CN116879122A - Infinitely-extensible modularized visual seepage simulation device - Google Patents
Infinitely-extensible modularized visual seepage simulation device Download PDFInfo
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- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/08—Investigating permeability, pore-volume, or surface area of porous materials
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- G—PHYSICS
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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- G01N15/08—Investigating permeability, pore-volume, or surface area of porous materials
- G01N15/0806—Details, e.g. sample holders, mounting samples for testing
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- G—PHYSICS
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/08—Investigating permeability, pore-volume, or surface area of porous materials
- G01N2015/0846—Investigating permeability, pore-volume, or surface area of porous materials by use of radiation, e.g. transmitted or reflected light
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8411—Application to online plant, process monitoring
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Abstract
The application provides an infinitely extensible modularized visual seepage simulation device, which comprises a simulation assembly, a fluid conveying assembly and an image acquisition assembly, wherein the simulation assembly is used for simulating the seepage of a fluid; the simulation assembly comprises a plurality of simulation units, the simulation units form at least one layer of simulation unit array, the simulation units comprise a microscopic visual model and a mounting base, the microscopic visual model comprises a chip carrier and a chip cover plate, the chip carrier is provided with a porous medium area, and the chip cover plate is covered on the chip carrier; the mounting bases of the simulation units are connected with each other, and porous medium areas of adjacent simulation units are communicated; the fluid delivery assembly includes an injection and production line in communication with the simulation unit and configured to pass a simulation fluid into the porous media region; the image acquisition assembly comprises an image sensor facing the simulation unit for acquiring a fluid seepage image. The application provides an infinitely-extensible modularized visual seepage simulation device which can observe the seepage phenomenon of fluid in a complex stratum in real time.
Description
Technical Field
The application belongs to the technical field of oil and gas field development and the technical field of microfluidic chips, and particularly relates to an infinitely extensible modularized visual seepage simulation device.
Background
The microfluidic chip is used as a novel analysis and detection platform, and can accurately control fluid in micrometer and nanometer size channels. In recent years, with the progress of the related technologies of the microfluidic manufacturing technology and the image acquisition processing system, the microfluidic technology has been developed. The method can realize in-situ observation and analyze seepage characteristics and thermodynamic behaviors of the fluid at the micrometer and nanometer scales, and has been widely focused in the fields of biology, medicine, environment, petroleum and the like.
The micro-fluidic technology has the advantage of real-time visualization, and the fluid in the micro-nano structure has different performances from those of the fluid in the macro-scale, which is similar to the fluid seepage in porous media such as underground soil, rock and the like, and can visualize the invisible physicochemical process of the underground.
Microfluidic technology has been well applied in the field of oil and gas field development, for example, simulating porous reservoir media such as sandstone, and visually explaining the microscopic seepage mechanism of the porous media. At present, a microfluidic chip with a single module is generally adopted to simulate a specific stratum structure in a certain plane, and then the flow phenomenon of fluid in the stratum is displayed through an image acquisition assembly and a display system.
However, these chips cannot simulate a formation structure with a combination of complex lithology and pore characteristics, and cannot observe the seepage phenomenon of fluid in the complex formation in real time.
Disclosure of Invention
The application takes an underground three-dimensional porous medium as a simulation object, provides an infinitely-extensible modularized visual seepage simulation device for overcoming the defects of the traditional microfluidic device, and can simulate the combination of complex lithology, pore characteristics, heterogeneous characteristics and the like of a stratum through three-dimensional expansion to develop gas injection, water injection and the like to visually study the interfacial phenomenon and multiphase seepage rules in the porous medium, thereby providing a high-efficiency and convenient study method for the related study of the porous medium in the fields of geology, environment, petroleum and the like.
The application provides an infinitely extensible modularized visual seepage simulation device, which comprises a simulation assembly, a fluid conveying assembly and an image acquisition assembly, wherein the simulation assembly is used for simulating the seepage of a fluid; the simulation assembly comprises a plurality of simulation units, the simulation units form at least one layer of simulation unit array, each simulation unit comprises a microscopic visual model and a mounting base, the microscopic visual model comprises a chip carrier and a chip cover plate, the chip carrier is provided with a porous medium area, and the chip cover plate is covered on the chip carrier; the mounting bases of the simulation units are connected with each other, and porous medium areas of adjacent simulation units are communicated; the fluid delivery assembly includes an injection and production line in communication with the simulation unit and configured to pass a simulation fluid into the porous media region; the image acquisition assembly comprises an image sensor facing the simulation unit and adapted to acquire a fluid seepage image.
