CN117059502B - Material clamping mechanism of bonding machine for chip processing - Google Patents
Material clamping mechanism of bonding machine for chip processing Download PDFInfo
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- CN117059502B CN117059502B CN202311308762.3A CN202311308762A CN117059502B CN 117059502 B CN117059502 B CN 117059502B CN 202311308762 A CN202311308762 A CN 202311308762A CN 117059502 B CN117059502 B CN 117059502B
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- 239000000463 material Substances 0.000 title claims abstract description 37
- 238000012545 processing Methods 0.000 title claims abstract description 23
- 239000002390 adhesive tape Substances 0.000 claims description 4
- 210000003813 thumb Anatomy 0.000 claims description 4
- 238000009434 installation Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 abstract description 16
- 238000003466 welding Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
- H01L2224/78704—Mechanical holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78743—Suction holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/78981—Apparatus chuck
- H01L2224/78982—Shape
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Gripping Jigs, Holding Jigs, And Positioning Jigs (AREA)
Abstract
The invention relates to the field of bonding machines, in particular to a material clamping mechanism of a bonding machine for chip processing, which comprises a clamping seat, wherein the clamping seat is arranged on a lifting seat, a movable seat is fixedly arranged at the bottom of the lifting seat, the movable seat is slidably arranged in a stable guide rail, the stable guide rail is fixedly arranged on a workbench of the bonding machine, a driving rail is fixedly arranged on the stable guide rail, a center box is fixedly arranged on the clamping seat, the center box is provided with micropores, the center box is communicated with an air pump device through an exhaust pipe, two groups of pre-clamping structures are symmetrically arranged on the clamping seat, each pre-clamping structure comprises a main stop block slidably arranged on the clamping seat and a movable clamping jaw slidably arranged in the main stop block, the sliding directions of the main stop block and the movable clamping jaw are mutually perpendicular, and two pressing structures with adjustable upper and lower positions are symmetrically arranged on the clamping seat; the invention can achieve the aim of conveniently carrying out chip loading and fixing and avoiding the unclosed chip clamping mechanism.
Description
Technical Field
The invention relates to the technical field of bonding machines, in particular to a material clamping mechanism of a bonding machine for chip processing.
Background
At present, the rapid development of electronic equipment promotes the rapid increase of the demand of chips, and in the manufacturing process of the chips, the bonding technology is one of key procedures and is responsible for reliably connecting the chips with devices such as leads or connectors. The stability and accuracy of the bonder, as a key device for performing the bonding process, directly affect the quality and performance of the chip.
In the bonding machine, a material clamping mechanism is a crucial part, and the material clamping mechanism is mainly responsible for stably clamping devices such as chips or connectors in the bonding process so as to ensure accurate welding positioning and stability. However, in the present bonder, on the one hand, the loading of the chip is performed inside the bonder, the clamping mechanism is not easy to operate, and the fixing of the chips with different sizes is difficult to be completed quickly and stably, on the other hand, the switching operation of the present clamping mechanism is performed manually, so that the manual operation is easy to be neglected, and if the clamp is not closed timely, the bonding connection process is caused to deviate.
Disclosure of Invention
The invention aims to provide a material clamping mechanism of a bonding machine for chip processing, so as to achieve the aim of conveniently carrying out chip loading and fixing and avoiding the phenomenon that the chip clamping mechanism is not closed, and solve the problems in the prior art.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a chip processing is with bonder material fixture, includes the grip slipper, the grip slipper is installed on the lift seat, and lift seat bottom fixed mounting has the movable seat, movable seat slidable mounting is in stable guide rail, and stable guide rail fixed mounting is on the workstation of bonder, and fixed mounting has drive rail on the stable guide rail, fixed mounting has the center box on the grip slipper, and is provided with the micropore on the center box, and the center box passes through the exhaust tube intercommunication on air pump device, the symmetry is provided with two sets of pre-clamping structure on the grip slipper, and pre-clamping structure is including slidable mounting's main dog and slidable mounting movable clamping jaw in main dog on the grip slipper, main dog and movable clamping jaw's slip direction mutually perpendicular, and main dog and movable clamping jaw's position can carry out the accurate adjustment, the symmetry is provided with two adjustable clamp structures in upper and lower positions on the grip slipper, and the height of clamp structure carries out the automatically regulated along with the horizontal migration of grip slipper.
