CN117056995B - Method and system for analyzing compliance of conformal attachment of flexible film material - Google Patents
Method and system for analyzing compliance of conformal attachment of flexible film material Download PDFInfo
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Abstract
The invention discloses a method and a system for analyzing compliance of conformal attachment of a flexible film material, wherein the method comprises the following steps: cutting the flexible film material into an initial pattern based on the site marking pattern; conformally attaching the cut flexible film material in a target pattern area of a target surface workpiece; acquiring the distance between the site marking patterns and the distance field distribution before and after conformal attachment of the site marking patterns on the flexible film material; calculating to obtain a measurement conformal mapping relation between an initial pattern and a target pattern of experimental measurement; obtaining a sliding term coefficient value and an adhesion term coefficient value in a fitting function model describing conformal compliance; establishing a simulated conformal mapping relation between an initial graph and a target graph in a conformal-attached scene, quantitatively judging whether the conformal-attached compliance performance is realized or not, and describing the conformal-attached compliance state based on the simulated conformal mapping relation. The method and the device can analyze and simulate the conformal attachment compliance of the flexible film material, and guide the design and manufacture of the flexible electronic device.
Description
Technical Field
The invention relates to the technical field of flexible film material compliance quantitative analysis, in particular to a method and a system for analyzing compliance of conformal attachment of a flexible film material.
Background
Conformal attachment is an important basis for the functionalization of flexible electronic devices.
Whether the flexible electronic device can realize conformal attachment on the target surface determines whether the flexible electronic device can realize a given function; the state of the flexible electronic device after conformal attachment determines what impact the structural performance of the device will be. Therefore, the conformal adhesion compliance analysis of the flexible film material serving as the substrate of the flexible electronic device on the surface of a certain complex curved surface is an essential link of the design of the flexible electronic device.
In the current flexible electronic field, the flexible film material is attached on a complex curved surface with certain difficulty, and especially, the flexible film material is attached on a curved surface with curvature other than 0 Gaussian to realize large-area continuity. The conformal attaching method such as serpentine, fractal curve, paper-cut metamaterial and the like is realized by the related report, the coverage rate of the curved surface is required to be sacrificed, the processing cost is high, the assembly method is complex and various, and the analysis of the general quantitative definition of the conformal attaching compliance is lacking.
In the stamping field, failure analysis related to metal plate failure is mainly carried out by adopting a film theory of neglecting friction to carry out analysis and solution, and the boundary condition assumption of the quantitative analysis model and the actual interaction condition difference between the flexible film material and the target surface in the conformal adhesion scene are large, so that the universality of conformal adhesion analysis is not realized; the conformal deformation analysis of the rigid polymer material is mainly predicted by adopting a rigidity theory, and the analysis of interface acting force in conformal attachment is not involved, so that the application range is limited; most of the works adopt numerical calculation simulation tools based on finite elements when conformal deformation analysis is carried out, the calculation cost is high, the analysis model does not have universality, and high-precision quantitative physical experiment verification support is lacked, so that the conformal mapping relation between the initial graph and the target graph of the flexible film material is difficult to accurately describe.
Therefore, development of a system and a method for analyzing conformal attachment compliance of a flexible thin film material are urgently needed to realize quantitative description of conformal attachment compliance of large-area continuity of the flexible thin film material on a complex curved surface, so as to guide high-precision design and manufacture of a flexible electronic device in a conformal attachment scene.
Disclosure of Invention
The invention aims to overcome the technical defects, and provides a method and a system for analyzing the conformal attachment compliance of a flexible film material, which solve the technical problem that the quantitative description of the conformal attachment compliance of the flexible film material on a complex curved surface is difficult in large-area continuity in the prior art.