In the infinitely expandable modularized visual seepage simulation device, optionally, the section of the simulation unit in the plane direction of the chip cover plate is rectangular, and the plurality of simulation units are arranged side by side along the extending direction of the chip carrier, so that the simulation unit array is in a matrix.
The infinitely expandable modularized visual seepage simulation device is characterized in that the section of the mounting base in the extending direction of the chip cover plate is rectangular;
as in the infinitely expandable modular visual seepage simulation device described above, optionally the simulation units further comprise connectors connected to corner portions of the mounting bases of adjacent simulation units to interconnect the different simulation units.
As described above, the infinitely expandable modular visual seepage simulation device may be configured such that, optionally, the mounting base has a first mounting hole, the connecting member has a second mounting hole opposite to the first mounting hole, and the connecting member connects two adjacent mounting bases by means of a pin penetrating through the first mounting hole and the second mounting hole.
As mentioned above, the infinitely expandable modular visual seepage simulation device, optionally, the installation base includes base and lower base, goes up base and lower base and encloses into the installation cavity jointly, and microscopic visual model inlays and establishes in the installation cavity, and the installation cavity has the opening that sets up in the side of installation base, and the opening is used for communicating with the adjacent analog unit in the installation base outside.
As in the infinitely expandable modular visual percolation simulation apparatus described above, optionally, the chip carrier has a fully etched region and a bonding region, the bonding region being located laterally of the fully etched region near the edge of the chip carrier, the fully etched region extending to the opening of the mounting cavity.
As an alternative, the plurality of simulation units includes a first simulation unit and a second simulation unit, the installation base of the first simulation unit has an injection hole communicated with the porous medium area, and the installation base of the second simulation unit has an outflow hole communicated with the porous medium area;
the infinitely expandable modular visual seepage simulation device as described above, optionally, the injection and production line comprises an injection pipe for injecting fluid and an outflow pipe for allowing fluid after seepage in the porous medium area to flow out, the injection hole is connected with the injection pipe, and the outflow hole is communicated with the outflow pipe.
As in the infinitely expandable modular visual seepage simulation device described above, optionally, at least one of the chip cover plate and the chip carrier corresponding to the first simulation unit has a first avoidance hole in communication with the injection hole;
at least one of the chip cover plate and the chip carrier corresponding to the second simulation unit is provided with a second avoidance hole communicated with the outflow hole.
In the infinitely expandable modularized visual seepage simulation device, optionally, the plurality of simulation units form a two-layer simulation unit array, the two-layer simulation unit array is arranged in a vertically stacked mode, and porous medium areas in the two-layer simulation unit array are mutually communicated.
The infinitely expandable modular visual seepage simulation device, as described above, optionally, the image acquisition assembly further comprises a microscope, the microscope is disposed between the image sensor and the simulation unit, and an eyepiece end of the microscope is disposed opposite to the image sensor.
The application provides an infinitely extensible modularized visual seepage simulation device, which comprises a simulation assembly, a fluid conveying assembly and an image acquisition assembly, wherein the simulation assembly is used for simulating the seepage of a fluid; the simulation assembly comprises a plurality of simulation units, the simulation units form at least one layer of simulation unit array, each simulation unit comprises a microscopic visual model and a mounting base, the microscopic visual model comprises a chip carrier and a chip cover plate, the chip carrier is provided with a porous medium area, and the chip cover plate is covered on the chip carrier; the mounting bases of the simulation units are connected with each other, and porous medium areas of adjacent simulation units are communicated; the fluid delivery assembly includes an injection and production line in communication with the simulation unit and configured to pass a simulation fluid into the porous media region; the image acquisition assembly comprises an image sensor facing the simulation unit for acquiring a fluid seepage image. The application provides an infinitely-extensible modularized visual seepage simulation device which can observe the seepage phenomenon of fluid in a complex stratum in real time.
The application has the beneficial technical effects that:
(1) The modular structure designed by the application is composed of at least one layer of simulation units, can be infinitely expanded according to experimental purposes, and can realize expansion and interlayer circulation in the longitudinal direction by designing an interlayer pipeline and a support frame. And designing a boundary connecting piece of the simulation unit, fastening and restraining adjacent simulation units by using bolts, realizing in-layer connection and fluid communication, and realizing physical simulation of the porous medium three-dimensional structure by using the modularized structure.
