CN117063031A - Refrigeration system, rotary joint for refrigeration system, vacuum chamber, substrate processing system and method for cooling vacuum chamber - Google Patents

Refrigeration system, rotary joint for refrigeration system, vacuum chamber, substrate processing system and method for cooling vacuum chamber Download PDF

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Publication number
CN117063031A
CN117063031A CN202180096127.6A CN202180096127A CN117063031A CN 117063031 A CN117063031 A CN 117063031A CN 202180096127 A CN202180096127 A CN 202180096127A CN 117063031 A CN117063031 A CN 117063031A
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China
Prior art keywords
coolant
refrigeration system
vacuum chamber
substrate processing
bushing
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CN202180096127.6A
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Chinese (zh)
Inventor
涂简尼
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Applied Materials Inc
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Applied Materials Inc
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Publication of CN117063031A publication Critical patent/CN117063031A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B41/00—Fluid-circulation arrangements
    • F25B41/40—Fluid line arrangements
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L33/00—Arrangements for connecting hoses to rigid members; Rigid hose connectors, i.e. single members engaging both hoses
    • F16L33/18—Arrangements for connecting hoses to rigid members; Rigid hose connectors, i.e. single members engaging both hoses characterised by the use of additional sealing means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B1/00—Compression machines, plants or systems with non-reversible cycle
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/005—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces in cold rooms
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
    • F25D17/02—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating liquids, e.g. brine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H01J37/32522—Temperature

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A refrigeration system (100), particularly a closed loop refrigeration system for cooling a vacuum chamber of a substrate processing system and/or capturing water vapor and/or other condensable substances, is described. The refrigeration system comprises a heat absorber (110) having a coolant line (113) with a coolant inlet (111) and a coolant outlet (112). The coolant input (111) is connected to a first channel (141) of the rotary joint (140). The coolant output (112) is connected to a second channel (142) of the rotary joint (140). In addition, a vacuum chamber, a substrate processing system, a method of cooling a vacuum chamber (particularly for capturing water vapor and/or other condensable substances), and a rotary joint for a refrigeration system are described.

Description

Refrigeration system, rotary joint for refrigeration system, vacuum chamber, substrate processing system and method for cooling vacuum chamber
Technical Field
Embodiments of the present disclosure relate to refrigeration systems, particularly refrigeration systems for cooling vacuum chambers and/or for capturing condensable substances (e.g., water vapor). In particular, embodiments of the present disclosure relate to a closed loop refrigeration system for cooling a vacuum chamber of a substrate processing system and/or for capturing condensable species, particularly a vacuum processing chamber. Further embodiments of the present disclosure relate to vacuum chambers, substrate processing systems, and methods of cooling vacuum chambers and/or for capturing condensable species.
Background
In many applications, it is desirable to deposit a thin layer on a substrate. The substrate may be coated in one or more chambers of a coating apparatus. The substrate may be coated in vacuum using vapor deposition techniques.
Several methods for depositing material on a substrate are known. For example, the substrate may be coated by a Physical Vapor Deposition (PVD) process, a Chemical Vapor Deposition (CVD) process, or a Plasma Enhanced Chemical Vapor Deposition (PECVD) process, or the like. The process is performed in a processing apparatus or processing chamber in which the substrate to be coated is located. A deposition material is provided in the apparatus. A variety of materials and their oxides, nitrides or carbides may be used for deposition on a substrate. The coating material can be used in several applications and in several technical fields. For example, substrates for displays are often coated by Physical Vapor Deposition (PVD) processes. Further applications include insulating panels, organic Light Emitting Diode (OLED) panels, substrates with Thin Film Transistors (TFTs), color filters or the like.
For PVD processes, the deposited material may be present in the solid phase as a target. Atoms of the target material (i.e., the material to be deposited) are ejected from the target by bombarding the target with energetic particles. Atoms of the target material are deposited on the substrate to be coated.
Typically, material deposition (particularly using PVD) in a vacuum processing chamber is performed at high temperatures. Thus, there is a need to provide a cooling system for a vacuum processing chamber, particularly for capturing water vapor and/or other condensable substances, particularly for processing temperature sensitive substrates.
