., speaker 321a or 400 in fig. 4 or 5) of an electronic device (e.g., electronic devices 101, 102, 104, 200, and 300 in fig. 1-4) versus coil (e.g., coil 403 in fig. 5) displacement according to an embodiment of the present disclosure.

Referring to fig. 8 and 9, "I" represents an initial position of the coil 403 in the Z-axis direction in a simple assembled state, and "N" represents a Z-axis direction position having the largest BL factor. For example, the BL factors may be symmetrically distributed or formed with respect to the position indicated by "N", and gradually decrease as the distance from the position indicated by "N" increases. In some embodiments of the present disclosure, the position represented by "N" may be substantially determined by the assembled position of magnets 404a and 404 b.

In the graphs of fig. 8 and 9, the horizontal axis indicates displacement of the coil 403 or the diaphragm 401 from the Z-axis direction of the initial position I of the coil 403, and an arrow in the direction pointing "inward" may indicate movement of the coil 403 or the diaphragm 401 in the-Z direction from the initial position in fig. 5, and an arrow in the direction pointing "outward" may indicate movement of the coil 403 or the diaphragm 401 in the +z direction. In the graphs of fig. 8 and 9, the vertical axis represents the BL factor of the speaker 400, and the BL factor may be defined as an integrated value of the magnetic flux density B of the magnetic field generated by the magnets 404a and 404B and the length l (see fig. 5) of the coil 403.

The speaker (e.g., the speaker 400 in fig. 5) having the BL factor characteristic of fig. 8 and 9 may have a thickness of about 2mm to 4mm, and a specified gap (e.g., hundreds of μm) between the coil and the yoke (e.g., the coil 403 and the first yoke 402a in fig. 5) may be ensured based on the maximum amplitude of the diaphragm 401. The general speaker having the BL factor characteristic of fig. 8 may not include the aforementioned avoidance groove 421 and the height adjuster 411, and may have a certain offset amount between the position N having the maximum BL factor and the initial position I of the coil. The speaker 400 having the BL factor characteristic of fig. 9 may have the first yoke 402a having a thickness of about hundreds of μm and the avoidance groove 421 formed to a depth of about tens of μm, and the BL factor may be increased to a value corresponding to the depth of the avoidance groove 421. In another embodiment of the present disclosure, the speaker 400 may reduce an offset between the initial position I of the coil 403 and the position N maximizing the BL factor by using the height adjuster 411, or may substantially coincide the initial position I with the position N. For example, the depth of the avoidance groove 421, the length of the height adjuster 411, and/or the height of the bent or curved portion (e.g., the depth of the bending groove 413) may be appropriately selected based on the BL factor or the offset to substantially match the initial position I with the position N. In another embodiment of the present disclosure, the depth or shape of the avoidance groove 421 may be appropriately selected based on the rigidity of the yoke (e.g., the first yoke 402 a) and the magnetic flux leakage. For example, the avoidance grooves 421 having a depth of about 0.03mm or more may be formed in a structure having a thickness of about 2mm to 4mm, in which a gap specified based on a space of the maximum amplitude of the diaphragm 401 is secured between the coil and the yoke (e.g., the coil 403 and the first yoke 402a in fig. 5) as described above. According to various embodiments of the present disclosure, since the avoidance groove 421 or the height adjuster 411 is provided, the speaker 400 may have BL factor characteristics as shown in fig. 9.

According to various embodiments of the present disclosure, the BL factor may be changed according to a displacement (e.g., -Z-direction displacement or +z-direction displacement) of the coil 403 from the initial position I when the same electrical signal is applied to the coil 403. In general, in a structure in which the initial position I of the coil 403 coincides with the position N, the relationship of the BL factor to the displacement of the coil 403 or the diaphragm 401 may be symmetrical with respect to the initial position of the magnets 404a and 404b (for example, the position N having the largest BL factor). For example, in a structure in which the initial position I of the coil 403 coincides with the position N, the BL factor may decrease as the position of the coil 403 is away from the initial position I, irrespective of the displacement direction.

