CN116978844A - Wafer strorage device - Google Patents
Wafer strorage device Download PDFInfo
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- CN116978844A CN116978844A CN202311227721.1A CN202311227721A CN116978844A CN 116978844 A CN116978844 A CN 116978844A CN 202311227721 A CN202311227721 A CN 202311227721A CN 116978844 A CN116978844 A CN 116978844A
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- 235000012431 wafers Nutrition 0.000 claims abstract description 102
- 238000003860 storage Methods 0.000 claims abstract description 44
- 230000007246 mechanism Effects 0.000 claims abstract description 36
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 17
- 238000009434 installation Methods 0.000 claims abstract description 6
- 230000002457 bidirectional effect Effects 0.000 claims description 20
- 230000001360 synchronised effect Effects 0.000 claims description 20
- 230000000149 penetrating effect Effects 0.000 claims description 10
- 238000005096 rolling process Methods 0.000 claims description 10
- 230000007306 turnover Effects 0.000 claims description 7
- 238000004804 winding Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 abstract description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000009471 action Effects 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The application relates to the field of semiconductor wafer storage devices, in particular to a wafer storage device, which comprises a U-shaped storage frame and bearing strips which are equidistantly arranged in the U-shaped storage frame, wherein each bearing strip can reciprocate along the vertical direction, a plurality of rectangular mounting grooves are formed in the mirror images of the inner walls of the two sides of the U-shaped storage frame, stabilizing mechanisms for keeping wafers in the vertical state are arranged in each rectangular mounting groove, and each group of stabilizing mechanisms comprises two clamping plates which can be mutually close to and far away along with the movement of the corresponding bearing strip; be provided with the bar on the mounting panel and dodge the groove, the inslot is dodged to the bar is provided with the installation pole, and the equidistance is provided with a plurality of stages on the installation pole and lifts the mechanism, and every stage lifts the mechanism and can upwards move along with corresponding bearing strip makes the bearing strip that has adjacently placed the wafer upwards move. The application can keep the wafers in a vertical state for storage, and the next wafer to be taken can be higher than the wafers which are placed later, thereby being convenient for the staff to continuously take.
Description
Technical Field
The application relates to the field of semiconductor wafer storage devices, in particular to a wafer storage device.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer.
Chinese patent: CN115910874B discloses a wafer storage frame, which belongs to the technical field of auxiliary devices for semiconductor silicon wafer production, and comprises: the side plates are parallel to each other, the inner walls of the side plates are provided with strip-shaped grooves which are arranged in pairs, and a supporting plate is arranged below the two side plates. The rear end of backup pad rotates to be connected in the one end of two curb plates, and pivoted axis perpendicular to curb plate is equipped with the connecting axle of perpendicular to curb plate in the both sides of backup pad front end, all slides on the connecting axle of backup pad both sides and is equipped with the fixture block to through the fixture block butt in the inner wall of curb plate, so that the backup pad is fixed.
In the application, the wafers are placed through a plurality of strip-shaped grooves which are arranged in pairs, but gaps exist between the strip-shaped grooves and the wafers due to different thicknesses of the wafers, and when the wafers are limited by the pressure rods, the pressure rods can not contact with each wafer, so that shaking is generated in the carrying process; and because the existence of clearance, when adjusting the backup pad, the backup pad slope sets up, and the wafer can slide in the backup pad, can not keep vertical state, can make the wafer card unable take out in the bar inslot.
Disclosure of Invention
To the problem that prior art exists, provide a wafer strorage device, through the cooperation of stabilizing mean and stage elevating system, make the wafer keep vertical state in the U-shaped deposits the frame, when taking the wafer, make the next wafer that waits to take can be higher than the wafer of putting to the staff of being convenient for carries out continuous taking.
