CN116955027B - MCU chip test system and test method thereof - Google Patents
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- G06F11/2205—Detection or location of defective computer hardware by testing during standby operation or during idle time, e.g. start-up testing using arrangements specific to the hardware being tested
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Abstract
The invention discloses an MCU chip test system and a test method thereof, relates to the technical field of MCU chip test, and solves the problems of testing the functions and reliability of an MCU chip. The test board adopts a power-on automatic reset unit to provide reset signals for the MCU chip, so that the MCU chip is in a correct state when the test is started, the MCU chip function test module adopts a real-time intelligent interrupt test unit to test the interrupt function of the MCU chip, adopts a combined automatic test unit to test the read-write function of the MCU chip register, and adopts an embedded temperature remote sensing test unit to test the working stability of the MCU chip at different temperatures.
Description
Technical Field
The invention relates to the field of MCU chip testing, in particular to an MCU chip testing system and an MCU chip testing method.
Background
The MCU chip is used as an embedded system, the technical principle of the MCU chip is that a plurality of functional modules are integrated on one chip, compared with the traditional computer system, the MCU has the advantages of small volume, low power consumption, stable system and the like, and the functions and the reliability of the MCU chip are changed due to environmental changes and artificial interference, so that great inconvenience is caused to the use of the MCU chip, and therefore, the MCU chip test system and the test method are required to test the functions and the reliability of the MCU chip.
In the prior art, the MCU chip test system and the test method have a plurality of defects, the MCU chip test system and the test method cannot provide a reset signal, ensure that the MCU chip is in a correct state at the beginning of the test, lack a module for testing the interrupt function and the register read-write function of the MCU chip, and cannot test the working stability of the MCU chip and the voltage stability of the MCU chip at different temperatures.
Disclosure of Invention
In order to overcome the defects of the technology, the invention discloses a MCU chip testing system and a testing method thereof, wherein a test board adopts a power-on automatic reset unit to provide reset signals for an MCU chip, the MCU chip is in a correct state when the test starts, an MCU chip function testing module adopts a real-time intelligent interrupt testing unit to test the interrupt function of the MCU chip, a combined automatic testing unit to test the read-write function of a register of the MCU chip, and an MCU chip reliability testing module adopts an embedded temperature remote sensing testing unit to test the working stability of the MCU chip at different temperatures and adopts a dynamic accurate voltage testing unit to test the voltage stability of the MCU chip.
In order to achieve the technical effects, the invention adopts the technical scheme that:
the MCU chip test system comprises a stabilized voltage power supply, a data acquisition module and a data storage module;
the stabilized power supply is used for providing stabilized voltage for the MCU chip test system, and is a single-phase precise purifying alternating current stabilized power supply;
the data acquisition module acquires MCU chip test data by using a DT85 data acquisition device;
The data storage module adopts a database memory to store MCU chip test data;
The test board, the MCU chip function test module and the MCU chip reliability test module are also included;
The test board is used for providing a stable and reliable environment and ensuring the accuracy and repeatability of MCU chip test, the test board comprises a reset module, an indication module and a debugging interface module, the reset module adopts a power-on automatic reset unit to provide reset signals for the MCU chip and ensure that the MCU chip is in a correct state when the test starts, the indication module adopts an LED indicator lamp to display the MCU chip test process state, the debugging interface module adopts a joint test working interface and a serial debugging interface to provide an interface for MCU chip test, the output end of the debugging interface module is connected with the input end of the reset module, and the output end of the reset module is connected with the input end of the indication module;
The MCU chip function test module is used for testing the functions of the MCU chip and comprises a real-time intelligent interrupt test unit and a combined automatic test unit, wherein the real-time intelligent interrupt test unit is used for testing the interrupt functions of the MCU chip, and the combined automatic test unit is used for testing the read-write functions of registers of the MCU chip;
The MCU chip reliability test module is used for testing the reliability of the MCU chip and ensuring that the MCU cannot fail in long-term use, and comprises an embedded temperature remote sensing test unit and a dynamic accurate voltage test unit, wherein the embedded temperature remote sensing test unit is used for testing the working stability of the MCU chip at different temperatures, and the dynamic accurate voltage test unit is used for testing the voltage stability of the MCU chip;
the output end of the stabilized voltage power supply is connected with the input ends of the data acquisition module, the data storage module, the input end of the test board, the MCU chip function test module and the MCU chip reliability test module, the output end of the test board is connected with the input ends of the MCU chip function test module and the MCU chip reliability test module, and the output ends of the MCU chip function test module and the MCU chip reliability test module are connected with the input ends of the data acquisition module and the data storage module.
