CN117102385A - Chip pin bending equipment - Google Patents
Chip pin bending equipment Download PDFInfo
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- CN117102385A CN117102385A CN202311346489.3A CN202311346489A CN117102385A CN 117102385 A CN117102385 A CN 117102385A CN 202311346489 A CN202311346489 A CN 202311346489A CN 117102385 A CN117102385 A CN 117102385A
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- bending
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- adsorption
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- 238000005452 bending Methods 0.000 title claims abstract description 158
- 230000007246 mechanism Effects 0.000 claims abstract description 168
- 238000001179 sorption measurement Methods 0.000 claims abstract description 118
- 238000003860 storage Methods 0.000 claims abstract description 38
- 238000012545 processing Methods 0.000 claims abstract description 35
- 230000005540 biological transmission Effects 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims description 114
- 238000005520 cutting process Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 16
- 238000012546 transfer Methods 0.000 claims description 9
- 230000001360 synchronised effect Effects 0.000 claims description 5
- XBWAZCLHZCFCGK-UHFFFAOYSA-N 7-chloro-1-methyl-5-phenyl-3,4-dihydro-2h-1,4-benzodiazepin-1-ium;chloride Chemical compound [Cl-].C12=CC(Cl)=CC=C2[NH+](C)CCN=C1C1=CC=CC=C1 XBWAZCLHZCFCGK-UHFFFAOYSA-N 0.000 claims 8
- 230000033001 locomotion Effects 0.000 description 21
- 238000010521 absorption reaction Methods 0.000 description 19
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000004804 winding Methods 0.000 description 6
- 230000002745 absorbent Effects 0.000 description 4
- 239000002250 absorbent Substances 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005056 compaction Methods 0.000 description 2
- 238000007373 indentation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004801 process automation Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C51/00—Measuring, gauging, indicating, counting, or marking devices specially adapted for use in the production or manipulation of material in accordance with subclasses B21B - B21F
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F23/00—Feeding wire in wire-working machines or apparatus
- B21F23/005—Feeding discrete lengths of wire or rod
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/918—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with at least two picking-up heads
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to the technical field of bending equipment and discloses chip pin bending equipment which is used for bending pins of a chip, wherein the chip comprises an adsorption end and a pin end, the chip pin bending equipment comprises a storage mechanism, a bending mechanism, a positioning mechanism and a conveying mechanism, the conveying mechanism comprises an adsorption component and a transmission component, the adsorption component comprises an adsorption part, the adsorption component is used for adsorbing or loosening the chip, the transmission component is respectively adjacent to the storage mechanism, the bending mechanism and the positioning mechanism and drives the adsorption component to reciprocate along the arrangement directions of the storage mechanism, the bending mechanism and the positioning mechanism, and after the chip is placed on the positioning mechanism by the adsorption component, the positioning mechanism is abutted with the adsorption end so that the axis of the adsorption end is aligned with the axis of the adsorption component above the positioning mechanism. The chip pin bending equipment provided by the invention can effectively protect the chip, has high reliability and can realize full-automatic processing.
Description
Technical Field
The invention belongs to the technical field of bending equipment, and particularly relates to chip pin bending equipment.
Background
Along with the increasingly wide application of chips in high-precision equipment, the quality requirements of manufacturers on the chips are higher and higher, in the production process of the chips, bending treatment is usually required to be carried out on metal pins of the chips, and the traditional bending modes are mostly manual bending, so that the precision and consistency of the chips are difficult to meet the use requirements, and the production efficiency is low.
In contrast, the Chinese patent document CN116237441A discloses an automatic pin folding mechanism for pins of a chip, and the scheme can realize automatic pin folding for the pins of the chip without manually folding the pins, so that the labor intensity of workers is effectively reduced, and the production efficiency is improved; but this scheme carries the chip through the clamping jaw in the in-process of unloading, and mechanical clamping jaw can cause certain damage to the chip at the in-process of snatching, and then influences the performance of chip.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provide the chip pin bending equipment which can effectively protect chips, has high reliability and can realize full-automatic processing.
The invention can be realized by the following technical scheme, namely, a chip pin bending device for bending pins of a chip, wherein the chip comprises an adsorption end and a pin end, and the chip pin bending device comprises:
the storage mechanism is used for placing chips to be processed;
the bending mechanism is used for bending the pin end of the chip;
the positioning mechanism is arranged between the storage mechanism and the bending mechanism and used for positioning the chip transferred to the bending mechanism;
The conveying mechanism comprises an adsorption component and a transmission component, wherein the adsorption component comprises an adsorption part, the adsorption part is used for adsorbing or loosening a chip, the transmission component is respectively adjacent to the storage mechanism, the bending mechanism and the positioning mechanism and drives the adsorption component to reciprocate along the arrangement direction of the storage mechanism, the bending mechanism and the positioning mechanism, and after the chip is placed on the positioning mechanism by the adsorption component, the positioning mechanism is abutted with the adsorption end so that the axis of the adsorption end is aligned with the axis of the adsorption part above the positioning mechanism.
In the above-mentioned chip pin equipment of bending, positioning mechanism includes base, first locating component and compresses tightly the subassembly, and this first locating component sets up on the base with compressing tightly the subassembly and surrounds into a mouthful style of calligraphy space, and this first locating component includes horizontal locating piece and vertical locating piece, and this compressing tightly the subassembly and including first compressing tightly piece and second compressing tightly piece, and first compressing tightly piece and second compressing tightly the piece and respectively towards horizontal locating piece or vertical locating piece direction motion to drive the chip and remove.
In the above-mentioned chip pin bending device, when the first pressing member and the second pressing member drive the chip to move towards the direction close to the transverse positioning block or the longitudinal positioning block, and the adsorption end is respectively abutted with the transverse positioning block, the longitudinal positioning block, the first pressing member and the second pressing member, the axis of the adsorption end is aligned with the axis of the adsorption member above the positioning mechanism.
In the above-mentioned chip pin equipment of bending, positioning mechanism still includes first supporting seat and second supporting seat, this first supporting seat sets up between base and first location subassembly, this second supporting seat is adjacent with first supporting seat, be provided with a breach on it, this breach includes the first junction surface opposite with the transverse positioning piece to and the second junction surface opposite with the longitudinal positioning piece, wherein, this first clamp piece sets up in second supporting seat and deviates from first junction surface one side, extends towards first junction surface direction and runs through first junction surface, this second clamp piece sets up in second supporting seat deviates from second junction surface one side, extends towards second junction surface direction and runs through the second junction surface.