In order to solve the problems in the prior art, the application adopts the following technical scheme:
a wafer storage device comprises a U-shaped storage frame, a bearing bar, a stabilizing mechanism and a stage lifting mechanism; a mounting plate is arranged inside the U-shaped storage frame; the bearing strips are in a horizontal state and are equidistantly arranged along the length direction of the mounting plate, the length direction of the bearing strips is mutually perpendicular to the length direction of the mounting plate, and a plurality of guide holes are formed in the top of the mounting plate at equal intervals along the two sides of the length direction; the bottom mirror image of each supporting strip is provided with a guide rod matched with the guide hole, the guide rods can be arranged in the corresponding guide holes in a sliding way, a reset spring is sleeved on each guide rod and positioned between the corresponding supporting strip and the mounting plate, one end, away from the corresponding supporting strip, of each guide rod is provided with a positioning disc, and the positioning disc is positioned between the inner wall of the bottom of the U-shaped storage frame and the bottom of the mounting plate; the inner walls of the two sides of the U-shaped storage frame are provided with a plurality of rectangular mounting grooves in a mirror image mode, the stabilizing mechanisms are arranged in the corresponding rectangular mounting grooves and used for enabling wafers to be in a vertical state, and each stabilizing mechanism comprises two clamping plates which can be mutually close to and far away along with the movement of the corresponding bearing strips; be provided with the bar on the mounting panel and dodge the groove, the inslot is dodged to the bar is provided with the installation pole, and the mechanism has the multiunit is raised to the stage, and the mechanism is raised in a plurality of stages along installation pole axis equidistance setting and be located corresponding bearing strip below, and every stage is raised the mechanism and can be along with corresponding bearing strip upward movement make the adjacent bearing strip that has placed the wafer upward movement.
Preferably, each group of stabilizing mechanism further comprises a bidirectional screw rod and a rotating rod; the bidirectional screw rod can be rotatably arranged in the rectangular mounting groove, a guide bar is arranged in the center of one side, close to the corresponding rectangular mounting groove, of each clamping plate in the length direction of the bidirectional screw rod, and the guide bar can be slidably arranged in the rectangular mounting groove and is in threaded connection with one end, corresponding to the bidirectional screw rod; the center of the bidirectional screw rod is provided with a first synchronous gear, and the rotating rod can be rotatably arranged in the rectangular mounting groove and is positioned below the bidirectional screw rod; the rotating rod is provided with two second synchronous gears, and the two second synchronous gears are meshed with the first synchronous gears; reset torsion springs are arranged at both ends of the rotating rod and are positioned between the corresponding second synchronous gears and the inner walls of the corresponding rectangular mounting grooves; and a first traction rope is further wound on each rotating rod, the first traction rope is positioned between the two second synchronous gears, connecting parts are arranged at two ends of each bearing strip along the length direction, and one end of each first traction rope, which is far away from the rotating rod, is connected with the connecting part of the corresponding bearing strip.
Preferably, each stage lifting mechanism comprises a rotating sleeve, a turnover block and a one-way bearing; the mounting rod is provided with a plurality of limiting discs along the axis, and the rotating sleeve can be rotatably arranged on the mounting rod and is positioned between two adjacent limiting discs; two sliding blocks are arranged on the mirror image of the outer wall of each rotating sleeve, the overturning blocks are arranged in a vertical state, one side of each overturning block along the length direction is provided with a strip-shaped penetrating groove for accommodating the rotating sleeve, sliding grooves are formed in the inner walls of the two sides of each strip-shaped penetrating groove, and the sliding blocks can be arranged in the sliding grooves in a sliding mode; a rectangular notch is formed in the corner of one side of the bottom of the turnover block, an abutting strip is hinged in the rectangular notch, and a strip-shaped notch for accommodating the abutting strip is formed in one side, away from the rectangular notch, of the top of the turnover block; the one-way bearing is arranged at one end of the rotating sleeve and positioned outside the strip-shaped through groove, the outer wall of the one-way bearing is provided with a rolling wheel, and a telescopic torsion spring is arranged between the rolling wheel and the adjacent limiting disc; the bottom of each positioning disk is provided with an extension rod, a traction plate is arranged between the two extension rods of each bearing strip, a second traction rope is arranged on the traction plate, and one end of the second traction rope, which is far away from the traction plate, is wound on the corresponding winding wheel.
Preferably, each clamping plate is further provided with a non-slip strip for buffering the wafer.
Preferably, rectangular penetrating grooves are formed in each clamping plate, sliding rods are arranged in each rectangular penetrating groove, an abutting frame is further arranged between two adjacent clamping plates, two elliptical avoiding grooves used for the sliding rods to penetrate through are formed in the abutting frame in a mirror image mode, abutting springs are further sleeved on each sliding rod, and the abutting springs are located between the corresponding abutting frame and the inner wall of the U-shaped storage frame; a plurality of rolling wheels can be rotatably arranged in each abutting frame.