As a further technical scheme of the invention, the power-on automatic reset unit comprises a trigger, a counter and a comparator, wherein the trigger triggers the counter to generate a count value according to the change of an input signal, the comparator sends a reset signal according to the count value to ensure the MCU chip to test normal operation, the trigger is a master-slave RS trigger, the counter is a digital display counter CGC72, and the comparator is a reset comparator BD3775AF.
As a further technical scheme of the invention, the working method of the real-time intelligent interrupt test unit comprises the following steps:
Step one, testing the interrupt priority, namely testing the interrupt function of the MCU chip by adopting an interrupt controller to process according to the correct priority, wherein the interrupt controller monitors an interrupt signal through dynamic monitoring, and the interrupt controller forms an interrupt chain to test the interrupt priority according to the interrupt vector combination;
Step two, interrupt real-time function test, wherein an interrupt processor is adopted to test that the MCU chip can respond and process in time when the interrupt arrives, the interrupt processor obtains the delay time of the MCU chip when responding to the interrupt through multi-channel time interval measurement, the actual interrupt response time is determined, and the actual interrupt response time calculation formula is as follows:
（1）
in the formula (1), T is the actual interrupt response time, For the number of interrupts, D is the time of arrival of the interrupt, i is the time index, Z is the time after response of the arrival of the interrupt,/>For multi-channel time interval,/>Is a multi-channel time interval parameter;
And step three, testing the interrupt re-entry function, namely testing the interrupt re-entry function of the MCU chip by adopting a calling link device, wherein the calling link device can correctly respond to an interrupt event in the interrupt processing process by verifying the test MCU chip through interrupt re-entry.
As a further technical scheme of the invention, the combined automatic test unit comprises a read-write test subunit, a comparison test subunit and a coverage test subunit, wherein the read-write test subunit adopts a reset read-write test to write an input value and a read output value into a register, the correctness and the reliability of the internal register of the MCU chip are detected, the comparison test subunit adopts a comparison test to compare the test result and check the consistency of the test result and an expected result, the coverage test subunit adopts a path coverage test module to ensure that the functionality of the register of the MCU chip is tested, the output end of the read-write test subunit is connected with the input end of the comparison test subunit, and the output end of the comparison test subunit is connected with the input end of the coverage test subunit.
As a further technical scheme of the invention, the path coverage test module adopts a structural coverage test to realize testing all MCU chip register paths and sub paths, thereby ensuring that the MCU chip register functions are executed.
As a further technical scheme of the invention, the working method of the embedded temperature remote sensing test unit comprises the following steps:
the method comprises the steps that firstly, a constant temperature control box is adopted to control an MCU chip to test the environmental temperature, the constant temperature control box is adopted to rapidly control the environmental temperature to be tested by a chip touch type linear rapid temperature change test box, and the chip touch type linear rapid temperature change test box is energy-saving and accurately controls the temperature to be 70-150 ℃;
Secondly, performing working stability tests on the MCU chip at different temperatures by adopting an STM32F407 temperature remote sensing processor according to a set temperature range and a set time interval, wherein the temperature range is 70-130 ℃ and the time interval is 1-3 seconds;
and thirdly, recording performance indexes and test data of the MCU chip at different temperatures by adopting a data recorder DT2055B, wherein the performance indexes of the MCU chip at least comprise CPU execution speed, memory speed and ADC conversion precision, the performance indexes and the test data of the MCU chip are analyzed and calculated by adopting an ant colony algorithm by adopting the data recorder DT2055B, the performance and the stability of the MCU chip at different temperatures are evaluated, and the performance indexes and the test data formulas of the MCU chip are analyzed and calculated as follows:
（2）
In the formula (2), M is the performance index and the data result of the analysis and calculation MCU chip, For CPU execution frequency, x is the CPU execution frequency index, N is the CPU execution speed,/>Is a performance index parameter of the MCU chip.
