CN116891679B - UV and moisture dual-curing compress type coating and preparation method and application thereof - Google Patents
UV and moisture dual-curing compress type coating and preparation method and application thereof Download PDFInfo
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- CN116891679B CN116891679B CN202310704755.9A CN202310704755A CN116891679B CN 116891679 B CN116891679 B CN 116891679B CN 202310704755 A CN202310704755 A CN 202310704755A CN 116891679 B CN116891679 B CN 116891679B
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- 238000000576 coating method Methods 0.000 title claims abstract description 60
- 239000011248 coating agent Substances 0.000 title claims abstract description 59
- 238000002360 preparation method Methods 0.000 title claims abstract description 27
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 46
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 33
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 33
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 26
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 26
- -1 modified acrylic ester Chemical class 0.000 claims abstract description 17
- 239000003085 diluting agent Substances 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 5
- 239000000178 monomer Substances 0.000 claims description 28
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 24
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 22
- 239000012948 isocyanate Substances 0.000 claims description 22
- 150000002513 isocyanates Chemical class 0.000 claims description 21
- 230000009977 dual effect Effects 0.000 claims description 20
- 238000001723 curing Methods 0.000 claims description 19
- 229920002818 (Hydroxyethyl)methacrylate Polymers 0.000 claims description 16
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 claims description 16
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 14
- 238000006243 chemical reaction Methods 0.000 claims description 14
- 229920001577 copolymer Polymers 0.000 claims description 13
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 11
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 11
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical group [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052731 fluorine Inorganic materials 0.000 claims description 10
- 239000011737 fluorine Substances 0.000 claims description 10
- 239000003973 paint Substances 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 8
- 238000005886 esterification reaction Methods 0.000 claims description 8
- 239000003381 stabilizer Substances 0.000 claims description 8
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N 1,4-Benzenediol Natural products OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 7
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 claims description 7
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 claims description 7
- 239000003054 catalyst Substances 0.000 claims description 7
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- JJSYPAGPNHFLML-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;3-sulfanylpropanoic acid Chemical compound OC(=O)CCS.OC(=O)CCS.OC(=O)CCS.CCC(CO)(CO)CO JJSYPAGPNHFLML-UHFFFAOYSA-N 0.000 claims description 6
- GNSFRPWPOGYVLO-UHFFFAOYSA-N 3-hydroxypropyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCO GNSFRPWPOGYVLO-UHFFFAOYSA-N 0.000 claims description 6
- 239000005058 Isophorone diisocyanate Substances 0.000 claims description 6
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 239000011787 zinc oxide Substances 0.000 claims description 5
- RSWGJHLUYNHPMX-ONCXSQPRSA-N abietic acid Chemical compound C([C@@H]12)CC(C(C)C)=CC1=CC[C@@H]1[C@]2(C)CCC[C@@]1(C)C(O)=O RSWGJHLUYNHPMX-ONCXSQPRSA-N 0.000 claims description 4
- 238000001914 filtration Methods 0.000 claims description 4
- 230000032050 esterification Effects 0.000 claims description 3
- 125000000687 hydroquinonyl group Chemical group C1(O)=C(C=C(O)C=C1)* 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 239000000376 reactant Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000012360 testing method Methods 0.000 abstract description 21
- 239000000853 adhesive Substances 0.000 abstract description 15
- 230000001070 adhesive effect Effects 0.000 abstract description 15
- 150000003839 salts Chemical class 0.000 abstract description 8
- 230000007797 corrosion Effects 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 6
- 239000007921 spray Substances 0.000 abstract description 5
- 238000009863 impact test Methods 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 8
- 230000006872 improvement Effects 0.000 description 7
