CN116847974A - Bonding test equipment - Google Patents
Bonding test equipment Download PDFInfo
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- CN116847974A CN116847974A CN202280010909.8A CN202280010909A CN116847974A CN 116847974 A CN116847974 A CN 116847974A CN 202280010909 A CN202280010909 A CN 202280010909A CN 116847974 A CN116847974 A CN 116847974A
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- shear
- frame housing
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- substrate
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- 238000012360 testing method Methods 0.000 title abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 238000006073 displacement reaction Methods 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000000696 magnetic material Substances 0.000 claims description 7
- 230000003287 optical effect Effects 0.000 claims description 3
- 230000005291 magnetic effect Effects 0.000 description 6
- 238000010008 shearing Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000003302 ferromagnetic material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0025—Shearing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/026—Specifications of the specimen
- G01N2203/0296—Welds
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- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention proposes a joint test device for determining the strength of a joint and/or a material present on a substrate, wherein the device comprises at least: a frame housing; a displacement unit for displacing the frame housing in a direction orthogonal to a plane defined by the base; a shear tool component housed in the frame housing and arranged to apply shear forces to the joint and/or material in a direction parallel to a plane defined by the substrate; and a shear height setting unit housed in the frame housing, wherein the shear height setting unit is arranged to determine when the shear tool member is in contact with the substrate under a first operating condition in which the displacement unit displaces the frame housing in a direction toward the substrate, thereby obtaining a contact height, and to move the shear tool member relative to the frame housing in a direction away from the substrate under a second operating condition in which the displacement unit does not displace the frame housing, thereby setting the shear height of the shear tool member based on the contact height.
Description
Technical Field
The present invention relates to a bonding test apparatus, in particular for determining the strength of a bond and/or a material present on a substrate.
Background
Electrical connections in semiconductors and electronic components typically include bonds (bond), and it is known that these bonds can be mechanically tested as a means of measuring bond quality. One such test is performed on a system known as a joint test equipment and is known as a shear test. To perform such tests, the parts of the joint tester known as the shear tool load the material mounted on the substrate or joint to a specific load or load until some type of failure occurs. During this shear or bond test, a force in a shear direction generally parallel to a plane defined by the substrate is measured. After performing the shear test, the sheared surface is also visually inspected.
The accuracy of the alignment of the shear tool relative to the point of engagement present on the substrate is known to be very important. In the known art, there are various designs to obtain the best possible accuracy of the positional alignment of the points of reference engagement of the shear tool. Consistent with the three dimensions of space, there are three alignments of the shear tool relative to the point of engagement.
Disclosure of Invention
The present disclosure relates to one of these alignments, known as "shear height". The "shear height" is the distance between (the front end of) the shear tool and the surface of the substrate adjacent to the joint or material being tested, as seen in the z-direction normal to the surface of the substrate. The accuracy of this high alignment is paramount to performing accurate bonding tests, and the "shear height" should be set and maintained in as accurate a manner as possible prior to and during shear testing. However, such accuracy is generally limited to that achievable by known bond testing techniques.
It is an object to provide an improved bonding test apparatus in which the "shear height" can be set more accurately, so that the bonding test can be performed more accurately.
In a first embodiment of the present disclosure, a bond test apparatus for determining the strength of a bond and/or a material present on a substrate is presented, wherein the apparatus comprises at least: a frame housing; a displacement unit for displacing the frame housing in a direction orthogonal to a plane defined by the base; a shear tool component housed in the frame housing and arranged to apply shear forces to the joint and/or material in a direction parallel to a plane defined by the substrate; and a shear height setting unit housed in the frame housing, wherein the shear height setting unit is arranged to determine when the shear tool member is in contact with the substrate under a first operating condition in which the displacement unit displaces the frame housing in a direction toward the substrate, thereby obtaining a contact height, and to move the shear tool member relative to the frame housing in a direction away from the substrate under a second operating condition in which the displacement unit does not displace the frame housing, thereby setting the shear height of the shear tool member based on the contact height.
