CN117102609A - Semiconductor refrigeration piece welding set - Google Patents
Semiconductor refrigeration piece welding set Download PDFInfo
- Publication number
- CN117102609A CN117102609A CN202310540726.3A CN202310540726A CN117102609A CN 117102609 A CN117102609 A CN 117102609A CN 202310540726 A CN202310540726 A CN 202310540726A CN 117102609 A CN117102609 A CN 117102609A
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- China
- Prior art keywords
- welding
- fixedly connected
- box
- wall
- semiconductor refrigeration
- Prior art date
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- Granted
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- 238000003466 welding Methods 0.000 title claims abstract description 128
- 238000005057 refrigeration Methods 0.000 title claims abstract description 35
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000005476 soldering Methods 0.000 claims description 13
- 238000001125 extrusion Methods 0.000 claims description 12
- 238000000746 purification Methods 0.000 claims description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 230000006378 damage Effects 0.000 abstract description 5
- 230000000694 effects Effects 0.000 description 8
- 230000033001 locomotion Effects 0.000 description 8
- 238000001816 cooling Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 208000014674 injury Diseases 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 230000001502 supplementing effect Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01D—SEPARATION
- B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
- B01D53/02—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography
- B01D53/04—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols by adsorption, e.g. preparative gas chromatography with stationary adsorbents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B15/00—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area
- B08B15/04—Preventing escape of dirt or fumes from the area where they are produced; Collecting or removing dirt or fumes from that area from a small area, e.g. a tool
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention relates to a semiconductor refrigeration piece welding device which comprises a welding box, wherein the front surface of the welding box is rotationally connected with a box door, a conveying assembly is arranged in the welding box, a placing part is arranged on the conveying assembly, the upper surface of the welding box is fixedly connected with a cylinder, the output end of the cylinder penetrates through the inner top wall of the welding box and is fixedly connected with a mounting plate, the lower surface of the mounting plate is fixedly connected with a welding head, and the upper surface of the welding box is fixedly connected with a purifying assembly. According to the semiconductor refrigeration piece welding device, the fan, the air inlet pipe and the air collecting hopper are matched, harmful gas generated during welding is sent into the purifying box, and the harmful gas is purified through the activated carbon and then discharged, so that the harm caused by the fact that workers inhale the harmful gas can be avoided, and the problem that in the prior art, the body of the workers is damaged due to the harmful gas generated during welding is solved.
Description
Technical Field
The invention relates to the technical field of semiconductor refrigeration piece processing, in particular to a semiconductor refrigeration piece welding device.
Background
The semiconductor refrigerating sheet, also called thermoelectric refrigerating sheet, is a heat pump, and has the advantages of no sliding component, high reliability, no refrigerant pollution, and the use of Peltier effect of semiconductor material.
Welding set among the prior art, a semiconductor refrigeration piece welding set of chinese patent publication like the authority number CN 212384776U, it drives the fixed plate through push-pull electromagnet circular telegram back expansion end and presses in the welding groove, makes the soldering bit of fixed plate bottom can press in the metallic channel then welds the refrigeration piece, but does not set up to open-type structure in the device, during operation, though the gauze mask can be worn to the staff, but the unavoidable harmful substance that the welding produced still partly is inhaled by the staff, can produce the injury to the staff.
In order to solve the problems, the invention provides a semiconductor refrigeration piece welding device.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, adapt to the actual needs, and provide a semiconductor refrigeration piece welding device so as to solve the technical problems.
In order to achieve the purpose of the invention, the technical scheme adopted by the invention is as follows:
the utility model provides a semiconductor refrigeration piece welding set, includes the welding box, the front of welding box rotates and is connected with the chamber door, the inside of welding box is provided with conveying subassembly, be provided with the portion of placing on the conveying subassembly, the last fixedly connected with cylinder of welding box, the output of cylinder runs through the interior roof and fixedly connected with mounting panel of welding box, the lower fixedly connected with soldering bit of mounting panel, the last fixedly connected with purification module of welding box.
