CN116963382A - Manufacturing method of circuit board with high heat dissipation and circuit board - Google Patents
Manufacturing method of circuit board with high heat dissipation and circuit board Download PDFInfo
- Publication number
- CN116963382A CN116963382A CN202310945160.2A CN202310945160A CN116963382A CN 116963382 A CN116963382 A CN 116963382A CN 202310945160 A CN202310945160 A CN 202310945160A CN 116963382 A CN116963382 A CN 116963382A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat
- dissipation plate
- circuit board
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 165
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000003825 pressing Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 20
- 238000005507 spraying Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 description 22
- 229910052751 metal Inorganic materials 0.000 description 22
- 238000005219 brazing Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 238000005553 drilling Methods 0.000 description 11
- 239000000945 filler Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 238000003801 milling Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 239000002023 wood Substances 0.000 description 5
- 238000010030 laminating Methods 0.000 description 4
- 239000010953 base metal Substances 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 230000000149 penetrating effect Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010329 laser etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000000275 quality assurance Methods 0.000 description 1
- 238000003908 quality control method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application relates to the technical field of printed circuit boards, and discloses a circuit board manufacturing method with high heat dissipation and a circuit board, wherein the circuit board manufacturing method with high heat dissipation comprises the following steps: providing a multi-layer board, a connecting layer and a heat dissipation plate, wherein the multi-layer board is provided with a plurality of heat dissipation parts and a plurality of containing holes, the heat dissipation parts and the containing holes are correspondingly arranged, the heat dissipation plate is connected with a plurality of heat conduction columns, and the heat conduction columns are arranged in one-to-one correspondence with the containing holes; sequentially stacking the heat dissipation plate, the connecting layer and the multilayer board together, wherein the heat conduction column extends into the accommodating hole and contacts with the heat dissipation part; and pressing the heat dissipation plate, the connecting layer and the multilayer plate together. The manufacturing method of the circuit board with high heat dissipation provided by the application can improve the heat dissipation performance of the multilayer board to a large extent.
Description
Technical Field
The application relates to the technical field of printed circuit boards, in particular to a circuit board manufacturing method with high heat dissipation and a circuit board.
Background
In order to meet the requirements of industries such as electronic communication, photovoltaic power supply and the like on a circuit board, the circuit board is required to have certain high-power and voltage-resistant performances and also is required to have better heat dissipation performance.
In the traditional mode for improving the heat dissipation performance of the circuit board, the heat dissipation block is directly embedded in the circuit board to improve the heat dissipation performance of the circuit board, but the heat dissipation area of the heat dissipation block is very limited, so that the heat dissipation performance of the circuit board cannot be improved to a great extent.
Disclosure of Invention
The application provides a circuit board manufacturing method with high heat dissipation and a circuit board, which can improve the heat dissipation performance of the circuit board to a greater extent.
In a first aspect, an embodiment of the present application provides a method for manufacturing a circuit board with high heat dissipation, including:
providing a multi-layer board, a connecting layer and a heat dissipation plate, wherein the multi-layer board is provided with a plurality of heat dissipation parts and a plurality of containing holes, the heat dissipation parts and the containing holes are correspondingly arranged, the heat dissipation plate is connected with a plurality of heat conduction columns, and the heat conduction columns are arranged in one-to-one correspondence with the containing holes;
sequentially stacking the heat dissipation plate, the connecting layer and the multilayer board together, wherein the heat conduction column extends into the accommodating hole and contacts with the heat dissipation part;
and pressing the heat dissipation plate, the connecting layer and the multilayer plate together.
In some of these embodiments, the thermally conductive post is mounted to the heat spreader plate prior to providing the multi-layer plate, the connection layer, and the heat spreader plate.
In some embodiments, the heat dissipation plate is provided with a plurality of concave parts, and the concave parts are arranged in one-to-one correspondence with the heat conduction columns; installing the heat conduction column to the heat dissipation plate, comprising: and inserting one end of the heat conduction column into the concave part.
In some embodiments, a gap is provided between the heat conducting post and the recess; after one end of the heat conduction column is inserted into the concave portion, the gap is filled with solder.
In some embodiments, a positioning part is arranged at the edge of the multilayer board, a positioning hole is arranged at the positioning part, and a positioning column is connected with the heat dissipation plate; when the heat dissipation plate, the connecting layer and the multi-layer plate are sequentially stacked together, the positioning column extends into the positioning hole so as to limit the relative positions of the multi-layer plate and the heat dissipation plate; after the heat dissipation plate, the connecting layer and the multilayer plate are pressed together, the positioning part, the connecting layer corresponding to the positioning part and the heat dissipation plate corresponding to the positioning part are removed.
In some of these embodiments, the heat spreader plate and the thermally conductive posts are browned prior to providing the multilayer plate, the tie layer, and the heat spreader plate.