(2) According to the application, through designing the micro-fluidic chip etching and modifying process, microscopic visual models with different pore structures and different lithologies can be manufactured in a distinguishing mode. The method is arranged and combined according to a certain rule or purpose, overcomes the disadvantage that the conventional micro-fluidic chip simulates a specific single stratum structure in a certain plane in a small size, and can accurately describe the characteristics of complex lithology, pore characteristics, non-uniformity and the like of any type of underground stratum.
(3) The application can realize interlayer circulation through the interlayer pressure-resistant quick connector, and the completely etched area can realize intra-layer circulation, thereby eliminating boundary effect. The size of the sealing ring is designed, interference fit is realized with the microscopic visual model and the mounting base, continuity of seepage states between adjacent simulation units is guaranteed, and real seepage rules in the three-dimensional porous medium under different geological conditions can be restored.
In addition to the technical problems, features constituting the technical solutions, and advantages brought by the technical features of the technical solutions described above, other technical problems that the infinitely expandable modular visual seepage simulation device of the present application can solve, other technical features included in the technical solutions, and advantages brought by the technical features, further detailed description will be given in specific embodiments.
Drawings
FIG. 1 is an assembled schematic view of an infinitely extensible modular visual seepage simulation device provided by an embodiment of the present application;
FIG. 2 is a schematic view of the structure of a base of an infinitely expandable modular visual seepage simulation device according to an embodiment of the present application;
FIG. 3 is a schematic diagram of the upper base structure of an infinitely expandable modular visual seepage simulation device provided by an embodiment of the application;
FIG. 4 is a schematic diagram of a connector structure of an infinitely expandable modular visual seepage simulation device according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a microscopic visual model of an infinitely extensible modular visual seepage simulation device according to an embodiment of the present application;
FIG. 6 is a schematic diagram of a seal ring structure of an infinitely expandable modular visual seepage simulation device according to an embodiment of the present application;
FIG. 7 is a schematic diagram of a bolt structure of an infinitely expandable modular visual seepage simulation device provided by an embodiment of the application;
FIG. 8 is a schematic diagram of a nut structure of an infinitely expandable modular visual seepage simulation device according to an embodiment of the present application;
FIG. 9 is a cross-sectional view of a microscopic visualization model in an infinitely expandable modular visual seepage simulation device provided by an embodiment of the present application;
FIG. 10 is a diagram of the internal structure of a microscopic visualization model in an infinitely extensible modular visual seepage simulation device provided by an embodiment of the present application;
fig. 11 is a three-dimensional expansion mode cross-sectional view of an infinitely expandable modular visual seepage simulation device provided by an embodiment of the application.
Reference numerals:
1-infinitely extensible modular visual seepage simulation device;
10-an analog component;
a 100-analog unit;
100 a-a first simulation unit;
100 b-a second simulation unit;
100 c-a third simulation unit;
110-upper base;
120-microscopic visualization model;
121-chip cover plate; 122-chip slide;
1221-a bonding region; 1222-completely etched region; 1223-porous media region; 1224-fluid injection groove; 1225-microscopic percolation pathways;
130-a lower base;
131-a first mounting hole;
132-positioning grooves;
133-sealing the groove;
140-connectors;
141-a second mounting hole;
150-sealing rings;
160-bolts;
170-nut;
20-a fluid delivery assembly;
21-a fluid injection port; 22-micro valve; 23-injection and production lines; 231-injection tube; 232-an outflow tube; 24-pressure-resistant quick connectors; 25-warm compaction collection points; 26-fluid outflow;
30-an image acquisition assembly;
31-an image sensor; a 32-processor;
40-supporting frame.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
An infinitely expandable modular visual seepage simulation device in this embodiment is further described below.
FIG. 1 is an assembled schematic view of an infinitely extensible modular visual seepage simulation device provided by an embodiment of the present application; FIG. 2 is a schematic view of the structure of a base of an infinitely expandable modular visual seepage simulation device according to an embodiment of the present application; FIG. 3 is a schematic diagram of the upper base structure of an infinitely expandable modular visual seepage simulation device provided by an embodiment of the application; FIG. 4 is a schematic diagram of a connector structure of an infinitely expandable modular visual seepage simulation device according to an embodiment of the present application; FIG. 5 is a schematic diagram of a microscopic visual model of an infinitely extensible modular visual seepage simulation device according to an embodiment of the present application; FIG. 6 is a schematic diagram of a seal ring structure of an infinitely expandable modular visual seepage simulation device according to an embodiment of the present application; FIG. 7 is a schematic diagram of a bolt structure of an infinitely expandable modular visual seepage simulation device provided by an embodiment of the application; FIG. 8 is a schematic diagram of a nut structure of an infinitely expandable modular visual seepage simulation device according to an embodiment of the present application; FIG. 9 is a cross-sectional view of a microscopic visualization model of an infinitely extensible modular visual seepage simulation device provided by an embodiment of the present application; FIG. 10 is a diagram of the internal structure of a microscopic visualization model in an infinitely extensible modular visual seepage simulation device provided by an embodiment of the present application; fig. 11 is a three-dimensional expansion mode cross-sectional view of an infinitely expandable modular visual seepage simulation device provided by an embodiment of the application.
