CN117059600A

CN117059600A - Substrate, packaging structure and electronic equipment

Info

Publication number: CN117059600A
Application number: CN202210488039.7A
Authority: CN
Inventors: 姚骋; 蒋帆; 吴艳红; 杨敏; 林永嘉
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2022-05-06
Filing date: 2022-05-06
Publication date: 2023-11-14
Also published as: WO2023213195A1

Abstract

The embodiment of the application provides a substrate, a packaging structure and electronic equipment. According to the substrate provided by the embodiment of the application, as the inductor is arranged in the groove of the substrate, the inductor is closer to the bonding pad for connecting the chip, so that the connecting line between the inductor and the bonding pad is shorter, and the eddy current loss of the connecting line between the inductor and the bonding pad is less; in addition, the structure of placing the inductor in the groove in the substrate can fully utilize the space in the substrate, reduce the use of the surface area of the substrate and reduce the packaging size to a certain extent.

Description

Substrate, packaging structure and electronic equipment

Technical Field

The present application relates to electronic manufacturing technology, and more particularly, to a substrate, a package structure, and an electronic device.

Background

Fig. 1 is a schematic diagram of a chip package structure including a chip 11, a package substrate 12, a printed circuit board (Printed Circuit Board, PCB) 13, and an inductor 14. It can be seen that: the chip 11 is packaged on the first surface of the packaging substrate 12, the PCB13 is arranged on the second surface of the packaging substrate 12, and the first surface and the second surface are arranged opposite to each other; the inductor 14 is disposed on a surface of the package substrate 12 remote from the chip 11.

The inductor 14 is disposed on the surface of the package substrate 12, and the inductor 12 needs to be connected to the metal wiring of the metal wiring layer inside the package substrate 12 by way of routing outside the package substrate 12, and then connected to the pins of the chip through the metal wiring and the bonding pads of the metal wiring layer. In the connection process, the wiring is longer, so that the eddy current loss on the wiring is larger and the board surface space is occupied.

Disclosure of Invention

The embodiment provides a substrate, a packaging structure and electronic equipment, so as to solve the problem of the existing packaging structure.

The first aspect of the embodiment of the application provides a substrate, on which a plurality of metal wiring layers and a dielectric layer filled between the metal wiring layers are arranged; the substrate is also provided with a groove, an inductor is accommodated in the groove, a first end of the inductor is connected to a first bonding pad of one surface of the substrate, a second end of the inductor is connected to a second bonding pad of one surface of the substrate, and the first bonding pad and the second bonding pad are positioned on the surface of the same side of the substrate or on the surfaces of two sides of the substrate respectively.

In the implementation mode, the inductor is arranged in the groove of the substrate, and the inductor is closer to the bonding pad for connecting the chip, so that the connecting line between the inductor and the bonding pad is shorter, and the eddy current loss of the connecting line between the inductor and the bonding pad is less; in addition, the structure of placing the inductor in the groove in the substrate can fully utilize the space in the substrate, reduce the use of the surface area of the substrate and reduce the packaging size to a certain extent.

With reference to the first implementation manner of the first aspect, the plurality of metal wiring layers includes a first metal wiring layer and/or a second metal wiring layer; a first end of the inductor is connected to the first pad by a metal wire in the first metal wire layer, and/or a second end of the inductor is connected to the second pad by a metal wire in the second metal wire layer; the first metal wiring layer and the second metal wiring layer are the same layer or different layers.

With reference to the second implementation manner of the first aspect, the inductor includes a magnetic pillar and a conductive core perpendicular to the plurality of metal wiring layers; the magnetic column is arranged in the groove, and the conductive core is wrapped in the magnetic column; one end of the conductive core is connected to a first end of the inductor and the other end of the conductive core is connected to a second end of the inductor.

With reference to the third implementation manner of the first aspect, the slot includes a first slot and a second slot, the inductor includes a magnetic pillar perpendicular to the plurality of metal wiring layers and a conductive core, the magnetic pillar includes a first magnetic pillar disposed in the first slot and a second magnetic pillar disposed in the second slot, and the conductive core includes a first conductive core and a second conductive core;

the first magnetic column is wrapped with the first conductive core, the second magnetic column is wrapped with the second conductive core, one end of the first conductive core is connected to the first end of the inductor, the other end of the first conductive core is connected to one end of the second conductive core, and the other end of the second conductive core is connected to the second end of the inductor.

With reference to the fourth implementation manner of the first aspect, the inductor includes a magnetic pillar and a conductive core perpendicular to the metal wiring layer, and the conductive core includes a first conductive core and a second conductive core;

the magnetic pillar wraps the first conductive core and the second conductive core, one end of the first conductive core is connected to the first end of the inductor, the other end of the first conductive core is connected to one end of the second conductive core, and the other end of the second conductive core is connected to the second end of the inductor.

With reference to the fifth implementation manner of the first aspect, the magnetic pillar is provided with a first through hole in a direction perpendicular to the metal wiring layer, and the conductive core includes a first conductive layer attached to an inner wall of the first through hole.

With reference to the sixth implementation manner of the first aspect, the inductor further includes a filling pillar; the filling column is buried in the second through hole, and the second through hole is a through hole surrounded by the first conductive layer.

In this implementation mode, the filling column is buried in the second through hole, and the filling column plays the effect of supporting, so that the overall structure stability of the inductor can be ensured, and then the structural stability of the substrate can be ensured.

With reference to the seventh implementation manner of the first aspect, the packing column is prepared from a packing slurry, and the packing slurry at least comprises one or a mixture of a conductive material and a non-conductive material.

In this implementation, when the filling paste includes a conductive material, the prepared filling column has a lower resistivity, and the corresponding inductor has a lower resistivity.

With reference to the eighth implementation manner of the first aspect, the magnetic pillar is prepared from a magnetic composite slurry, and the magnetic composite slurry includes a soft magnetic material, a resin material and a curing agent.

In this implementation, the magnetic composite paste includes a soft magnetic material, and the addition of the soft magnetic material can multiply the inductance of the inductor.

With reference to the ninth implementation manner of the first aspect, the soft magnetic material includes at least one or a mixture of ferrite magnetic powder and iron-based magnetic powder.

In this implementation, when the soft magnetic material comprises ferrite magnetic powder, since the ferrite magnetic powder has a higher resistivity, under a certain voltage, less current passes through the ferrite magnetic powder, and the corresponding ferrite magnetic powder generates less eddy current loss, the lower the loss of the inductor made of the ferrite magnetic powder.

With reference to the tenth implementation manner of the first aspect, the iron-based magnetic powder includes at least one or a mixture of several of a crystalline iron-based magnetic powder and an amorphous nano iron-based magnetic powder.

In this implementation manner, when the soft magnetic material includes a crystalline iron-based magnetic powder, the amorphous nano iron-based magnetic powder has better corrosion resistance, better wear resistance, higher strength, higher hardness and toughness, higher resistivity, higher Bs and other properties due to the irregular arrangement of atoms of the amorphous nano iron-based magnetic powder, the amorphous structure without periodicity and grain boundaries, and therefore, the inductor prepared from the amorphous nano iron-based magnetic powder has better corrosion resistance, better wear resistance, higher strength, higher hardness and toughness, higher Bs, lower magnetic loss and other properties.

With reference to the eleventh implementation manner of the first aspect, the resin material includes a thermosetting resin;

alternatively, the resin material includes a thermosetting resin and a thermoplastic resin.

In the implementation mode, when the resin material comprises thermosetting resin, the thermosetting resin is heated to generate chemical change, gradually hardened and molded, and is not softened after being heated again, so that the magnetic column prepared from the thermosetting resin can still keep a stable structure after being heated again. When the resin material includes a thermosetting resin and a thermoplastic resin, the thermoplastic resin may be, but is not limited to, one or more of polyethylene, polypropylene, polyamide, polyurethane; because the thermoplastic resin is simple and convenient to process and mold and has good mechanical properties, the magnetic column prepared from the thermoplastic resin and the thermosetting resin can be ensured to have good mechanical properties and structural stability.

A second aspect of an embodiment of the present application provides a package structure, including: a package substrate and a chip disposed on the package substrate; the substrate, the first bonding pad and/or the second bonding pad are/is welded on the surface of the substrate.