Preferably, the bottom of each rectangular mounting groove is provided with a vertically downwardly extending strip-shaped wire groove, and each wire groove can be rotatably provided with a wire guide wheel for guiding the first traction rope.
Preferably, the two sides of the top of the mounting plate along the length direction of the strip-shaped avoidance groove are provided with limiting strips for limiting the positions of the bearing strips.
Preferably, limiting plates are arranged on two sides of the top of each bearing strip along the length direction.
Compared with the prior art, the application has the beneficial effects that:
1. according to the application, through the matching of the bearing strip, the clamping plate and the abutting frame, along with the movement of the bearing strip, the rollers on the clamping plate and the abutting frame can carry out multidirectional restriction on wafers with different specifications, so that the stability in the storage process is ensured.
2. According to the application, through the cooperation of the rotating sleeve, the overturning block and the one-way bearing, when a worker takes out the wafer, the adjacent rotating sleeve can rotate, so that the bearing strip arranged above the rotating sleeve can move for a certain distance in the direction away from the mounting plate, and at the moment, the wafer on the bearing strip is higher than the wafer which is orderly placed, so that the worker can continuously take the wafer conveniently.
Drawings
FIG. 1 is a perspective view of a wafer storage device;
FIG. 2 is a perspective view of a wafer storage device in use;
FIG. 3 is a perspective view of a wafer storage device in a pick-up state;
FIG. 4 is an enlarged view of a portion of FIG. 3 at A;
FIG. 5 is an enlarged view of a portion of FIG. 3 at B;
FIG. 6 is a side view of a wafer storage device in use;
FIG. 7 is a plan cross-sectional view of FIG. 6 taken along the direction C-C;
FIG. 8 is a partial enlarged view at D in FIG. 7;
FIG. 9 is an enlarged view of a portion of FIG. 7 at E;
FIG. 10 is a partial perspective view of a wafer storage device;
FIG. 11 is an enlarged view of a portion of FIG. 10 at F;
FIG. 12 is a partial perspective view of a second wafer storage device;
fig. 13 is a partial exploded perspective view of a wafer storage device.
The reference numerals in the figures are:
1-U-shaped storage frames; 11-mounting plates; 111-guiding holes; 112-a strip-shaped avoidance groove; 113-mounting a rod; 114-a limiting disc; 115-limit bars; 12-rectangular mounting slots; 13-a bar-shaped wire groove; 14-wire guiding wheels;
2-supporting strips; 21-a guide bar; 22-a return spring; 23-positioning plate; 24-connecting part; 25-extension rod; 26-traction plate; 27-a second traction rope; 28-limiting plates;
3-a stabilizing mechanism; 31-clamping plates; 311-guide bars; 312-anti-slip strips; 313-rectangular through slots; 314—a sliding bar; 315-conflict frame; 316-elliptical relief grooves; 317-abutting the spring; 318-rolling wheel; 32-a bidirectional screw rod; 321-a first synchromesh; 33-a rotating lever; 331-a second synchronizing gear; 332-reset torsion spring; 333-a first traction rope;
4-stage elevation mechanism; 41-rotating the sleeve; 411-sliding blocks; 42-turning over the block; 421-bar-shaped through slots; 422-sliding grooves; 423-rectangular notch; 424-conflict bar; 425-bar-shaped groove; 43-one-way bearing; 431—a take-up wheel; 432-telescoping torsion spring.
Detailed Description
The application will be further described in detail with reference to the drawings and the detailed description below, in order to further understand the features and technical means of the application and the specific objects and functions achieved.
