CN116996767A

CN116996767A - Driving assembly and camera module

Info

Publication number: CN116996767A
Application number: CN202210390964.6A
Authority: CN
Inventors: 请求不公布姓名
Original assignee: Ningbo Sunny Opotech Co Ltd
Current assignee: Ningbo Sunny Opotech Co Ltd
Priority date: 2022-04-14
Filing date: 2022-04-14
Publication date: 2023-11-03
Also published as: WO2023197996A1; CN117768779A

Abstract

The driving assembly comprises a chip anti-shake fixing part with a containing cavity, a chip anti-shake movable part which is suspended in the containing cavity, a chip driving element for driving the chip anti-shake movable part to move relative to the chip anti-shake fixing part in the containing cavity, and a chip anti-shake conductive part for conducting the driving element and a circuit board of the camera module, wherein the chip anti-shake conductive part is embedded in a chip movable carrier of the chip anti-shake movable part in an insert molding mode through an injection molding process and is integrally molded with the chip movable carrier, so that the number of parts of the driving assembly is reduced, and the structure and assembly complexity of the driving assembly are simplified.

Description

Driving assembly and camera module

Technical Field

The application relates to the field of camera modules, in particular to a driving assembly and a camera module.

Background

With the popularity of mobile electronic devices, related technologies of camera modules applied to mobile electronic devices for helping users acquire images have been rapidly developed and advanced. Currently, in the market, consumers have increasingly high and diversified functions, such as anti-shake functions, of camera modules configured in mobile electronic devices (e.g., smart phones).

When a mobile electronic device is used for photographing, the photographing effect is reduced due to physiological tremble with a certain frequency and shake generated by movement of a human body under normal conditions, and therefore, the mobile electronic device is generally provided with an anti-shake motor to drive an optical lens and/or a photosensitive chip to move so as to realize an anti-shake function.

With the increasing requirement of imaging quality of the camera module, the volume and weight of the optical lens are increased, and the driving force requirement of the anti-shake motor is also increased. The volume of the camera module is also greatly limited by the current mobile electronic equipment, and the occupied volume of the anti-shake motor is correspondingly increased along with the increase of the lens. In other words, in the trend of the optical lens toward larger volume and weight, the driving force provided by the anti-shake motor is difficult to increase accordingly.

Under the premise of limited driving force, the heavier the lens is, the shorter the anti-shake motor can drive the optical lens to move, and the anti-shake capability is affected. On the other hand, the heavier the optical lens, the slower the anti-shake motor can drive the optical lens to move, and the longer the optical lens reaches a predetermined compensation position, which also affects the anti-shake effect.

In order to overcome the above-mentioned drawbacks, the present inventors propose a driving assembly for achieving the purpose of optical anti-shake by driving the photosensitive chip to move.

Disclosure of Invention

The application has the advantages that the driving assembly and the camera module are provided, wherein the driving assembly can realize optical anti-shake by driving the photosensitive chip to move so as to meet the requirements of the optical anti-shake on the driving stroke and the driving speed, and the driving assembly combines a plurality of parts in an integrated forming mode, so that the structural complexity of the driving assembly can be reduced, and the assembly process is simplified.

The application further provides a driving assembly and a camera module, wherein a plurality of parts of the driving assembly are integrally formed through an injection molding process, so that the stability of the position relationship among the parts can be improved, and the overall structural stability of the driving assembly is further improved.

Other advantages and features of the application will become apparent from the following description, and may be realized by means of the instrumentalities and combinations particularly pointed out in the claims.

To achieve at least one of the above advantages, according to one aspect of the present application, there is provided a driving assembly including:

Chip anti-shake fixing part with accommodating cavity;

a chip anti-shake movable part suspended in the accommodating chamber;

the chip driving element is used for driving the chip anti-shake movable part to move in the accommodating cavity relative to the chip anti-shake fixing part, wherein the chip driving element comprises a chip coil assembly arranged on the chip anti-shake movable part and a chip magnet assembly fixed on the chip anti-shake fixing part and corresponding to the chip coil assembly, and the chip coil assembly comprises at least one chip coil; and

the chip anti-shake conductive part comprises at least one coil conductive element which is wrapped in the chip anti-shake movable part, each coil conductive element is provided with a first exposed coil conductive end part, a second exposed coil conductive end part opposite to the first coil conductive end part and a coil conductive extension part which extends between the first coil conductive end part and the second coil conductive end part, wherein at least one chip coil is electrically connected to the first coil conductive end part, and the second coil conductive end part is suitable for being electrically connected with a circuit board.

In the driving assembly according to the present application, the chip anti-shake movable portion includes a chip movable carrier having opposite upper and lower surfaces, wherein a first coil conductive end portion of the coil conductive element is exposed to the upper surface of the chip movable carrier, and a second coil conductive end portion of the coil conductive element is exposed to the lower surface of the chip movable carrier.

In the driving assembly according to the present application, the chip coil assembly includes a coil circuit board provided to the chip movable carrier, the at least one chip coil is fixed and electrically connected to the coil circuit board, and the coil circuit board is electrically connected to the first coil conductive end portion.

In the driving assembly according to the present application, the chip anti-shake fixing portion includes an upper cover and a base that are fastened to each other to form the receiving chamber, and the chip magnet assembly is fixed to the upper cover.

In the driving assembly according to the present application, the driving assembly further includes a chip holding assembly including at least one chip magnetic attraction element wrapped in the chip anti-shake movable portion, so that the chip anti-shake movable portion is suspended in the receiving cavity of the chip anti-shake fixing portion by magnetic attraction between the at least one chip magnetic attraction element and the chip magnet assembly.

In the driving assembly according to the present application, the driving assembly further includes a chip holding assembly including at least one chip magnet attraction element embedded in the chip movable carrier to enable the chip movable carrier to be attracted to the upper cover by magnetic attraction between the at least one chip magnet attraction element and the chip magnet assembly.

In the driving assembly according to the present application, the chip holding assembly further includes a chip supporting assembly provided between the chip movable carrier and the upper cover, the chip supporting assembly including a ball groove concavely formed in the chip movable carrier and a ball provided in the ball groove, wherein the ball is sandwiched between the upper cover and the chip movable carrier by a magnetic attraction force between the at least one chip magnetic attraction element and the chip magnet assembly.

In the driving assembly according to the present application, the chip supporting assembly further includes a ball supporting piece embedded in the chip movable carrier and located at a bottom of the ball groove, the balls being supported by the ball supporting piece.

In the driving assembly according to the present application, the chip movable carrier includes a chip carrier body and a chip carrier side portion extending downward from a periphery of the chip carrier body, wherein the chip movable carrier further includes an extension column protrusively formed at an upper surface of the chip carrier body, and the ball groove is concavely formed at an upper surface of the extension column.

In the drive assembly according to the present application, the drive assembly further comprises a chip position sensing assembly comprising at least one position sensing element, the chip anti-shake conductive portion further comprising at least one sensing element conductive element encased within the chip movable carrier, each of the sensing element conductive elements comprising a first sensing element conductive end exposed to an upper surface of the chip movable carrier, a second sensing element conductive end exposed to a lower surface of the chip movable carrier and opposite the first sensing element conductive end, and a sensing element conductive extension extending between the first sensing element conductive end and the second sensing element conductive end, wherein the first sensing element conductive end is electrically connected to the position sensing element, and the second sensing element conductive end is adapted to be electrically connected to the wiring board.

In the drive assembly according to the present application, the first sensing element conductive end is lower than the first coil conductive end in a height direction set by the chip movable carrier.

In the drive assembly according to the present application, the sensing element conductive element, the coil conductive element, and the ball support plate have no magnetic permeability, and the chip magnet attractive element has magnetic permeability.

In the drive assembly according to the present application, the chip magnetically attractive element includes a magnetically attractive element body enclosed within the chip movable carrier and a magnetically attractive element connection extending from the magnetically attractive element body to outside the chip movable carrier, the sensing element conductive element further includes a sensing element conductive connection extending from a sensing element conductive body formed by the first sensing element conductive end, the second sensing element conductive end and the sensing element conductive extension to outside the chip movable carrier, the coil conductive element further includes a coil conductive connection extending from a coil conductive body formed by the first coil conductive end, the second coil conductive end and the coil conductive extension to outside the chip movable carrier, the ball support includes a support piece body located at a bottom of the ball groove and a support piece connection extending from the support piece body to outside the chip movable carrier, and there is a difference in height setting of the magnetically attractive element connection and the sensing element conductive connection, the coil conductive connection, the support piece connection, and the chip movable carrier.