Further, the conveying assembly comprises two conveying rollers which are rotationally connected with the inner wall of the welding box, the same conveying belt is sleeved on the surfaces of the two conveying rollers, the two conveying rollers are in transmission connection through the conveying belt, a motor is fixedly connected to the back of the welding box, and the output end of the motor penetrates through the inner wall of the welding box and is fixedly connected with the conveying rollers.
Further, the discharge gate has been seted up on the right side of welding case, and the inner wall fixedly connected with baffle box of discharge gate, the interior bottom wall fixedly connected with rubber pad of baffle box.
Further, place the portion include with conveyer belt fixed surface connection's bottom plate, the spout has been seted up to the upper surface of bottom plate, and the inner wall sliding connection of spout has the slider, the upper surface fixedly connected with of slider places the board, the upper surface of placing the board is provided with welding groove and metallic channel respectively.
Further, the through-hole has been seted up to the inner wall of spout, and the inner chamber of through-hole is provided with the connecting rod, the one end and the slider fixed connection of connecting rod, the other end fixedly connected with atress piece of connecting rod, the both sides of atress piece all are provided with the fillet, the upper surface fixedly connected with stopper of connecting rod, the connecting rod atress is flexible, the inner wall fixedly connected with extrusion piece of welding box, the both sides of extrusion piece all are provided with the circular arc angle, exit has been seted up to the back of welding box, the surface cover of connecting rod is equipped with the spring, the one end and the inner wall fixed connection of spout of spring, the other end and the slider fixed connection of spring.
Further, the purification assembly comprises a fan fixedly connected with the upper surface of the welding box, an air inlet pipe is fixedly connected with the air inlet end of the fan, one end of the air inlet pipe is fixedly connected with the back surface of the welding box, the inner wall of the welding box is rotationally connected with a gas collecting hopper, the air inlet pipe is communicated with the gas collecting hopper, the upper surface of the welding box is fixedly connected with the purification box, an air outlet end of the fan is communicated with the purification box, a mesh box is detachably connected with the inner wall of the purification box, active carbon is arranged in the mesh box, an air inlet is formed in the upper surface of the welding box, and a filter screen is fixedly connected with the inner wall of the air inlet.
Further, the back of welding case has seted up the arc wall, the inner wall sliding connection of arc wall has the slide bar, the one end and the back fixed connection of gas-collecting channel of slide bar.
Further, the back rotation of welding case is connected with the incomplete gear, the back sliding connection of welding case has the removal frame, the interior roof of removing the frame and interior diapire all are provided with the driving tooth, incomplete gear and driving tooth meshing, the last fixed surface of removing the frame is connected with the drive ring, the drive ring cover is established at the surface of slide bar and is laminated with the surface of slide bar.
Further, the inner wall rotation of intake pipe is connected with the swivel becket, the inner wall fixedly connected with of swivel becket a plurality of rotor blade, a plurality of the one end fixedly connected with same axis of rotation of rotor blade, the bottom of axis of rotation runs through the surface of intake pipe and fixedly connected with drive bevel gear, the back fixedly connected with driven bevel gear of incomplete gear, drive bevel gear and driven bevel gear meshing.
Further, a welding method of a semiconductor refrigeration piece welding device, through starting a motor and a fan, the output end of the motor drives one of conveying rollers to rotate, and then the conveying rollers are driven to move under the cooperation of the other conveying rollers, the conveying belt drives the placement part to move, when the placement part moves to the position of the extrusion piece, the motor stops working, the extrusion piece extrudes the stressed block, the connecting rod is bent, and then the limiting block moves downwards, under the reset action of the spring, the sliding block moves backwards, the sliding block drives the placement plate to move backwards and move out of the welding box through the inlet and outlet parts, a user puts the refrigeration piece and a wire into the welding groove and the wire groove, then presses the placement plate to enter the welding box, and simultaneously starts the motor again, so that the placement part continues to move, when the placement part moves to the lower part, the motor stops working, the starting action drives the welding head to move downwards, and the fan, the air inlet pipe is matched with the air bucket, harmful gas generated during welding is sent into the purifying box, the active carbon purifies the harmful gas and then is discharged, the harmful gas is prevented from being damaged by workers, the harmful gas is sucked into the resetting action, the sliding block moves backwards, the sliding block drives the placement plate to move backwards, the placement plate moves backwards and moves out of the welding box through the inlet and then moves downwards, and then rotates the bevel gear, the bevel gear rotates, the cooling piece is prevented from falling down, and then rotates, and the cooling piece is driven to rotate, and then rotates, and the air inlet and rotates, and then rotates, and rotates around the rotating and rotates, and thereby, and rotates the rotating and rotates the rotary shaft, and rotates the rotary blade. The driven bevel gear drives the residual gear to rotate, the residual gear drives the movable frame to reciprocate left and right, the movable frame drives the limiting ring to move, the limiting ring drives the sliding rod to move along the arc-shaped groove, the sliding rod drives the gas collecting hopper to swing, and the phenomenon that the welded position is always sucked in to influence the welding effect is avoided, so that the problem that the body of a worker is damaged due to harmful gas generated by welding in the prior art is solved by the semiconductor refrigeration sheet welding device.