As a further technical scheme of the invention, the working method of the dynamic accurate voltage testing unit comprises the following steps:
Step one, obtaining sample training data of MCU chip voltage test results by adopting an accurate potential sensor calibration platform, wherein the sample training data at least comprises test distance, calibration voltage and calibration frequency;
Secondly, performing voltage test and short circuit test on the MCU chip by adopting a dynamic voltage detector, wherein the dynamic voltage detector measures the voltage fluctuation condition of the MCU chip through the electrical test of the MCU chip to determine the voltage stability of the MCU chip, and the dynamic voltage detector detects the short circuit condition of the MCU chip through an insulation test end to determine the power supply capacity of the MCU chip;
And thirdly, establishing a compensation function model according to the voltage test result and the calibration voltage by using a regression algorithm, and reducing the influence of the measurement distance on the measurement result, wherein the establishment formula of the compensation function model is as follows:
（3）
In the formula (3), the amino acid sequence of the compound, To compensate the functional model,/>Regression algorithm fitting coefficient,/>In order to compensate the function model parameters, V is the calibration voltage, b is the calibration voltage subscript, k is the calibration times, and R is the voltage test result.
A MCU chip test method is applied to the MCU chip test system, and comprises the following steps:
selecting a test board according to test requirements and test purposes, wherein the test board adopts a power-on automatic reset unit to provide reset signals for MCU chip test, and displays the test process state of the MCU chip through an LED indicator lamp;
Inserting the MCU chip into a test board, wherein the test board is connected with an MCU chip function test module and an MCU chip reliability test module through a joint test work interface and a serial debugging interface to debug and control the debugging interface;
step three, the MCU chip function test module adopts a real-time intelligent interrupt test unit to test the interrupt function of the MCU chip, and adopts a combined automatic test unit to test the register read-write function of the MCU chip;
Step four, the MCU chip reliability test module adopts an embedded temperature remote sensing test unit to test the working stability of the MCU chip at different temperatures, and adopts a dynamic accurate voltage test unit to test the voltage stability of the MCU chip
And fifthly, in the test execution process, acquiring MCU chip test data by using a DT85 data acquisition device, and storing the MCU chip test data by using a database memory.
Compared with the prior art, the invention has the beneficial positive effects that:
The invention discloses an MCU chip test system and a test method thereof, wherein a test board adopts a power-on automatic reset unit to provide reset signals for an MCU chip to ensure that the MCU chip is in a correct state at the beginning of test, an MCU chip function test module adopts a real-time intelligent interrupt test unit to test the interrupt function of the MCU chip, a combined automatic test unit to test the read-write function of a register of the MCU chip, and an MCU chip reliability test module adopts an embedded temperature remote sensing test unit to test the working stability of the MCU chip at different temperatures and adopts a dynamic accurate voltage test unit to test the voltage stability of the MCU chip.
Drawings
In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings which are required in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the invention, and that other drawings can be obtained from these drawings without inventive faculty for a person skilled in the art,
FIG. 1 is a schematic diagram of the overall architecture of the present invention;
FIG. 2 is a schematic diagram of the method steps employed in the present invention;
FIG. 3 is a schematic diagram showing the steps of a method for operating a real-time intelligent interrupt test unit according to the present invention;
FIG. 4 is a schematic diagram showing the steps of the working method of the embedded temperature remote sensing test unit of the present invention;
FIG. 5 is a schematic diagram showing the steps of the method for operating the dynamic accurate voltage test unit according to the present invention.
Detailed Description
The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the disclosure. It should be understood that the description is only illustrative and is not intended to limit the scope of the invention. In addition, in the description, descriptions of well-known structures and techniques are omitted so as not to unnecessarily obscure the present invention.