Disclosure of Invention
In view of the foregoing, a refrigeration system (in particular a closed-loop refrigeration system for cooling a vacuum chamber of a substrate processing system and/or for capturing water vapor and/or other condensable substances), a vacuum chamber, a substrate processing system, a method of cooling a vacuum chamber, and a swivel for a refrigeration system according to the independent claims are provided. Other aspects, advantages and features will be apparent from the dependent claims, the description and the drawings.
According to one aspect of the present disclosure, a refrigeration system is provided. The refrigeration system includes a heat sink. The heat sink includes a coolant conduit. The coolant conduit includes a coolant input and a coolant output. The coolant input is connected to the first passage of the rotary joint. The coolant output is connected to the second passage of the rotary joint.
In accordance with a further aspect of the present disclosure, a closed loop refrigeration system for cooling a vacuum chamber of a substrate processing system is provided. In particular, closed loop refrigeration systems are configured to capture water vapor and/or other condensable substances by freezing the water vapor and/or other condensable substances onto a cold surface cooled by the refrigeration system. The closed-loop refrigeration system comprises a heat absorber, a pressure reducer, a booster and a heat inhibitor. In particular, the heat absorber is an evaporator, the pressure reducer is a metering device or an expansion valve, the booster is a compressor, and the heat blocker is a condenser. In addition, the closed loop refrigeration system includes a swivel joint connecting the coolant piping of the heat absorber to the pressure reducer and the pressure booster.
In accordance with another aspect of the present disclosure, a vacuum chamber for a substrate processing system is provided. The vacuum chamber includes a heat sink of a refrigeration system according to any of the embodiments described herein.
According to a further aspect of the present disclosure, a substrate processing system is provided. The substrate processing system includes a vacuum chamber, a deposition source provided in the vacuum chamber, and a refrigeration system according to any of the embodiments described herein.
According to a further aspect of the present disclosure, a rotary joint for a refrigeration system is provided. The swivel includes a body having a first passage and a second passage. Further, the swivel includes a bushing circumferentially surrounding the body. In addition, the rotary joint includes a first coolant connector and a second coolant connector. The first coolant connector is connected to the liner. The second coolant connector is connected to the body, in particular via a mounting plate. In addition, the swivel joint comprises seals provided at the interface between the first coolant connector and the bushing, at the interface between the bushing and the main body, and at the interface between the second coolant connector and the main body, in particular at the interface between the main body and the mounting plate, and at the interface between the second coolant connector and the mounting plate. At least one of the body, the bushing, the seal and the mounting plate comprises a high and low temperature resistant polymeric material, particularly a polymeric material that is resistant to high and low temperatures in a temperature range of-160 ℃ to +150 ℃.
In accordance with another aspect of the present disclosure, a method of cooling a vacuum chamber of a substrate processing system is provided, particularly for capturing water vapor and/or other condensable species. The method includes using a refrigeration system according to any of the embodiments described herein.
According to yet another aspect of the present disclosure, a method of manufacturing a coated substrate is provided. The method includes using at least one of a refrigeration system according to any of the embodiments described herein, a vacuum chamber according to any of the embodiments described herein, and a substrate processing system according to any of the embodiments described herein.
Embodiments also relate to apparatus for carrying out the disclosed methods and include apparatus parts for performing each of the described method aspects. These method aspects may be performed by hardware components, a computer programmed by suitable software, any combination of the two, or in any other way. Furthermore, embodiments according to the present disclosure also relate to methods for operating the described devices. The method for operating the described device includes method aspects for performing each function of the device.
Drawings
So that the manner in which the above recited features of the present disclosure can be understood in detail, a more particular description of the disclosure, briefly summarized above, may be had by reference to embodiments. The drawings relate to embodiments of the present disclosure and are described below:
FIG. 1 shows a schematic diagram of a refrigeration system according to embodiments described herein;
FIG. 2 shows a schematic diagram of a refrigeration system according to further embodiments described herein;
FIG. 3 shows a schematic diagram of a vacuum chamber provided with a refrigeration system according to embodiments described herein;
FIG. 4 shows a schematic view of a swivel joint for a refrigeration system according to embodiments described herein;
FIG. 5 shows a schematic diagram of a substrate processing system according to embodiments described herein;
FIG. 6 illustrates a block diagram illustrating a method for cooling a vacuum chamber of a substrate processing system, according to embodiments described herein; and
fig. 7 shows a block diagram illustrating a method of manufacturing a coated substrate according to embodiments described herein.