A third aspect of the embodiment of the application provides an electronic device, which comprises a PCB and a packaging structure arranged on the PCB, wherein the PCB is welded with the packaging structure through a welding assembly; the packaging structure comprises the packaging structure provided by the embodiment of the application; and/or the PCB comprises the substrate provided by the embodiment of the application, and the packaging structure is welded with the first bonding pad and/or the second bonding pad on the surface of the substrate.

Drawings

FIG. 1 is a schematic diagram of a package structure;

FIG. 2 provides a structure of a multi-layered substrate;

FIG. 3 is a cross-sectional view of a substrate provided in one possible embodiment;

FIG. 4a is a cross-sectional view of a substrate provided in one possible embodiment;

FIG. 4b is a bottom view of the substrate provided in FIG. 4 a;

FIG. 5 is a cross-sectional view of a substrate provided in one possible embodiment;

FIG. 6 is a cross-sectional view of a substrate provided in one possible embodiment;

fig. 7 is a perspective view of a pillar inductor provided in one possible embodiment;

fig. 8 is a perspective view of a U-shaped inductor provided in one possible embodiment;

fig. 9 is a perspective view of a U-shaped inductor provided in one possible embodiment;

fig. 10 is a perspective view of a multiphase inductor provided in one possible embodiment;

FIG. 11 is a cross-sectional view of a substrate provided in one possible embodiment;

FIG. 12 is a cross-sectional view of a substrate provided in one possible embodiment;

FIG. 13 is a flowchart of a substrate preparation method according to one possible embodiment;

FIG. 14 is a flowchart of a method for manufacturing an inductor according to one possible embodiment;

FIG. 15 is a cross-sectional view of a magnetic pillar provided in one possible embodiment;

FIG. 16 is a cross-sectional view of a magnetic pillar with a first via provided in one possible embodiment;

FIG. 17 is a cross-sectional view of a conductive core and magnet pillar assembly provided in one possible embodiment;

fig. 18 is a cross-sectional view of an inductor provided in one possible embodiment;

fig. 19 is a flowchart of a method for manufacturing an inductor according to another possible embodiment;

FIG. 20 is a cross-sectional view of a first conductive layer and a magnetic pillar assembly according to one possible embodiment;

FIG. 21 is a cross-sectional view of a first conductive layer, support posts and magnetic pillar assembly according to one possible embodiment;

FIG. 22 is a cross-sectional view of an inductor provided in one possible embodiment;

fig. 23 is a flowchart of a method for manufacturing an inductor according to another possible embodiment;

FIG. 24 is a cross-sectional view of an assembly of magnetic pillars and insulating layers according to one possible embodiment;

FIG. 25 is a cross-sectional view of an assembly of magnetic pillars and insulating layers according to one possible embodiment;

FIG. 26 is a cross-sectional view of an assembly of a conductive core, a magnetic pillar, and an insulating layer according to one possible embodiment;

FIG. 27 is a cross-sectional view of an assembly of a conductive core, a second conductive layer, a third conductive layer, a magnetic pillar, and an insulating layer according to one possible embodiment;

FIG. 28a is a top view of an assembly of a conductive core, a second conductive layer, a third conductive layer, a conductive sheet, a magnetic pillar, and an insulating layer according to one possible embodiment;

FIG. 28b is a cross-sectional view of an assembly of a conductive core, a second conductive layer, a third conductive layer, a conductive sheet, a magnetic pillar, and an insulating layer on the AA' side according to one possible embodiment;

FIG. 29 is a cross-sectional view of a package structure according to one possible embodiment;

FIG. 30 is a cross-sectional view of an electronic device provided in one possible embodiment;

FIG. 31 is a cross-sectional view of an electronic device according to one possible embodiment;

fig. 32 is a cross-sectional view of an electronic device provided in a possible embodiment.

Detailed Description

The technical scheme in the present embodiment will be described with reference to the drawings in the present embodiment. In the description of the present embodiment, unless otherwise indicated, "/" indicates that the related objects are an "or" relationship, for example: A/B may represent A or B; the "and/or" in the present embodiment is merely an association relationship describing the association object, and means that three relationships may exist, for example: a and/or B may represent: there are three cases, a alone, a and B together, and B alone, wherein a, B may be singular or plural. Also, in the description of the present embodiment, unless otherwise specified, "a plurality" means two or more than two. "at least one of" or the like means any combination of these items, including any combination of single item(s) or plural items(s). For example: at least one of a, b, or c(s) may represent: a, b, c, a-b, a-c, b-c, or a-b-c, wherein a, b, c may be single or plural. In addition, in order to clearly describe the technical solution of the present embodiment, in the embodiment of the present embodiment, the words "first", "second", and the like are used to distinguish the same item or similar items having substantially the same function and effect. It will be appreciated by those of skill in the art that the words "first," "second," and the like do not limit the amount and order of execution, and that the words "first," "second," and the like do not necessarily differ. Meanwhile, in the present embodiment, words such as "exemplary" or "such as" are used to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g." is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion that may be readily understood.

In the present application, unless explicitly specified and limited otherwise, the term "coupled" may be used in a manner that enables electrical connection for signal transmission, and "coupled" may be used in a manner that is either direct or indirect via an intermediary.

First, the structure of the substrate in the embodiment of the present application is described as follows:

referring to fig. 2, fig. 2 provides a structure of a multilayer substrate, which includes a plurality of stacked metal wiring layers 21 (or circuit layers), wherein an insulating medium 22 (for example, a resin material, which may also be referred to as a dielectric layer in this embodiment) is disposed between two adjacent metal wiring layers, and as shown in fig. 2, 5 metal wiring layers are included from the P-plane to the B-plane. And the different metal wiring layers are electrically connected by vias 23 (via). Vias (via) are formed by drilling holes in a substrate and then plating a layer of conductive material (e.g., copper) on the surface of the drilled holes so that current can flow between two metal wiring layers connected by the via. In addition, as shown in fig. 2, the via hole (via) includes a through hole (plating through hole, PTH) penetrating the substrate, a Blind Via (BVH) with both ends buried inside the substrate, and a Buried Via (BVH) with one end exposed to the substrate surface. Wherein the drilling of through holes is generally required to punch through the substrate, the through holes are used for connecting two metal wiring layers (for example, the metal wiring layer 21a and the metal wiring layer 21b in fig. 2) of the outermost layer of the substrate. The blind holes are usually drilled from one side of the substrate and are used to connect an outermost metal wiring layer of the substrate to an inner metal wiring layer (e.g., metal wiring layer 21a and metal wiring layer 21c in fig. 2) without drilling through the substrate. The buried holes are usually drilled inside the substrate, and the buried holes are usually drilled in the insulating medium where the buried holes are to be provided in the insulating medium bonding process, and the buried holes are used to connect the metal wiring layers (for example, the metal wiring layer 21a and the metal wiring layer 21b in fig. 2) of the two inner layers of the substrate. Of course, the method is not limited to through holes, blind holes or buried holes according to practical requirements. Of course, the substrate shown in fig. 2 includes, but is not limited to, a PCB, a package substrate for a chip. It should be noted that, in the case where the package substrate includes a substrate, the dielectric layer may also be referred to as a core layer, and the metal wiring layer may also be referred to as an build-up layer.

Taking a package substrate of a chip as an example, the package substrate can generally provide functions of electrical connection, protection, support and the like for the chip. For example, the leads of the chip may be connected to the inductor through pads on the surface of the package substrate, and metal wirings of the metal wiring layer 21. The inductor is usually disposed on the surface of the package substrate, and the inductor needs to be connected to the metal wiring of the metal wiring layer by way of wiring outside the package substrate, and then connected to the pins of the chip through the metal wiring and the bonding pads of the metal wiring layer. In the connection process, the wiring is longer, so that the eddy current loss on the wiring is larger and the board surface space is occupied.

In order to solve the technical problem, the substrate provided by the embodiment of the application is internally provided with a groove for accommodating the inductor. In the embodiment of the application, the groove in the substrate can penetrate through the through hole of the substrate, or can not penetrate through the blind hole or the buried hole of the substrate. The embodiment of the application does not specifically limit the shape of the groove, and the shape of the groove can be set according to actual requirements. For example: in some possible implementations, the slot may be a cylinder with a circular cross-section. In some possible implementations, the slot may be a cylinder with a racetrack cross-section. In some possible implementations, the slot may be a cylinder that is square in cross-section. In this embodiment, the inductor is accommodated in the groove.