Referring to fig. 8, it can be noted that when there is an offset between the initial position I and the position N of the coil 403, the relationship of the BL factor to the displacement of the coil 403 is asymmetric with respect to the initial position I of the coil 403. For example, it may be noted that the BL factor gradually increases and the distance from position N gradually decreases as coil 403 moves in the-Z direction, and that the BL factor continuously decreases as coil 403 moves in the +Z direction. In the illustrated embodiment of the present disclosure, the BL factor at a position where the coil 403 is moved about-0.2 mm from the initial position I differs from the BL factor at a position where the coil 403 is moved about +0.2mm from the initial position I by about 0.04N/A, and this asymmetry of the BL factor may be proportional to the displacement of the coil 403 from the initial position I. The asymmetry of the BL factor with respect to the initial position I of the coil 403 or according to the displacement of the coil 403 can be improved by reducing the amount of offset between the initial position I and the position N of the coil 403. However, since it is necessary to secure a gap based on the amplitude of the coil 403 or the diaphragm 401 or the deformation of the suspension 406, there may be a limitation in reducing the deviation or offset between the initial position I and the position N in a typical speaker.

According to various embodiments of the present disclosure, the avoidance groove 421 may be formed to a certain depth (e.g., about 0.03mm or more) as long as the thickness of the first yoke 402a allows, or the length of the height adjuster 411 may be adjusted to reduce the offset between the initial position I and the position N while securing the available space based on the amplitude of the diaphragm 401. For example, in the speaker 400 according to various embodiments of the present disclosure, the diaphragm 401 and/or the coil 403 may be disposed closer to the first yoke 402a while reducing the height or thickness of the curved portion 461 of the suspension 406, or the coil 403 may be disposed closer to the first yoke 402a by means of the height adjuster 411 while the shape of the suspension 406 or the position of the diaphragm 401 remains unchanged. For example, since the speaker 400 includes the avoidance groove 421, an available space or gap may be provided between the coil 403 and the first yoke 402a (e.g., the bottom surface of the avoidance groove 421) based on the maximum amplitude of the diaphragm 401 and the vibration of the diaphragm 401, and the coil 403 may be arranged or assembled at a position having the maximum BL factor while maintaining the available gap.

Referring to fig. 9, it can be noted that the initial position I and the position N substantially coincide with each other, and the BL factor distribution is symmetrical with respect to the initial position I according to the displacement of the coil 403 in the speaker 400 including the avoidance groove 421. In the speaker 400 according to various embodiments of the present disclosure, the BL factor of the speaker 400 may be maintained at about 0.6N/a or more when the coil 403 and/or the diaphragm 401 vibrate or linearly reciprocate between about-0.4 mm position and +0.4mm position. On the other hand, it can be noted from fig. 8 that the BL factor is asymmetric with respect to the initial position I of the coil according to the displacement of the coil in the "inner" direction and the "outer" direction, and the BL factor is reduced to about 0.54N/a at the +0.4mm position. Although it has been described herein that the "BL factor distribution is symmetrical with respect to the initial position I", the various embodiments are not limited thereto. For example, various embodiments of the present disclosure may improve the asymmetry of the BL factor distribution by adjusting the position of the coil 403, and "a configuration in which the BL factor distribution is symmetrical with respect to the initial position I" may correspond to one of these various embodiments.

Accordingly, in the speaker 400 and/or the electronic device 300 according to the various embodiments of the present disclosure, the position of the coil 403 may be easily adjusted corresponding to the depth of the avoidance groove 421, and the symmetry and/or linearity of the BL factor according to the displacement of the coil 403 may be ensured while a large BL factor is achieved through the position adjustment of the coil 403. For example, the speaker 400 and/or the electronic device 300 according to various embodiments of the present disclosure may provide improved sound quality and/or rich volume through easy sound quality adjustment. In some embodiments of the present disclosure, a gap between the diaphragm 401 and the yoke (e.g., the first yoke 402 a) may be easily reduced corresponding to the depth of the avoidance groove 421, thereby reducing the thickness of the speaker 400 and/or the electronic device 300 according to various embodiments of the present disclosure. In a structure in which it is difficult to change the shape of the suspension 406 or to reduce the gap between the diaphragm 401 and the yoke (e.g., the first yoke 402 a) to ensure the gap between the suspension 406 or other structure (e.g., the second yoke 402b and/or the second magnet 404b in fig. 5), the initial position I of the coil 403 can be easily aligned with the position N (e.g., the position having the largest BL factor) by using the height adjuster 411.