Detailed Description
Reference will now be made in detail to the various embodiments of the disclosure, one or more examples of which are illustrated in the figures. In the following description of the drawings, like reference numerals refer to like parts. Only the differences with respect to the individual embodiments are described. Each example is provided by way of explanation of the disclosure, and is not meant as a limitation of the disclosure. In addition, features illustrated or described as part of one embodiment can be used on or in conjunction with other embodiments to yield yet a further embodiment. The description is intended to include such modifications and variations.
Referring to fig. 1 for exemplary purposes, a refrigeration system 100 according to the present disclosure is described. According to embodiments that may be combined with any of the other embodiments described herein, the refrigeration system 100 includes a heat sink 110. The heat absorber 110 has a coolant pipe 113 having a coolant input 111 and a coolant output 112. As exemplarily shown in fig. 1, the coolant input is connected to a first channel 141 of the rotary joint 140 and the coolant output 112 is connected to a second channel 142 of the rotary joint 140. Typically, the first channel 141 is connected to the coolant input line 114 and the second channel 142 is connected to the coolant output line 115. The coolant input line 114 supplies coolant to the coolant conduit 113. The coolant output line 115 removes coolant from the coolant conduit 113. In other words, the coolant input line 114 is configured to supply coolant to the coolant pipe 113 of the heat absorber 110. Thus, the coolant output line 115 is configured to discharge coolant from the coolant conduit 113 of the heat absorber 110.
Thus, a refrigeration system is provided which advantageously provides the possibility of providing a heat absorber of the refrigeration system in a pivotable door of a vacuum chamber. Accordingly, a closed loop refrigeration system for cooling a vacuum chamber of a substrate processing system that has a more compact design than the prior art, such that space limitations may be advantageously addressed. Additionally, it will be appreciated that embodiments of the refrigeration system as described herein advantageously provide for capturing water vapor and/or other condensable substances, for example by freezing the water vapor and/or other condensable substances onto a cold surface cooled by the refrigeration system.
Further aspects and features of the refrigeration system 100 according to embodiments of the present disclosure are described with exemplary reference to fig. 2 and 3. According to an embodiment, which may be combined with any of the other embodiments described herein, the first channel 141 of the swivel joint 140 is connected to the pressure reducer 120. In particular, the first passage 141 of the swivel joint 140 may be connected to the pressure reducer 120 via the coolant input line 114, as exemplarily shown in fig. 2. For example, the pressure reducer 120 may be a metering device or an expansion valve. Typically, the second passage 142 of the swivel joint 140 is connected to the supercharger 130. In particular, the second passage 142 of the rotary joint 140 may be connected to the supercharger 130 via the coolant output line 115, as exemplarily shown in fig. 2. For example, the supercharger 130 may be a compressor.
According to an embodiment, which may be combined with any of the other embodiments described herein, the first channel 141 of the swivel joint 140 has a first input opening 141a, as exemplarily indicated in fig. 2. In addition, the first passage 141 of the rotary joint 140 has a first output opening 141B. Typically, the first input opening 141A is connected to the coolant input line 114. The first output opening 141B is connected to the coolant input portion 111 of the coolant pipe 113. As exemplarily indicated in fig. 2, the second channel 142 generally has a second input opening 142A and a second output opening 142B. The second input opening 142A is connected to the coolant output 112 of the coolant pipe 113. The second output opening 142B is connected to the coolant output line 115.
As exemplarily shown in fig. 2, a refrigeration system generally in accordance with embodiments described herein is a closed-loop refrigeration system. According to an embodiment, which may be combined with any of the other embodiments described herein, the closed-loop refrigeration system includes a heat absorber 110, a pressure reducer 120, a booster 130, a heat blocker 150, and a rotary joint 140 connecting the heat absorber 110 (particularly the coolant conduit 113 of the heat absorber 110) to the pressure reducer 120 and the booster 130. The heat sink 110 may be an evaporator. The pressure reducer 120 may be a metering device or an expansion valve. The supercharger 130 may be a compressor. The heat blocker 150 may be a condenser.