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- FEUIEHHLVZUGPB-UHFFFAOYSA-N oxolan-2-yl prop-2-enoate Chemical class C=CC(=O)OC1CCCO1 FEUIEHHLVZUGPB-UHFFFAOYSA-N 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000003556 assay Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- IMQFZQVZKBIPCQ-UHFFFAOYSA-N 2,2-bis(3-sulfanylpropanoyloxymethyl)butyl 3-sulfanylpropanoate Chemical compound SCCC(=O)OCC(CC)(COC(=O)CCS)COC(=O)CCS IMQFZQVZKBIPCQ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- CSTCGHZCMTZWEB-UHFFFAOYSA-N fluoroimino(oxo)methane Chemical compound FN=C=O CSTCGHZCMTZWEB-UHFFFAOYSA-N 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- JRWNODXPDGNUPO-UHFFFAOYSA-N oxolane;prop-2-enoic acid Chemical compound C1CCOC1.OC(=O)C=C JRWNODXPDGNUPO-UHFFFAOYSA-N 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- LWRBVKNFOYUCNP-UHFFFAOYSA-N 2-methyl-1-(4-methylsulfanylphenyl)-2-morpholin-4-ylpropan-1-one Chemical compound C1=CC(SC)=CC=C1C(=O)C(C)(C)N1CCOCC1 LWRBVKNFOYUCNP-UHFFFAOYSA-N 0.000 description 1
- ZYMCJDAUBJFVSM-UHFFFAOYSA-N 6-methylheptyl 4-(dimethylamino)benzoate Chemical compound CC(C)CCCCCOC(=O)C1=CC=C(N(C)C)C=C1 ZYMCJDAUBJFVSM-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- IAXXETNIOYFMLW-COPLHBTASA-N [(1s,3s,4s)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@]2(C)[C@@H](OC(=O)C(=C)C)C[C@H]1C2(C)C IAXXETNIOYFMLW-COPLHBTASA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- GCTPMLUUWLLESL-UHFFFAOYSA-N benzyl prop-2-enoate Chemical compound C=CC(=O)OCC1=CC=CC=C1 GCTPMLUUWLLESL-UHFFFAOYSA-N 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 229940119545 isobornyl methacrylate Drugs 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
- C09D175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Paints Or Removers (AREA)
Abstract
The invention discloses a UV moisture dual-curing compress type coating, and a preparation method and application thereof, wherein the preparation raw materials comprise: 10 to 30 parts of acrylic resin, 2 to 12 parts of rosin modified acrylic ester, 10 to 30 parts of toughened acrylic resin, 1 to 15 parts of moisture-curable prepolymer, 10 to 30 parts of diluent, 10 to 30 parts of tackifier and 1 to 10 parts of photoinitiator. The UV and moisture dual-curing coating disclosed by the invention has the advantages that the adhesive force is greatly improved on the surface of a polluted circuit board and the surface of a circuit board with a complex structure and in a cold-hot alternating environment, and the corrosion resistance and the protection performance are excellent under test conditions such as a salt spray resistance test, a cold-hot impact test and a high-temperature and high-humidity test.
Description
Technical Field
The invention belongs to the field of coating materials, and particularly relates to a UV (ultraviolet) moisture dual-curing compress coating, and a preparation method and application thereof.
Background
The coating is a protective coating applied to a printed circuit board or other electronic substrate and conforming to the contours of the object being coated. The environment and mechanical protection effect can be provided, and electronic circuits and components are prevented from being influenced by the environments such as moisture, salt fog, mould and the like, so that the reliability and the safety of the printed circuit board are improved, and the purpose of prolonging the service life of electronic products is achieved.
With the increasing awareness of environmental protection, solvent-based coating applications have been replaced in the past by more environmentally friendly, energy-efficient solventless UV systems. Pure UV system coating type paint is developed successively by a plurality of manufacturers in China, and the coating type paint of an upgrade type UV/moisture composite system is developed in recent years along with the technical progress, so that the problem of local shadow area solidification is solved. However, when the surface of the circuit board is polluted by residual soldering flux and has a complex structure, the adhesion force of the system is reduced to different degrees; the problems of uneven complex surface and uneven coating thickness of the surface-degree circuit board, shrinkage caused by inconsistent curing speed, delamination problem (greatly reduced adhesive force) under the alternating condition of high and low temperature environments are not solved well. To compensate for these performance deficiencies and the lack of such products, it has become necessary to develop a UV moisture dual cure coating that has excellent barrier properties.
