CN116890146A - Rapid sintering method - Google Patents
Rapid sintering method Download PDFInfo
- Publication number
- CN116890146A CN116890146A CN202310666667.4A CN202310666667A CN116890146A CN 116890146 A CN116890146 A CN 116890146A CN 202310666667 A CN202310666667 A CN 202310666667A CN 116890146 A CN116890146 A CN 116890146A
- Authority
- CN
- China
- Prior art keywords
- electrode
- substrate
- current
- heated
- sintering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005245 sintering Methods 0.000 title claims abstract description 62
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000005476 soldering Methods 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 12
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- -1 soft soldering Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/83009—Pre-treatment of the layer connector or the bonding area
- H01L2224/83048—Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Abstract
The invention discloses a rapid sintering method, which comprises the following steps: 1. placing the fixed piece at a preset position on one surface of the base material, wherein a welding material is arranged between the fixed piece and the base material; 2. an electrode disposed on the other opposing surface of the substrate, the electrode comprising a positive electrode and a negative electrode; the positive electrode and the negative electrode are arranged at intervals; the structure of the electrode is generally matched with the substrate to be heated, and the contact area between the electrode and the heated substrate is as large as possible; thereby ensuring that the current uniformly flows through the substrate and the welding material and ensuring that the temperature field is uniform; 3. energizing the electrode according to the parameters designed in advance, and sintering; the invention can rapidly realize local heating, rapidly heat the heated object by applying large current to the object to be heated to generate Joule heat, and reach the required sintering temperature in a relatively short time, thereby not needing to heat the whole product, and rapidly adjusting the sintering temperature at any time, and has high reliability.
Description
Technical Field
The invention belongs to the technical field related to the technical improvement of sintering methods, and particularly relates to a rapid sintering method which is capable of rapidly and locally heating an object to be heated to generate Joule heat by applying large current to the object to be heated, rapidly heating the object to be heated to reach the required sintering temperature in a relatively short time, thereby avoiding heating the whole product to protect the product, and enabling the sintering temperature of the heating sintering mode to be rapidly adjusted at any time and having high reliability.
Background
At present, a plurality of common methods for fixedly connecting a metal part to an electric conductor, such as welding, fastening and the like, are available, wherein the welding comprises sintering, the sintering is often used in the semiconductor manufacturing industry, the existing sintering method needs to heat the whole die to a preset sintering temperature, and then the welding materials to be sintered are heated and sintered in a heat conduction mode, so that the parts to be fixedly connected are connected; in the sintering process, the heat conduction time is relatively long, and the sintering efficiency is low; in practice, some devices and materials thereof cannot withstand high temperatures for a long time, and in general, the preset temperature of the mold is relatively lowered, and the sintering time required is relatively long.
The shortcomings of the prior art scheme are: 1. in the sintering process, since the equipment and the die are always kept at the preset sintering temperature, the preset sintering temperature is relatively low and the sintering time is relatively long in order to ensure the service lives of the equipment, the die and the materials; 2. in order to ensure that the temperature of the sintered welding material can reach the preset temperature, the whole die is heated, so that the whole sintered welding material needs to bear high temperature for a long time, and the reliability of products can be influenced for some products which cannot bear high temperature for a long time; 3. in this way, the temperature is slowly changed and is not adjustable during the sintering process.
Therefore, a rapid sintering method is developed, which can rapidly heat the object to be heated by applying a large current to the object to be heated to generate Joule heat, rapidly heat the object to be heated, and reach the required sintering temperature in a relatively short time, so that the whole product is not required to be heated to protect the product, and the sintering temperature of the heating sintering mode can be rapidly adjusted at any time, and the reliability is high.
Disclosure of Invention
The invention aims to provide a rapid sintering method which can rapidly heat an object to be heated by applying large current to the object to be heated to generate Joule heat, rapidly heat the object to be heated and reach the required sintering temperature in a relatively short time, so that the whole product is not required to be heated to protect the product, the sintering temperature of the heating sintering mode can be rapidly adjusted at any time, and the reliability is high.
In order to achieve the above purpose, the present invention provides the following technical solutions: a rapid sintering method comprising the steps of:
1. placing the fixed piece at a preset position on one surface of the base material, wherein a welding material is arranged between the fixed piece and the base material;
2. an electrode disposed on the other opposing surface of the substrate, the electrode comprising a positive electrode and a negative electrode; the positive electrode and the negative electrode are arranged at intervals, and the sizes of the positive electrode and the negative electrode are consistent; the structure of the electrode is generally matched with the substrate to be heated, and the contact area between the electrode and the heated substrate is as large as possible; thereby ensuring that the current uniformly flows through the substrate and the welding material and ensuring that the temperature field is uniform;
3. energizing the electrode according to the parameters designed in advance, and sintering.
Preferably, the positive electrode and the negative electrode are of the same size.
Preferably, the projection of the welding material on the substrate coincides with the projection of the electrode on the substrate as much as possible, thereby ensuring that the current flows uniformly through the substrate, the welding material, and the temperature field is uniform.
Preferably, pressure is applied to the upper portion of the fixed member during sintering, which is advantageous in improving the quality of the sintered welding.
Preferably, the soldering material is a sintered soldering material, such as soldering or sintered silver or sintered copper.
Preferably; when the electric heater works, the current provided for the electrode is direct current or alternating current or pulse current, the conducted current can reach thousands of amperes at maximum, and the temperature of an object to be heated can be raised to 200-600 ℃ in a short time; and the temperature can be regulated by regulating the current in real time.