Preferably, the clamping seat is arranged at the top of the lifting seat, an air cylinder is arranged in the lifting seat, the movable seat is arranged at the bottom of the lifting seat, and the movable seat is limited in the stable guide rail.
Preferably, the workbench is horizontally arranged in the bonding machine, the driving rail is arranged on the side surface of the stable guide rail, the driving rail is a linear rail, and the side surface of the movable seat is connected with the driving part of the driving rail.
Preferably, the center box is arranged at the center of the top surface of the clamping seat, the micropores are arranged on the top surface of the center box, and the exhaust pipe is connected with the bottom end of the guide pipe on the side surface of the center box.
Preferably, the clamping seat is provided with a limit groove, the bottom of the main stop block is provided with a bottom block, the bottom block is slidably mounted in the limit groove, the side surface of the main stop block is arranged on the adhesive tape, the main stop block is provided with a positioning assembly, the positioning assembly adopts a positioning screw, and the limit groove is provided with a first scale.
Preferably, the both sides of the main stop block are provided with sliding grooves, the movable clamping jaw is slidably arranged in the sliding grooves, the movable clamping jaw is of an L-shaped structure, a second scale is arranged on the movable clamping jaw, and the second scale is positioned on the upper surface of the movable clamping jaw.
Preferably, the mounting seat is fixedly mounted on the main stop block, the adjusting rod is mounted in the mounting seat in a limiting rotation mode, the shifting wheel is arranged on the adjusting rod, and the first screw and the second screw are arranged on two sides of the adjusting rod in a mirror image mode.
Preferably, the threads of the first screw rod and the second screw rod are reversely arranged, the first screw rod and the second screw rod are provided with nut seats, and the nut seats are fixedly connected with the movable clamping jaw.
Preferably, the compressing structure comprises a guide rod vertically arranged at the top of the clamping seat, a lifting frame is slidably arranged on the guide rod, a spring is fixedly connected to the lifting frame, and two ends of the lifting frame are respectively provided with a limiting pressing block and an inclined block.
Preferably, the crane is L type support, and spacing briquetting setting is on the top of crane, and the sloping block setting is in the bottom of crane, the spring cup joints on the guide bar, fixed mounting has the bracing piece on the grip slipper, and the bracing piece top is provided with the ejector pad, and the ejector pad is located the removal orbit of sloping block.
Compared with the prior art, the invention has the beneficial effects that:
1. the clamping mechanism is used in a bonding machine for chip processing, clamping of chip materials can be carried out, the clamping mechanism takes the clamping seat as a main body, the chip materials are fixed on the clamping seat, the height of the clamping seat can be adjusted, meanwhile, the lifting seat is arranged in the stable guide rail by utilizing the movable seat, the horizontal position of the clamping seat can be adjusted by means of movement of the movable seat, and when the chip materials are loaded, the movable seat and the clamping seat on the movable seat are moved to the outside of the bonding machine by utilizing the driving track according to requirements, so that the initial clamping and fixing of the chips can be carried out more conveniently and rapidly, and then the clamping seat is sent to the bonding machine processing position for final clamping and fixing, and the clamping stability is effectively ensured.
2. The center box is arranged in the center of the clamping seat, so that the chip can be adsorbed by utilizing negative pressure to prevent the chip from displacement, the pre-clamping structure is also arranged on the clamping seat and can be adjusted according to the size of the chip to be processed, and when the clamping seat is moved to the outside of the bonding machine, the chip can be conveniently placed into the pre-clamping structure to be primarily fixed.