In the drive assembly according to the present application, the sensing element conductive connection portion and the coil conductive connection portion coincide in a height direction set by the chip movable carrier.

In the driving assembly according to the present application, the sensing element conductive member, the coil conductive member, the ball support plate, and the chip magnetically attractable member are integrally formed with the chip movable carrier through an injection molding process.

In the driving assembly according to the present application, the chip coil assembly includes a first chip coil set including at least one chip coil, a second chip coil set including at least one chip coil, and a third chip coil set including at least one chip coil, wherein the second chip coil set and the third chip coil set are disposed along an X-axis direction set by the driving assembly, and the first chip coil set is disposed along a Y-axis direction set by the driving assembly, the X-axis direction being perpendicular to the Y-axis direction.

According to another aspect of the present application, there is also provided an image capturing module, including:

An optical lens;

the photosensitive assembly comprises a circuit board and a photosensitive chip electrically connected to the circuit board; and

the driving assembly as described above, wherein the photosensitive assembly is mounted to a chip movable carrier of the driving assembly.

Further objects and advantages of the present application will become fully apparent from the following description and the accompanying drawings.

These and other objects, features and advantages of the present application will become more fully apparent from the following detailed description, the accompanying drawings and the appended claims.

Drawings

The above and other objects, features and advantages of the present application will become more apparent by describing embodiments of the present application in more detail with reference to the attached drawings. The accompanying drawings are included to provide a further understanding of embodiments of the application and are incorporated in and constitute a part of this specification, illustrate the application and together with the embodiments of the application, and not constitute a limitation to the application. In the drawings, like reference numerals generally refer to like parts or steps.

Fig. 1 illustrates a schematic diagram of an image capturing module according to an embodiment of the present application.

Fig. 2 illustrates a partial schematic view of an imaging module according to an embodiment of the present application.

Fig. 3A illustrates a schematic diagram of a partial explosion of an imaging module according to an embodiment of the present application.

Fig. 3B illustrates another partial exploded view of an imaging module according to an embodiment of the present application.

Fig. 4A illustrates a partial structure diagram of an image capturing module according to an embodiment of the present application.

Fig. 4B illustrates a partial structure enlarged schematic view of the camera module according to the embodiment of the present application.

Fig. 4C illustrates a partial structural cross-sectional schematic view of an image capturing module according to an embodiment of the present application.

Fig. 5 illustrates a partially disassembled schematic view of an imaging module according to an embodiment of the present application.

Fig. 6A illustrates a partial schematic view of a drive assembly of an imaging module according to an embodiment of the present application.

Fig. 6B illustrates a partially disassembled schematic view of a drive assembly of an imaging module according to an embodiment of the present application.

Fig. 6C illustrates a partial structural schematic diagram of a driving assembly of the camera module according to an embodiment of the present application.

Fig. 6D illustrates another partial structural diagram of the driving assembly of the camera module according to an embodiment of the present application.

Fig. 6E illustrates still another partial structural schematic of a driving assembly of the camera module according to an embodiment of the present application.

Fig. 7 illustrates another partial structure diagram of the camera module according to an embodiment of the present application.

Detailed Description

Hereinafter, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. It should be apparent that the described embodiments are only some embodiments of the present application and not all embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein.

Summary of the application

As described above, with the popularity of mobile electronic devices, related technologies of camera modules applied to mobile electronic devices for helping users to acquire images have been rapidly developed and advanced. Currently, in the market, consumers have increasingly high and diversified functions, such as anti-shake functions, of camera modules configured in mobile electronic devices (e.g., smart phones).

In the existing solutions, it is proposed that optical anti-shake can be achieved by driving the photosensitive chip. In particular, although the photosensitive chip is also being developed toward a large size, the weight of the photosensitive chip is much lighter than that of the optical lens, and thus, the driving stroke and driving speed requirements for optical anti-shake can be satisfied by driving the photosensitive chip.

Further, in the existing technical scheme for realizing optical anti-shake by driving the photosensitive chip, the assembly process is complex, and the requirements on the dimensional precision and the positioning precision of each component are high. For example, the driving motor for driving the photosensitive assembly is electrically connected with the circuit board in the photosensitive assembly through an electrical connection structure, for this purpose, in some designs, the components of the driving motor are subjected to grooving and other procedures so that the electrical connection structure passes through the groove body between the circuit board and the driving motor to be electrically connected between the photosensitive assembly and the driving motor, and in the grooving scheme, corresponding requirements are set on the position and the size of each component around the groove body.

Based on the above, the application proposes that the conductive structure and other components can be combined together through the driving assembly in an integrated mode through an integrated mode, so that the structural complexity of the driving assembly is reduced, and the assembly process is simplified. And by the method, the position relation between the conductive structure and other components can be determined, so that the stability of the position relation among the components is improved, and the stability of the whole structure of the driving assembly for driving the photosensitive chip is further improved.

Exemplary camera Module

As shown in fig. 1, an image capturing module 1 according to an embodiment of the present application is illustrated, which includes a photosensitive member 40, an optical lens 10 held on a photosensitive path of the photosensitive member 40, and a driving member for driving the optical lens 10 and/or the photosensitive member 40 to move to achieve optical performance adjustment, for example, optical anti-shake, optical focusing, and the like.

Accordingly, the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11, and the lens group 12 includes at least one optical lens, and the number of the at least one optical lens may be one or more, and is not limited.

The driving assembly comprises a chip driving motor 30, and the chip driving motor 30 is suitable for driving the photosensitive assembly 40 to translate and/or rotate, so as to realize the chip anti-shake function of the camera module 1.

The chip driving motor 30 includes a chip anti-shake fixing portion 31, a chip anti-shake movable portion 33, a chip driving element 32, and a chip anti-shake conductive portion 35, the chip anti-shake fixing portion 31 has a receiving cavity to receive the chip anti-shake movable portion 33, the chip driving element 32, and the chip anti-shake conductive portion 35, the chip anti-shake conductive portion 35 provides current to the chip driving element 32, and the chip driving element 32 is configured to drive the chip anti-shake movable portion 33 to move relative to the chip anti-shake fixing portion 31 in the receiving cavity of the chip anti-shake fixing portion 31. The photosensitive assembly 40 is fixed to the chip anti-shake movable portion 33, so that the chip driving element 32 drives the photosensitive assembly 40 to move relative to the chip anti-shake fixed portion 31.

The driving assembly further comprises a lens driving motor 20, and the lens driving motor 20 is suitable for driving the optical lens 10 to translate and/or rotate, so as to realize functions of focusing the lens, anti-shake of the lens and the like of the image capturing module 1. The lens driving motor 20 includes a lens driving fixed portion, a lens driving movable portion, a lens driving element, and a lens driving conductive portion, wherein the lens driving fixed portion has a receiving cavity for receiving the lens driving movable portion, the lens driving element, and the lens driving conductive portion, the lens driving conductive portion provides the lens driving element with a driving power, and the lens driving element drives the lens driving movable portion to move relative to the lens driving fixed portion. The optical lens 10 is fixed to the lens driving movable portion, so that the lens driving element drives the optical lens 10 to move relative to the lens driving fixed portion, for example, drives the optical lens 10 to move along the optical axis thereof to realize a lens focusing function; alternatively, the optical lens 10 is driven to translate in a direction perpendicular to the optical axis thereof or the optical lens 10 is driven to rotate around a direction perpendicular to the optical axis thereof to realize a lens anti-shake function. The lens driving motor 20 is fixed to the chip anti-shake fixing portion 31 of the chip driving motor 30 through the lens driving fixing portion, so that the optical lens 10 is disposed on the photosensitive path of the photosensitive assembly 40.

In one embodiment of the present application, the lens driving motor 20 is not disposed in the image capturing module 1, the optical lens 10 is directly mounted on the chip anti-shake fixing portion 31 of the chip driving motor 30, or the optical lens 10 is indirectly mounted on the chip anti-shake fixing portion 31 of the chip driving motor 30 through a supporting member, so that the optical lens 10 is disposed on the photosensitive path of the photosensitive assembly 40.

The photosensitive assembly 40 includes a circuit board 41, a photosensitive chip 42 electrically connected to the circuit board 41, and an electronic component 43, wherein the photosensitive chip 42 is configured to receive the external light collected by the optical lens 10 for imaging, and is electrically connected to an external mobile electronic device through the circuit board 41. In one embodiment of the present application, the electronic component 43 may be one or more of passive electronic devices such as resistors and capacitors, and active electronic devices such as a driving chip and a memory chip, and the electronic component 43 may be electrically connected to the front surface of the circuit board 41, or may be electrically connected to the back surface of the circuit board 41, depending on the design requirements of the camera module 1.