The connection modes of the devices of the substrate provided by the embodiment of the application are described below with reference to the specific drawings.

Fig. 3 is a cross-sectional view of a substrate provided with a plurality of metal wiring layers 21 and a dielectric layer 22 filled between the metal wiring layers according to one possible embodiment. Grooves are provided in the direction of the substrate perpendicular to the multilayer metal wiring layer 21. In this embodiment, the slot is a cylindrical through hole, which penetrates the entire substrate. An inductor 24 is housed within the tank. The first end of the inductor 24 is connected to a first pad 25a of a surface of the substrate and the second end of the inductor 24 is connected to a second pad 25b of a surface of the substrate. In this embodiment, the first pads 25a and the second pads 25b are located on the surfaces of different sides of the substrate.

It is noted that electrodes may be fabricated at both ends of the inductor during actual application. In the embodiment of the present application, in an application scenario where electrodes are fabricated at two ends of an inductor, the electrodes at two ends of the inductor may be metal electrodes or bonding pads in the same layer as a metal wiring layer, and in the substrate provided in fig. 3, the electrodes at two ends of the inductor may be a first bonding pad and a second bonding pad. In some possible embodiments, the first pad and/or the second pad may be co-layer with the metal wiring layer of the outermost layer of the substrate.

In some possible implementations, the slot may be a buried via with one end buried inside the substrate, one end exposed to the substrate surface, an inductor buried inside the slot, one end buried inside the substrate, and one end exposed to the substrate surface. Referring specifically to fig. 4a and 4b, fig. 4a is a cross-sectional view of a substrate provided in one possible embodiment, and fig. 4b is a bottom view of the substrate provided in fig. 4 a. The inductor 24 is seen embedded in the slot with one end embedded inside the substrate and one end exposed to the substrate surface. The end of the inductor 24 exposed to the substrate surface may be directly connected to the first pad 25 a. The electrode embedded in one end of the substrate of the inductor 24 is in the same layer as the metal wiring layer 21a, one end of the metal wiring in the metal wiring layer 21a is connected with one end of the metal wiring in the metal wiring layer 21b through the guide hole 23, the other end of the metal wiring in the metal wiring layer 21b is connected with the second bonding pad 25b, and further, the connection between the end embedded in the substrate of the inductor 24 and the second bonding pad 25b is realized.

In some possible implementations, the slot may be a blind hole with both ends buried inside the substrate, an inductor buried inside the slot, and both ends buried inside the substrate. Specifically, referring to fig. 5, the electrode at one end of the inductor 24 may be in the same layer as the metal wiring layer 21a, one end of the metal wiring in the metal wiring layer 21a is connected to one end of the metal wiring in the metal wiring layer 21b through the via hole 23a, and the other end of the metal wiring in the metal wiring layer 21b is connected to the first pad 25a, so that the electrode at one end of the inductor 24 is connected to the first pad 25 a. The electrode at the other end of the inductor 24 is in the same layer as the metal wiring layer 21c, one end of the metal wiring in the metal wiring layer 21c is connected to one end of the metal wiring in the metal wiring layer 21d through the via hole 23b, and the other end of the metal wiring in the metal wiring layer 21d is connected to the second pad 25b, thereby realizing connection of the other end of the inductor 24 to the second pad 25 b. In this embodiment, the first pad 25a and the second pad 25b are located on different sides of the substrate.

Fig. 3-5 are merely illustrative of the several first and second pads on either side of a substrate, and in some possible embodiments the first and second pads are on the same side of the substrate. The substrate structure in which the first pad and the second pad are located on the same side will be described with reference to the accompanying drawings.

Fig. 6 is a cross-sectional view of a substrate provided in one possible embodiment. In this embodiment, the grooves may be blind holes with both ends buried inside the substrate. An inductor 24 is housed within the tank. One end of the inductor 24 is in the same layer as the metal wiring layer 21a, one end of the metal wiring in the metal wiring layer 21a is connected to one end of the metal wiring in the metal wiring layer 21b through the via hole 23a, and the other end of the metal wiring in the metal wiring layer 21b is connected to the first pad 25a, thereby realizing connection of one end of the inductor 24 to the first pad 25 a. The electrode at the other end of the inductor 24 is in the same layer as the metal wiring layer 21c, one end of the metal wiring in the metal wiring layer 21c is connected to one end of the metal wiring in the metal wiring layer 21d through the via hole 23b, and the other end of the metal wiring in the metal wiring layer 21d is connected to the second pad 25b, thereby realizing connection of the other end of the inductor 24 to the second pad 25 b.

The embodiment of the application does not limit the type of the inductor, for example: in some feasible implementations, the inductor may be an air inductor (air core inductor, ACI). Since the inductor may function to block the variation of the current, the inductor may be configured in the power supply to achieve the filtering effect. Along with the evolution of the power supply, the electric energy conversion efficiency of the required power supply is continuously improved, the power supply area is continuously reduced, and the corresponding required inductor can realize the characteristic of high inductance under the condition of small volume. Since the addition of soft magnetic material within the inductor can multiply the inductance, in order to meet the above requirements, in some possible implementations the inductor may be a magneto-electric sensor with soft magnetic material added, the inductors appearing in the embodiments described below are magneto-electric sensors. The soft magnetic material in the embodiment of the application is a soft magnetic material in ferromagnetic materials.

The shape of the inductor is not limited in the embodiments of the present application, for example: in some possible implementations, the inductor may be a pillar inductor, and fig. 7 is a perspective view of a pillar inductor provided in one possible embodiment. It can be seen that the columnar inductor 24 includes: the magnetic pillar 241, a conductive core 242 penetrating the magnetic pillar 241 in a longitudinal direction (a direction perpendicular to the multilayer metal wiring layers in this embodiment), and electrodes 243a and 243b provided at both ends of the conductive core 242. When the electrode of the inductor is located at the outermost surface of the substrate, the electrode may be directly multiplexed as a pad. In general, the electrode 243a and the electrode 243b on both sides of the columnar inductor may be connected to pads on different sides of the substrate. In some possible embodiments, the electrode 243a and the electrode 243b on both sides of the columnar inductor may also be connected to pads on different sides of the substrate by metal wiring and via 23 in metal wiring layer 21.

In some possible implementations, the inductor may be a U-shaped inductor. Fig. 8 is a perspective view of a U-shaped inductor provided in one possible embodiment. It can be seen that the U-shaped inductor may comprise: a magnetic pillar 241a, a magnetic pillar 241b, a conductive core 242a penetrating the magnetic pillar 241a longitudinally, and a conductive core 242b penetrating the magnetic pillar 241b longitudinally, an electrode 243a provided at one end of the conductive core 242a and an electrode 243b provided at one end of the conductive core 242b at the first side of the magnetic pillar 241a and the magnetic pillar 241 b; on the second side of the magnetic pillars 241a and 241b, an electrode 243c disposed at one end of the conductive core 242a and an electrode 243d disposed at one end of the conductive core 242 b. Wherein electrode 243c and electrode 243d are conductive. In general, electrodes 243c and 243d of such an inductor may be soldered to devices on the same side of the substrate. For example, the electrode 243c and the electrode 243d of the U-shaped inductor are disposed on the side facing the substrate, and then the electrode 243c and the electrode 243d are connected to the pads on the same side of the substrate, for example, the electrode 243c and the electrode 243d of the inductor are disposed on the side facing the chip and connected to the pads disposed on the side facing the chip.

Fig. 9 is a perspective view of a U-shaped inductor provided in one possible embodiment, and it can be seen that the inductor includes: a magnetic pillar 241 longitudinally penetrating the conductive core 242a and the conductive core 242b of the magnetic pillar 241, an electrode 243a disposed at one end of the conductive core 242a and an electrode 243b disposed at one end of the conductive core 242b at a first side of the magnetic pillar 241; on the second side of the magnetic pillar 241, an electrode 243c disposed at one end of the conductive core 242a and an electrode 243d disposed at one end of the conductive core 242 b; wherein electrode 243c and electrode 243d are conductive. In general, electrodes 243c and 243d of such an inductor may be soldered to devices on the same side of the substrate. For example, the electrode 243c and the electrode 243d of the inductor are provided on the side facing the chip, and are connected to pads provided on the side facing the chip.

Fig. 7-9 are merely exemplary illustrations of several single-phase inductors. In the embodiment of the application, the inductor may further comprise a multiphase inductor, and the structure of the multiphase inductor is described below with reference to the specific drawings.