As exemplarily shown in fig. 2, the second output opening 142B of the second channel 142 of the swivel joint 140 is connected to the supercharger input 131 via the coolant output line 115. The coolant output line 115 may also be referred to as a suction line. The booster input 132 is connected to the heat blocker input 151 of the heat blocker 150 via the first connection line 116. The first connection line 116 may also be referred to as a hot gas line. The heat blocker output 152 of the heat blocker 150 is connected via the second connection line 117 to the pressure reducer input 121 of the pressure reducer 120. The second connecting line 117 may also be referred to as a liquid line. The reducer output 122 of the reducer 120 is connected to a first input opening 141A of a first channel 141 of the swivel joint 140 via the coolant input line 114. The coolant input line 114 may also be referred to as a coolant supply line. The first output opening 141B of the first channel 141 of the swivel joint 140 is connected to the coolant input 111 of the coolant pipe 113 of the heat sink 110. The coolant output 112 of the coolant pipe 113 is connected to the second input opening 142A of the second passage 142 of the rotary joint 140. For better understanding, the direction of flow of the coolant in the refrigeration system is indicated by way of example with arrow F in fig. 2.
Referring illustratively to fig. 3, in accordance with an embodiment that may be combined with any of the other embodiments described herein, the heat sink 110 is provided in a pivotable door 220, particularly a vacuum chamber 210 for a processing system. The swivel joint 140 is connected to a pivotable door 220. In addition, the rotary joint 140 may be installed inside the vacuum chamber 210 (not explicitly shown) or outside the vacuum chamber 210, as schematically shown in fig. 3.
Thus, with exemplary reference to fig. 3, it will be appreciated that in accordance with further aspects of the present disclosure, a vacuum chamber 210 for a substrate processing system is provided, the vacuum chamber 210 being coupled to a refrigeration system 100 in accordance with any of the embodiments described herein. In particular, the vacuum chamber 210 may be coupled to the refrigeration system 100 by providing the vacuum chamber 210 with a heat sink 110 of the refrigeration system 100 according to any of the embodiments described herein. In particular, the heat sink 110 may be provided in a pivotable door 220 of the vacuum chamber 210.
According to embodiments, which may be combined with any of the other embodiments described herein, the vacuum chamber is a vacuum processing chamber for vertical substrate processing. In particular, a vacuum chamber is configured for vertical processing of large area substrates, and in this disclosure, a "vacuum chamber" may be understood as a chamber configured to provide a vacuum within the chamber. Typically, the flexible substrate is transported through a vacuum chamber as described herein. The term "vacuum" as used herein is to be understood as a technical vacuum with a vacuum pressure of less than e.g. 10 mbar. Typically, the pressure in a vacuum chamber as described herein may be at 10 -5 mbar and about 10 -8 Between mbar, more usually at 10 -5 mbar and 10 -7 Between mbar, and even more typically about 10 -6 mbar and about 10 -7 Between mbar.
The term "substrate" as used herein shall particularly include inflexible substrates, e.g. glass plates. The present disclosure is not limited thereto, and the term "substrate" may also include flexible substrates, such as rolls or foils. In addition, a sensitive substrate may be included.
According to some examples, the large area substrate may be GEN 4.5 (corresponding to about 0.67m 2 (0.73x0.92 m)), GEN 5 (corresponding to about 1.4 m) 2 (1.1 m×1.3 m)), GEN 7.5 (corresponding to about 4.29 m) 2 (1.95 m×2.2 m)), GEN 8 (corresponding to about 5.3 m) 2 (2.16 m×2.46 m)), or even GEN 10 (corresponding to about 9.0 m) 2 Is a substrate (2.88 m×3.13 m)). Even larger generations (such as GEN 11, GEN 12 and/or corresponding substrate areas) may be similarly implemented. Thus, a large area substrate can be understood as having a surface area of at least 0.5m 2 In particular at least 1.0m 2 More particularly at least 3.0m 2 Or even 5.0m 2 Or a larger substrate of the surface to be treated.