In some embodiments, the browning treatment for the heat dissipation plate and the heat conduction column comprises:
the heat dissipation plate and the heat conduction column are placed into a conveying device, the conveying device comprises a first conveying component and a second conveying component which are sequentially arranged along a first direction at intervals, the second conveying component is used for bearing the heat dissipation plate, the first conveying component is used for propping against one surface of the heat dissipation plate, which is opposite to the second conveying component, the second conveying component and the first conveying component are used for conveying the heat dissipation plate along a second direction together, the second direction is perpendicular to the first direction, one end of the heat conduction column is connected with the heat dissipation plate, and the other end of the heat conduction column is arranged towards the first conveying component;
and spraying and browning the heat dissipation plate and the heat conduction column in the second direction.
In some embodiments, the first conveying assembly includes a first support, a first rotating shaft and a plurality of first rollers, the first rotating shaft is rotatably connected with the first support, the first rotating shaft extends along a third direction, the third direction is perpendicular to the first direction and perpendicular to the second direction, the first rollers are connected with the first rotating shaft, the plurality of first rollers are arranged at intervals along the third direction, and at least one first roller is located between two adjacent heat conducting columns along the third direction.
In some of these embodiments, the conveyor further comprises an adjustment member for positioning between the first conveyor assembly and the second conveyor assembly, the adjustment member for adjusting the distance of the first conveyor assembly and the second conveyor assembly in the first direction.
In a second aspect, an embodiment of the present application provides a circuit board, where the circuit board is processed according to the method for manufacturing a circuit board with high heat dissipation as described in the first aspect.
The manufacturing method of the circuit board with high heat dissipation provided by the embodiment of the application has the beneficial effects that: because the multiply wood is provided with a plurality of radiating parts and a plurality of holding hole, radiating part and holding hole correspond the setting, the heating panel is connected with a plurality of heat conduction posts, a plurality of heat conduction posts and a plurality of holding hole one-to-one set up, and when stacking heating panel, tie coat and multiply wood together in proper order, the heat conduction post extends to the holding downthehole, the heat conduction post contacts with the radiating part, so be in the heating panel, tie coat and multiply wood pressfitting back together, can pass through the heat conduction post with the heat that the radiating part produced and conduct to the heating panel fast, the radiating rate is fast, and the radiating area of heating panel is great, can improve the heat dispersion of multiply wood to a great extent.
Compared with the prior art, the circuit board provided by the application has similar beneficial effects to those of the circuit board with high heat dissipation provided by the application, and the circuit board is not repeated here.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a flow chart of a method for fabricating a circuit board with high heat dissipation in one embodiment of the application;
FIG. 2 is a schematic diagram of a heat spreader, a connection layer, and a multi-layer board pressed together according to one embodiment of the present application;
FIG. 3 is a schematic view of the structure of the heat spreader, the multi-layer board, and the connection layer shown in FIG. 2, with the positioning portion, the connection layer corresponding to the positioning portion, and the heat spreader corresponding to the positioning portion removed;
FIG. 4 is a schematic view of a conveyor apparatus according to one embodiment of the present application;
FIG. 5 is a schematic view of a conveying apparatus according to another embodiment of the present application;
FIG. 6 is a top view of the conveyor shown in FIG. 5;
FIG. 7 is a schematic view of the first conveyor assembly in one embodiment of the application;
FIG. 8 is a perspective view of the first conveyor assembly shown in FIG. 7;
FIG. 9 is an exploded view of the first delivery assembly shown in FIG. 8;
FIG. 10 is an enlarged partial view of portion A of the first delivery assembly shown in FIG. 9;
fig. 11 is an enlarged partial view of a portion B of the first conveyor assembly shown in fig. 9.
The meaning of the labels in the figures is:
10. a multi-layer board;
11. a heat dissipation part; 12. an accommodation hole; 13. a positioning part; 14. positioning holes;
20. a connection layer;
30. a heat dissipation plate;
31. a recessed portion; 32. a solder; 33. a through hole;
40. a heat conducting column;
50. positioning columns;
60. a first transport assembly;
61. a first support; 62. a first rotating shaft; 621. an adjustment aperture; 63. a first roller; 64. a mounting member; 65. connecting sleeves; 651. a connection hole;
70. a second transport assembly;
71. a second support; 72. a second rotating shaft; 73. a second roller;
80. an adjusting member.
Detailed Description
The present application will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present application more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Reference in the specification to "one embodiment," "some embodiments," or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the application. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
In order to describe the technical scheme of the application, the following description is made with reference to specific drawings and embodiments.
Referring to fig. 1, fig. 2 and fig. 3, in a first aspect, an embodiment of the present application provides a method for manufacturing a circuit board with high heat dissipation, including:
s100: the multi-layer board 10, the connecting layer 20 and the heat dissipation plate 30 are provided, the multi-layer board 10 is provided with a plurality of heat dissipation parts 11 and a plurality of accommodating holes 12, the heat dissipation parts 11 and the accommodating holes 12 are correspondingly arranged, the heat dissipation plate 30 is connected with a plurality of heat conduction columns 40, and the heat conduction columns 40 are correspondingly arranged with the accommodating holes 12 one by one.