3. The pre-clamping structure comprises a main stop block and a movable clamping jaw, wherein the main stop block and the movable clamping jaw can be adjusted, limit is carried out on the periphery of a chip, and the chip material is preliminarily fixed, wherein the main stop block transversely limits the chip, and after the position of the main stop block is adjusted, the movable clamping jaw can be adjusted adaptively and synchronously, so that the chip limiting requirement is met, the main stop block and the movable clamping jaw are very convenient to adjust and fix, and a square limiting frame with a certain size can be formed, so that the chip material is preliminarily clamped.
4. The clamping seat is also provided with the pressing structure, so that the final fixing of the chip can be performed by utilizing the pressing structure, the pressing structure can be automatically adjusted along with the position of the clamping seat, the clamping structure can be opened when the clamping seat moves out of the bonding machine, otherwise, after the chip is pre-fixed on the clamping seat, the clamping structure can automatically move downwards when the clamping seat enters the bonding machine, the chip material is finally fixed, and the bonding machine can ensure the welding quality when the bonding machine performs metal wire welding.
Drawings
FIG. 1 is a first schematic view of a bonder structure according to the present invention.
FIG. 2 is a second schematic view of the bonder structure of the present invention.
Fig. 3 is a first schematic view of the clamping mechanism of the present invention.
Fig. 4 is a second schematic view of the clamping mechanism of the present invention.
Fig. 5 is a schematic view of a movable seat structure according to the present invention.
Fig. 6 is a schematic view of a clamping seat structure according to the present invention.
Fig. 7 is a schematic view of the structure of the clamping part of the present invention.
Fig. 8 is a first schematic view of the pre-clamping structure of the present invention.
Fig. 9 is a second schematic view of the pre-clamping structure of the present invention.
Fig. 10 is a schematic view of a compacting structure of the present invention.
In the figure: clamping seat 1, lifting seat 2, movable seat 3, stable guide rail 4, working table 5, bonding machine 6, driving track 7, center box 8, micropore 9, exhaust tube 10, limit groove 11, main stop block 12, bottom block 13, adhesive tape 14, positioning component 15, first scale 16, movable clamping jaw 17, second scale 18, mounting seat 19, adjusting rod 20, thumb wheel 21, first screw 22, second screw 23, nut seat 24, guide rod 25, lifting frame 26, spring 27, limit pressing block 28, oblique block 29, support rod 30, push block 31.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and detailed description, wherein it is to be understood that, under the precondition of no conflict, new embodiments can be formed by any combination of the embodiments or technical features described below, and it should be understood that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1 to 10, the present invention provides a technical solution: the utility model provides a chip processing is with bonder material fixture, including grip slipper 1, grip slipper 1 installs on lift seat 2, and lift seat 2 bottom fixed mounting has movable seat 3, movable seat 3 slidable mounting is in stable guide rail 4, and stable guide rail 4 fixed mounting is on the workstation 5 of bonder 6, and fixed mounting has drive track 7 on the stable guide rail 4, fixed mounting has center box 8 on grip slipper 1, and be provided with micropore 9 on the center box 8, and center box 8 communicates on air pump device through exhaust tube 10, the symmetry is provided with two sets of pre-clamping structure on grip slipper 1, and pre-clamping structure is including the movable clamping jaw 17 of slidable mounting on grip slipper 1 in main clamping jaw 12, the slip direction mutually perpendicular of main clamping jaw 12 and movable clamping jaw 17, and the position of main clamping jaw 12 and movable clamping jaw 17 can be accurately adjusted, the symmetry is provided with two adjustable clamp structures of upper and lower position on grip slipper 1, and the height of clamp structure carries out automatically regulated along with the horizontal movement of grip slipper 1.
The grip slipper 1 is installed at the top of lifting seat 2, and is provided with the cylinder in the lifting seat 2, and movable seat 3 sets up in the bottom of lifting seat 2, and the spacing setting of movable seat 3 is in stable guide rail 4.