Accordingly, the "shear height" can be set more precisely than the prior art joint test configuration. In the case of this embodiment, only the shear tool members are being displaced to set the shear height. Thus, what is being displaced is a limited amount of mass, and because all of these movements are done locally, very high precision can be achieved. Due to the limited mass displacement and local movement, the joint test apparatus according to the present disclosure can be operated very precisely and enables shear height settings in the submicron range.
Preferably in one embodiment the shear height setting unit comprises a sensor element mounted between the shear height setting unit and the frame housing, wherein the sensor element is one element selected from the group consisting of a capacitive distance sensor element, an optical distance sensor element or a linear variable displacement transducer element. Thus, the moment at which the shear tool member 'touches' the substrate surface can be accurately determined, which is critical for the setting of the shear height as described below.
In another embodiment of the present disclosure, the shear height setting unit comprises a height actuator unit mounted between the shear height setting unit and the frame housing, the height actuator unit being arranged to move the shear tool member relative to the frame housing in a direction away from the base in the second operating condition. Since the height actuator unit only has to displace the shear tool component relative to the frame housing in a direction away from the base, the overall mass displacement is limited and involves a limited number of parts, the stiffness in the shear direction can be very high, ensuring an improved accuracy of the shear height setting, in particular in the sub-micrometer range.
In a preferred embodiment, the height actuator unit comprises a piezoelectric actuator element and an electromagnet connection unit arranged for mechanically connecting the piezoelectric actuator element with the shear tool assembly in the second operating condition. In particular, the shear tool component comprises a contact flange element made of a magnetic material (or ferromagnetic material). The contact flange element made of (ferro) magnetic material will just wipe over the electromagnet connection unit in the first operating condition, during which the electromagnet connection unit is deactivated. In a second operating condition, the electromagnet connection unit will be activated and the contact flange element and the shear tool element will be mechanically coupled to the electromagnet connection unit and the piezoelectric actuator element. This mechanical interconnection caused by the magnetic force causes the piezoelectric actuator element to displace the shear tool element precisely up and down and raise the shear tool element to the desired shear height.
In a further second embodiment of the present disclosure, a bond test apparatus for determining the strength of a bond and/or a material present on a substrate is presented, wherein the apparatus comprises at least: a frame housing; a displacement unit for displacing the frame housing in a direction orthogonal to a plane defined by the base; a shear tool component housed in the frame housing and arranged to apply shear forces to the joint and/or material in a direction parallel to a plane defined by the substrate; and a shear height setting unit housed in the frame housing, wherein the shear height setting unit is arranged to determine when the shear tool member is in contact with the substrate under a first operating condition in which the displacement unit displaces the frame housing in a direction toward the substrate, thereby obtaining a contact height, and to move the shear tool member relative to the frame housing in a direction away from the substrate under a second operating condition in which the displacement unit does not displace the frame housing, thereby setting the shear height of the shear tool member based on the contact height. According to this embodiment, the height actuator unit comprises a motor, such as but not limited to a voice coil actuator element, to precisely displace the shear tool member up and down and to raise the shear tool member to a desired shear height.
In both the first and second embodiments, the shear height setting unit may further comprise a control unit configured to control the first and second operating conditions of the displacement unit and/or the electromagnet connection unit.
In particular, the control unit is configured to apply a reduced alternating current to the subsequently deactivated electromagnet connection unit under the first operating condition to reduce the remanence present in the electromagnet connection unit to a desired amount. Any remanence will create a small attractive force on the contact flange element made of (ferro) magnetic material, thereby causing some unwanted friction between the shear tool component and the height actuator unit. The residual magnetic force may be advantageous to ensure that the flange element remains in contact with the electromagnet, but with a controlled amount of contact friction.
