CN116936717A - High-brightness LED structure packaging method and LED structure - Google Patents
High-brightness LED structure packaging method and LED structure Download PDFInfo
- Publication number
- CN116936717A CN116936717A CN202311065040.XA CN202311065040A CN116936717A CN 116936717 A CN116936717 A CN 116936717A CN 202311065040 A CN202311065040 A CN 202311065040A CN 116936717 A CN116936717 A CN 116936717A
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- China
- Prior art keywords
- packaging
- lamp beads
- led lamp
- dip
- led structure
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Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 47
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000011324 bead Substances 0.000 claims abstract description 52
- 239000003292 glue Substances 0.000 claims abstract description 18
- 239000003086 colorant Substances 0.000 claims abstract description 15
- 238000007711 solidification Methods 0.000 claims abstract description 4
- 230000008023 solidification Effects 0.000 claims abstract description 4
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000009434 installation Methods 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 4
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a high-brightness LED structure packaging method and an LED structure, comprising the following steps: s1, taking three-primary-color LED lamp beads and performing DIP packaging to obtain three-primary-color DIP packaging LED lamp beads; s2, taking a bracket, and uniformly distributing the DIP packaging LED lamp beads with three primary colors in the S1 on the bracket; and S3, glue is filled in the bracket and solidification is carried out, so that the high-brightness LED structure is obtained. The invention has the advantages of convenient operation and installation, high brightness, stable performance, strong reliability and the like.
Description
Technical Field
The invention belongs to the technical field of LEDs, and particularly relates to a high-brightness LED structure packaging method and an LED structure.
Background
The LED has been developed from big to small, the brightness is from dark to bright, the scene of use also is from single indication backlight to present no hole is gone into, the encapsulation of LED also is from original DIP encapsulation to present SMD encapsulation, but under many scenes, the luminance and the consumption of LED still can not satisfy the condition, for example in the outdoor needs 10000 cd/square meter's luminance, the full bright consumption requirement is about 200 watts, the LED luminance of DIP encapsulation can reach this time, but the encapsulation of SMD is far insufficient, but the LED of DIP encapsulation is because lamp pearl is bigger by itself, the pixel density is done not high again, the LED of DIP is less efficient than the LED of SMD in the operation.
Disclosure of Invention
The invention provides a high-brightness LED structure packaging method and an LED structure for solving the defects in the prior art.
In order to solve the technical problems, the invention adopts the following technical scheme:
the high brightness LED structure packaging method comprises the following steps:
s1, taking three-primary-color LED lamp beads and performing DIP packaging to obtain three-primary-color DIP packaging LED lamp beads;
s2, taking a bracket, and uniformly distributing the DIP packaging LED lamp beads with three primary colors in the S1 on the bracket;
and S3, glue is filled in the bracket and solidification is carried out, so that the high-brightness LED structure is obtained.
Preferably, the packaging glue of the tricolor DIP packaged LED lamp bead in S1 is epoxy resin.
Preferably, the DIP packaging LED lamp beads with three primary colors in the S2 are uniformly distributed on the support in a delta shape.
Preferably, the pins of the LED lamp beads packaged by the DIP with three primary colors in the S2 are welded on the bracket.
Preferably, the glue filled in the step S3 is silicone.
The LED structure is manufactured according to the high-brightness LED structure packaging method.
By adopting the technical scheme, the invention has the following beneficial effects:
(1) According to the invention, the three-primary-color LED lamp beads are subjected to DIP packaging firstly, then the three-primary-color DIP packaging LED lamp beads obtained by the DIP packaging are subjected to glue pouring and solidification again by referring to an SMD packaging mode in the prior art, and finally a high-brightness LED structure is obtained, so that the LED lamp has the advantages of the SMD packaging LED and the DIP packaging LED in the prior art, and is convenient to operate and install and has high brightness;
(2) The three-primary-color LED lamp beads are packaged by the epoxy resin, so that the LED lamp beads are good in waterproof performance and stable in performance, the brightness of the whole lamp beads is improved, and the reliability is greatly enhanced;
(3) The DIP packaging LED lamp beads with three primary colors are uniformly distributed on the bracket in a delta shape, so that the space is further saved, and the size is reduced;
in conclusion, the invention has the advantages of convenient operation and installation, high brightness, stable performance, high reliability and the like.