In order to achieve the technical purpose, in a first aspect, the technical scheme of the invention provides a method for analyzing compliance of conformal attachment of a flexible film material, which comprises the following steps:
preparing a site marking pattern at marking points on the surface of the flexible film material, and cutting the flexible film material into an initial pattern based on the site marking pattern;
conformally attaching the cut flexible film material in a target pattern area of a target surface workpiece;
acquiring the distance between the site marking patterns under a preset angle, and carrying out scanning measurement on the site marking patterns of the flexible film material on the target surface workpiece to acquire the distance field distribution before and after conformal attachment of the site marking patterns on the flexible film material;
calculating to obtain the space position of the mark site according to the distance between the site mark patterns under the preset angle and the distance field distribution before and after the conformal attachment of the site mark patterns on the flexible film material, and obtaining the measurement conformal mapping relation between the initial pattern and the target pattern which are experimentally measured according to the space position of the mark site;
fitting the measurement conformal mapping relation based on a least square method to obtain a sliding term coefficient value and an adhesion term coefficient value in a fitting function model describing conformal compliance;
establishing a simulated conformal mapping relation between an initial graph and a target graph in a conformal-attached scene by a parameterized modeling method, quantitatively judging whether the conformal-attached compliance performance is realized or not based on a sliding item coefficient value and an adhesion item coefficient value in a conformal-attached fitting function model, and describing the conformal-attached compliance state based on the simulated conformal mapping relation.
Compared with the prior art, the method for analyzing the conformal attachment compliance of the flexible film material has the beneficial effects that:
the conformal attaching compliance is to attach a flexible film material with a certain initial pattern to a target surface, and is consistent with the geometric configuration of the target pattern after attaching, and comprises two concepts of whether the conformal attaching is invalid and whether the conformal attaching is in a state of being invalid or not, wherein whether the conformal attaching is invalid depends on competition between two conditions, one is competition between surface stress of the flexible film material and acting force of the interface between the flexible film material and the target surface when the mechanical property of the flexible film material is fixed, and competition between mechanical property of the flexible film material and the conformal mapping between the initial pattern and the target pattern when the acting force of the interface between the flexible film material and the target surface is large enough; the state of conformal-attachment is embodied as a conformal mapping relationship between the initial pattern and the target pattern.
According to the analysis method for the conformal attachment compliance of the flexible film material, quantitative judgment on whether the conformal attachment compliance is achieved is carried out through the sliding term coefficient value and the adhesion term coefficient value in the fitting function model of the conformal compliance, namely, whether the corresponding position of the flexible film material on the target graph of the target surface workpiece is in a sliding state or an adhesion state is judged, and under the condition that the corresponding position of the flexible film material on the target graph of the target surface workpiece is in the adhesion state, the conformal attachment compliance state is described based on the simulated conformal mapping relation, namely, the mechanical property of the flexible film material and competition of conformal mapping between the initial graph and the target graph. The method and the device can analyze and simulate the conformal attachment compliance of the flexible film material well, guide the high-precision design and manufacture of the flexible electronic device in a conformal attachment scene, and have very good practical value.
According to some embodiments of the present invention, quantitative determination of whether conformal-attach compliance is achieved is performed on sliding term coefficient values and adhesion term coefficient values in a conformal-compliance-based fitting function model, including the steps of:
when the sliding term coefficient value is larger than the adhesion term coefficient value, the flexible film material slides relatively in a target pattern area of the target surface workpiece; when the sliding term coefficient value is smaller than the adhering term coefficient value, the flexible film material adheres to the target pattern area of the target surface workpiece.
According to some embodiments of the invention, the conformal-attach compliance state description based on the simulated conformal mapping relation includes the steps of:
and when the flexible film material is adhered to a target pattern area of a target surface workpiece, judging the conformal adhesion compliance state according to the measured conformal mapping relation between the initial pattern and the target pattern and the mechanical property of the flexible film material.
According to some embodiments of the present invention, the fitting of the measured conformal mapping relation based on a least squares method, to obtain a sliding term coefficient value and an adhesion term coefficient value in a fitting function model describing conformal compliance, includes the steps of:
giving a definition of a conformal factor for quantitative calculation of conformal-attach compliance based on a first basis shape of a differential geometric surfaceThe conformal factor defines the mapping relation used for calculating the initial graph and the target graph, +.>The method comprises the steps that the first basic shape of a curved surface of a target graph is obtained, and I is the first basic shape of the curved surface of an initial graph; />The target surface is a rotationally symmetrical curved surface, the target pattern is a rotationally symmetrical curved surface with a boundary, the initial pattern is a projected circle of the rotationally symmetrical curved surface along the rotationally symmetrical axial direction, the axial direction and the normal direction are respectively subjected to stress analysis, the initial pattern is a circular flexible film material radius D, and the thickness of the film isThe local curvature radius of the rotationally symmetrical curved surface is R 0 The interaction pressure between the flexible film material and the target surface is P, and the friction adhesion acts in the tangential direction of the curved surface parameter spaceThe friction coefficient is->With circumferential stress +.>And radial stress->；/>
When (when)When 0, the drug is added>The differential mapping relation of arc length between the initial pattern and the target pattern is constant +.>When->At maximum, there is circumferential strain provided the material is incompressibleThe local differential mapping relation of arc length between the initial graph and the target graph is +.>；
Based on the clamping method, a fitting function model for describing conformal compliance is provided, the interaction force between the actual flexible film material and the target surface is between minimum and maximum, the competition between sliding and adhesion is reflected, and a weighted summation mode is adopted to fit the conformal mapping relation of arc length in the actual situation：，/>For sliding item coefficient value, ++>For sliding item->For adhesion term coefficient value, < >>Is an adhesion term.