In the above-mentioned chip pin bending device, the pressing assembly further includes a first pressing cylinder, a second pressing cylinder, a first limiting member and a second limiting member disposed on the base, where the first pressing cylinder is connected with the first pressing member and is used to drive the first pressing member to move in a direction approaching or separating from the transverse positioning block, and the second pressing cylinder is connected with the second pressing member and is used to drive the second pressing member to move in a direction approaching or separating from the longitudinal positioning block; the first limiting piece is arranged on one side, far away from the transverse positioning block, of the first pressing piece and extends towards the direction facing the base so as to limit the stroke of the first pressing piece, and the second limiting piece is arranged on one side, far away from the longitudinal positioning block, of the second pressing piece and extends towards the direction facing the base so as to limit the stroke of the second pressing piece.
In the above-mentioned chip pin equipment of bending, the absorption end of chip includes first butt face, second butt face, third butt face and fourth butt face, and this first butt face and second butt face set up in the vertical direction of absorption end to be relative setting, this third butt face and fourth butt face set up in the horizontal direction of absorption end to be relative setting, wherein, after first clamp and the second clamp motion, first butt face and horizontal locating piece butt, second butt face and first clamp butt, third butt face and vertical locating piece butt, fourth butt face and second clamp butt.
In the chip pin bending equipment, the adsorption assembly further comprises a support frame, a lifting structure and a driving cylinder;
one side of the supporting frame is detachably connected with the adsorption piece, and the other side of the supporting frame is detachably connected with the lifting structure;
the lifting structure comprises a connecting seat, a sliding block and a sliding rail, wherein the connecting seat is detachably connected with the transmission assembly, the sliding rail is arranged on one side of the connecting seat, which is away from the transmission assembly, and extends along the vertical direction of the connecting seat, one surface of the sliding block is movably connected with the sliding rail, and the other surface of the sliding block is detachably connected with the supporting frame so as to drive the absorption member to reciprocate along the vertical direction;
The driving cylinder is respectively connected with the sliding block and the adsorption piece to drive the sliding block to move along the length direction of the sliding rail and drive the adsorption piece to inhale or deflate.
In the above-mentioned chip pin equipment of bending, still include the unloading mechanism that deviates from positioning mechanism direction with bending mechanism, this unloading mechanism includes plummer and unloading subassembly, and this unloading subassembly reciprocates between plummer and next work area for transfer the chip on the plummer to next work area.
In the above-mentioned chip pin equipment of bending, support frame and adsorption piece are provided with three groups, are provided with the connecting plate between this support frame and the elevation structure, and this connecting plate one side can be dismantled with three groups of support frames respectively and is connected, and the another side can be dismantled with the sliding block and be connected, wherein, when adsorption component is in initial position, this three groups of adsorption piece are located storage mechanism, positioning mechanism and bending mechanism top respectively, and when adsorption component is in the motion position, this three groups of adsorption piece are located positioning mechanism, bending mechanism and unloading mechanism top respectively to realize the synchronous transfer of multichip.
In the above-mentioned chip pin bending equipment, the bending mechanism comprises a carrier table, a secondary positioning assembly, a bending assembly and a cutting knife;
The carrier table is provided with a processing groove and a placing groove, wherein the processing groove extends along the vertical direction of the carrier table and penetrates through the carrier table to allow the bending assembly to extend in, and the placing groove is adjacent to the processing groove and is used for forming a preset position for a chip;
the secondary positioning assembly is arranged on one side of the carrier platform far away from the ground and comprises a first positioning block, a second positioning block, a third positioning block and a positioning cylinder for driving the first positioning block, the second positioning block and the third positioning block, wherein the first positioning block, the second positioning block and the third positioning block move towards the position close to the adsorption end and are abutted with three surfaces of the adsorption end;
the bending assembly comprises an upper bending cutter and a lower bending cutter, wherein the lower bending cutter is arranged below the placing groove, the lower bending cutter comprises a first supporting part and a second supporting part, and a height difference is arranged between the first supporting part and the second supporting part; the upper bending knife is movably connected with the carrier table and reciprocates in the processing groove along the vertical direction of the upper bending knife so as to bend the pin end;
the cutting knife is arranged on one side of the lower bending knife back away from the chip and is used for cutting redundant pins.
Compared with the prior art, the invention has the following beneficial effects: 1. by arranging the adsorption component and conveying the chips and feeding and discharging in an adsorption mode through the adsorption component, compared with a manipulator, the chip clamping damage can be effectively avoided, and the stability and reliability of the chip are further effectively improved; 2. the positioning mechanism is arranged between the material storage mechanism and the bending mechanism, the positioning mechanism is made to form four-side abutting connection with the absorption end of the chip placed on the positioning mechanism, and the axis of the absorption end is aligned with the axis of the absorption part above the positioning mechanism; the adsorption end of the chip is positioned at the right center of the adsorption piece, so that the chip adsorbed by the storage mechanism is subjected to position correction and positioning and then is transmitted to the bending mechanism, the positioning precision of the chip is effectively improved, and the influence of the position error generated by the adsorption piece directly adsorbing the chip from the storage mechanism on the precision of the chip placement and bending mechanism is avoided; 3. the three groups of the supporting seats and the adsorbing pieces are arranged, and the connecting plates are arranged between the supporting seats and the lifting structure, one surfaces of the connecting plates are detachably connected with the three groups of the supporting seats respectively, and the other surfaces of the connecting plates are detachably connected with the sliding blocks, so that the three groups of the adsorbing pieces can reciprocate at the initial position and the movement position, synchronous transfer of a plurality of chips is realized, and the processing efficiency is further effectively improved; 4. the secondary positioning assembly is arranged on the bending mechanism to push the chip in the placing groove, so that the accurate positioning of the chip processing position is realized, errors in bending are effectively avoided, the bending precision is effectively improved, the secondary positioning assembly can fix the three surfaces of the adsorption end, the chip moving caused by the bending assembly during processing is effectively avoided, and the chip processing stability is further effectively improved; 5. the first supporting part and the second supporting part are arranged on the lower bending knife, and the first supporting part and the second supporting part are provided with a height difference, so that a fixing surface which is abutted against the third abutting surface of the adsorption end can be formed, four sides of the adsorption end are fixed through cooperation with the secondary positioning assembly, and further the firmness of fixing the adsorption end is effectively ensured; in addition, the height of the first supporting part is lower than that of the second supporting part, so that the pin end arranged on the second supporting part is higher than the horizontal plane, and meanwhile, through the inclined arrangement of the first supporting part and the second supporting part, even if an included angle is formed between the first supporting part, the second supporting part and the horizontal plane of the lower bending knife, the included angle can compensate the rebound angle after bending, thereby ensuring that the bending angle can reach 90 degrees; 6. by arranging the blanking mechanism, and enabling the blanking assembly of the blanking mechanism to reciprocate between the bearing table and the next working area so as to transfer chips on the bearing table to the next working area, full automation of chip feeding, bending and blanking is realized, manual operation is not needed, labor cost is effectively saved on one hand, and machining efficiency is effectively improved on the other hand; 7. through setting up the location briquetting in last bent sword adjacent side to make the extension length of location briquetting be greater than the extension length of last bent sword, make last bent sword when processing the chip, this location briquetting earlier with partial pin end butt, further guaranteed the firm nature that the chip is fixed, effectively avoided last bent sword chip to take place to remove when processing, thereby effectively improved the precision that the chip was bent.