In this disclosure, "vertical substrate processing" may be understood as substrates that are oriented substantially vertically during processing. The vertical direction corresponds to the direction of gravity. A substrate oriented substantially vertically is understood to be a substrate oriented with a tolerance T with respect to the vertical direction (i.e. the direction of gravity), wherein T is ± 15 °, in particular T ± 10 °, more in particular T ± 5 °, for example T ± 1 °.
Referring to fig. 4 for an exemplary illustration, a swivel joint 140 for a refrigeration system according to the present disclosure is described. According to an embodiment, which may be combined with any of the other embodiments described herein, the swivel joint 140 comprises a body 143 comprising a first channel 141 and a second channel 142. Further, the swivel 140 includes a bushing 144 that circumferentially surrounds the body 143. In addition, the rotary joint 140 includes a first coolant connector 146 and a second coolant connector 147. The first coolant connector 146 is connected to the liner 144. The second coolant connector 147 is connected to the body 143, in particular via a mounting plate 148. Typically, the mounting plate 148 is configured to mount the swivel joint 140 to a pivotable door or vacuum chamber wall. In addition, the rotary joint 140 includes seals 145 provided at the interface between the first coolant connector 146 and the bushing 144, at the interface between the bushing 144 and the body 143, and at the interface between the second coolant connector 147 and the body 143, particularly at the interface between the body 143 and the mounting plate 148, and at the interface between the second coolant connector 147 and the mounting plate 148. At least one of the body 143, the bushing 144, the seal 145, and the mounting plate 148 comprises a polymeric material that is resistant to high and low temperatures. In particular, a substantial portion (i.e., more than 50%) of at least one of the body 143, bushing 144, seal 145, and mounting plate 148 may be made of a polymeric material that is resistant to high and low temperatures. Typically, temperature resistant polymeric materials are resistant to temperatures in the range of from-160 ℃ to +150 ℃.
Thus, the swivel joint according to embodiments described herein advantageously provides the possibility of providing a heat absorber of a refrigeration system, in particular a cryogenic refrigeration system, in a pivotable door of a vacuum chamber. In addition, using the rotary joint 140 according to the described embodiment has the following advantages: compared to the prior art, a refrigeration system with a more compact design can be provided, so that the space limitation problem can be advantageously solved. Furthermore, the rotary joint according to embodiments described herein advantageously provides improved performance compared to the prior art, especially in the temperature range from-160 ℃ to +150 ℃. In addition, rotary joints according to embodiments described herein are particularly suitable for high pressures (e.g., up to 45 bar) as well as low pressures (e.g., vacuum pressures).
According to embodiments that may be combined with any of the other embodiments described herein, at least one of the body 143, the bushing 144, the seal 145, and the mounting plate 148 may be made of a material comprising 50% or more, particularly 70% or more, more particularly 90% or more, or even of a polymeric material that is resistant to high and low temperatures as described herein,
for example, the high and low temperature resistant polymeric material may be selected from the group consisting of Polyimide (PI), polyetheretherketone (PEEK), high Performance Polyamide (HPPA), polyaminodiamine (PAI), and Polytetrafluoroethylene (PTFE).
According to embodiments that may be combined with any of the other embodiments described herein, the first coolant connector 146 includes a first connector conduit 146A and a second connector conduit 146B. As exemplarily shown in fig. 4, the first connector conduit 146A is in fluid communication with the first channel 141 and the second connector conduit 146B is in fluid communication with the second channel 142. Generally, the first connector conduit 146A may be connected to the coolant input line 114 as described herein. As described herein, the second connector conduit 146B may be connected to the coolant output line 115. For example, the first coolant connector 146 may be made of stainless steel. Alternatively, the first coolant connector 146 may be made of a high and low temperature resistant polymeric material as described herein,
according to embodiments that may be combined with any of the other embodiments described herein, the second coolant connector 147 includes a third connector conduit 147A and a fourth connector conduit 147B. As exemplarily shown in fig. 4, the third connector conduit 147A is in fluid communication with the first channel 141 and the fourth connector conduit 147B is in fluid communication with the second channel 142. In general, as described herein, the third connector conduit 147A may be connected to the coolant input 111 of the coolant conduit 113 of the heat sink 110. As described herein, the fourth connector conduit 147B may be connected to the coolant output 112 of the coolant conduit 113 of the heat sink 110. For example, the second coolant connector 147 may be made of stainless steel. Alternatively, the second coolant connector 147 may be made of a high and low temperature resistant polymeric material as described herein.