According to some embodiments of the present invention, obtaining a distance between site mark patterns at a preset angle includes the steps of:
and adjusting the position of each straight barrel microscope through a 3-axis displacement system, and acquiring the distance between the site marking patterns under the preset angle through the straight barrel microscope.
According to some embodiments of the invention, the site marking pattern is a plurality of circular arcs distributed around a circle center, and the site marking pattern is displayed as a plurality of concentric circles on the surface of the flexible film material.
In a second aspect, the present invention provides a compliant film material conformally affixed compliance analysis system comprising:
the raw material marking and cutting module is used for preparing a site marking pattern at marking points on the surface of the flexible film material and cutting the flexible film material into an initial pattern based on the site marking pattern;
the attaching module is used for conformally attaching the flexible film material in a target pattern area of the target surface workpiece;
the distance field calculation module is used for obtaining the distance between the site marking patterns under a preset angle, carrying out scanning measurement on the site marking patterns of the flexible film material on the target surface workpiece, and obtaining the distance field distribution before and after conformal attachment of the site marking patterns on the flexible film material;
the measurement conformal mapping module is used for calculating the spatial position of the marking site according to the distance between the marking patterns of the site at a preset angle and the distance field distribution before and after conformal attachment of the marking patterns of the site on the flexible film material, and obtaining the measurement conformal mapping relation between the initial pattern and the target pattern which are measured experimentally according to the spatial position of the marking site;
the coefficient value calculation module is used for fitting the measurement conformal mapping relation based on a least square method to obtain a sliding term coefficient value and an adhesion term coefficient value in a fitting function model for describing conformal compliance;
the compliance state description module is used for establishing a simulated conformal mapping relation between an initial graph and a target graph in a conformal-attached scene through a parameterized modeling method, quantitatively judging whether the conformal-attached compliance is realized or not based on a sliding item coefficient value and an adhesion item coefficient value in a conformal-attached function model, and describing the conformal-attached compliance state based on the simulated conformal mapping relation.
In a third aspect, the present invention provides an electronic device, comprising: a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the method of compliance analysis of conformal attachment of a flexible thin film material as defined in any one of the first aspects when the computer program is executed.
In a fourth aspect, the present invention provides a computer-readable storage medium storing computer-executable instructions for causing a computer to perform the method of conformally affixing a flexible thin-film material according to any one of the first aspects.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The foregoing and/or additional aspects and advantages of the present invention will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings, in which the summary drawings are to be fully consistent with one of the drawings of the specification:
FIG. 1 is a flow chart of a method for analyzing compliance of conformal attachment of a flexible film material according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a compliance of a flexible film material conformally attached to a curved surface according to a compliance analysis method of a flexible film material conformally attached according to an embodiment of the present invention;
FIG. 3 is a site-directed graph of a compliant film material conformally affixed compliance analysis method according to one embodiment of the present invention;
fig. 4 is a graph showing the effect of a microscopic measurement system of a compliant film material conformally attached compliance analysis method according to an embodiment of the present invention on measuring a curved surface distance field.
Reference numerals illustrate: an initial pattern 110, a target pattern 120, a target surface workpiece 130, and a site mark pattern 140.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It should be noted that although functional block diagrams are depicted as block diagrams, and logical sequences are shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the block diagrams in the system. The terms first, second and the like in the description and in the claims and in the above-described figures, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Embodiments of the present invention will be further described below with reference to the accompanying drawings.