The photosensitive chip 42 is directly or indirectly fixed on the circuit board 41, the photosensitive chip 42 includes a photosensitive area and a non-photosensitive area, the photosensitive chip 42 is electrically connected to the circuit board 41 through a chip pad located in the non-photosensitive area, for example, the photosensitive chip 42 may be electrically connected to the circuit board 41 by wire bonding (wire bonding), soldering, FC process (flip chip), RDL (rewiring layer technology), or the like.

In one embodiment of the present application, the circuit board 41 includes a circuit board body 411, a connection strap 412, and a reinforcing plate 413. The connection belt 412 connects and electrically connects the circuit board main body 411, so that the imaging information acquired by the photosensitive chip 42 is transmitted to an external mobile electronic device through the circuit board main body 411 and the connection belt 412. The reinforcing plate 413 may be fixed to the rear surface of the circuit board body 411, thereby increasing the structural strength of the circuit board body 411. The circuit board main body 411 includes a circuit board through hole 4111 in the middle, the bottom surface of the circuit board main body 411 is fixed with the reinforcing plate 413 by, for example, bonding, and the reinforcing plate 413 and the circuit board main body 411 form a mounting cavity to accommodate the photosensitive chip 42, so that the influence of the thickness of the circuit board main body 411 on the thickness of the photosensitive assembly 40 is avoided, and the height of the camera module 1 is reduced.

In one embodiment of the present application, the connection strap 412 includes a first connection strap 4121 and a second connection strap 4122, and the first connection strap 4121 and the second connection strap 4122 respectively extend outwardly from opposite sides of the circuit board body 411 and may be further bent upwardly, in such a manner that the circuit board body 411 is maintained stationary during movement, and resistance force when the circuit board 41 is driven to move is further reduced. Of course, in another specific example of the present application, the first connection strap 4121 and the second connection strap 4122 may extend outward from adjacent two sides of the circuit board main body 411 and be bent upward, which is not limited thereto by the present application.

The photosensitive assembly 40 further includes a filter element 44, the filter element 44 being held in the photosensitive path of the photosensitive chip 42 for filtering the imaging light entering the photosensitive chip 42. In a specific example, the filter element 44 is mounted and fixed on the base 45 of the photosensitive assembly 40 and corresponds to at least a photosensitive area of the photosensitive chip 42, the filter element 44 may be directly attached to or reversely attached to the base 45, and the base 45 has a light-passing hole, so that the light of the optical lens 10 may be incident on the photosensitive chip 42 through the light-passing hole of the base 45.

The photosensitive assembly 40 may be fixed to the chip anti-shake movable portion 33 of the chip driving motor 30 through the circuit board 41 (the circuit board body 411) or the base 45 so that the photosensitive assembly 40 moves with the movement of the chip anti-shake movable portion 33.

Exemplary chip drive Motor

Fig. 2 to 7 show an embodiment of the chip driving motor 30 of the present application, the chip driving motor 30 includes a chip anti-shake fixing portion 31, a chip anti-shake movable portion 33, a chip driving element 32, and a chip anti-shake conductive portion 35.

The chip driving element 32 is disposed between the chip anti-shake movable portion 33 and the chip anti-shake fixing portion 31 in such a manner as to connect the chip anti-shake movable portion 33 and the chip anti-shake fixing portion 31, respectively, and the chip anti-shake conductive portion 35 is electrically connected to the chip driving element 32 and the photosensitive assembly 40, and provides a driving power for the chip driving element 32 to drive the chip anti-shake movable portion 33 to translate in an X-axis direction (i.e., a direction set by an X-axis) and a Y-axis direction (i.e., a direction set by a Y-axis) and/or rotate around a Z-axis direction (i.e., a direction set by a Z-axis) so as to realize translational anti-shake and/or rotational anti-shake of the photosensitive assembly 40. It should be noted that, in the embodiment of the present application, the X-axis direction and the Y-axis direction are perpendicular to each other, the Z-axis direction is perpendicular to the plane in which the X-axis direction and the Y-axis direction are located, and the Z-axis direction is also the direction of the optical axis of the optical lens 10, in other words, the X-axis, the Y-axis, and the Z-axis form a three-dimensional coordinate system, and the XOY plane in which the X-axis direction and the Y-axis direction are located is also referred to as a plane in which the horizontal direction is located.

As shown in fig. 2 to 3B, in one embodiment of the present application, the chip anti-shake fixing portion 31 includes an upper cover 311 and a base 312 that are fastened to each other to form a receiving cavity. That is, the chip anti-shake fixing portion 31 includes an upper cover 311 and a base 312 that are fastened to each other. The upper cover 311 and the base 312 are fixed to each other and form the accommodating cavity (i.e., the accommodating cavity of the chip anti-shake fixing portion 31) for accommodating the chip anti-shake movable portion 33, the chip driving element 32, the chip anti-shake conductive portion 35, the photosensitive assembly 40, and other camera module components, so that not only the camera module components can be protected, but also dust, dirt or stray light can be reduced from entering the chip driving motor 30. In a specific example of the present application, the upper cover 311 and the base 312 may be made of a metal material such as nonmagnetic stainless steel.

Specifically, in the embodiment of the present application, the upper cover 311 is disposed above the substrate 312, and the upper cover 311 includes a cover body 3111 having an opening in the center, where the opening corresponds to the photosensitive assembly 40, so that light can enter the photosensitive assembly 40 through the opening to perform imaging, and preferably, the opening has a circular shape. Further, the upper cover 311 may further include a cover circumferential side 3112 integrally extending from the cover body 3111 toward the base 312, so as to be fixedly connected to the base 312 via the cover circumferential side 3112, for example, by laser welding or adhesive bonding between the cover circumferential side 3112 and the base 312. The cover circumferential side 3112 further includes at least one circumferential recess 31121, so that at least one connection strip 412 outlet formed between the upper cover 311 and the base 312 provides the connection strip 412 of the circuit board 41 to protrude from the receiving cavity of the chip anti-shake fixing portion 31, and in a specific example of the present application, the cover circumferential side 3112 includes two circumferential recesses 31121 disposed opposite to each other, and two connection strip 412 outlets formed between the upper cover 311 and the base 312 provide the first connection strip 4121 and the second connection strip 4122 of the circuit board 41 to protrude from the receiving cavity of the chip anti-shake fixing portion 31.

Fig. 4A is a schematic cross-sectional view along the broken line AA in fig. 2, and fig. 4B is an enlarged schematic view of the circular area a in fig. 4A, as shown in fig. 3A to 4B, the chip anti-shake movable portion 33 includes a chip movable carrier 331, and the chip movable carrier 331 has opposite upper and lower surfaces. The chip driving element 32 is disposed between the chip movable carrier 331 and the upper cover 311, and the chip driving element 32 drives the chip movable carrier 331 to move relative to the chip anti-shake fixing portion 31; the photosensitive assembly 40 is disposed between the movable chip carrier 331 and the substrate 312, and the photosensitive assembly 40 is mounted on the movable chip carrier 331 through the circuit board 41, so that the photosensitive assembly 40 moves along with the movable chip carrier 331. In the embodiment of the present application, a certain air gap exists between the bottom surface of the photosensitive assembly 40 (i.e., the side of the photosensitive assembly 40 near the substrate 312) and the substrate 312, so that the movement of the photosensitive assembly 40 is not easily blocked by the substrate 312, reducing the driving force requirement of the chip driving element 32, in other words, the photosensitive assembly 40 is suspended above the substrate 312.

In the embodiment of the present application, the chip anti-shake movable portion 33 is suspended in the accommodating cavity of the chip anti-shake fixing portion 31, so that the chip anti-shake movable portion 33 can move relative to the chip anti-shake fixing portion 31.

As shown in fig. 6A, the chip movable carrier 331 of the chip shake preventing movable portion 33 includes a chip carrier body 3311 fixed to each other and a chip carrier side portion 3312 extending downward from the periphery of the chip carrier body 3311. The circuit board 41 is fixed on the bottom surface of the chip carrier body 3311 (i.e., the side facing the substrate 312), the chip carrier body 3311 has a carrier body through hole 33111, and the carrier body through hole 33111 is adapted to provide a light path for the photosensitive chip 42 of the photosensitive assembly 40 and also provide a mounting space for the electronic component 43 on the photosensitive assembly 40, so as to prevent the electronic component 43 from interfering with the chip carrier body 3311. The chip carrier side 3312 includes a first carrier side 33121, a second carrier side 33122, a third carrier side 33123, and a fourth carrier side 33124 that integrally extend outwardly from the chip carrier body 3311. The first carrier side 33121 is disposed opposite the second carrier side 33122 and adjacent to the third carrier side 33123 and the fourth carrier side 33124, with the third carrier side 33123 being disposed opposite the fourth carrier side 33124. The first carrier side 33121, the second carrier side 33122, the third carrier side 33123 and the fourth carrier side 33124 are adapted to act as anti-collision members for the movement of the chip carrier body 3311 to avoid the chip carrier body 3311 from directly colliding with the chip anti-shake fixing portion 31.

