CN116903829A - Quick curing agent for epoxy resin and preparation method thereof - Google Patents
Quick curing agent for epoxy resin and preparation method thereof Download PDFInfo
- Publication number
- CN116903829A CN116903829A CN202310901519.6A CN202310901519A CN116903829A CN 116903829 A CN116903829 A CN 116903829A CN 202310901519 A CN202310901519 A CN 202310901519A CN 116903829 A CN116903829 A CN 116903829A
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- CN
- China
- Prior art keywords
- curing agent
- epoxy resin
- triethylene tetramine
- modified compound
- aminoethyl
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 74
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 44
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 44
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- PAOXFRSJRCGJLV-UHFFFAOYSA-N 2-[4-(2-aminoethyl)piperazin-1-yl]ethanamine Chemical compound NCCN1CCN(CCN)CC1 PAOXFRSJRCGJLV-UHFFFAOYSA-N 0.000 claims abstract description 33
- 150000001875 compounds Chemical class 0.000 claims abstract description 29
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229960001124 trientine Drugs 0.000 claims abstract description 25
- MBYLVOKEDDQJDY-UHFFFAOYSA-N tris(2-aminoethyl)amine Chemical compound NCCN(CCN)CCN MBYLVOKEDDQJDY-UHFFFAOYSA-N 0.000 claims abstract description 22
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims abstract description 18
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 6
- 125000004122 cyclic group Chemical group 0.000 abstract description 3
- 230000002349 favourable effect Effects 0.000 abstract description 3
- 230000001737 promoting effect Effects 0.000 abstract 1
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 239000011159 matrix material Substances 0.000 description 7
- 150000001412 amines Chemical class 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000013329 compounding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000009745 resin transfer moulding Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
- C08G59/502—Polyalkylene polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5006—Amines aliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
Abstract
The invention relates to the technical field of epoxy resin curing agents, in particular to a rapid curing agent for epoxy resin and a preparation method thereof; comprises triethylene tetramine, diethylene triamine, N-aminoethylpiperazine and a curing agent modified compound; the quick curing agent can be uniformly mixed with epoxy resin, and then can realize quick curing in a mold, the curing time can be shortened to 2 minutes or less, and the impact strength of the cured product is improved compared with the prior art. According to the invention, the 1, 4-piperazine diethylamine is added into triethylene tetramine, so that the curing speed of the triethylene tetramine can be improved, and the main chain of the molecular chain of the triethylene tetramine contains cyclic molecules, so that the structure is stable, and cracks caused by internal stress can be prevented in the rapid curing process of epoxy resin. And the 1, 4-piperazine diethylamine is completely compatible with the N, N-di (2-aminoethyl) -1, 2-ethylenediamine, is favorable for uniformly dispersing and mixing the 1, 4-piperazine diethylamine in triethylene tetramine, and can further fully play a promoting role.
Description
Technical Field
The invention relates to the technical field of epoxy resin curing agents, in particular to a rapid curing agent for epoxy resin and a preparation method thereof.
Background
The rapid development of epoxy resins benefits on the one hand from its own excellent properties and on the other hand from its characteristic process diversity (coating, dipping, pouring, spraying, injection, moulding, etc.) and product diversity (versatility). The epoxy resin is applied by a compounding technology, except equipment and technology, the most important is the formula design, and the realization of perfect formula design requires the selection and combination of the epoxy resin, the curing agent and the related additives; in particular, the curing agent, once the epoxy resin is determined, plays a decisive role in the manufacturability of the epoxy resin composition and in the final properties of the cured product (product).
In recent years, in some application fields with a relatively high front, higher requirements are put on curing agents, such as HP-RTM process (High Pressure Resin Transfer Molding, high-pressure resin transfer molding process), and short-cycle (mass) and high-quality production is required. Although epoxy cure systems have been reduced from the initial cure time of 8 minutes to 5 minutes to the current 3 minute cure, it is desirable to have faster processing without affecting other properties of the cured product, particularly toughness. Because faster curing speeds tend to bring about faster curing shrinkage, faster physical changes in cooling shrinkage produce more internal stress, and when the internal stress exceeds the strength of the cured product, cracks are generated inside the cured product, resulting in a significant decrease in the mechanical strength, particularly toughness, of the product.