Now, various modified examples of a speaker (e.g., the speaker 321a in fig. 4 or the speaker 400 in fig. 5) will be described with reference to fig. 10 to 13. In the following description of embodiments of the present disclosure, the same reference numerals may be assigned or no reference numerals are assigned to components that can be easily understood from the foregoing embodiments of the present disclosure, and detailed descriptions thereof may also be avoided.

Fig. 10 is a cross-sectional view illustrating a speaker 500 of an electronic device (e.g., electronic devices 101, 102, 104, 200, and 300 in fig. 1-4) according to an embodiment of the present disclosure.

Referring to fig. 10, the speaker 500 and/or the diaphragm 501 may further include a height adjustment member 511. For example, the height adjustment member 511 may be attached to one surface of the diaphragm 501 instead of the height adjuster 411 of fig. 5, and the coil 403 may be mounted to the height adjustment member 511 and disposed on one surface of the diaphragm 501. In the structure including the height adjustment member 511, the height adjuster 411 and/or the bending groove 413 of fig. 5 may be omitted. For example, the diaphragm 501 may have a substantially flat plate shape. In another embodiment of the present disclosure, in order to increase the coupling force between the height adjustment member 511 and one surface of the diaphragm 501, a concave-convex structure may be formed on the coupling surface between one surface of the diaphragm 501 and the height adjustment member 511.

Fig. 11 is a cross-sectional view illustrating a speaker 600 in an electronic device (e.g., electronic devices 101, 102, 104, 200, and 300 in fig. 1-4) according to an embodiment of the present disclosure.

Referring to fig. 11, in the speaker 600, the shape of the end 633 of the coil 603 (e.g., the surface 431 facing the first yoke 402a in fig. 5) may be stepped, and the avoidance groove 621 (e.g., the avoidance groove 421 in fig. 5) may be formed in a shape corresponding to the shape of the end 633 of the coil 603. For example, the height adjuster 411 in fig. 5 or the height adjusting member 511 of fig. 10 may be omitted. In this case, the coil 603 of fig. 11 may include a protrusion (e.g., stepped end 633) having a size or length corresponding to the avoidance groove 621, as compared to the coil 403 of fig. 5, so that the initial position of the coil 603 may be aligned with the magnets 404a and 404 b.

Fig. 12 is a cross-sectional view illustrating a speaker 700 in an electronic device (e.g., electronic devices 101, 102, 104, 200, and 300 in fig. 1-4) according to an embodiment of the present disclosure. Fig. 13 is a cross-sectional view illustrating a yoke 702 (e.g., the first yoke 402a in fig. 5) separated from the speaker 700 of fig. 12 according to an embodiment of the present disclosure.

In embodiments of the present disclosure, the yoke 702 (e.g., the first yoke 402a in fig. 5) may be manufactured in a manner such as die casting, stamping, and/or cnc machining. In another embodiment of the present disclosure, the yoke 702 may be manufactured by combining a plurality of yoke plates 702a and 702b, and the avoidance grooves 721a may be formed by basically combining the yoke plates 702a and 702 b.

Referring to fig. 12 and 13, the yoke 702 may be formed by combining a plurality of yoke plates 702a and 702b in the speaker 700. In an embodiment of the present disclosure, the first yoke plate 702a among the yoke plates may include a first step portion 723a formed along an edge thereof. The first step portion 723a may include a first bottom surface 725a facing in the-Z direction and a first sidewall 729a disposed outwardly in the X-axis direction. In some embodiments of the present disclosure, the first bottom surface 725a may bond the first sidewall 729a to the side surface 727a of the first yoke plate 702a. Among the yoke plates, the second yoke plate 702b may include a second step portion 723b that forms the opening region 721b while surrounding the opening region 721 b. The second step portion 723b may include a second bottom surface 725b facing in the +z direction and a second sidewall 729b disposed to face inward in the X-axis direction or facing the opening region 721 b. In some embodiments of the present disclosure, the second bottom surface 725b may bond the second sidewall 729b to a side surface 727b of the second yoke plate 702b (e.g., a side surface defining a perimeter of the opening region 721 b).