Drawings
Fig. 1 is a schematic structural diagram of a chip pin bending device in a moving position according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a partial structure of a chip pin bending apparatus according to an embodiment of the present invention.
Fig. 3 is a partial exploded view of fig. 2.
Fig. 4 is a schematic structural diagram of a positioning mechanism according to an embodiment of the invention.
Fig. 5 is a schematic view of the structure of fig. 4 at another view angle.
Fig. 6 is a schematic structural diagram of a chip according to an embodiment of the invention.
Fig. 7 is a schematic structural diagram of a conveying mechanism according to an embodiment of the present invention.
Fig. 8 is a schematic structural diagram of a bending structure in an embodiment of the present invention.
Fig. 9 is a schematic partial structure of a bending structure according to an embodiment of the present invention.
Fig. 10 is an enlarged view at a in fig. 9.
Fig. 11 is a schematic structural view of a lower bending blade according to an embodiment of the present invention.
Fig. 12 is a schematic structural diagram of a cutting blade according to an embodiment of the present invention.
Fig. 13 is a schematic view of a structure in which a chip is placed on a lower bending blade in an embodiment of the present invention.
FIG. 14 is a partial exploded view of an upper crimping tool and a locating press block in accordance with an embodiment of the present invention.
Fig. 15 is an enlarged view at B in fig. 14.
Like reference numerals denote like technical features throughout the drawings, in particular: 100. a storage mechanism; 200. a positioning mechanism; 210. a base; 220. a first positioning assembly; 221. a transverse positioning block; 222. a longitudinal positioning block; 230. a compression assembly; 231. a first pressing member; 232. a second pressing member; 233. a first compaction cylinder; 234. a second compaction cylinder; 235. a first limiting member; 236. a second limiting piece; 237. a first elastic member; 240. a first support base; 250. a second support base; 251. a first connection surface; 252. a second connection surface; 300. a bending mechanism; 310. a carrier stage; 311. a processing groove; 312. a placement groove; 320. a secondary positioning component; 321. a first positioning block; 322. a second positioning block; 323. a third positioning block; 324. positioning a cylinder; 325. a second elastic member; 330. a bending assembly; 331. an upper bending knife; 332. a lower bending knife; 333. a first support portion; 334. a second supporting part; 335. a fixing surface; 340. a cutting knife; 341. a first cutting edge; 342. a second cutting edge; 400. a conveying mechanism; 410. an adsorption assembly; 411. an absorbing member; 412. a support frame; 413. a connecting seat; 414. a sliding block; 415. a slide rail; 416. a driving cylinder; 417. a connecting plate; 418. an adjusting plate; 420. a transmission assembly; 500. a blanking mechanism; 510. a carrying platform; 520. a blanking assembly; 600. a chip; 610. an adsorption end; 611. a first abutment surface; 612. a second abutment surface; 613. a third abutment surface; 614. a fourth abutment surface; 620. a pin end; 700. and positioning the pressing block.
Detailed Description
The following are specific embodiments of the present invention and the technical solutions of the present invention will be further described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
As shown in fig. 1 to 15, the chip pin bending apparatus provided in the embodiments of the present invention includes a material storage mechanism 100, a bending mechanism 300, a positioning mechanism 200, a conveying mechanism 400, an adsorption assembly 410, a transmission assembly 420, and a blanking mechanism 500.
As shown in fig. 1 to 15, a chip pin bending apparatus provided in an embodiment of the present invention is configured to perform pin bending processing on a chip 600, where the chip 600 includes an adsorption end 610 and a pin end 620, and the chip pin bending apparatus includes:
a storage mechanism 100 for placing a chip 600 to be processed;
bending mechanism 300 for bending pin end 620 of chip 600;
The positioning mechanism 200 is arranged between the material storage mechanism 100 and the bending mechanism 300 and is used for positioning the chip 600 transferred to the bending mechanism 300;
the conveying mechanism 400 comprises an adsorption component 410 and a transmission component 420, wherein the adsorption component 410 comprises an adsorption component 411, the adsorption component 411 is used for adsorbing or loosening the chip 600, the transmission component 420 is respectively adjacent to the storage mechanism 100, the bending mechanism 300 and the positioning mechanism 200, and drives the adsorption component 410 to reciprocate along the arrangement direction of the three components, and after the adsorption component 410 places the chip 600 on the positioning mechanism 200, the positioning mechanism 200 is abutted with the adsorption end 610 so that the axis of the adsorption end 610 is aligned with the axis of the adsorption component 411 above the positioning mechanism 200; further, the adsorption end 610 of the chip 600 is positioned at the center of the adsorption piece 411, so that the chip 600 adsorbed by the storage mechanism 100 is subjected to position correction and positioning and then moved to the bending mechanism 300, the positioning precision of the chip 600 is effectively improved, and the influence of the position error generated by the adsorption piece 411 directly adsorbing the chip 600 from the storage mechanism 100 on the precision of the chip 600 placed on the bending mechanism 300 is avoided; and through the adsorption component 410 with absorptive mode removal and go up the unloading, compare in traditional manipulator, can effectively avoid chip 600 to be pressed from both sides the damage, and then effectively improved chip 600's stability and reliability.
Specifically, as shown in fig. 1, in the present embodiment, the storage mechanism 100, the positioning mechanism 200, the bending mechanism 300, and the blanking mechanism 500 are sequentially arranged from right to left, and the conveying mechanism 400 is disposed on an adjacent side of the former in the arrangement direction, so that the chip 600 can flow among the storage mechanism 100, the positioning mechanism 200, the bending mechanism 300, and the blanking mechanism 500.
In this embodiment, the storage mechanism 100 includes a storage rack, a winding belt, a driver and a detector, where the winding belt is sleeved on the storage rack and can rotate relative to the storage rack, the driver is disposed above the storage rack and is used to drive the winding belt to rotate, so as to realize continuous supply of the storage chip 600, the detector is disposed on one side of the storage rack close to the direction of the positioning mechanism 200, and performs laser irradiation on the chip 600 at the outlet of the winding belt, so as to realize detection of whether the chip 600 exists or not, and avoid air transportation of equipment; when the detector detects that the coil material belt has the chip 600, the transmission mechanism is started to perform subsequent operation, and when the detector detects that the coil material belt has no chip 600, the coil material belt is rotated to rotate the chip 600 behind the coil material belt to the outlet.