1. According to the semiconductor refrigeration piece welding device, the fan, the air inlet pipe and the air collecting hopper are matched, harmful gas generated during welding is sent into the purifying box, and the harmful gas is purified through the activated carbon and then discharged, so that the harm caused by the fact that workers inhale the harmful gas can be avoided, and the problem that in the prior art, the body of the workers is damaged due to the harmful gas generated during welding is solved.
2. According to the semiconductor refrigerating sheet welding device, the conveying assembly drives the placing part to move, the semiconductor refrigerating sheets to be welded sequentially reach the position below the welding head, the discharging hole is arranged, when the placing part moves to the position corresponding to the placing part, the welded refrigerating sheets and the wires fall on the rubber pad to fall down, discharging is facilitated, and the rubber pad is arranged to prevent the welded refrigerating sheets and the wires from being separated under stress, so that the semiconductor refrigerating sheet welding device has the effect of facilitating discharging.
3. According to the welding device, the air inlet is matched with the filter screen, so that air is supplemented in the welding box when the fan sucks air, and the former placing part is positioned below the air inlet when the latter placing part is positioned below the soldering bit, so that air flow at the welded refrigerating piece positioned below the air inlet is accelerated during air supplementing, the solidification speed of soldering tin is improved, the phenomenon that the subsequent refrigerating piece falls on a rubber pad to cause detachment is avoided, the defective rate is reduced, and the semiconductor refrigerating piece welding device has the effect of reducing the defective rate.
4. According to the semiconductor refrigeration piece welding device, the placement part is driven to move through the movement of the conveying belt, when the placement part moves to the position of the extrusion piece, the extrusion piece extrudes the stress piece, so that the connecting rod is bent, the limiting block moves downwards, the sliding block moves backwards under the reset action of the spring, the placement plate moves backwards and moves out of the welding box through the inlet and outlet parts, a user can conveniently place the refrigeration piece and the lead, and the semiconductor refrigeration piece welding device has the effect of being convenient for feeding.
5. According to the invention, the rotating blades rotate when the airflow passes through, so that the rotating shafts are driven to rotate, the driving bevel gears are driven to rotate, the driven bevel gears are driven to rotate, the residual gears are driven to rotate, the moving frame is driven to reciprocate left and right, the limiting rings are driven to move, the sliding rods are driven to move along the arc-shaped grooves, the gas collecting hopper is driven to swing, the gas suction at the welding position is avoided, the welding effect is prevented from being influenced, and the semiconductor refrigeration piece welding device has the function of avoiding the influence on the welding effect.
Drawings
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of a three-dimensional (cross-sectional weld box) structure of the transfer assembly of the present invention;
FIG. 3 is a schematic perspective view of a placement unit according to the present invention;
FIG. 4 is a schematic side cross-sectional view of a base plate of the present invention;
FIG. 5 is an enlarged schematic view of the structure of FIG. 4A according to the present invention;
FIG. 6 is a schematic side sectional view of a weld box of the present invention;
FIG. 7 is an enlarged schematic view of the structure of FIG. 6B according to the present invention;
FIG. 8 is a schematic perspective view of a blower of the present invention;
FIG. 9 is an enlarged schematic view of the structure of FIG. 8C in accordance with the present invention;
FIG. 10 is a schematic elevational view of the tip of the present invention;
FIG. 11 is a schematic diagram of a rear view of a spur gear of the present invention;
FIG. 12 is a schematic cross-sectional view of an air intake pipe of the present invention;
FIG. 13 is a schematic cross-sectional view of a weld box of the present invention;
fig. 14 is an enlarged schematic view of the structure of fig. 13D according to the present invention.