Drawings
The invention will now be described in more detail with reference to the accompanying drawings, in which:
FIG. 1 illustrates a first embodiment of an apparatus for determining the strength of a bond and/or material present on a substrate according to the present disclosure;
fig. 2 illustrates a second embodiment of an apparatus for determining the strength of a bond and/or material present on a substrate according to the present disclosure.
Detailed Description
For a better understanding of the present invention, like parts in the drawings are designated with like numerals.
Fig. 1 and 2 illustrate various embodiments of a bond testing apparatus according to the present disclosure, which is indicated by reference numeral 100 in fig. 1 and 200 in fig. 2.
The present invention relates to a bonding test apparatus, in particular for determining the strength of a bond and/or a material present on a substrate.
As outlined in the introduction above, electrical connections in semiconductors and electronic components typically comprise joints, and it is known that mechanical testing of these joints is required as a means of measuring joint quality. One such test is known as a shear test, which may be performed with a joint test apparatus. To perform such tests, the parts of the joint tester known as the shear tool load the material mounted on the substrate or joint to a specific load or load until some type of failure occurs. During this shear or bond test, a force in a shear direction generally parallel to a plane defined by the substrate is measured. After performing the shear test, the sheared surface is also visually inspected.
In fig. 1 and 2, reference numeral 1 denotes such a substrate. On the contact surface 1a of the substrate 1, a plurality of electrical features, such as copper conductors, copper pillars or solder balls 2a and/or electronic packages or electronic components 2b (e.g. resistors, capacitors, semiconductor ICs, etc.) may be mounted and their bonding may be tested as described previously. The substrate 1 may be of different types including, but not limited to, FR4 or ceramic circuit boards, silicon chips and silicon wafers.
Returning to fig. 1 and 2, the respective portions of two schematic illustrations of the joint test apparatus 100 and 200 according to the present disclosure are explained. Both embodiments 100 and 200 are capable of determining the strength of such joints or balls 2a and/or components 2b present on the substrate 1. The engagement testing device 100 (200) may be of the force measuring system type and is constituted at least by the frame housing 10. The shear tool member 20 and the shear height setting unit 30 are accommodated in the frame housing 10.
The shear tool member 20 comprises a shear tool holder 21 which holds a shear tool 22. The shear tool 22 may be permanently mounted in the shear tool holder 21 or may be of a replaceable type. The cutting tool 22 has an elongated configuration that terminates in a free cutting tool nose 22a. For proper operation of either of the embodiments 100 and 200, the shear tool component 20 is arranged to apply a shear force to the joint 2a and/or the material component 2b in a direction parallel to a plane defined by the substrate 1. The direction parallel to the plane defined by the substrate 1 is indicated by an arrow located below the substrate 1 and pointing to the left.
In this particular embodiment, the shear tool component 20 may be mounted to the frame housing 10 by means of a shear tool sensor unit 11, in which a shear tool holder 21 contains a sensor for sensing or measuring a force exerted by a shear tool 22 on the joint 2a or component 2b in a shear direction substantially parallel to the plane defined by the substrate 1.
According to the disclosure shown in fig. 1, the shear height setting unit 30 comprises a sensor element 31. The sensor element 31 is mounted between the shear tool sensor unit 11 and the frame housing 10. In various configurations, the sensor element 31 is one element selected from the group consisting of a capacitive distance sensor element, an optical distance sensor element, or a linear variable displacement transducer element.
The configuration of the two embodiments depicted in fig. 1 and 2 serves to establish the precise position of the front end 22a of the shear tool 22 with respect to the surface 1a of the substrate and in particular with respect to the point of engagement 2a or component 2b present on the substrate 1. The accuracy of the positional alignment of (the leading end 22a of) the shearing tool 22 with respect to the point of the joint 2a or the component 2b existing on the substrate 1 is known to be very important.
