CN116916529A - Ultra-wideband high-integration expandable subarray mother board - Google Patents

Ultra-wideband high-integration expandable subarray mother board Download PDF

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Publication number
CN116916529A
CN116916529A CN202310839670.1A CN202310839670A CN116916529A CN 116916529 A CN116916529 A CN 116916529A CN 202310839670 A CN202310839670 A CN 202310839670A CN 116916529 A CN116916529 A CN 116916529A
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CN
China
Prior art keywords
sub
radio frequency
ultra
mother board
subarray
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Pending
Application number
CN202310839670.1A
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Chinese (zh)
Inventor
刘垄
李树良
李晓鲲
闵应存
吴鸿超
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CETC 14 Research Institute
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CETC 14 Research Institute
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Publication date
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Priority to CN202310839670.1A priority Critical patent/CN116916529A/en
Publication of CN116916529A publication Critical patent/CN116916529A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H01Q21/0025—Modular arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
    • H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
    • H01Q3/30—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array
    • H01Q3/34—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture varying the relative phase between the radiating elements of an array by electrical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/20—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements characterised by the operating wavebands
    • H01Q5/25—Ultra-wideband [UWB] systems, e.g. multiple resonance systems; Pulse systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0215—Grounding of printed circuits by connection to external grounding means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0272—Adaptations for fluid transport, e.g. channels, holes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D30/00—Reducing energy consumption in communication networks
    • Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)

Abstract

The high-integration active subarray mother board technology can remarkably reduce the volume weight of an active subarray by integrating functional components such as a chip-based TR component, a delay amplifying component, a secondary power supply and the like on one subarray mother board, and is a development direction of radar hardware which is in urgent need of continuous technological breakthrough. The invention provides an ultra-wideband high-integration expandable sub-matrix board, which integrates and designs functional modules such as a TR component, a delay amplifying component, a secondary power supply, a wave control drive, a radio frequency power distribution synthesis network and the like into one sub-matrix board, realizes interconnection and integration of various signals through a mixed-voltage high-low frequency printed board, and provides corresponding solving measures aiming at the problems of printed board architecture layout, high-efficiency heat dissipation of devices, radio frequency broadband connection and printed board processing after high-integration design. The high integration design of the active subarray arrangement in the array plane caliber can be realized, and the high-performance and multifunctional broadband expandability can be realized.

