CN116997100B - Bonding pad manufacturing method, system and medium based on machine vision - Google Patents
Bonding pad manufacturing method, system and medium based on machine vision Download PDFInfo
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- CN116997100B CN116997100B CN202310614264.5A CN202310614264A CN116997100B CN 116997100 B CN116997100 B CN 116997100B CN 202310614264 A CN202310614264 A CN 202310614264A CN 116997100 B CN116997100 B CN 116997100B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 87
- 238000000149 argon plasma sintering Methods 0.000 claims abstract description 112
- 238000005245 sintering Methods 0.000 claims abstract description 92
- 238000000034 method Methods 0.000 claims description 18
- 238000009826 distribution Methods 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000004364 calculation method Methods 0.000 claims description 11
- 238000003860 storage Methods 0.000 claims description 11
- 238000007781 pre-processing Methods 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims 2
- 238000009795 derivation Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
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- 230000003287 optical effect Effects 0.000 description 2
- 238000011897 real-time detection Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
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- 230000002265 prevention Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
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Abstract
The embodiment of the application provides a bonding pad manufacturing method, a bonding pad manufacturing system and a bonding pad manufacturing medium based on machine vision, wherein the bonding pad manufacturing method comprises the following steps: acquiring PCB image information to obtain a laser sintering area; positioning the PCB by a tooling fixture, and obtaining position information of a plurality of positioning points; establishing laser sintering area information according to the positioning point position information, and collecting temperature information of a laser sintering area; comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate; judging whether the temperature deviation rate is larger than or equal to a preset temperature threshold value; if the laser parameters are larger than or equal to the laser sintering parameters, generating adjustment information, and adjusting the laser parameters of the laser sintering area according to the adjustment information; if the laser sintering parameters are smaller than the preset parameters, sintering and manufacturing the laser sintering area according to the preset parameters; the laser parameters are adjusted in real time by judging the temperatures of different positions of the PCB, so that the safety of sintering and manufacturing of the bonding pads is ensured, and the damage of the PCB is prevented.
Description
Technical Field
The application relates to the field of bonding pad manufacturing, in particular to a bonding pad manufacturing method, a bonding pad manufacturing system and a bonding pad manufacturing medium based on machine vision.
Background
After the completion of the existing bonding pad, the bonding pad cannot be effectively protected to a half-cavity area to be used as the bonding pad when the PP glue overflows, the outer layer is etched or the welding prevention is manufactured, the sinking thickness of the bonding pad cannot be monitored in real time in the manufacturing process of the bonding pad, the thickness of the PCB is large after the device is installed, the integrated installation of the PCB is affected, in addition, the laser parameters cannot be adjusted in real time according to the temperatures of different areas of the PCB in the manufacturing process of the existing bonding pad, the high-temperature damage of the PCB is easily caused, and aiming at the problems, an effective technical solution to be needed is urgently.
Disclosure of Invention
An object of the embodiment of the application is to provide a bonding pad manufacturing method, a bonding pad manufacturing system and a bonding pad manufacturing medium based on machine vision, which can adjust laser parameters in real time by judging temperatures of different positions of a PCB, ensure the safety of bonding pad sintering manufacturing and prevent the damage of the PCB.
The embodiment of the application also provides a bonding pad manufacturing method based on machine vision, which comprises the following steps:
acquiring PCB image information, and preprocessing the PCB image information to obtain a laser sintering area;
positioning the PCB by a tooling fixture, and obtaining position information of a plurality of positioning points;
establishing laser sintering area information according to the positioning point position information, and collecting temperature information of a laser sintering area;
comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate;
judging whether the temperature deviation rate is larger than or equal to a preset temperature threshold value;
if the laser parameters are larger than or equal to the laser sintering parameters, generating adjustment information, and adjusting the laser parameters of the laser sintering area according to the adjustment information;
and if the laser sintering parameters are smaller than the preset parameters, sintering and manufacturing the laser sintering area according to the preset parameters.
Optionally, in the machine vision based pad manufacturing method according to the embodiment of the present application, the obtaining PCB image information, preprocessing the PCB image information to obtain a laser sintering area includes:
acquiring a PCB image, dividing the PCB image into a plurality of subregions, and extracting the characteristic values of the subregions;
comparing the image characteristic values of the plurality of sub-areas with preset image characteristic values to obtain a characteristic deviation rate;
judging whether the characteristic deviation rate is larger than a first deviation rate threshold value and smaller than a second deviation rate threshold value;
if the deviation ratio is larger than the first deviation ratio threshold and smaller than the second deviation ratio threshold, generating correction information, and correcting the sub-area image characteristic value according to the correction information;
if the image characteristic values are smaller than or equal to the first deviation rate threshold value, fusing the image characteristic values of the plurality of sub-areas;
if the image characteristic value is larger than or equal to the second deviation rate threshold value, eliminating the corresponding sub-region image characteristic value;
the first deviation rate threshold is less than the second deviation rate threshold.
Optionally, in the machine vision based pad manufacturing method according to the embodiment of the present application, the positioning of the PCB board by the tooling fixture and obtaining the positional information of a plurality of positioning points include:
acquiring tool jig parameter information and establishing a positioning column movement track model;
generating a predicted track of the positioning column according to the movement track model of the positioning column;
obtaining a current moving track of the positioning column, and performing similarity calculation on a predicted track of the positioning column and the current moving track to obtain track similarity;
judging whether the track similarity is larger than or equal to a preset similarity threshold value;
if the position information is greater than or equal to the positioning column distribution information, positioning point position information is established according to the positioning column distribution information;
if the position feedback information is smaller than the preset value, generating position feedback information, and adjusting the position of the positioning column according to the position feedback information.