Therefore, a compounding technology of a curing system needs to be developed, so that the production process can be fast, and the service performance of the product can be not influenced or even improved.
Disclosure of Invention
The purpose of the invention is that: a fast curing agent for epoxy resins is provided for solving at least one of the above-mentioned technical problems.
In order to solve the technical problems, the invention adopts the following technical scheme:
the quick curing agent for the epoxy resin comprises the following components in parts by mass:
100 parts of triethylene tetramine, 30-50 parts of diethylenetriamine, 0.5-1 part of N-aminoethylpiperazine and 5-10 parts of curing agent modified compound, wherein the curing agent modified compound comprises N, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine.
Further, the mass ratio of the N, N-di (2-aminoethyl) -1, 2-ethylenediamine to the 1, 4-piperazine diethylamine in the curing agent modified compound is 1:1-2.
Another object of the invention is: a method for preparing a fast curing agent for epoxy resin is provided for solving at least one of the above technical problems.
In order to solve the technical problems, the invention adopts the following technical scheme:
a method of preparing a rapid curing agent for an epoxy resin, the method comprising the steps of:
s1, preparation of a curing agent modified compound: uniformly mixing N, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine to form a curing agent modified compound;
s2, preparation of an epoxy resin curing agent: uniformly mixing triethylene tetramine, diethylene triamine, N-aminoethylpiperazine and the curing agent modified compound prepared in the step S1 to prepare an epoxy resin rapid curing agent;
wherein the weight portions of the components are as follows: 100 parts of triethylene tetramine, 30-50 parts of diethylene triamine, 0.5-1 part of N-aminoethylpiperazine and 5-10 parts of curing agent modified compound.
Further, the stirring temperature in the step S2 is 10-40 ℃, and the stirring speed is 50-120 r/min.
Further, in the step S1, the mass ratio of the N, N-di (2-aminoethyl) -1, 2-ethylenediamine to the 1, 4-piperazine diethylamine is 1:1-2.
Further, the preparation of the curing agent modified compound in the step S1 comprises the following steps: n, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine are put into a stirring device and stirred uniformly at the speed of 50r/min-120r/min at 50 ℃ to prepare the curing agent modified compound.
The technical scheme of the invention has the beneficial effects that:
the quick curing agent can be uniformly mixed with epoxy resin, and then can realize quick curing in a mold, the curing time can be shortened to within 2 minutes, and the impact strength of the cured product is improved compared with the prior product.
The invention adopts the mixture of N, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine as the curing agent modification compound, wherein the 1, 4-piperazine diethylamine is not only an amine curing agent, but also an amine curing agent accelerator, and the curing speed of triethylene tetramine can be improved by adding the 1, 4-piperazine diethylamine into the triethylene tetramine. In addition, the molecular chain main chain of the 1, 4-piperazine diethylamine contains cyclic molecules, has stable structure and can prevent internal stress from generating cracks in the process of rapidly curing the epoxy resin. And the 1, 4-piperazine diethylamine is completely compatible with the N, N-di (2-aminoethyl) -1, 2-ethylenediamine, which is favorable for uniformly dispersing and mixing the 1, 4-piperazine diethylamine in triethylene tetramine, and the compatibility problem among all components is not worried, so that the promotion effect of the 1, 4-piperazine diethylamine can be further fully exerted. N, N-bis (2-aminoethyl) -1, 2-ethylenediamine is also an amine curing agent, and its molecular structure contains long flexible branched molecules, which can improve the toughness of the cured product. Therefore, the N, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine are used together, so that the curing speed can be improved in terms of technology, and the impact strength can be improved in terms of performance.
Detailed Description
The present invention is not limited to the following embodiments, and those skilled in the art can implement the present invention in various other embodiments according to the present invention, or simply change or modify the design structure and thought of the present invention, which fall within the protection scope of the present invention. It should be noted that, without conflict, the embodiments of the present invention and features of the embodiments may be combined with each other.
The sources of the raw materials in the invention are as follows:
triethylene tetramine, D100059, shanghai aladine Biochemical technologies Co., ltd;
diethylenetriamine, D301794, shanghai aladine Biochemical technologies Co., ltd;
n-aminoethylpiperazine, A101279, shanghai Ala Biochemical technologies Co., ltd;
n, N-bis (2-aminoethyl) -1, 2-ethylenediamine, T106669, shanghai Ala Di Biochemical technologies Co., ltd;
1, 4-piperazine diethylamine, D589798, shanghai aladine Biochemical technologies Co., ltd;
epoxy resin, E-51, from the chemical Co., ltd.