The reference numerals are as follows:
1. welding a box; 2. a door; 3. a transfer assembly; 301. a conveying roller; 302. a conveyor belt; 303. a motor; 4. a placement unit; 401. a bottom plate; 402. a slide block; 403. placing a plate; 404. a welding groove; 405. a wire groove; 406. a connecting rod; 407. a stress block; 408. a limiting block; 409. extruding a block; 410. an inlet and an outlet; 411. a spring; 5. a cylinder; 6. a mounting plate; 7. soldering iron head; 8. a purification assembly; 801. a blower; 802. an air inlet pipe; 803. a gas collecting hopper; 804. a purifying box; 805. a mesh box; 806. a filter screen; 9. a guide groove; 10. a rubber pad; 11. an arc-shaped groove; 12. a slide bar; 13. a stub gear; 14. a moving frame; 15. a drive tooth; 16. a drive ring; 17. a rotating ring; 18. a rotating blade; 19. a rotating shaft; 20. a drive bevel gear; 21. driven bevel gears.
Detailed Description
The invention is further illustrated by the following examples in connection with figures 1-14:
as shown in fig. 1-14, a semiconductor refrigeration piece welding device comprises a welding box 1, wherein a box door 2 is rotatably connected to the front surface of the welding box 1, a conveying assembly 3 is arranged in the welding box 1, a placing part 4 is arranged on the conveying assembly 3, an air cylinder 5 is fixedly connected to the upper surface of the welding box 1, the output end of the air cylinder 5 penetrates through the inner top wall of the welding box 1 and is fixedly connected with a mounting plate 6, a soldering iron head 7 is fixedly connected to the lower surface of the mounting plate 6, and a purifying assembly 8 is fixedly connected to the upper surface of the welding box 1.
The conveying assembly 3 comprises two conveying rollers 301 rotatably connected with the inner wall of the welding box 1, the surfaces of the two conveying rollers 301 are sleeved with the same conveying belt 302, the two conveying rollers 301 are in transmission connection through the conveying belt 302, a motor 303 is fixedly connected to the back of the welding box 1, and the output end of the motor 303 penetrates through the inner wall of the welding box 1 and is fixedly connected with the conveying rollers 301.
A discharge hole is formed in the right side of the welding box 1, the inner wall of the discharge hole is fixedly connected with a guide chute 9, and the inner bottom wall of the guide chute 9 is fixedly connected with a rubber pad 10.
Specifically, drive through conveying component 3 and place the motion of portion 4, and then make the semiconductor refrigeration piece that needs the welding arrive soldering bit 7 below in proper order, through setting up the discharge gate, when placing portion 4 and removing to rather than the position that corresponds, the refrigeration piece after the welding can fall on rubber pad 10 with the wire, conveniently discharges, through setting up rubber pad 10, prevents that the refrigeration piece after the welding from breaking away from with the wire atress.
In this embodiment, as shown in fig. 3-7 and fig. 13-14, the placement part 4 includes a bottom plate 401 fixedly connected with the surface of the conveyor belt 302, a chute is formed on the upper surface of the bottom plate 401, the inner wall of the chute is slidably connected with a slider 402, the upper surface of the slider 402 is fixedly connected with a placement plate 403, and a welding groove 404 and a wire groove 405 are respectively provided on the upper surface of the placement plate 403.