As shown in fig. 1, an embodiment of the present application provides an infinitely scalable modular visual seepage simulation device 1. The device specifically comprises an analog assembly 10, a fluid conveying assembly 20 and an image acquisition assembly 30; the simulation assembly 10 comprises a plurality of simulation units 100, the simulation units 100 form at least one layer of simulation unit array, each simulation unit 100 comprises a microscopic visual model 120 and a mounting base, the microscopic visual model 120 comprises a chip carrier 122 and a chip cover plate 121, the chip carrier 122 is provided with a porous medium area 1223, and the chip cover plate 121 is covered on the chip carrier 122; the mounting bases of the respective simulation units 100 are connected to each other, and the porous medium areas 1223 of the adjacent simulation units 100 are communicated; the fluid delivery assembly 20 includes an injection and production line 23, the injection and production line 23 in communication with the simulation unit 100 configured to pass a simulation fluid into a porous media region 1223; the image acquisition assembly 30 comprises an image sensor 31, the image sensor 31 facing the simulation unit 100 for acquiring a fluid seepage image.
Thus, through the improvement of the structure of the simulation assembly 10, the porous medium area 1223 and the completely etched area 1222 are etched on the microscopic visualization model 120 in the simulation assembly 10, the adjacent simulation units 100 are communicated and arranged into an array with a certain layer number according to actual conditions, and compared with the conventional microfluidic device which can only simulate a single stratum structure in a certain plane, the image sensor 31 is adopted to capture the fluid seepage phenomenon in the simulation assembly 10, so that the stratum structure with the combination of complex lithology and pore characteristics can be simulated, and the fluid seepage phenomenon in the complex stratum can be observed in real time.
In particular, microscopic visualization model 120 is a device capable of viewing internal structures or objects, at least a portion of which are constructed of transparent or light-permeable materials, so that the structures contained therein can be viewed microscopically. The microscopic visual model can be specifically in a box-shaped structure. The structure of the microscopic visual model 120 is shown in fig. 5, in which the interior of the microscopic visual model 120 is divided into three areas, i.e., a fluid inlet area, a fluid detection area, and a fluid outlet area, according to the difference in the functions of the fluid in the microscopic visual model 120.
Specifically, the materials of the mounting base, the chip carrier 122 and the chip cover 121 are quartz glass or sapphire glass, so that the glass material has certain strength and can bear larger load, and the material has better light transmittance, so that the light path is convenient to be incident into the chip carrier 122, and the seepage condition of fluid is observed.
In some embodiments, the cross section of the simulation units 100 in the plane direction of the chip cover 121 is rectangular, and a plurality of simulation units 100 are arranged side by side along the extending direction of the chip carrier 122, so that the array of simulation units 100 is in a matrix, as shown in fig. 1.
In some embodiments, the cross section of the mounting base in the extending direction of the chip cover 121 is rectangular, and as shown in fig. 2, a positioning groove 132 is further provided inside the mounting base. The shape of the positioning groove 132 is the same as the shape of the microscopic visualization model 120 for positioning the microscopic visualization model 120. A seal groove 133 is further provided in the interior of the mounting base for placing the seal 150.
Specifically, the side length of the mounting base is 4-10cm, the thickness is 3-6mm, the depth of the positioning groove 132 is 1-2mm, the depth of the sealing groove 133 is 2-4mm, and the size of the positioning groove 132 is the same as that of the microscopic visual model 120, so that the microscopic visual model 120 can be completely clamped inside the positioning groove 132, the microscopic visual model 120 is fixed, and the phenomenon that the microscopic visual model 120 generates a virtual image due to shaking in the experimental process is avoided, so that the acquired picture is not clear, and the experimental result is influenced.
The analog units 100 further include a connection member 140, as shown in fig. 4, the connection member 140 being connected to a corner portion of the mounting base of the adjacent analog unit 100, as shown in fig. 1, to connect the different analog units 100 to each other.