The clamping mechanism is used in a bonding machine for chip processing, and can clamp chip materials, the clamping mechanism takes a clamping seat 1 as a main body, the chip materials are fixed on the clamping seat 1, the clamping seat 1 is arranged on a lifting seat 2, the height of the lifting seat 2 can be adjusted, meanwhile, the lifting seat 2 is arranged in a stable guide rail 4 by utilizing a movable seat 3, and the horizontal position of the clamping seat 1 can be adjusted by virtue of the movement of the movable seat 3.
The workbench 5 is horizontally arranged in the bonding machine 6, the driving rail 7 is arranged on the side surface of the stable guide rail 4, the driving rail 7 is a linear rail, and the side surface of the movable seat 3 is connected with a driving part of the driving rail 7.
Be provided with workstation 5 in the bonder 6, stable track 4 sets up on workstation 5, consequently, carried out the movable mounting of grip slipper 1 in bonder 6, when carrying out the loading of chip material, utilize drive track 7 to remove the outside of bonder 6 with movable seat 3 and grip slipper 1 on it, more convenient and fast carries out the preliminary centre gripping of chip and fixes, later sends grip slipper 1 into bonder 6 processing position again, carries out final clamp fixation, the effectual centre gripping stability of guaranteeing.
The center box 8 is arranged at the center of the top surface of the clamping seat 1, the micropores 9 are arranged on the top surface of the center box 8, and the exhaust pipe 10 is connected with the bottom end of the guide pipe on the side surface of the center box 8.
The center of the clamping seat 1 is provided with the center box 8, the suction pipe 10 can be used for sucking air, negative pressure is generated at the micropore 9 of the center box 8, and when a chip is placed on the center box 8, the chip can be adsorbed by the negative pressure, so that the chip is prevented from being displaced.
Be provided with spacing groove 11 on grip slipper 1, and main dog 12 bottom is provided with bottom block 13, and bottom block 13 slidable mounting is in spacing groove 11, and the side of main dog 12 arranges and sets up at adhesive tape 14, and is provided with locating component 15 on the main dog 12, and locating component 15 adopts the locating screw, and spacing groove 11 department is provided with first scale 16.
And still be provided with the pre-clamping structure on the grip slipper 1, the chip size that the pre-clamping structure can be according to waiting to process is adjusted, when removing the outside of bonder 6 with grip slipper 1, can be convenient put into the pre-clamping structure with the chip in, carries out preliminary fixed.
The both sides of the main stop block 12 are provided with sliding grooves, the movable clamping jaw 17 is slidably arranged in the sliding grooves, the movable clamping jaw 17 is of an L-shaped structure, the movable clamping jaw 17 is provided with a second scale 18, and the second scale 18 is positioned on the upper surface of the movable clamping jaw 17.
The pre-clamping structure is composed of a main stop block 12 and a movable clamping jaw 17, the two parts can be adjusted, the periphery of the chip is limited, and the effect of preliminary fixing of chip materials is achieved.
The main stop block 12 performs lateral limitation of the chip, slides the main stop block 12 on the clamping seat 1 according to the size of the chip to be processed, slides the main stop block 12 to a required position through the indication of the first scale 16, and then uses the positioning assembly 15 to rapidly fix the position.
The main stop block 12 is fixedly provided with a mounting seat 19, an adjusting rod 20 is arranged in the mounting seat 19 in a limiting rotation mode, a thumb wheel 21 is arranged on the adjusting rod 20, and a first screw rod 22 and a second screw rod 23 are arranged on two sides of the adjusting rod 20 in a mirror image mode.
After the position of the main stop block 12 is adjusted, the movable clamping jaw 17 can be adjusted adaptively and synchronously to meet the chip limiting requirement, and when the chip limiting requirement is met, the driving wheel 21 rotates the adjusting rod 20 to drive the first screw 22 and the second screw 23 to rotate, the threads of the first screw 22 and the second screw 23 are opposite, and when the chip limiting requirement is met, the two nut seats 24 can be adjusted synchronously and reversely.