With both embodiments, a precise alignment of the front end 22a of the shear tool 22 with respect to the surface 1a, also known as "shear height", can be established. The "shear height" is the distance between (the front end 22a of) the shear tool 22 and the surface 1a of the substrate 1 adjacent to the joint 2a or material part 2b being tested, seen in the z-direction normal to the surface of the substrate. In fig. 1 and 2, the "shear height" is denoted by 'x'. Setting the height alignment 'x' in an accurate manner and maintaining the height alignment during the shear test is important for performing accurate bonding tests.
Here, in a first operating condition of the joint test apparatus 100 (or 200), the complete unit, i.e. the frame housing 10 comprising the shear tool member 20, the shear tool sensor unit 11 and the shear height setting unit 30, may be displaced by means of a displacement unit (not depicted) in a direction orthogonal to the plane defined by (the contact surface 1a of) the substrate 1. The direction normal to the plane is indicated by the vertically oriented double arrow on the left side of the frame housing 10 of both embodiments 100 and 200.
With the sensor element 31, the moment at which the front end 22a' of the shear tool member 20, and in particular the shear tool 22, touches the substrate surface 1a can be precisely determined. In a first operating condition in which the shear tool assembly 20 (and the frame housing 10) is moved in the z-direction towards the substrate 1, the front end 22a of the shear tool 22 touches the substrate surface 1a while the distance difference between the shear tool sensor unit 11 and the sensor element 31 is sensed. Once "touchdown" is sensed, the displacement in the z-direction normal to the substrate is stopped and the front end 22a touches the "touchdown" of the surface 1a to set a reference position for setting a desired shear height 'x' in a second operating condition of the joint test apparatus 100, i.e. a desired height of the front end 22a relative to the substrate surface 1a for performing a shear test on the joint 2a or component 2 b.
Here, the shear height setting unit 30 includes a height actuator unit, the first embodiment of which is depicted in fig. 1 and denoted by reference numeral 32. The height actuator unit 32 of fig. 1 is mounted between the shear tool sensor unit 11 and the frame housing 10, as seen in a direction orthogonal to the plane formed by the base 1. In a second operating condition of the engagement test apparatus 100, the height actuator unit is arranged to move the shear tool member 20 relative to the frame housing 10 in a direction away from the substrate 1, and thus in a direction opposite to the z-direction of 'touchdown' movement of the shear tool member 20 in the first operating condition.
In the second operating condition, the frame housing 10, which has previously been displaced in the z-direction towards the base 1 together with the shear tool member 20 in the first operating condition, is set in a fixed position relative to the base 1, and only the shear tool member 20 is moved relative to the frame housing 10 in a direction away from the base 1, thus in a direction opposite to the z-direction of the 'touchdown' movement. Thus, a limited amount of the mass of the shear tool member 20 is displaced and because all of these movements are accomplished locally, a very high degree of accuracy can be obtained. Since only limited masses of the shear tool member 20 and the shear tool front end 21 are displaced, the engagement testing device 100 can be operated very precisely and a shear height setting in the submicron range can be achieved.
Since the height actuator unit 30 only has to displace the shear tool element 20 relative to the frame housing 10 in a direction away from the base 1, the overall mass displacement is limited and involves a limited number of parts as well. Thus, when performing a shear test, the stiffness of the structure in the shear direction may be very high, ensuring an improved accuracy of the shear height setting, especially in the sub-micrometer range.
In particular, the elevation actuator unit 30 may include a piezoelectric actuator element 32 and an electromagnet connection (or clamping) unit 33. In the second operating condition, the electromagnet connection (or clamping) unit 33 is used to mechanically connect or clamp the piezoelectric actuator element 32 with the shear tool element 20, and more specifically to mechanically connect or clamp the piezoelectric actuator element 32 with the shear tool sensor unit 11.