Specifically, the multi-layer board 10 may be formed by laminating a plurality of core boards, wherein the core boards are manufactured through the processes of cutting, baking, primary drilling, grinding, copper deposition, electroplating, inner layer circuit, inner layer etching, inner layer AOI (Automated Optical Inspection, automatic optical inspection), CCD (Charge Coupled Device ) targeting, browning and the like, and the core boards after the inner layer is manufactured are subjected to the processes of laminating, secondary drilling, grinding, copper deposition, electroplating, outer layer circuit, outer layer etching, outer layer AOI, solder mask, silk screen characters, flying needle testing, tin spraying, tertiary drilling, gong board, finished product cleaning, laminating pretreatment, riveting and the like to obtain the multi-layer board 10. The multi-layer board 10 may be an FR-4 epoxy fiberglass board.
The material of the connection layer 20 may be thermosetting glue or prepreg, and the shape of the connection layer 20 is consistent with the shape of the heat dissipation plate 30. The heat dissipation plate 30 may be a metal substrate, such as a copper substrate or an aluminum substrate with high heat dissipation, or may be a ceramic plate, and the specific material may be selected according to the requirement of heat conductivity. The thickness of the heat dissipation plate 30 may be selected according to need, and is not limited thereto, and a metal substrate of 3.0mm is used in this embodiment.
The heat conductive pillars 40 may be metal pillars, such as copper pillars or aluminum pillars, with high heat conductivity, or ceramic pillars, and the specific material may be selected according to the requirement of heat conductivity.
It will be appreciated that the heat dissipation portions 11 are provided with electronic components or circuits requiring heat dissipation, and that one or more receiving holes 12 may be provided in each heat dissipation portion 11.
S200: the heat dissipation plate 30, the connection layer 20, and the multi-layered board 10 are sequentially stacked together, the heat conduction post 40 extends into the accommodating hole 12, and the heat conduction post 40 contacts the heat dissipation part 11.
Specifically, the heat dissipation plate 30, the multilayer board 10 and the connection layer 20 may be stacked and riveted together in order for positioning at the time of subsequent lamination.
It can be understood that, since the heat conducting post 40 contacts with the heat dissipating part 11, the heat generated by the heat dissipating part 11 can be quickly conducted to the heat dissipating plate 30 through the heat conducting post 40, and the heat dissipating area of the heat dissipating plate 30 is larger, so that the heat dissipating speed is increased, and the heat dissipating performance of the multi-layer board 10 can be improved to a greater extent.
It should be noted that, the heat conductive post 40 may be directly contacted with the electronic component with high heat dissipation, and a through hole through which the heat conductive post 40 passes may be provided on the connection layer 20.
S300: the heat dissipation plate 30, the connection layer 20, and the multi-layered board 10 are pressed together.
Specifically, after the heat dissipation plate 30, the connection layer 20, and the multilayer board 10 are pressed together, the connection layer 20 connects the heat dissipation plate 30 and the multilayer board 10 together. The dielectric layers of the connection layer 20 and the multi-layered board 10 melt and fill the gap between the heat conductive pillars 40 and the receiving holes 12.
According to the manufacturing method of the circuit board with high heat dissipation provided by the embodiment of the application, as the multi-layer board 10 is provided with the plurality of heat dissipation parts 11 and the plurality of containing holes 12, the heat dissipation parts 11 and the containing holes 12 are correspondingly arranged, the heat dissipation plate 30 is connected with the plurality of heat conduction columns 40, the plurality of heat conduction columns 40 are arranged in one-to-one correspondence with the plurality of containing holes 12, and when the heat dissipation plate 30, the connecting layer 20 and the multi-layer board 10 are sequentially stacked together, the heat conduction columns 40 extend into the containing holes 12, and the heat conduction columns 40 are contacted with the heat dissipation parts 11, so that after the heat dissipation plate 30, the connecting layer 20 and the multi-layer board 10 are pressed together, heat generated by the heat dissipation parts 11 can be quickly conducted to the heat dissipation plate 30 through the heat conduction columns 40, the heat dissipation speed is high, the heat dissipation area of the heat dissipation plate 30 is large, and the heat dissipation performance of the multi-layer board 10 can be improved to a large extent.
Although the conventional manner of directly laminating the metal substrate on the back of the multilayer board 10 can have a certain heat dissipation effect, for the components with large heat productivity, the components are directly manufactured by the multilayer board 10 and the metal substrate to bear, and the problems that the multilayer board 10 cannot bear the circulation of large current due to the overlarge heat productivity of the components, and further the lamination of the bonding layer at the joint of the multilayer board 10 and the metal substrate is caused due to overlarge heat productivity exist.