As shown in fig. 6, in the present embodiment, the chip 600 is a hall chip, which includes an adsorption end 610 and a pin end 620, wherein the adsorption end 610 includes a first abutting surface 611, a second abutting surface 612, a third abutting surface 613 and a fourth abutting surface 614, the first abutting surface 611 and the second abutting surface 612 are disposed in a vertical direction of the adsorption end 610 and are disposed oppositely, and the third abutting surface 613 and the fourth abutting surface 614 are disposed in a horizontal direction of the adsorption end 610 and are disposed oppositely, so as to be positioned by the positioning mechanism 200.
As shown in fig. 1 to 5, in the present embodiment, the positioning mechanism 200 is interposed between the material storage mechanism 100 and the bending mechanism 300, and includes a base 210, a first positioning component 220 and a pressing component 230, where the first positioning component 220 and the pressing component 230 are disposed on the base 210 and enclose a square space, the first positioning component 220 includes a transverse positioning block 221 and a longitudinal positioning block 222, the pressing component 230 includes a first pressing member 231 and a second pressing member 232, and the first pressing member 231 and the second pressing member 232 respectively move towards the transverse positioning block 221 or the longitudinal positioning block 222 to drive the chip 600 to move, so as to implement position correction of the chip 600; when the first pressing member 231 and the second pressing member 232 drive the chip 600 to move towards the direction close to the transverse positioning block 221 or the longitudinal positioning block 222, and the adsorption end 610 is respectively abutted against the transverse positioning block 221, the longitudinal positioning block 222, the first pressing member 231 and the second pressing member 232, the axis of the adsorption end 610 is aligned with the axis of the adsorption member 411 above the positioning mechanism 200, so that the positioning of the adsorption end 610 of the chip 600 is realized, and when the adsorption member 411 sucks the positioned chip 600 again, the adsorption end 610 of the chip 600 is positioned in the center of the adsorption member 411, thereby realizing the correction of the position of the chip 600 on the adsorption member 411, eliminating the positional deviation of the adsorption member 411 when directly adsorbing the chip 600 from the coil stock belt, and effectively improving the positioning accuracy of the chip 600.
As shown in fig. 4 and 5, in the present embodiment, the lateral positioning block 221 is L-shaped, the short side of the lateral positioning block 221 faces the pressing assembly 230, the longitudinal positioning block 222 is rectangular and is vertically connected with the lateral positioning block 221 to position the adsorbing end 610 in the lateral and longitudinal directions, the first pressing member 231 and the second pressing member 232 are in a convex shape, wherein the first pressing member 231 is opposite to the lateral positioning block 221, the second pressing member 232 is opposite to the longitudinal positioning block 222, when the first pressing member 231 and the second pressing member 232 move towards the lateral positioning block 221 or the longitudinal positioning block 222, a square space for accommodating the adsorbing end 610 is formed, so that the first abutting surface 611 of the adsorbing end 610 abuts against the lateral positioning block 221, the second abutting surface 612 abuts against the first pressing member 231, the third abutting surface 613 abuts against the longitudinal positioning block 222, and the fourth abutting surface 614 abuts against the second pressing member 232 to position the adsorbing end 610.
In this embodiment, the positioning mechanism 200 further includes a first supporting seat 240 and a second supporting seat 250 disposed on a side of the base 210 far from the ground, where the first supporting seat 240 is disposed between the base 210 and the first positioning component 220 and is irregularly rectangular, and is fixed to the base 210 by a fastener, where the longitudinal positioning block 222 and the first supporting seat 240 are integrally formed, and the height of the longitudinal positioning block 222 is higher than the surface height of the first supporting seat 240, so as to achieve longitudinal positioning of the suction end 610, the transverse positioning block 221 is detachably connected with the first supporting seat 240, and in order to ensure stability of the transverse positioning block 221, the first supporting seat 240 is further provided with an L-shaped groove, and the height of the L-shaped groove is smaller than the height of the transverse positioning block 221, so that the transverse positioning block 221 can protrude from the surface of the first supporting seat 240, to achieve transverse positioning of the suction end 610, and the L-shaped groove can enable the transverse positioning block 221 to retain a certain thickness, thereby ensuring strength of the transverse positioning block 221, and further ensuring stability of the transverse positioning block 221 in use.
The second supporting seat 250 is L-shaped, is adjacent to the first supporting seat 240 and has a height higher than that of the first supporting seat 240, and is provided with a right-angle notch, the notch is abutted against the first supporting seat 240, and includes a first connecting surface 251 opposite to the transverse positioning block 221 and a second connecting surface 252 opposite to the longitudinal positioning block 222, wherein the first pressing member 231 is disposed on a side of the second supporting seat 250 facing away from the first connecting surface 251, extends toward the first connecting surface 251 and penetrates the first connecting surface 251, the second pressing member 232 is disposed on a side of the second supporting seat 250 facing away from the second connecting surface 252, and the second pressing member 232 extends toward the second connecting surface 252 and penetrates the second connecting surface 252, and the heights of the first pressing member 231 and the second pressing member 232 are higher than those of the first supporting seat 240, so that the first pressing member 231 and the second pressing member 232 move.
In order to achieve the movement of the first pressing member 231 and the second pressing member 232, in this embodiment, the pressing assembly 230 further includes a first pressing cylinder 233 and a second pressing cylinder 234 disposed on the base 210, where the first pressing cylinder 233 is connected to the first pressing member 231 to drive the first pressing member 231 to move toward a direction approaching or away from the lateral positioning block 221, and the second pressing cylinder 234 is connected to the second pressing member 234 and the second pressing member 232 to drive the second pressing member 232 to move toward a direction approaching or away from the longitudinal positioning block 222, so as to achieve the movement of the chip 600, thereby achieving the positioning of the adsorption end 610.
In this embodiment, the pressing assembly 230 further includes a first limiting member 235 and a second limiting member 236, where the first limiting member 235 is disposed on a side of the first pressing member 231 away from the lateral positioning block 221 and extends toward the direction facing the base 210 to limit the maximum movement stroke of the first pressing member 231, and the second limiting member 236 is disposed on a side of the second pressing member 232 away from the longitudinal positioning block 222 and extends toward the direction facing the base 210 to limit the maximum movement stroke of the second pressing member 232, so as to avoid excessive movement of the first pressing member 231 and the second pressing member 232, and damage to the chip 600 caused by impact of the absorbing end 610, thereby affecting the performance of the chip 600 and effectively improving the safety and stability of the operation of the device.
Preferably, to improve the protection of the chip 600 and avoid the chip 600 from receiving excessive impact force during the positioning process, in this embodiment, the pressing assembly 230 further includes two sets of first elastic members 237 disposed in the direction that the first and second limiting members 235 and 236 are away from the lateral positioning block 221 or the longitudinal positioning block 222, and two sets of fixing blocks disposed in the direction that the first elastic members 237 are away from the first and second limiting members 235 and 236, wherein the fixing blocks are connected to the base 210 by fasteners, one end of the first elastic members 237 is connected to the fixing blocks, the other end of the first elastic members 237 is connected to the first limiting member 235 or the second limiting member 236, and the first pressing members 231 and the second pressing members 232 are moved towards the direction close to the lateral positioning block 221 or the longitudinal positioning block 222 by the first elastic members 237.