Referring to fig. 1 to 13, a wafer storage device comprises a U-shaped storage frame 1, a support bar 2, a stabilizing mechanism 3 and a stage lifting mechanism 4; a mounting plate 11 is arranged inside the U-shaped storage frame 1; the bearing strips 2 are in a horizontal state and are equidistantly arranged along the length direction of the mounting plate 11, the length direction of the bearing strips 2 is mutually perpendicular to the length direction of the mounting plate 11, and a plurality of guide holes 111 are equidistantly arranged at the top of the mounting plate 11 along the two sides of the length direction; the bottom mirror image of each supporting strip 2 is provided with a guide rod 21 matched with the guide hole 111, the guide rods 21 can be slidably arranged in the corresponding guide holes 111, a return spring 22 is sleeved on each guide rod 21, the return spring 22 is positioned between the corresponding supporting strip 2 and the mounting plate 11, one end, away from the corresponding supporting strip 2, of each guide rod 21 is provided with a positioning disc 23, and the positioning disc 23 is positioned between the inner wall of the bottom of the U-shaped storage frame 1 and the bottom of the mounting plate 11; the inner walls of the two sides of the U-shaped storage frame 1 are provided with a plurality of rectangular mounting grooves 12 in a mirror image mode, the stabilizing mechanisms 3 are provided with a plurality of groups, the stabilizing mechanisms 3 are arranged in the corresponding rectangular mounting grooves 12 and are used for enabling wafers to keep in a vertical state, and each group of stabilizing mechanisms 3 comprises two clamping plates 31 which can be mutually close to and far away along with the movement of the corresponding bearing strip 2; the mounting plate 11 is provided with a strip-shaped avoiding groove 112, a mounting rod 113 is arranged in the strip-shaped avoiding groove 112, the stage lifting mechanisms 4 are provided with a plurality of groups, the stage lifting mechanisms 4 are arranged at equal intervals along the axis of the mounting rod 113 and positioned below the corresponding bearing strip 2, and each stage lifting mechanism 4 can upwards move along with the corresponding bearing strip 2 to enable the bearing strip 2 adjacent to which the wafer is placed to upwards move.
The two ends of each supporting strip 2 correspond to one rectangular mounting groove 12 respectively, a worker places a wafer on each supporting strip 2 in a vertical state, the wafer is located between the two rectangular mounting grooves 12 and between the two corresponding clamping plates 31 at the moment, the two clamping plates 31 can initially position the wafer, then, the worker releases the wafer, the corresponding supporting strips 2 overcome the elastic force of the reset springs 22 and move towards the direction close to the mounting plates 11, the positioning plates 23 can limit the positions of the guide rods 21, and the situation that the wafer is pushed out of the guide holes 111 due to the elastic force of the reset springs 22 is avoided; along with the movement of the supporting strip 2, the clamping plates 31 at the two ends of the supporting strip are respectively driven to approach each other, so that wafers with different thicknesses are clamped, the positions of the wafers are limited, the wafers can be kept in a vertical state, damage in the process of carrying is avoided, and at the moment, the highest points of the wafers are positioned on the same horizontal plane (shown in figure 2); when the wafer needs to be taken out, the wafer is taken out by the staff, the bearing strip 2 for taking out the wafer moves towards the direction away from the mounting plate 11 under the action of the elastic force of the reset spring 22, the stage lifting mechanism 4 arranged at the bottom of the bearing strip 2 can move a distance along with the movement of the corresponding bearing strip 2 towards the direction away from the mounting plate 11, so that the wafer placed on the stage lifting mechanism can protrude a distance (shown in figure 3) relative to the wafer placed in order, the wafer is taken out by the staff continuously, and the clamping plates 31 for clamping the wafer are mutually away along with the movement of the bearing strip 2, so that the wafer is in a loose state, and the wafer is taken out by the staff more favorably.
Referring to fig. 3 to 10, each set of stabilizing mechanisms 3 further includes a bi-directional screw 32 and a rotating lever 33; the bidirectional screw rod 32 can be rotatably arranged in the rectangular mounting groove 12, a guide strip 311 is arranged in the center of one side, close to the corresponding rectangular mounting groove 12, of each clamping plate 31 in the length direction of the bidirectional screw rod 32, and the guide strip 311 can be slidably arranged in the rectangular mounting groove 12 and is in threaded connection with one end, corresponding to the bidirectional screw rod 32; a first synchronous gear 321 is arranged at the center of the bidirectional screw rod 32, and a rotating rod 33 is rotatably arranged in the rectangular mounting groove 12 and positioned below the bidirectional screw rod 32; the rotating rod 33 is provided with two second synchronous gears 331, and the two second synchronous gears 331 are meshed with the first synchronous gear 321; reset torsion springs 332 are arranged at both ends of the rotating rod 33, and the reset torsion springs 332 are positioned between the corresponding second synchronous gears 331 and the inner walls of the corresponding rectangular mounting grooves 12; each rotating rod 33 is further wound with a first traction rope 333, the first traction rope 333 is located between the two second synchronous gears 331, the two ends of each supporting strip 2 along the length direction are provided with connecting portions 24, and one end, away from the rotating rod 33, of the first traction rope 333 is connected with the connecting portion 24 of the corresponding supporting strip 2.