According to various embodiments of the present disclosure, the opening region 721b may at least partially accommodate the first yoke plate 702a. For example, the first yoke plate 702a may be coupled to the second yoke plate 702b while being disposed in the opening region 721 b. According to an embodiment of the present disclosure, when the first yoke plate 702a is disposed in the opening region 721b, the first bottom surface 725a may be joined to the second bottom surface 725b to face each other. For example, when the bottom surfaces 725a and 725b are joined to face each other, the first and second yoke plates 702a and 702b may be bonded to each other, and thus the yoke 702 (e.g., the first yoke 402a in fig. 5) may be manufactured. Methods such as welding, thermal fusion, thermal or conductive adhesive based attachment, or soldering may be used in joining bottom surfaces 725a and 725b to each other.

In the yoke 702 manufactured by combining a plurality of yoke plates (e.g., the first yoke plate 702a and the second yoke plate 702 b), the first side wall 729a may be disposed to be substantially in contact with the side surface 727b (e.g., a surface defining a portion of the opening region 721 b) of the second yoke plate 702b, according to various embodiments of the present disclosure. The avoidance groove 721a may be partially surrounded by at least one of the second sidewall 729b of the second yoke plate 702b, the second bottom surface 725b of the second yoke plate 702b, and/or the side surface 727a of the first yoke plate 702 a. In some embodiments of the present disclosure, the side surface 727a of the first yoke plate 702a may be disposed to face the second side wall 729b such that the side surface 727a forms an inner wall of the avoidance groove 721a together with the second side wall 729b, and a portion of the bottom surface 725b forms substantially a bottom surface of the avoidance groove 721 a.

Fig. 14 is a cross-sectional view illustrating a speaker 400 in an electronic device (e.g., electronic devices 101, 102, 104, 200, and 300 in fig. 1-4) according to an embodiment of the present disclosure.

In the embodiments of the present disclosure, as an example, the curved portion (e.g., curved portion 461 in fig. 5) of the suspension is disposed more inward than the diaphragm 401. However, the various embodiments of the present disclosure are not limited thereto. Referring to fig. 14, the suspension 406 may include a curved portion 861 protruding more outward than the diaphragm 401. For example, various shapes such as "U", inverted "U", "S", or zigzags (e.g., partially corrugated shapes) may be used for suspension 406 or curved portions 461 and 861, without limiting the various embodiments of the present disclosure. Other components of the speaker 400 in fig. 14 may be similar to those of the previous embodiments or a combination of optional components of the previous embodiments of the present disclosure, which will not be described herein.

Fig. 15 is a cross-sectional view illustrating a speaker 400 in an electronic device (e.g., electronic devices 101, 102, 104, 200, and 300 in fig. 1-4) according to an embodiment of the present disclosure.

In the embodiments of the present disclosure, although the height adjusting piece (e.g., the height adjusting piece 411 in fig. 5) of the diaphragm 401 protrudes in the-Z direction on the diaphragm 401 as an example, the embodiments of the present disclosure are not limited thereto. Referring to fig. 15, a height adjuster 811 may protrude in the +z direction on the diaphragm 401, and a coil 403 may be disposed on an inner surface (e.g., a surface facing the-Z direction) of the diaphragm 401 corresponding to the height adjuster 811. Other components of the speaker 400 in fig. 15 may be similar to those of the previous embodiments or a combination of optional components of the previous embodiments of the present disclosure, which will not be described herein.

As described above, according to various embodiments of the present disclosure, a speaker (e.g., the sound output module 155 in fig. 1, the speaker 321a in fig. 4, or the speaker 400 in fig. 5) and/or an electronic device (e.g., the electronic devices 101, 102, 104, 200, and 300 in fig. 1 to 4) including the speaker may include: a diaphragm (e.g., diaphragm 401 in fig. 5); a yoke (e.g., the first yoke 402a in fig. 5 to 7) disposed to face the diaphragm and including an avoidance groove (e.g., the avoidance groove 421 in fig. 5 to 7) formed on a surface thereof facing the diaphragm; a coil (e.g., coil 403 in fig. 5 to 7) mounted to one surface of the diaphragm and disposed between the diaphragm and the yoke; and a first magnet (e.g., first magnet 404a in fig. 5 to 7) mounted to the yoke and disposed to be surrounded by at least a portion of the coil, or a second magnet (e.g., second magnet 404b in fig. 5 to 7) disposed to surround at least a portion of the coil. The coil may be disposed such that a surface thereof facing the yoke corresponds to the avoidance groove, and is configured to linearly reciprocate the diaphragm by receiving the electric signal.