In this embodiment, in the initial state, the first pressing cylinder 233 drives the first limiting member 235 to drive the first pressing member 231 to move in a direction away from the transverse positioning block 221, the second pressing cylinder 234 drives the second limiting member 236 to drive the second pressing member 232 to move in a direction away from the longitudinal positioning block 222, so that the two sets of first elastic members 237 are in a pressed state in the initial state, and the chip 600 is placed, and after the chip 600 is placed, the first pressing cylinder 233 and the second pressing cylinder 234 are relaxed, so that the first elastic members 237 drive the first pressing member 231 and the second pressing member 232 to move in a direction close to the transverse positioning block 221 or the longitudinal positioning block 222 under the action of elastic force, thereby realizing positioning of the chip 600.
In this embodiment, the first elastic member 237 is a spring, and the first pressing member 231 and the second pressing member 232 are in elastic contact with the adsorption end 610 through the first elastic member 237, so that the impact force applied to the adsorption end 610 is effectively reduced, and the adsorption end 610 is better protected.
As shown in fig. 3 and 7, in order to avoid pinching the chip 600, in this embodiment, the suction assembly 410 is used as a tool for transferring the chip 600, and the suction assembly 410 includes a cylindrical suction member 411 arranged vertically, and an elastic suction nozzle is disposed at an end of the suction member 411 facing the ground, so as to effectively protect the surface of the chip 600.
In this embodiment, the adsorption assembly 410 further includes a support frame 412, a lifting structure and a driving cylinder 416, wherein the support frame 412 is L-shaped, one side of the support frame 412 is detachably connected with the adsorption member 411, and the other side of the support frame is detachably connected with the lifting structure, wherein a connecting hole for the adsorption member 411 to pass through is provided on a horizontal side of the support frame 412 so as to support the adsorption member 411, and a vertical side of the support frame 412 is detachably connected with the lifting structure through a fastener so as to realize longitudinal movement of the adsorption member 411, thereby realizing placement and taking of the chip 600.
In this embodiment, the lifting structure includes a connecting seat 413, a sliding block 414 and a sliding rail 415, where the connecting seat 413 is detachably connected with the transmission assembly 420 to reciprocate along with the transmission assembly 420 in the arrangement directions of the storage mechanism 100, the positioning mechanism 200, the bending mechanism 300 and the blanking mechanism 500, so as to realize the lateral movement of the absorbent 411; the sliding rail 415 is disposed on one side of the connecting seat 413 away from the transmission assembly 420 and extends along the vertical direction of the connecting seat 413, one surface of the sliding block 414 is movably connected with the sliding rail 415, and the other surface of the sliding block 414 is detachably connected with the supporting frame 412, so as to drive the adsorbing member 411 to reciprocate along the vertical direction, thereby realizing the up-and-down movement of the adsorbing member 411, and further realizing the placement and the taking of the chip 600.
The driving cylinder 416 is disposed on the connecting seat 413, and is in pneumatic connection with the sliding block 414 and the adsorbing member 411, so as to drive the sliding block 414 to move along the length direction of the sliding rail 415, so as to realize the longitudinal movement of the adsorbing member 411 and further realize the movement of the chip 600, and meanwhile, also drive the adsorbing member 411 to inhale or deflate, so as to further realize the tightening or loosening of the chip 600.
As shown in fig. 1, fig. 2, fig. 3, fig. 7, in order to realize synchronous transfer of a plurality of chips 600, in this embodiment, three groups of support frames 412 and suction members 411 are arranged in a row, a connecting plate 417 is arranged between the support frames 412 and the lifting structure, one surface of the connecting plate 417 is detachably connected with the three groups of support frames 412, and the other surface of the connecting plate 417 is detachably connected with the sliding block 414, wherein when the suction assembly 410 is at an initial position, the three groups of suction members 411 are respectively located above the material storage mechanism 100, the positioning mechanism 200 and the bending mechanism 300, and when the suction assembly 410 is at a moving position, the three groups of suction members 411 are respectively located above the positioning mechanism 200, the bending mechanism 300 and the blanking mechanism 500, so that synchronous transfer of a plurality of chips 600 is realized, and further, the processing efficiency is effectively improved.
In this embodiment, in order to ensure stable longitudinal movement of the three groups of absorbent members 411, in this embodiment, two groups of sliding blocks 414 and sliding rails 415 are respectively disposed on one side of the connecting seat 413 facing the absorbent assembly 410 in a left-right structure, so that the force bearing area of the connecting plate 417 is effectively increased, and thus the movement stability of the multiple groups of absorbent members 411 is ensured.
In order to respectively control the longitudinal moving heights of the plurality of absorbing members 411, in this embodiment, an adjusting plate 418 is further disposed between the three groups of supporting frames 412 and the connecting plate 417, one side of the adjusting plate 418 facing away from the connecting plate 417 is further provided with a sliding rail 415, and a sliding block 414 slidably connected with the sliding rail 415, and one side of the sliding block 414 facing away from the adjusting plate 418 is detachably connected with the supporting frames 412, so that the longitudinal moving heights of the plurality of absorbing members 411 are respectively controlled, and fine adjustment of the longitudinal movement is realized.
As shown in fig. 1, 2, 3 and 8, in the present embodiment, to implement the processing of the lead end 620 of the chip 600, the bending mechanism 300 is disposed on a side of the positioning mechanism 200 away from the storage mechanism 100, and includes a carrier 310, a secondary positioning assembly 320, a bending assembly 330 and a cutting blade 340.
As shown in fig. 9 to 10, in the present embodiment, the carrier 310 is provided with a processing groove 311 with a convex shape and a placing groove 312 with a concave shape, wherein the processing groove 311 extends along the vertical direction of the carrier 310 and penetrates through the carrier 310 for the bending component 330 to extend in, so as to facilitate bending the lead end 620; the placement groove 312 is adjacent to the processing groove 311, and is used for forming a preset position for the chip 600, so as to reduce the movement stroke of the secondary positioning, thereby improving the working efficiency of the secondary positioning; and supports the chip 600 by cooperation with the lower bending blade 332.