Through-holes are formed in the inner walls of the sliding grooves, connecting rods 406 are arranged in the inner cavities of the through-holes, one ends of the connecting rods 406 are fixedly connected with sliding blocks 402, the other ends of the connecting rods 406 are fixedly connected with stress blocks 407, round corners are arranged on two sides of the stress blocks 407, limiting blocks 408 are fixedly connected to the upper surfaces of the connecting rods 406, the connecting rods 406 are stressed and bendable, extrusion blocks 409 are fixedly connected to the inner walls of the welding box 1, arc angles are arranged on two sides of the extrusion blocks 409, inlet and outlet 410 are formed in the back of the welding box 1, springs 411 are sleeved on the surfaces of the connecting rods 406, one ends of the springs 411 are fixedly connected with the inner walls of the sliding grooves, and the other ends of the springs 411 are fixedly connected with the sliding blocks 402.
Specifically, the placement part 4 is driven to move by the movement of the conveyor belt 302, when the placement part 4 moves to the position of the extrusion block 409, the extrusion block 409 extrudes the stress block 407, so that the connecting rod 406 bends, the limiting block 408 moves downwards, the sliding block 402 moves backwards under the reset action of the spring 411, the placement plate 403 moves backwards and moves out of the welding box 1 through the inlet and outlet 410, and a user can place the refrigerating sheet and the lead conveniently.
In this embodiment, as shown in fig. 8 and 10, the purifying component 8 includes a fan 801 fixedly connected with the upper surface of the welding tank 1, an air inlet pipe 802 is fixedly connected with an air inlet end of the fan 801, one end of the air inlet pipe 802 is fixedly connected with the back surface of the welding tank 1, an air collecting hopper 803 is rotatably connected with an inner wall of the welding tank 1, the air inlet pipe 802 is communicated with the air collecting hopper 803, a purifying tank 804 is fixedly connected with the upper surface of the welding tank 1, an air outlet end of the fan 801 is communicated with the purifying tank 804, a mesh box 805 is detachably connected with an inner wall of the purifying tank 804, active carbon is arranged in the mesh box 805, an air inlet is formed in the upper surface of the welding tank 1, and a filter screen 806 is fixedly connected with an inner wall of the air inlet.
Specifically, through air inlet and filter screen 806 cooperation, carry out the air filling in welding case 1 when fan 801 breathes in, because the part 4 is placed to the later time when being located soldering bit 7 below, the part 4 is placed to the previous time is located the below of air intake, when the air filling, the air flow that is located the cooling fin department that has welded of air intake below accelerates, improves the solidification rate of soldering tin, can avoid follow-up cooling fin to fall to cause the phenomenon that breaks away from to appear on rubber pad 10, reduces the defective percentage.
In this embodiment, as shown in fig. 8-12, an arc-shaped groove 11 is formed on the back surface of the welding box 1, a slide bar 12 is slidably connected to the inner wall of the arc-shaped groove 11, and one end of the slide bar 12 is fixedly connected to the back surface of the gas collecting hopper 803.
The back of the welding box 1 is rotationally connected with a residual gear 13, the back of the welding box 1 is slidably connected with a movable frame 14, the inner top wall and the inner bottom wall of the movable frame 14 are respectively provided with driving teeth 15, the residual gear 13 is meshed with the driving teeth 15, the upper surface of the movable frame 14 is fixedly connected with a driving ring 16, and the driving ring 16 is sleeved on the surface of the slide rod 12 and is attached to the surface of the slide rod 12.
The inner wall of the air inlet pipe 802 is rotatably connected with a rotating ring 17, the inner wall of the rotating ring 17 is fixedly connected with a plurality of rotating blades 18, one end of each rotating blade 18 is fixedly connected with the same rotating shaft 19, the bottom end of each rotating shaft 19 penetrates through the surface of the air inlet pipe 802 and is fixedly connected with a driving bevel gear 20, the back surface of the residual gear 13 is fixedly connected with a driven bevel gear 21, and the driving bevel gear 20 is meshed with the driven bevel gear 21.
Specifically, through rotating the leaf 18 and taking place to rotate when the air current passes through, and then drive axis of rotation 19 rotates, and then drives the rotation of initiative bevel gear 20, and then drives driven bevel gear 21 and rotate, and then drives incomplete gear 13 and rotate, and then drives and remove frame 14 left and right sides reciprocating motion, and then drive the spacing ring motion, and then drive slide bar 12 and follow arc groove 11 motion, and then drive gas collection hopper 803 swing, avoid directly inhaling the position of welding, influence welded effect.