Fig. 10 is a perspective view of a multi-phase inductor provided in a feasible embodiment, and it can be seen that the multi-phase inductor can include two single-phase inductors 24-1 and 24-2, wherein the structure of the single-phase inductors 24-1 and 24-2 and the connection relationship between the components can refer to the U-shaped inductor provided in fig. 9, and the embodiments of the present application are not repeated.

It should be noted that fig. 10 is merely an exemplary description of a dual-phase inductor, and the number of phases of the inductor may be set according to the requirement in the practical application process, which is too much limited in the embodiments of the present application.

In the embodiment of the application, the magnetic column is prepared by filling a groove with magnetic composite slurry and curing the magnetic composite slurry, wherein the magnetic composite slurry comprises a soft magnetic material, a resin material and a curing agent. Under the condition of current flow, the magnetic inductor can greatly increase the inductance of the inductor due to the high magnetic permeability of the soft magnetic material.

The magnetic column preparation material is described below.

Wherein:

the soft magnetic material is composed of ferromagnetic substance or ferrimagnetic substance, and has corresponding magnetization intensity or magnetic induction intensity under the action of external magnetic field, and can increase inductance of inductor by adding into inductor.

In the practical application process, the soft magnetic material can generate magnetic loss; the magnetic loss refers to the phenomenon that the work done by the outside on the soft magnetic material is converted into heat in the magnetization or reverse magnetization process. The magnetic loss includes hysteresis magnetic loss and eddy current magnetic loss. The greater the magnetic loss of a soft magnetic material, the higher the loss of an inductor containing the soft magnetic material, resulting in lower power conversion efficiency for a power supply using the inductor;

in view of reducing eddy current loss of the soft magnetic material, it is useful to produce a low-loss inductor. As a possible implementation, the soft magnetic material may be ferrite magnetic powder; the ferrite magnetic powder can be ferrite material, and the ferrite material can be one or a mixture of a plurality of manganese zinc ferrite, nickel zinc ferrite and ferromanganese ferrite. Since the losses of soft magnetic material result on the one hand from eddy current losses, which means that the conductor generates heat and energy losses when it is moved in a non-uniform magnetic field or in a time-varying magnetic field. Since ferrite magnetic powder has a higher resistivity, under a certain voltage, less current passes through the ferrite magnetic powder, and the corresponding ferrite magnetic powder generates less eddy current loss, the lower the loss of an inductor made of the ferrite magnetic powder.

It is contemplated to prepare an inductor of higher inductance. As a possible implementation, the soft magnetic material may be an iron-based magnetic powder, wherein the iron-based magnetic powder may be a crystalline iron-based magnetic powder, which may be, but is not limited to, one or a mixture of carbonyl iron, feSi, feSiCr, feNi, feNiMo. The iron-based magnetic powder has higher saturation magnetic induction, wherein the saturation magnetic induction refers to the magnetic induction when the soft magnetic material is magnetized to saturation and can be represented by Bs; since the higher the saturation induction, the higher the permeability and the higher the inductance, the inductor containing the iron-based magnetic powder has a higher inductance.

As a possible implementation, an amorphous nano-iron-based magnetic powder may be used as the iron-based magnetic powder. In terms of magnetic physics, the amorphous nano iron-based magnetic powder has the advantages of irregular atomic arrangement, no periodical and crystal grain boundary amorphous structure, better corrosion resistance, better wear resistance, higher strength, higher hardness and toughness, higher resistivity, higher Bs and the like, so that the inductor prepared from the amorphous nano iron-based magnetic powder has the advantages of better corrosion resistance, better wear resistance, higher strength, higher hardness and toughness, higher Bs, lower magnetic loss and the like. Furthermore, the eddy current loss can be reduced by reducing the particle size of the amorphous nano iron-based magnetic powder, so that the magnetic loss is smaller in a high-frequency application scene, and the inductor of the amorphous nano iron-based magnetic powder can be applied to the high-frequency application scene.

In an embodiment of the application, the soft magnetic material comprises one or more of an iron-based magnetic powder, and/or one or more of a ferrite magnetic powder. Wherein the iron-based magnetic powder comprises one or more of crystalline iron-based magnetic powder and/or one or more of amorphous nano-iron-based magnetic powder.

The resin material is an organic substance which is solid, medium solid, pseudo solid or liquid at normal temperature and which melts to have fluidity at high temperature. At high temperature, the melted resin material can be mixed with the soft magnetic material, and the mixture has fluidity, so that the mixture can be poured into a cavity with rated properties; the mixture can be given a specific shape (i.e., a magnetic pillar having a specific shape) after the curing reaction. Considering the structural stability of the magnetic column, as a feasible implementation manner, the resin material at least comprises thermosetting resin, wherein the thermosetting resin can be one or a mixture of several of polyester resin, epoxy resin, phenolic resin and organic silicon resin; the thermosetting resin is heated to produce chemical change, and the thermosetting resin is hardened and formed gradually and is not softened after being heated, so that the magnetic column prepared from the thermosetting resin can still maintain a stable structure after being heated again. Considering the mechanical properties of the magnetic column, as one possible implementation, the resin material may include a thermosetting resin and a thermoplastic resin, and the thermoplastic resin may be, but is not limited to, one or a mixture of several of polyethylene, polypropylene, polyamide, polyurethane; because the thermoplastic resin is simple and convenient to process and mold and has good mechanical properties, the magnetic column prepared from the thermoplastic resin and the thermosetting resin can be ensured to have good mechanical properties and structural stability.

Curing agents are a class of substances or mixtures that enhance the curing reaction. As a possible implementation, the curing agent may comprise one or a mixture of several of imidazole, anhydride, amine.

The magnetic pillar structure is described below: the shape of the magnetic column is not limited in the embodiment of the application, and the shape of the magnetic column can be set according to requirements, for example: in some possible implementations, the magnetic pillar may be a pillar having a circular radial cross-section; in some possible implementations, the magnetic pillars may be racetrack-shaped pillars in radial cross section; in some possible implementations, the magnetic pillars may be cylinders with square radial cross-sections. The magnetic column is longitudinally provided with a first through hole for accommodating the conductive core.

In the embodiment of the application, the conductive core refers to a structure with small resistivity and easy current conduction. The structure of the conductive core is described below:

in an embodiment of the present application, the conductive core may be a solid conductive post, for example: in some possible implementations, the conductive core may be a conductive post shaped to fit the first via; the conductive core may be a conductive layer such as: in some possible implementations, the conductive core may be a conductive layer attached to the inner wall of the first via (for the purpose of distinguishing from other conductive layers, in embodiments of the present application, the conductive layer attached to the inner wall of the first via may be referred to as a first conductive layer).

The following describes the material of the conductive core: when the conductive core is a conductive column, the embodiment of the application does not limit the material of the conductive column, and any material which has small resistivity and is easy to conduct current can be used as the material for preparing the conductive column; for example: the material from which the conductive pillars are made may be metal. In some possible implementations, the conductive pillars may be made of silver, considering that inductors with a relatively low resistivity are made; since silver has a low resistivity, conductive pillars made of silver have a low resistivity, and inductors including silver pillars may have a low resistivity. In some feasible implementations, the preparation material of the conductive column may be copper, and since copper has lower resistivity and lower cost, the resistivity and the cost of the copper column prepared by the method can be considered, and the resistivity and the cost of the inductor comprising the copper column can be considered. As a feasible implementation manner, the conductive core may be a pure substance, i.e. pure silver or pure copper, etc., and the metal core of the pure substance is added by way of insertion; as a possible implementation, the conductive core may also be prepared from a metal paste, for example: copper paste or silver paste. In the embodiment of the application, the metal paste can contain metal powder and other substances, the other substances can comprise resin and the like, the metal paste can be poured into the first through hole, and the conductive core is obtained after the metal paste is solidified.

When the conductive core includes the first conductive layer, the material of the first conductive layer is not limited in the embodiment of the present application, and any material having a small resistivity and being easy to conduct current can be used as the material of the first conductive layer in the embodiment of the present application; for example: the material of the first conductive layer may be a metal. In some possible implementations, the material of the first conductive layer may be silver, considering that inductors with a relatively low resistivity are produced; since silver has a low resistivity, the first conductive layer made of silver may have a low resistivity, and application of the first conductive layer to the inductor may cause the inductor to have a low resistivity. Considering that the prepared inductor can have both resistivity and cost, in some possible implementations, the material of the first conductive layer may be copper, and since copper has lower resistivity and lower cost, the application of the first conductive layer to the inductor can make the inductor have both resistivity and cost.