The threads of the first screw rod 22 and the second screw rod 23 are reversely arranged, a nut seat 24 is arranged on the first screw rod 22 and the second screw rod 23, and the nut seat 24 is fixedly connected with the movable clamping jaw 17.
According to the indication of the second scale 18, the two movable clamping jaws 17 are synchronously moved and regulated through the two nut seats 24, the two movable clamping jaws 17 are moved to corresponding positions according to the size of a chip to be processed, and a square limiting frame with a certain size is formed by matching with the two main stop blocks 12, so that the chip material is primarily clamped.
The compressing structure comprises a guide rod 25 vertically arranged at the top of the clamping seat 1, a lifting frame 26 is slidably arranged on the guide rod 25, a spring 27 is fixedly connected to the lifting frame 26, and two ends of the lifting frame 26 are respectively provided with a limiting pressing block 28 and an inclined block 29.
Meanwhile, the clamping seat 1 is further provided with the pressing structure, the final fixing of the chip can be carried out by utilizing the pressing structure, the pressing structure can be automatically adjusted along with the position of the clamping seat 1, when the clamping seat 1 moves out of the bonding machine 6, the clamping structure can be opened, otherwise, after the chip is pre-fixed on the clamping seat 1, the clamping structure can automatically move downwards when the clamping seat 1 enters the bonding machine 6, the chip material is finally fixed, and the bonding machine 6 can ensure the welding quality when the metal wire is welded.
The lifting frame 26 is an L-shaped bracket, the limiting pressing block 28 is arranged at the top end of the lifting frame 26, the inclined block 29 is arranged at the bottom end of the lifting frame 26, the spring 27 is sleeved on the guide rod 25, the supporting rod 30 is fixedly arranged on the clamping seat 1, the pushing block 31 is arranged at the top of the supporting rod 30, and the pushing block 31 is positioned on the moving track of the inclined block 29.
When the clamping seat 1 moves inwards along with the movable seat 3, the inclined block 29 moves to the pushing block 31, and the pushing block 31 can pull down the lifting frame 26 along the inclined plane of the inclined block 29, so that the lifting frame 26 overcomes the elastic force of the spring 27 to move, and the limiting pressing blocks 28 at the front end of the lifting frame 26 are driven to press on two sides of a chip material, so that the chip is stably fixed, and the bonding processing quality is ensured.
The invention is used when in use: first, the clamping mechanism of the invention is used in a bonding machine for chip processing, clamping of chip materials can be carried out, the clamping mechanism takes a clamping seat 1 as a main body, the chip materials are fixed on the clamping seat 1, the clamping seat 1 is arranged on a lifting seat 2, the height of the lifting seat 2 can be adjusted, meanwhile, the lifting seat 2 is arranged in a stable guide rail 4 by a movable seat 3, the horizontal position of the clamping seat 1 can be adjusted by means of the movement of the movable seat 3, a workbench 5 is arranged in the bonding machine 6, the stable guide rail 4 is arranged on the workbench 5, therefore, the movable installation of the clamping seat 1 is carried out in the bonding machine 6, when the chip materials are loaded, the movable seat 3 and the clamping seat 1 thereon are moved outside the bonding machine 6 by a driving rail 7 according to requirements, the preliminary clamping and fixing of chips can be carried out more conveniently and rapidly, then the clamping seat 1 is sent to the processing position of the bonding machine 6 for final clamping and fixing, so that the clamping stability is effectively ensured, the center of the clamping seat 1 is provided with the center box 8, the suction pipe 10 can be utilized for suction, negative pressure is generated at the micropore 9 of the center box 8, when a chip is placed on the center box 8, the negative pressure is utilized for absorbing the chip to prevent the chip from displacement, the clamping seat 1 is also provided with the pre-clamping structure, the pre-clamping structure can be adjusted according to the size of the chip to be processed, when the clamping seat 1 is moved to the outside of the bonding machine 6, the chip can be conveniently placed into the pre-clamping structure for preliminary fixing, the pre-clamping structure is composed of the main stop block 12 and the movable clamping jaw 17, the two parts can be adjusted, the periphery of the chip is limited, the effect of preliminary fixing the chip material is achieved, wherein the main stop block 12 performs the lateral limit of the chip, the