According to various embodiments of the present disclosure, the diaphragm may include a height adjustment member (e.g., the height adjustment member 411 in fig. 5) protruding on one surface thereof, and the coil may be mounted to the height adjustment member.

According to various embodiments of the present disclosure, the diaphragm may further include a bending groove (e.g., bending groove 413 in fig. 5) recessed from the other surface of the diaphragm at a position corresponding to the height adjuster.

According to various embodiments of the present disclosure, the diaphragm may include a height adjustment member (e.g., the height adjustment member 511 in fig. 10) attached to one surface thereof, and the coil may be mounted to the height adjustment member.

According to various embodiments of the present disclosure, a yoke (e.g., the first yoke 402a in fig. 5 or the yoke 702 in fig. 12) may include: a first yoke plate (e.g., first yoke plate 702a in fig. 12 or 13) including a first step portion (e.g., first step portion 723a in fig. 13) formed along an edge thereof; and a second yoke plate (e.g., second yoke plate 702b in fig. 12 or 13) forming an opening region (e.g., opening region 721b in fig. 13) at least partially accommodating the first yoke plate, and the second yoke plate includes a second step portion (e.g., second step portion 723b in fig. 13) formed around the opening region, and a bottom surface of the first step portion (e.g., first bottom surface 725a in fig. 13) may be bonded to a bottom surface of the second step portion (e.g., second bottom surface 725b in fig. 13).

According to various embodiments of the present disclosure, the avoidance groove may be at least partially surrounded by at least one of a side wall of the second step portion (e.g., the second side wall 729b in fig. 13), a bottom surface of the second step portion, or a side surface of the first yoke plate (e.g., a side surface denoted by reference numeral "723a" in fig. 13).

According to various embodiments of the present disclosure, the coil may have a first width (e.g., a first width d1 in fig. 6) on a surface thereof facing the yoke, and the avoidance groove may have a second width (e.g., a second width d2 in fig. 6) greater than the first width.

According to various embodiments of the present disclosure, the speaker and/or the electronic device may further include a frame (e.g., frame 405 in fig. 5) disposed on the yoke, and a suspension (e.g., suspension 406 in fig. 5) disposed around and coupling the diaphragm to the frame, and at least a portion of an edge of the diaphragm may be coupled to the suspension.

According to various embodiments of the present disclosure, the diaphragm may further include a height adjustment member protruding on one surface of the diaphragm, and a bending groove recessed from the other surface of the diaphragm at a position corresponding to the height adjustment member, and the coil may be mounted to the height adjustment member.

According to various embodiments of the present disclosure, the speaker and/or the electronic device including the speaker may further include a filler (e.g., filler 499 in fig. 5) disposed in the bending groove, and the suspension may be disposed to seal the bending groove.

According to various embodiments of the present disclosure, the suspension may include a curved portion (e.g., curved portion 461 in fig. 5) protruding toward the yoke.

According to various embodiments of the present disclosure, a speaker (e.g., speaker 321a in fig. 4 or speaker 400 in fig. 5) and/or an electronic device including a speaker (e.g., electronic devices 101, 102, 104, 200, and 300 in fig. 1-4) may include: a diaphragm (e.g., the diaphragm 401 in fig. 5) including a height adjusting member (e.g., the height adjusting member 411 in fig. 5) protruding on one surface thereof and a bending groove (e.g., the bending groove 413 in fig. 5) recessed from the other surface thereof at a position corresponding to the height adjusting member; a yoke (e.g., the first yoke 402a in fig. 5 to 7) disposed to face the diaphragm and including an avoidance groove (e.g., the avoidance groove 421 in fig. 5 to 7) formed on a surface thereof facing the diaphragm; a coil (e.g., coil 403 in fig. 5 to 7), a height adjuster mounted to one surface of the diaphragm and disposed between the diaphragm and the yoke; and a first magnet (e.g., first magnet 404a in fig. 5 to 7) mounted to the yoke and disposed to be surrounded by at least a portion of the coil, or a second magnet (e.g., second magnet 404b in fig. 5 to 7) disposed to surround at least a portion of the coil. The coil may have a smaller width (e.g., a first width d1 in fig. 6) than the avoidance groove on a surface thereof facing the yoke (e.g., a surface denoted by reference numeral "431" in fig. 5 or 6), may be disposed such that the surface thereof facing the yoke corresponds to the avoidance groove, and may be configured to linearly reciprocate the diaphragm by receiving an electric signal.

