CN117025119A - Shell-core structure micron-sized array adhesion pad with pits on surface - Google Patents

Shell-core structure micron-sized array adhesion pad with pits on surface Download PDF

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Publication number
CN117025119A
CN117025119A CN202311108390.XA CN202311108390A CN117025119A CN 117025119 A CN117025119 A CN 117025119A CN 202311108390 A CN202311108390 A CN 202311108390A CN 117025119 A CN117025119 A CN 117025119A
Authority
CN
China
Prior art keywords
pits
adhesive pad
shell
micro
soft
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202311108390.XA
Other languages
Chinese (zh)
Inventor
薛龙建
朱博
史哲坤
李刚
肖康建
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan University WHU
Original Assignee
Wuhan University WHU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wuhan University WHU filed Critical Wuhan University WHU
Priority to CN202311108390.XA priority Critical patent/CN117025119A/en
Publication of CN117025119A publication Critical patent/CN117025119A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/04—Networks or arrays of similar microstructural devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00214—Processes for the simultaneaous manufacturing of a network or an array of similar microstructural devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane
    • C09J2483/006—Presence of polysiloxane in the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The application discloses a shell-core structure micron-sized array adhesive pad with pits on the surface. The adhesive pad includes: a soft back and a soft plane; a columnar array structure formed by a plurality of columnar unit arrays on the soft back for generating adhesion; wherein the columnar unit includes: the soft shell is a hollow cylinder; a hard core, a columnar structure, and a soft shell; pit, cavity formed by the difference in height between soft shell and hard core top for better contact and larger contact area under smaller load. The technical scheme is used for cyclic adhesion in complex environments such as dry state, wet state, liquid state and the like. The adhesive pad has good stability and high adhesive force, solves the defect that the traditional columnar array bionic adhesive pad has low adhesive force and can not realize effective adhesion in complex environments, and has wide application scenes in the fields of nondestructive transportation, micro-nano processing, robots and the like.