main stop block 12 slides on the clamping seat 1 according to the size of the chip to be processed, the main stop block 12 slides to a required position through the indication of the first scale 16, then the positioning component 15 is utilized to perform quick fixing, after the position adjustment of the main stop block 12 is completed, the adaptive synchronous adjustment of the movable clamping jaw 17 can be performed, so as to meet the chip limit requirement, during adjustment, the adjusting rod 20 is rotated through the thumb wheel 21 to drive the first screw 22 and the second screw 23 to rotate, the threads of the first screw 22 and the second screw 23 are opposite, during synchronous rotation, the synchronous reverse adjustment of the two nut seats 24 can be performed, the movement adjustment of the two movable clamping jaws 17 is performed synchronously through the two nut seats 24 according to the indication of the second scale 18, according to the size of the chip to be processed, the invention moves two movable clamping jaws 17 to corresponding positions, cooperates with two main stop blocks 12 to form a square limit frame with a certain size, performs preliminary clamping of chip materials, meanwhile, the invention is also provided with a pressing structure on the clamping seat 1, the final fixing of the chip can be performed by utilizing the pressing structure, the pressing structure can be automatically adjusted along with the position of the clamping seat 1, when the clamping seat 1 moves out of the bonding machine 6, the clamping structure can be opened, otherwise, after the chip is pre-fixed on the clamping seat 1, the clamping structure can automatically move downwards to finally fix the chip materials when the clamping seat 1 enters into the bonding machine 6, the bonding machine 6 can ensure the welding quality when the bonding machine 6 performs metal wire welding, when the clamping seat 1 moves inwards along with the movable seat 3, the inclined block 29 moves to the position of the pushing block 31, the lifting frame 26 can be pulled downwards along the inclined plane of the inclined block 29, so that the lifting frame 26 overcomes the elastic force of the spring 27 to move, and the limiting pressing blocks 28 at the front end of the lifting frame 26 are driven to press on the two sides of the chip material, so that the chip is stably fixed, and the bonding processing quality is ensured.
The above embodiments are only preferred embodiments of the present invention, and the scope of the present invention is not limited thereto, but various modifications can be made by those skilled in the art without inventive effort from the above concepts, and all modifications are within the scope of the present invention.
Claims (8)
1. The utility model provides a chip processing is with bonder material fixture, includes grip slipper (1), its characterized in that: the clamping seat (1) is arranged on the lifting seat (2), the bottom of the lifting seat (2) is fixedly provided with the movable seat (3), the movable seat (3) is slidably arranged in the stable guide rail (4), the stable guide rail (4) is fixedly arranged on the workbench (5) of the bonding machine (6), the stable guide rail (4) is fixedly provided with the driving track (7), the clamping seat (1) is fixedly provided with the center box (8), the center box (8) is provided with the micro-holes (9), the center box (8) is communicated on the air pump device through the exhaust pipe (10), the clamping seat (1) is symmetrically provided with two groups of pre-clamping structures, each pre-clamping structure comprises a main stop block (12) slidably arranged on the clamping seat (1) and a movable clamping jaw (17) slidably arranged in the main stop block (12), the sliding directions of the main stop block (12) and the movable clamping jaw (17) are mutually perpendicular, the positions of the main stop block (12) and the movable clamping jaw (17) can be automatically adjusted, and the clamping seat (1) can be tightly pressed down in a structure which can be accurately adjusted along with the height of the clamping seat (1);
the utility model provides a clamping structure, including vertical guide bar (25) of installing at grip slipper (1) top, and slidable mounting has crane (26) on guide bar (25), fixedly connected with spring (27) on crane (26), and the both ends of crane (26) are provided with spacing briquetting (28) and sloping block (29) respectively, crane (26) are L type support, and spacing briquetting (28) set up the top at crane (26), and sloping block (29) set up the bottom at crane (26), spring (27) cup joint on guide bar (25), fixed mounting has bracing piece (30) on grip slipper (1), and bracing piece (30) top is provided with ejector pad (31), and ejector pad (31) are located the removal orbit of sloping block (29).