As exemplarily shown in fig. 4, the rotary joint 140 includes a bushing housing 161 and/or a body housing 162 according to embodiments that may be combined with any of the other embodiments described herein. In particular, the rotary joint 140 may include at least one of a bushing housing 161 that encases (encasing) the bushing 144 and a body housing 162 that encases, at least in part, the body 143. In particular, the bushing housing 161 is configured to provide a first intermediate space 161A between an inner surface of the bushing housing 161 and an outer surface of the bushing 144. For example, the first intermediate space 161A may be provided by providing a recess at the inner surface of the liner housing 161. Similarly, the body housing 162 may be configured to provide a second intermediate space 162A between an inner surface of the body housing 162 and an outer surface of the body 143. For example, the second intermediate space 162A may be provided by providing a recess at the inner surface of the main body case 162. It will be appreciated that typically the first intermediate space 161A and the second intermediate space 162A are void spaces that may be filled with air.
In particular in the temperature range from-160℃to +150℃and/or from about 10℃compared with the prior art -7 Providing a bushing housing 161 and/or a body housing 162 as described herein may be beneficial to improve the performance of the rotary joint 140 when employed in a pressure range of mbar up to 45 bar.
According to an embodiment, which may be combined with any of the other embodiments described herein, at least one of the liner housing 161 and the main body housing 162 includes a high and low temperature resistant polymeric material selected from the group consisting of Polyimide (PI), polyetheretherketone (PEEK), high Performance Polyamide (HPPA), polyaminodiamine (PAI), and Polytetrafluoroethylene (PTFE). In particular, the bushing housing 161 and/or the main body housing 162 may be made of a material comprising 50% or more, particularly 70% or more, more particularly 90% or more, or even be composed of a polymeric material resistant to high and low temperatures as described herein.
Referring illustratively to fig. 4, the bushing 144 includes a first bushing opening 144A and a second bushing opening 144B, according to embodiments that may be combined with any of the other embodiments described herein. The first bushing opening 144A is aligned with the first input opening 141A of the first channel 141. The second bushing opening 144B is aligned with the second output opening 142B of the second channel 142.
As exemplarily shown in fig. 4, the bushing 144 may include a first bushing 144A and a second bushing 144B, i.e., two separate bushings. A first bushing opening 144A may be provided in the first bushing 144C. A second bushing opening 144B may be provided in the second bushing 144D.
Referring exemplarily to fig. 5, a substrate processing system 200 in accordance with the present disclosure is described. According to embodiments that may be combined with other embodiments described herein, the substrate processing system 200 includes a vacuum chamber 210, a deposition source 230 provided in the vacuum chamber 210, and a refrigeration system 100 according to any of the embodiments described herein. Generally, the vacuum chamber 210 and deposition source 230 are configured for vertical large area substrate processing. As schematically illustrated in fig. 5, employing a refrigeration system 100 according to any of the embodiments described herein has the following advantages: the pressure reducer 120, the heat blocker 150, and the booster 130 may be disposed below the vacuum chamber 210. In other words, the pressure reducer 120, the heat blocker 150, and the booster 130 (which together may also be referred to as poly-cold) may be provided at a first level, and the vacuum chamber 210 may be provided at a second level above the first level.
Thus, by providing a substrate processing system 200 having a refrigeration system 100 as described herein, an improved substrate processing system 200 may be provided as compared to the prior art.
According to one example, the deposition source 230 may be a sputter source, particularly for depositing material on a large area substrate. In other words, in general, the deposition source 230 as described herein is configured for coating a large area substrate using sputtering (particularly PVD sputtering).
For example, sputtering may be performed as diode sputtering or as magnetron sputtering. Magnetron sputtering is particularly advantageous because the deposition rate is quite high. By arranging a magnet assembly or magnetron behind the sputtered material of the cathode or sputtering target so as to trap free electrons within a magnetic field created in the immediate vicinity of the target surface, these electrons are forced to move within the magnetic field and cannot escape. This increases the probability of ionizing gas molecules, typically by several orders of magnitude. This in turn greatly increases the deposition rate. For example, in the case of a rotatable sputter target, the rotatable sputter target may have a substantially cylindrical form, and the magnet assembly may be located inside the rotatable cathode or sputter target.