Specifically, the four adjacent simulation units 100 are longitudinally constrained by structural cooperation, and the simulation units 100 are longitudinally infinitely expanded by the connection of the connecting pieces 140.
Specifically, the thickness of the connection member 140 is 3-6mm in conformity with the thickness of the microscopic visual model 120, so that the connection member 140 and the microscopic visual model 120 are closely combined.
In some embodiments, the mounting base has a first mounting hole 131, the connector 140 has a second mounting hole 141 opposite the first mounting hole 131, and the connector 140 connects adjacent mounting bases by a pin passing through the first mounting hole 131 and the second mounting hole 141, using a bolt 160 as shown in fig. 7, and a nut 170 as shown in fig. 8.
The material of the installation base is a transparent temperature-resistant pressure-resistant Polycarbonate (PC) plate or glass fiber reinforced plastic, and the material has the characteristics of resisting the temperature of 120-150 ℃ and the pressure of 0-10 MPa, so that the installation base can be prevented from being cracked due to larger pressure when the seepage phenomenon of the simulated fluid in the stratum is avoided.
The installation base includes an upper base 110 and a lower base 130, as shown in fig. 2 and 3, the upper base 110 and the lower base 130 enclose a mounting cavity together, the microscopic visual model 120 is embedded in the mounting cavity, and the mounting cavity has an opening disposed at a side of the installation base, and the opening is used for communicating with an adjacent simulation unit 100 outside the installation base. The connecting member 140 is disposed at an opening at a side of the mounting base, and is used for laterally connecting two adjacent analog units 100.
Specifically, the microscopic visual model 120 is located at the middle part of the installation cavity, and as shown in fig. 1, the upper surface of the microscopic visual model 120 is attached to the upper base 110, and the lower surface of the microscopic visual model 120 is attached to the lower base 130.
Specifically, the inner part of the installation cavity further comprises a sealing ring 150, as shown in fig. 6, an inner ring of the sealing ring 150 is clamped at the edge of the microscopic visual model 120, and an outer ring of the sealing ring 150 is in contact with the sealing groove 133 in the installation base. The two adjacent simulation units 100 share the same sealing ring 150, so that lateral expansion is realized, and the completely etched areas of the adjacent microscopic visualization models 120 are laterally aligned in an interference fit mode, so that fluid communication in the adjacent simulation units 100 is realized.
Specifically, the thickness of the inner ring of the sealing ring 150 is 2-5mm, and the thickness of the outer ring is 9-15mm. The thickness of the inner ring is slightly smaller than the thickness of the microscopic visual model 120, and the thickness of the outer ring is slightly larger than the sum of the thickness of the microscopic visual model 120 and the thickness of the sealing groove 133 of the upper base 110 and the lower base 130, so that interference fit is formed, tightness is ensured, and leakage of fluid of two adjacent simulation units 100 is prevented when the fluid flows through a completely etched area.
It should be noted that, the material of the sealing ring 150 may be nitrile rubber, fluorosilicone rubber, etc., and the material has the characteristics of resisting temperature 120-150 ℃, resisting pressure 0-10 MPa, resisting salt, resisting acid and alkali, resisting oil, etc., so that the corrosion of the fluid to the sealing ring 150 during the simulation experiment is avoided, and the service life of the sealing ring 150 can be prolonged.
In some embodiments, the chip carrier 122 has a fully etched region 1222 and a bonding region 1221, as shown in fig. 9, the bonding region 1221 being located on a side of the fully etched region 1222 near the edge of the chip carrier 122, the fully etched region 1222 extending to the opening of the mounting cavity.
Wherein the chip carrier 122 forms the porous medium region 1223 by an exposure etching process, as shown in fig. 9, the microscopic percolation path 1225 in the porous medium region 1223 has a width of 0.1 to 500 μm and a depth of 0.1 to 500 μm.
Specifically, the porous medium region 1223 further includes a fluid injection groove 1224 therein, and as shown in fig. 10, the fluid injection groove 1224 is disposed on a diagonal line of the microscopic visualization model 120, the fluid injection groove 1224 communicates with the microscopic seepage passage 1225, and the fluid flows into the microscopic seepage passage 1225 through the fluid injection groove 1224.
The chip carrier 122 and the chip cover 121 are connected together by thermal bonding, so that the bonded microscopic visual model 120 has sufficient tightness and mechanical strength, and is free from cracking and leakage.
