CN116868684A - Ceramic heater and method for manufacturing ceramic heater - Google Patents
Ceramic heater and method for manufacturing ceramic heater Download PDFInfo
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- CN116868684A CN116868684A CN202280016310.5A CN202280016310A CN116868684A CN 116868684 A CN116868684 A CN 116868684A CN 202280016310 A CN202280016310 A CN 202280016310A CN 116868684 A CN116868684 A CN 116868684A
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- 239000000919 ceramic Substances 0.000 title claims abstract description 125
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000000034 method Methods 0.000 title claims abstract description 10
- 229910052751 metal Inorganic materials 0.000 claims abstract description 51
- 239000002184 metal Substances 0.000 claims abstract description 51
- 238000005259 measurement Methods 0.000 claims abstract description 41
- 238000010438 heat treatment Methods 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims description 44
- 239000002923 metal particle Substances 0.000 claims description 24
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000005406 washing Methods 0.000 description 5
- 238000010304 firing Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000005273 aeration Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000011343 solid material Substances 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/42—Heating elements having the shape of rods or tubes non-flexible
- H05B3/48—Heating elements having the shape of rods or tubes non-flexible heating conductor embedded in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/013—Heaters using resistive films or coatings
Landscapes
- Resistance Heating (AREA)
Abstract
Provided are a ceramic heater and a method for manufacturing the ceramic heater, wherein the resistance of a heating resistor is improved and breakage is suppressed. The ceramic heater (11) is provided with a heating resistor embedded in a substrate, and is characterized in that the heating resistor (40) contains a metal component and a ceramic component, and when 10 points are measured at different measurement positions (A1, A2, A5, A6) which are 10 [ mu ] m square in the cross section of the heating resistor, the average content of the metal component is 35 area% or more and less than 50 area%, and the minimum content of the metal component is 30 area% or more.
Description
Technical Field
The present invention relates to a ceramic heater used for, for example, warm water washing of toilet seats, heaters, electric water heaters, 24-hour bathtubs, soldering irons, hair curlers, and the like, and a method for manufacturing the ceramic heater.
Background
Conventionally, for example, a heat exchange unit having a container (heat exchanger) made of resin is used for a warm water washing toilet seat, and a long tubular ceramic heater is disposed in the heat exchange unit to heat washing water stored in the heat exchanger.
As this ceramic heater, a structure is used in which a ceramic sheet on which a heater wiring circuit as a heating resistor is printed is wound around a cylindrical ceramic insulating tube and integrally fired (see patent document 1).
The water flowing through the gap between the inner wall of the heat exchanger and the outer periphery of the ceramic heater is heated by the ceramic heater.
Prior art literature
Patent literature
Patent document 1: japanese patent laid-open No. 9-7739
Disclosure of Invention
Problems to be solved by the invention
In addition, when the ceramic heater is miniaturized, the area of the portion of the ceramic sheet where the heater wiring can be formed becomes small. Therefore, in order to obtain the same heat as the conventional ceramic heater in each circuit, it is necessary to increase wiring resistance or line width and increase the number of turns to secure the same wiring length as the conventional one.
Here, since the wiring circuit of the heater is formed by printing an ink paste containing metal particles, there is a limit to narrowing the line width (for example, about 0.3 mm) when considering the wetting of printing. Therefore, it is necessary to increase wiring resistance, and ceramic particles such as alumina are added to the paste for this purpose.
However, when many ceramic particles are contained in the wiring as insulators, there is a problem that the ceramic particles are sandwiched between metal particles as conduction paths, which hinders conduction and is liable to break the wiring.
Accordingly, an object of the present invention is to provide a ceramic heater and a method for manufacturing the ceramic heater, which can improve the resistance of a heat generating resistor and suppress disconnection.
Means for solving the problems
In order to solve the above problems, the ceramic heater according to the present invention comprises a heating resistor embedded in a base body, wherein the heating resistor comprises a metal component and a ceramic component, and when 10 points are measured at different measurement points of 10 μm square in a cross section of the heating resistor, an average content of the metal component is 35 area% or more and less than 50 area%, and a minimum content of the metal component is 30 area% or more.
According to this ceramic heater, the "average content of metal component" indicating the resistance of the entire heat generating resistor is set to a level at which the resistance becomes high, and therefore the resistance of the heat generating resistor can be improved.
Further, since the "minimum content of the metal component" is set to a level at which the content ratio of the ceramic component does not fluctuate at each measurement site, it is possible to suppress occurrence of breakage due to local generation of a region where the ceramic component is excessive.