When the conductive core comprises a first conductive layer, the inductor may further comprise support posts in some possible embodiments in order to obtain a structurally stable inductor. The support column is buried in the second through hole of the first conductive layer surrounding city, and the support column plays a role in supporting the first conductive layer, so that the overall structure of the inductor is stable, wherein the material of the first conductive layer can be referred to the above embodiment. The preparation materials of the packed column (the preparation materials of the packed column may also be referred to as packing slurry in the embodiments of the present application) are not limited in the embodiments of the present application. For example: in some possible implementations, the filler paste may be a non-conductive material, which may be, but is not limited to, a resin. In view of the low resistivity inductor being produced, as one possible implementation, the filler paste may be a conductive material, which may be, but is not limited to, a metal paste, for example, a silver paste or a copper paste.

In some possible embodiments the substrate may have a U-shaped inductor housed therein. The structure of the substrate accommodating the U-shaped inductor will be described with reference to the accompanying drawings.

Fig. 11 is a cross-sectional view of a substrate provided in one possible embodiment. In this embodiment, a first groove and a second groove are provided in the substrate. The U-shaped inductor 24 includes a magnetic pillar 241a (the inside of the magnetic pillar 241a is provided with a first through hole penetrating longitudinally, the magnetic pillar 241a is accommodated in the first groove), a magnetic pillar 241b (the inside of the magnetic pillar 241b is provided with a first through hole penetrating longitudinally, the magnetic pillar 241a is accommodated in the second groove), a first conductive layer 242a attached to the first through hole inside the magnetic pillar 241b, and a first conductive layer 242b attached to the first through hole inside the magnetic pillar 241 b. Wherein one end of the first conductive layer 242a and one end of the first conductive layer 242b are connected by metal wiring in the metal wiring layer 21 e. The electrode at the other end of the first conductive layer 242a is in the same layer as the metal wiring layer 21a, one end of the metal wiring in the metal wiring layer 21a is connected to one end of the metal wiring in the metal wiring layer 21b through the via hole 23a, the other end of the metal wiring in the metal wiring layer 21b is connected to the first pad 25a, and further, the connection between the other end of the first conductive layer 242a and the first pad 25a is realized. The other end of the first conductive layer 242b is in the same layer as the metal wiring layer 21c, one end of the metal wiring in the metal wiring layer 21c is connected to one end of the metal wiring in the metal wiring layer 21d through the via hole 23b, the other end of the metal wiring in the metal wiring layer 21d is connected to the second pad 25b, and further, the connection between the other end of the first conductive layer 242b and the second pad 25b is achieved.

Fig. 12 is a cross-sectional view of a substrate provided in one possible embodiment. In this embodiment, the U-shaped inductor 24 is accommodated in the substrate. The U-shaped inductor 24 includes a magnetic pillar 241 (two first through holes are provided inside), a first conductive layer 242a attached to an inner wall of one of the first through holes, and a first conductive layer 242b attached to an inner wall of the other first through hole. Wherein one end of the first conductive layer 242a and one end of the first conductive layer 242b are connected by metal wiring in the metal wiring layer 21 e. The electrode at the other end of the first conductive layer 242a is in the same layer as the metal wiring layer 21a, one end of the metal wiring in the metal wiring layer 21a is connected to one end of the metal wiring in the metal wiring layer 21b through the via hole 23a, the other end of the metal wiring in the metal wiring layer 21b is connected to the first pad 25a, and further, the connection between the other end of the first conductive layer 242a and the first pad 25a is realized. The other end of the first conductive layer 242b is in the same layer as the metal wiring layer 21c, one end of the metal wiring in the metal wiring layer 21c is connected to one end of the metal wiring in the metal wiring layer 21d through the via hole 23b, the other end of the metal wiring in the metal wiring layer 21d is connected to the second pad 25b, and further, the connection between the other end of the first conductive layer 242b and the second pad 25b is achieved.

Fig. 7-12 are merely exemplary illustrations of several ways of connecting devices on a substrate, and the way of connecting the devices may be adjusted as desired during actual application.

The substrate provided by the embodiment of the application is provided with a plurality of metal wiring layers and a dielectric layer filled between the metal wiring layers; the substrate is also provided with a slot in which an inductor is received, a first end of the inductor being connected to a first pad of a surface of the substrate, and a second end of the inductor being connected to a second pad of a surface of the substrate. According to the substrate provided by the embodiment of the application, as the inductor is arranged in the groove of the substrate, the inductor is closer to the bonding pad for connecting the chip, so that the connecting line between the inductor and the bonding pad is shorter, and the eddy current loss of the connecting line between the inductor and the bonding pad is less; in addition, the structure of placing the inductor in the groove in the substrate can fully utilize the space in the substrate, reduce the use of the surface area of the substrate and reduce the packaging size to a certain extent.

The second aspect of the embodiment of the present application provides a method for manufacturing a substrate, which is described below with reference to the specific drawings:

Fig. 13 is a flowchart of a substrate preparation method according to a feasible embodiment, where the substrate preparation method includes S131 to S132:

s131, forming a groove in the substrate;

there are various implementations of forming the grooves on the substrate. For example: in some possible implementations, holes may be formed in the substrate by laser drilling; in some possible implementations, a via-shaped slot may be formed in the substrate by mechanical drilling. It should be noted that the embodiments of the present application are merely exemplary of two implementations of forming the grooves on the substrate, and in practical application, the implementations of forming the grooves on the substrate may be, but are not limited to, the two implementations, and the applicant does not limit the present application too much.

S132, embedding an inductor in the groove;

there are various implementations of embedding inductors in a trench. For example: in some possible implementations, the inductor may be prepared in advance and then placed directly in the tank. In some possible implementations, the inductor may be fabricated within the tank.

The process of preparing an inductor in a tank is described below with reference to specific drawings. Fig. 14 is a flowchart of a method for manufacturing an inductor according to a feasible embodiment, where the method for manufacturing an inductor in a slot longitudinally arranged on a substrate is provided in fig. 14, and the method for manufacturing an inductor includes steps S141 to S144:

S141, adding the magnetic composite slurry into the tank, and forming a magnetic column after curing reaction;

FIG. 15 is a cross-sectional view of a magnetic pillar provided in one possible embodiment; in this embodiment, the magnetic pillar 241 is cylindrical in shape.

In the embodiment of the application, the magnetic column is prepared from a magnetic composite slurry, and the magnetic composite slurry comprises a soft magnetic material, a resin material and a curing agent. The preparation process of the magnetic column can be to add the magnetic composite slurry into the holes, and then heat up to 100-200 ℃ to solidify the magnetic composite slurry to obtain the magnetic column.

In an embodiment of the application, the magnetic composite slurry comprises a soft magnetic material, a resin material and a curing agent.

Considering that the inductor with high and low inductance loss is prepared, as a feasible implementation manner, ferrite magnetic powder can be adopted as the soft magnetic material; considering the preparation of an inductor with a higher inductance, as a possible implementation, the soft magnetic material may be an iron-based magnetic powder, wherein the iron-based magnetic powder may be a crystalline iron-based magnetic powder, which may be one or a mixture of several of carbonyl iron and FeSi, feSiCr, feNi, feNiMo. Considering that the prepared inductor has the properties of better corrosion resistance, better wear resistance, higher strength, higher hardness and toughness, higher Bs, lower magnetic loss and the like, as a feasible implementation mode, the soft magnetic material can be amorphous nano iron-based magnetic powder.

The resin material, considering the structural stability of the magnetic column, may comprise a thermosetting resin, which may comprise one or a mixture of several of polyester resin, epoxy resin, phenolic resin, and silicone resin, as one possible implementation. Considering the mechanical properties of the magnetic column, as one possible implementation, the resin material may include a thermosetting resin and a thermoplastic resin, and the thermoplastic resin may include one or a mixture of several of polyethylene, polypropylene, polyamide, polyurethane.

S142, forming a first through hole in the longitudinal direction of the magnetic column;

FIG. 16 is a cross-sectional view of a magnetic pillar with a first via provided in one possible embodiment; it can be seen that the magnetic pillar 241 has a first through hole 241-1 in the longitudinal direction.