According to the manufacturing method of the circuit board with high heat dissipation provided by the embodiment of the application, the heat of the high-power component is directly conducted into the heat dissipation plate 30 by the heat conduction column 40 through the heat conduction column 40 arranged on the heat dissipation plate 30, so that the technical effect of direct heat dissipation is realized, and further, the heat conduction column 40 is fast in design heat transfer performance, the heat transfer of the regional positive electrode is facilitated, the service life of a photovoltaic power supply is prolonged, and the selective flow distribution of the heat transfer path of the high-temperature photovoltaic high-power and medium-power component is realized. In addition, since the heat dissipation plate 30 is connected with the plurality of heat conduction columns 40, and the heat conduction columns 40 extend into the accommodating holes 12, the connection strength between the multi-layer board 10 and the heat dissipation plate 30 can be improved, and the layering problem can be avoided.
Optionally, after the heat dissipation plate 30, the connection layer 20 and the multi-layer board 10 are pressed together, a through hole 33 may be formed in the heat dissipation plate 30, and the through hole 33 separates the heat dissipation plate 30 into a first board and a second board, where the first board and the second board respectively correspond to different heat dissipation portions 11. So set up, can dispel the heat independently through first board and second board respectively to different heat dissipation portion 11, avoid the heat dissipation process of different heat dissipation portion 11 to receive the influence.
Optionally, after the heat spreader 30, the connection layer 20 and the multi-layer board 10 are pressed together, edge milling, three times of drilling, tin spraying, high-voltage testing, routing and forming, deionized cleaning, FQC (Final Quality Control, shipment inspection), FQA (Factory Quality Assurance ) and packaging processing may be performed on the heat spreader 30, the connection layer 20 and the multi-layer board 10.
Edge milling: and (5) performing edge milling treatment after finishing lamination, wherein the edge milling is finished in a conventional mode.
Three times of drilling: and (5) completing the conventional drilling process.
Spraying tin: and (5) finishing the conventional tin spraying process.
High pressure test: and (5) completing the conventional high-voltage test flow.
Ion cleaning, FQC, FQA, packaging: all are completed according to the conventional manufacturing flow.
It should be noted that after the heat dissipation plate 30, the connection layer 20 and the multilayer board 10 are pressed together, if the total thickness of the heat dissipation plate 30, the connection layer 20 and the multilayer board 10 reaches 6.0mm, the tin spraying and the browning level will exceed the process, the upper roller of the browning level may be removed, the board is placed according to 1000min, the board is held by both hands, the tin furnace mouth is enlarged by the tin spraying, and the first trial adjustment of the tin spraying parameters is performed again.
Traditional thermosetting adhesive and heating panel 30 bonding's mode, withstand voltage is not enough when using on photovoltaic power strip, causes heating panel 30 and multiply wood 10 layering's risk easily, consequently, in this embodiment, the material of tie layer 20 selects and uses non-gummosis PP, solves pressfitting layering's risk.
The material of the connecting layer 20 is selected from non-gumming PP with lower flow rate, so that the molten connecting layer 20 can be prevented from overflowing onto the multilayer board 10 when the heat dissipation plate 30, the connecting layer 20 and the multilayer board 10 are pressed together.
The thickness of the non-adhesive PP is 0.08mm, which is because the too thick non-adhesive PP is easy to overflow on the multilayer board 10 after lamination, thereby causing poor adhesive retention on the multilayer board 10. In other embodiments, for example, the glue overflow amount of the non-gummosis PP after the test lamination is within a controllable range, and the non-gummosis PP with other thickness can be selected.
On the other hand, the thickness of the non-gumming PP is only 0.08mm, the middle part is not positioned, and routing and forming cannot be used, so that the micro-laser lithography is adopted on the flow design, and the method can solve the problem that the non-gumming PP is deformed during routing, and further causes bending of the non-gumming PP to cause offset during riveting.
The connection layer 20 is made of non-adhesive PP by the processes of cutting, drilling, laser lithography, prestack, etc.
Cutting: and (5) selecting the non-gummosis PP with the thickness of 0.08mm, and opening the coiled material non-gummosis PP into sheets.
Drilling: holes corresponding to the heat conductive pillars 40 are drilled simultaneously with drilling holes corresponding to the functional holes in the multilayer board 10.
Laser lithography: because the non-gumming PP is thinner, the connecting position is designed without internal positioning, and the connection cannot be produced in a routing mode, the connection cannot be produced in a laser etching mode, and the deformation problem can be avoided.
Prestack: and (5) pressing the laminated board after finishing the shape cutting.
Referring to fig. 1 and 2, in some embodiments, before providing the multi-layer board 10, the connection layer 20, and the heat dissipation plate 30, the heat conduction post 40 is mounted to the heat dissipation plate 30.
By adopting the above scheme, the heat conduction column 40 can be processed first, and then the heat conduction column 40 is mounted on the heat dissipation plate 30, so that the processing precision of the heat conduction column 40 is improved.
Alternatively, the heat conductive post 40 may be snapped/welded/adhered to the heat dissipation plate 30.