Compared with the prior art, the invention provides a rapid sintering method, which has the following beneficial effects:
the rapid sintering method can rapidly realize local heating, generate Joule heat by passing large current to the object to be heated, rapidly heat the object to be heated, and reach the required sintering temperature in a relatively short time, thereby not needing to heat the whole product to protect the product, and the sintering temperature of the heating sintering mode can be rapidly adjusted at any time, and the reliability is high.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate and together with the embodiments of the invention and do not constitute a limitation to the invention, and in which:
FIG. 1 is a schematic diagram of the working principle of the rapid sintering method according to the present invention;
in the figure: 1. a substrate; 2. a power module; 3. welding materials; 4. a positive electrode; 5. and a negative electrode.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention; all other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the present invention provides a technical solution: a rapid sintering method for fixedly connecting a power module to a substrate, comprising the steps of:
1. placing the power module 2 at a preset position on one surface of the substrate 1, wherein a welding material 3 is arranged between the power module 2 and the substrate 1;
2. electrodes are provided on the other opposite surface of the substrate 1, the electrodes including a positive electrode 4 and a negative electrode 5; the positive electrode 4 and the negative electrode 5 are arranged at intervals, and the sizes of the positive electrode 4 and the negative electrode 5 are consistent; the structure of the electrode is generally matched with the substrate to be heated, and the contact area between the electrode and the heated substrate is as large as possible; simultaneously, the projection of the welding material 3 on the substrate 1 and the projection of the electrode on the substrate 1 are overlapped as much as possible, so that the current is ensured to uniformly flow through the substrate 1 and the welding material 3, and the temperature field is uniform;
3. energizing the motor according to the parameters designed in advance, and sintering.
When the welding device works, by conducting a large current to the substrate 1 to generate heat, the substrate 1 can be heated to a higher temperature in a short time, so that the welding of the welding material 3 is realized, and the welding material 3 is a sintered welding material, such as sintered silver, sintered copper or other sintered materials in general;
when the welding device works, only a place where current flows is a heat source, the welding material 3 is close to the substrate 1, and heat generated by the substrate 1 can rapidly heat the welding material 3 through heat conduction;
in the sintering process, a certain pressure can be applied to the upper part of the power module 2, so that the quality of sintering welding is improved;
in operation, since the welding material 3 has a certain conductivity, current flows through the welding material 3, and the welding material 3 generates heat by itself due to the flow of a large current;
when the electric heater works, the current provided for the electrode can be direct current or alternating current or pulse current, the magnitude of the current is selected according to the design requirement, the conducted current can reach thousands of amperes at maximum, and the temperature of an object to be heated can be raised to 200-600 ℃ in a short time; the temperature can be regulated by regulating the current in real time;
during operation, the structural design of the electrode is generally matched with the design of the substrate to be heated, and the contact area between the electrode and the heated substrate is as large as possible, so that the current uniformly flows through the heated substrate, and the temperature field is uniform;
when the welding device works, the welding material can be a sintered metal material such as soft soldering, silver sintering, copper sintering and the like, and meanwhile, the welding material is matched with the application of pressure to ensure the sintering quality; the current control heating can rapidly realize local high temperature, and sinter the sintering material, so that other materials can be protected from bearing high temperature for a long time, and better sintering quality can be obtained due to higher temperature.
In this embodiment, the fixed member is the power module 2; the base material is a heat dissipating substrate 1.
The present embodiment is of the semiconductor industry, although other industries may be used, and will not be described here again-!
Compared with the prior art, the invention has the following beneficial effects:
the rapid sintering method can rapidly realize local heating, generate Joule heat by passing large current to the object to be heated, rapidly heat the object to be heated, and reach the required sintering temperature in a relatively short time, thereby not needing to heat the whole product to protect the product, and the sintering temperature of the heating sintering mode can be rapidly adjusted at any time, and the reliability is high.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A rapid sintering method, characterized in that: the method comprises the following steps:
1. placing the fixed piece at a preset position on one surface of the base material, wherein a welding material is arranged between the fixed piece and the base material;
2. an electrode disposed on the other opposing surface of the substrate, the electrode comprising a positive electrode and a negative electrode; the positive electrode and the negative electrode are arranged at intervals; the structure of the electrode is generally matched with the substrate to be heated, and the contact area between the electrode and the heated substrate is as large as possible; thereby ensuring that the current uniformly flows through the substrate and the welding material and ensuring that the temperature field is uniform;
3. energizing the electrode according to the parameters designed in advance, and sintering.
2. The rapid sintering method according to claim 1, characterized in that: the positive electrode and the negative electrode are of the same size.
3. The rapid sintering method according to claim 1, characterized in that: the projection of the welding material on the base material is overlapped with the projection of the electrode on the base material as much as possible, so that the current is ensured to uniformly flow through the base plate and the welding material, and the temperature field is uniform.
4. The rapid sintering method according to claim 1, characterized in that: in the sintering process, pressure is applied to the upper part of the fixed piece, so that the quality of sintering welding is improved.
5. The rapid sintering method according to claim 1, characterized in that: the soldering material is a sintered soldering material, such as soldering or sintered silver or sintered copper.
6. The rapid sintering method according to claim 1, characterized in that: when the electric heater works, the current provided for the electrode is direct current or alternating current or pulse current, the conducted current can reach thousands of amperes at maximum, and the temperature of an object to be heated can be raised to 200-600 ℃ in a short time; and the temperature can be regulated by regulating the current in real time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310666667.4A CN116890146A (en) | 2023-06-07 | 2023-06-07 | Rapid sintering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310666667.4A CN116890146A (en) | 2023-06-07 | 2023-06-07 | Rapid sintering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116890146A true CN116890146A (en) | 2023-10-17 |
Family
ID=88310025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310666667.4A Pending CN116890146A (en) | 2023-06-07 | 2023-06-07 | Rapid sintering method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116890146A (en) |
-
2023
- 2023-06-07 CN CN202310666667.4A patent/CN116890146A/en active Pending
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