The mechanical connection or clamping between the piezoelectric actuator element 32 and the shear tool component 20, in particular the shear tool sensor unit 11, is achieved by means of a magnetic clamping force applied between the two parts 32 and 20/11. In particular, the shear tool member 20 comprises a contact flange element 34 made of a magnetic material. The contact flange element 34 made of magnetic material is permanently mounted to the shear tool component 20 and in particular with its contact surface element 34a with the shear tool sensor unit 11.
In a first operating condition of the engagement test device 100, the contact flange element 34 will just wipe over the electromagnet connection unit 33, during which the electromagnet connection unit 33 is deactivated. In the second operating condition, the electromagnet connection unit 33 will be activated and the contact flange element 34, the shear tool sensor unit 11 and the shear tool element 20 may be mechanically coupled to the electromagnet connection unit 33 and the piezoelectric actuator element 32 by means of the magnetic force generated (introduction) by the activated electromagnet of the electromagnet connection unit 33.
This mechanical interconnection due to magnetic forces causes the piezoelectric actuator element 32 to displace the shear tool member 20 and thus the shear tool 22 precisely in an up-down direction normal to the plane of the substrate 1 and accordingly raise the shear tool member 20 (and the shear tool 22) to the desired shear height 'x'.
In short, the shear height setting unit 30 is arranged to determine when the front ends 22a of the shear tool members 20 and the shear tools 22 are in contact with the upper surface 1a of the substrate 1 under a first operating condition in which the displacement unit displaces the frame housing 10 in a direction towards the substrate 1. The contact position or touchdown sets the contact height or reference position. In a second operating condition in which the displacement unit does not displace the frame housing 10, the electromagnet connection unit 33 of the shear height setting unit 30 is activated, so that the shear tool member 20 is clamped with the height actuator unit 32, and the shear tool member 20 can be displaced relative to the frame housing 10 and in a direction away from the substrate 1, to set the shear height 'x' of the shear tool member relative to the contact height or reference position.
Operation under both the first and second operating conditions is controlled by means of the control unit 35, which may be housed in the frame housing 10 or mounted externally to the housing 10. The control unit 35 operates a displacement unit for displacing the frame housing 10 towards and away from the base 1, receives signals generated by the sensor element 31 for determining and establishing a "ground contact" reference position, generates signals for activating and deactivating the electromagnet clamping units 33, and controls the height actuator unit 32 for lifting the shear tool components 20 and the shear tool 22 to a desired shear height 'x'.
Thus, the shear height 'x' can be set in a much more accurate manner than the prior art joint test configuration. In the case of the embodiment depicted in fig. 1, only the shear tool member 20 is being displaced relative to the frame housing 10 and the base 1 to set the shear height 'x'. Thus, a limited amount of mass is being displaced, and because all of these movements are done locally, very high accuracy can be achieved. Due to the limited mass displacement and local movement, the joint testing apparatus according to the embodiment of fig. 1 can be operated very precisely and enables shear height settings in the sub-micrometer range.
Another second embodiment of a joint test apparatus 200 is depicted in fig. 2. Its functionality and operation in view of the first and second operating conditions is very similar to the first embodiment depicted in fig. 1.
Similarly, in a first operating condition of the joint test apparatus 200, the complete unit, i.e. the frame housing 10 comprising the shear tool member 20, the shear tool sensor unit 11 and the shear height setting unit 30, may be displaced by means of a displacement unit (not depicted) in a direction orthogonal to the plane defined by (the contact surface 1a of) the substrate 1. The direction normal to this plane is indicated by the vertically oriented double arrow on the left side of the frame housing 10.
The sensor element 31 is able to precisely determine the moment at which the cutting tool part 20, and in particular the front end 22a' of the cutting tool 22, touches the substrate surface 1 a. In a first operating condition, in which the shear tool assembly 20 (and the frame housing 10) is moved towards the substrate 1, the front end 22a of the shear tool 22 touches the substrate surface 1a, while the distance difference between the shear tool sensor unit 11 and the sensor element 31 is sensed.