The structural formula of the 1, 4-piperazine diethylamine is
The structural formula of the N, N-di (2-aminoethyl) -1, 2-ethylenediamine is
The quick curing agent for the epoxy resin comprises the following components in parts by mass:
100 parts of triethylene tetramine, 30-50 parts of diethylenetriamine, 0.5-1 part of N-aminoethylpiperazine and 5-10 parts of curing agent modified compound, wherein the curing agent modified compound comprises N, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine.
The principle of the compound modification of the curing agent in the invention is as follows: the 1, 4-piperazine diethylamine is not only an amine curing agent, but also can be used as an amine curing agent accelerator, and after being added into triethylene tetramine, the curing speed of the triethylene tetramine can be improved. In addition, the main chain of the molecular chain contains cyclic molecules, so that the structure is stable, and the internal stress can be prevented from generating cracks in the rapid curing process of the epoxy resin. And the 1, 4-piperazine diethylamine is completely compatible with the N, N-di (2-aminoethyl) -1, 2-ethylenediamine, which is favorable for uniformly dispersing and mixing the 1, 4-piperazine diethylamine in triethylene tetramine, and can further fully play the promotion effect of the 1, 4-piperazine diethylamine. N, N-bis (2-aminoethyl) -1, 2-ethylenediamine is also an amine curing agent, and its molecular structure contains long flexible branched molecules, which can improve the toughness of the cured product. Therefore, the N, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine are used together, so that the curing speed can be improved in terms of technology, and the impact strength can be improved in terms of performance.
Example 1:
preparing a curing agent modified compound: 3 g of N, N-bis (2-aminoethyl) -1, 2-ethylenediamine and 3 g of 1, 4-piperazine diethylamine were mixed and stirred at 120r/min at 50℃for 0.5 hour.
Preparing a rapid curing agent: 100 g of triethylene tetramine, 30 g of diethylenetriamine, 0.5 g of N-aminoethylpiperazine and 6 g of curing agent modification compound are mixed and stirred at room temperature (25 ℃) for 0.5 hours at 120r/min.
Preparing epoxy resin cured sample bars: 100 g of epoxy resin and 20 g of quick curing agent are uniformly mixed, injected into a mold and cured at 80 ℃ to prepare a resin matrix sample, and the relevant performance is tested, and the results are shown in table 1.
Example 2:
preparing a curing agent modified compound: 3 g of N, N-bis (2-aminoethyl) -1, 2-ethylenediamine and 6 g of 1, 4-piperazine diethylamine were mixed and stirred at 120r/min at 50℃for 0.5 hour.
Preparing a rapid curing agent: 100 g of triethylene tetramine, 30 g of diethylenetriamine, 1 g of N-aminoethylpiperazine and 9 g of curing agent modification compound are mixed and stirred at room temperature (25 ℃) for 0.5 hour at 120r/min.
Preparing epoxy resin cured sample bars: 100 g of epoxy resin and 20 g of quick curing agent are uniformly mixed, injected into a mold and cured at 80 ℃ to prepare a resin matrix sample, and the relevant performance is tested, and the results are shown in table 1.
Example 3:
preparing a curing agent modified compound: 5 g of N, N-bis (2-aminoethyl) -1, 2-ethylenediamine and 5 g of 1, 4-piperazine diethylamine were mixed and stirred at 120r/min at 50℃for 0.5 hours.
Preparing a rapid curing agent: 100 g of triethylene tetramine, 50 g of diethylenetriamine, 1 g of N-aminoethylpiperazine and 10 g of curing agent modified compound are mixed and stirred at room temperature and 120r/min for 0.5 hour.
Preparing epoxy resin cured sample bars: 100 g of epoxy resin and 20 g of quick curing agent are uniformly mixed, injected into a mold and cured at 80 ℃ to prepare a resin matrix sample, and the relevant performance is tested, and the results are shown in table 1.
Comparative example 1:
preparing a curing agent: 100 g of triethylene tetramine, 30 g of diethylenetriamine and 1 g of N-aminoethylpiperazine are mixed and stirred at room temperature and 120r/min for 0.5 hour.
Preparing epoxy resin cured sample bars: 100 g of epoxy resin and 20 g of quick curing agent are uniformly mixed, injected into a mold and cured at 80 ℃ to prepare a resin matrix sample, and the relevant performance is tested, and the results are shown in table 1.
Comparative example 2:
preparing a curing agent: 100 g of triethylene tetramine, 30 g of diethylenetriamine, 1 g of N-aminoethylpiperazine and 3 g of N, N-di (2-aminoethyl) -1, 2-ethylenediamine are mixed and stirred at room temperature for 0.5 hour at 120r/min.
Preparing epoxy resin cured sample bars: 100 g of epoxy resin and 20 g of quick curing agent are uniformly mixed, injected into a mold and cured at 80 ℃ to prepare a resin matrix sample, and the relevant performance is tested, and the results are shown in table 1.
Comparative example 3:
preparing a curing agent: 100 g of triethylene tetramine, 30 g of diethylenetriamine, 1 g of N-aminoethylpiperazine and 3 g of 1, 4-piperazine diethylamine were mixed and stirred at room temperature for 0.5 hour at 120r/min.
Preparing epoxy resin cured sample bars: 100 g of epoxy resin and 20 g of quick curing agent are uniformly mixed, injected into a mold and cured at 80 ℃ to prepare a resin matrix sample, the resin matrix sample is subjected to test related performance, the curing time is in accordance with standard GB/T22314, the unnotched impact strength is in accordance with standard GB/T1043, and the results are shown in Table 1.
Table 1 test items and test results
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (6)
1. A rapid curing agent for epoxy resins, characterized by: the rapid curing agent comprises the following components in parts by mass:
100 parts of triethylene tetramine, 30-50 parts of diethylenetriamine, 0.5-1 part of N-aminoethylpiperazine and 5-10 parts of curing agent modified compound, wherein the curing agent modified compound comprises N, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine.
2. A rapid curing agent for epoxy resins according to claim 1, characterized in that: the mass ratio of the N, N-di (2-aminoethyl) -1, 2-ethylenediamine to the 1, 4-piperazine diethylamine in the curing agent modified compound is 1:1-2.
3. A preparation method of a rapid curing agent for epoxy resin is characterized by comprising the following steps: the preparation method comprises the following steps:
s1, preparation of a curing agent modified compound: uniformly mixing N, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine to form a curing agent modified compound;
s2, preparation of an epoxy resin curing agent: uniformly mixing triethylene tetramine, diethylene triamine, N-aminoethylpiperazine and the curing agent modified compound prepared in the step S1 to prepare an epoxy resin rapid curing agent;
wherein the weight portions of the components are as follows: 100 parts of triethylene tetramine, 30-50 parts of diethylene triamine, 0.5-1 part of N-aminoethylpiperazine and 5-10 parts of curing agent modified compound.
4. A method for preparing a rapid curing agent for epoxy resins according to claim 3, characterized in that: the stirring temperature in the step S2 is 10-40 ℃, and the stirring speed is 50-120 r/min.
5. A method for preparing a rapid curing agent for epoxy resins according to claim 3, characterized in that: in the step S1, the mass ratio of the N, N-di (2-aminoethyl) -1, 2-ethylenediamine to the 1, 4-piperazine diethylamine is 1:1-2.
6. A method for preparing a rapid curing agent for epoxy resins according to claim 3, characterized in that: the preparation of the curing agent modified compound in the step S1 comprises the following steps: n, N-di (2-aminoethyl) -1, 2-ethylenediamine and 1, 4-piperazine diethylamine are put into a stirring device and stirred uniformly at the speed of 50r/min-120r/min at 50 ℃ to prepare the curing agent modified compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310901519.6A CN116903829A (en) | 2023-07-21 | 2023-07-21 | Quick curing agent for epoxy resin and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310901519.6A CN116903829A (en) | 2023-07-21 | 2023-07-21 | Quick curing agent for epoxy resin and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116903829A true CN116903829A (en) | 2023-10-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310901519.6A Pending CN116903829A (en) | 2023-07-21 | 2023-07-21 | Quick curing agent for epoxy resin and preparation method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN116903829A (en) |
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2023
- 2023-07-21 CN CN202310901519.6A patent/CN116903829A/en active Pending
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