Referring to fig. 1 to 4, fig. 1 is a flowchart of a method for analyzing compliance of conformal attachment of a flexible film material according to an embodiment of the present invention; FIG. 2 is a schematic diagram of a compliance of a flexible film material conformally attached to a curved surface according to a compliance analysis method of a flexible film material conformally attached according to an embodiment of the present invention; FIG. 3 is a site-directed graph of a compliant film material conformally affixed compliance analysis method according to one embodiment of the present invention; fig. 4 is a graph showing the effect of a microscopic measurement system of a compliant film material conformally attached compliance analysis method according to an embodiment of the present invention on measuring a curved surface distance field. The method for analyzing the compliance of the conformal attachment of the flexible film material includes, but is not limited to, steps S110 to S160.
Step S110, preparing a site marking pattern at marking points on the surface of the flexible film material, and cutting the flexible film material into an initial pattern based on the site marking pattern;
step S120, conformally attaching the flexible film material in a target pattern area of the target surface workpiece;
step S130, obtaining the distance between the site marking patterns under a preset angle, and carrying out scanning measurement on the site marking patterns of the flexible film material on the target surface workpiece to obtain the distance field distribution before and after conformal attachment of the site marking patterns on the flexible film material;
step S140, calculating to obtain the spatial position of the mark site according to the distance between the site mark patterns under the preset angle and the distance field distribution before and after the conformal attachment of the site mark patterns on the flexible film material, and obtaining the measurement conformal mapping relation between the initial pattern and the target pattern which are measured experimentally according to the spatial position of the mark site;
step S150, fitting the measured conformal mapping relation to obtain a sliding term coefficient value and an adhesion term coefficient value in a fitting function model describing conformal compliance;
step S160, establishing a simulated conformal mapping relation between an initial graph and a target graph in a conformal-attached scene, quantitatively judging whether the conformal-attached compliance performance is realized or not based on a sliding item coefficient value and an adhesion item coefficient value in a conformal-attached function model, and describing the conformal-attached compliance state based on the simulated conformal mapping relation.
In one embodiment, a method for analyzing compliance of conformal attachment of a flexible film material includes the steps of: preparing a site marking pattern 140 at a marking point on the surface of the flexible film material, and cutting the flexible film material into an initial pattern 110 based on the site marking pattern 140; conformally attaching the flexible film material in the target pattern 120 area of the target surface workpiece 130; acquiring the distance between the site marking patterns 140 under a preset angle, and scanning the site marking patterns 140 of the flexible film material on the target surface workpiece 130 to acquire the distance field distribution before and after conformal attachment of the site marking patterns 140 on the flexible film material; according to the distance between the site marking patterns 140 under the preset angle and the distance field distribution before and after the conformal attachment of the site marking patterns 140 on the flexible film material, the preset angle can be that shooting is carried out on the target pattern 120 area which is opposite to the target surface workpiece 130 by using shooting equipment, the space position of the marking site is obtained by calculation, and the measurement conformal mapping relation between the initial pattern 110 and the target pattern 120 which are measured experimentally is obtained according to the space position of the marking site; fitting the measurement conformal mapping relation based on a least square method to obtain a sliding term coefficient value and an adhesion term coefficient value in a fitting function model describing conformal compliance; establishing a simulated conformal mapping relation between the initial graph 110 and the target graph 120 in the conformal-attached scene by a parameterized modeling method, quantitatively judging whether the conformal-attached compliance performance is realized or not based on the sliding item coefficient value and the adhesion item coefficient value in the fitting function model of the conformal-attached compliance, and describing the conformal-attached compliance state based on the simulated conformal mapping relation.
The method for analyzing the conformal attaching compliance of the flexible film material according to the embodiment quantitatively determines whether the conformal attaching compliance is achieved by the sliding term coefficient value and the adhesion term coefficient value in the fitting function model of the conformal compliance, that is, determines that the corresponding position of the flexible film material on the target pattern 120 of the target surface workpiece 130 is in a sliding state or an adhesion state, and describes the conformal attaching compliance state based on the simulated conformal mapping relationship when the corresponding position of the flexible film material on the target pattern 120 of the target surface workpiece 130 is in an adhesion state, that is, the mechanical property of the flexible film material and competition between the initial pattern 110 and the target pattern 120. The method and the device can analyze and simulate the conformal attachment compliance of the flexible film material well, guide the high-precision design and manufacture of the flexible electronic device in a conformal attachment scene, and have very good practical value.