There are various implementations of forming the first through hole in the longitudinal direction of the magnetic pillar. For example: in some possible implementations, the first through hole may be formed in the longitudinal direction of the magnetic pillar by laser drilling. In some possible implementations, the first through hole may be formed in the longitudinal direction of the magnetic pillar by mechanical drilling. It should be noted that the embodiments of the present application are merely illustrative of two implementations of forming the first through hole in the longitudinal direction of the magnetic pillar, and in practical applications, the implementations of forming the first through hole in the longitudinal direction of the magnetic pillar may be, but are not limited to, the two implementations described above, where the applicant does not make any excessive limitation.

S143, pouring conductive materials into the first through holes, and curing to obtain conductive cores;

FIG. 17 is a cross-sectional view of a conductive core and magnet pillar assembly provided in one possible embodiment; it can be seen that the conductive core 242 longitudinally extends through the magnetic pillar 241.

The non-conductive material is limited, and any material with small resistivity and easy current conduction can be used as the conductive material in the embodiment of the application; in some possible implementations, the conductive material may be silver, considering that inductors with a relatively low resistivity are produced. In some possible implementations, the conductive material may be copper, considering that the prepared inductor combines resistivity and cost.

S144 form electrodes at both ends of the conductive core, respectively.

Fig. 18 is a cross-sectional view of an inductor provided in one possible embodiment; as can be seen, the inductor comprises: a magnetic pillar 241, a conductive core 242 longitudinally penetrating the magnetic pillar 241, and a pair of electrodes 243a and 243b disposed at both ends of the conductive core 242.

The implementation of forming the electrodes at both ends of the conductive core may be a conventional electrode preparation method in the art, and the applicant does not make any limitation here.

When the inductance is an inductance in a buried hole on the substrate, the electrode may be formed simultaneously with the metal wiring of the metal wiring layer of the layer in the substrate forming process.

When the inductor is an inductor in a blind hole on the substrate, the electrode at one end is made simultaneously with the metal wiring of the metal wiring layer at the layer, and the electrode at the other end is made simultaneously with the metal wiring of the metal wiring layer at the layer as a bonding pad;

when the inductance is an inductance in a via hole on the substrate, the electrode may be fabricated for the pad simultaneously with the metal wiring of the metal wiring layer of the layer.

Fig. 19 is a flowchart of a method for manufacturing an inductor according to another possible embodiment, where the method for manufacturing an inductor in a groove of a substrate is provided in fig. 19, and the method for manufacturing an inductor includes: s191 to S195;

s191, adding the magnetic composite slurry into the groove, and forming a magnetic column after curing reaction;

the process of forming the magnetic pillar may refer to the above embodiment.

S192 forming a first through hole in the longitudinal direction of the magnetic pillar;

the process of forming the first through hole may refer to the above embodiment.

S193 forms a first conductive layer on an inner wall of the first via hole.

FIG. 20 is a cross-sectional view of a first conductive layer and a magnetic pillar assembly according to one possible embodiment; it can be seen that the first conductive layer 242 is attached to the inner wall of the first via hole within the magnetic pillar 241.

The first conductive layer may be formed on the inner wall of the first via hole by electroplating, which is conventionally used in the art. For example: physical vapor deposition (physical vapor deposition, PVD), electroless plating, electroplating, and the like.

In the embodiment of the application, the preparation material of the first conductive layer is a conductive material, the embodiment of the application does not limit the conductive material, and any material which has small resistivity and is easy to conduct current can be used as the preparation material of the first conductive layer in the embodiment of the application; in view of the fabrication of inductors with relatively low resistivity, in some possible implementations, the fabrication material of the first conductive layer may include silver. In some possible implementations, the first conductive layer may be made of a material including copper, considering that the manufactured inductor combines both resistivity and cost.

Considering that the inductor with stable structure is manufactured, as an alternative implementation manner, the support column can be manufactured in the second through hole surrounded by the first conductive layer, so as to improve the stability of the inductor. Specifically, with continued reference to fig. 19, the manufacturing process of the inductor further includes:

and S194, adding filling slurry into the second through holes surrounded by the first conductive layer, and curing the filling slurry to obtain the support columns.

FIG. 21 is a cross-sectional view of a first conductive layer, support posts and magnetic pillar assembly according to one possible embodiment; it can be seen that the support posts 244 are disposed within the second through holes surrounded by the first conductive layer 242, and that the first conductive layer 242 is attached to the inner walls of the first through holes of the magnetic posts 241.

In some possible implementations, the filler paste may be a non-conductive material, which may be, but is not limited to, a resin. In view of the low resistivity inductor being produced, as one possible implementation, the filler paste may be a conductive material, which may be, but is not limited to, a metal paste, such as: the metal paste may be silver paste or copper paste.

S195 electrodes are formed at both ends of the first conductive layer, respectively.

FIG. 22 is a cross-sectional view of an inductor provided in one possible embodiment; as can be seen, the inductor comprises: a magnetic pillar 241, a first conductive layer 242 longitudinally penetrating the magnetic pillar, a support post 244 longitudinally penetrating the first conductive layer 242 of the magnetic pillar, and a pair of electrodes 243a and 243b disposed at both ends of the conductive core; a pair of electrodes 243a and 243b are connected to the first conductive layer 242, respectively.

Optionally, forming a first through hole in a longitudinal direction of the magnetic pillar includes: two first through holes are formed in the longitudinal direction of the magnetic column; the electrodes of the conductive cores buried in the two first through holes are conducted on the first side of the substrate, and the electrodes of the conductive cores are not conducted on the second side of the substrate.

Fig. 23 is a flowchart of a method for manufacturing an inductor according to another possible embodiment, where the method for manufacturing an inductor in a substrate groove is provided in fig. 23, and the method for manufacturing an inductor includes: S231-S235;

the substrate is provided with a plurality of metal wiring layers and a dielectric layer filled between the metal wiring layers; the trench may be a through hole penetrating the entire substrate, or may be a through hole penetrating at least one insulating layer or a buried hole. The process of preparing the inductor in the trench is described below by taking the trench through an insulating layer as an example.

S231, adding the magnetic composite slurry into the tank, and forming a magnetic column after curing reaction;

the process of forming the magnetic pillar may refer to the above embodiment.

FIG. 24 is a cross-sectional view of an assembly of magnetic pillars and insulating layers according to one possible embodiment; it can be seen that the magnetic pillars 241 are filled in the slots of the insulating layer 22.

S232, manufacturing two first through holes in the longitudinal direction of the magnetic column;

FIG. 25 is a cross-sectional view of an assembly of magnetic pillars and insulating layers according to one possible embodiment; it can be seen that there are two first through holes 241-1a and 241-1b on the magnetic pillar 241.

S233 fills the conductive core in the first via.

FIG. 26 is a cross-sectional view of an assembly of a conductive core, a magnetic pillar, and an insulating layer according to one possible embodiment; it can be seen that the conductive core 242a is filled in the first through hole 241-1a, and the conductive core 242b is filled in the first through hole 241-1 b.

The process of filling the conductive core in the first through hole can be referred to the above embodiment.

S234, forming a second conductive layer on one surface of the insulating layer and forming a third conductive layer on the other surface of the insulating layer;

FIG. 27 is a cross-sectional view of an assembly of a conductive core, a second conductive layer, a third conductive layer, a magnetic pillar, and an insulating layer according to one possible embodiment; it can be seen that the insulating layer 22 has one surface formed with the second conductive layer 245 and the other surface formed with the third conductive layer 246. The second conductive layer 245 communicates with the conductive cores 242a and 242b on one side of the insulating layer 22, and the third conductive layer 246 communicates with the conductive cores 242a and 242b on the other side of the insulating layer 22.

The second conductive layer may be formed on the surface of the insulating layer by electroplating, which is conventionally used in the art. For example: physical vapor deposition (physical vapor deposition, PVD), electroless plating, electroplating, and the like.

The third conductive layer may be formed on the surface of the substrate by electroplating, which is commonly used in the art. For example: physical vapor deposition (physical vapor deposition, PVD), electroless plating, electroplating, and the like.

S235 forms two conductive sheets (pads) at the target position of the third conductive layer.