It is considered that the metal component is accumulated by the average content of the metal component being 35 area% or more and is connected to the entire inside of the heating resistor body, whereby the high conductivity is stably exhibited.
In the ceramic heater of the present invention, the maximum content of the metal component may be 80 area% or less.
According to this ceramic heater, fluctuation in the content ratio of the ceramic component at each measurement site is further reduced, and disconnection can be further suppressed.
In the ceramic heater of the present invention, it is possible that at 25℃and a thickness of 25 μm, every 100. Mu.m 2 The specific resistance of the heating resistor is 0.02 Ω or more.
According to this ceramic heater, the resistance of the heating resistor can be reliably increased.
The method for manufacturing a ceramic heater according to the present invention includes a ceramic substrate manufacturing step of manufacturing a ceramic substrate and a coating step of coating or printing ink as a heat generating resistor around the ceramic substrate, wherein the ink contains metal particles and ceramic particles, the metal particles have an average particle diameter of 0.5 to 2.0 [ mu ] m, and the ceramic particles have an average particle diameter of 0.2 to 2.0 [ mu ] m.
Effects of the invention
According to the present invention, the resistance of the heating resistor of the ceramic heater can be increased and disconnection can be suppressed.
Drawings
Fig. 1 is a front view showing a ceramic heater according to an embodiment of the present invention.
Fig. 2 is an expanded view showing a ceramic sheet of the ceramic heater.
Fig. 3 is an exploded view schematically showing a heater wiring circuit included in fig. 2.
Fig. 4 is a schematic diagram showing a measurement site of a heat generating resistor and a conduction path at the measurement site according to an embodiment of the present invention.
Fig. 5 is a schematic diagram showing a measurement site of a heating resistor not conforming to the present invention and a conduction path at the measurement site.
Fig. 6 is a view showing an example in which a plurality of measurement sites are selected from the same cross section of the heat generating resistor.
Fig. 7 is a diagram showing an actual relationship between the content of the metal component and the resistivity.
Fig. 8 is a graph showing the results of actually measuring the content of the metal component in the heat generating resistor of the ceramic heater according to the present invention and the commercial ceramic heater.
Fig. 9 is a view next to fig. 8.
Detailed Description
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Fig. 1 is a front view showing a ceramic heater 11 according to an embodiment of the present invention, fig. 2 is an expanded view showing a ceramic sheet 19 of the ceramic heater 11, and fig. 3 is an expanded view schematically showing heater wiring circuits 40a and 40b included in fig. 2.
The ceramic heater 11 according to the embodiment of the present invention may be used to heat washing water in a heat exchanger of a heat exchange unit such as a warm water washing toilet seat.
As shown in fig. 1, the ceramic heater 11 includes a cylindrical base body (ceramic base body) 13 in which a heat generating resistor 40 is embedded, and an annular or end-annular ceramic flange 30 joined to the outer periphery of the ceramic base body 13 via a joining member 20.
The ceramic base 13 includes a cylindrical ceramic support 17 and a ceramic sheet 19 wound around the outer periphery of the support 17, and the support 17 has a through hole 17h in the axial direction O. In the heat exchanger, water flowing through the through-hole 17h is heated by the ceramic heater 11, and water in a gap between the inner wall of the heat exchanger and the outer periphery of the ceramic heater is also heated by the ceramic heater 11.
The support 17 and the ceramic sheet 19 may be formed of, for example, alumina. The ceramic sheet 19 does not completely cover the outer periphery of the support 17, and a slit 13s extending along the axis O of the support 17 is formed in the rolled portion 19a of the ceramic sheet 19.
On the other hand, as shown in fig. 2, a heating resistor 40 including a plurality of heater wiring circuits 40a and 40b having a serpentine pattern shape is formed on the ceramic sheet 19 by printing or the like. The heater wiring circuits 40a and 40b of the heating resistor 40 are formed as follows: the folded portions 40m at both ends of the plurality of wiring portions 40L (see the upper diagram of fig. 3) extending along the axis O direction extend in the width direction and are connected to the ends of the adjacent wiring portions 40L. The wiring portions at both ends of each heater wiring circuit 40a, 40b are integrally connected to the 3 connection terminals 41, 42a, 42b in the shape of a solder plate at one end in the axis O direction.
Specifically, as shown in fig. 3, the wiring portions 40L1 and 40L2 at both ends of the heater wiring circuit 40a are connected to the connection terminal 41 as the common ground and the connection terminal 42a on the positive electrode side, respectively. Similarly, the wiring portions 40L3 and 40L4 at both ends of the heater wiring circuit 40b are connected to the connection terminal 41 and the connection terminal 42b on the positive electrode side, respectively.