As shown in fig. 1-5, an MCU chip test system includes a regulated power supply, a data acquisition module and a data storage module;
the stabilized power supply is used for providing stabilized voltage for the MCU chip test system, and is a single-phase precise purifying alternating current stabilized power supply;
the data acquisition module acquires MCU chip test data by using a DT85 data acquisition device;
The data storage module adopts a database memory to store MCU chip test data;
The test board, the MCU chip function test module and the MCU chip reliability test module are also included;
The test board is used for providing a stable and reliable environment and ensuring the accuracy and repeatability of MCU chip test, the test board comprises a reset module, an indication module and a debugging interface module, the reset module adopts a power-on automatic reset unit to provide reset signals for the MCU chip and ensure that the MCU chip is in a correct state when the test starts, the indication module adopts an LED indicator lamp to display the MCU chip test process state, the debugging interface module adopts a joint test working interface and a serial debugging interface to provide an interface for MCU chip test, the output end of the debugging interface module is connected with the input end of the reset module, and the output end of the reset module is connected with the input end of the indication module;
The MCU chip function test module is used for testing the functions of the MCU chip and comprises a real-time intelligent interrupt test unit and a combined automatic test unit, wherein the real-time intelligent interrupt test unit is used for testing the interrupt functions of the MCU chip, and the combined automatic test unit is used for testing the read-write functions of registers of the MCU chip;
The MCU chip reliability test module is used for testing the reliability of the MCU chip and ensuring that the MCU cannot fail in long-term use, and comprises an embedded temperature remote sensing test unit and a dynamic accurate voltage test unit, wherein the embedded temperature remote sensing test unit is used for testing the working stability of the MCU chip at different temperatures, and the dynamic accurate voltage test unit is used for testing the voltage stability of the MCU chip;
the output end of the stabilized voltage power supply is connected with the input ends of the data acquisition module, the data storage module, the input end of the test board, the MCU chip function test module and the MCU chip reliability test module, the output end of the test board is connected with the input ends of the MCU chip function test module and the MCU chip reliability test module, and the output ends of the MCU chip function test module and the MCU chip reliability test module are connected with the input ends of the data acquisition module and the data storage module.
In a further embodiment, the power-on automatic reset unit includes a trigger, a counter and a comparator, the trigger triggers the counter to generate a count value according to the change of an input signal, the comparator sends a reset signal according to the count value to ensure that the MCU chip tests normal operation, the trigger is a master-slave RS trigger, the counter is a digital display counter CGC72, and the comparator is a reset comparator BD3775AF.
In a further embodiment, the working method of the real-time intelligent interrupt test unit is as follows:
Step one, testing the interrupt priority, namely testing the interrupt function of the MCU chip by adopting an interrupt controller to process according to the correct priority, wherein the interrupt controller monitors an interrupt signal through dynamic monitoring, and the interrupt controller forms an interrupt chain to test the interrupt priority according to the interrupt vector combination;
Step two, interrupt real-time function test, wherein an interrupt processor is adopted to test that the MCU chip can respond and process in time when the interrupt arrives, the interrupt processor obtains the delay time of the MCU chip when responding to the interrupt through multi-channel time interval measurement, the actual interrupt response time is determined, and the actual interrupt response time calculation formula is as follows:
（1）
in the formula (1), T is the actual interrupt response time, For the number of interrupts, D is the time of arrival of the interrupt, i is the time index, Z is the time after response of the arrival of the interrupt,/>For multi-channel time interval,/>Is a multi-channel time interval parameter;
And step three, testing the interrupt re-entry function, namely testing the interrupt re-entry function of the MCU chip by adopting a calling link device, wherein the calling link device can correctly respond to an interrupt event in the interrupt processing process by verifying the test MCU chip through interrupt re-entry.
In a specific embodiment, the input of the interrupt handler includes a set of object files and a set of library files, wherein the object files are intermediate files generated after compiling, and include program codes and data, the library files include a set of pre-compiled functions and constants, and the interrupt handler first performs symbol analysis on the input interrupt signal, i.e., associates each symbol (such as a function, a variable, etc.) with its corresponding address or value. In the symbol parsing process, the interrupt processor checks whether the symbols in all input target files have conflict or repetition, if so, the MCU chip can correctly respond to the interrupt event in the interrupt processing process, and the interrupt processor determines the actual interrupt response time according to the multi-channel time interval as shown in the table 1:
| Time/s used in method 1 | Time/s for method 2 | Time/s used in method 3 | |
| Group A | 46 | 45 | 40 |
| Group B | 22 | 21 | 19 |
| Group C | 6 | 5 | 5 |
Three test sets are arranged, three methods are adopted to respectively determine the interrupt response time of the MCU chip when the interrupt arrives, the method 1 is the traditional method to determine the interrupt response time of the MCU chip when the interrupt arrives, the method 2 adopts an interrupt processor to determine the interrupt response time of the MCU chip when the interrupt arrives, the method 3 adopts an interrupt processor to determine the interrupt response time of the MCU chip when the interrupt arrives through a multi-channel time interval, as shown in the table 1, the three methods have obvious differences, the method 2 is reduced by about general time compared with the method 1, the method 3 is reduced by about 75 time compared with the method 2, and the interrupt processor of the invention is known to have outstanding technical effects when determining the actual interrupt response time through the multi-channel time interval.