The conformal-attached-compliance analysis method can accurately and quantitatively define the conformal-attached compliance; the conformal attachment platform of the conformal attachment compliance analysis system can realize accurate alignment matching of flexible film materials of different initial patterns 110 and target patterns 120 on different target surfaces, and can perform data acquisition on the direct mapping relation between the initial patterns 110 and the target patterns 120 by combining a microscopic mark measurement system with high-precision point position marks on the surfaces of the flexible film materials, and is used for fitting the conformal attachment model provided by the invention; the resulting fitted model can be used to analyze and predict the conformal adhesion behavior of the relevant flexible film material.
Firstly, a site marking pattern 140 is prepared on the surface of a flexible film material based on a high-precision plane processing technology, the site marking pattern 140 can be flexibly set according to actual detection requirements, in the embodiment, a plurality of circular arcs distributed around a circle center are arranged, the site marking pattern 140 is displayed as a plurality of concentric circles on the surface of the flexible film material, and as the flexible film material is attached to a target surface workpiece 130, the target surface workpiece 130 applied in the application is a curved surface workpiece, and the site marking pattern 140 is arranged as the plurality of circular arcs distributed around the circle center, so that the detection of marking points in a attached state is facilitated.
Cutting the flexible film material into an initial pattern 110 based on the site marking pattern 140, and aligning and fixing the flexible film material into a group of clamping pieces through the site marking pattern 140 and mounting the flexible film material on a clamping workpiece mounting table; wherein the initial pattern 110 may be a sector or triangle, and the initial flexible film material may be a circle or regular polygon, facilitating subsequent cutting.
Fixing the target surface workpiece 130 to a target surface mount and mounting on the integral mount; the high-precision displacement table is adjusted to move the clamping workpiece mounting table, so that the clamping workpiece is aligned with the target surface workpiece 130, and further the conformal attachment of the flexible film material with a certain initial pattern 110 in the target pattern 120 area of the target surface workpiece 130 is realized.
And adjusting the position of each straight-barrel microscope through a 3-axis displacement system, so that the distance between the site marking patterns 140 under a specific angle is obtained, scanning measurement is carried out on the site marking patterns 140 on the target surface on a measurement calibration interface, and further the distance field distribution before and after conformal attachment of the site marking patterns 140 on the flexible film material is obtained.
The spatial position of the marker loci is calculated in combination with the geometric relationship between the target surface and the distance field of the locus marker pattern 140 at a specific angle, and then the conformal mapping relationship between the initial pattern 110 and the target pattern 120 is determined. Fitting the conformal mapping relation obtained by experimental measurement based on a least square method to obtain specific numerical values of the coefficient value of the sliding term and the coefficient value of the adhesion term in a fitting function model describing conformal compliance;
and establishing a conformal mapping relation between the initial graph 110 and the target graph 120 in the conformal-attached scene by a parameterized modeling method to quantitatively judge whether the conformal-attached compliance performance is realized or not and rapidly describe the conformal-attached compliance state with high precision.
Further, the quantitative determination of whether the conformal attaching compliance is realized or not is performed on the sliding term coefficient value and the adhesion term coefficient value in the fitting function model based on the conformal compliance, which comprises the following steps: when the slip term coefficient value is greater than the adhesion term coefficient value, the flexible film material slides relatively over the target pattern 120 area of the target surface workpiece 130; when the slip term coefficient value is less than the adhesion term coefficient value, the flexible film material adheres to the target pattern 120 area of the target surface workpiece 130.
The conformal attaching compliance state description based on the simulated conformal mapping relation comprises the following steps: when the flexible film material adheres to the target pattern 120 area of the target surface workpiece 130, the conformal adhesion compliance state is determined based on the measured conformal mapping between the initial pattern 110 and the target pattern 120 and the mechanical properties of the flexible film material.