With continued reference to fig. 1 and 2, in some embodiments, the heat dissipation plate 30 is provided with a plurality of concave portions 31, and the plurality of concave portions 31 are disposed in one-to-one correspondence with the plurality of heat conductive columns 40; the heat conductive post 40 is attached to the heat dissipation plate 30, and includes: one end of the heat conductive post 40 is inserted into the recess 31.
Through adopting above-mentioned scheme, can be when installing heat conduction post 40 in heating panel 30, conveniently fix a position heat conduction post 40, and can improve the counterpoint precision of heat conduction post 40 and heating panel 30.
It will be appreciated that inserting one end of the heat conductive post 40 into the recess 31 may employ an automatic post-embedding machine programmed to achieve a self-embedding function of the heat conductive post 40.
Alternatively, the recess 31 may be a slot or a hole, and the heat conductive post 40 and the recess 31 may be connected in a transition, interference, and clearance fit manner.
In this embodiment, the recess 31 is a hole penetrating the heat dissipating plate 30, and the heat conducting post 40 and the recess 31 are connected by a clearance fit.
Wherein, the external dimension of the heat conduction column 40 is smaller than that of the concave part 31 by 0.05mm, so as to facilitate the insertion of one end of the heat conduction column 40 into the concave part 31.
Optionally, a gap is provided between the heat conductive post 40 and the recess 31; after one end of the heat conductive post 40 is inserted into the recess 31, the gap is filled with the brazing filler metal 32. By such arrangement, one end of the heat conduction column 40 is conveniently inserted into the concave portion 31, and the connection strength between the heat conduction column 40 and the heat dissipation plate 30 can be ensured.
The brazing filler metal 32 may be used to fill the gap in a micro brazing manner, that is, a brazing manner is adopted, a metal material with a melting point lower than that of the base metal is selected as the brazing filler metal 32, the brazing filler metal 32 and the brazing filler metal 32 are heated to a temperature higher than that of the brazing filler metal 32 and lower than that of the base metal, the base metal is wetted by the liquid brazing filler metal 32, and the gap is filled and the joint between the heat conducting post 40 and the heat radiating plate 30 is smooth, attractive, and the welding is precise and firm. Meanwhile, by means of micro brazing, the brazing filler metal 32 is conveniently controlled during welding, the brazing filler metal is prevented from exceeding the upper surface and the lower surface of the cooling plate 30, and further welding materials cannot be remained on the upper surface and the lower surface of the cooling plate 30, and the installation and the appearance of the cooling plate 30 are prevented from being influenced.
Referring to fig. 1 and 2, in some embodiments, a positioning portion 13 is disposed at an edge of the multi-layer board 10, the positioning portion 13 is provided with a positioning hole 14, and the heat dissipation plate 30 is connected with a positioning post 50; when the heat dissipation plate 30, the connection layer 20 and the multi-layer plate 10 are sequentially stacked together, the positioning posts 50 extend into the positioning holes 14 to define the relative positions of the multi-layer plate 10 and the heat dissipation plate 30; after the heat dissipation plate 30, the connection layer 20, and the multilayer board 10 are pressed together, the positioning portion 13, the connection layer 20 corresponding to the positioning portion 13, and the heat dissipation plate 30 corresponding to the positioning portion 13 are removed.
By adopting the above scheme, the alignment accuracy of the multilayer board 10 and the heat dissipation plate 30 can be ensured.
It will be appreciated that the locating portion 13 is disposed in a non-wire area of the multi-layer board 10. The positioning portion 13, the connection layer 20 corresponding to the positioning portion 13, and the heat dissipation plate 30 corresponding to the positioning portion 13 may be removed by cutting or routing.
Optionally, the connection layer 20 is provided with a through hole, and the positioning post 50 is inserted into the through hole when the heat dissipation plate 30, the connection layer 20, and the multi-layer board 10 are stacked together in sequence. By the arrangement, the alignment precision of the multilayer board 10, the connecting layer 20 and the heat dissipation plate 30 can be ensured, and random movement of the connecting layer 20 is avoided.
It will be appreciated that after the positioning posts 50 are inserted through the through holes and extend into the positioning holes 14, the multi-layer board 10, the connection layer 20 and the heat dissipation plate 30 may be riveted and fixed.
In some of these embodiments, prior to providing multilayer board 10, tie layer 20, and heat spreader 30, heat spreader 30 and heat conductive post 40 are browned.
By adopting the above scheme, the connection strength between the heat dissipation plate 30 and the connection layer 20, and between the heat conduction post 40 and the multilayer board 10 can be improved.
The heat dissipation plate 30 provided in this embodiment adopts a metal substrate, and includes the following steps: cutting, drilling, routing, grinding, welding the heat conducting columns 40, browning and prestack.
Cutting: opening a related metal substrate according to a required size;
drilling: because there are some mounting holes in the multilayer board 10, the area corresponding to the mounting hole of the multilayer board 10 needs to be drilled, and after the material is cut, the metal substrate needs to be drilled.