According to various embodiments of the present disclosure, the speaker and/or the electronic device including the speaker may further include: a frame (e.g., frame 405 in fig. 5) disposed on the yoke; and a suspension (e.g., suspension 406 in fig. 5) disposed around and coupling the diaphragm to the frame, and at least a portion of an edge of the diaphragm may be coupled to the suspension.

According to various embodiments of the present disclosure, the speaker and/or the electronic device including the speaker may further include a filler (e.g., filler 499 in fig. 5) disposed in the bending groove, and the suspension may be disposed to cover at least a portion of the bending groove.

According to various embodiments of the present disclosure, an electronic device (e.g., electronic devices 101, 102, 104, 200, and 300 in fig. 1-4) may include: a housing (e.g., housing 210 in fig. 3) including a first surface (e.g., first surface 210A in fig. 2), a second surface (e.g., second surface 210B in fig. 3) facing in a direction opposite to the direction of the first surface, and a side surface (e.g., side surface 210C in fig. 2) at least partially surrounding a space between the first surface and the second surface; and at least one speaker (e.g., speaker 321a in fig. 4 or speaker 400 in fig. 5) disposed inside the housing and between the first surface and the second surface. The speaker may include: a diaphragm (e.g., diaphragm 401 in fig. 5); a yoke (e.g., the first yoke 402a in fig. 5 to 7) disposed to face the diaphragm and including an avoidance groove (e.g., the avoidance groove 421 in fig. 5 to 7) formed on a surface thereof facing the diaphragm; a coil (e.g., coil 403 in fig. 5 to 7) mounted to one surface of the diaphragm and disposed between the diaphragm and the yoke; and a first magnet (e.g., the first magnet 404a in fig. 5 to 7) provided to be surrounded by at least a portion of the coil, or a second magnet (e.g., the second magnet 404b in fig. 5 to 7) provided to surround at least a portion of the coil, and the coil may have a smaller width (e.g., the first width d1 in fig. 6) on a surface thereof facing the yoke than the avoidance groove, may be provided such that the surface thereof facing the yoke corresponds to the avoidance groove, and may be configured to linearly reciprocate the diaphragm by receiving an electrical signal.

According to various embodiments of the present disclosure, the diaphragm may include a height adjustment member (e.g., the height adjustment member 411 in fig. 5) protruding on one surface of the diaphragm and a bending groove (e.g., the bending groove 413 in fig. 5) recessed from the other surface of the diaphragm at a position corresponding to the height adjustment member, and the coil may be mounted to the height adjustment member.

According to various embodiments of the present disclosure, the speaker may further include: a frame (e.g., frame 405 in fig. 5) disposed on the yoke; and a suspension (e.g., suspension 406 in fig. 5) disposed around and coupling the diaphragm to the frame, and at least a portion of an edge of the diaphragm may be coupled to the suspension.

According to various embodiments of the present disclosure, the speaker may further include a filler (e.g., filler 499 in fig. 5) disposed in the bending groove, and the suspension may be disposed to seal the bending groove.

According to various embodiments of the present disclosure, the electronic device may further include at least one sound hole (e.g., the audio modules 214 and 203 in fig. 2) formed to radiate sound in a direction facing the first surface or in a direction facing the side surface, and the speaker may output the sound to the outside of the case through the sound hole.