Description

Ultra-wideband high-integration expandable subarray mother board
Technical Field
The invention belongs to the technical field of radar antennas, and particularly relates to an ultra-wideband high-integration expandable sub-array motherboard.
Background
The phased array radar is a radar adopting a phased array antenna, and the rapid scanning of the wave beam is realized through electric control scanning. The antenna array surface is an important component for receiving and transmitting electromagnetic waves in phased array radar equipment, and achieves the functions of beam real-time change, small signal amplification receiving, broadband transmitting and the like. In order to meet the requirements of functions and performances such as detection, interference, detection, communication and the like required by the multifunctional radar electronic equipment, the antenna array surface is required to contain various active devices such as amplification, control, phase shift, delay, attenuation and the like used in a transmitting link and a receiving link besides basic components such as an antenna, a feeder line network and the like. The modularized design is an important development trend of the antenna array surface, and the expandability and maintainability of the antenna array surface can be greatly improved by integrating the basic functions of the antenna array surface to form different functional modules. The most important functional module of the antenna array surface is an analog active subarray, and the main functions of the antenna array surface are as follows: when receiving, amplifying and receiving external signals, classifying and synthesizing radio frequency signals, and sending the radio frequency signals to a rear end for processing; during transmitting, the radio frequency signals sent by the network are classified and amplified and then distributed to the antenna units to form electromagnetic waves radiated to the space. The active subarray consists of a TR assembly, a delay amplifying assembly, a wave control module, a radio frequency power divider network, a secondary power supply and the like, and all the components are independent modules which are mutually interconnected through connectors and cables.
The active subarray at present mainly has the following problems: 1) The volume and the weight are large, and the size often exceeds the limit of an electric caliber, so that the expandability and the use flexibility of the antenna array surface are reduced; 2) The internal components are interconnected by adopting cables, so that more loss is brought, and the subarray heat dissipation burden is excessively heavy while the performance of the subarray is reduced. The antenna array surface of the next-generation radar electronic equipment is developed towards high integration, more active devices are integrated into a smaller space, so that the aperture of the antenna array surface corresponds to the subarray radio frequency interface one by one, the interconnection loss can be reduced, the aperture efficiency of the array surface is effectively improved, and more importantly, the antenna array surface has expansibility and reconfigurable capability; on the other hand, the functional requirements of radar equipment such as higher working frequency, larger scanning range, more polarization forms, receiving and transmitting duplex and the like also lead the antenna array surface to be integrated with more active devices in a smaller space. The high-integration active subarray mother board technology is a feasible and effective development direction, and the volume weight of an active subarray can be remarkably reduced by integrating functional components such as a chip-based TR component, a delay amplifying component, a secondary power supply and the like on one subarray mother board, so that the development direction of radar hardware with a continuous technology breakthrough is urgently needed.
Disclosure of Invention
Therefore, the invention provides an ultra-wideband high-integration expandable subarray mother board, which mainly solves the design problems of high integration, miniaturization, expandability and high performance of an active subarray of a radar antenna array surface. Functional modules such as a TR assembly, a delay amplifying assembly, a secondary power supply, a wave control drive, a radio frequency power distribution synthesis network and the like are integrated and designed into a subarray mother board, interconnection and integration of various signals are realized through a mixed-voltage high-low frequency printed board, and corresponding solving measures are provided for the problems of printed board architecture layout, efficient heat dissipation of devices, radio frequency broadband connection and printed board processing after high-integration design. The high integration design of the active subarray arrangement in the array plane caliber can be realized, and the high-performance and multifunctional broadband expandability can be realized.
The ultra-wideband high-integration expandable sub-matrix board comprises 24 double-channel TR components, 2 delay amplifying components, 7 secondary power modules, a wave control driving device and a dual-polarization power dividing network, wherein the transmission of control and power signals in the sub-matrix board is realized through a low-frequency part of a mixed-voltage printed board, and the dual-polarization power dividing network is realized through a high-frequency part of the mixed-voltage printed board.
Further, two cavities with different depths are dug in the mixed stamping plate, the high-height device is welded in the deep cavity, and the low-height device is welded in the shallow cavity.
Furthermore, the mixed-pressure printed board high-frequency part uses a third-order Wilkinson power divider to realize the ultra-wideband power division network function.
Further, due to the height restrictions and signal connection requirements, the hybrid printed board has the low frequency portion below and the high frequency portion above.
Further, the radio frequency signals of the subarray mother board are connected to the radio frequency connector through the side, the strip line is exposed out of the cavity above the radio frequency connection position of the subarray mother board, the microstrip line is transited into the microstrip line, the cavity is also dug below, the radio frequency ground is exposed out, the radio frequency connector is fixed on the metal structure shell, and the structure shell is in conductive contact with the cavity dug below the subarray mother board, so that the radio frequency grounding requirement is realized.
Further, the subarray mother board is filled with copper blocks below the TR component and the delay amplifying component, and the upper surface and the lower surface of the copper blocks are flush with the printed board.
Further, the 8λ and 16λ delay windings are disposed within the sub-motherboard radio frequency stripline layer by coupling the delay amplifying assembly to the sub-motherboard.
The invention has the beneficial effects that
1. Aiming at the design of an ultra-wideband subarray mother board, 24 TR assemblies, 2 delay amplifying assemblies, 7 2 power supplies and a dual-polarization power division network are integrated, the integration level of an active subarray is remarkably improved, and the space size is remarkably reduced.
2. When the TR assembly is designed to dissipate heat, copper is buried through the printed board to conduct heat, heat is transferred to the structural cold plate through the lower portion of the TR assembly, and high-efficiency heat dissipation is achieved through liquid cooling.