In a further embodiment, the joint automatic test unit comprises a read-write test subunit, a comparison test subunit and a coverage test subunit, wherein the read-write test subunit adopts a reset read-write test to write an input value and a read output value into a register, the correctness and the reliability of the internal register of the MCU chip are detected, the comparison test subunit adopts a comparison test to compare the test result and check the consistency of the test result and an expected result, the coverage test subunit adopts a path coverage test module to ensure that the functionality of the register of the MCU chip is tested, the output end of the read-write test subunit is connected with the input end of the comparison test subunit, and the output end of the comparison test subunit is connected with the input end of the coverage test subunit.
In a further embodiment, the path coverage test module adopts a structural coverage test to realize testing all MCU chip register paths and sub paths, so as to ensure that the MCU chip register functions are executed, and the structural coverage test generates all inputs and paths according to the MCU chip register function execution, determines the MCU chip register function execution output and improves the test coverage rate of the MCU chip register read-write function.
In a further embodiment, the working method of the embedded temperature remote sensing test unit is as follows:
the method comprises the steps that firstly, a constant temperature control box is adopted to control an MCU chip to test the environmental temperature, the constant temperature control box is adopted to rapidly control the environmental temperature to be tested by a chip touch type linear rapid temperature change test box, and the chip touch type linear rapid temperature change test box is energy-saving and accurately controls the temperature to be 70-150 ℃;
Secondly, performing working stability tests on the MCU chip at different temperatures by adopting an STM32F407 temperature remote sensing processor according to a set temperature range and a set time interval, wherein the temperature range is 70-130 ℃ and the time interval is 1-3 seconds;
and thirdly, recording performance indexes and test data of the MCU chip at different temperatures by adopting a data recorder DT2055B, wherein the performance indexes of the MCU chip at least comprise CPU execution speed, memory speed and ADC conversion precision, the performance indexes and the test data of the MCU chip are analyzed and calculated by adopting an ant colony algorithm by adopting the data recorder DT2055B, the performance and the stability of the MCU chip at different temperatures are evaluated, and the performance indexes and the test data formulas of the MCU chip are analyzed and calculated as follows:
（2）
In the formula (2), M is the performance index and the data result of the analysis and calculation MCU chip, For CPU execution frequency, x is the CPU execution frequency index, N is the CPU execution speed,/>Is a performance index parameter of the MCU chip.
In a specific embodiment, the data logger DT2055B is a flexible data collection device that can be used to collect various analog and digital signals for subsequent analysis and processing, the collection principle of the data logger is mainly to convert the analog signals into digital signals through an analog-to-digital converter, and then store the digital signals in a memory or an external medium, and the data logger DT2055B uses an ant colony algorithm to analyze and calculate the performance index of the MCU chip and the accuracy of the test data as shown in table 2:
According to the difference of the object number and the attribute number of the data groups, four test groups are set, the performance index and the test data of the MCU chip are respectively analyzed and calculated by adopting two methods, the performance index and the test data of the MCU chip are analyzed and calculated by adopting a conventional method, the performance index and the test data of the MCU chip are analyzed and calculated by adopting an ant colony algorithm, as shown in a table 2, when one group is subjected to data processing, the accuracy of the performance index and the test data of the MCU chip are obviously different, the greater the accuracy is, the better the performance index and the test data analysis and calculation method of the MCU chip are, the accuracy of the method is obviously greater than that of the method III, and the performance index and the test data analysis and calculation method of the MCU chip by adopting the ant colony algorithm have outstanding technical effects.