When the wafers are not stored, the two guide strips 311 are separated from each other under the torque force of the reset torsion springs 332 arranged at two ends of the rotating rod 33, so that the entering space can be provided for the wafers to the greatest extent, when the wafers are placed, the wafers are contacted with the corresponding bearing strips 2, so that the bearing strips 2 overcome the elastic force of the reset springs 22 and move towards the direction close to the mounting plate 11, in the process, the corresponding first traction ropes 333 are pulled by the connecting parts 24 at two ends of the bearing strips 2 along the length direction, the first traction ropes 333 drive the moving rotating rod 33 to rotate, the two second synchronous gears 331 on the rotating rod 33 are respectively meshed with the first synchronous gears 321 on the corresponding bidirectional screw rods 32, so that the bidirectional screw rods 32 arranged at two ends of the bearing strips 2 are synchronously rotated, the guide strips 311 are in threaded connection with the corresponding ends of the bidirectional screw rods 32, and the two clamping plates 31 can abut and limit the two sides of the wafers, so that the storage stability of the wafers is ensured.
Referring to fig. 10 to 13, each stage lifting mechanism 4 includes a rotating sleeve 41, a turning block 42, and a one-way bearing 43; the mounting rod 113 is provided with a plurality of limiting plates 114 along the axis, and the rotating sleeve 41 is rotatably arranged on the mounting rod 113 and positioned between two adjacent limiting plates 114; two sliding blocks 411 are arranged on the outer wall mirror image of each rotating sleeve 41, the overturning blocks 42 are arranged in a vertical state, a strip-shaped penetrating groove 421 for accommodating the rotating sleeve 41 is formed in one side of the overturning blocks 42 along the length direction, sliding grooves 422 are formed in the inner walls of the two sides of the strip-shaped penetrating groove 421, and the sliding blocks 411 can be arranged in the sliding grooves 422 in a sliding mode; a rectangular notch 423 is formed in the corner of one side of the bottom of the turnover block 42, an abutting strip 424 is hinged in the rectangular notch 423, and a strip-shaped notch 425 for accommodating the abutting strip 424 is formed in one side, away from the rectangular notch 423, of the top of the turnover block 42; the one-way bearing 43 is arranged at one end of the rotating sleeve 41 and is positioned outside the strip-shaped through groove 421, a winding wheel 431 is arranged on the outer wall of the one-way bearing 43, and a telescopic torsion spring 432 is arranged between the winding wheel 431 and the adjacent limiting disc 114; the bottom of each positioning disc 23 is provided with an extension rod 25, a traction plate 26 is arranged between the two extension rods 25 of each supporting strip 2, a second traction rope 27 is arranged on the traction plate 26, and one end of the second traction rope 27, which is far away from the traction plate 26, is wound on a corresponding winding wheel 431.
When the wafer is placed on the supporting strip 2, the supporting strip 2 moves downwards, so that the second traction rope 27 on the traction plate 26 pulls the rolling wheel 431 to rotate, at this time, the reset torsion spring 332 generates torsion due to the rotation of the rolling wheel 431, and the rotating sleeve 41 cannot rotate in the process due to the arrangement of the one-way bearing 43; when taking the wafer, under the combined action of reset spring 22 and reset torsion spring 332, the rotation direction of the winding wheel 431 is opposite to that of placing the wafer, at this moment, the one-way bearing 43 can drive the rotating sleeve 41 to rotate, when the rotating sleeve 41 rotates 180 DEG, the rotating sleeve 41 slides in the strip-shaped through groove 421, so that one end hinged with the abutting strip 424 can move to the top, at this moment, the hinged abutting strip 424 can rotate to the strip-shaped notch 425 of the adjacent turning block 42, along with the continuous rotation of the rotating sleeve 41, when the rotating sleeve 41 rotates from 180 DEG to 360 DEG, the abutting strip 424 can drive the adjacent turning block 42 to turn 180 DEG, so that the winding wheel 431 on the adjacent turning block 42 can pull the corresponding second traction rope 27, thereby enabling the adjacent supporting strip 2 to move a distance towards the direction far away from the mounting plate 11, and enabling the highest point of the wafer on the adjacent supporting strip 2 in the vertical direction to be higher than the wafer placed subsequently, so that the operator can take the wafer continuously.
As shown in fig. 4, each clamping plate 31 is further provided with a slip prevention bar 312 for buffering the wafer.