In one embodiment of the present application, the chip carrier side portion 3312 (the first carrier side portion 33121, the second carrier side portion 33122, the third carrier side portion 33123 and the fourth carrier side portion 33124) further extends toward the base 312, the chip carrier side portion 3312 is lower than the bottom surface of the chip carrier body 3311, so that when the wiring board 41 is fixed to the bottom surface of the chip carrier body 3311 by adhesive medium mounting, a space formed between the chip carrier side portion 3312 and the chip carrier body 3311 can accommodate part of the overflowed adhesive medium, the probability that the adhesive medium overflows to the outside of the chip carrier side portion 3312 is reduced, and the chip carrier side portion 3312 extends toward the base 312 can also increase the side surface area of the chip carrier 331, so that the impact area between the chip carrier 331 and the chip anti-shake fixing portion 31 is increased. Further, to allow the connecting straps 412 to extend outwardly, the first carrier side 33121 and the second carrier side 33122 each have a strap relief groove 33125 that provides a channel through which the first connecting strap 4121 and the second connecting strap 4122 extend outwardly.

As shown in fig. 5, the chip driving element 32 includes a chip magnet assembly 321 and a chip coil assembly 322, wherein the chip coil assembly 322 is disposed on the chip anti-shake movable portion 33, and the chip magnet assembly 321 is fixed to the chip anti-shake fixing portion 31 and corresponds to the chip coil assembly 322. The chip magnet assembly 321 is fixed to the upper cover 311 of the chip anti-shake fixing portion 31 by, for example, bonding a bonding medium, the chip coil assembly 322 is fixed to the chip movable carrier 331 of the chip anti-shake movable portion 33, and the chip magnet assembly 321 is disposed opposite to the chip coil assembly 322, so that the chip anti-shake movable portion 33 is driven to move relative to the chip anti-shake fixing portion 31 by a magnetic force between the chip coil assembly 322 and the chip magnet assembly 321.

Further, the specific structure of the chip driving element 32 is described, and each of the chip coil sets includes at least one chip coil. Referring to fig. 5, in one embodiment of the present application, the chip coil assembly 322 includes a first chip coil set 3221, a second chip coil set 3222, and a third chip coil set 3223, wherein the first chip coil set 3221, the second chip coil set 3222, and the third chip coil set 3223 are disposed on a plane on which an X axis and a Y axis lie, that is, the first chip coil set 3221, the second chip coil set 3222, and the third chip coil set 3223 are disposed along a horizontal direction. The first chip coil set 3221 is disposed along the Y-axis direction, the second chip coil set 3222 is disposed along the X-axis direction, the third chip coil set 3223 is disposed along the X-axis direction, the second chip coil set 3222 and the third chip coil set 3223 are disposed opposite to each other along the Y-axis direction, and further, the second chip coil set 3222 and the third chip coil set 3223 are symmetrical with respect to the Y-axis. The first chip coil set 3221, the second chip coil set 3222 and the third chip coil set 3223 are disposed around the circumference of the photosensitive assembly 40.

The appearance of the photosensitive chip 42 of the photosensitive assembly 40 is a rectangular structure including a long side and a wide side, the appearance edge of the photosensitive assembly 40 may be defined with a first side, a second side, a third side and a fourth side, the center of the photosensitive chip 42 is taken as an origin, a rectangular coordinate system is established, the first side and the second side are parallel to the X-axis direction, and the third side and the fourth side are parallel to the Y-axis direction.

The first chip coil set 3221, the second chip coil set 3222 and the third chip coil set 3223 each include at least one chip coil. That is, the first chip coil set 3221 includes at least one chip coil, the second chip coil set 3222 includes at least one chip coil, and the third chip coil set 3223 includes at least one chip coil. For example, in one specific example of the present application, the first chip coil set 3221 includes a first chip coil 32211 and a second chip coil 32212, the first chip coil 32211 and the second chip coil 32212 are disposed relatively parallel along the Y-axis direction; the second chip coil set 3222 includes a third chip coil 32221 and a fourth chip coil 32222, wherein the third chip coil 32221 and the fourth chip coil 32222 are relatively parallel arranged along the X-axis direction; the third chip coil set 3223 includes a fifth chip coil 32231 and a sixth chip coil 32232, and the fifth chip coil 32231 and the sixth chip coil 32232 are relatively parallel arranged along the X-axis direction; the third chip coil 32221 and the fifth chip coil 32231 are arranged along the X-axis direction; the fourth chip coil 32222 and the sixth chip coil 32232 are arranged along the X-axis direction. It can be said that the first chip coil 32211 and the second chip coil 32212 are respectively disposed on the third side and the fourth side of the photosensitive assembly 40, and the first chip coil 32211 and the second chip coil 32212 are respectively disposed in parallel with the third side and the fourth side; the third chip coil 32221 and the fifth chip coil 32231 are disposed on the second side of the photosensitive assembly 40, and the third chip coil 32221 and the fifth chip coil 32231 are disposed parallel to the second side; the fourth chip coil 32222 and the sixth chip coil 32232 are disposed on a first side of the photosensitive assembly 40, and the fourth chip coil 32222 and the sixth chip coil 32232 are disposed parallel to the first side.

The first chip coil 32211 and the second chip coil 32212 cooperate to drive the chip anti-shake moving portion 33 to move along the X-axis direction, and the third chip coil 32221, the fourth chip coil 32222, the fifth chip coil 32231, and the sixth chip coil 32232 cooperate to drive the chip anti-shake moving portion 33 to move along the Y-axis direction and/or rotate about the Z-axis direction.

Preferably, the first chip coil 32211 and the second chip coil 32212 have the same size, and the third chip coil 32221, the fourth chip coil 32222, the fifth chip coil 32231, and the sixth chip coil 32232 have the same size, and the first chip coil 32211 and the second chip coil 32212 have a size larger than the third chip coil 32221, the fourth chip coil 32222, the fifth chip coil 32231, and the sixth chip coil 32232.

In one embodiment of the present application, the chip coil assembly 322 further includes a coil circuit board 3224, and at least one chip coil in the chip coil assembly 322 is fixed and electrically connected to the coil circuit board 3224. In a specific example of the present application, the first chip coil set 3221 (the first chip coil 32211, the second chip coil 32212), the second chip coil set 3222 (the third chip coil 32221, the fourth chip coil 32222) and the third chip coil set 3223 (the fifth chip coil 32231, the sixth chip coil 32232) are all fixed and electrically connected to the coil circuit board 3224, and the chip coil assembly 322 is electrically connected to the chip anti-shake conductive portion 35 through the coil circuit board 3224 to be further electrically connected to the wiring board 41 of the photosensitive assembly 40. In particular, the first chip coil set 3221, the second chip coil set 3222 and the third chip coil set 3223 may be wound coils fixedly electrically connected to the coil circuit board 3224; alternatively, the first chip coil set 3221, the second chip coil set 3222 and the third chip coil set 3223 may be directly wound on the coil circuit board 3224; alternatively, the first chip Coil set 3221, the second chip Coil set 3222 and the third chip Coil set 3223 are etched directly on the Coil circuit board 3224 to form a planar Coil (FP-Coil), which may reduce the height of the chip Coil assembly 322, and thus the height of the chip drive motor 30.

The coil circuit board 3224 has a circuit board light-passing hole 32241, and the circuit board light-passing hole 32241 provides a light passing hole for the light of the optical lens 10 to enter the photosensitive assembly 40. As further shown in fig. 4C, fig. 4C is a schematic cross-sectional view along the dashed line BB in fig. 2, the coil circuit board 3224 further includes at least one positioning hole 32242, and the at least one positioning hole 32242 cooperates with at least one positioning post 33115 on the chip carrier body 3311 to enable the coil circuit board 3224 to be precisely positioned and mounted on the chip carrier body 3311. In one specific example of the present application, the coil circuit board 3224 includes two positioning holes 32242, and the chip carrier body 3311 includes two positioning posts 33115 integrally protruding outward from the chip carrier body 3311, and the two positioning holes 32242 are respectively sleeved on the two positioning posts 33115, so that the coil circuit board 3224 is precisely positioned on the chip carrier body 3311.

Accordingly, in one embodiment of the present application, the chip-magnet assembly 321 includes a first chip-magnet set 3211, a second chip-magnet set 3212 and a third chip-magnet set 3213, where the first chip-magnet set 3211, the second chip-magnet set 3212 and the third chip-magnet set 3213 are disposed on a plane on which the X-axis and the Y-axis lie (i.e., disposed along a horizontal direction). Further, the first chip magnet set 3211 and the first chip coil set 3221 are vertically opposite, the second chip magnet set 3212 and the second chip coil set 3222 are vertically opposite, and the third chip magnet set 3213 and the third chip coil set 3223 are vertically opposite, so that each chip coil is located in a magnetic field of a corresponding chip magnet. In this way, the first chip magnet group 3211 is disposed along the Y-axis direction, the second chip magnet group 3212 and the third chip magnet group 3213 are disposed along the X-axis direction, the second chip magnet group 3212 and the third chip magnet group 3213 are disposed opposite to each other along the Y-axis direction, and the second chip magnet group 3212 and the third chip magnet group 3213 are symmetrical with respect to the Y-axis. In the present application, the upper side is the side far from the photosensitive assembly 40, and the lower side is the side near to the photosensitive assembly 40.

The first, second, and third chip-magnet sets 3211, 3212, and 3213 each include at least one chip magnet. For example, in one specific example of the present application, the first chip-magnet group 3211 includes a first chip-magnet 32111 and a second chip-magnet 32112, and the first chip-magnet 32111 and the second chip-magnet 32112 are disposed relatively parallel in the Y-axis direction; the second chip magnet group 3212 includes a third chip magnet 32121 and a fourth chip magnet 32122, and the third chip magnet 32121 and the fourth chip magnet 32122 are relatively parallel arranged along the X-axis direction; the third chip-magnet group 3213 includes a fifth chip-magnet 32131 and a sixth chip-magnet 32132, and the fifth chip-magnet 32131 and the sixth chip-magnet 32132 are relatively parallel along the X-axis direction; the third chip magnet 32121 and the fifth chip magnet 32131 are arranged in the X-axis direction; the fourth chip magnet 32122 and the sixth chip magnet 32132 are arranged along the X-axis direction. More specifically, in the embodiment of the present application, the first chip magnet group 3211 is disposed at two opposite sides of the photosensitive assembly 40 along the Y-axis direction, and the second chip magnet group 3212 and the third chip magnet group 3213 are disposed at four corners of the photosensitive assembly 40 along the X-axis direction.

The first chip magnet 32111 and the second chip magnet 32112 cooperate to drive the chip anti-shake moving portion 33 to move in the X-axis direction, and the third chip magnet 32121, the fourth chip magnet 32122, the fifth chip magnet 32131 and the sixth chip magnet 32132 cooperate to drive the chip anti-shake moving portion 33 to move in the Y-axis direction and/or rotate about the Z-axis direction.

Preferably, the first chip-magnet 32111 and the second chip-magnet 32112 have the same size, the third chip-magnet 32121, the fourth chip-magnet 32122, the fifth chip-magnet 32131 and the sixth chip-magnet 32132 have the same size, and the first chip-magnet 32111 and the second chip-magnet 32112 have a size larger than the third chip-magnet 32121, the fourth chip-magnet 32122, the fifth chip-magnet 32131 and the sixth chip-magnet 32132.

The first chip coil set 3221 and the first chip magnet set 3211 interact to drive the chip anti-shake movable part 33, so as to drive the photosensitive assembly 40 to translate in the X-axis direction; the second chip coil set 3222 and the second chip magnet set 3212 interact, and the third chip coil set 3223 and the third chip magnet set 3213 interact to jointly drive the chip anti-shake movable portion 33, so as to drive the photosensitive assembly 40 to translate in the Y-axis direction and/or rotate around the Z-axis direction.

In one embodiment of the present application, the chip-magnet assembly 321 further includes a magnetic conductive member 3214 disposed between the first chip-magnet assembly 3211, the second chip-magnet assembly 3212, the third chip-magnet assembly 3213 and the upper cover 311, the first chip-magnet assembly 3211, the second chip-magnet assembly 3212 and the third chip-magnet assembly 3213 are indirectly fixed to the upper cover 311 by the magnetic conductive member 3214, and the magnetic conductive member 3214 is adapted to enhance a magnetic field force of the chip-magnet assembly 321 facing the coil-magnet assembly direction, thereby enhancing a driving force of the chip driving element 32. In a specific example of the present application, the magnetic conductive member 3214 includes six magnetic conductive units, and the six magnetic conductive units are respectively disposed between the first chip magnet 32111 and the upper cover 311, between the second chip magnet 32112 and the upper cover 311, between the third chip magnet 32121 and the upper cover 311, between the fourth chip magnet 32122 and the upper cover 311, between the fifth chip magnet 32131 and the upper cover 311, and between the sixth chip magnet 32132 and the upper cover 311, and the magnetic conductive units are "U" wrapped around the chip magnets near the top surface of the upper cover 311 and the two sides where the chip magnet area is maximum. In other embodiments of the present application, the magnetic conducting unit may only wrap the chip magnet near the top surface of the upper cover 311, or may include the chip magnet near the top surface of the upper cover 311 and four sides of the chip magnet, which is not limited in this application.

In one embodiment of the present application, the chip driving motor 30 further includes a chip position sensing assembly 36 and a chip holding assembly 34, wherein the chip position sensing assembly 36 is used for acquiring position or movement information of the photosensitive assembly 40, and the chip holding assembly 34 is adapted to enable the chip movable carrier 331 to be suspended in the chip anti-shake fixing portion 31, so that the photosensitive assembly 40 may be suspended in the chip anti-shake fixing portion 31 by the chip holding assembly 34.

As shown in fig. 6A, the chip position sensing assembly 36 is fixed to the chip movable carrier 331. When the movable chip carrier 331 moves, the chip position sensing unit 36 is adapted to obtain the position information of the movable chip carrier 331 by obtaining the magnetic field variation of the chip magnet unit 321.

The position sensing element includes at least one position sensing element, and the number of the position sensing elements is not limited by the present application. In one specific example of the present application, the chip position sensing assembly 36 includes a first position sensing element 361, a second position sensing element 362, and a third position sensing element 363 for sensing positional information of three movements of translation of the chip movable carrier 331 in the X-axis direction, translation in the Y-axis direction, and rotation about the Z-axis direction. In an embodiment of the present application, the first position sensing element 361, the second position sensing element 362, and the third position sensing element 363 are hall elements; in other embodiments of the present application, the first position sensing element 361, the second position sensing element 362, and the third position sensing element 363 are driving chips having a position sensing function.

As shown in fig. 6B, the chip holding assembly 34 includes a chip supporting assembly 341 and a chip magnetic attraction assembly 342. The chip supporting component 341 is disposed between the chip movable carrier 331 and the upper cover 311, and the chip magnetic attraction component 342 is fixed to the chip movable carrier 331 of the chip anti-shake movable portion 33, so that the chip magnetic attraction between the chip magnetic attraction component 342 and the chip magnet component 321 causes the chip anti-shake movable portion 33 to be attracted to the upper cover 311. The chip supporting component 341 is disposed between the upper cover 311 of the chip anti-shake fixing portion 31 and the chip movable carrier 331 of the chip anti-shake movable portion 33, and the chip supporting component 341 is clamped by the upper cover 311 and the chip movable carrier 331 under the action of magnetic attraction between the chip magnetic attraction component 342 and the chip magnet component 321, and a gap is kept between the chip movable carrier 331 and the upper cover 311, so that resistance of the chip anti-shake movable portion 33 during movement is reduced.

In an embodiment of the present application, the chip supporting member 341 includes a ball groove 3412 concavely formed in the chip movable carrier 331 and a ball 3411 disposed in the ball groove 3412. The number of the balls 3411 and the ball grooves 3412 is not limited by the present application, and in one embodiment of the present application, the chip supporting assembly 341 includes at least three balls 3411 disposed between the chip movable carrier 331 and the upper cover 311, and in order to limit the movement range of the balls 3411, the chip supporting assembly 341 further includes at least three ball grooves 3412 corresponding to the at least three balls 3411, preferably, at least three ball grooves 3412 are formed in the chip movable carrier 331, the depth of the ball grooves 3412 is smaller than the diameter of the balls 3411, and at least a portion of the balls 3411 may protrude from the ball grooves 3412 so that the balls 3411 may maintain frictional contact with the upper cover 311.

Further, the chip movable carrier 331 further includes an extension post 3313 formed protruding from an upper surface of the chip carrier body 3311, and the ball groove 3412 is concavely formed on the upper surface of the extension post 3313. In one embodiment of the present application, the chip movable carrier 331 includes at least three extension posts 3313 formed on the chip carrier body 3311, at least three of the extension posts 3313 protrude from the upper surface of the chip carrier body 3311, and at least three of the ball grooves 3412 are formed in at least three of the extension posts 3313. The chip supporting member 341 is disposed between the extension post 3313 and the upper cover 311 such that a certain gap is maintained between the chip movable carrier 331 and the upper cover 311, which is not changed with the movement of the chip movable carrier 331.

In one specific example of the present application, the chip movable carrier 331 includes four extension posts 3313 formed on the chip carrier body 3311, and the chip supporting member 341 includes four ball grooves 3412 formed by recessing the top surfaces of the extension posts 3313 and four balls 3411 disposed between the four ball grooves 3412 and the upper cover 311. Four of the extension posts 3313 are distributed on both longer sides of the chip carrier body 3311 so as to reduce the size of the chip carrier body 3311.

With further reference to fig. 4A and 4B, the chip supporting assembly 341 further includes a ball supporting piece 3413 embedded in the chip movable carrier 331 and located at the bottom of the ball groove 3412, and the balls 3411 are supported by the ball supporting piece 3413. In one embodiment of the present application, the chip supporting assembly 341 further includes at least three ball supporting pieces 3413, the ball supporting pieces 3413 are fixed on the chip movable carrier 331 and serve as bottom surfaces of the ball grooves 3412, and the ball supporting pieces 3413 may be made of metal materials such as stainless steel, so as to provide a smoother supporting surface for the balls 3411, and reduce the rolling friction of the balls 3411. In a specific example of the present application, the chip supporting assembly 341 includes four ball supporting pieces 3413, each ball supporting piece 3413 is fixed in the extension post 3313 of the chip movable carrier 331 by insert molding and has an upper surface exposed as a bottom surface of each ball groove 3412, and further referring to fig. 6E, the ball supporting piece 3413 includes a supporting piece main body 34131 and a supporting piece connecting portion 34132, the supporting piece main body 34131 and the supporting piece connecting portion 34132 integrally extend, and the upper surface of the supporting piece main body 34131 is exposed and has a bottom surface of the ball groove 3412. The support piece connection portion 34132 is used to maintain the position of the ball support piece 3413 in the chip movable carrier 331 during the insert molding process, and the support piece connection portion 34132 may be connected to the support piece connection portion 34132 of the other ball support piece 3413 or to other supporting members for supporting the support piece connection portion 34132. After the ball bearing plates 3413 are formed in the chip movable carrier 331 by an insert molding process, the bearing plate connecting portions 34132 are cut, and a portion of the bearing plate connecting portions 34132 may be exposed outside the chip movable carrier 331. That is, in some embodiments of the present application, the ball bearing plate 3413 includes a plate body 34131 at the bottom of the ball groove 3412 and a plate connection portion 34132 extending from the plate body 34131 to the outside of the chip movable carrier 331.

As shown in fig. 6A, 6B, and 6E, in some embodiments of the application, the chip magnet assembly 342 includes at least one chip magnet 3421. The chip magnetic attraction element 3421 is wrapped in the chip anti-shake movable portion 33, so that the chip anti-shake movable portion 33 is suspended in the accommodating cavity of the chip anti-shake fixing portion 31 by the magnetic attraction between the chip magnetic attraction element 3421 and the chip magnet assembly 321. In a specific example of the present application, at least one of the chip magnetic attraction elements 3421 is embedded in the chip movable carrier 331 of the chip anti-shake movable portion 33 through an insert molding process, and the at least one of the chip magnetic attraction elements 3421 is disposed opposite to the chip magnet assembly 321 so as to generate a magnetic attraction force along the Z-axis direction between the at least one of the chip magnetic attraction elements 3421 and the chip magnet assembly 321, and further the chip movable carrier 331 of the chip anti-shake movable portion 33 is attracted to the upper cover 311 by the magnetic attraction force between the at least one of the chip magnetic attraction elements 3421 and the chip magnet assembly 321. And the balls 3411 are clamped between the upper cover 311 and the chip movable carrier 331 by the magnetic attraction between the at least one chip magnetic attraction element 3421 and the chip magnet assembly 321, so that the chip supporting assembly 341 is clamped between the chip anti-shake fixing portion 31 and the chip anti-shake movable portion 33. The chip magnetic attraction element 3421 is made of a material with magnetic conduction property, and is suitable for generating magnetic attraction force with the magnet.

The chip magnetic element 3421 includes a magnetic element main body 34211 and a magnetic element connecting portion 34212, the magnetic element main body 34211 and the magnetic element connecting portion 34212 integrally extend, the magnetic element connecting portion 34212 is used for maintaining the position of the chip magnetic element 3421 in the chip movable carrier 331 in the insert molding process, and the magnetic element connecting portion 34212 may be connected with the magnetic element connecting portions 34212 of other chip magnetic elements 3421 or with other supporting members for supporting the magnetic element connecting portion 34212. After the chip magnetic element 3421 is formed in the chip movable carrier 331 by an insert molding process, the magnetic element connection portion 34212 is cut, and a portion of the magnetic element connection portion 34212 may be exposed outside the chip movable carrier 331. That is, in some embodiments of the present application, the chip magnetic element 3421 includes a magnetic element body 34211 enclosed in the chip movable carrier 331 and a magnetic element connection part 34212 extending from the magnetic element body 34211 to the outside of the chip movable carrier 331.

In one embodiment of the present application, the upper surface of the chip magnetic attraction element 3421 is exposed and not covered by the chip movable carrier 331, as shown in fig. 6A; in other embodiments of the present application, the upper surface of the chip magnetic attraction member 3421 may be wrapped by the chip movable carrier 331, and the present application is not limited thereto.

In one specific example of the present application, the chip magnetic attraction assembly 342 includes eight chip magnetic attraction elements 3421, each two chip magnetic attraction elements 3421 are disposed on two sides of the ball 3411, and the chip magnetic attraction elements 3421 on two sides of each ball 3411 have the same shape, so as to provide a uniform and stable magnetic attraction force, so that the chip movable carrier 331 is stably attracted to the upper cover 311.

In the present application, the chip movable carrier 331 may be insert-molded with the ball support piece 3413 or insert-molded with the chip magnetic element 3421, and the chip anti-shake conductive portion 35 may be embedded in the chip anti-shake movable portion 33 by insert-molding to reduce the number of components of the chip driving motor 30.

Therefore, the chip anti-shake conductive portion 35 is embedded in the chip anti-shake movable portion 33 by, for example, insert molding, so as to provide the chip anti-shake movable portion 33 with a conductive function, so that the chip coil assembly 322 can be electrically connected with the circuit board 41 through the chip anti-shake movable portion 33. And since the chip anti-shake conductive portion 35 is embedded in the chip anti-shake movable portion 33 by insert molding, the chip anti-shake movable portion 33 is adapted to provide two flat mounting surfaces for mounting and fixing the chip coil assembly 322 and the circuit board 41, and also to reduce the number of components of the chip anti-shake motor, reduce the assembly complexity of the chip anti-shake motor, and protect the chip anti-shake conductive portion 35.

Specifically, fig. 6A to 6B show the embedded structure of the chip anti-shake movable portion 33 and the chip anti-shake conductive portion 35. The chip anti-shake conductive portion 35 includes a coil conductive member 351 and a sensing element conductive member 352. The coil conductive element 351 includes at least one coil conductive element 3511 encapsulated within the chip anti-shake movable portion 33. In one embodiment of the application, the coil conductive assembly 351 includes a plurality (two and more) of coil conductive elements 3511, as shown in fig. 6C. A plurality of the coil conductive members 3511 are embedded in the chip movable carrier 331 in an Insert Molding manner by, for example, an injection Molding (Insert Molding) process, and the plurality of the coil conductive members 3511 may electrically connect the chip coil assembly 322 and the wiring board 41. The sensing element conductive component 352 includes at least one sensing element conductive element 3521 encased within the chip movable carrier 331. In one embodiment of the present application, the sensing element conductive component 352 includes a plurality (two or more) of sensing element conductive components 3521, wherein the plurality of sensing element conductive components 3521 are embedded in the chip movable carrier 331 by, for example, injection molding, and the plurality of sensing element conductive components 3521 may be electrically connected to the chip position sensing component 36 and the circuit board 41.