The connection terminals 41, 42a, and 42b are electrically connected to 3 (only 2 are shown in fig. 1) external terminals 43 formed on the outer peripheral surface (the back surface in fig. 2) of the ceramic sheet 19 via through-hole conductors or the like, not shown.
The heating resistor 40 and the connection terminals 41, 42a, and 42b may be formed of tungsten, for example, as a main component.
Next, the heating resistor 40 (each heater wiring circuit 40a, 40 b) will be described with reference to fig. 4 to 5. Fig. 4 is a schematic diagram showing the conduction paths at the measurement sites A1 and A2 and the measurement sites A1 and A2 of the heating resistor according to the embodiment of the present invention, and fig. 5 is a schematic diagram showing the conduction paths at the measurement sites a10 and a20 and the measurement sites a10 and a20 of the heating resistor which do not conform to the present invention.
The heating resistor 40 includes a metal component and a ceramic component. When 10 points are measured at different measurement points of 10 μm square in the cross section of the heating resistor 40, the average content of the metal component is 35 area% or more and less than 50 area%, and the minimum content of the metal component is 30 area% or more.
As shown in fig. 4, the measurement sites A1 and A2 are regions 10 μm square in the cross section of the heating resistor 40 (one wiring portion 40L of the heater wiring circuit 40a in fig. 3 is shown in fig. 4). Then, the images of the secondary electron images (constituent images) were binarized by an electron microscope (SEM) for the respective measurement sites A1 and A2 …, and the area ratio (area%) of the bright sites corresponding to the metal components was obtained as the content ratio of the metal components.
The "average content of the metal component" is an average value of the content of the metal component at each measurement site at 10. The "minimum content of the metal component" is the lowest value among the content of the metal component at each measurement site. Similarly, the "highest content of metal component" described below is the highest value among the content of metal components at each measurement site.
The heating resistor 40 is typically formed by printing an ink paste containing metal particles and ceramic particles. In addition, ceramic particles such as alumina increase wiring resistance, but when a large number of ceramic particles are contained, the ceramic particles are sandwiched between metal particles as conduction paths, which inhibit conduction, and are likely to break.
Therefore, as shown in fig. 4, by uniformly mixing the metal particles M and the ceramic particles C at the respective measurement sites A1, A2 (i.e., the content ratio of the ceramic component does not fluctuate at the respective measurement sites A1, A2), the conductive paths P are reliably formed by connecting the metal particles M without being divided by the ceramic particles C at the respective measurement sites A1, A2.
This increases the content of the ceramic component in the heating resistor, thereby improving the resistance and suppressing breakage. In particular, the thinner the line width of the heating resistor 40 (wiring portion 40L), the more likely the line breakage occurs when there are portions locally containing a large number of ceramic particles, but the line breakage can be suppressed.
Although the conduction path P along the cross section of each measurement site A1, A2 is shown in fig. 4 for convenience, the conduction path is actually formed toward the back side of the paper by passing through the cross section of each measurement site A1, A2. However, the arrangement state of the metal particles M and the ceramic particles C is considered to be three-dimensionally isotropic (the cross-sections of the measurement sites A1 and A2 and the direction of the back side of the plane orthogonal to the cross-sections are the same), and therefore, for convenience of illustration in the drawing, the conduction path P along the cross-sections of the measurement sites A1 and A2 is shown.
On the other hand, as shown in fig. 5, a case where the metal particles M and the ceramic particles C are not uniformly mixed at the respective measurement sites A1, A2 (i.e., a case where the content ratio of the ceramic component fluctuates greatly at the respective measurement sites A1, A2) is considered.
In this case, at the measurement site a10, the proportion of the ceramic particles C is large (4 in the measurement site), and therefore the metal particles M are divided by the ceramic particles C and do not form conductive paths, resulting in the broken line B. On the other hand, at the measurement site a20, the proportion of the ceramic particles C is small (1 in the measurement site), and therefore the metal particles M are connected without being divided by the ceramic particles C, forming the conduction paths P.
From the above, the "average content of metal component" is determined as an index indicating the resistance of the entire heat generating resistor, and is set so that the resistance becomes high.
The "minimum content of metal component" is determined as an index for suppressing occurrence of breakage of the wire by locally generating an excessive ceramic component region without fluctuation in the content of the ceramic component at each measurement site, and breakage is suppressed. For example, the "minimum content of metal component" at the measurement site a10 in fig. 5 is less than the predetermined range of the present invention.
In the present invention, when the maximum content of the metal component is 80 area% or less, the fluctuation in the content ratio of the ceramic component at each measurement site is further reduced, and disconnection can be further suppressed.