The conformal adhesion compliance is a concept that a flexible thin film material of a certain initial pattern 110 is adhered to a target surface, the geometry of the flexible thin film material is consistent with that of a target pattern 120 after adhesion, the conformal compliance includes two concepts that whether conformal adhesion fails or not and a conformal adhesion state, whether the conformal adhesion fails or not depends on competition between two conditions, one is competition between surface stress of the flexible thin film material and interface acting force of the flexible thin film material and the target surface when the mechanical property of the flexible thin film material is fixed, and the other is competition between mechanical property of the flexible thin film material and conformal mapping between the initial pattern 110 and the target pattern 120 when the interface acting force of the flexible thin film material and the target surface is enough, and the conformal adhesion state is represented as a conformal mapping relation between the initial pattern 110 and the target pattern 120.
Further, fitting the measured conformal mapping relation based on a least square method to obtain a sliding term coefficient value and an adhesion term coefficient value in a fitting function model describing conformal compliance, wherein the method comprises the following steps:
giving a definition of a conformal factor for quantitative calculation of conformal-attach compliance based on a first basis shape of a differential geometric surfaceThe conformal factor defines the mapping relation used for calculating the initial graph and the target graph, +.>The method comprises the steps that the first basic shape of a curved surface of a target graph is obtained, and I is the first basic shape of the curved surface of an initial graph; />The target surface is a rotationally symmetrical curved surface, the target pattern is a rotationally symmetrical curved surface with a boundary, the initial pattern is a projected circle of the rotationally symmetrical curved surface along the rotationally symmetrical axial direction, the axial direction and the normal direction are respectively subjected to stress analysis, the initial pattern is a circular flexible film material radius D, and the thickness of the film isThe local curvature radius of the rotationally symmetrical curved surface is R 0 The interaction pressure between the flexible film material and the target surface is P, the friction adhesion acts in the tangential direction of the curved surface parameter space, and the friction coefficient is +.>With circumferential stress +.>And radial stress->；/>
When (when)When 0, the drug is added>The differential mapping relation of arc length between the initial pattern and the target pattern is constant +.>When->At maximum, there is circumferential strain provided the material is incompressibleThe local differential mapping relation of arc length between the initial graph and the target graph is +.>；
Based on the clamping method, a fitting function model for describing conformal compliance is provided, the interaction force between the actual flexible film material and the target surface is between minimum and maximum, the competition between sliding and adhesion is reflected, and a weighted summation mode is adopted to fit the conformal mapping relation of arc length in the actual situation：，/>For sliding item coefficient value, ++>For sliding item->For adhesion term coefficient value, < >>Is an adhesion term.
The invention also provides a compliance analysis system for conformal attachment of a flexible film material, comprising: the raw material marking and cutting module is used for preparing a site marking pattern 140 at marking points on the surface of the flexible film material and cutting the flexible film material into an initial pattern 110 based on the site marking pattern 140; an affixing module for conformally affixing the flexible film material in the target pattern 120 area of the target surface workpiece 130; the distance field calculation module is used for obtaining the distance between the site marking patterns 140 under a preset angle, scanning the site marking patterns 140 of the flexible film material on the target surface workpiece 130, and obtaining the distance field distribution before and after conformal attachment of the site marking patterns 140 on the flexible film material; the measurement conformal mapping module is used for calculating the spatial position of the marking site according to the distance between the site marking patterns 140 under the preset angle and the distance field distribution before and after the conformal attachment of the site marking patterns 140 on the flexible film material, and obtaining the measurement conformal mapping relation between the initial pattern 110 and the target pattern 120 which are experimentally measured according to the spatial position of the marking site; the coefficient value calculation module is used for fitting the measurement conformal mapping relation to obtain a sliding term coefficient value and an adhesion term coefficient value in a fitting function model for describing conformal compliance; the compliance state description module is configured to establish a simulated conformal mapping relationship between the initial pattern 110 and the target pattern 120 in the conformal-attached scene through a parameterized modeling method, quantitatively determine whether the conformal-attached compliance performance is achieved based on the sliding term coefficient value and the adhesion term coefficient value in the fitting function model of the conformal-attached scene, and describe the conformal-attached compliance state based on the simulated conformal mapping relationship.
The application also provides an electronic device comprising: the device comprises a memory, a processor and a computer program stored on the memory and capable of running on the processor, wherein the processor realizes the method for analyzing the conformal attachment compliance of the flexible film material when executing the computer program.