3. The low-impedance transmission power division network design is used for designing the radio frequency power division network, so that the thickness of the radio frequency printed board is reduced, and meanwhile, the processability is realized.
4. Aiming at devices with different heights, different types of printed boards are designed and used for digging cavities, so that the devices are welded in the cavities, the real subarray mother board is only 5.5mm in height, and the function requirement of being expandable in unit spacing is realized.
5. Aiming at the radio frequency welding part, double-sided slotting design is carried out, so that a good radio frequency grounding function is realized, and ultra-wideband connection impedance matching is ensured.
6. The large-bit delay state delay winding of the delay amplifying assembly is integrated in the subarray mother board, so that the design difficulty of the delay amplifying assembly is reduced, the size of the delay amplifying assembly is reduced, and the BGA welding reliability is ensured.
Drawings
Fig. 1 is a plan layout view of a sub-matrix board.
Fig. 2 is a schematic diagram of a sub-matrix hybrid printed board lamination relationship.
Fig. 3 is a schematic diagram of a sub-array motherboard height design.
Fig. 4 is a plan view of the planar position of the copper heat spreader of the sub-array motherboard of fig. 2.
Fig. 5 is a schematic diagram of a sub-matrix dual polarized rf network layout.
Fig. 6 is a schematic diagram of an impedance transformation and low impedance power divider of the rf power divider network of fig. 5.
Fig. 7 is a cross-sectional and three-dimensional schematic diagram of a sub-motherboard rf connector connection.
Fig. 8 is a schematic diagram of a delay amplifying assembly radio frequency circuit.
Detailed Description
The following description of the technical solutions in the embodiments of the present invention will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, the sub-matrix board is designed to realize a 24-channel dual-polarized radio frequency transceiver function, and in order to realize this function, 24 dual-channel TR assemblies, 2 delay amplifying assemblies, 7 secondary power modules, a wave control driving device, a dual-polarized power division network and the like are integrated in the sub-matrix board. The transmission of control and power signals in the sub-mother board is realized through a low-frequency part of the mixed-pressure printed board, and the dual-polarization power division network is realized through a high-frequency part of the mixed-pressure printed board.
As shown in fig. 3, in order to achieve scalability of the sub-mother board, the thickness and horizontal length of the sub-mother board must be limited to within the cell pitch, and in this embodiment, the thickness of the sub-mother board is limited to within 5.5mm, and the length of the printed board is limited to within 298 mm. The thickness of the mixed printed board is 2.7mm, the thickness of the delay amplifying assembly and the TR assembly is 3mm, and the thickness of the energy storage capacitor and the low-frequency connector is 4.3mm. In order to reduce the overall thickness of the sub-matrix board, two types of cavities 1-5 and 1-9 are dug in the printed board, and the depths of the cavities are 0.8mm and 1.6mm respectively. And respectively welding a device with the height of 3mm and a device with the height of 4.3mm in the two cavities, wherein the TR component and the delay amplifying component are welded with the printed board in a BGA mode, the diameter of a ball adopted for welding is 0.4mm, and the space with the thickness of 0.4mm is occupied. Through the two cavity designs, the design with low thickness of which the integral thickness of the sub-matrix plate is less than 5.5mm is realized.
As shown in fig. 6, the mixed-printed board high-frequency part needs to realize an ultra-wideband power division network function, and a third-order wilkinson power divider is used. In order to reduce the thickness of the printed board, the high-frequency printed board adopts a CLTE-XT-01055 board, the thickness of a single-layer board is 0.254mm, if the design of a conventional Wilkinson power divider is adopted, the narrowest line width of a circuit of the printed board is less than 0.15mm, and the conventional processing technology is difficult to realize. The invention uses broadband chebyshev impedance transformation to transform a 50 ohm transmission system into a 34 ohm transmission system, the input and output ends in the printed board are subjected to impedance transformation, and the internal power division network adopts a low impedance system. The low-thickness, large-bandwidth and processable radio frequency power division network function is realized.
When designing the sub-matrix printed board, the low-frequency printed board is arranged below and the high-frequency printed board is arranged above because of the height limitation and the signal connection requirement. The sub-mother board radio frequency signals are connected to the radio frequency connector through the side, and in order to achieve good ultra-wideband radio frequency transmission performance, good radio frequency grounding is required. As shown in fig. 7, at the radio frequency connection position of the sub-motherboard printed board, the L7 layer strip line is exposed from the cavity dug above, and the transition is made into the microstrip line. The cavity is dug in the same way below, and the L8 layer of radio frequency ground is exposed. The radio frequency connector is fixed on the metal structure shell, and the structure shell is in conductive contact with the cavity dug below the printed board, so that the radio frequency grounding requirement is realized. Through the design of two-sided fluting, effectively guarantee ultra wide band ground connection, guarantee radio frequency standing wave performance.
As shown in fig. 2 and 4, the sub-motherboard printed board is copper block filled under the TR assembly and the delay amplifying assembly. The copper block filling area below the TR component is 64mm 2 The copper block filling area below the delay amplifying assembly is 52mm 2 The upper and lower surfaces of the filled copper block are flush with the printed board, and the thickness of the filled copper block is 1.9mm. The TR component and the delay amplifying component are welded on the printed board through the BGA, and heat generated by the TR component and the delay amplifying component is conducted into copper blocks filled in the printed board through the BGA solder balls and then is conducted downwards to a cold plate attached to the lower surface of the printed board to realize heat dissipation.
As shown in fig. 8, the delay amplifying assembly has a relatively large number of delay bits, and the large-bit delay winding occupies a relatively large space, in this embodiment, the large-bit delay winding cannot be placed for the chipped delay amplifying assembly, the delay amplifying assembly and the sub-mother board are coupled, and the 8 lambda and 16 lambda delay windings are arranged in the radio frequency strip line layer of the sub-mother board printed board, and the specific wiring is shown in fig. 5. Through the design, the miniaturization design of the delay amplifying chip is realized, the BGA welding reliability is ensured, and meanwhile, the requirements of the sub-array motherboard on the broadband scanning function are met.
The present invention is not limited to the above-described specific embodiments, and various modifications and variations are possible. Any modification, equivalent replacement, improvement, etc. of the above embodiments according to the technical substance of the present invention should be included in the protection scope of the present invention.