Optionally, in the machine vision based pad manufacturing method according to the embodiment of the present application, the PCB board is stacked and staggered with the circuit through the dielectric layer, and the top surface and the bottom surface of the PCB board are both dielectric layers, the bottom of the PCB board is provided with solder resist ink, the laser sintering area is located in the middle area of the top of the PCB board, solder resist ink is provided on the top of the PCB board and on two sides of the sintering area, and the set laser parameters break down the dielectric layer of the sintering area to manufacture the pad.
Optionally, in the machine vision based pad manufacturing method described in the embodiment of the present application, a temperature sensor is disposed at the top of the positioning column, and temperature data corresponding to the position of the PCB board is detected in real time by the temperature sensor;
judging whether the temperature data is larger than a preset temperature threshold value or not;
if the heat conduction parameter is larger than the preset value, generating a heat conduction parameter, and conducting heat out through the positioning column according to the heat conduction parameter;
if the laser sintering parameters are smaller than the preset sintering parameters, generating sintering feedback parameters, and adjusting laser sintering parameters according to the sintering feedback parameters.
Optionally, in the method for manufacturing a bonding pad based on machine vision according to the embodiment of the present application, if the bonding pad is smaller than the predetermined threshold, sintering and manufacturing the laser sintering area according to the current laser parameters;
acquiring the sintered PCB image information, and extracting the PCB surface image information;
slicing the surface image of the PCB according to the length direction of the PCB to obtain a plurality of slice images;
extracting the gray value of each slice image;
carrying out difference calculation on gray values of adjacent slice images to obtain gray difference values;
judging whether the gray difference value is smaller than a preset gray threshold value or not;
if the surface of the PCB at the two corresponding slice images is flush, judging that the surface of the PCB at the two corresponding slice images is flush;
if the difference is larger than the preset value, judging that the PCB at the two corresponding slice images is provided with a groove, and calculating the depth of the groove according to the corresponding gray difference;
setting laser parameters according to a preset manufacturing depth, and carrying out groove sintering on the sintering area;
and stopping sintering when the depth of the groove is equal to the preset manufacturing depth, and finishing the manufacture of the bonding pad.
In a second aspect, embodiments of the present application provide a machine vision based bond pad fabrication system, the system comprising: the device comprises a memory and a processor, wherein the memory comprises a program of a bonding pad manufacturing method based on machine vision, and the program of the bonding pad manufacturing method based on machine vision realizes the following steps when being executed by the processor:
acquiring PCB image information, and preprocessing the PCB image information to obtain a laser sintering area;
positioning the PCB by a tooling fixture, and obtaining position information of a plurality of positioning points;
establishing laser sintering area information according to the positioning point position information, and collecting temperature information of a laser sintering area;
comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate;
judging whether the temperature deviation rate is larger than or equal to a preset temperature threshold value;
if the laser parameters are larger than or equal to the laser sintering parameters, generating adjustment information, and adjusting the laser parameters of the laser sintering area according to the adjustment information;
and if the laser sintering parameters are smaller than the preset parameters, sintering and manufacturing the laser sintering area according to the preset parameters.
Optionally, in the machine vision based pad manufacturing system according to the embodiment of the present application, the obtaining PCB image information, preprocessing the PCB image information to obtain a laser sintering area, includes:
acquiring a PCB image, dividing the PCB image into a plurality of subregions, and extracting the characteristic values of the subregions;
comparing the image characteristic values of the plurality of sub-areas with preset image characteristic values to obtain a characteristic deviation rate;
judging whether the characteristic deviation rate is larger than a first deviation rate threshold value and smaller than a second deviation rate threshold value;
if the deviation ratio is larger than the first deviation ratio threshold and smaller than the second deviation ratio threshold, generating correction information, and correcting the sub-area image characteristic value according to the correction information;
if the image characteristic values are smaller than or equal to the first deviation rate threshold value, fusing the image characteristic values of the plurality of sub-areas;
if the image characteristic value is larger than or equal to the second deviation rate threshold value, eliminating the corresponding sub-region image characteristic value;
the first deviation rate threshold is less than the second deviation rate threshold.
Optionally, in the machine vision based pad manufacturing system according to the embodiment of the present application, the positioning of the PCB board by the tooling fixture and obtaining a plurality of positioning point position information include:
acquiring tool jig parameter information and establishing a positioning column movement track model;
generating a predicted track of the positioning column according to the movement track model of the positioning column;
obtaining a current moving track of the positioning column, and performing similarity calculation on a predicted track of the positioning column and the current moving track to obtain track similarity;
judging whether the track similarity is larger than or equal to a preset similarity threshold value;
if the position information is greater than or equal to the positioning column distribution information, positioning point position information is established according to the positioning column distribution information;
if the position feedback information is smaller than the preset value, generating position feedback information, and adjusting the position of the positioning column according to the position feedback information.
In a third aspect, embodiments of the present application further provide a computer readable storage medium, where a machine vision based pad manufacturing method program is included, where the machine vision based pad manufacturing method program, when executed by a processor, implements the steps of the machine vision based pad manufacturing method according to any one of the above.
As can be seen from the above, according to the machine vision-based method, system and medium for manufacturing a bonding pad provided by the embodiments of the present application, the PCB image information is preprocessed by obtaining the PCB image information, so as to obtain a laser sintering area; positioning the PCB by a tooling fixture, and obtaining position information of a plurality of positioning points; establishing laser sintering area information according to the positioning point position information, and collecting temperature information of a laser sintering area; comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate; judging whether the temperature deviation rate is larger than or equal to a preset temperature threshold value; if the laser parameters are larger than or equal to the laser sintering parameters, generating adjustment information, and adjusting the laser parameters of the laser sintering area according to the adjustment information; if the laser sintering parameters are smaller than the preset parameters, sintering and manufacturing the laser sintering area according to the preset parameters; and the laser parameters are adjusted in real time by judging the temperatures of different positions of the PCB, so that the safety of sintering and manufacturing of the bonding pads is ensured, and the damage of the PCB is prevented.