In the present invention, the thickness of the film is 25 μm at 25℃per 100. Mu.m 2 When the specific resistance of the area heating resistor 40 is 0.02 Ω or more, the resistance of the heating resistor can be reliably increased. Regarding the resistivity, the heating resistor 40 was cut and the resistance was measured, and the width, thickness and length of the cut portion were measured to calculate the thickness of 25 μm per 100 μm 2 Resistance value of the area.
In the present embodiment, as a method of controlling the average content of the metal component and the minimum content of the metal component within the above-described ranges, there is mentioned a method of making the particle diameters of the metal particles and the ceramic particles contained in the resistor ink for forming the heating resistor 40 finer. By making the particle diameter of each particle finer, the degree of dispersion when each particle is mixed can be improved, and fluctuation in the content ratio of the ceramic component can be reduced.
Specifically, when measured by using a particle size distribution based on, for example, a laser diffraction/scattering method, the average particle diameter Φ of the metal particles can be set to 0.5 to 2.0 μm, and the average particle diameter Φ of the ceramic particles can be set to 0.2 to 2.0 μm.
As the metal particles, tungsten powder and molybdenum powder can be used in combination. Examples of the ceramic particles include alumina.
Further, by adjusting the firing temperature at the time of forming the heating resistor 40, particularly by suppressing excessive grain growth and excessive sintering of the metal component, fluctuation in the content ratio of the ceramic component can be reduced.
The resistor ink can be manufactured, for example, as follows. First, metal particles and ceramic particles were weighed and placed in a pot, and after the solvent was put in, each particle was pulverized into fine powder by a ball mill. Then, resin (binder) was put into a ball mill, and the mixture was further mixed and pulverized, and then, excess solvent was removed by aeration. Thus, paste-like ink was obtained.
The ceramic heater 11 can be manufactured, for example, as follows.
First, a member as the support 17 is extruded from a paste of ceramic powder such as alumina and pre-fired. A green sheet as the ceramic sheet 19 is formed from the same paste as described above, and the resistor ink as the heating resistor 40 and the connection terminals 41, 42a, and 42b shown in fig. 2 is printed on the surface thereof and dried. Then, another green sheet is laminated on the printed surface of the green sheet and pressed, so that the heating resistor 40 and the connection terminals 41, 42a, 42b are buried between the two green sheets. Then, a through hole is provided in one surface of the laminate of two green sheets, and a through hole conductor is filled, and a conductive paste as the external terminal 43 is printed directly on the upper surface and dried.
Then, ceramic paste is applied to the opposite surface of the laminate of two green sheets, wound around the support 17, and bonded thereto, and the whole is fired.
The flange 30 is obtained by press-molding ceramic powder such as alumina by a mold and firing the ceramic powder.
The ceramic base 13 and the flange 30 thus manufactured are provided with a bonding material 20 (glass) as a solid material of the bonding member 20 in a gap between the ceramic base 13 and the flange 30, and the flange 30 is bonded to the outer periphery of the ceramic base 13 by heating the gap to a temperature equal to or higher than the melting temperature of the glass.
The method for manufacturing a ceramic heater according to the present invention comprises a ceramic substrate manufacturing step for manufacturing a ceramic substrate and a coating step for coating (printing) an ink as a heat generating resistor around the ceramic substrate, wherein the ink contains metal particles and ceramic particles, the average particle diameter of the metal particles is 0.5 to 2.0 mu, and the average particle diameter of the ceramic particles is 0.2 to 2.0 mu.
The present invention is not limited to the above-described embodiments, but it goes without saying that various modifications and equivalents included in the spirit and scope of the present invention are also covered.
The types of the metal component and the ceramic component constituting the heating resistor are not limited to the above.
The number and shape of the heater wiring circuits are not limited.
The measurement sites in the cross section of the heating resistor may be different from each other, or a plurality of measurement sites A5 and A6 may be selected from the same cross section as shown in fig. 6.
[ example ]
Example 1
As the metal particles, tungsten powder and molybdenum powder were used, and as the ceramic particles, alumina powder was used, and as described above, the average particle diameter Φ of the metal particles was produced: 1.3 μm and the average particle diameter phi of the ceramic particles: 0.5 μm resistor ink. The mixing ratio of the metal particles in each resistor ink was varied.
After printing and drying the resistor ink in a predetermined heat-generating pattern, firing is performed at a temperature at which the metal particles do not oxidize, and the resistivity at 25 ℃ and a thickness of 25 μm is measured by a conventional method.
The results obtained are shown in fig. 7. The content of the metal component was set as described above, and the area ratio (area%) at 10 points was measured for the different measurement points of 10 μm square in the cross section of the heat generating resistor.