Through being provided with antislip strip 312, not only can improve the frictional force of grip block 31 to the wafer, make the wafer more stable, can also play certain cushioning effect, protect the wafer.
Referring to fig. 4 and 10, a rectangular through slot 313 is formed in each clamping plate 31, a sliding rod 314 is arranged in each rectangular through slot 313, an abutting frame 315 is further arranged between two adjacent clamping plates 31, two oval avoidance slots 316 for the sliding rods 314 to pass through are formed in a mirror image mode on each abutting frame 315, a tight abutting spring 317 is further sleeved on each sliding rod 314, and the abutting springs are located between the corresponding abutting frame 315 and the inner wall of the U-shaped storage frame 1; a plurality of rolling wheels 318 are rotatably provided in each of the interference frames 315.
Through being provided with conflict frame 315, can be provided with a plurality of gyro wheels in the conflict frame 315, when the wafer is put into between two grip blocks 31, the wafer outer wall can be with the gyro wheel contact on the conflict frame 315, support tight spring 317 and can make conflict frame 315 paste the wafer outer wall all the time, can make a plurality of wafers keep coaxial setting, can also place not unidimensional wafer, thereby improve the practicality of device, when two grip blocks 31 are close to each other, conflict frame 315 can gliding setting is in two rectangle wearing inslot 313, the stability of conflict frame 315 not only can be ensured to oval on conflict frame 315, can also dodge the position of two slide bars 314, avoid producing the volume collision between conflict frame 315 and the grip block 31.
Referring to fig. 1, 5 and 7, a bar-shaped wire groove 13 extending vertically downward is provided at the bottom of each rectangular mounting groove 12, and a wire wheel 14 for guiding the first traction rope 333 is rotatably provided in each wire groove.
Through being provided with wire wheel 14 to can guide first haulage rope 333, make it can remove along bar wire groove 13, avoid producing the contact between first haulage rope 333 and the wafer, ensure the quality of depositing of wafer.
Referring to fig. 2, 3 and 5, limit bars 115 for limiting the position of the support bar 2 are provided on both sides of the top of the mounting plate 11 along the length direction of the bar-shaped avoiding groove 112.
Through being provided with spacing 115 to can restrict the position of bearing strip 2, thereby restrict the rotation angle of rotating cover 41, avoid when the wafer is overweight, the degree of overturning of upset piece 42 is too big, leads to follow-up bearing strip 2 unable removal.
Referring to fig. 2 and 10, a limiting plate 28 is provided on both sides of the top of each support bar 2 in the length direction.
Through being provided with limiting plate 28, can form the region that is used for placing the wafer between two limiting plates 28 to avoid the wafer to follow the landing on the bearing strip 2, improve the stability of centre gripping.
The foregoing examples merely illustrate one or more embodiments of the application, which are described in greater detail and are not to be construed as limiting the scope of the application. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (8)
1. The wafer storage device is characterized by comprising a U-shaped storage frame, a bearing bar, a stabilizing mechanism and a stage lifting mechanism; a mounting plate is arranged inside the U-shaped storage frame; the bearing strips are in a horizontal state and are equidistantly arranged along the length direction of the mounting plate, the length direction of the bearing strips is mutually perpendicular to the length direction of the mounting plate, and a plurality of guide holes are formed in the top of the mounting plate at equal intervals along the two sides of the length direction; the bottom mirror image of each supporting strip is provided with a guide rod matched with the guide hole, the guide rods can be arranged in the corresponding guide holes in a sliding way, a reset spring is sleeved on each guide rod and positioned between the corresponding supporting strip and the mounting plate, one end, away from the corresponding supporting strip, of each guide rod is provided with a positioning disc, and the positioning disc is positioned between the inner wall of the bottom of the U-shaped storage frame and the bottom of the mounting plate;
the inner walls of the two sides of the U-shaped storage frame are provided with a plurality of rectangular mounting grooves in a mirror image mode, the stabilizing mechanisms are arranged in the corresponding rectangular mounting grooves and used for enabling wafers to be in a vertical state, and each stabilizing mechanism comprises two clamping plates which can be mutually close to and far away along with the movement of the corresponding bearing strips;
be provided with the bar on the mounting panel and dodge the groove, the inslot is dodged to the bar is provided with the installation pole, and the mechanism has the multiunit is raised to the stage, and the mechanism is raised in a plurality of stages along installation pole axis equidistance setting and be located corresponding bearing strip below, and every stage is raised the mechanism and can be along with corresponding bearing strip upward movement make the adjacent bearing strip that has placed the wafer upward movement.