Once "touchdown" is sensed, the displacement in the z-direction normal to the substrate is stopped and the front end 22a touches the "touchdown" of the surface 1a to set a reference position for setting a desired shear height 'x' in the second operating condition of the joint test apparatus 200, i.e. a desired height of the front end 22a relative to the substrate surface 1a for performing a shear test on the joint 2a or component 2 b.
In this second embodiment, the shear height setting unit 30 includes a height actuator unit denoted by reference numeral 44. The second embodiment of the height actuator unit 44 is mounted between the shear tool sensor unit 11 and the frame housing 10, seen in a direction orthogonal to the plane formed by the base 1. In a second operating condition of the engagement testing device 200, the height actuator unit 44 is arranged to move the shear tool member 20 relative to the frame housing 10 in a direction away from the base 1, and thus in a direction opposite to the direction of "touchdown" movement of the shear tool member 20 in the first operating condition.
According to a second embodiment, the elevation actuator unit 44 comprises a motor, preferably but not limited to a voice coil actuator element 44. This embodiment of the height actuator unit 44 is capable of precisely displacing up and down and lifting the shear tool member 20 to a desired shear height 'x' in a similar manner as the first embodiment of fig. 1.
In both the first and second embodiments, a control unit 35 is housed in the frame housing 10 and is used to operate a displacement unit for displacing the frame housing 10 towards and away from the substrate 1, to receive signals generated by the sensor element 31 for determining and establishing a "touchdown" reference position, to generate signals for activating and deactivating the electromagnet clamping unit 33, and to control a height actuator unit 32/44 for lifting the shear tool components 20 and the shear tool 22 to a desired shear height 'x'.
In both embodiments 100 and 200, in the second operating condition, the frame housing 10, which has been previously displaced in the z-direction together with the shear tool component 20 in the first operating condition towards the base 1, is set in a fixed position relative to the base 1. With the height actuator unit 32 or 44 of the first or second embodiment, the shear tool member 20 is moved relative to the frame housing 10 in a direction away from the base 1, and thus in a direction opposite to the z-direction of the 'touchdown' movement.
A limited amount of the mass of the shear tool element 20 is displaced and because all of this movement is accomplished locally, a very high degree of accuracy can be achieved. Because only the limited masses of the shear tool member 20 and the shear tool front end 22a are displaced, the engagement test apparatus 100 and 200 can be operated very accurately and can achieve shear height settings in the submicron range.
Thus, the shear height 'x' can be set more precisely than in the prior art joint test configuration. In the case of the embodiment depicted in fig. 1 and 2, only the shear tool member 20 is being displaced relative to the frame housing 10 and the base 1 to set the shear height 'x'. Thus, a limited amount of mass is being displaced, and because all of these movements are done locally, very high accuracy can be achieved. Due to the limited mass displacement and local movement, the joint testing apparatus according to this embodiment can be operated very accurately and enables shear height settings in the sub-micrometer range.
In particular, the control unit 35 of the device 100 is arranged to apply a reduced alternating current to the electromagnet connection unit 33, which is subsequently deactivated, in a first operating condition, in order to reduce the remanence present in the electromagnet connection unit 33 to a desired amount. Any remanence will create a small attractive force on the contact flange element 34 made of a (ferro) magnetic material, thereby causing some unwanted friction between the shear tool component 20 (shear tool sensor unit 11) and the height actuator unit 30. The residual magnetic force may be advantageous to ensure that the contact flange element 34 remains in contact with the electromagnet connection unit 33, but with a controlled amount of contact friction.