In order to improve the bending precision of the chip 600 and avoid errors during bending, in this embodiment, the secondary positioning assembly 320 is disposed on a side of the carrier stage 310 far away from the ground, and includes a first positioning block 321, a second positioning block 322, a third positioning block 323, and a positioning cylinder 324 for driving the three, where the first positioning block 321 is disposed on the right side of the placement slot 312, the second positioning block 322 is disposed on the left side of the placement slot 312 opposite to the first positioning block 321, and the third positioning block 323 is disposed on a side of the placement slot 312 far away from the processing slot 311, and is disposed perpendicular to the first positioning block 321 and the second positioning block 322, respectively, so as to form a surrounding shape on three sides of the adsorption end 610; the first positioning block 321, the second positioning block 322 and the third positioning block 323 move towards the position close to the adsorption end 610 and are abutted against the three surfaces of the adsorption end 610, the chip 600 is positioned by pushing the adsorption end 610, the first positioning block 321 is abutted against the first abutting surface 611, the second positioning block 322 is abutted against the second abutting surface 612, the third positioning block 323 is abutted against the fourth abutting surface 614 to fix the three surfaces of the adsorption end 610, the chip 600 is prevented from moving when the bending assembly 330 is processed, and the processing stability of the chip 600 is effectively improved.
In the present embodiment, the positioning cylinder 324 is provided with three groups, which are respectively connected with the first positioning block 321, the second positioning block 322 and the third positioning block 323, so as to respectively drive the first positioning block 321, the second positioning block 322 and the third positioning block 323.
Preferably, to improve the protection of the chip 600 and avoid the chip 600 from receiving excessive impact force during the positioning process, in this embodiment, the secondary positioning assembly 320 further includes three sets of second elastic members 325 disposed between the positioning cylinder 324 and the first positioning block 321 or the second positioning block 322 or the third positioning block 323, so that the positioning cylinder 324 drives the first positioning block 321 or the second positioning block 322 or the third positioning block 323 to move towards the position close to the adsorption end 610 through the second elastic members 325 to achieve positioning.
In this embodiment, the second elastic member 325 is a spring, and the first positioning block 321, the second positioning block 322, and the third positioning block 323 can form elastic contact with the adsorption end 610 through the second elastic member 325, so that the impact force received by the adsorption end 610 is effectively reduced, and the adsorption end 610 is better protected.
It should be noted that, in this embodiment, by setting the first positioning block 321, the second positioning block 322, and the third positioning block 323, the position adjustment of the adsorption end 610 in three directions is realized, and compared with the prior art, the fine adjustment of the moving distance can be realized by setting a single or two positioning blocks.
As shown in fig. 8, 10, 11 and 13, in order to bend the lead end 620 of the chip 600, in this embodiment, the bending assembly 330 includes an upper bending blade 331 and a lower bending blade 332 that are matched with each other, the lower bending blade 332 is disposed below the placement groove 312 to support the chip 600, the lower bending blade 332 includes a first supporting portion 333 and a second supporting portion 334 that are adjacently disposed, the first supporting portion 333 is used for placing the adsorbing end 610, the second supporting portion 334 is used for placing a part of the lead end 620, and a height difference is provided between the first supporting portion 333 and the second supporting portion 334, wherein the height of the first supporting portion 333 is lower than that of the second supporting portion 334, so that the first supporting portion 333 and the second supporting portion 334 are in a step shape, and a fixing surface 335 that is abutted against the third abutting surface 613 of the adsorbing end 610 can be formed, and by matching with the first positioning block 321, the second positioning block 322 and the third positioning block 323, the fixing of the adsorbing end 610 is realized, and the effective four-sided fixing of the adsorbing end 610 is ensured; in addition, the height of the first supporting portion 333 is lower than that of the second supporting portion 334, so that the lead end 620 disposed on the second supporting portion 334 is higher than the horizontal plane, and meanwhile, by obliquely arranging the first supporting portion 333 and the second supporting portion 334, even if an included angle is formed between the first supporting portion 333, the second supporting portion 334 and the horizontal plane of the lower bending knife 332, the included angle can compensate the rebound angle after bending, thereby ensuring that the bending angle can reach 90 °.
To process the pin end 620, in this embodiment, the upper bending knife 331 is vertically arranged, movably connected to the carrier 310, and reciprocates in the vertical direction in the processing slot 311 to bend the pin end 620; the upper bending knife 331 is provided with four bending grooves, so as to bend four pins of the pin end 620 respectively.
As shown in fig. 8, 14 and 15, in order to further ensure the processing stability of the pin end 620, in this embodiment, the positioning press block 700 is further included and disposed adjacent to the upper bending knife 331, where the positioning press block 700 corresponds to the second supporting portion 334 and extends towards a direction close to the second supporting portion 334, and the extending length is greater than that of the upper bending knife 331, so that the distance between the positioning press block 700 and the second supporting portion 334 is smaller than that between the upper bending knife 331 and the pin end 620, and when the upper bending knife 331 processes the chip 600, the positioning press block 700 can be abutted with a part of the pin end 620 first, so that the fixing reliability of the chip 600 is further ensured, and the movement of the upper bending knife 331 during processing is effectively avoided, thereby effectively improving the bending precision of the chip 600.
Preferably, the extending end of the positioning press block 700 is provided with a pin indentation, and the edge of the pin indentation is provided with a round angle, so that the shearing effect generated by the upper bending knife 331 during pressing down can be avoided.
Because the lengths of the bent lead ends 620 of the chip 600 are different, in this embodiment, the cutting blade 340 is disposed on the side of the lower bending blade 332 away from the chip 600, is disposed perpendicular to the lower bending blade 332, and reciprocates along the horizontal direction of the bottom of the processing slot 311 to cut the redundant leads.
Preferably, as shown in fig. 12, the cutting blade 340 has a first cutting edge 341 and a second cutting edge 342 which are symmetrically arranged, and both can be used alternatively, so that the utilization rate of the cutting blade 340 is effectively improved.
As shown in fig. 1 to 3, in this embodiment, to implement full-process automation of chip 600 processing, the device further includes a blanking mechanism 500 away from the direction of the positioning mechanism 200 with the bending mechanism 300, where the blanking mechanism 500 includes a carrying table 510 and a blanking assembly 520, and the blanking assembly 520 reciprocates between the carrying table 510 and a next working area to transfer the chip 600 on the carrying table 510 to the next working area, thereby implementing full automation of chip 600 loading, bending and blanking, without manual operation, on one hand, effectively saving labor cost, and on the other hand, effectively improving processing efficiency.