Specifically, the position of the fully etched region 1222 may be set according to the formation structure to be simulated, that is, the fully etched region 1222 may be set on both sides of the microscopic visual model 120, for communicating with the simulation units 100 on the adjacent both sides. Meanwhile, a completely etched region 1222 may be provided on one side of the microscopic visualization model 120, and the other side is used to provide a closed boundary.
It should be noted that the depth of the fully etched region 1222 is the same as the size of the porous medium, and this is provided to eliminate the boundary effect and ensure the continuity of fluid seepage between the adjacent simulation units 100. At the same time, the surface properties of the fully etched region 1222, such as wettability, roughness, etc., can also be controlled by surface modification techniques to simulate the seepage of fluids under different wetting conditions.
Specifically, the microscopic visual model 120 can design various porous medium forms according to different templates used for exposure etching and different modification techniques, wherein different permeabilities can be set in the microscopic visual model 120 of different simulation units 100, and a specific heterogeneous simulation unit 100 array can be formed according to the regular arrangement of the permeabilities.
Specifically, different pore structures may also be etched in the microscopic visualization model 120 of the different simulation units 100 to simulate inter-particle pore structures, pure crack structures, crack-inter-particle pore structures, hole-inter-particle pore structures, inter-particle pore-micro-crack-macro-cavity structures, inter-particle pore-micro-crack-macro-crack structures, and the like.
Specifically, the micro-visualization model 120 micro-channel surfaces in different simulation units 100 may be overlaid with clay particles or rock particles to simulate different lithologies or soil types.
In some embodiments, the plurality of simulation units 100 includes a first simulation unit 100a and a second simulation unit 100b, the mounting base of the first simulation unit 100a having an injection hole in communication with the porous medium region 1223, the mounting base of the second simulation unit 100b having an outflow hole in communication with the porous medium region 1223, as shown in fig. 9 and 11; the injection and production line 23 includes an injection pipe 231 for injecting a fluid and an outflow pipe 232 for allowing the fluid, which has permeated in the porous medium region 1223, to flow out, the injection hole being connected to the injection pipe 231, and the outflow hole being in communication with the outflow pipe, as shown in fig. 11. The injection pipe 231 and the outflow pipe 232 are disposed at the fluid inlet 21 and the fluid outlet 26, respectively.
Specifically, the simulation unit further includes a third simulation unit 100c, where the base of the third simulation unit 100c is in a closed state, and no central hole is provided to connect the first simulation unit 100a and the second simulation unit 100b, so as to construct a combined environment of the stratum.
In some embodiments, at least one of the chip cover 121 and the chip carrier 122 corresponding to the first analog unit 100a has a first escape hole in communication with the injection hole; at least one of the chip cover sheet 121 and the chip carrier sheet 122 corresponding to the second simulation unit 100b has a second escape hole communicating with the outflow hole. The first avoidance holes and the second avoidance holes are arranged for communicating the etched porous medium.
Specifically, the pressure-resistant quick connectors 24 are connected to the outer parts of the chip cover plate 121 and the chip carrier 122 of the microscopic visual model 120, and the pressure-resistant quick connectors 24 are distributed in the vertical direction, so that the pressure-resistant quick connectors have the characteristics of plug and play and can be detached and taken conveniently. Wherein, each pressure-resistant quick connector 24 is matched with a micro valve 22 and a temperature and pressure collecting point 25, which can precisely control the temperature and pressure of the outlet and inlet of each simulation unit 100.
Specifically, the fluid delivery assembly 20 further includes a liquid injection pump (not shown) that acts in concert with the microvalve 22 to drive fluid flow at a rate.
Specifically, a test tube (not shown) is disposed at each of the fluid inlet 21 and the fluid outlet 26, the fluid for the experiment is filled into the test tube at the fluid inlet 21, the fluid is injected into the microscopic visualization model 120 through the injection tube, and after the fluid passes through the porous medium area 1223 to complete the detection, the fluid flows into the test tube at the fluid outlet 26 through the outflow tube, and is collected and stored.
In some embodiments, the plurality of analog cells 100 form a two-layer array of analog cells, the two-layer array of analog cells 100 being arranged one above the other, and the porous medium regions 1223 in the two-layer array of analog cells 100 being in communication with each other.
A supporting frame 40 is disposed between two layers of simulation units 100 stacked up and down, and is used for supporting adjacent simulation units 100, and sharing the vertical load of the injection pipe 231 and the outflow pipe 232.