Additional features and advantages of the application will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the application embodiments. The objectives and other advantages of the application will be realized and attained by the structure particularly pointed out in the written description and claims thereof as well as the appended drawings.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments of the present application will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a flowchart of a machine vision-based pad manufacturing method according to an embodiment of the present application;
fig. 2 is a flowchart of a processing of a sub-region image feature value of a machine vision-based pad manufacturing method according to an embodiment of the present application;
fig. 3 is a flowchart of adjusting the position of a positioning column in the machine vision-based pad manufacturing method according to the embodiment of the present application;
fig. 4 is a flowchart of performing groove sintering on a sintering area according to a preset manufacturing depth according to a machine vision-based pad manufacturing method provided in an embodiment of the present application;
fig. 5 is a schematic structural diagram of a machine vision-based pad manufacturing system according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The components of the embodiments of the present application, which are generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to be within the scope of the present application.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only to distinguish the description, and are not to be construed as indicating or implying relative importance.
Referring to fig. 1, fig. 1 is a flowchart of a machine vision-based pad manufacturing method according to some embodiments of the present application. The machine vision-based bonding pad manufacturing method is used in terminal equipment and comprises the following steps of:
s101, acquiring PCB image information, and preprocessing the PCB image information to obtain a laser sintering area;
s102, positioning the PCB by a tooling fixture, and obtaining position information of a plurality of positioning points;
s103, establishing laser sintering area distribution information according to the positioning point position information, and collecting temperature information of a laser sintering area;
s104, comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate;
s105, judging whether the temperature deviation rate is larger than or equal to a preset temperature threshold value;
s106, if the laser sintering parameters are greater than or equal to the laser sintering parameters, generating adjustment information, and adjusting the laser parameters of the laser sintering area according to the adjustment information; and if the laser sintering parameters are smaller than the preset parameters, sintering and manufacturing the laser sintering area according to the preset parameters.
It is to be noted that, first choice needs to fix a position the PCB board, guarantees the precision of laser sintering in-process, simultaneously, in carrying out laser sintering in-process real-time detection PCB board laser sintering region's temperature, when great deviation appears in the temperature, can be through adjusting laser parameters, guarantee that laser sintering region's temperature is located reasonable scope, improves the security of PCB circuit.
Referring to fig. 2, fig. 2 is a flow chart of a process of processing a sub-region image feature value of a machine vision based pad manufacturing method according to some embodiments of the present application. According to the embodiment of the invention, the PCB image information is obtained, and is preprocessed to obtain the laser sintering area, which comprises the following steps:
s201, obtaining a PCB image, dividing a plurality of sub-areas of the PCB image, and extracting characteristic values of the sub-areas;
s202, comparing the image characteristic values of a plurality of sub-areas with preset image characteristic values to obtain a characteristic deviation rate;
s203, judging whether the characteristic deviation rate is larger than a first deviation rate threshold value and smaller than a second deviation rate threshold value;
s204, if the deviation ratio is larger than the first deviation ratio threshold and smaller than the second deviation ratio threshold, generating correction information, and correcting the characteristic value of the sub-area image according to the correction information;
s205, if the image characteristic values are smaller than or equal to the first deviation rate threshold value, fusing the image characteristic values of a plurality of sub-areas;
s206, if the image feature value is larger than or equal to the second deviation rate threshold value, eliminating the corresponding sub-region image feature value;
the first deviation ratio threshold is less than the second deviation ratio threshold.
The method is characterized in that the deviation rate of the characteristic values of the sub-region images is judged, the characteristic values of the sub-region images are corrected, the accuracy of the sub-region images is guaranteed, in addition, the characteristic values with larger deviation of the sub-region images are corrected, the corrected characteristic values are fused again, the accuracy of the PCB images is improved, and the positions and parameters of the laser sintering region are accurately acquired.
Referring to fig. 3, fig. 3 is a flowchart illustrating a positioning post position adjustment method according to some embodiments of the present application. According to the embodiment of the invention, the PCB is positioned by the tooling fixture, and the position information of a plurality of positioning points is obtained, comprising:
s301, acquiring parameter information of a tool and a fixture, and establishing a positioning column movement track model;
s302, generating a predicted track of the positioning column according to the movement track model of the positioning column;
s303, acquiring a current moving track of the positioning column, and calculating similarity between a predicted track of the positioning column and the current moving track to obtain track similarity;
s304, judging whether the track similarity is larger than or equal to a preset similarity threshold value;
s305, if the position information is greater than or equal to the position information, generating positioning column distribution information, and establishing positioning point position information according to the positioning column distribution information;
and S306, if the position feedback information is smaller than the preset value, generating position feedback information, and adjusting the position of the positioning column according to the position feedback information.
It is to be noted that, through obtaining the parameter information of frock tool, including the size, the shape of frock tool to carry out the judgement of the prediction orbit of reference column through reference column moving trajectory model, carry out the adjustment of reference column position according to the shape of different frock tools, PCB board, improve the location fastness of reference column, when the great deviation appears in the moving orbit of reference column, rectify the position of reference column.
According to the embodiment of the invention, the PCB is laminated and staggered through the dielectric layers and the circuits, the top surface and the bottom surface of the PCB are both dielectric layers, the bottom of the PCB is provided with solder resist ink, the laser sintering area is positioned in the middle area of the top of the PCB, the solder resist ink is arranged on the top of the PCB and on the two sides of the sintering area, and the solder pad is manufactured by puncturing the dielectric layers of the sintering area through the set laser parameters.