Referring illustratively to the block diagram shown in fig. 6, a method 300 of cooling the vacuum chamber 210 of the substrate processing system 200 according to the present disclosure is described. The method 300 includes using (represented by block 310 in fig. 6) a refrigeration system 100 according to any of the embodiments described herein. It will be appreciated that the cooling method 300 may be used to capture water vapor and/or other condensable substances by freezing the water vapor and/or other condensable substances onto a cold surface cooled by a refrigeration system.
Thus, by using the refrigeration system 100 as described herein, an improved method of cooling a vacuum chamber of a substrate processing system may be provided as compared to the prior art. Additionally, an improved method of capturing water vapor and/or other condensable materials is provided.
Referring illustratively to the block diagram shown in fig. 7, a method 400 of manufacturing a coated substrate in accordance with the present disclosure is described. The method 400 includes using (represented by block 410 in fig. 7) at least one of the refrigeration system 100 according to any embodiment described herein, the vacuum chamber 210 according to any embodiment described herein, the substrate processing system 200 according to any embodiment described herein, and the rotary union 140 according to any embodiment described herein.
According to an embodiment, which may be combined with any of the other embodiments described herein, the method 400 includes coating (represented by block 420 in fig. 7) a substrate, particularly a large area substrate, by using the deposition source 230 as described herein. As an example, coating (represented by block 420 in fig. 7) may include sputtering a conductive or semiconductive material. For example, coating may include sputtering a transparent conductive oxide film onto a substrate as described herein. According to other examples, coating may include sputtering a material like ITO, IZO, IGZO or MoN. In addition, the coating may include sputtering silver (Ag), ag alloys, and/or magnesium (Mg). Further exemplary, the coating may include sputtering a metallic material. Sputtering can therefore be used to deposit electrodes, particularly transparent electrodes in displays, particularly OLED displays, liquid crystal displays and touch screens. In addition, sputtering can be used to deposit electrodes, particularly transparent electrodes in thin film solar cells, photodiodes, and smart or switchable glasses.
It will be appreciated that for coating a substrate, the substrate may be continuously moved past the deposition source during coating ("dynamic coating"). Alternatively, the substrate may remain substantially in a constant position during coating ("static coating"). In addition, substrate scanning or substrate wobbling is also possible. Embodiments described in this disclosure relate to dynamic and static coating processes.
In view of the foregoing, it will be appreciated that embodiments of the present disclosure advantageously provide an improved refrigeration system, particularly an improved closed loop refrigeration system for cooling a vacuum chamber of a substrate processing system and/or capturing condensable species (e.g., water vapor), an improved vacuum chamber for a substrate processing system, an improved rotary joint for a refrigeration system, and an improved method of cooling a vacuum chamber and/or capturing condensable species (e.g., water vapor), as compared to the prior art. In addition, it will be appreciated that a dynamic closed loop refrigeration system is advantageously provided over the prior art, as the use of a rotary joint as described herein has the following advantages: the heat sink may be movable, for example provided in a pivotable door.
While the foregoing is directed to embodiments, other and further embodiments may be devised without departing from the basic scope thereof, and the scope thereof is determined by the claims that follow.

Claims (16)

1. A refrigeration system (100) comprising a heat absorber (110) having a coolant conduit (113), the coolant conduit (113) having a coolant input (111) and a coolant output (112), the coolant input (111) being connected to a first channel (141) of a rotary joint (140) and the coolant output (112) being connected to a second channel (142) of the rotary joint (140).
2. Refrigeration system (100) of claim 1, wherein the first channel (141) is connected to a pressure reducer (120), in particular via a coolant input line (114), and wherein the second channel (142) is connected to a booster (130), in particular via a coolant output line (115).
3. The refrigeration system (100) of claim 2, the first channel (141) having a first input opening (141A) and a first output opening (141B), the second channel (142) having a second input opening (142A) and a second output opening (142B), the first input opening (141A) being connected to the coolant input line (114), the first output opening (141B) being connected to the coolant input (111) of the coolant conduit (113), the second input opening (142A) being connected to the coolant output (112) of the coolant conduit (113), and the second output opening (142B) being connected to the coolant output line (115).