And (5) milling: and (3) according to the design, routing the metal substrate out of the required shape.
Grinding: the grinding is done in a conventional manner.
Welding the heat conduction column 40: the metal substrate is soldered to the heat conductive pillars 40 prior to browning.
Referring to fig. 4, in the present embodiment, the browning treatment is performed on the heat dissipation plate 30 and the heat conduction post 40, including:
firstly, putting a heat dissipation plate 30 and a heat conduction column 40 into a conveying device, wherein the conveying device comprises a first conveying component 60 and a second conveying component 70 which are sequentially and alternately arranged along a first direction, the second conveying component 70 is used for bearing the heat dissipation plate 30, the first conveying component 60 is used for supporting one surface of the heat dissipation plate 30, which is opposite to the second conveying component 70, the second conveying component 70 and the first conveying component 60 are used for conveying the heat dissipation plate 30 along a second direction together, the second direction is perpendicular to the first direction, one end of the heat conduction column 40 is connected with the heat dissipation plate 30, and the other end of the heat conduction column 40 is arranged towards the first conveying component 60;
next, the heat radiating plate 30 and the heat conductive post 40 are spray-browned in the second direction.
By adopting the scheme, the spraying efficiency of the radiating plate 30 and the heat conducting columns 40 can be improved, and random movement of the radiating plate 30 and the heat conducting columns 40 during spraying and browning of the radiating plate 30 and the heat conducting columns 40 is avoided.
Optionally, the first conveying assembly 60 includes a first support 61, a first rotating shaft 62 and a plurality of first rollers 63, the first rotating shaft 62 is rotationally connected with the first support 61, the first rotating shaft 62 extends along a third direction, the third direction is perpendicular to the first direction and perpendicular to the second direction, the first rollers 63 are connected with the first rotating shaft 62, the plurality of first rollers 63 are arranged at intervals along the third direction, and at least one first roller 63 is located between two adjacent heat conducting columns 40 along the third direction. So configured, the heat conductive post 40 can be prevented from colliding with the first roller 63.
Alternatively, the second conveying assembly 70 includes a second support 71, a second rotating shaft 72, and a plurality of second rollers 73, the second rotating shaft 72 is rotatably connected to the second support 71, the second rotating shaft 72 extends along a third direction, the second rollers 73 are connected to the second rotating shaft 72, the plurality of second rollers 73 are disposed at intervals along the third direction, and at least two second rollers 73 are used for supporting the heat dissipation plate 30 together.
It is understood that the first support 61 and the second support 71 may be integrally provided or separately provided.
Referring to fig. 5 and 6, in another embodiment, the conveying apparatus further includes an adjusting member 80 disposed between the first conveying assembly 60 and the second conveying assembly 70, and the adjusting member 80 is used to adjust the distance between the first conveying assembly 60 and the second conveying assembly 70 along the first direction.
Through adopting above-mentioned scheme, can be when the height of heat conduction post 40 along the first direction is great, through locating adjusting part 80 between first conveying component 60 and second conveying component 70, increase the distance along the first direction of first conveying component 60 and second conveying component 70, avoid heat conduction post 40 to collide with first conveying component 60.
It will be appreciated that the height of the adjustment member 80 in the first direction is greater than the sum of the heights of the heat dissipation plate 30 and the heat conduction post 40 in the first direction, typically greater than 0.5 mm. Taking the height of the heat dissipation plate 30 as 3.0mm and the height of the heat conduction column 40 as 0.5mm as an example, the total height of the heat dissipation plate 30 and the heat conduction column 40 after welding is 3.5mm, the height of the adjusting piece 80 needs to be more than 0.5mm larger than the total thickness of the metal plate and the metal column by 3.5mm, namely the height of the adjusting piece 80 needs to be more than 4.0mm, the adjusting piece 80 is placed on the second conveying assembly 70 during browning, the first conveying assembly 60 is supported, and then the heat dissipation plate 30 and the heat conduction column 40 are placed on a browning horizontal line for browning. The first delivery assembly 60 is jacked up by adding an adjustment member 80.
The adjusting member 80 and the heat dissipation plate 30 and the heat conduction column 40 may be transported in the second direction by the second transporting assembly 70 and the first transporting assembly 60 simultaneously, and the first roller 63 and the second roller 73 respectively abut against two opposite surfaces of the adjusting member 80. When the heat dissipation plate 30 with the heat conduction columns 40 is over-browned, the first roller 63 at the top is higher than the heat dissipation plate 30 and the heat conduction columns 40, so that the heat conduction columns 40 are not blocked in the first conveying assembly 60 when the heat dissipation plate is over-browned, and no browning can be realized.
The regulator 80 may employ FR-4 strakes.
Optionally, the first conveying assembly 60 further includes a first slider (not shown in the drawings), and the first rotating shaft 62 is rotatably connected to the first slider, and the first slider is slidably disposed on the first support 61 along the first direction.