The number of coil conductive elements 3511 in the coil conductive assembly 351 is related to the number of circuits needed for the chip coil assembly 322, and in one specific example of the present application, the coil conductive assembly 351 includes 6 coil conductive elements 3511. Each of the coil conductive elements 3511 has a first coil conductive end 35111 that is exposed, a second coil conductive end 35113 that is opposite the first coil conductive end 35111 and that is exposed, and a coil conductive extension 35112 that extends and is electrically conductive between the first coil conductive end 35111 and the second coil conductive end 35113, the first coil conductive end 35111 being located higher than the second coil conductive end 35113, the coil conductive extension 35112 extending downwardly from the first coil conductive end 35111 to the second coil conductive end 35113. When the coil conductive member 3511 is embedded in the chip movable carrier 331, the chip movable carrier 331 does not cover the upper surface of the first coil conductive end portion 35111, the upper surface of the first coil conductive end portion 35111 is exposed for electrical connection with the chip coil assembly 322, the chip movable carrier 331 does not cover the lower surface of the second coil conductive end portion 35113, and the lower surface of the second coil conductive end portion 35113 is exposed for electrical connection with the circuit board 41, thereby electrically conducting the chip coil assembly 322 and the circuit board 41. In some embodiments of the present application, at least a portion of the first coil conductive ends 35111 of the coil conductive elements 3511 are exposed to the upper surface of the chip movable carrier 331 and the second coil conductive ends 35113 are exposed to the lower surface of the chip movable carrier 331. The coil circuit board 3224 of the chip coil assembly 322 is electrically connected to the first coil conductive end 35111, and the second coil conductive end 35113 is adapted to electrically connect to the wiring board 41 in such a way that electrical communication between the chip coil assembly 322 and the wiring board 41 is achieved.

In an embodiment of the present application, the first coil conductive end 35111 of the coil conductive element 3511 forms part of the upper conductive portion 33112 of the chip carrier body 3311 of the chip movable carrier 331 and the second coil conductive end 35113 of the coil conductive element 3511 forms part of the lower conductive portion 33113 of the chip carrier body 3311 of the chip movable carrier 331. In other words, the upper conductive portion 33112 includes a first coil conductive end portion 35111 and the lower conductive portion 33113 includes a second coil conductive end portion 35113.

Further, to maintain the position of the coil conductive assembly 351 in the chip movable carrier 331 during the insert molding process, the coil conductive member 3511 further includes a coil conductive connection portion 35114, and the coil conductive connection portion 35114 may be connected to the coil conductive connection portions 35114 of other coil conductive members 3511 or to other support members for supporting the coil conductive connection portions 35114. After the coil conductive member 351 is formed in the chip movable carrier 331 by an insert molding process, the coil conductive connection portion 35114 is cut, and a portion of the coil conductive connection portion 35114 is exposed outside the chip movable carrier 331. That is, in some embodiments of the present application, the coil conductive element 3511 further comprises a coil conductive connection 35114 extending from a coil conductive body formed by the first coil conductive end 35111, the second coil conductive end 35113, and the coil conductive extension 35112 to the outside of the chip movable carrier 331.

In one embodiment of the present application, the first coil conductive end 35111, the second coil conductive end 35113, the coil conductive extension 35112, and the coil conductive connection 35114 are integrally formed from a conductive material. In another embodiment of the present application, the coil conductive member 3511 is not provided with the coil conductive connection portion 35114, and further the first coil conductive end portion 35111, the second coil conductive end portion 35113 and the coil conductive extension portion 35112 are integrally formed of a conductive material.

Referring to fig. 6A, 6B and 6D, the number of sensing element conductive elements 3521 in the sensing element conductive assembly 352 is related to the amount of circuitry required by the chip position sensing assembly 36. In one specific example of the application, the sense element conductive element 3521 includes a first sense element conductive end 35211, a second sense element conductive end 35213 opposite the first sense element conductive end 35211, and a sense element conductive extension 35212 extending and electrically conducting between the first sense element conductive end 35211 and the second sense element conductive end 35213. When the sensing element conductive element 3521 is embedded in the chip movable carrier 331, the chip movable carrier 331 does not cover the upper surface of the first sensing element conductive end 35211, which is used for electrically connecting with the chip position sensing assembly 36, the chip movable carrier 331 does not cover the lower surface of the second sensing element conductive end 35213, and the lower surface of the second sensing element conductive end 35213 is exposed for electrically connecting with the circuit board 41, thereby electrically conducting the sensing element conductive assembly 352 and the circuit board 41. In some embodiments of the present application, at least a portion of the first sensing element conductive ends 35211 of the sensing element conductive elements 3521 of all of the sensing element conductive elements 3521 are exposed to the upper surface of the chip movable carrier 331 and the second sensing element conductive ends 35213 are exposed to the lower surface of the chip movable carrier 331. The first sensing element conductive end 35211 is electrically connected to the position sensing element and the second sensing element conductive end 35213 is adapted to be electrically connected to the wiring board 41 in such a way that electrical conduction between the sensing element conductive assembly 352 and the wiring board 41 is achieved.

It is noted that in one of the sense element conductive elements 3521, the number of the first sense element conductive end 35211, the second sense element conductive end 35213, and the sense element conductive extension 35212 can be one or more, and is not limited.

The first sensing element conductive end 35211 of the sensing element conductive element 3521 forms part of the upper conductive portion 33112 of the chip carrier body 3311 of the chip movable carrier 331 and the second sensing element conductive end 35213 forms part of the lower conductive portion 33113 of the chip carrier body 3311 of the chip movable carrier 331. In other words, the upper conductive portion 33112 includes a first coil conductive end 35111 and a first sensing element conductive end 35211, and the lower conductive portion 33113 includes a second coil conductive end 35113 and a second sensing element conductive end 35213.

In some embodiments of the application, the first sensing element conductive end 35211 is located lower than the first coil conductive end 35111. More specifically, the first sensing element conductive end 35211 is lower than the first coil conductive end 35111 in the height direction set by the chip movable carrier 331. In this way, the height of the position sensing element may be reduced, and may not even protrude from the upper surface of the chip movable carrier 331. Specifically, the chip carrier body 3311 has a sensing element groove 33114 formed thereon, the chip position sensing assembly 36 is disposed in the sensing element groove 33114, and thus the chip position sensing assembly 36 is prevented from being excessively high in height, and the first sensing element conductive end 35211 is electrically connected to the bottom surface of the chip position sensing assembly 36, and thus the first sensing element conductive end 35211 is disposed at a position lower than the first coil conductive end 35111, and the position sensing element is disposed between the chip coil assembly 322 and the wiring board 41 in the height (Z-axis) direction. Preferably, the chip position sensing assembly 36 is received in the sensing element recess 33114 without protruding from the sensing element recess 33114.

In order to maintain the position of the sensing element conductive assembly 352 in the chip movable carrier 331 during the insert molding process, the sensing element conductive assembly 352 further includes a sensing element conductive connection 35214, and the sensing element conductive connection 35214 may be connected to the sensing element conductive connection 35214 of the other sensing element conductive element 3521 or to other support members for supporting the sensing element conductive connection 35214. After the sensing element conductive member 352 is formed in the chip movable carrier 331 through an insert molding process, the sensing element conductive connection portion 35214 is cut, and a portion of the sensing element conductive connection portion 35214 is exposed outside the chip movable carrier 331. That is, in some embodiments of the present application, the sense element conductive element 3521 further comprises sense element conductive connections 35214 extending from a sense element conductive body formed by the first sense element conductive end, the second sense element conductive end, and the sense element conductive extension 35212 to the outside of the chip movable carrier 331.

In one embodiment of the present application, the first sensing element conductive end portion 35211, the sensing element conductive extension 35212, the second sensing element conductive end portion 35213, and the sensing element conductive connection 35214 are integrally formed of a conductive material. In another embodiment of the present application, the sensing element conductive element 3521 is not provided with the sensing element conductive connection portion 35214, and further the first sensing element conductive end portion 35211, the sensing element conductive extension portion 35212 and the second sensing element conductive end portion 35213 are integrally formed of conductive material.