Working principle: when the semiconductor refrigeration piece welding device is used, a user starts a motor 303 and a fan 801, the output end of the motor 303 drives one of the conveying rollers 301 to rotate, then drives a conveying belt 302 to move under the cooperation of the other conveying roller 301, the conveying belt 302 drives a placing part 4 to move, when the placing part 4 moves to the position of a pressing block 409, the motor 303 stops working, the pressing block 409 presses a stress block 407, a connecting rod 406 bends, a limiting block 408 moves downwards, a sliding block 402 moves backwards under the reset action of a spring 411, the sliding block 402 drives a placing plate 403 to move backwards and move out of a welding box 1 through an inlet and an outlet 410, the user places a refrigeration piece and a wire into a welding groove 404 and a wire groove 405, then presses the placing plate 403 to enter the welding box 1, and simultaneously the motor 303 starts again, so that the placing part 4 continues to move, when the placement part 4 moves below the soldering bit 7, the motor 303 stops working, the starting action drives the soldering bit 7 to move downwards to weld, the fan 801, the air inlet pipe 802 and the air collecting hopper 803 are matched, harmful gas generated during welding is sent into the purifying box 804, activated carbon purifies the harmful gas and then is discharged, the harmful gas is prevented from being inhaled by workers to cause injury, at the moment, the former placement part 4 is positioned below the air inlet, when supplementing air, the air flow at the welded refrigerating piece positioned below the air inlet is accelerated, the solidification speed of soldering tin is improved, the phenomenon that the follow-up refrigerating piece falls on the rubber pad 10 to cause detachment is avoided, the defective rate is reduced, when the placement part 4 moves to the position of the discharge port, the welded refrigerating piece and the wire fall on the rubber pad 10 to conveniently discharge, when the fan 801 works, the rotating blade 18 rotates when the air flow passes through, and then drive axis of rotation 19 and rotate, axis of rotation 19 drives initiative bevel gear 20 and rotates, initiative bevel gear 20 drives driven bevel gear 21 and rotates, driven bevel gear 21 drives incomplete gear 13 and rotates, incomplete gear 13 drives and moves frame 14 left and right sides reciprocating motion, it moves to move the spacing ring, spacing ring moves slide bar 12 along arc groove 11 motion, slide bar 12 drives the gas collecting hopper 803 and swings, avoid directly inhaling in the welded position, influence welded effect, thereby make this semiconductor refrigeration piece welding set solve among the prior art because the harmful gas that the welding produced causes staff's health to produce the problem of injury.
The embodiments of the present invention are disclosed as preferred embodiments, but not limited thereto, and those skilled in the art will readily appreciate from the foregoing description that various extensions and modifications can be made without departing from the spirit of the present invention.
Claims (9)
1. The utility model provides a semiconductor refrigeration piece welding set, includes welding box (1), the front rotation of welding box (1) is connected with chamber door (2), the inside of welding box (1) is provided with conveying subassembly (3), be provided with on conveying subassembly (3) and place portion (4), the last fixed surface of welding box (1) is connected with cylinder (5), the output of cylinder (5) runs through the interior roof of welding box (1) and fixedly connected with mounting panel (6), the lower fixed surface of mounting panel (6) is connected with soldering iron head (7), a serial communication port, the last fixed surface of welding box (1) is connected with purifying assembly (8).
2. The semiconductor refrigeration fin bonding apparatus of claim 1, wherein: the conveying assembly (3) comprises two conveying rollers (301) which are rotatably connected with the inner wall of the welding box (1), the surfaces of the conveying rollers (301) are sleeved with one conveying belt (302), the conveying rollers (301) are in transmission connection through the conveying belt (302), a motor (303) is fixedly connected to the back of the welding box (1), and the output end of the motor (303) penetrates through the inner wall of the welding box (1) and is fixedly connected with the conveying rollers (301).
3. The semiconductor refrigeration fin bonding apparatus of claim 1, wherein: the right side of welding case (1) has seted up the discharge gate, and the inner wall fixedly connected with baffle box (9) of discharge gate, the interior bottom wall fixedly connected with rubber pad (10) of baffle box (9).