Disclosure of Invention
The invention aims to solve the technical problems of poor adhesion of a coating on the surface of a polluted circuit board and the surface of a circuit board with a complex structure and the problem of reduced adhesion in a cold-hot alternating environment, and provides a UV moisture dual-curing coating with excellent protective performance, a preparation method and application thereof.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
the UV and moisture dual-curing compress type coating comprises the following preparation raw materials in parts by weight:
10 to 30 parts of acrylic resin, 2 to 12 parts of rosin modified acrylic ester, 10 to 30 parts of toughened acrylic resin, 1 to 15 parts of moisture-curable prepolymer, 10 to 30 parts of diluent, 10 to 30 parts of tackifier and 1 to 10 parts of photoinitiator;
The rosin modified acrylic ester is an esterification reactant of rosin acid and hydroxyethyl methacrylate;
The toughening acrylic resin is a copolymer formed by isobornyl acrylate, trimethylolpropane tri (3-mercaptopropionate) and octavinyl silsesquioxane according to a mercapto-olefin click chemical reaction;
The moisture-curable prepolymer is a copolymer of isocyanate and hydroxyl-containing acrylate monomers;
The tackifier is a copolymer of fluorine-containing isocyanate and hydroxyl-containing acrylic monomer.
As a further improvement, the preparation method of the rosin modified acrylic ester comprises the following steps: in the presence of a stabilizer and a catalyst, adding the hydroxyethyl methacrylate monomer into abietic acid for esterification reaction.
As a further improvement, the stabilizer is hydroquinone and the catalyst is zinc oxide.
As a further improvement, the preparation method of the toughened acrylate resin comprises the following steps: isobornyl acrylate and trimethylolpropane tri (3-mercaptopropionate) are subjected to pre-reaction, and octavinyl silsesquioxane is added for reaction.
As a further improvement, the moisture-curable prepolymer is prepared by the following steps: isocyanate and hydroxyl-containing acrylate monomer react to NCO percent of less than or equal to 0.05 percent.
As a further improvement, the isocyanate is selected from one or any combination of hexamethylene diisocyanate HDI, 4' -dicyclohexylmethane diisocyanate HMDI or isophorone diisocyanate IPDI; and/or the hydroxyl-containing acrylate monomer is selected from one or any combination of hydroxyethyl methacrylate or hydroxypropyl methacrylate.
As a further improvement, the tackifier is prepared by reacting fluorine-containing isocyanate with hydroxyl-containing acrylic monomer to NCO% of less than or equal to 0.05%.
As a further improvement, the fluorine-containing isocyanate is selected from one or any combination of ortho-fluoro isocyanate, meta-fluoro isocyanate or para-fluoro isocyanate; and/or the hydroxyl-containing acrylic monomer is selected from one or any combination of hydroxyethyl methacrylate or hydroxypropyl methacrylate.
The invention also provides a preparation method of the UV moisture dual-curing compress paint, which comprises the following steps:
(1) Adding acrylate resin, rosin modified acrylate, toughened acrylic resin, a diluent, a tackifier and a photoinitiator into a reaction kettle, and removing water to ensure that the water content is below 100 ppm;
(2) And under the protection of inert gas, adding the moisture-curable prepolymer into the kettle, uniformly stirring, and filtering to obtain the UV moisture dual-curing compress paint.
The invention also provides application of the UV moisture dual-curing compress type coating in an electronic substrate.
Compared with the prior art, the invention has the beneficial effects that:
(1) According to the invention, rosin modified acrylic ester is added to esterify rosin and introduce the rosin into the coating, so that the compatibility and wettability of the coating and a polluted surface are improved, the adhesive force of the polluted circuit board surface is improved, and the application type coating has wider adaptability;
(2) The toughened acrylic resin disclosed by the invention is flexible, and can be added into a coating to play roles in toughening, reducing shrinkage stress and environmental alternating cold and hot shrinkage stress, so that the adhesive force of the coating is kept unchanged;
(3) The tackifier adopts the acrylic acid monomer copolymer containing fluorine isocyanate and hydroxyl, has low surface tension, has the function of increasing the wetting of a base material, improves the adhesive force of the surface of a polluted circuit board, can participate in polymerization, improves the moisture and heat resistance of a coating, and ensures wider adaptability of the application type coating;
(4) The moisture-curable prepolymer ensures that the shadow area is effectively cured, so that the coating has better protective performance.
The UV and moisture dual-curing compress type coating provided by the invention has the advantages that the components act together, so that the adhesive force is greatly improved on the surface of a polluted circuit board and the surface of a circuit board with a complex structure and in a cold-hot alternating environment; the corrosion resistance and the protection performance are excellent under the test conditions of salt spray resistance test, cold and hot impact test, high temperature and high humidity test and the like. Can be used as coating material for electronic base material such as printed circuit board to protect electronic circuit and components from humidity, salt fog, mold, etc.
Detailed Description
The present invention will be described more fully hereinafter with reference to the preferred embodiments for the purpose of facilitating understanding of the present invention, but the scope of the present invention is not limited to the following specific embodiments.
Unless defined otherwise, all technical and scientific terms used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the scope of the present invention.
Unless otherwise specifically indicated, the various raw materials, reagents, instruments, equipment and the like used in the present invention are commercially available or may be prepared by existing methods.
In some embodiments, the UV moisture dual curing dressing type coating comprises the following preparation raw materials in parts by weight: 10 to 30 parts of acrylic resin (preferably 18 to 25 parts), 2 to 12 parts of rosin modified acrylic acid ester (preferably 5 to 10 parts), 10 to 30 parts of toughened acrylic resin (preferably 18 to 25 parts), 1 to 15 parts of moisture curable prepolymer (preferably 8 to 12 parts), 10 to 30 parts of acrylic diluent (preferably 15 to 25 parts), 10 to 30 parts of tackifier (preferably 10 to 15 parts) and 1 to 10 parts of photoinitiator (preferably 2 to 6 parts).
In some embodiments, the acrylate resin is a polyurethane modified acrylate resin and/or an epoxy modified acrylate resin. The polyurethane modified acrylic resin can be one or more of CN996, CN9888, CN9001 and CN9006, and the epoxy modified acrylic resin can be one or more of CNUVE151, CN159, CN104 and CN 120.
In some embodiments, the rosin modified acrylate is an esterification reactant of rosin acid and hydroxyethyl methacrylate. The rosin modified acrylic ester can improve the compatibility and wettability of the coating and the circuit board, especially the polluted surface, and improve the adhesive force.
In some embodiments, the rosin modified acrylate is prepared by adding hydroxyethyl methacrylate monomer to rosin acid in the presence of a stabilizer and a catalyst to perform an esterification reaction. The stabilizer prevents oxidative discoloration of rosin unsaturated bonds. Preferably, the mass ratio of the abietic acid to the hydroxyethyl methacrylate is 10 (20-25). Preferably, the stabilizer is hydroquinone, and the mass ratio of the hydroquinone to the abietic acid is 0.05 (8-12). Preferably, the catalyst is zinc oxide, and the mass ratio of the zinc oxide to the abietic acid is 0.1 (8-12). Preferably, the reaction temperature of the esterification reaction is 150-250 ℃ and the reaction time is 3-5 h.
In some embodiments, the toughened acrylate resin is a copolymer of isobornyl acrylate, trimethylolpropane tris (3-mercaptopropionate), and octavinylsilsesquioxane according to a mercapto-olefin click chemistry. The adhesive force of the coating is kept unchanged by adding the adhesive into the coating to toughen and reduce shrinkage stress and environmental alternating cold and heat shrinkage stress.
In some specific embodiments, the toughened acrylate resin is prepared by pre-reacting isobornyl acrylate and trimethylolpropane tris (3-mercaptopropionate), and then adding octavinyl silsesquioxane for reaction. Preferably, the molar ratio of isobornyl acrylate, trimethylolpropane tri (3-mercaptopropionate) and octavinylsilsesquioxane is (1.5-2.5): 0.8-1.2): 1. Preferably, the reaction is performed for 1.5 to 2.5 hours and then 3 to 5 hours.
In some embodiments, the moisture curable prepolymer is a copolymer of isocyanate and hydroxyl-containing acrylate monomers. The unsaturated double bond participates in the coating curing, and isocyanate at the other end absorbs moisture to further react, so that the problem of photo-blind area curing is solved, and the protective performance is improved.
In some embodiments, the moisture curable prepolymer is prepared by reacting an isocyanate and a hydroxyl-containing acrylate monomer to an NCO% of 0.05%. In some embodiments, the isocyanate is selected from one or more of hexamethylene diisocyanate HDI, 4' -dicyclohexylmethane diisocyanate HMDI, isophorone diisocyanate IPDI. The hydroxyl-containing acrylate monomer is selected from one or more of hydroxyethyl methacrylate or hydroxypropyl methacrylate. Preferably, the molar ratio of isocyanate to hydroxyl-containing acrylate monomer is (0.95-1.05): 1.
In some specific embodiments, the acrylic ester diluent is selected from one or more of tetrahydrofuran acrylate, ethoxylated tetrahydrofuran acrylate, 1, 6-hexanediol diacrylate, isobornyl acrylate, isobornyl methacrylate and benzyl acrylate.
In some embodiments, the tackifier is a copolymer of a fluoroisocyanate and a hydroxyl-containing acrylic monomer. The tackifier can participate in UV light curing reaction, can increase the wettability of a base material, improves the adhesive force of the surface of a polluted circuit board, and improves the moisture and heat resistance.
In some embodiments, the preparation method of the copolymer of the fluorine-containing isocyanate and the hydroxyl-containing acrylic monomer comprises the step of reacting the fluorine-containing isocyanate and the hydroxyl-containing acrylic monomer to NCO% of less than or equal to 0.05%. In some embodiments, the fluorine-containing isocyanate is selected from one or more of ortho-fluoro isocyanate, meta-fluoro isocyanate and para-fluoro isocyanate. The acrylic monomer containing hydroxyl is selected from one or more of hydroxyethyl methacrylate or hydroxypropyl methacrylate. Preferably, the molar ratio of the fluorine-containing isocyanate to the hydroxyl-containing acrylic monomer is (0.95 to 1.05): 1. Preferably, the reaction time is from 5 to 7 hours.
In some embodiments, the photoinitiator is selected from one or more of 2-hydroxy-methylphenyl propane-1-one, 1-hydroxycyclohexyl phenyl ketone, 2-methyl-1- (4-methylthiophenyl) -2-morpholino-1-propanone, benzoin dimethyl ether, benzophenone, isooctyl p-N, N-dimethylaminobenzoate, 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide, and ethyl 2,4, 6-trimethylbenzoyl phenyl phosphonate.
In some embodiments, the method of preparing a UV moisture dual cure application coating of the present invention comprises the steps of:
(1) Adding acrylate resin, rosin modified acrylate, toughened acrylic resin, an acrylate diluent, a tackifier and a photoinitiator into a reaction kettle; to enhance the protective properties of the coating in a wet environment, it is desirable to remove the moisture therefrom, and in a preferred embodiment, the temperature is raised above 70 ℃ and a vacuum is applied to remove the moisture so that the moisture is below 100 ppm.
(2) Under the protection of inert gas, adding the moisture-curable prepolymer into the kettle, uniformly stirring, and filtering to obtain the UV moisture dual-curing compress paint.
Example 1
The parts by weight of the components of the UV moisture dual cure application coating of this example are shown in table 1.
TABLE 1
Component (A) | Proportion by weight |
Polyurethane modified acrylic resin CN966 | 13.3 |
Epoxy-modified acrylic resin CNUVE151,151 | 8.3 |
Self-synthesized rosin modified acrylic ester | 7.4 |
Self-synthesized toughened acrylic resin | 22.8 |
Self-synthesizing moisture curable prepolymers | 11.2 |
Ethoxylated tetrahydrofuranyl acrylate | 10 |
Isobornyl acrylate | 10 |
Tackifier(s) | 12 |
2,4, 6-Trimethylbenzoyl-diphenylphosphine oxide | 2.8 |
2-Hydroxy-methyl-phenyl-propan-1-one | 2.0 |
The preparation method of the self-synthesized rosin modified acrylic ester comprises the following steps: adding 10 parts of abietic acid into a stirring kettle, heating to 150 ℃, adding 0.05 part of hydroquinone serving as a stabilizer and 0.1 part of zinc oxide serving as a catalyst after the abietic acid is dissolved, heating to 200 ℃, slowly dropwise adding 23.3 parts of hydroxyethyl methacrylate monomer, and carrying out esterification reaction for 4 hours after the dropwise adding is finished, thus obtaining the product for standby.
The preparation method of the self-synthesis toughened acrylate resin comprises the following steps: 2mol of isobornyl acrylate and 1mol of trimethylolpropane tri (3-mercaptopropionate) are reacted for 2 hours preferentially, and then 1mol of octavinyl silsesquioxane is added for reaction for 4 hours, so that the product is obtained for standby.
The preparation method of the self-synthesized moisture-curable prepolymer comprises the following steps: adding 1mol of hexamethylene diisocyanate HDI and 1mol of hydroxyethyl methacrylate monomer into a stirring kettle, and stopping stirring when NCO% is less than or equal to 0.05% at room temperature, thus obtaining the copolymer.
The preparation method of the tackifier comprises the following steps: adding 0.2mol of m-fluoroisocyanate and 0.2mol of hydroxyethyl methacrylate monomer into a reaction kettle, stirring for 6 hours, testing NCO% to be less than or equal to 0.05%, and stopping stirring to obtain the copolymer.
The preparation method of the UV moisture dual-curing compress type coating comprises the following steps:
adding acrylate resin CN996, epoxy modified acrylic resin CNUVE, self-synthesized rosin modified acrylic ester, self-synthesized toughened acrylic resin, ethoxylated acrylic tetrahydrofuranyl ester, isobornyl acrylate, tackifier, 2,4, 6-trimethylbenzoyl-diphenyl phosphine oxide and 2-hydroxy-methyl phenyl propane-1-ketone into a stirring kettle, heating to 70 ℃, vacuumizing to remove water, so that the water is below 100ppm, adding self-synthesized moisture curable prepolymer into the kettle under the protection of nitrogen, stirring uniformly, and filtering with 200 meshes to obtain the product.
Example 2
The parts by weight of the components of the UV moisture dual cure application coating of this example are shown in table 2. The preparation methods of the self-synthesized rosin modified acrylate, self-synthesized toughened acrylate resin, self-synthesized moisture-curable prepolymer, tackifier and UV moisture dual-cure application coating of this example are the same as those of example 1.
TABLE 2
Component (A) | Proportion by weight |
Polyurethane modified acrylic resin CN966 | 13.3 |
Epoxy-modified acrylic resin CNUVE151,151 | 8.3 |
Self-synthesized rosin modified acrylic ester | 3 |
Self-synthesized toughened acrylic resin | 12 |
Self-synthesizing moisture curable prepolymers | 2 |
Ethoxylated tetrahydrofuranyl acrylate | 10 |
Isobornyl acrylate | 10 |
Tackifier(s) | 10 |
2,4, 6-Trimethylbenzoyl-diphenylphosphine oxide | 2.8 |
2-Hydroxy-methyl-phenyl-propan-1-one | 2.0 |
Example 3
The parts by weight of the components of the UV moisture dual cure application coating of this example are shown in table 3. The preparation methods of the self-synthesized rosin modified acrylate, self-synthesized toughened acrylate resin, self-synthesized moisture-curable prepolymer, tackifier and UV moisture dual-cure application coating of this example are the same as those of example 1.
TABLE 3 Table 3
Comparative example 1
The parts by weight of the components of the UV moisture dual cure application coating of this comparative example are shown in table 4. The preparation method of each component, the preparation method of the UV moisture dual curing compress coating is the same as that of the example 1. The difference from example 1 is that no self-synthesizing rosin-modified acrylate was added.
TABLE 4 Table 4
Component (A) | Proportion by weight |
Polyurethane modified acrylic resin CN966 | 13.3 |
Epoxy-modified acrylic resin CNUVE151,151 | 8.3 |
Self-synthesized rosin modified acrylic ester | 0 |
Self-synthesized toughened acrylic resin | 22.8 |
Self-synthesizing moisture curable prepolymers | 11.2 |
Ethoxylated tetrahydrofuranyl acrylate | 10 |
Isobornyl acrylate | 10 |
Tackifier(s) | 12 |
2,4, 6-Trimethylbenzoyl-diphenylphosphine oxide | 2.8 |
2-Hydroxy-methyl-phenyl-propan-1-one | 2.0 |
Comparative example 2
The parts by weight of the components of the UV moisture dual cure application coating of this comparative example are shown in table 5. The preparation method of each component, the preparation method of the UV moisture dual curing compress coating is the same as that of the example 1. The difference from example 1 is that no self-synthesized toughened acrylic resin was added.
TABLE 5
Component (A) | Proportion by weight |
Polyurethane modified acrylic resin CN966 | 13.3 |
Epoxy-modified acrylic resin CNUVE151,151 | 8.3 |
Self-synthesized rosin modified acrylic ester | 7.4 |
Self-synthesized toughened acrylic resin | 0 |
Self-synthesizing moisture curable prepolymers | 11.2 |
Ethoxylated tetrahydrofuranyl acrylate | 10 |
Isobornyl acrylate | 10 |
Tackifier(s) | 12 |
2,4, 6-Trimethylbenzoyl-diphenylphosphine oxide | 2.8 |
2-Hydroxy-methyl-phenyl-propan-1-one | 2.0 |
Comparative example 3
The parts by weight of the components of the UV moisture dual cure application coating of this comparative example are shown in table 6. The preparation method of each component, the preparation method of the UV moisture dual curing compress coating is the same as that of the example 1. The difference from example 1 is that no self-synthesized moisture-curable prepolymer was added.
TABLE 6
The coatings obtained in examples and comparative examples were sprayed on the surface of a circuit board with a coating film thickness of 75 μm and then cured (resulting in radical polymerization and NCO moisture curing) using a light source of 80mW@365 nm. The specific performance results of examples 1 to 3 and comparative examples are shown in Table 7.
TABLE 7
Note that: appearance was observed according to GB/T1721-2008 varnish, clear oil, diluent appearance and clarity assay;
Viscosity was tested according to GB/T1723-93 paint viscosity assay;
testing the surface drying time according to a GB1728-1979 paint film and putty film drying time measuring method;
Testing the adhesive force of the coating according to the GB/T5210-2006 colored paint and varnish pull-off method adhesive force test;
According to the measurement of the neutral salt spray resistance of GB-T1771-2007 colored paint and varnish, the corrosion damage condition of a coating film on the surface of a test plate after a salt spray resistance test is tested;
Testing the corrosion damage condition of the coating film on the surface of the test plate after the damp-heat resistance test according to a GB-T1740-2007 film damp-heat resistance assay method;
According to GB/T2423 standard test of basic environmental test procedure of electric and electronic products, the condition of corrosion and damage of a coating film on the surface of a test plate after a cold and heat shock resistance test is tested;
the complex circuit board has various surface components, high pin height distribution and high protection requirement.
From the table above, it can be seen that: the adhesive force of the embodiment of the invention is greatly improved on the surface of the polluted circuit board and the surface of the circuit board with complex structure under the cold-hot alternating environment; the corrosion resistance and the protection performance are excellent under the test conditions of salt spray resistance test, cold and hot impact test, high temperature and high humidity test and the like. All the protective properties are better than those of the commercial products. The self-synthesized toughened acrylic resin has better cold and heat shock resistance and better adhesive force; the self-synthesized moisture-curable prepolymer is adopted to improve the moisture resistance and the salt fog resistance; the self-synthesized tackifier can improve the adhesive force.
The foregoing is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Therefore, any simple modification, equivalent variation and modification of the above embodiments according to the technical substance of the present invention shall fall within the scope of the technical solution of the present invention.
Claims (9)
1. The UV and moisture dual-curing compress type coating is characterized by comprising the following preparation raw materials in parts by weight:
10 to 30 parts of acrylic resin, 2 to 12 parts of rosin modified acrylic ester, 10 to 30 parts of toughened acrylic resin, 1 to 15 parts of moisture-curable prepolymer, 10 to 30 parts of diluent, 10 to 30 parts of tackifier and 1 to 10 parts of photoinitiator;
The rosin modified acrylic ester is an esterification reactant of rosin acid and hydroxyethyl methacrylate;
The toughened acrylic resin is a copolymer formed by isobornyl acrylate, trimethylolpropane tri (3-mercaptopropionate) and octavinyl silsesquioxane according to a mercapto-olefin click chemical reaction; the preparation method of the toughened acrylic resin comprises the following steps: pre-reacting isobornyl acrylate and trimethylolpropane tri (3-mercaptopropionate), and then adding octavinyl silsesquioxane for reaction;
The moisture-curable prepolymer is a copolymer of isocyanate and hydroxyl-containing acrylate monomers;
The tackifier is a copolymer of fluorine-containing isocyanate and hydroxyl-containing acrylic monomer.
2. The UV moisture dual cure application coating according to claim 1, wherein the rosin modified acrylate is prepared by the process of: in the presence of a stabilizer and a catalyst, adding the hydroxyethyl methacrylate monomer into abietic acid for esterification reaction.
3. The UV moisture dual cure application coating according to claim 2, wherein the stabilizer is hydroquinone and the catalyst is zinc oxide.
4. The UV moisture dual cure application coating according to claim 1 or 2, wherein the moisture curable prepolymer is prepared by the process of: isocyanate and hydroxyl-containing acrylate monomer react to NCO percent of less than or equal to 0.05 percent.
5. The UV moisture dual cure application coating according to claim 4, wherein said isocyanate is selected from one or any combination of hexamethylene diisocyanate HDI, 4' -dicyclohexylmethane diisocyanate HMDI or isophorone diisocyanate IPDI; and/or the hydroxyl-containing acrylate monomer is selected from one or any combination of hydroxyethyl methacrylate or hydroxypropyl methacrylate.
6. The UV moisture dual cure application coating according to claim 1 or 2, wherein the tackifier is prepared by reacting a fluorine-containing isocyanate with a hydroxyl-containing acrylic monomer to an nco% of 0.05%.
7. The UV moisture dual cure application coating according to claim 6, wherein the fluorine-containing isocyanate is selected from one or any combination of ortho-, meta-, or para-fluoro-isocyanates; and/or the hydroxyl-containing acrylic monomer is selected from one or any combination of hydroxyethyl methacrylate or hydroxypropyl methacrylate.
8. A method of preparing a UV moisture dual cure coating according to any one of claims 1 to 7, comprising the steps of:
(1) Adding acrylate resin, rosin modified acrylate, toughened acrylic resin, a diluent, a tackifier and a photoinitiator into a reaction kettle, and removing water to ensure that the water content is below 100 ppm;
(2) And under the protection of inert gas, adding the moisture-curable prepolymer into the kettle, uniformly stirring, and filtering to obtain the UV moisture dual-curing compress paint.
9. Use of a UV moisture dual cure application coating as claimed in any one of claims 1 to 7 in an electronic substrate.
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JP2014074082A (en) * | 2012-10-02 | 2014-04-24 | Three Bond Co Ltd | Photocurable resin composition |
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JP2014074082A (en) * | 2012-10-02 | 2014-04-24 | Three Bond Co Ltd | Photocurable resin composition |
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