In one embodiment of the present application, the coil conductive member 351 and the sensing element conductive member 352 are composed of the same conductive material and are insert molded together in the chip movable carrier 331, so that the coil conductive connection portions 35114 of the plurality of coil conductive elements 3511 of the coil conductive member 351 and the sensing element conductive connection portions 35214 of the plurality of sensing element conductive elements 3521 of the sensing element conductive member 352 may be located at the same height. That is, the sensing element conductive connection portion 35214 and the coil conductive connection portion 35114 are uniform in the height direction set by the chip movable carrier 331.

In one embodiment of the present application, the ball bearing plate 3413, the chip magnet assembly 342 (including the magnet element) and the chip anti-shake conductive portion 35 (including the sensing element conductive element 3521 and the coil conductive element 3511) are all embedded in the chip movable carrier 331 in an insert molding manner through an injection molding process, and are integrally formed with the chip movable carrier 331, so that the number of components of the chip driving motor 30 is reduced, and the structure and assembly complexity of the chip driving motor 30 are simplified.

It should be noted that the chip magnet assembly 342 needs to be made of a material having magnetic permeability, and the ball support piece 3413 and the chip anti-shake conductive portion 35 (including the sensing element conductive assembly 352 and the coil conductive assembly 351) need to be made of a material having no magnetic permeability, so that the chip magnet assembly 342 is a same layer of material tape and the ball support piece 3413 and the chip anti-shake conductive portion 35 are another layer of material tape in an insert molding process, and thus, after being made, the height of the magnet element connection 34212 of the at least one chip magnet element 3421 of the chip magnet assembly 342 is not identical to the height of the support connection of the ball support piece 3413 and the coil conductive connection 35114 and the sensing element conductive connection 35214 of the chip anti-shake conductive portion 35. It can be seen that the sensing element conductive element 3521, the coil conductive element 3511 and the ball support plate 3413 of the chip anti-shake conductive portion 35 have no magnetic permeability, the chip magnetic attraction element 3421 of the magnetic attraction assembly has magnetic permeability, and the magnetic attraction element connection portion 34212 is different from the sensing element conductive connection portion 35214, the coil conductive connection portion 35114 and the support plate connection portion 34132 in the height direction set by the chip movable carrier 331.

Further, the mounting and energization modes of the chip movable carrier 331 will be described. In one embodiment of the present application, the coil circuit board 3224 and the chip movable carrier 331 are adhesively fixed by providing an adhesive medium between the chip movable carrier 331 and the coil circuit board 3224 by providing solder (e.g., soldering) on the upper conductive portion 33112 of the chip movable carrier 331 to be electrically conducted with a pad on the back surface of the coil circuit board 3224 of the chip coil assembly 322; the chip movable carrier 331 and the wiring board 41 are adhesively fixed by disposing an adhesive medium between the chip movable carrier 331 and the wiring board 41. As shown in fig. 7, at least a portion of the lower conductive portion 33113 of the chip movable carrier 331 is exposed, and then the lower conductive portion 33113 of the back surface of the chip movable carrier 331 and the side surface of the board main body 411 of the board 41 are electrically conducted by solder.

In summary, the driving assembly and the camera module 1 according to the embodiments of the present application are illustrated, wherein the driving assembly combines a plurality of components together in an integrally formed manner, so that the structural complexity of the driving assembly can be reduced, and the assembly process can be simplified.

It will be appreciated by persons skilled in the art that the embodiments of the application described above and shown in the drawings are by way of example only and are not limiting. The objects of the present application have been fully and effectively achieved. The functional and structural principles of the present application have been shown and described in the examples and embodiments of the application may be modified or practiced without departing from the principles described.

Claims

1. A drive assembly, comprising:

chip anti-shake fixing part with accommodating cavity;

a chip anti-shake movable part suspended in the accommodating chamber;

2. The drive assembly of claim 1, wherein the chip anti-shake movable portion comprises a chip movable carrier having opposite upper and lower surfaces, wherein a first coil conductive end of the coil conductive element is exposed to the upper surface of the chip movable carrier and a second coil conductive end of the coil conductive element is exposed to the lower surface of the chip movable carrier.

3. The drive assembly of claim 2, wherein the chip coil assembly includes a coil circuit board disposed on the chip movable carrier, the at least one chip coil being secured and electrically connected to the coil circuit board, the coil circuit board being electrically connected to the first coil conductive end.

4. The drive assembly of claim 3, wherein the chip anti-shake fixing portion includes an upper cover and a base that are fastened to each other to form the receiving chamber, the chip magnet assembly being fixed to the upper cover.

5. The drive assembly of claim 1, further comprising a chip holding assembly including at least one chip magnet element encased within the chip anti-shake movable portion such that the chip anti-shake movable portion is suspended within the receiving cavity of the chip anti-shake fixing portion by magnetic attraction between the at least one chip magnet element and the chip magnet assembly.

6. The drive assembly of claim 4, wherein the drive assembly further comprises a chip holding assembly comprising at least one chip magnet embedded within the chip movable carrier to enable the chip movable carrier to be attracted to the upper cover by magnetic attraction between the at least one chip magnet and the chip magnet assembly.

7. The drive assembly of claim 6, wherein the chip holding assembly further comprises a chip support assembly disposed between the chip movable carrier and the upper cover, the chip support assembly comprising a ball groove concavely formed in the chip movable carrier and a ball disposed in the ball groove, wherein the ball is clamped between the upper cover and the chip movable carrier by a magnetic attraction force between the at least one chip magnetic attraction element and the chip magnet assembly.

8. The drive assembly of claim 7, wherein the chip support assembly further comprises a ball support tab embedded within the chip movable carrier at a bottom of the ball groove, the ball being supported by the ball support tab.

9. The drive assembly of claim 8, wherein the chip movable carrier comprises a chip carrier body and a chip carrier side extending downward from a periphery of the chip carrier body, wherein the chip movable carrier further comprises an extension post protrusively formed on an upper surface of the chip carrier body, and the ball groove is concavely formed on an upper surface of the extension post.

10. The drive assembly of claim 8, wherein the drive assembly further comprises a chip position sensing assembly comprising at least one position sensing element, the chip anti-shake conductive portion further comprising at least one sensing element conductive element encased within the chip movable carrier, each sensing element conductive element comprising a first sensing element conductive end exposed to an upper surface of the chip movable carrier, a second sensing element conductive end exposed to a lower surface of the chip movable carrier and opposite the first sensing element conductive end, and a sensing element conductive extension extending between the first sensing element conductive end and the second sensing element conductive end, wherein the first sensing element conductive end is electrically connected to the position sensing element, and the second sensing element conductive end is adapted to be electrically connected to the wiring board.

11. The drive assembly of claim 10, wherein the first sensing element conductive end is lower than the first coil conductive end in a height direction set by the chip movable carrier.

12. The drive assembly of claim 10, wherein the sensing element conductive element, the coil conductive element, and the ball support tab are non-magnetically permeable, and the chip magnetically attractable element is magnetically permeable.

13. The drive assembly of claim 11, wherein the chip magnetically attractable element includes a magnetically attractable element body encased within the chip movable carrier and a magnetically attractable element connection extending from the magnetically attractable element body to outside the chip movable carrier, the sensing element conductive element further including a sensing element conductive connection extending from a sensing element conductive body formed by the first sensing element conductive end, the second sensing element conductive end, and the sensing element conductive extension to outside the chip movable carrier, the coil conductive element further including a coil conductive connection extending from a coil conductive body formed by the first coil conductive end, the second coil conductive end, and the coil conductive extension to outside the chip movable carrier, the ball support including a support sheet body at a bottom of the ball groove and a support sheet connection extending from the support sheet body to outside the chip movable carrier, the magnetically attractable element connection and the sensing element conductive connection, the coil conductive connection, the support sheet connection being set to be highly diverse in the direction of movement of the chip movable carrier.

14. The drive assembly of claim 13, wherein the sensing element conductive connection and the coil conductive connection are coincident in a height direction set by the chip movable carrier.

15. The drive assembly of claim 13, wherein the sensing element conductive element, the coil conductive element, the ball support tab, and the chip magnetically attractable element are integrally formed with the chip movable carrier by an injection molding process.

16. The drive assembly of claim 4, wherein the chip coil assembly comprises a first chip coil set comprising at least one of the chip coils, a second chip coil set comprising at least one of the chip coils, and a third chip coil set comprising at least one of the chip coils, wherein the second chip coil set and the third chip coil set are disposed along an X-axis direction set by the drive assembly, the first chip coil set is disposed along a Y-axis direction set by the drive assembly, the X-axis direction being perpendicular to the Y-axis direction.

17. A camera module, comprising:

An optical lens;

a drive assembly according to any one of claims 1 to 16, wherein the photosensitive assembly is mounted to a chip movable carrier of the drive assembly.