4. The semiconductor refrigeration fin bonding apparatus of claim 1, wherein: the placing part (4) comprises a bottom plate (401) fixedly connected with the surface of the conveyor belt (302), a chute is formed in the upper surface of the bottom plate (401), a sliding block (402) is slidably connected to the inner wall of the chute, a placing plate (403) is fixedly connected to the upper surface of the sliding block (402), and a welding groove (404) and a wire groove (405) are respectively formed in the upper surface of the placing plate (403).
5. The semiconductor refrigeration fin bonding apparatus according to claim 4, wherein: the inner wall of spout has been seted up the through-hole, and the inner chamber of through-hole is provided with connecting rod (406), the one end and the slider (402) fixed connection of connecting rod (406), the other end fixedly connected with atress piece (407) of connecting rod (406), the both sides of atress piece (407) all are provided with the fillet, the upper surface fixedly connected with stopper (408) of connecting rod (406), connecting rod (406) atress is flexible, the inner wall fixedly connected with extrusion piece (409) of welding case (1), the both sides of extrusion piece (409) all are provided with the circular arc angle, exit (410) have been seted up to the back of welding case (1), the surface cover of connecting rod (406) is equipped with spring (411), the one end and the inner wall fixed connection of spout of spring (411), the other end and slider (402) fixed connection of spring (411).
6. The semiconductor refrigeration fin bonding apparatus of claim 1, wherein: the purification assembly (8) comprises a fan (801) fixedly connected with the upper surface of the welding box (1), an air inlet pipe (802) is fixedly connected with the air inlet end of the fan (801), one end of the air inlet pipe (802) is fixedly connected with the back surface of the welding box (1), the inner wall of the welding box (1) is rotationally connected with a gas collecting hopper (803), the air inlet pipe (802) is communicated with the gas collecting hopper (803), the upper surface of the welding box (1) is fixedly connected with a purification box (804), the air outlet end of the fan (801) is communicated with the purification box (804), a mesh box (805) is detachably connected with the inner wall of the purification box (804), activated carbon is arranged in the mesh box (805), an air inlet is formed in the upper surface of the welding box (1), and a filter screen (806) is fixedly connected with the inner wall of the air inlet.
7. The semiconductor refrigeration fin bonding apparatus of claim 1, wherein: the back of welding case (1) has seted up arc wall (11), the inner wall sliding connection of arc wall (11) has slide bar (12), the one end of slide bar (12) is connected with the back fixed of gas collection fill (803).
8. The semiconductor refrigeration fin bonding apparatus according to claim 6, wherein: the back rotation of welding case (1) is connected with incomplete gear (13), the back sliding connection of welding case (1) has movable frame (14), interior roof and interior diapire of movable frame (14) all are provided with driving tooth (15), incomplete gear (13) and driving tooth (15) meshing, the upper surface fixedly connected with driving ring (16) of movable frame (14), driving ring (16) cover are established at the surface of slide bar (12) and are laminated with the surface of slide bar (12).
9. The semiconductor refrigeration fin bonding apparatus of claim 8, wherein: the inner wall rotation of intake pipe (802) is connected with swivel becket (17), the inner wall fixedly connected with of swivel becket (17) a plurality of swivel becket (18), a plurality of the one end fixedly connected with of swivel becket (18) is same axis of rotation (19), the bottom of axis of rotation (19) runs through the surface of intake pipe (802) and fixedly connected with drive bevel gear (20), the back fixedly connected with driven bevel gear (21) of incomplete gear (13), drive bevel gear (20) and driven bevel gear (21) meshing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310540726.3A CN117102609B (en) | 2023-05-15 | 2023-05-15 | Semiconductor refrigeration piece welding set |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202310540726.3A CN117102609B (en) | 2023-05-15 | 2023-05-15 | Semiconductor refrigeration piece welding set |
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| CN117102609A true CN117102609A (en) | 2023-11-24 |
| CN117102609B CN117102609B (en) | 2024-04-09 |
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| CN117102609B (en) | 2024-04-09 |
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