In some embodiments, the image acquisition assembly 30 further includes a microscope disposed between the image sensor 31 and the analog unit 100, with an eyepiece end of the microscope disposed opposite the image sensor 31.
Optionally, a light source such as a light emitting diode is disposed above the microscope, the light emitting diode irradiates light on the microscopic visual model 120, the interior of the microscopic visual model 120 is composed of a microscopic seepage channel 1225 and unetched glass, when fluid flows through the light source irradiation area through the microscopic seepage channel 1225, detection is started, and different images are displayed in different areas due to different refractive indexes of the glass and the fluid.
Specifically, the image sensor 31 is a Complementary Metal Oxide Semiconductor (CMOS) sensor, and the fluid in the microscopic visual model 120 has the characteristics of micro quantity, micro sample, fast flow speed, etc., and the chip imaging target surface of the complementary metal Oxide Semiconductor sensor (Complementary Metal-Oxide Semiconductor, CMOS) has large size and good photosensitivity, can capture the micro fluid moving in the microscopic visual model 120, and can effectively capture the image of the fast moving object.
Specifically, the image acquisition assembly 30 further includes a processor 32, and the image sensor 31 transmits fluid seepage signals to the processor 32, and the seepage law of the fluid is analyzed by using image processing software in the processor 32.
The operation of the infinitely scalable modular visual percolation simulation apparatus 1 is explained below:
firstly, determining a certain number of simulation assemblies 10 with a certain layer number according to a required simulation purpose, and preparing microcosmic visual models 120 with different properties according to the required simulation purpose, wherein the microcosmic visual models are combined according to a certain rule, so that the combined simulation assemblies 10 can simulate real geological features; then, the first simulation unit 100a is selected as an initial injection point, the second simulation unit 100b is selected as an outflow point, the first simulation unit 100a and the second simulation unit 100b are externally connected with an injection and production line 23, the fluid injection port 21 and the fluid outflow port 26 are respectively externally connected with a test tube, water is injected into the simulation assembly 10 through the fluid injection port 21, the pressure is set to be the highest operation pressure, the operation pressure is maintained for about 40 minutes, and it is determined that no liquid leakage exists at the joint of the pressure-resistant quick connector 24 and the micro valve 22, namely, the test is qualified, and at the moment, a simulation experiment can be started. Finally, the simulation assembly 10 is placed under the image acquisition assembly 30, and the seepage characteristics and flow phenomena of the internal fluid are observed.
In this embodiment, an infinitely expandable modular visual seepage simulation device 1 comprises a simulation assembly 10, a fluid conveying assembly 20 and an image acquisition assembly 30; the simulation assembly 10 comprises a plurality of simulation units 100, the simulation units 100 form at least one layer of simulation unit 100 array, each simulation unit 100 comprises a microscopic visual model 120 and a mounting base, the microscopic visual model 120 comprises a chip carrier 122 and a chip cover plate 121, the chip carrier 122 is provided with a porous medium area 1223 formed by etching, and the chip cover plate 121 is covered on the chip carrier 122; the mounting bases of the respective simulation units 100 are connected to each other, and the porous medium areas 1223 corresponding to the adjacent simulation units 100 are communicated; the fluid delivery assembly 20 includes an injection and production line 23, the injection and production line 23 being in communication with the simulation unit 100 and configured to pass a simulation fluid into the porous media region 1223; the image acquisition assembly 30 comprises an image sensor 31, the image sensor 31 facing the simulation unit 100 for acquiring a fluid seepage image. Thus, through the improvement of the structure of the simulation assembly 10, the porous medium area 1223 and the completely etched area 1222 are etched on the microscopic visualization model 120 in the simulation assembly 10, the adjacent simulation units 100 are communicated and arranged into an array with a certain layer number according to actual conditions, and compared with the conventional microfluidic device which can only simulate a single stratum structure in a certain plane, the image sensor 31 is adopted to capture the fluid seepage phenomenon in the simulation assembly 10, so that the stratum structure with the combination of complex lithology and pore characteristics can be simulated, and the fluid seepage phenomenon in the complex stratum can be observed in real time.
It should be noted that references in the specification to "one embodiment," "an example embodiment," "some embodiments," etc., indicate that the embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same embodiment. Furthermore, when a particular feature, structure, or characteristic is described in connection with an embodiment, it is submitted that it is within the knowledge of one skilled in the art to effect such feature, structure, or characteristic in connection with other embodiments whether or not explicitly described.