Drawings
Fig. 1 is a flow chart of the high brightness LED structure packaging method of the present invention.
Detailed Description
The following description of the embodiments of the present invention will be made apparent and fully in view of the accompanying drawings, in which some, but not all embodiments of the invention are shown.
The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention.
All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
Example 1
In this embodiment, the high-brightness LED structure packaging method of the present invention firstly packages the three primary colors of LED lamp beads according to the DIP packaging method in the prior art, and then packages the three primary colors of LED lamp beads with reference to the SMD packaging method in the prior art to finally obtain the high-brightness LED structure, so that the high-brightness LED structure has the advantages of both the two packaging methods, not only is convenient for operation and installation, but also has large brightness and as small a volume as possible.
As shown in fig. 1, in one embodiment of the present invention, the high brightness LED structure packaging method of the present invention includes the steps of:
s1, taking three-primary-color LED lamp beads and performing DIP encapsulation to obtain three-primary-color DIP encapsulation LED lamp beads, wherein the three-primary-color LED lamp beads are RGBLED lamp beads, namely red, green and blue LED lamp beads, each of the three-color LED lamp beads is respectively encapsulated by DIP, specifically, glue is respectively encapsulated on the three-color LED lamp beads, more specifically, the encapsulated glue is epoxy resin, pins of the three-color LED lamp beads are exposed outside the glue after the three-color LED lamp beads are encapsulated by the glue, water cannot enter at all due to encapsulation of epoxy resin in an area where the three-color LED lamp beads are attached to the glue when the three-color LED lamp beads are used, stability is good after the three-color LED lamp beads are encapsulated, and good brightness and reliability are achieved, and the SMD (surface mounted device) of the three-color LED lamp beads is not affected when the three-color LED lamp beads are encapsulated again on the basis of DIP encapsulation, namely, the three-color LED lamp beads can be consistently encapsulated in the three-dimensional LED lamp beads of 1mm, and the LED lamp beads of three-1 mm can be manufactured by the LED lamp beads of the invention, and the LED lamp beads of three-1 mm can be stably-sized, and the LED lamp beads of 1mm can be manufactured, and the LED lamp beads of three-1 mm can be stably and LED lamp beads of 1mm;
s2, taking a support, uniformly distributing the DIP packaging LED lamp beads of three primary colors in S1 on the support, specifically, referring to the existing SMDLED lamp bead, namely, taking the support firstly, directly taking the support as an LED lamp bead support, uniformly distributing the DIP packaging LED lamp beads of three primary colors which are packaged in S1 on the support, and arranging according to a sequence, wherein the DIP packaging LED lamp beads of three primary colors in S2 are uniformly distributed on the support in a delta shape, pins of the DIP packaging LED lamp beads of three primary colors in S2 are welded on the support, and support pins are further arranged on the support, so that the LED lamp beads can be electrically connected to emit light conveniently;
s3, glue is filled in the bracket and is cured to obtain a high-brightness LED structure, specifically, the bracket can be sleeved with a shell, the shell can be PPA material, glue filled in the bracket can be silicon resin, the combination of the PPA material and the silicon resin can be easily peeled off at high temperature, after glue filling, the glue can be sent into a baking oven to be cured and baked, fluorescent powder and other materials can be added into the glue to change color or improve brightness, and the like, specific baking temperature and time are the prior art, the setting can be carried out according to different requirements, the high-brightness LED structure can be obtained after curing, the size after packaging is completed according to the steps is about 3.5mm, specifically, the size after packaging is about 3.5mm, and the size can be 3.5mm, so that the problem of high brightness and low power consumption of a display screen above P6 on the market can be solved, the LED packaging structure not only has the advantages of good DIP packaging stability and high brightness, but also has the advantage of convenient operation of SMD packaging.