The processor and the memory may be connected by a bus or other means.
The memory, as a non-transitory computer readable storage medium, may be used to store non-transitory software programs as well as non-transitory computer executable programs. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid state storage device. In some embodiments, the memory optionally includes memory remotely located relative to the processor, the remote memory being connectable to the processor through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
The apparatus embodiments described above are merely illustrative, in which the elements illustrated as separate components may or may not be physically separate, may be located in one place, or may be distributed over a plurality of network elements. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, an embodiment of the present invention further provides a computer readable storage medium storing computer executable instructions that are executed by a processor or a controller, for example, by one of the processors in the above terminal embodiment, so that the above processor performs the method for analyzing the conformally attaching compliance of the flexible film material in the above embodiment.
Those of ordinary skill in the art will appreciate that all or some of the steps, systems, and methods disclosed above may be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components may be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on computer readable media, which may include computer storage media (or non-transitory media) and communication media (or transitory media). The term computer storage media includes both volatile and nonvolatile, removable and non-removable media implemented in any method or technology for storage of information such as computer readable instructions, data structures, program modules or other data, as known to those skilled in the art. Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technology, CD-ROM, digital Versatile Disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, or any other medium which can be used to store the desired information and which can be accessed by a computer. Furthermore, as is well known to those of ordinary skill in the art, communication media typically embodies computer readable instructions, data structures, program modules or other data in a modulated data signal such as a carrier wave or other transport mechanism and includes any information delivery media.
While the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the above embodiment, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are included in the scope of the present invention as defined in the appended claims.
The above-described embodiments of the present invention do not limit the scope of the present invention. Any of various other corresponding changes and modifications made according to the technical idea of the present invention should be included in the scope of the claims of the present invention.
Claims (9)
1. The method for analyzing the conformally attached compliance of the flexible film material is characterized by comprising the following steps of:
preparing a site marking pattern at marking points on the surface of the flexible film material, and cutting the flexible film material into an initial pattern based on the site marking pattern;
conformally attaching the cut flexible film material in a target pattern area of a target surface workpiece;
acquiring the distance between the site marking patterns under a preset angle, and carrying out scanning measurement on the site marking patterns of the flexible film material on the target surface workpiece to acquire the distance field distribution before and after conformal attachment of the site marking patterns on the flexible film material;
calculating to obtain the space position of the mark site according to the distance between the site mark patterns under the preset angle and the distance field distribution before and after the conformal attachment of the site mark patterns on the flexible film material, and obtaining the measurement conformal mapping relation between the initial pattern and the target pattern which are experimentally measured according to the space position of the mark site;
fitting the measurement conformal mapping relation to obtain a sliding term coefficient value and an adhesion term coefficient value in a fitting function model describing conformal compliance;
establishing a simulated conformal mapping relation between an initial graph and a target graph in a conformal-attached scene, quantitatively judging whether the conformal-attached compliance performance is realized or not based on a sliding item coefficient value and an adhesion item coefficient value in a conformal-attached function model, and describing the conformal-attached compliance state based on the simulated conformal mapping relation.
2. The method for analyzing the conformal adhesion compliance of a flexible film material according to claim 1, wherein the quantitative determination of whether the conformal adhesion compliance is achieved is performed based on the sliding term coefficient value and the adhesion term coefficient value in the fitting function model of the conformal compliance, comprises the steps of:
when the sliding term coefficient value is larger than the adhesion term coefficient value, the flexible film material slides relatively in a target pattern area of the target surface workpiece; when the sliding term coefficient value is smaller than the adhering term coefficient value, the flexible film material adheres to the target pattern area of the target surface workpiece.
3. The method of claim 2, wherein the conformal-attachment-compliance state description of the flexible film material based on the simulated conformal mapping relationship comprises the steps of:
and when the flexible film material is adhered to a target pattern area of a target surface workpiece, judging the conformal adhesion compliance state according to the measured conformal mapping relation between the initial pattern and the target pattern and the mechanical property of the flexible film material.