List of reference numerals
1. Substrate
1a contact surface of a substrate
2a electrical bonding or solder ball
2b electronic component
x shear height
100. First embodiment of the joint test apparatus
200. Second embodiment of the joint test apparatus
10. Frame shell
11. Shear tool sensor unit
12. Shear tool sensor
20. Shearing tool component
21. Shearing tool holder
22. Shearing tool
22a front end of shearing tool
30. Shear height setting unit
31. Sensor element
32. First embodiment of the altitude actuator Unit
33. Electromagnet clamping unit
34. Contact element
34a contact surface element
35. Control unit
44. A second embodiment of the elevation actuator unit.
Claims (8)
1. An apparatus for determining the strength of a bond and/or a material present on a substrate, the apparatus comprising at least:
a frame housing;
a displacement unit for displacing the frame housing in a direction orthogonal to a plane defined by the base;
a shear tool component housed in the frame housing and arranged to apply shear forces to the joint and/or the material in a direction parallel to the plane defined by the substrate; and
a shear height setting unit accommodated in the frame housing,
the shear height setting unit is arranged to-determine when the shear tool component is in contact with the substrate under a first operating condition in which the displacement unit displaces the frame housing in a direction towards the substrate, thereby obtaining a contact height, and
-moving the shear tool member relative to the frame housing in a direction away from the base in a second operating condition in which the displacement unit does not displace the frame housing, to set a shear height of the shear tool member based on the contact height.
2. The apparatus of claim 1, wherein the shear height setting unit comprises a sensor element mounted between the shear height setting unit and the frame housing.
3. The apparatus of claim 2, wherein the sensor element is one element selected from the group consisting of a capacitive distance sensor element, an optical distance sensor element, or a linear variable displacement transducer element.
4. The apparatus of any preceding claim, wherein the shear height setting unit further comprises a height actuator unit mounted between the shear height setting unit and the frame housing, the height actuator unit being arranged to move the shear tool component relative to the frame housing in a direction away from the substrate in the second operating condition.
5. The apparatus of claim 4, wherein the elevation actuator unit comprises a piezoelectric actuator element and an electromagnet connection unit arranged for mechanically connecting the piezoelectric actuator element with the shear tool component in the second operating condition.
6. The apparatus of claim 5, wherein the shear tool component comprises a contact flange element made of a magnetic material.
7. The apparatus of claim 4, wherein the elevation actuator unit comprises a voice coil actuator element.
8. The apparatus of any one of the preceding claims, wherein the shear height setting unit further comprises a control unit configured to control the first and second operating conditions of the displacement unit.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL2027453 | 2021-01-28 | ||
| NL2027453A NL2027453B1 (en) | 2021-01-28 | 2021-01-28 | A bond testing apparatus |
| PCT/NL2022/050026 WO2022164311A1 (en) | 2021-01-28 | 2022-01-20 | A bond testing apparatus. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116847974A true CN116847974A (en) | 2023-10-03 |
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ID=74858724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202280010909.8A Pending CN116847974A (en) | 2021-01-28 | 2022-01-20 | Bonding test equipment |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP4284627A1 (en) |
| CN (1) | CN116847974A (en) |
| NL (1) | NL2027453B1 (en) |
| WO (1) | WO2022164311A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL2021048B1 (en) * | 2018-06-04 | 2019-12-11 | Xyztec B V | Improvements to Step back Height |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2363701B1 (en) * | 2010-03-05 | 2015-11-04 | Nordson Corporation | Improved clamping mechanism for shear testing apparatus |
| WO2018139930A1 (en) * | 2017-01-30 | 2018-08-02 | Xyztec B.V. | None contact shear testing |
-
2021
- 2021-01-28 NL NL2027453A patent/NL2027453B1/en active
-
2022
- 2022-01-20 EP EP22700698.8A patent/EP4284627A1/en active Pending
- 2022-01-20 WO PCT/NL2022/050026 patent/WO2022164311A1/en active Application Filing
- 2022-01-20 CN CN202280010909.8A patent/CN116847974A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| NL2027453B1 (en) | 2022-09-02 |
| WO2022164311A1 (en) | 2022-08-04 |
| EP4284627A1 (en) | 2023-12-06 |
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