The target position is a position where the conductive core is contacted with the third conductive layer, and the diameter of the conductive sheet is larger than that of the conductive core. Two conductive sheets are connected to the conductive cores 242a and 242b, respectively, and are separated from each other to realize electrode non-conduction at one side of the substrates of the conductive cores 242a and 232 b. In this embodiment, the conductive sheet is one form of the inductor electrode, and thus the electrode of the inductor mentioned in the above embodiment may also be a conductive sheet.

FIG. 28a is a top view of an assembly of a conductive core, a second conductive layer, a third conductive layer, a conductive sheet, a magnetic pillar, and an insulating layer according to one possible embodiment; FIG. 28b is a cross-sectional view of an assembly of a conductive core, a second conductive layer, a third conductive layer, a conductive sheet, a magnetic pillar, and an insulating layer on the AA' side according to one possible embodiment; it can be seen that conductive sheet 247a communicates with conductive core 242a and conductive sheet 247b communicates with conductive core 242 b. The conductive sheet 247a and the conductive sheet 247b are isolated from each other. Conductive pads 247a and 247b may be connected to pads on the substrate surface.

The substrate obtained by the preparation method of the substrate provided by the embodiment of the application comprises a plurality of metal wiring layers and a dielectric layer filled between the metal wiring layers; the substrate is also provided with a slot in which an inductor is received, a first end of the inductor being connected to a first pad of a surface of the substrate, and a second end of the inductor being connected to a second pad of a surface of the substrate. According to the prepared substrate, the inductor is arranged in the groove of the substrate, and the inductor is close to the bonding pad for connecting the chip, so that the connecting line between the inductor and the bonding pad is short, and the eddy current loss of the connecting line between the inductor and the bonding pad is low; in addition, the structure of placing the inductor in the groove in the substrate can fully utilize the space in the substrate, reduce the use of the surface area of the substrate and reduce the packaging size to a certain extent.

A second aspect of the present application provides a package structure, specifically referring to fig. 29, the package structure includes: a package substrate 2 and a chip 3 disposed on the package substrate 2; the package substrate 2 includes the substrate provided by the embodiment of the present application, the chip 3 is soldered to the first bonding pad and/or the second bonding pad on the surface of the substrate.

In a third aspect of the present application, fig. 30 is a cross-sectional view of an electronic device according to a possible embodiment, where the electronic device includes a PCB4 and a package structure 5, and the PCB4 and the package structure 5 are soldered by a soldering assembly. The package structure 5 includes a package substrate 2 and a chip 3, where the package substrate 2 includes a substrate provided by the embodiment of the present application, and the chip 3 is soldered to a first pad and/or a second pad on a surface of the substrate.

Fig. 31 is a cross-sectional view of an electronic device according to a possible embodiment, where the electronic device includes a PCB4 and a package structure 5, and the PCB4 includes a substrate according to an embodiment of the present application. The package structure 5 is soldered to the first pads, and/or the second pads, of the surface of the PCB 4.

Fig. 32 is a cross-sectional view of an electronic device according to a possible embodiment, the electronic device including a PCB4 and a package structure 5 disposed on the PCB4, the PCB4 including a substrate according to an embodiment of the present application; the package structure 5 comprises a package substrate 2 and a chip 3, wherein the package substrate 2 comprises the substrate provided by the embodiment of the application, and the chip 3 is welded with a first bonding pad and/or a second bonding pad on the surface of the package substrate 2.

The technical scheme provided by the embodiment of the application is described below with reference to specific embodiments:

example 1:

drilling two round holes on the PCB, wherein the size of the round holes is 0.5mm, the center distance of the round holes is 0.6mm, the thickness of the PCB is 1.5mm, filling the magnetic composite slurry into the round holes, scraping the magnetic composite slurry protruding out of the PCB, and then solidifying; the soft magnetic material of the magnetic composite slurry is amorphous FeSiB magnetic powder 80wt.%, D50=5um, D90=9um; 20wt.% MnZn ferrite soft magnetic material, d50=1um, d90=3um; the resin material is bisphenol A epoxy resin, and the curing agent is acid anhydride curing agent; the soft magnetic material accounts for 85% of the magnetic composite sizing agent; the viscosity of the magnetic composite slurry is 100Pas (5 rpm); curing temperature is 150 ℃ and curing time is 90min; drilling the center of the magnetic column, wherein the diameter of the drilling is 0.15mm; electroplating a 30um copper layer on the surface of the magnetic column by using a copper deposition electroplating process, filling holes on the inner side of the copper layer in a straight insertion mode (Plating Through Hole, PTH) by using hole plugging resin, solidifying and leveling the resin after filling, and forming two non-conductive round holes on the surface of one magnetic column by exposure and development, wherein the two magnetic columns on the other side are conductive copper layers; forming a U-shaped inductor.

Example 2:

drilling a runway-shaped structure on the packaging substrate, wherein the width is 0.35mm, the total length is 1.0mm, the thickness of the packaging substrate is 1.0mm, filling the magnetic composite slurry into the holes of the runway-shaped structure, scraping the magnetic composite slurry protruding out of the packaging substrate, and then solidifying; the soft magnetic material of the magnetic composite slurry is selected from 50wt.% of nanocrystalline FeSiBCuNb soft magnetic material, D50=8um and D90=15um; 30wt.% Mn ferrite soft magnetic material, d50=0.5 um, d90=1 um; carbonyl iron powder D20wt.%, d50=2um, d90=4um; the resin material is polyethylene resin 50 wt%, epoxy resin 50 wt%, and the curing agent is imidazole curing agent; the soft magnetic material accounts for 90% of the total weight of the magnetic composite sizing agent; the viscosity of the magnetic composite slurry is 150Pas (5 rpm); curing temperature is 180 ℃ and curing time is 30min; drilling holes with the diameter of 0.2mm at the centers of two sides of the magnetic column; electroplating a layer of copper layer of 10um on the surface of the magnetic column by utilizing a copper deposition electroplating process, filling PTH holes on the inner side of copper by utilizing silver paste, solidifying and leveling the silver paste after filling, and forming two non-conductive round holes on the surface of one magnetic column by exposure and development, wherein the two magnetic columns on the other side are conductive copper layers; forming a U-shaped inductor.

Example 3:

drilling a square structure on the packaging substrate, wherein the side length is 0.8mm, the thickness of the packaging substrate is 1.2mm, filling the magnetic composite slurry into the square holes, scraping the magnetic composite slurry protruding out of the packaging substrate, and then solidifying; the soft magnetic material of the magnetic composite slurry is amorphous FeSiBCrC soft magnetic material with 90wt.%, D50=2um, D90=6um; 10wt.% of the NiZn ferrite soft magnetic material, d50=0.7um, d90=2um; the resin material is 10wt.% phenolic resin, 90wt.% epoxy resin and the curing agent is a diethylenetriamine curing agent; the soft magnetic material accounts for 80% of the total weight of the magnetic composite sizing agent; the viscosity of the magnetic composite slurry is 50Pas (5 rpm); curing temperature is 120 ℃ and curing time is 60min; drilling holes at the centers of four corners of the magnetic column, wherein the diameter of the holes is 0.15mm; sputtering a layer of copper on the surface of the magnetic column by PVD, forming a layer of 15um thick copper layer on the surface of the magnetic column by copper deposition electroplating process, filling PTH holes on the inner side of the copper layer by using hole plugging resin, curing and leveling the resin after filling, forming four non-conductive round holes on the surface of one side of the magnetic column by exposure and development, wherein the magnetic columns on two adjacent sides of the other side are conductive copper layers; two U-shaped inductors are formed.

Example 4:

two round holes are drilled on the glass packaging substrate with the copper-clad layers on the two sides, the size of the round holes is 0.3m, the center distance of the round holes is 0.4mm, the thickness of the packaging substrate is 0.8mm, the magnetic composite slurry is filled into the round holes, solidification is carried out, and the magnetic composite slurry protruding out of the packaging substrate is scraped to be flat; the soft magnetic material of the magnetic composite slurry is FeSiCr soft magnetic material of 30wt.%, D50=3um, D90=6um; 20wt.% MnZn ferrite soft magnetic material, d50=3um, d90=6um; 40wt.% FeNiMo soft magnetic material, d50=10um, d90=22um; feSi soft magnetic material 10wt.%, d50=6um, d90=14um; 30wt.% of a resin material polypropylene, 40wt.% of a polyester resin, 30wt.% of a silicone resin and an anhydride curing agent; the mass of the soft magnetic material accounts for 87% of the total mass of the magnetic composite sizing agent; the viscosity of the magnetic composite slurry is 200Pas (5 rpm); curing temperature is 100 ℃ and curing time is 120min; drilling the center of the magnetic column, wherein the diameter of the drilling hole is 0.1mm; electroplating an 8um copper layer on the surface of the magnetic column by utilizing a copper deposition electroplating process, filling PTH holes on the inner side of the copper layer by utilizing hole filling resin, curing and leveling the resin after filling, and forming two non-conductive pads on the surface of one magnetic column by exposure and development, wherein the two magnetic columns on the other side are conductive copper layers; forming a U-shaped inductor.