4. The method for analyzing the conformally affixed compliance of a flexible film material according to claim 1, wherein fitting the measured conformally mapped relationship to obtain a sliding term coefficient value and an adhering term coefficient value in a fitting function model describing the conformally affixed compliance, comprises the steps of:
giving a definition of a conformal factor for quantitative calculation of conformal-attach compliance based on a first basis shape of a differential geometric surfaceThe conformal factor defines the mapping relation used for calculating the initial graph and the target graph, +.>The method comprises the steps that the first basic shape of a curved surface of a target graph is obtained, and I is the first basic shape of the curved surface of an initial graph; />The target surface is a rotationally symmetrical curved surface, the target pattern is a rotationally symmetrical curved surface with a boundary, the initial pattern is a projected circle of the rotationally symmetrical curved surface along the rotationally symmetrical axial direction, stress analysis is respectively carried out on the axial direction and the normal direction, the initial pattern is provided with a circular flexible film material radius D, and the thickness of the film is->Local of rotationally symmetrical curved surfaceRadius of curvature of the portion R 0 The interaction pressure between the flexible film material and the target surface is P, the friction adhesion acts in the tangential direction of the curved surface parameter space, and the friction coefficient is +.>With circumferential stress +.>And radial stress->；When->When 0, the drug is added>The differential mapping relation of arc length between the initial pattern and the target pattern is constant +.>When->At maximum, assuming the material is incompressible, there is circumferential strain +.>The local differential mapping relation of arc length between the initial graph and the target graph is +.>；
The fitting function model for describing conformal compliance is proposed based on a clamping method, the interaction force between the actual flexible film material and the target surface is between minimum and maximum, the competition between sliding and adhesion is reflected, and weighted summation is adoptedFitting the conformal mapping relation of arc length in actual situation：/>，For sliding item coefficient value, ++>For sliding item->For adhesion term coefficient value, < >>Is an adhesion term.
5. The method for analyzing compliance of conformal attachment of a flexible film material according to claim 1, wherein obtaining a distance between the site mark patterns at a predetermined angle comprises the steps of:
and adjusting the position of each straight barrel microscope through a 3-axis displacement system, and acquiring the distance between the site marking patterns under the preset angle through the straight barrel microscope.
6. The method for analyzing the conformally affixed compliance of a flexible thin-film material according to claim 1, wherein the site marking pattern is a plurality of circular arcs distributed around a circle center, and the site marking pattern displays a plurality of concentric circles on the surface of the flexible thin-film material.
7. A compliant film material conformally affixed compliance analysis system, comprising:
the raw material marking and cutting module is used for preparing a site marking pattern at marking points on the surface of the flexible film material and cutting the flexible film material into an initial pattern based on the site marking pattern;
the attaching module is used for conformally attaching the flexible film material in a target pattern area of the target surface workpiece;
the distance field calculation module is used for obtaining the distance between the site marking patterns under a preset angle, carrying out scanning measurement on the site marking patterns of the flexible film material on the target surface workpiece, and obtaining the distance field distribution before and after conformal attachment of the site marking patterns on the flexible film material;
the measurement conformal mapping module is in communication connection with the distance field calculation module and is used for calculating to obtain the spatial position of the marking site according to the distance between the marking patterns of the site under a preset angle and the distance field distribution before and after conformal attachment of the marking patterns of the site on the flexible film material, and obtaining the measurement conformal mapping relation between the initial graph and the target graph which are experimentally measured according to the spatial position of the marking site;
the coefficient value calculation module is in communication connection with the measurement conformal mapping module, and fits the measurement conformal mapping relation to obtain a sliding term coefficient value and an adhesion term coefficient value in a fitting function model describing conformal compliance;
the compliance state description module is in communication connection with the measurement conformal mapping module and the coefficient value calculation module and is used for establishing a simulation conformal mapping relation between an initial graph and a target graph in a conformal attaching scene, quantitatively judging whether the conformal attaching compliance performance is realized or not based on a sliding item coefficient value and an adhesion item coefficient value in a fitting function model of the conformal compliance, and describing the conformal attaching compliance state based on the simulation conformal mapping relation.
8. An electronic device, comprising: a memory, a processor and a computer program stored on the memory and executable on the processor, wherein the processor implements the method of conformally affixing a flexible film material according to any one of claims 1 to 6 when the computer program is executed by the processor.
9. A computer-readable storage medium storing computer-executable instructions for causing a computer to perform the method of conformally affixing a flexible thin-film material according to any one of claims 1 to 6.
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