In a further embodiment, the working method of the dynamic accurate voltage test unit is as follows:
Step one, obtaining sample training data of MCU chip voltage test results by adopting an accurate potential sensor calibration platform, wherein the sample training data at least comprises test distance, calibration voltage and calibration frequency;
Secondly, performing voltage test and short circuit test on the MCU chip by adopting a dynamic voltage detector, wherein the dynamic voltage detector measures the voltage fluctuation condition of the MCU chip through the electrical test of the MCU chip to determine the voltage stability of the MCU chip, and the dynamic voltage detector detects the short circuit condition of the MCU chip through an insulation test end to determine the power supply capacity of the MCU chip;
And thirdly, establishing a compensation function model according to the voltage test result and the calibration voltage by using a regression algorithm, and reducing the influence of the measurement distance on the measurement result, wherein the establishment formula of the compensation function model is as follows:
（3）
In the formula (3), the amino acid sequence of the compound, To compensate the functional model,/>Regression algorithm fitting coefficient,/>In order to compensate the function model parameters, V is the calibration voltage, b is the calibration voltage subscript, k is the calibration times, and R is the voltage test result.
In a specific embodiment, the dynamic voltage detector is a device for detecting and measuring voltage signals in a circuit, and is used for monitoring and measuring voltage changes of an MCU chip so as to perform voltage test and short circuit test, and the dynamic voltage detector is generally composed of two parts: the probe and the detector, the dynamic voltage detector can be used for measuring the voltage signal in the MCU chip, such as clock signal, data signal, control signal, etc., the dynamic voltage detector can be used for cracking the encryption MCU chip, because the encryption MCU chip can generally produce different output results according to the voltage change, the encryption algorithm inside the MCU chip can be analyzed through the dynamic voltage detector, the dynamic voltage detector adopts the regression algorithm to reduce the influence result of the measuring distance on the measuring result as shown in Table 3:
Four test groups are arranged, the voltage stability of the MCU chip is respectively determined by adopting two methods, the voltage stability of the MCU chip is determined for the dynamic voltage detector by adopting a fifth method, the voltage stability of the MCU chip is determined by adopting a regression algorithm by adopting a sixth method, as shown in a table 3, the voltage stability of the MCU chip is obviously different by adopting the two methods, the better the voltage stability of the MCU chip is, the larger the numerical value of the measurement result is, the larger the measurement result is, the three times is increased compared with the fifth method, and the dynamic voltage detector has outstanding technical effects by adopting the regression algorithm to determine the voltage stability of the MCU chip.
In a further embodiment, an MCU chip test method, applied to the MCU chip test system, includes the steps of:
selecting a test board according to test requirements and test purposes, wherein the test board adopts a power-on automatic reset unit to provide reset signals for MCU chip test, and displays the test process state of the MCU chip through an LED indicator lamp;
Inserting the MCU chip into a test board, wherein the test board is connected with an MCU chip function test module and an MCU chip reliability test module through a joint test work interface and a serial debugging interface to debug and control the debugging interface;
step three, the MCU chip function test module adopts a real-time intelligent interrupt test unit to test the interrupt function of the MCU chip, and adopts a combined automatic test unit to test the register read-write function of the MCU chip;
Step four, the MCU chip reliability test module adopts an embedded temperature remote sensing test unit to test the working stability of the MCU chip at different temperatures, and adopts a dynamic accurate voltage test unit to test the voltage stability of the MCU chip
And fifthly, in the test execution process, acquiring MCU chip test data by using a DT85 data acquisition device, and storing the MCU chip test data by using a database memory.
While specific embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these specific embodiments are merely illustrative, and that various omissions, substitutions, and changes in the form and details of the methods and systems described above may be made by those skilled in the art without departing from the spirit and scope of the invention. For example, it is within the scope of the present invention to combine the above-described method steps to perform substantially the same function in substantially the same way to achieve substantially the same result. Accordingly, the scope of the invention is limited only by the following claims.