4. A refrigeration system (100) of any of claims 1 to 3, wherein the heat sink (110) is provided in a pivotable door (220) and the swivel joint (140) is connected to the pivotable door (220).
5. The refrigeration system (100) of claim 4, wherein the pivotable door (220) is a door of a vacuum chamber (210), in particular a door of a substrate processing system (200).
6. A closed loop refrigeration system for cooling a vacuum chamber (210) of a substrate processing system (200), particularly for capturing water vapor and/or other condensable substances, comprising:
-a heat absorber (110), in particular an evaporator;
-a pressure reducer (120), in particular a metering device or an expansion valve;
-a supercharger (130), in particular a compressor;
-a heat blocker (150), in particular a condenser; and
-a swivel joint (140) connecting a coolant conduit (113) of the heat absorber (110) to the pressure reducer (120) and the booster (130).
7. A vacuum chamber (210) for a substrate processing system (200), the vacuum chamber coupled to the refrigeration system (100) of any of claims 1-6.
8. The vacuum chamber (210) of claim 7, which is a vacuum processing chamber for vertical substrate processing, in particular large area substrate processing.
9. A substrate processing system (200), comprising:
-a vacuum chamber (210);
-a deposition source (230) provided in the vacuum chamber; and
-a refrigeration system (100) according to any of claims 1 to 6.
10. The substrate processing system (200) of claim 9, wherein the vacuum chamber (210) and the deposition source (230) are configured for vertical large area substrate processing.
11. A swivel joint (140) for a refrigeration system (100), comprising:
-a body (143) comprising a first channel (141) and a second channel (142);
-a bushing (144) circumferentially surrounding the body (143);
-a first coolant connector (146) connected to the bushing (144);
-a second coolant connector (147) connected to the body (143), in particular via a mounting plate (148); and
-a seal (145) provided at the interface between the first coolant connector (146) and the bushing (144), at the interface between the bushing (144) and the main body (143), at the interface between the second coolant connector (147) and the main body (143), in particular at the interface between the main body (143) and the mounting plate (148) and at the interface between the second coolant connector (147) and the mounting plate (148), wherein at least one of the main body (143), the bushing (144), the seal (145) and the mounting plate (148) comprises a high and low temperature resistant polymeric material, in particular the polymeric material resistant to high and low temperatures in a temperature range from-160 ℃ to +150 ℃.
12. The rotary joint (140) of claim 11, wherein the high and low temperature resistant polymeric material is selected from the group consisting of Polyimide (PI), polyetheretherketone (PEEK), high Performance Polyamide (HPPA), polyaminodiamine (PAI), and Polytetrafluoroethylene (PTFE).
13. The rotary joint (140) of claim 11 or 12, further comprising at least one of a bushing housing (161) encasing the bushing (144) and a body housing (162) at least partially encasing the body (143), in particular the bushing housing (161) being configured to provide a first intermediate space (161A) between an inner surface of the bushing housing (161) and an outer surface of the bushing (144), and in particular the body housing (162) being configured to provide a second intermediate space (162A) between an inner surface of the body housing (162) and an outer surface of the body (143).
14. The rotary joint (140) of claim 13, wherein at least one of the bushing housing (161) and the main body housing (162) comprises a high temperature and low temperature resistant polymeric material selected from the group consisting of Polyimide (PI), polyetheretherketone (PEEK), high Performance Polyamide (HPPA), polyaminodiamine (PAI), and Polytetrafluoroethylene (PTFE).
15. A method (300) of cooling a vacuum chamber (210) of a substrate processing system (200), in particular for capturing water vapor and/or other condensable substances, comprising using (310) a refrigeration system (100) according to any of claims 1 to 6.
16. A method (400) of manufacturing a coated substrate using the refrigeration system (100) of any of claims 1 to 6; the vacuum chamber (210) of claim 7 or 8; the substrate processing system (200) of claim 9 or 10, and at least one of the rotary joint (140) of any of claims 11 to 14.
CN202180096127.6A 2021-03-26 2021-03-26 Refrigeration system, rotary joint for refrigeration system, vacuum chamber, substrate processing system and method for cooling vacuum chamber Pending CN117063031A (en)

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