The processing flow of the chip pin bending device provided by the embodiment of the invention is that after the device is started, the material storage mechanism 100 operates to enable the chip 600 to be positioned at the outlet of the material winding belt, at the moment, the conveying mechanism 400 is positioned at the initial position, namely, three groups of absorption parts 411 are respectively positioned above the material storage mechanism 100, the positioning mechanism 200 and the bending mechanism 300, then, a first group of absorption parts 411 are started to absorb the chip 600 on the material winding belt, at the moment, if the chip 600 is positioned on the positioning mechanism 200, a second group of absorption parts 411 are synchronously started to absorb the chip 600 on the positioning mechanism 200, if the chip 600 is positioned on the bending mechanism 300, a third group of absorption parts 411 are synchronously started to absorb the chip 600 on the bending mechanism 300, and after the chip 600 is absorbed stably, the transmission assembly 420 drives the three groups of absorption parts 411 to move towards the direction far away from the material storage mechanism 100, so that the absorption assembly 410 is positioned at the movement position, namely, the three groups of absorption parts 411 are respectively positioned above the positioning mechanism 200, the bending mechanism 300 and the blanking mechanism 500, at the moment, the chip 600 on the first group of absorption parts 411 are transferred to the positioning mechanism 200, the chip 600 on the second group of absorption parts 411 are synchronously started, and the chip 600 on the second group of absorption parts are synchronously started to the chip 600 on the lower absorption parts 600, and the chip 600 are transferred to the position of the chip 600 and the lower absorption parts are synchronously transferred to the position 500; then, the first group of adsorbing elements 411 are restarted, the chips 600 adsorbed by the adsorbing elements are placed on the positioning mechanism 200, the second group of adsorbing elements 411 are synchronously restarted, the chips 600 adsorbed by the adsorbing elements are placed in the placing grooves 312 of the bending mechanism 300, the third group of adsorbing elements 411 are synchronously restarted, the chips 600 adsorbed by the adsorbing elements are placed on the bearing table 510, and then the transmission assembly 420 drives the three groups of adsorbing elements 411 to retract to the initial position at the same time, and the chips 600 of the next batch are transferred again, so that the cyclic transfer of the chips 600 is realized.
After the positioning mechanism 200 detects the chip 600, the first pressing member 231 and the second pressing member 232 move towards the direction of the transverse positioning block 221 or the longitudinal positioning block 222, so that the four surfaces of the chip 600 are respectively abutted against the first pressing member 231, the second pressing member 232, the transverse positioning block 221 and the longitudinal positioning block 222, the position of the chip 600 is corrected and positioned, the axis of the adsorption end 610 is aligned with the axis of the second group of adsorption elements 411, the chip 600 sucked by the second group of adsorption elements 411 is positioned at the center of the second group of adsorption elements 411, and the second group of adsorption elements 411 can smoothly place the chip 600 in the placing groove 312 with smaller space on the bending mechanism 300.
After the bending mechanism 300 detects the chip 600, the positioning cylinder 324 drives the first positioning block 321, the second positioning block 322 and the third positioning block 323 to move, and corrects and positions the adsorption end 610, so that the adsorption end 610 is positioned at a processing position, and after that, the upper bending knife 331 descends to press the horizontal pin end 620 downwards, so that the pin end 620 is bent to 90 degrees, and the bending processing of the chip 600 is realized.
It should be noted that the description of the present invention as it relates to "first", "second", "a", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise. The terms "coupled," "secured," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally formed, for example; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
In addition, the technical solutions of the embodiments of the present invention may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present invention.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (10)
1. Chip pin bending equipment for carry out pin bending processing to chip (600), this chip (600) include adsorption terminal (610) and pin end (620), its characterized in that, this chip pin bending equipment includes:
a storage mechanism (100) for placing chips (600) to be processed;
a bending mechanism (300) for bending the lead end (620) of the chip (600);
the positioning mechanism (200) is arranged between the material storage mechanism (100) and the bending mechanism (300) and is used for positioning the chip (600) transferred to the bending mechanism (300);
The conveying mechanism (400) comprises an adsorption assembly (410) and a transmission assembly (420), wherein the adsorption assembly (410) comprises an adsorption part (411), the adsorption part (411) is used for adsorbing or loosening the chip (600), the transmission assembly (420) is respectively adjacent to the storage mechanism (100), the bending mechanism (300) and the positioning mechanism (200), and drives the adsorption assembly (410) to reciprocate along the arrangement direction of the three, and after the chip (600) is placed on the positioning mechanism (200) by the adsorption assembly (410), the positioning mechanism (200) is abutted with the adsorption end (610) so that the axle center of the adsorption end (610) is aligned with the axle center of the adsorption part (411) above the positioning mechanism (200).
2. The die pin bending apparatus according to claim 1, wherein the positioning mechanism (200) includes a base (210), a first positioning component (220) and a pressing component (230), the first positioning component (220) and the pressing component (230) are disposed on the base (210) and enclose an opening-shaped space, the first positioning component (220) includes a transverse positioning block (221) and a longitudinal positioning block (222), the pressing component (230) includes a first pressing member (231) and a second pressing member (232), and the first pressing member (231) and the second pressing member (232) move in directions of the transverse positioning block (221) or the longitudinal positioning block (222), respectively, so as to drive the die (600) to move.
3. The die pin bending apparatus according to claim 2, wherein when the first pressing member (231) and the second pressing member (232) drive the die (600) to move in a direction approaching the lateral positioning block (221) or the longitudinal positioning block (222), and the adsorption end (610) is abutted to the lateral positioning block (221), the longitudinal positioning block (222), the first pressing member (231) and the second pressing member (232), respectively, an axis of the adsorption end (610) is aligned with an axis of the adsorption member (411) above the positioning mechanism (200).
4. The die pin bending apparatus according to claim 2, wherein the positioning mechanism (200) further comprises a first supporting seat (240) and a second supporting seat (250), the first supporting seat (240) is disposed between the base (210) and the first positioning component (220), the second supporting seat (250) is adjacent to the first supporting seat (240), a notch is disposed thereon, the notch comprises a first connecting surface (251) opposite to the transverse positioning block (221), and a second connecting surface (252) opposite to the longitudinal positioning block (222), wherein the first pressing member (231) is disposed on a side of the second supporting seat (250) facing away from the first connecting surface (251), extends towards the first connecting surface (251) and penetrates the first connecting surface (251), and the second pressing member (232) is disposed on a side of the second supporting seat (250) facing away from the second connecting surface (252), extends towards the second connecting surface (252) and penetrates the second connecting surface (252).
5. The die pin bending apparatus according to claim 4, wherein the pressing assembly (230) further comprises a first pressing cylinder (233), a second pressing cylinder (234), a first limiting member (235) and a second limiting member (236) disposed on the base (210), wherein the first pressing cylinder (233) is connected to the first pressing member (231) to drive the first pressing member (231) to move in a direction approaching or separating from the transverse positioning block (221), and the second pressing cylinder (234) is connected to the second pressing member (232) to drive the second pressing member (232) to move in a direction approaching or separating from the longitudinal positioning block (222); the first limiting piece (235) is arranged on one side, far away from the transverse positioning block (221), of the first pressing piece (231) and extends towards the direction facing the base (210) so as to limit the stroke of the first pressing piece (231), and the second limiting piece (236) is arranged on one side, far away from the longitudinal positioning block (222), of the second pressing piece (232) and extends towards the direction facing the base (210) so as to limit the stroke of the second pressing piece (232).