Claims (7)
1. An MCU chip test system, which is characterized in that: the MCU chip test system comprises a stabilized voltage power supply, a data acquisition module and a data storage module;
the stabilized power supply is used for providing stabilized voltage for the MCU chip test system, and is a single-phase precise purifying alternating current stabilized power supply;
the data acquisition module acquires MCU chip test data by using a DT85 data acquisition device;
The data storage module adopts a database memory to store MCU chip test data;
The method is characterized in that: the MCU chip test system also comprises a test board, an MCU chip function test module and an MCU chip reliability test module;
The test board is used for providing a stable and reliable environment and ensuring the accuracy and repeatability of MCU chip test, the test board comprises a reset module, an indication module and a debugging interface module, the reset module adopts a power-on automatic reset unit to provide reset signals for the MCU chip and ensure that the MCU chip is in a correct state when the test starts, the indication module adopts an LED indicator lamp to display the MCU chip test process state, the debugging interface module adopts a joint test working interface and a serial debugging interface to provide an interface for MCU chip test, the output end of the debugging interface module is connected with the input end of the reset module, and the output end of the reset module is connected with the input end of the indication module;
The MCU chip function test module is used for testing the functions of the MCU chip and comprises a real-time intelligent interrupt test unit and a combined automatic test unit, wherein the real-time intelligent interrupt test unit is used for testing the interrupt functions of the MCU chip, and the combined automatic test unit is used for testing the read-write functions of registers of the MCU chip;
The MCU chip reliability test module is used for testing the reliability of the MCU chip and ensuring that the MCU cannot fail in long-term use, and comprises an embedded temperature remote sensing test unit and a dynamic accurate voltage test unit, wherein the embedded temperature remote sensing test unit is used for testing the working stability of the MCU chip at different temperatures, and the dynamic accurate voltage test unit is used for testing the voltage stability of the MCU chip;
The output end of the stabilized voltage power supply is connected with the input ends of the data acquisition module, the data storage module, the input end of the test board, the MCU chip function test module and the MCU chip reliability test module, the output end of the test board is connected with the input ends of the MCU chip function test module and the MCU chip reliability test module, and the output ends of the MCU chip function test module and the MCU chip reliability test module are connected with the input ends of the data acquisition module and the data storage module;
the working method of the dynamic accurate voltage test unit comprises the following steps:
Step one, obtaining sample training data of MCU chip voltage test results by adopting an accurate potential sensor calibration platform, wherein the sample training data at least comprises test distance, calibration voltage and calibration frequency;
Secondly, performing voltage test and short circuit test on the MCU chip by adopting a dynamic voltage detector, wherein the dynamic voltage detector measures the voltage fluctuation condition of the MCU chip through the electrical test of the MCU chip to determine the voltage stability of the MCU chip, and the dynamic voltage detector detects the short circuit condition of the MCU chip through an insulation test end to determine the power supply capacity of the MCU chip;
And thirdly, establishing a compensation function model according to the voltage test result and the calibration voltage by using a regression algorithm, and reducing the influence of the measurement distance on the measurement result, wherein the establishment formula of the compensation function model is as follows:
（1）
in the formula (1), the components are as follows, To compensate the functional model,/>Regression algorithm fitting coefficient,/>In order to compensate the function model parameters, V is the calibration voltage, b is the calibration voltage subscript, k is the calibration times, and R is the voltage test result.
2. The MCU chip test system of claim 1, wherein: the power-on automatic reset unit comprises a trigger, a counter and a comparator, wherein the trigger triggers the counter to generate a count value according to the change of an input signal, the comparator sends a reset signal according to the count value to ensure the normal running of MCU chip test, the trigger is a master-slave RS trigger, the counter is a digital display counter CGC72, and the comparator is a reset comparator BD3775AF.