According to the embodiment of the invention, the top of the positioning column is provided with the temperature sensor, and the temperature data corresponding to the position of the PCB board is detected in real time through the temperature sensor;
judging whether the temperature data is larger than a preset temperature threshold value or not;
if the heat conduction parameter is larger than the preset value, generating a heat conduction parameter, and conducting heat out through the positioning column according to the heat conduction parameter;
if the laser sintering parameters are smaller than the preset sintering parameters, generating sintering feedback parameters, and adjusting laser sintering parameters according to the sintering feedback parameters.
It is to be noted that, through judging the temperature of the PCB board at reference column top, realize carrying out real-time supervision to PCB board temperature, when appearing higher temperature, need cool down to the PCB board, carry out heat derivation to the reference column through the heat conduction parameter this moment, the heat conduction parameter includes heat conduction's speed, heat conduction's coefficient of conductivity etc. when the temperature is less than preset temperature threshold value, it can accelerate to demonstrate laser sintering speed, can adjust laser sintering parameter this moment, improves sintering efficiency.
Referring to fig. 4, fig. 4 is a flow chart of groove sintering of a sintering region according to a preset manufacturing depth according to a machine vision-based pad manufacturing method in some embodiments of the present application. According to an embodiment of the present invention, if less than, sintering and manufacturing the laser sintering area according to the current laser parameters;
s401, acquiring the sintered PCB image information, and extracting the PCB surface image information;
s402, slicing the surface image of the PCB according to the length direction of the PCB to obtain a plurality of sliced images;
s403, extracting the gray value of each slice image, and performing difference calculation on the gray values of the adjacent slice images to obtain gray difference values;
s404, judging whether the gray difference value is smaller than a preset gray threshold value; if the surface of the PCB at the two corresponding slice images is flush, judging that the surface of the PCB at the two corresponding slice images is flush; if the difference is larger than the preset value, judging that the PCB at the two corresponding slice images is provided with a groove, and calculating the depth of the groove according to the corresponding gray difference;
s405, setting laser parameters according to a preset manufacturing depth, and performing groove sintering on the sintering area;
and S406, stopping sintering when the depth of the groove is equal to the preset manufacturing depth, and finishing the manufacture of the bonding pad.
It is to be noted that, through carrying out slicing treatment to the PCB board image, make PCB board image form a plurality of bar image, when the great deviation appears in adjacent bar image gray value, it appears the difference in height to state two bar images, calculates the depth that forms the recess after laser sintering through the gray difference, can regard as the basis of laser parameter adjustment, realizes real-time accurate adjustment recess's degree of depth.
According to an embodiment of the present invention, further comprising:
performing difference calculation on the depth of the groove and a preset manufacturing depth to obtain an adjacent depth;
judging whether the adjacent depth is larger than a preset depth;
if the sintering speed is greater than the first preset value, carrying out groove sintering on the sintering area according to the first laser parameters, and generating a first sintering travelling speed;
if the sintering speed is smaller than the first preset value, carrying out groove sintering on the sintering area according to the second laser parameters, and generating a second sintering travelling speed;
the first laser parameters are different from the second laser parameters; the first sintering travel speed is greater than the second sintering travel speed.
It should be noted that, groove sintering is performed on the sintering region according to different laser parameters, so as to realize the manufacture of the bonding pad, when the sintering region is sintered, the dielectric layer of the sintering region is sintered and melted by the CO2 laser, and the sintering travelling speed can be understood as the melting rate of the dielectric layer in the sintering region, namely the speed of increasing the groove depth, and the preferable groove depth is 50um.
Referring to fig. 5, fig. 5 is a schematic structural diagram of a machine vision-based bonding pad manufacturing system according to some embodiments of the present application. In a second aspect, embodiments of the present application provide a machine vision based bond pad fabrication system 5, comprising: the memory 51 and the processor 52, the memory 51 includes a program of a machine vision-based pad manufacturing method, and the machine vision-based pad manufacturing method program, when executed by the processor, realizes the following steps:
acquiring PCB image information, and preprocessing the PCB image information to obtain a laser sintering area;
positioning the PCB by a tooling fixture, and obtaining position information of a plurality of positioning points;
establishing laser sintering area information according to the positioning point position information, and collecting temperature information of a laser sintering area;
comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate;
judging whether the temperature deviation rate is larger than or equal to a preset temperature threshold value;
if the laser parameters are larger than or equal to the laser sintering parameters, generating adjustment information, and adjusting the laser parameters of the laser sintering area according to the adjustment information;
and if the laser sintering parameters are smaller than the preset parameters, sintering and manufacturing the laser sintering area according to the preset parameters.
It is to be noted that, first choice needs to fix a position the PCB board, guarantees the precision of laser sintering in-process, simultaneously, in carrying out laser sintering in-process real-time detection PCB board laser sintering region's temperature, when great deviation appears in the temperature, can be through adjusting laser parameters, guarantee that laser sintering region's temperature is located reasonable scope, improves the security of PCB circuit.
According to the embodiment of the invention, the PCB image information is obtained, and is preprocessed to obtain the laser sintering area, which comprises the following steps:
acquiring a PCB image, dividing the PCB image into a plurality of subregions, and extracting the characteristic values of the subregions;
comparing the image characteristic values of the plurality of sub-areas with preset image characteristic values to obtain a characteristic deviation rate;
judging whether the characteristic deviation rate is larger than a first deviation rate threshold value and smaller than a second deviation rate threshold value;
if the deviation ratio is larger than the first deviation ratio threshold and smaller than the second deviation ratio threshold, generating correction information, and correcting the sub-area image characteristic value according to the correction information;
if the image characteristic values are smaller than or equal to the first deviation rate threshold value, fusing the image characteristic values of the plurality of sub-areas;
if the image characteristic value is larger than or equal to the second deviation rate threshold value, eliminating the corresponding sub-region image characteristic value;
the first deviation ratio threshold is less than the second deviation ratio threshold.