2. A wafer storage device according to claim 1, wherein each set of stabilizing mechanisms further comprises a bi-directional screw and a rotating rod;
the bidirectional screw rod can be rotatably arranged in the rectangular mounting groove, a guide bar is arranged in the center of one side, close to the corresponding rectangular mounting groove, of each clamping plate in the length direction of the bidirectional screw rod, and the guide bar can be slidably arranged in the rectangular mounting groove and is in threaded connection with one end, corresponding to the bidirectional screw rod;
the center of the bidirectional screw rod is provided with a first synchronous gear, and the rotating rod can be rotatably arranged in the rectangular mounting groove and is positioned below the bidirectional screw rod;
the rotating rod is provided with two second synchronous gears, and the two second synchronous gears are meshed with the first synchronous gears;
reset torsion springs are arranged at both ends of the rotating rod and are positioned between the corresponding second synchronous gears and the inner walls of the corresponding rectangular mounting grooves;
and a first traction rope is further wound on each rotating rod, the first traction rope is positioned between the two second synchronous gears, connecting parts are arranged at two ends of each bearing strip along the length direction, and one end of each first traction rope, which is far away from the rotating rod, is connected with the connecting part of the corresponding bearing strip.
3. A wafer storage device according to claim 1, wherein each stage lifting mechanism comprises a rotating sleeve, a flipping block and a one-way bearing;
the mounting rod is provided with a plurality of limiting discs along the axis, and the rotating sleeve can be rotatably arranged on the mounting rod and is positioned between two adjacent limiting discs; two sliding blocks are arranged on the mirror image of the outer wall of each rotating sleeve, the overturning blocks are arranged in a vertical state, one side of each overturning block along the length direction is provided with a strip-shaped penetrating groove for accommodating the rotating sleeve, sliding grooves are formed in the inner walls of the two sides of each strip-shaped penetrating groove, and the sliding blocks can be arranged in the sliding grooves in a sliding mode;
a rectangular notch is formed in the corner of one side of the bottom of the turnover block, an abutting strip is hinged in the rectangular notch, and a strip-shaped notch for accommodating the abutting strip is formed in one side, away from the rectangular notch, of the top of the turnover block;
the one-way bearing is arranged at one end of the rotating sleeve and positioned outside the strip-shaped through groove, the outer wall of the one-way bearing is provided with a rolling wheel, and a telescopic torsion spring is arranged between the rolling wheel and the adjacent limiting disc;
the bottom of each positioning disk is provided with an extension rod, a traction plate is arranged between the two extension rods of each bearing strip, a second traction rope is arranged on the traction plate, and one end of the second traction rope, which is far away from the traction plate, is wound on the corresponding winding wheel.
4. A wafer storage device according to claim 2, wherein each clamping plate is further provided with a slip-resistant strip for cushioning wafers.
5. The wafer storage device according to claim 2, wherein each clamping plate is provided with a rectangular penetrating groove, a sliding rod is arranged in each rectangular penetrating groove, an abutting frame is further arranged between two adjacent clamping plates, two oval avoiding grooves for the sliding rods to penetrate are formed in the abutting frame in a mirror image mode, each sliding rod is further sleeved with an abutting spring, and the abutting springs are located between the corresponding abutting frame and the inner wall of the U-shaped storage frame; a plurality of rolling wheels can be rotatably arranged in each abutting frame.
6. A wafer storage device according to claim 2, wherein each rectangular mounting groove is provided with a vertically downwardly extending bar-shaped wire groove, each wire groove being rotatably provided with a wire wheel for guiding the first traction rope.
7. A wafer storage device according to claim 3, wherein the top of the mounting plate is provided with a stop bar on each side of the length direction of the bar-shaped avoiding groove for limiting the position of the supporting bar.
8. A wafer storage device according to claim 1, wherein the top of each support bar is provided with a limiting plate on both sides in the longitudinal direction.
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| CN202311227721.1A CN116978844B (en) | 2023-09-22 | 2023-09-22 | Wafer strorage device |
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| CN202311227721.1A CN116978844B (en) | 2023-09-22 | 2023-09-22 | Wafer strorage device |
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| CN116978844B CN116978844B (en) | 2023-12-26 |
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| CN116978844B (en) | 2023-12-26 |
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