2. The bonding machine material clamping mechanism for chip processing according to claim 1, wherein: the clamping seat (1) is arranged at the top of the lifting seat (2), an air cylinder is arranged in the lifting seat (2), the movable seat (3) is arranged at the bottom of the lifting seat (2), and the movable seat (3) is limited in the stable guide rail (4).
3. The bonding machine material clamping mechanism for chip processing according to claim 1, wherein: the workbench (5) is horizontally arranged in the bonding machine (6), the driving rail (7) is arranged on the side face of the stable guide rail (4), the driving rail (7) is a linear rail, and the side face of the movable seat (3) is connected with a driving part of the driving rail (7).
4. The bonding machine material clamping mechanism for chip processing according to claim 1, wherein: the center box (8) is arranged at the center of the top surface of the clamping seat (1), micropores (9) are arranged on the top surface of the center box (8), and the exhaust pipe (10) is connected with the bottom end of the guide pipe on the side surface of the center box (8).
5. The bonding machine material clamping mechanism for chip processing according to claim 1, wherein: be provided with spacing groove (11) on grip slipper (1), and main dog (12) bottom is provided with bottom block (13), and bottom block (13) slidable mounting in spacing groove (11), the side range of main dog (12) sets up in adhesive tape (14), and is provided with locating component (15) on main dog (12), and locating component (15) adopt positioning screw, spacing groove (11) department is provided with first scale (16).
6. The bonding machine material clamping mechanism for chip processing according to claim 1, wherein: the two sides of the main stop block (12) are provided with sliding grooves, the movable clamping jaw (17) is slidably arranged in the sliding grooves, the movable clamping jaw (17) is of an L-shaped structure, the movable clamping jaw (17) is provided with a second scale (18), and the second scale (18) is located on the upper surface of the movable clamping jaw (17).
7. The bonding machine material clamping mechanism for chip processing according to claim 6, wherein: the main stop block (12) is fixedly provided with an installation seat (19), an adjusting rod (20) is installed in the installation seat (19) in a limiting rotation mode, a thumb wheel (21) is arranged on the adjusting rod (20), and a first screw (22) and a second screw (23) are arranged on two sides of the adjusting rod (20) in a mirror image mode.
8. The bonding machine material clamping mechanism for chip processing according to claim 7, wherein: the threads of the first screw rod (22) and the second screw rod (23) are reversely arranged, a nut seat (24) is arranged on the first screw rod (22) and the second screw rod (23), and the nut seat (24) is fixedly connected with the movable clamping jaw (17).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311308762.3A CN117059502B (en) | 2023-10-11 | 2023-10-11 | Material clamping mechanism of bonding machine for chip processing |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311308762.3A CN117059502B (en) | 2023-10-11 | 2023-10-11 | Material clamping mechanism of bonding machine for chip processing |
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| CN117059502A CN117059502A (en) | 2023-11-14 |
| CN117059502B true CN117059502B (en) | 2024-01-30 |
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| CN116525516A (en) * | 2023-06-05 | 2023-08-01 | 安徽积芯微电子科技有限公司 | Press finger for chip bonding and base thereof |
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| JP2004247374A (en) * | 2003-02-12 | 2004-09-02 | Nidec Tosok Corp | Die bonder |
| WO2010055730A1 (en) * | 2008-11-14 | 2010-05-20 | 東京エレクトロン株式会社 | Bonding apparatus and bonding method |
| CN212257354U (en) * | 2020-06-03 | 2020-12-29 | 苏州凌骏机械制造有限公司 | High-precision base of full-automatic bonder |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN117059502A (en) | 2023-11-14 |
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