Description

Shell-core structure micron-sized array adhesion pad with pits on surface
Technical Field
The application belongs to the technical field of surface adhesion, relates to a shell-core structure intelligent adhesion membrane with pits at the top, and in particular relates to a bionic adhesion pad capable of realizing reversible adhesion in a dry state, a wet state and under liquid.
Background
For the field of microelectronic processing, the realization of the nondestructive and pollution-free transfer of the micro-nano chip is important for the processing, storage and transportation of the chip. The bionic columnar adhesion pad can provide nondestructive and pollution-free efficient reversible adhesion. Reversible adhesive pads applicable to industrial production should be compatible with high adhesive performance, high stability and adaptability under different environments. In particular, in the micro-nano processing field, the adhesion pad needs to achieve reversible adhesion in a liquid environment with photoresist, and thus needs to adhere in a wet or even liquid environment. The simple cylindrical array has low adhesion and can not achieve reversible adhesion with certain strength under special environment.
There is therefore a need for a columnar array that can achieve stable adhesion in dry, wet and submerged environments.
Disclosure of Invention
In view of the above, the application provides a shell-core structure micron-sized array bionic adhesion pad with pits on the surfaces of gecko toe bristles and octopus foot suction cups, which can realize strong adhesion under different working environments and simultaneously give consideration to structural stability.
The technical scheme provided by the application is as follows:
a shell-core structured micro-scale array adhesive pad with pits on the surface, comprising:
a soft back and a soft plane;
a columnar array structure formed by a plurality of columnar unit arrays on the soft back for generating adhesion;
wherein the columnar unit includes:
the soft shell is a hollow cylinder;
a hard core, a columnar structure, and a soft shell;
pit, cavity formed by the difference in height between soft shell and hard core top for better contact and larger contact area under smaller load.
Further, the modulus of the hard core is higher than that of the soft shell, and the material is one or a combination of a plurality of high polymer materials, inorganic nonmetallic materials, metal materials and composite materials. Preferably, polymeric materials such as PS, PVC, PCL; inorganic nonmetallic materials such as carbon nanotubes, carbon fibers, glass fibers; any one or a combination of a plurality of materials such as silver nanowires, gold nanowires and the like.
Further, the hard core is composed of a single root or a plurality of roots.
Further, the hard core can change temperature through external stimulus so as to adjust the modulus; the stimulation includes electrical heating by an external lead, photothermal effect heating by a hard core made of a photothermal material, and electromagnetic heating by an external electromagnetic field.
Further, the shape of the top surface of the hard core may be any shape, including polygonal, circular, and curved and rectilinear patterns.
Further, the hard core and the soft shell are sealed by connection, and the connection forms a core-shell structure with obvious interface or a gradual change structure without obvious interface.
Still further, the graded structure having no distinct interface is a structure including an interface between two phases becoming insignificant by diffusion.
Still further, the connection means between the hard core and the soft shell includes physical connection, chemical connection, and a combination of both.
The hard core has a variety of functions including supporting and enhancing adhesion, and may also be given its corresponding functionality or intelligence through the use of functional materials.
Further, the bottom surface of the pit is continuously enlarged from bottom to top.
Still further, the shape of the pit includes an inverted cone, an inverted mesa, and a segment.
Further, the soft shell is made of a high polymer material. Preferably, the polymer material comprises plastics and rubber; among them, plastics include, for example, polyethylene (PE), polystyrene (PS), polyvinyl Chloride (PCL), polylactic acid (PLA), and the like; the rubber includes silicone rubber, fluororubber, carbon-based rubber, and the like.
Further, the arrangement mode of the columnar array structure comprises square, round, random arrangement and combination thereof. Preferred arrangements include one or a combination of tetragonal, hexagonal, rhombic, concentric circular arrangements and custom graphic arrangements.
Further, a gap is left between adjacent columnar units.
Further, the shell material may be freely selected from hydrophilic or hydrophobic materials.
Further, the back has certain toughness, and can adapt to the surface profile of an adhered object. Preferred materials include any one or a combination of several of silicone rubber, fluororubber, polyolefin, gel, textile.
Further, the processing mode of the adhesion pad comprises one or a combination of a plurality of processing modes such as ultraviolet exposure, laser direct writing, two-photon laser direct writing, focused ion beam etching and the like.
Further, the columnar units are millimeter-sized, micrometer-sized or nanometer-sized.
Compared with the related art, the bionic adhesion pad has the following beneficial effects:
1. according to the adhesive pad, the hard core is embedded in the adhesive pad, and the conical pits are formed in the top end of the adhesive pad, so that the adhesive force of the adhesive pad is greatly improved.
2. Due to the pit design at the top end of the adhesion pad, water or other media in an adhesion interface can be effectively extruded, a sealing effect is achieved, and adhesion can be achieved in dry, wet, submerged and other complex media.
3. The adhesion device has no overhang structure, can circulate for many times, and realizes stable adhesion.
4. The adhesive pad has good stability and high adhesive force, solves the defect that the traditional columnar array bionic adhesive pad has low adhesive force and cannot realize effective adhesion in a complex environment, and has wide application scenes in the fields of nondestructive transportation, micro-nano processing, robots and the like.
5. The adhesion pad can realize corresponding functionality or intelligence by using the hard core of the functional or intelligent material, and provides richer application scenes.
Drawings
FIG. 1 is a three-view of a core-shell structure provided by an embodiment of the present application;
FIG. 2 illustrates several hard core structures according to embodiments of the present application;
FIG. 3 illustrates several pit shapes provided by embodiments of the present application;
FIG. 4 illustrates several microcolumn shapes provided by embodiments of the application for god;
FIG. 5 shows an arrangement of several micro-column arrays according to an embodiment of the present application;
wherein, the elements in the figure are identified as follows:
10-hard nuclei; 20-pit; 30-soft shell; 40-backing; 11-a cylindrical hard core; 12-triangular prism shaped hard nuclei; 13-a quadrangular prism shaped hard core; 14-truncated cone-shaped hard cores; 15-multi-strand hard nuclei; 21-conical pits; 22-cylindrical pits; 23-hexagonal pyramid shaped pits; 24-hexagonal frustum-shaped pits; 25-spherical pits; 31-a cylindrical microcolumn; 32-square microcolumns; 33-six-edged pigs; 51-a square array; a 52-hexagonal array; 53-concentric circular array.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to fall within the scope of the application.
In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The following disclosure provides many different embodiments, or examples, for implementing different features of the application. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
The specific procedure of the impact test of the present application will now be described with respect to a common application scenario. It should be noted that this common embodiment is not to be taken as a basis for understanding the essential characteristics of the application claimed to solve the technical problem, but is merely exemplary.
Example 1
A shell-core structured micro-scale array adhesive pad with pits on the surface, comprising:
a soft back 40, a soft plane;
a columnar array structure formed by a plurality of columnar unit arrays on the soft back for generating adhesion;
wherein the columnar unit includes:
the soft shell 30 is a hollow cylinder;
a hard core 10, a columnar structure, nested in a soft shell 30 for providing support;
pit 20, a cavity formed by the difference in height between the tops of soft shell 30 and hard core 10, is used to achieve better contact and a larger contact area under a smaller load.
As a preferred embodiment, in the smart adhesive pad, the soft shell and the back are made of low-modulus silicone rubber, the hard core is made of high-modulus silicone rubber, the diameter of the micro-pillars is 50 micrometers, the height is 100 micrometers, the diameter of the bottoms of the pits is 30 micrometers, the depth is 10 micrometers, the diameter of the tops is 50 micrometers, and the smart adhesive pad is arranged in a square array with a period of 70 micrometers (the transverse or longitudinal distance between adjacent columnar units), as shown in fig. 1.
The method for realizing reversible adhesion in a dry environment in the embodiment comprises the following main steps:
step one: and the surface of the columnar array with the pits faces to the adhered object, and the fit between the micro-columnar array and the surface of the adhered object is realized through the flexible back.
Step two: and applying pressure on the back of the adhesion pad, wherein the pits at the top ends of the microcolumns are flattened, the contact area of the microcolumns and an adhered object is effectively increased, better contact is formed, air in the pits at the top ends of the microcolumns is extruded out of the pits, the complete contact between the inner surfaces of the pits and the adhered surface is realized, and vacuum suction is generated.
Step three: and when the loading force is removed, the pit at the top end of the microcolumn tends to retract, the side wall of the pit and an adhered object are rubbed to generate a grabbing force, and the adhesion pad generates strong adhesion under the combined action of the adhesion force, the vacuum suction force and the grabbing force.
Step four: when the adhesive is required to be released, the adhesive pad is torn off from one side of the adhesive pad, so that the adhesive pad and the adhered object are peeled off.
Example 2
The structure of embodiment 2 is the same as that of embodiment 1, except that the present embodiment can realize intelligent release.
Specifically, the soft shell and the back of the intelligent adhesion pad are made of silicone rubber, the diameter of the microcolumn is 50 micrometers, the height of the microcolumn is 100 micrometers, the diameter of the bottom of the pit is 30 micrometers, the depth of the pit is 10 micrometers, the diameter of the top of the pit is 50 micrometers, the hard core is carbon fiber, the diameter of the pit is 30 micrometers, the height of the pit is 70 micrometers, and the pit is arranged in a square array with the period of 70 micrometers, as shown in fig. 1.
An intelligent reversible release and adhesion method comprises the following main steps:
step one: the hard core is heated by ultraviolet irradiation, so that the temperature of the microcolumn is integrally increased, the flexibility of a molecular chain of the soft shell material is increased, and the adhesion is further improved.
Step two: the surface of the columnar array with the pits faces to the adhered object, the fit between the micro-columnar array and the surface of the adhered object is realized through the flexible back, pressure is applied to the back of the adhesion pad, and air in the pits at the tops of the micro-columns is extruded out of the pits, so that the complete contact between the inner surfaces of the pits and the adhered surface is realized.
Step three: when the adhesion is required to be removed, the ultraviolet lamp is turned off, so that the whole microcolumn is cooled, and the adhesion pad and the adhered object are peeled off.
The present application is not limited to the above-mentioned embodiments, but any modifications, equivalents, improvements and modifications within the scope of the application will be apparent to those skilled in the art.