Example 5:

two round holes are drilled on the glass packaging substrate with the copper-clad layers on the two sides, the size of the round holes is 0.4m, the center distance of the round holes is 0.6mm, the thickness of the packaging substrate is 1.2mm, the magnetic composite slurry is filled into the round holes, solidification is carried out, and the magnetic composite slurry protruding out of the packaging substrate is scraped to be flat; the soft magnetic material of the magnetic composite slurry is Mn ferrite soft magnetic material, D50=2um, D90=5um; epoxy resin as resin material and acid anhydride as curing agent; the mass of the soft magnetic material accounts for 89% of the total mass of the magnetic composite sizing agent; magnetic composite slurry viscosity 70Pas (5 rpm); curing temperature is 180 ℃ and curing time is 80min; drilling the center of the magnetic column, wherein the diameter of the drilling hole is 0.175mm; filling silver paste into a drilled hole, curing for 90min at 180 ℃, leveling the silver paste after curing, electroplating a copper layer on the surface of a packaging substrate, forming two non-conductive round holes on the surface of one magnetic column through exposure and development, wherein the two magnetic columns on the other side are communicated copper layers; forming a U-shaped inductor.

The magnetic composite slurries of examples 1-5 were each tested for saturation induction (saturation magnetic induction, which may be denoted as Bs) and magnetic induction (magnetic flux density, which may be denoted as B) at a frequency of 80 MHz. The loss angles of the magnetic composite slurries of examples 1-5 were then calculated, respectively, wherein loss angle = B/Bs, and the results obtained can be seen in table 1.

TABLE 1

80MHz	Bs	B	Loss angle tan delta
				Example 1	7	0.203	0.029
Example 2	10.5	0.473	0.045
				Example 3	5.8	0.11	0.019
Example 4	12	0.696	0.058
				Example 5	5.5	0.06	0.011

The inductor inductances, Q values, ac resistivities, and dc resistivities of examples 1-5 were tested at a frequency of 80MHz, respectively, and the results obtained can be seen in table 2.

TABLE 2

The magnetic composite slurry provided by the embodiment of the application has the performance advantages of high magnetic induction intensity, magnetic induction intensity B and low loss angle. The inductor prepared from the magnetic composite slurry has the advantages of higher inductance, higher Q value, lower alternating current resistivity, lower direct current resistivity and lower inductance loss. The inductor is applied to the power supply, so that the electric energy conversion efficiency of the power supply can be improved.

Since the inductor may enable high inductance characteristics in a small volume, the inductor may be suitable for use with wearable devices, handheld personal communication system units, portable data units (such as personal digital assistants), navigation devices, set top boxes, music players, video players, entertainment units, fixed location data units (such as meter reading equipment), communication devices, smart phones, tablet computers, or any other device that stores or retrieves data or computer instructions, or any combination thereof.

One or more of the packaging structures, steps, features, and/or functions illustrated in the embodiments of the present application can be rearranged and/or combined into a single component, step, feature, or function, or can be implemented in several components, steps, or functions. Additional elements, components, steps, and/or functions may also be added without departing from embodiments of the present application. In some implementations, the figures and their corresponding descriptions may be used to fabricate, create, provide, and/or produce integrated devices. In some implementations, the integrated device may include a die package, a package substrate, an integrated circuit, a wafer, a semiconductor device, and/or an interposer.

The term "exemplary" is used herein to mean "serving as an example, instance, or illustration. Any implementation or aspect described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other aspects of embodiments of the application.

It is also noted that the embodiments may be described as a process which is depicted as a flowchart, a flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. Additionally, the order of the operations may be rearranged. The process terminates when its operation is complete.

The various aspects of the embodiments of the application described herein may be implemented in different systems without departing from the embodiments of the application. It should be noted that the above aspects of the embodiments of the present application are merely examples and should not be construed as limiting the embodiments of the present application. The description of the aspects of the embodiments of the present application is intended to be illustrative, and not to limit the scope of the appended claims. Thus, the teachings of the present application may be readily applied to other types of apparatuses and many alternatives, modifications, and variations will be apparent to those skilled in the art.

Claims

1. A substrate, characterized in that a plurality of metal wiring layers and a dielectric layer filled between the metal wiring layers are arranged on the substrate; the substrate is also provided with a groove, an inductor is accommodated in the groove, a first end of the inductor is connected to a first bonding pad of one surface of the substrate, a second end of the inductor is connected to a second bonding pad of one surface of the substrate, and the first bonding pad and the second bonding pad are positioned on the surface of the same side of the substrate or on the surfaces of two sides of the substrate respectively.

2. The substrate of claim 1, wherein the plurality of metal wiring layers comprises a first metal wiring layer and/or a second metal wiring layer;

A first end of the inductor is connected to the first pad by a metal wire in the first metal wire layer, and/or a second end of the inductor is connected to the second pad by a metal wire in the second metal wire layer; the first metal wiring layer and the second metal wiring layer are the same layer or different layers.

3. The substrate of claim 1 or 2, wherein the inductor comprises a magnetic pillar and a conductive core perpendicular to the plurality of metal wiring layers; the magnetic column is arranged in the groove, and the conductive core is wrapped in the magnetic column; one end of the conductive core is connected to a first end of the inductor and the other end of the conductive core is connected to a second end of the inductor.

4. The substrate of claim 1 or 2, wherein the slots comprise a first slot and a second slot, the inductor comprising a magnetic pillar perpendicular to the plurality of metal wiring layers and a conductive core, the magnetic pillar comprising a first magnetic pillar disposed within the first slot and a second magnetic pillar disposed within the second slot, the conductive core comprising a first conductive core and a second conductive core;

the first conductive core is wrapped in the first magnetic column, the second conductive core is wrapped in the second magnetic column, one end of the first conductive core is connected to the first end of the inductor, the other end of the first conductive core is connected to one end of the second conductive core, and the other end of the second conductive core is connected to the second end of the inductor.

5. The substrate of claim 1 or 2, wherein the inductor comprises a magnetic pillar perpendicular to the metal wiring layer and a conductive core comprising a first conductive core and a second conductive core;

6. The substrate according to any one of claims 3 to 5, wherein the magnetic pillar is provided with a first via hole in a direction perpendicular to the metal wiring layer, and the conductive core includes a first conductive layer attached to an inner wall of the first via hole.

7. The substrate of claim 6, wherein the inductor further comprises a filler post;

the filling column is buried in the second through hole, and the second through hole is a through hole surrounded by the first conductive layer.

8. The substrate of claim 7, wherein the filler columns are prepared from a filler slurry comprising at least one or a mixture of conductive and non-conductive materials.

9. The substrate of any one of claims 3-8, wherein the magnetic pillars are prepared from a magnetic composite paste comprising a soft magnetic material, a resin material, and a curing agent.

10. A substrate according to claim 9, characterized in that the soft magnetic material comprises at least one or a mixture of ferrite magnetic powder, iron-based magnetic powder.

11. A substrate according to claim 10, characterized in that the iron-based magnetic powder comprises at least one or a mixture of crystalline iron-based magnetic powder, amorphous nano-iron-based magnetic powder.

12. The substrate of claim 9, wherein the resin material comprises a thermosetting resin;

or, the resin material includes a thermosetting resin and a thermoplastic resin.

13. A package structure, comprising:

a package substrate, and a chip disposed on the package substrate; wherein the package substrate comprises a substrate according to any of claims 1-12, the chip being soldered to the first pads and/or the second pads of the substrate surface.

14. An electronic device is characterized by comprising a PCB and a packaging structure arranged on the PCB, wherein the PCB is welded with the packaging structure through a welding assembly; the package structure comprising the package structure of claim 13; and/or the PCB comprises a substrate as claimed in any of claims 1-12, the package structure being soldered to the first pads and/or the second pads of the substrate surface.