As shown in fig. 7, when the content of the metal component is less than about 50 area%, the resistivity increases sharply. Based on the results, the average content of the metal component in the present invention was set to less than 50 area%.
Example 2
The ceramic heaters (examples) and commercially available ceramic heaters (comparative examples 1 to 3) produced in the same manner as in example 1 were measured for "average content of metal component", "minimum content of metal component", and "maximum content of metal component", respectively, by the above-described methods. Then, the difference in the level of the metal component content= (highest content of the metal component) - (lowest content of the metal component) was calculated.
The results obtained are shown in fig. 8 and 9.
Fig. 8 is a graph showing the results of actually measuring the content of the metal component of the heat generating resistor in comparative examples 1, 2, and 3 and examples. The plot on the left side of each sample shows the result of randomly selecting 10 points for each sample and measuring, and the plot on the right side of each sample shows the result of deliberately selecting a region/a smaller region of more metal components for each sample by visual observation and measuring.
Fig. 9 is a result of calculating the average content, the highest content, the lowest content, and the level difference of the content of the metal component in comparative examples 1, 2, and 3 and examples based on the measurement results shown in fig. 8.
The "average content of metal component" of comparative examples 1 and 2 was 50 area% or more, which is higher than that of examples, and the resistance of the heat generating resistor of the ceramic heater could not be increased.
In comparative example 3, although the "average content of metal component" was as high as in example, the "minimum content of metal component" was less than 30 area% and lower than in example, and it was considered that breakage was easy.
Description of the reference numerals
11. Ceramic heater
40. Heating resistor
A1, A2, A5 and A6 measurement sites.
Claims (4)
1. A ceramic heater includes a heating resistor embedded in a substrate,
the ceramic heater is characterized in that,
the heating resistor comprises a metal component and a ceramic component,
when 10 points are measured at different measurement points having a square cross section of 10 μm, the average content of the metal component is 35 to less than 50 area%, and the minimum content of the metal component is 30 area% or more.
2. The ceramic heater according to claim 1, wherein,
the maximum content of the metal component is 80 area% or less.
3. A ceramic heater according to claim 1 or 2, wherein,
every 100 μm at 25℃and a thickness of 25. Mu.m 2 The specific resistance of the heating resistor is 0.02 Ω or more.
4. A method of manufacturing a ceramic heater, comprising:
a ceramic substrate manufacturing step of manufacturing a ceramic substrate; and
a coating step of coating or printing ink as a heating resistor on the periphery of the ceramic substrate,
the method for manufacturing the ceramic heater is characterized in that,
the ink contains metal particles and ceramic particles, wherein the average particle diameter of the metal particles is 0.5-2.0 mu, and the average particle diameter of the ceramic particles is 0.2-2.0 mu.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021065623 | 2021-04-08 | ||
| JP2021-065623 | 2021-04-08 | ||
| PCT/JP2022/017033 WO2022215676A1 (en) | 2021-04-08 | 2022-04-04 | Ceramic heater, and method for manufacturing ceramic heater |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116868684A true CN116868684A (en) | 2023-10-10 |
Family
ID=83546086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280016310.5A Pending CN116868684A (en) | 2021-04-08 | 2022-04-04 | Ceramic heater and method for manufacturing ceramic heater |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4322707A1 (en) |
| JP (1) | JPWO2022215676A1 (en) |
| CN (1) | CN116868684A (en) |
| WO (1) | WO2022215676A1 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3110974B2 (en) * | 1995-05-16 | 2000-11-20 | 日本特殊陶業株式会社 | Alumina ceramic heater with metallized heating layer |
| JP3493247B2 (en) | 1995-06-21 | 2004-02-03 | 京セラ株式会社 | Ceramic heater |
| JP3691649B2 (en) * | 1997-10-28 | 2005-09-07 | 日本特殊陶業株式会社 | Ceramic heater |
| JP6924729B2 (en) * | 2018-02-05 | 2021-08-25 | 日本特殊陶業株式会社 | Ceramic heater |
-
2022
- 2022-04-04 JP JP2022560471A patent/JPWO2022215676A1/ja active Pending
- 2022-04-04 EP EP22784659.9A patent/EP4322707A1/en active Pending
- 2022-04-04 WO PCT/JP2022/017033 patent/WO2022215676A1/en active Application Filing
- 2022-04-04 CN CN202280016310.5A patent/CN116868684A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022215676A1 (en) | 2022-10-13 |
| EP4322707A1 (en) | 2024-02-14 |
| JPWO2022215676A1 (en) | 2022-10-13 |
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