Optionally, the second conveying assembly 70 further includes a second slider (not shown in the drawings), and the second rotating shaft 72 is rotatably connected to the second slider, and the second slider is slidably disposed on the second support 71 along the first direction.
Alternatively, the regulating members 80 may be provided one on each of opposite sides of the heat dissipation plate 30.
Referring to fig. 7 to 11, in a further embodiment, the first roller 63 is detachably connected to the first rotating shaft 62.
By adopting the above scheme, when conveying different heat dissipation plates 30 and heat conduction columns 40, namely when the position of the heat conduction column 40 along the third direction relative to the heat dissipation plate 30 changes, part of the first roller 63 is removed, so as to convey the heat dissipation plate 30 and the heat conduction column 40, and improve the universality of the conveying device.
Optionally, the first rotating shaft 62 is provided with a plurality of adjusting holes 621, the plurality of adjusting holes 621 are arranged at intervals along the third direction, the first conveying assembly 60 includes a mounting member 64 and a plurality of connecting sleeves 65, the plurality of connecting sleeves 65 are arranged in one-to-one correspondence with the plurality of first rollers 63, the first rollers 63 are sleeved on the connecting sleeves 65, the connecting sleeves 65 are slidably sleeved on the first rotating shaft 62, the connecting sleeves 65 are provided with connecting holes 651, and the mounting member 64 is arranged in the connecting holes 651 and one of the adjusting holes 621 in a penetrating manner so as to detachably connect the first rollers 63 to the first rotating shaft 62.
By adopting the above-described configuration, the position of the first roller 63 in the third direction can be adjusted by penetrating the mounting member 64 into the connection hole 651 and the different adjustment holes 621, so that different heat dissipation plates 30 and different heat conduction columns 40 can be transported.
The mounting member 64 may be a bolt, a screw, a pin, or the like.
In a second aspect, an embodiment of the present application provides a circuit board, which is processed according to the method for manufacturing a circuit board with high heat dissipation as in the first aspect.
According to the circuit board provided by the embodiment of the application, the multi-layer board 10 is provided with the plurality of radiating parts 11 and the plurality of containing holes 12, the radiating parts 11 and the containing holes 12 are correspondingly arranged, the radiating plate 30 is connected with the plurality of heat conducting columns 40, the plurality of heat conducting columns 40 are arranged in one-to-one correspondence with the plurality of containing holes 12, and when the radiating plate 30, the connecting layer 20 and the multi-layer board 10 are sequentially stacked together, the heat conducting columns 40 extend into the containing holes 12, and the heat conducting columns 40 are contacted with the radiating parts 11, so that after the radiating plate 30, the connecting layer 20 and the multi-layer board 10 are pressed together, heat generated by the radiating parts 11 can be quickly conducted to the radiating plate 30 through the heat conducting columns 40, the radiating speed is high, the radiating area of the radiating plate 30 is large, and the radiating performance of the multi-layer board 10 can be greatly improved.
The circuit board provided by the embodiment of the application can be a copper column thick copper plate for a voltage-resistant photovoltaic power supply.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (10)
1. The manufacturing method of the circuit board with high heat dissipation is characterized by comprising the following steps:
providing a multi-layer board, a connecting layer and a heat dissipation plate, wherein the multi-layer board is provided with a plurality of heat dissipation parts and a plurality of containing holes, the heat dissipation parts and the containing holes are correspondingly arranged, the heat dissipation plate is connected with a plurality of heat conduction columns, and the heat conduction columns are arranged in one-to-one correspondence with the containing holes;
sequentially stacking the heat dissipation plate, the connecting layer and the multilayer board together, wherein the heat conduction column extends into the accommodating hole and contacts with the heat dissipation part;
and pressing the heat dissipation plate, the connecting layer and the multilayer plate together.
2. The method of claim 1, wherein the heat conductive post is mounted to the heat sink before providing the multi-layer board, the connection layer, and the heat sink.
3. The method for manufacturing a circuit board according to claim 2, wherein the heat dissipation plate is provided with a plurality of concave portions, and the plurality of concave portions are arranged in one-to-one correspondence with the plurality of heat conduction columns; installing the heat conduction column to the heat dissipation plate, comprising: and inserting one end of the heat conduction column into the concave part.
4. The method of manufacturing a circuit board according to claim 3, wherein a gap is provided between the heat conduction post and the recess; after one end of the heat conduction column is inserted into the concave portion, the gap is filled with solder.
5. The method for manufacturing a circuit board according to claim 1, wherein a positioning part is arranged at the edge of the multilayer board, a positioning hole is arranged at the positioning part, and a positioning column is connected with the heat dissipation plate; when the heat dissipation plate, the connecting layer and the multi-layer plate are sequentially stacked together, the positioning column extends into the positioning hole so as to limit the relative positions of the multi-layer plate and the heat dissipation plate; after the heat dissipation plate, the connecting layer and the multilayer plate are pressed together, the positioning part, the connecting layer corresponding to the positioning part and the heat dissipation plate corresponding to the positioning part are removed.