The method is characterized in that the deviation rate of the characteristic values of the sub-region images is judged, the characteristic values of the sub-region images are corrected, the accuracy of the sub-region images is guaranteed, in addition, the characteristic values with larger deviation of the sub-region images are corrected, the corrected characteristic values are fused again, the accuracy of the PCB images is improved, and the positions and parameters of the laser sintering region are accurately acquired.
According to the embodiment of the invention, the PCB is positioned by the tooling fixture, and the position information of a plurality of positioning points is obtained, comprising:
acquiring tool jig parameter information and establishing a positioning column movement track model;
generating a predicted track of the positioning column according to the movement track model of the positioning column;
obtaining a current moving track of the positioning column, and performing similarity calculation on a predicted track of the positioning column and the current moving track to obtain track similarity;
judging whether the track similarity is larger than or equal to a preset similarity threshold value;
if the position information is greater than or equal to the positioning column distribution information, positioning point position information is established according to the positioning column distribution information;
if the position feedback information is smaller than the preset value, generating position feedback information, and adjusting the position of the positioning column according to the position feedback information.
It is to be noted that, through obtaining the parameter information of frock tool, including the size, the shape of frock tool to carry out the judgement of the prediction orbit of reference column through reference column moving trajectory model, carry out the adjustment of reference column position according to the shape of different frock tools, PCB board, improve the location fastness of reference column, when the great deviation appears in the moving orbit of reference column, rectify the position of reference column.
According to the embodiment of the invention, the PCB is laminated and staggered through the dielectric layers and the circuits, the top surface and the bottom surface of the PCB are both dielectric layers, the bottom of the PCB is provided with solder resist ink, the laser sintering area is positioned in the middle area of the top of the PCB, the solder resist ink is arranged on the top of the PCB and on the two sides of the sintering area, and the solder pad is manufactured by puncturing the dielectric layers of the sintering area through the set laser parameters.
According to the embodiment of the invention, the top of the positioning column is provided with the temperature sensor, and the temperature data corresponding to the position of the PCB board is detected in real time through the temperature sensor;
judging whether the temperature data is larger than a preset temperature threshold value or not;
if the heat conduction parameter is larger than the preset value, generating a heat conduction parameter, and conducting heat out through the positioning column according to the heat conduction parameter;
if the laser sintering parameters are smaller than the preset sintering parameters, generating sintering feedback parameters, and adjusting laser sintering parameters according to the sintering feedback parameters.
It is to be noted that, through judging the temperature of the PCB board at reference column top, realize carrying out real-time supervision to PCB board temperature, when appearing higher temperature, need cool down to the PCB board, carry out heat derivation to the reference column through the heat conduction parameter this moment, the heat conduction parameter includes heat conduction's speed, heat conduction's coefficient of conductivity etc. when the temperature is less than preset temperature threshold value, it can accelerate to demonstrate laser sintering speed, can adjust laser sintering parameter this moment, improves sintering efficiency.
According to an embodiment of the present invention, if less than, sintering and manufacturing the laser sintering area according to the current laser parameters;
acquiring the sintered PCB image information, and extracting the PCB surface image information;
slicing the surface image of the PCB according to the length direction of the PCB to obtain a plurality of slice images;
extracting the gray value of each slice image;
carrying out difference calculation on gray values of adjacent slice images to obtain gray difference values;
judging whether the gray difference value is smaller than a preset gray threshold value or not;
if the surface of the PCB at the two corresponding slice images is flush, judging that the surface of the PCB at the two corresponding slice images is flush;
if the difference is larger than the preset value, judging that the PCB at the two corresponding slice images is provided with a groove, and calculating the depth of the groove according to the corresponding gray difference;
setting laser parameters according to a preset manufacturing depth, and carrying out groove sintering on the sintering area;
and stopping sintering when the depth of the groove is equal to the preset manufacturing depth, and finishing the manufacture of the bonding pad.
It is to be noted that, through carrying out slicing treatment to the PCB board image, make PCB board image form a plurality of bar image, when the great deviation appears in adjacent bar image gray value, it appears the difference in height to state two bar images, calculates the depth that forms the recess after laser sintering through the gray difference, can regard as the basis of laser parameter adjustment, realizes real-time accurate adjustment recess's degree of depth.
According to an embodiment of the present invention, further comprising:
performing difference calculation on the depth of the groove and a preset manufacturing depth to obtain an adjacent depth;
judging whether the adjacent depth is larger than a preset depth;
if the sintering speed is greater than the first preset value, carrying out groove sintering on the sintering area according to the first laser parameters, and generating a first sintering travelling speed;
if the sintering speed is smaller than the first preset value, carrying out groove sintering on the sintering area according to the second laser parameters, and generating a second sintering travelling speed;
the first laser parameters are different from the second laser parameters; the first sintering travel speed is greater than the second sintering travel speed.
It should be noted that, groove sintering is performed on the sintering region according to different laser parameters, so as to realize the manufacture of the bonding pad, when the sintering region is sintered, the dielectric layer of the sintering region is sintered and melted by the CO2 laser, and the sintering travelling speed can be understood as the melting rate of the dielectric layer in the sintering region, namely the speed of increasing the groove depth, and the preferable groove depth is 50um.
A third aspect of the present invention provides a computer readable storage medium having embodied therein a machine vision based bonding pad fabrication method program which, when executed by a processor, implements the steps of the machine vision based bonding pad fabrication method as in any one of the above.
According to the machine vision-based bonding pad manufacturing method, system and medium disclosed by the invention, the PCB image information is obtained, and the PCB image information is preprocessed to obtain a laser sintering area; positioning the PCB by a tooling fixture, and obtaining position information of a plurality of positioning points; establishing laser sintering area information according to the positioning point position information, and collecting temperature information of a laser sintering area; comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate; judging whether the temperature deviation rate is larger than or equal to a preset temperature threshold value; if the laser parameters are larger than or equal to the laser sintering parameters, generating adjustment information, and adjusting the laser parameters of the laser sintering area according to the adjustment information; if the laser sintering parameters are smaller than the preset parameters, sintering and manufacturing the laser sintering area according to the preset parameters; and the laser parameters are adjusted in real time by judging the temperatures of different positions of the PCB, so that the safety of sintering and manufacturing of the bonding pads is ensured, and the damage of the PCB is prevented.
In the several embodiments provided in this application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above described device embodiments are only illustrative, e.g. the division of units is only one logical function division, and there may be other divisions in actual implementation, such as: multiple units or components may be combined or may be integrated into another system, or some features may be omitted, or not performed. In addition, the various components shown or discussed may be coupled or directly coupled or communicatively coupled to each other via some interface, whether indirectly coupled or communicatively coupled to devices or units, whether electrically, mechanically, or otherwise.
The units described above as separate components may or may not be physically separate, and components shown as units may or may not be physical units; can be located in one place or distributed to a plurality of network units; some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in each embodiment of the present invention may be integrated in one processing unit, or each unit may be separately used as one unit, or two or more units may be integrated in one unit; the integrated units may be implemented in hardware or in hardware plus software functional units.
Those of ordinary skill in the art will appreciate that: all or part of the steps for implementing the above method embodiments may be implemented by hardware related to program instructions, and the foregoing program may be stored in a readable storage medium, where the program, when executed, performs steps including the above method embodiments; and the aforementioned storage medium includes: a mobile storage device, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), a magnetic disk or an optical disk, or the like, which can store program codes.
Alternatively, the above-described integrated units of the present invention may be stored in a readable storage medium if implemented in the form of software functional modules and sold or used as separate products. Based on such understanding, the technical solution of the embodiments of the present invention may be embodied in essence or a part contributing to the prior art in the form of a software product stored in a storage medium, including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in the embodiments of the present invention. And the aforementioned storage medium includes: a removable storage device, ROM, RAM, magnetic or optical disk, or other medium capable of storing program code.
Claims (4)
1. A machine vision based bonding pad fabrication method, comprising:
acquiring PCB image information, and preprocessing the PCB image information to obtain a laser sintering area;
positioning the PCB by a tooling fixture, and obtaining position information of a plurality of positioning points;
establishing laser sintering area information according to the positioning point position information, and collecting temperature information of a laser sintering area;
comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate;
judging whether the temperature deviation rate is larger than or equal to a preset temperature threshold value;
if the laser parameters are larger than or equal to the laser sintering parameters, generating adjustment information, and adjusting the laser parameters of the laser sintering area according to the adjustment information;
if the laser sintering parameters are smaller than the preset parameters, sintering and manufacturing the laser sintering area according to the preset parameters;
the method for obtaining the PCB image information comprises the steps of:
acquiring a PCB image, dividing the PCB image into a plurality of subregions, and extracting the characteristic values of the subregions;
comparing the image characteristic values of the plurality of sub-areas with preset image characteristic values to obtain a characteristic deviation rate;
judging whether the characteristic deviation rate is larger than a first deviation rate threshold value and smaller than a second deviation rate threshold value;
if the deviation ratio is larger than the first deviation ratio threshold and smaller than the second deviation ratio threshold, generating correction information, and correcting the sub-area image characteristic value according to the correction information;
if the image characteristic values are smaller than or equal to the first deviation rate threshold value, fusing the image characteristic values of the plurality of sub-areas;
if the image characteristic value is larger than or equal to the second deviation rate threshold value, eliminating the corresponding sub-region image characteristic value;
the first deviation ratio threshold is less than the second deviation ratio threshold;
the utility model provides a PCB board is fixed a position through frock tool to obtain a plurality of setpoint position information, include:
acquiring tool jig parameter information and establishing a positioning column movement track model;
generating a predicted track of the positioning column according to the movement track model of the positioning column;
obtaining a current moving track of the positioning column, and performing similarity calculation on a predicted track of the positioning column and the current moving track to obtain track similarity;
judging whether the track similarity is larger than or equal to a preset similarity threshold value;
if the position information is greater than or equal to the positioning column distribution information, positioning point position information is established according to the positioning column distribution information;
if the position feedback information is smaller than the preset value, generating position feedback information, and adjusting the position of the positioning column according to the position feedback information;
the PCB is distributed in a lamination and staggered way through dielectric layers and circuits, the top surface and the bottom surface of the PCB are both dielectric layers, the bottom of the PCB is provided with solder resist ink, a laser sintering area is positioned in the middle area of the top of the PCB, solder resist ink is arranged on the top of the PCB and on two sides of the sintering area, and a bonding pad is manufactured by puncturing the dielectric layers of the sintering area through set laser parameters;
the top of the positioning column is provided with a temperature sensor, and temperature data corresponding to the position of the PCB is detected in real time through the temperature sensor;
judging whether the temperature data is larger than a preset temperature threshold value or not;
if the heat conduction parameter is larger than the preset value, generating a heat conduction parameter, and conducting heat out through the positioning column according to the heat conduction parameter;
if the laser sintering parameters are smaller than the preset sintering parameters, generating sintering feedback parameters, and adjusting laser sintering parameters according to the sintering feedback parameters.
2. The machine vision based bonding pad manufacturing method according to claim 1, wherein if the bonding pad manufacturing method is smaller than the machine vision based bonding pad manufacturing method, sintering and manufacturing are performed on the laser sintering area according to current laser parameters;
acquiring the sintered PCB image information, and extracting the PCB surface image information;
slicing the surface image of the PCB according to the length direction of the PCB to obtain a plurality of slice images;
extracting the gray value of each slice image;
carrying out difference calculation on gray values of adjacent slice images to obtain gray difference values;
judging whether the gray difference value is smaller than a preset gray threshold value or not;
if the surface of the PCB at the two corresponding slice images is flush, judging that the surface of the PCB at the two corresponding slice images is flush;
if the difference is larger than the preset value, judging that the PCB at the two corresponding slice images is provided with a groove, and calculating the depth of the groove according to the corresponding gray difference;
setting laser parameters according to a preset manufacturing depth, and carrying out groove sintering on the sintering area;
and stopping sintering when the depth of the groove is equal to the preset manufacturing depth, and finishing the manufacture of the bonding pad.
3. A machine vision based bond pad fabrication system, the system comprising: the device comprises a memory and a processor, wherein the memory comprises a program of a bonding pad manufacturing method based on machine vision, and the program of the bonding pad manufacturing method based on machine vision realizes the following steps when being executed by the processor:
acquiring PCB image information, and preprocessing the PCB image information to obtain a laser sintering area;
positioning the PCB by a tooling fixture, and obtaining position information of a plurality of positioning points;
establishing laser sintering area information according to the positioning point position information, and collecting temperature information of a laser sintering area;
comparing the temperature information of the laser sintering area with preset temperature information to obtain a temperature deviation rate;
judging whether the temperature deviation rate is larger than or equal to a preset temperature threshold value;
if the laser parameters are larger than or equal to the laser sintering parameters, generating adjustment information, and adjusting the laser parameters of the laser sintering area according to the adjustment information;
if the laser sintering parameters are smaller than the preset parameters, sintering and manufacturing the laser sintering area according to the preset parameters;
the method for obtaining the PCB image information comprises the steps of:
acquiring a PCB image, dividing the PCB image into a plurality of subregions, and extracting the characteristic values of the subregions;
comparing the image characteristic values of the plurality of sub-areas with preset image characteristic values to obtain a characteristic deviation rate;
judging whether the characteristic deviation rate is larger than a first deviation rate threshold value and smaller than a second deviation rate threshold value;
if the deviation ratio is larger than the first deviation ratio threshold and smaller than the second deviation ratio threshold, generating correction information, and correcting the sub-area image characteristic value according to the correction information;
if the image characteristic values are smaller than or equal to the first deviation rate threshold value, fusing the image characteristic values of the plurality of sub-areas;
if the image characteristic value is larger than or equal to the second deviation rate threshold value, eliminating the corresponding sub-region image characteristic value;
the first deviation ratio threshold is less than the second deviation ratio threshold;
the utility model provides a PCB board is fixed a position through frock tool to obtain a plurality of setpoint position information, include:
acquiring tool jig parameter information and establishing a positioning column movement track model;
generating a predicted track of the positioning column according to the movement track model of the positioning column;
obtaining a current moving track of the positioning column, and performing similarity calculation on a predicted track of the positioning column and the current moving track to obtain track similarity;
judging whether the track similarity is larger than or equal to a preset similarity threshold value;
if the position information is greater than or equal to the positioning column distribution information, positioning point position information is established according to the positioning column distribution information;
if the position feedback information is smaller than the preset value, generating position feedback information, and adjusting the position of the positioning column according to the position feedback information;
the PCB is distributed in a lamination and staggered way through dielectric layers and circuits, the top surface and the bottom surface of the PCB are both dielectric layers, the bottom of the PCB is provided with solder resist ink, a laser sintering area is positioned in the middle area of the top of the PCB, solder resist ink is arranged on the top of the PCB and on two sides of the sintering area, and a bonding pad is manufactured by puncturing the dielectric layers of the sintering area through set laser parameters;
the top of the positioning column is provided with a temperature sensor, and temperature data corresponding to the position of the PCB is detected in real time through the temperature sensor;
judging whether the temperature data is larger than a preset temperature threshold value or not;
if the heat conduction parameter is larger than the preset value, generating a heat conduction parameter, and conducting heat out through the positioning column according to the heat conduction parameter;
if the laser sintering parameters are smaller than the preset sintering parameters, generating sintering feedback parameters, and adjusting laser sintering parameters according to the sintering feedback parameters.
4. A computer readable storage medium, characterized in that the computer readable storage medium comprises a machine vision based pad manufacturing method program, which, when executed by a processor, implements the steps of the machine vision based pad manufacturing method according to claim 1 or 2.
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Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6110823A (en) * | 1993-11-16 | 2000-08-29 | Formfactor, Inc. | Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method |
| CN1286654A (en) * | 1997-12-26 | 2001-03-07 | 三菱电机株式会社 | Laser machining apparatus |
| JP2004200618A (en) * | 2002-12-20 | 2004-07-15 | Kyocera Corp | Laser trimming system |
| CN101923356A (en) * | 2010-03-16 | 2010-12-22 | 江苏和利普激光科技有限公司 | Fast and accurate locating method of laser resistance trimming substrate |
| JP2011029534A (en) * | 2009-07-29 | 2011-02-10 | Kyocera Corp | Multilayer wiring board |
| DE102012221218A1 (en) * | 2011-11-22 | 2013-05-23 | Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. | Device, useful for quality assurance of products manufactured by laser beam processing, includes laser beam processing apparatus, laser beam source, deflecting unit, and unit for determining and recording temperature at processing position |
| CN104236734A (en) * | 2014-09-16 | 2014-12-24 | 嘉兴福宁医疗器械有限公司 | Device based on visual inspection and used for thermometer production |
| JP2015149319A (en) * | 2014-02-04 | 2015-08-20 | セイコーエプソン株式会社 | Method for manufacturing wiring board, wiring board, electronic device, electronic equipment and moving body |
| CN110582159A (en) * | 2019-08-30 | 2019-12-17 | 武汉科技大学 | FPC bonding pad surface defect processing system and method |
| CN111014672A (en) * | 2019-12-27 | 2020-04-17 | 湖南华曙高科技有限责任公司 | Temperature control system and method for laser sintering and readable storage medium |
| CN111425243A (en) * | 2020-04-07 | 2020-07-17 | 盐城摩因宝新材料有限公司 | Dust settling method and system for coal mining area based on climatic weather conditions |
| WO2021045034A1 (en) * | 2019-09-06 | 2021-03-11 | 日本ハム株式会社 | Growth evaluation device, growth evaluation method, and growth evaluation program |
| CN112486097A (en) * | 2020-11-19 | 2021-03-12 | 苏州众智诺成信息科技有限公司 | Cutting platform wear state monitoring method and system based on model algorithm and readable storage medium |
| CN113791120A (en) * | 2021-09-14 | 2021-12-14 | 中冶长天(长沙)智能科技有限公司 | Method and system for obtaining optimal section image of sintering machine tail |
| CN114565895A (en) * | 2022-04-28 | 2022-05-31 | 深圳市博铭维***工程有限公司 | Security monitoring system and method based on intelligent society |
| CN115082842A (en) * | 2022-08-23 | 2022-09-20 | 创颖峻网络科技(深圳)有限公司 | E-commerce goods appearance verification and warehousing processing method and device |
| CN115592133A (en) * | 2022-12-13 | 2023-01-13 | 中车工业研究院（青岛）有限公司（Cn） | Laser sintering scanning method, device and equipment and readable storage medium |
| CN115839617A (en) * | 2021-09-17 | 2023-03-24 | 株洲瑞德尔智能装备有限公司 | Sintering temperature control method and device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2900297A1 (en) * | 2013-03-15 | 2014-09-18 | Matterfab Corp. | Cartridge for an additive manufacturing apparatus and method |
| CN106959652B (en) * | 2017-05-08 | 2019-08-16 | 北京百度网讯科技有限公司 | Intelligent control method, device and readable computer storage medium |
| JP7163766B2 (en) * | 2018-12-28 | 2022-11-01 | 株式会社デンソーテン | Attached matter detection device and attached matter detection method |
-
2023
- 2023-05-29 CN CN202310614264.5A patent/CN116997100B/en active Active
Patent Citations (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6110823A (en) * | 1993-11-16 | 2000-08-29 | Formfactor, Inc. | Method of modifying the thickness of a plating on a member by creating a temperature gradient on the member, applications for employing such a method, and structures resulting from such a method |
| CN1286654A (en) * | 1997-12-26 | 2001-03-07 | 三菱电机株式会社 | Laser machining apparatus |
| JP2004200618A (en) * | 2002-12-20 | 2004-07-15 | Kyocera Corp | Laser trimming system |
| JP2011029534A (en) * | 2009-07-29 | 2011-02-10 | Kyocera Corp | Multilayer wiring board |
| CN101923356A (en) * | 2010-03-16 | 2010-12-22 | 江苏和利普激光科技有限公司 | Fast and accurate locating method of laser resistance trimming substrate |
| DE102012221218A1 (en) * | 2011-11-22 | 2013-05-23 | Leibniz-Institut Für Festkörper- Und Werkstoffforschung Dresden E.V. | Device, useful for quality assurance of products manufactured by laser beam processing, includes laser beam processing apparatus, laser beam source, deflecting unit, and unit for determining and recording temperature at processing position |
| JP2015149319A (en) * | 2014-02-04 | 2015-08-20 | セイコーエプソン株式会社 | Method for manufacturing wiring board, wiring board, electronic device, electronic equipment and moving body |
| CN104236734A (en) * | 2014-09-16 | 2014-12-24 | 嘉兴福宁医疗器械有限公司 | Device based on visual inspection and used for thermometer production |
| CN110582159A (en) * | 2019-08-30 | 2019-12-17 | 武汉科技大学 | FPC bonding pad surface defect processing system and method |
| WO2021045034A1 (en) * | 2019-09-06 | 2021-03-11 | 日本ハム株式会社 | Growth evaluation device, growth evaluation method, and growth evaluation program |
| CN111014672A (en) * | 2019-12-27 | 2020-04-17 | 湖南华曙高科技有限责任公司 | Temperature control system and method for laser sintering and readable storage medium |
| CN111425243A (en) * | 2020-04-07 | 2020-07-17 | 盐城摩因宝新材料有限公司 | Dust settling method and system for coal mining area based on climatic weather conditions |
| CN112486097A (en) * | 2020-11-19 | 2021-03-12 | 苏州众智诺成信息科技有限公司 | Cutting platform wear state monitoring method and system based on model algorithm and readable storage medium |
| CN113791120A (en) * | 2021-09-14 | 2021-12-14 | 中冶长天(长沙)智能科技有限公司 | Method and system for obtaining optimal section image of sintering machine tail |
| CN115839617A (en) * | 2021-09-17 | 2023-03-24 | 株洲瑞德尔智能装备有限公司 | Sintering temperature control method and device |
| CN114565895A (en) * | 2022-04-28 | 2022-05-31 | 深圳市博铭维***工程有限公司 | Security monitoring system and method based on intelligent society |
| CN115082842A (en) * | 2022-08-23 | 2022-09-20 | 创颖峻网络科技(深圳)有限公司 | E-commerce goods appearance verification and warehousing processing method and device |
| CN115592133A (en) * | 2022-12-13 | 2023-01-13 | 中车工业研究院（青岛）有限公司（Cn） | Laser sintering scanning method, device and equipment and readable storage medium |
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|---|---|
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