Generally, terms should be understood at least in part by use in the context. For example, the term "one or more" as used herein may be used to describe any feature, structure, or characteristic in a singular sense, or may be used to describe a combination of features, structures, or characteristics in a plural sense, at least in part depending on the context. Similarly, terms such as "a" and "an" may also be understood to convey a singular usage or a plural usage, depending at least in part on the context.
It should be readily understood that the terms "on … …", "above … …" and "above … …" in this disclosure should be interpreted in the broadest sense such that "on … …" means not only "directly on something", but also includes "on something" with intermediate features or layers therebetween, and "above … …" or "above … …" includes not only the meaning "on something" or "above" but also the meaning "above something" or "above" without intermediate features or layers therebetween (i.e., directly on something).
Further, spatially relative terms, such as "below," "beneath," "above," "over," and the like, may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein interpreted accordingly.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Claims (10)
1. An infinitely expandable modularized visual seepage simulation device is characterized by comprising a simulation assembly, a fluid conveying assembly and an image acquisition assembly;
the simulation assembly comprises a plurality of simulation units, the simulation units form at least one layer of simulation unit array, each simulation unit comprises a microscopic visual model and a mounting base, the microscopic visual model comprises a chip carrier and a chip cover plate, the chip carrier is provided with a porous medium area, and the chip cover plate is covered on the chip carrier; the mounting bases of the simulation units are connected with each other, and porous medium areas of adjacent simulation units are communicated;
the fluid delivery assembly includes an injection and production line in communication with the simulation unit and configured to pass a simulation fluid into the porous media region;
the image acquisition assembly comprises an image sensor facing the simulation unit for acquiring a fluid seepage image.
2. The infinitely extensible modular visual seepage simulation device of claim 1, wherein the cross section of the simulation units in the plane direction of the chip cover sheet is rectangular, and a plurality of the simulation units are arranged side by side along the extending direction of the chip carrier sheet so that the simulation unit array is in a matrix.
3. The infinitely extensible modular visual seepage simulation device of claim 2, wherein the mounting base is rectangular in cross section in the direction of extension of the chip cover sheet;
the simulation units further include connectors connected to corner portions of the mounting bases adjacent to the simulation units to interconnect the different simulation units.
4. The infinitely extensible modular visual seepage simulation device of claim 3, wherein the mounting base comprises a first mounting hole, the connecting piece comprises a second mounting hole opposite to the first mounting hole, and the connecting piece is connected with two adjacent mounting bases through a pin shaft penetrating through the first mounting hole and the second mounting hole.
5. The infinitely extensible modular visual seepage simulation device of any one of claims 1-4, wherein the mounting base comprises an upper base and a lower base, wherein the upper base and the lower base together enclose a mounting cavity, wherein the microscopic visual model is embedded in the mounting cavity, and wherein the mounting cavity has an opening disposed laterally of the mounting base for communicating with adjacent simulation units outside the mounting base.
6. The infinitely scalable modular visual seepage simulation device of claim 5, wherein the chip carrier has a fully etched region and a bonding region, the bonding region being located on a side of the fully etched region near an edge of the chip carrier, the fully etched region extending to an opening of the mounting cavity.
7. The infinitely extensible modular visual seepage simulation device of any one of claims 1-4, wherein a plurality of the simulation units comprises a first simulation unit having a mounting base with an injection orifice in communication with the porous media region and a second simulation unit having an outflow orifice in communication with the porous media region;
the injection and production pipeline comprises an injection pipe for injecting fluid and an outflow pipe for allowing the fluid flowing out after seepage in the porous medium area, wherein the injection hole is connected with the injection pipe, and the outflow hole is communicated with the outflow pipe.
8. The infinitely extensible modular visual seepage simulation device of claim 7, wherein at least one of the chip cover sheet and the chip carrier sheet corresponding to the first simulation unit has a first relief hole in communication with the injection hole;
at least one of the chip cover plate and the chip carrier corresponding to the second simulation unit is provided with a second avoiding hole communicated with the outflow hole.
9. The infinitely extensible modular visual seepage simulation device of any one of claims 1-4, wherein a plurality of the simulation units form a two-layer simulation unit array, the two-layer simulation unit array is arranged one above the other, and the porous medium areas in the two-layer simulation unit array are communicated with each other.
10. The infinitely extensible modular visual seepage simulation device of any one of claims 1-4, wherein the image acquisition assembly further comprises a microscope disposed between the image sensor and the simulation unit with an eyepiece end of the microscope and the image sensor disposed opposite.
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