The invention also discloses an LED structure and a method for manufacturing the LED structure with high brightness.
The present embodiment is not limited in any way by the shape, material, structure, etc. of the present invention, and any simple modification, equivalent variation and modification made to the above embodiments according to the technical substance of the present invention are all included in the scope of protection of the technical solution of the present invention.
Claims (6)
1. The high-brightness LED structure packaging method is characterized by comprising the following steps of:
s1, taking three-primary-color LED lamp beads and performing DIP packaging to obtain three-primary-color DIP packaging LED lamp beads;
s2, taking a bracket, and uniformly distributing the DIP packaging LED lamp beads with three primary colors in the S1 on the bracket;
and S3, glue is filled in the bracket and solidification is carried out, so that the high-brightness LED structure is obtained.
2. The method of packaging a high brightness LED structure of claim 1, wherein: and the packaging glue of the LED lamp beads packaged by the DIP with three primary colors in the S1 is epoxy resin.
3. The method of packaging a high brightness LED structure of claim 1, wherein: and the DIP packaging LED lamp beads with three primary colors in the S2 are uniformly distributed on the support in a delta shape.
4. The method of packaging a high brightness LED structure of claim 1, wherein: and the pins of the LED lamp beads packaged by the DIP with three primary colors in the S2 are welded on the bracket.
5. The method of packaging a high brightness LED structure of claim 1, wherein: and (3) the glue filled in the step (S3) is silicon resin.
LED structure, its characterized in that: the method of any one of claims 1-5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311065040.XA CN116936717A (en) | 2023-08-22 | 2023-08-22 | High-brightness LED structure packaging method and LED structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311065040.XA CN116936717A (en) | 2023-08-22 | 2023-08-22 | High-brightness LED structure packaging method and LED structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116936717A true CN116936717A (en) | 2023-10-24 |
Family
ID=88379174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311065040.XA Pending CN116936717A (en) | 2023-08-22 | 2023-08-22 | High-brightness LED structure packaging method and LED structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116936717A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008103393A (en) * | 2006-10-17 | 2008-05-01 | Funai Electric Co Ltd | Led lamp device |
| US20110079808A1 (en) * | 2009-10-01 | 2011-04-07 | Everlight Electronics Co., Ltd. | Light emitting diode |
| TW201123125A (en) * | 2009-12-21 | 2011-07-01 | Aussmak Optoelectronic Corp | Light transmissible display apparatus |
| CN204011416U (en) * | 2014-07-25 | 2014-12-10 | 佛山市蓝箭电子股份有限公司 | A kind of general high cup type LED support and encapsulating products thereof |
| CN105591013A (en) * | 2016-03-25 | 2016-05-18 | 深圳市九洲光电科技有限公司 | SMD outer package type LED |
| CN210778676U (en) * | 2019-10-08 | 2020-06-16 | 永林电子有限公司 | Direct-insertion LED lamp bead with built-in patch type LED |
-
2023
- 2023-08-22 CN CN202311065040.XA patent/CN116936717A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008103393A (en) * | 2006-10-17 | 2008-05-01 | Funai Electric Co Ltd | Led lamp device |
| US20110079808A1 (en) * | 2009-10-01 | 2011-04-07 | Everlight Electronics Co., Ltd. | Light emitting diode |
| TW201123125A (en) * | 2009-12-21 | 2011-07-01 | Aussmak Optoelectronic Corp | Light transmissible display apparatus |
| CN204011416U (en) * | 2014-07-25 | 2014-12-10 | 佛山市蓝箭电子股份有限公司 | A kind of general high cup type LED support and encapsulating products thereof |
| CN105591013A (en) * | 2016-03-25 | 2016-05-18 | 深圳市九洲光电科技有限公司 | SMD outer package type LED |
| CN210778676U (en) * | 2019-10-08 | 2020-06-16 | 永林电子有限公司 | Direct-insertion LED lamp bead with built-in patch type LED |
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