6. The die pin bending apparatus according to claim 2, wherein the suction end (610) of the die (600) includes a first abutment surface (611), a second abutment surface (612), a third abutment surface (613) and a fourth abutment surface (614), the first abutment surface (611) and the second abutment surface (612) are disposed in a vertical direction of the suction end (610) and are disposed opposite to each other, the third abutment surface (613) and the fourth abutment surface (614) are disposed in a horizontal direction of the suction end (610) and are disposed opposite to each other, wherein the first abutment surface (611) abuts against the lateral positioning block (221), the second abutment surface (612) abuts against the first pressing member (231), the third abutment surface (613) abuts against the longitudinal direction (222), and the fourth abutment surface (614) abuts against the second pressing member (232) after the first pressing member (231) and the second pressing member (232) move.
7. The die pin bending apparatus of claim 1, wherein the suction assembly (410) further comprises a support frame (412), a lifting structure, and a driving cylinder (416);
one side of the supporting frame (412) is detachably connected with the adsorption piece (411), and the other side is detachably connected with the lifting structure;
the lifting structure comprises a connecting seat (413), a sliding block (414) and a sliding rail (415), wherein the connecting seat (413) is detachably connected with a transmission assembly (420), the sliding rail (415) is arranged on one side of the connecting seat (413) which is away from the transmission assembly (420) and extends along the vertical direction of the connecting seat (413), one surface of the sliding block (414) is movably connected with the sliding rail (415), and the other surface of the sliding block is detachably connected with a supporting frame (412) so as to drive an absorbing member (411) to reciprocate along the vertical direction;
the driving cylinder (416) is respectively connected with the sliding block (414) and the adsorption piece (411) to drive the sliding block (414) to move along the length direction of the sliding rail (415) and drive the adsorption piece (411) to suck or deflate.
8. The die pin bending apparatus of claim 7, further comprising a blanking mechanism (500) oriented away from the positioning mechanism (200) with respect to the bending mechanism (300), the blanking mechanism (500) including a carrier table (510) and a blanking assembly (520), the blanking assembly (520) being reciprocally movable between the carrier table (510) and a next working area for transferring the die (600) on the carrier table (510) to the next working area.
9. The chip pin bending equipment according to claim 8, wherein three groups of the supporting frames (412) and the adsorbing members (411) are arranged, a connecting plate (417) is arranged between the supporting frames (412) and the lifting structure, one surface of the connecting plate (417) is detachably connected with the three groups of the supporting frames (412) respectively, the other surface of the connecting plate is detachably connected with the sliding block (414), when the adsorbing assembly (410) is at the initial position, the three groups of the adsorbing members (411) are respectively arranged above the material storage mechanism (100), the positioning mechanism (200) and the bending mechanism (300), and when the adsorbing assembly (410) is at the moving position, the three groups of the adsorbing members (411) are respectively arranged above the positioning mechanism (200), the bending mechanism (300) and the blanking mechanism (500) so as to realize synchronous transfer of the multiple chips (600).
10. The die pin bending apparatus of claim 1, wherein the bending mechanism (300) comprises a carrier stage (310), a secondary positioning assembly (320), a bending assembly (330), and a cutting blade (340);
the carrier table (310) is provided with a processing groove (311) and a placing groove (312), wherein the processing groove (311) extends along the vertical direction of the carrier table (310) and penetrates through the carrier table (310) to enable the bending component (330) to extend in, and the placing groove (312) is adjacent to the processing groove (311) and is used for forming a preset position for the chip (600);
The secondary positioning assembly (320) is arranged on one side, far away from the ground, of the carrier table (310) and comprises a first positioning block (321), a second positioning block (322), a third positioning block (323) and a positioning cylinder (324) for driving the first positioning block, the second positioning block (322) and the third positioning block (323), wherein the first positioning block (321), the second positioning block (322) and the third positioning block (323) move towards the side close to the adsorption end (610) and are abutted with three surfaces of the adsorption end (610);
the bending assembly (330) comprises an upper bending cutter (331) and a lower bending cutter (332), the lower bending cutter (332) is arranged below the placing groove (312), the lower bending cutter (332) comprises a first supporting part (333) and a second supporting part (334), and a height difference is formed between the first supporting part (333) and the second supporting part (334); the upper bending knife (331) is movably connected with the carrier table (310) and reciprocates in the vertical direction of the processing groove (311) so as to bend the pin end (620);
the cutting knife (340) is arranged at one side of the lower bending knife (332) away from the chip (600) and is used for cutting redundant pins.
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| CN107052198A (en) * | 2017-06-27 | 2017-08-18 | 耒阳市亚湘电子科技有限公司 | A kind of pin bender |
| CN207043225U (en) * | 2017-06-27 | 2018-02-27 | 耒阳市亚湘电子科技有限公司 | A kind of pin bender |
| CN108704959A (en) * | 2018-06-05 | 2018-10-26 | 江苏杰士德精密工业有限公司 | To carry out the semi-automatic bending equipment of bending to FPC plates |
| CN108687264A (en) * | 2018-08-10 | 2018-10-23 | 重庆市嘉凌新科技有限公司 | A kind of device for bending pins |
| US20220033199A1 (en) * | 2018-09-20 | 2022-02-03 | Trumpf Maschinen Austria Gmbh & Co. Kg. | Automated vacuum gripper and method for securely gripping components |
| CN109954823A (en) * | 2019-04-30 | 2019-07-02 | 苏州英维特精密机械有限公司 | Automatic shearing foot bending equipment |
| CN211103538U (en) * | 2019-08-23 | 2020-07-28 | 广州市易飞科技发展有限公司 | Capacitor lead positioning device |
| CN211803539U (en) * | 2020-01-08 | 2020-10-30 | 武汉艾特艾迪汽车科技有限公司 | Chip pin bending device and chip pin bending machine |
| CN111215557A (en) * | 2020-02-18 | 2020-06-02 | 杭州大轶科技有限公司 | IC chip pin processing equipment and processing method |
| CN211965713U (en) * | 2020-03-31 | 2020-11-20 | 苏州瀚川智能科技股份有限公司 | IC bending mechanism |
| CN114799741A (en) * | 2022-03-30 | 2022-07-29 | 湖南星创智能装备有限公司 | IGBT chip automatically cropped assembly integrative equipment of bending |
| CN115301855A (en) * | 2022-08-12 | 2022-11-08 | 珠海格力电器股份有限公司 | Pin shearing and bending device and working method and production line thereof |
| CN116237441A (en) * | 2023-02-09 | 2023-06-09 | 珠海格力新元电子有限公司 | Automatic pin folding mechanism for chip pins |
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| CN117102385B (en) | 2024-01-12 |
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