Claims (7)

1. An ultra-wideband high-integration expandable sub-array motherboard is characterized in that: the sub-mother board comprises 24 double-channel TR components, 2 delay amplifying components, 7 secondary power modules, a wave control driving device and a dual-polarization power dividing network, wherein the transmission of control and power signals in the sub-mother board is realized through a low-frequency part of the mixed-voltage printed board, and the dual-polarization power dividing network is realized through a high-frequency part of the mixed-voltage printed board.
2. The ultra-wideband highly integrated expandable sub-array motherboard of claim 1, wherein: two cavities with different depths are dug in the mixed stamping plate, the device with high height is welded in the deep cavity, and the device with low height is welded in the shallow cavity.
3. The ultra-wideband highly integrated expandable sub-array motherboard of claim 1, wherein: and the mixed-printed board high-frequency part realizes an ultra-wideband power division network function by using a third-order Wilkinson power divider.
4. The ultra-wideband highly integrated expandable sub-array motherboard of claim 1, wherein: the low frequency part of the hybrid printed board is below and the high frequency part is above because of the height limitation and the need of signal connection.
5. The ultra-wideband highly integrated expandable sub-array motherboard of claim 1, wherein: the sub-mother board radio frequency signals are connected to the radio frequency connector through the side, the cavity is dug above the radio frequency connection position of the sub-mother board to expose the strip line, the strip line is transited into the microstrip line, the cavity is dug below the sub-mother board radio frequency signals to expose the radio frequency ground, the radio frequency connector is fixed on the metal structure shell, the structure shell is in conductive contact with the cavity dug below the sub-mother board, and the radio frequency grounding requirement is realized.
6. The ultra-wideband highly integrated expandable sub-array motherboard of claim 1, wherein: and the subarray mother board is filled with copper blocks below the TR component and the delay amplifying component, and the upper surface and the lower surface of the copper blocks are flush with the printed board.
7. The ultra-wideband highly integrated expandable sub-array motherboard of claim 1, wherein: the delay amplifying assembly is coupled with the subarray mother board, and the 8lambda and 16lambda delay windings are arranged in the subarray mother board radio frequency strip line layer.
CN202310839670.1A 2023-07-10 2023-07-10 Ultra-wideband high-integration expandable subarray mother board Pending CN116916529A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202310839670.1A CN116916529A (en) 2023-07-10 2023-07-10 Ultra-wideband high-integration expandable subarray mother board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310839670.1A CN116916529A (en) 2023-07-10 2023-07-10 Ultra-wideband high-integration expandable subarray mother board

Publications (1)

Publication Number Publication Date
CN116916529A true CN116916529A (en) 2023-10-20

Family

ID=88359540

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202310839670.1A Pending CN116916529A (en) 2023-07-10 2023-07-10 Ultra-wideband high-integration expandable subarray mother board

Country Status (1)

Country Link
CN (1) CN116916529A (en)

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