3. The MCU chip test system of claim 1, wherein: the working method of the real-time intelligent interrupt test unit comprises the following steps:
Step one, testing the interrupt priority, namely testing the interrupt function of the MCU chip by adopting an interrupt controller to process according to the correct priority, wherein the interrupt controller monitors an interrupt signal through dynamic monitoring, and the interrupt controller forms an interrupt chain to test the interrupt priority according to the interrupt vector combination;
Step two, testing real-time interrupt function, namely testing that an MCU chip can respond and process in time when an interrupt arrives by adopting an interrupt processor, wherein the interrupt processor obtains the delay time of the MCU chip when responding to the interrupt through multi-channel time interval measurement, and determines the actual interrupt response time, and the actual interrupt response time calculation formula is as follows;
（2）
In the formula (2), T is the actual interrupt response time, For the number of interrupts, D is the time of arrival of the interrupt, i is the time index, Z is the time after response of the arrival of the interrupt,/>For multi-channel time interval,/>Is a multi-channel time interval parameter;
And step three, testing the interrupt re-entry function, namely testing the interrupt re-entry function of the MCU chip by adopting a calling link device, wherein the calling link device can correctly respond to an interrupt event in the interrupt processing process by verifying the test MCU chip through interrupt re-entry.
4. The MCU chip test system of claim 1, wherein: the combined automatic test unit comprises a read-write test subunit, a comparison test subunit and a coverage test subunit, wherein the read-write test subunit adopts a reset read-write test to write an input value and a read output value into a register, the correctness and the reliability of the internal register of the MCU chip are detected, the comparison test subunit adopts a comparison test to compare a test result, the consistency of the test result and an expected result is checked, the coverage test subunit adopts a path coverage test module to ensure that the functionality of the register of the MCU chip is tested, the output end of the read-write test subunit is connected with the input end of the comparison test subunit, and the output end of the comparison test subunit is connected with the input end of the coverage test subunit.
5. The MCU chip test system of claim 4, wherein: the path coverage test module adopts a structural coverage test to realize testing all MCU chip register paths and sub paths, ensures that the MCU chip register functions are executed, generates all inputs and paths according to the MCU chip register function execution, determines the MCU chip register function execution output, and improves the test coverage rate of the MCU chip register read-write function.
6. The MCU chip test system of claim 1, wherein: the working method of the embedded temperature remote sensing test unit comprises the following steps:
the method comprises the steps that firstly, a constant temperature control box is adopted to control an MCU chip to test the environmental temperature, the constant temperature control box is adopted to rapidly control the environmental temperature to be tested by a chip touch type linear rapid temperature change test box, and the chip touch type linear rapid temperature change test box is energy-saving and accurately controls the temperature to be 70-150 ℃;
Secondly, performing working stability tests on the MCU chip at different temperatures by adopting an STM32F407 temperature remote sensing processor according to a set temperature range and a set time interval, wherein the temperature range is 70-130 ℃ and the time interval is 1-3 seconds;
And thirdly, recording performance indexes and test data of the MCU chip at different temperatures by adopting a data recorder DT2055B, wherein the performance indexes of the MCU chip at least comprise CPU execution speed, memory speed and ADC conversion precision, the performance indexes and the test data of the MCU chip are analyzed and calculated by adopting an ant colony algorithm by adopting the data recorder DT2055B, the performance and the stability of the MCU chip at different temperatures are evaluated, and the performance indexes and the test data formulas of the MCU chip are analyzed and calculated as follows:
（3）
In the formula (3), M is the performance index and the data result of the analysis and calculation MCU chip, For CPU execution frequency, x is the CPU execution frequency index, N is the CPU execution speed,/>Is a performance index parameter of the MCU chip.
7. The MCU chip testing method is characterized in that: an MCU chip test system applied to any one of claims 1-6, said method comprising:
selecting a test board according to test requirements and test purposes, wherein the test board adopts a power-on automatic reset unit to provide reset signals for MCU chip test, and displays the test process state of the MCU chip through an LED indicator lamp;
Inserting the MCU chip into a test board, wherein the test board is connected with an MCU chip function test module and an MCU chip reliability test module through a joint test work interface and a serial debugging interface to debug and control the debugging interface;
step three, the MCU chip function test module adopts a real-time intelligent interrupt test unit to test the interrupt function of the MCU chip, and adopts a combined automatic test unit to test the register read-write function of the MCU chip;
Step four, the MCU chip reliability test module adopts an embedded temperature remote sensing test unit to test the working stability of the MCU chip at different temperatures, and adopts a dynamic accurate voltage test unit to test the voltage stability of the MCU chip;
And fifthly, in the test execution process, acquiring MCU chip test data by using a DT85 data acquisition device, and storing the MCU chip test data by using a database memory.
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