Claims (10)

1. A shell-core structured micro-scale array adhesive pad with pits on the surface, comprising:
a soft back and a soft plane;
a columnar array structure formed by a plurality of columnar unit arrays on the soft back for generating adhesion;
wherein the columnar unit includes:
the soft shell is a hollow cylinder;
a hard core, a columnar structure, and a soft shell;
pit, cavity formed by the difference in height between soft shell and hard core top for better contact and larger contact area under smaller load.
2. The micro-scale array adhesive pad with a pit on the surface according to claim 1, wherein the modulus of the hard core is higher than that of the soft shell, and the material is one or a combination of several of high polymer material, inorganic nonmetallic material, metallic material and composite material.
3. The micro-scale array adhesive pad with pits on the surface according to claim 1, wherein the hard core consists of a single piece or a plurality of pieces.
4. The micro-scale array adhesive pad with pits on the surface according to claim 1, wherein the hard core can change the temperature by external stimulus to adjust the modulus; the stimulation includes electrical heating by an external lead, photothermal effect heating by a hard core made of a photothermal material, and electromagnetic heating by an external electromagnetic field.
5. The micro-scale array adhesive pad with a pit on the surface according to claim 1, wherein the hard core and the soft shell are sealed by connection, and the connection forms a core-shell structure with obvious interface or a gradual change structure without obvious interface.
6. The micro array adhesive pad with a pit on the surface according to claim 5, wherein the connection mode between the hard core and the soft shell comprises physical connection, chemical connection and the combination of the two.
7. The micro array adhesive pad of shell-core structure with pits on the surface according to claim 1, wherein the bottom surface of the pits increases continuously from bottom to top.
8. The micro array adhesive pad of shell-core structure with pits on the surface according to claim 7, wherein the shape of the pits includes inverted cone, inverted mesa and sphere.
9. The micro-scale array adhesive pad with pits on the surface according to claim 1, wherein the soft shell material is a polymer material.
10. The micro-scale array adhesive pad with pits on the surface according to claim 1, wherein the arrangement of the columnar array structure comprises square, round, random arrangement and a combination thereof.
CN202311108390.XA 2023-08-30 2023-08-30 Shell-core structure micron-sized array adhesion pad with pits on surface Pending CN117025119A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202311108390.XA CN117025119A (en) 2023-08-30 2023-08-30 Shell-core structure micron-sized array adhesion pad with pits on surface

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202311108390.XA CN117025119A (en) 2023-08-30 2023-08-30 Shell-core structure micron-sized array adhesion pad with pits on surface

Publications (1)

Publication Number Publication Date
CN117025119A true CN117025119A (en) 2023-11-10

Family

ID=88639150

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202311108390.XA Pending CN117025119A (en) 2023-08-30 2023-08-30 Shell-core structure micron-sized array adhesion pad with pits on surface

Country Status (1)

Country Link
CN (1) CN117025119A (en)

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