While the present disclosure has been shown and described with reference to various embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present disclosure as defined by the appended claims and their equivalents. For example, the various embodiments described above may be combined to constitute additional embodiments. In an embodiment of the present disclosure, the height adjuster of fig. 5 or the height adjusting member of fig. 10 may be combined with the coil shape of fig. 11 or the yoke structure of fig. 12, and the yoke structure of fig. 12 may be combined with the coil shape of fig. 11. In some embodiments of the present disclosure, one electronic device may include a plurality of speakers, and the audio modules 214 and 203 previously described with reference to fig. 2 or 3 may be interpreted as including the above speakers.

Claims

1. A speaker, comprising:

a vibrating diaphragm;

a yoke disposed to face the diaphragm and including an avoidance groove formed on a surface of the yoke facing the diaphragm;

a coil mounted to one surface of the diaphragm and disposed between the diaphragm and the yoke; and

a first magnet mounted to the yoke and arranged to be surrounded by at least a portion of the coil, or a second magnet arranged to surround at least a portion of the coil,

Wherein the coil is disposed such that a surface of the coil facing the yoke corresponds to the avoidance groove, and

wherein the coil is configured to linearly reciprocate the diaphragm by receiving an electrical signal.

2. A loudspeaker according to claim 1,

wherein the diaphragm includes a height adjuster protruding on the one surface of the diaphragm, and

wherein the coil is mounted to the height adjuster.

3. The speaker of claim 2, wherein the diaphragm further comprises a bending groove recessed from the other surface of the diaphragm at a position corresponding to the height adjuster.

4. A loudspeaker according to claim 1,

wherein the diaphragm includes a height adjusting member attached to the one surface of the diaphragm, and

wherein the coil is mounted to the height adjustment member.

5. A loudspeaker according to claim 1,

wherein, the yoke includes:

a first yoke plate including a first step portion formed along an edge thereof, and

a second yoke plate forming an opening area which at least partially accommodates the first yoke plate, and which includes a second step portion formed around the opening area, and

Wherein a bottom surface of the first step portion is bonded to a bottom surface of the second step portion.

6. The speaker of claim 5, wherein the avoidance groove is at least partially surrounded by at least one of a side wall of the second step portion, the bottom surface of the second step portion, and a side surface of the first yoke plate.

7. A loudspeaker according to claim 1,

wherein the coil has a first width on a surface of the coil facing the yoke, and

wherein the avoidance groove has a second width that is greater than the first width.

8. The speaker of claim 1, the speaker further comprising:

a frame disposed on the yoke; and

a suspension disposed around the diaphragm and coupling the diaphragm to the frame,

wherein at least a portion of an edge of the diaphragm is coupled to the suspension.

9. A loudspeaker according to claim 8,

wherein, the vibrating diaphragm still includes:

a height adjusting member protruding on the one surface of the diaphragm, and

a bending groove recessed from the other surface of the diaphragm at a position corresponding to the height adjusting member, and

Wherein the coil is mounted to the height adjuster.

10. The speaker of claim 9, the speaker further comprising:

the filling piece is arranged in the bending groove,

wherein the suspension is configured to seal the bending groove.

11. The speaker of claim 8, wherein the suspension includes a curved portion protruding toward the yoke.

12. A speaker according to claim 3, wherein the coil has a smaller width than the avoidance groove on a surface of the coil facing the yoke.

13. An electronic device, comprising:

a housing including a first surface, a second surface facing in a direction opposite to that of the first surface, and a side surface at least partially surrounding a space between the first surface and the second surface; and

at least one speaker disposed inside the housing between the first surface and the second surface,

wherein, the speaker includes:

the diaphragm is arranged in the cavity of the diaphragm,

a yoke disposed to face the diaphragm and including an avoidance groove formed on a surface of the yoke facing the diaphragm,

a coil mounted to one surface of the diaphragm and disposed between the diaphragm and the yoke, and

wherein the coil has a smaller width than the avoidance groove on a surface of the coil facing the yoke,

wherein the coil is disposed such that the surface of the coil facing the yoke corresponds to the avoidance groove, and

14. The electronic device according to claim 13,

wherein, the vibrating diaphragm includes:

a height adjusting member protruding on the one surface of the diaphragm, and

wherein the coil is mounted to the height adjuster.

15. The electronic device of claim 13, the electronic device further comprising:

at least one sound hole formed to radiate sound in a direction facing the first surface or in a direction facing the side surface,

wherein the speaker outputs sound to the outside of the housing through the sound hole.