6. The method according to any one of claims 1 to 5, wherein the heat dissipation plate and the heat conductive pillars are subjected to browning treatment before providing the multilayer board, the connection layer, and the heat dissipation plate.
7. The method of manufacturing a circuit board according to claim 6, wherein the browning treatment is performed on the heat dissipation plate and the heat conduction post, comprising:
the heat dissipation plate and the heat conduction column are placed into a conveying device, the conveying device comprises a first conveying component and a second conveying component which are sequentially arranged along a first direction at intervals, the second conveying component is used for bearing the heat dissipation plate, the first conveying component is used for propping against one surface of the heat dissipation plate, which is opposite to the second conveying component, the second conveying component and the first conveying component are used for conveying the heat dissipation plate along a second direction together, the second direction is perpendicular to the first direction, one end of the heat conduction column is connected with the heat dissipation plate, and the other end of the heat conduction column is arranged towards the first conveying component;
and spraying and browning the heat dissipation plate and the heat conduction column in the second direction.
8. The method according to claim 7, wherein the first conveying assembly includes a first support, a first rotating shaft and a plurality of first rollers, the first rotating shaft is rotatably connected with the first support, the first rotating shaft extends along a third direction, the third direction is perpendicular to the first direction and perpendicular to the second direction, the first rollers are connected with the first rotating shaft, the plurality of first rollers are arranged at intervals along the third direction, and at least one first roller is located between two adjacent heat conducting columns along the third direction.
9. The method of claim 7, wherein the conveyor further comprises an adjusting member disposed between the first conveyor assembly and the second conveyor assembly, the adjusting member being configured to adjust a distance between the first conveyor assembly and the second conveyor assembly along the first direction.
10. A circuit board, wherein the circuit board is manufactured according to the method for manufacturing a circuit board with high heat dissipation according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310945160.2A CN116963382A (en) | 2023-07-28 | 2023-07-28 | Manufacturing method of circuit board with high heat dissipation and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310945160.2A CN116963382A (en) | 2023-07-28 | 2023-07-28 | Manufacturing method of circuit board with high heat dissipation and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116963382A true CN116963382A (en) | 2023-10-27 |
Family
ID=88452571
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310945160.2A Pending CN116963382A (en) | 2023-07-28 | 2023-07-28 | Manufacturing method of circuit board with high heat dissipation and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116963382A (en) |
-
2023
- 2023-07-28 CN CN202310945160.2A patent/CN116963382A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110402061B (en) | Cooling of power electronic circuits | |
| US7054159B2 (en) | Printed wiring board having heat radiating means and method of manufacturing the same | |
| US10229895B2 (en) | Electronic sub-assembly and method for the production of an electronic sub-assembly | |
| JP5767338B2 (en) | Electronic device, method for manufacturing the same, and printed circuit board including the electronic device | |
| US8039752B2 (en) | Heat dissipation structure of a print circuit board | |
| US7053491B2 (en) | Electronic assembly having composite electronic contacts for attaching a package substrate to a printed circuit board | |
| US7662694B2 (en) | Capacitor having adjustable capacitance, and printed wiring board having the same | |
| WO2021184190A1 (en) | Circuit board structure, electronic product, and manufacturing method and repair method for circuit board structure | |
| CN110856375B (en) | Hot-pressing tin-melting welding circuit board and manufacturing method thereof | |
| CN104347267A (en) | Method of producing electronic components and method of producing substrate-type terminals | |
| CN101980589B (en) | Method for manufacturing power module circuit board, power module and magnetic core of power module | |
| US20070037432A1 (en) | Built up printed circuit boards | |
| CN111050459A (en) | Printed circuit board and optical module | |
| CN113225938B (en) | Method for manufacturing thermoelectric separation circuit board | |
| EP1675445B1 (en) | Method for producing semiconductor substrate | |
| WO2012093509A1 (en) | Semiconductor device and method of manufacturing thereof | |
| CN116963382A (en) | Manufacturing method of circuit board with high heat dissipation and circuit board | |
| CN202857131U (en) | Circuit board capable of reducing glue overflow and circuit structure thereof | |
| US8624129B2 (en) | Method of attaching a high power surface mount transistor to a printed circuit board | |
| US6747875B2 (en) | Surface mount power supplies for standard assembly process | |
| EP2911485B1 (en) | Printed circuit board and method of manufacturing the same | |
| JP7518601B2 (en) | Busbar laminate, electronic component mounting module including same, and method for manufacturing busbar laminate | |
| CN110267430B (en) | Circuit board for blind groove coating and preparation process thereof | |
| US7308756B2 (en) | Apparatus used for manufacturing semiconductor device, method of manufacturing the semiconductor devices, and semiconductor device manufactured by the apparatus and method | |
| CN116963398A (en) | PCB manufacturing method for improving lamination alignment precision of heat dissipation plate and PCB |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |