CN116794471A - Intelligent detection system for defective products of semiconductor devices - Google Patents
Intelligent detection system for defective products of semiconductor devices Download PDFInfo
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- CN116794471A CN116794471A CN202310609241.5A CN202310609241A CN116794471A CN 116794471 A CN116794471 A CN 116794471A CN 202310609241 A CN202310609241 A CN 202310609241A CN 116794471 A CN116794471 A CN 116794471A
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Abstract
The invention discloses an intelligent detection system for defective products of semiconductor devices, and relates to the technical field of semiconductors. According to the intelligent detection system for the defective products of the semiconductor devices, the automatic discharging of the discharging mechanism can be realized in the detection process, after the conducting detection mechanism is utilized to conduct and detect the diode, the appearance detection mechanism is utilized to detect whether cracks or abnormal deformation exists on the outer surface of the diode, the automation degree of the detection process is high, the continuous detection work of the diode can be realized, and the qualification rate of the diode is improved. The diode loading mechanism can utilize the meshing of gear and rack in the testing process, utilize the frictional force effect between diode and the cleaning roller can realize three hundred sixty degrees upset of diode, the omnidirectional detection work of appearance detection mechanism of being convenient for to utilize the frictional effect of cleaning roller when the diode rotates, clear away the spot of remaining at the surface, thereby can be convenient for follow-up discovery spot cover defect such as crack down.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to an intelligent detection system for defective products of semiconductor devices.
Background
Semiconductors refer to materials that have electrical conductivity properties at normal temperatures that are intermediate between conductors and insulators. Semiconductors have wide applications in radios, televisions, and thermometry. If the diode is a common device manufactured by a semiconductor, the diode is easy to generate cracks, surface scratches and defects that cannot be normally conducted in the production process, for the cracks and the surface scratches scattered in different areas, the degree of difference between the diode and the surrounding environment is small, the diode is detected and identified only by manual eyes, the identification precision and the identification speed are low, the misjudgment rate is high, the qualification rate of the product is greatly reduced, once a defective diode is put into use, the safety coefficient and the service life of the corresponding product are influenced, huge potential safety hazards and economic losses are caused, and the detection of each face of the diode can be realized by manually continuously turning the diode by using mechanical equipment for detection; whether detection diode can normally switch on generally utilizes the manual work to detect one by one through professional equipment, and detection process speed is slow, inefficiency.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an intelligent detection system for defective products of semiconductor devices, which solves the problems that the defects of cracks and scratches on the surfaces of the diodes are detected and identified only by adopting naked eyes manually, the identification precision and the identification speed are low, the misjudgment rate is high, the diodes are required to be manually turned to realize the detection of all the surfaces by using the appearance detection of mechanical equipment, the workload is high, the efficiency is low, the defects that normal conduction cannot be carried out manually one by one, and the detection process speed is low and the efficiency is low.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a semiconductor device defective products intelligent detection system, includes the conveying support and sets up at the inside conveyer belt subassembly of conveying support, conveying support top one side is provided with switches on detection mechanism, evenly be provided with diode loading mechanism on the conveyer belt subassembly outer wall, switch on detection mechanism top and fixedly be provided with blowing mechanism, and switch on detection mechanism lateral wall and fixedly be provided with electric putter one, conveying support top and be located and switch on detection mechanism one side and fixedly be provided with the curb plate, the curb plate top is provided with the camera support, the camera support top is followed left right equidistance and is distributed there is the CCD camera, fixedly be provided with outward appearance detection mechanism and electric putter two on the curb plate lateral wall, conveying support top is provided with the rack.
Preferably, the conduction detection mechanism comprises a first side plate and a second side plate which is arranged parallel to the first side plate, insulating installation blocks are fixedly arranged on opposite side walls of the first side plate and the second side plate, movable grooves are formed in outer walls of the insulating installation blocks, conductive components are movably arranged in the movable grooves, detection boxes are fixedly arranged on the side walls of the second side plate, and driving blocks are fixedly arranged on the left sides of the opposite side walls of the first side plate and the second side plate and located on the insulating installation blocks.
Preferably, the conductive assembly comprises a conductive metal plate and a graphite plate fixedly arranged on the outer wall of the conductive metal plate, four corners of the conductive metal plate, which are far away from the side wall of the graphite plate, are fixedly provided with upright posts, and the outer wall of each upright post is sleeved with a first spring in a sliding way.
Preferably, the diode loading mechanism comprises a loading seat, top blocks fixedly arranged on two sides of the outer wall of the loading seat and a placing groove arranged at the top of the loading seat, wherein mounting grooves are formed in two sides of the bottom of the placing groove, a cleaning roller is arranged in the mounting groove through rotation of a rotating shaft, one end of the rotating shaft penetrates through the mounting groove and is fixedly provided with a gear, adjusting holes are formed in the front side wall and the rear side wall of the loading seat, and correction components are arranged in the adjusting holes in a sliding mode.
Preferably, the correction assembly comprises a cross rod and telescopic rods fixedly arranged on two sides of the outer wall of the cross rod, a push rod is fixedly arranged on the outer wall of the cross rod and located between the two telescopic rods, a second spring is sleeved on the outer wall of the telescopic rod, and a stress block is fixedly arranged on the outer wall of the cross rod far away from the push rod.
Preferably, the discharging mechanism comprises a storage box, a bearing frame fixedly sleeved on the outer wall of the storage box and a square groove formed in the outer wall of the storage box, and a material control assembly is slidably arranged in the square groove.
Preferably, the material control assembly comprises a partition plate and rotating seats fixedly arranged on two sides of the outer wall of the partition plate, and a stop block is arranged in the rotating seats in a rotating mode.
Preferably, a torsion spring is arranged between the stop block and the rotating seat, sliding columns are fixedly arranged on two sides of the side wall of the baffle plate, which is far away from the rotating seat, and a third spring is sleeved on the outer wall of the sliding column.
Preferably, one end of the conduction detection mechanism is connected with a first controller, one end of the controller is connected with a first electric push rod, the first controller comprises a first processor and a first time relay, the output end of the conduction detection mechanism is connected with the input end of the first processor, and the first time relay and the first electric push rod are connected with the first processor in a bidirectional mode.
Preferably, one end of the appearance detection mechanism is connected with a second controller, the second controller comprises a second processor and a second time relay, the output end of the appearance detection mechanism is connected with the input end of the second processor, the second processor is connected with the second time relay and the second electric push rod in a bidirectional mode, and the output end of the CCD camera is connected with the input end of the appearance detection mechanism.
Advantageous effects
The invention provides an intelligent detection system for defective products of semiconductor devices. Compared with the prior art, the method has the following beneficial effects:
1. the intelligent detection system for the defective products of the semiconductor devices is characterized in that a discharging mechanism, a conduction detection mechanism and an appearance detection mechanism are arranged on a conveying device formed by a conveying support and a conveying assembly at the same time, the discharging mechanism can realize automatic discharging in the detection process, after the conduction detection mechanism is used for conducting detection on the diode, the appearance detection mechanism is used for detecting whether cracks or abnormal deformation exist on the outer surface of the diode, and defective products of the diode with defects can be automatically removed; the invention has high automation degree in the detection process, can realize continuous detection work of the diode, has high detection speed, high efficiency and low misjudgment rate, and improves the qualification rate of the diode.
2. The utility model provides a semiconductor device defective products intelligent detection system, can utilize the meshing of gear and rack through setting up diode loading mechanism in the testing process, drive the cleaning roller and rotate, utilize the frictional force effect between diode and the cleaning roller can realize three hundred sixty degrees upset of diode, the CCD camera carries out the omnidirectional to the surface of diode and shoots, the omnidirectional detection work of appearance detection mechanism of being convenient for improves the detection accuracy, and utilize the frictional effect of cleaning roller when the diode rotates, clear away the spot of remaining at the surface, thereby can be convenient for follow-up discovery spot cover defect such as crack down.
3. The utility model provides a semiconductor device defective products intelligent detection system, through set up correction subassembly in diode loading mechanism, two correction subassemblies can promote the diode that is arranged in the loading seat in opposite directions in the drive block effect in step, make it be in the intermediate position of standing groove, thereby can make the pin at diode both ends equal apart from two conductive component lateral wall distances, guarantee that pin and graphite plate can just stable contact, both guaranteed that the diode pin can not warp because of the skew of position receives conductive component extrusion, simultaneously can guarantee the stability of switch-on between diode and the conductive component, and then improve the degree of accuracy of detection.
4. The utility model provides a semiconductor device defective products intelligent detection system, through setting up stand and first spring in electrically conductive subassembly, can change the interval between two electrically conductive subassemblies through compressing first spring when graphite sheet lateral wall receives less exogenic action, can make closely, stable contact between diode pin and the graphite sheet, avoided pin and graphite sheet unable contact, lead to the unable conduction of circuit, cause the condition that leads to the erroneous judgement to appear in the electrically conductive subassembly, and can make the pin smooth-going enter into between two electrically conductive subassemblies through setting up the chamfer at the both ends of graphite sheet, graphite has lubricated effect moreover, make diode smooth-going between two electrically conductive subassemblies.
5. The utility model provides a semiconductor device defective products intelligent detection system, thrust when through utilizing diode loading mechanism to remove for the kicking block can promote accuse material subassembly and remove from square groove, can realize the effect of automatic blanking after the storage tank bottom relief hole is opened, and accuse material subassembly loses behind the kicking block effect moreover and can automatic recovery home position, blocks up the relief hole, realizes releasing the purpose of a diode at every turn, manual blowing of tradition at every turn, and degree of automation is high, and the blowing is fast, has liberated the both hands in the staff.
6. The intelligent detection system for the defective products of the semiconductor devices can rapidly push out unqualified diodes after detection by arranging the first electric push rod and the second electric push rod after the conduction detection mechanism and the appearance detection mechanism, so that the purpose of automatically removing the defective products is achieved.
Drawings
FIG. 1 is a schematic perspective view of the whole of the present invention;
FIG. 2 is an enlarged perspective view of the portion A of the present invention;
FIG. 3 is a schematic perspective view of a conduction detection assembly according to the present invention;
FIG. 4 is a schematic perspective view of a conductive component according to the present invention;
FIG. 5 is an exploded perspective view of the diode loading mechanism of the present invention;
FIG. 6 is an enlarged perspective view of part B of the present invention;
FIG. 7 is a schematic perspective view of an orthotic assembly according to the present invention;
FIG. 8 is an exploded perspective view of the discharging mechanism of the present invention;
FIG. 9 is a schematic perspective view of a material control assembly according to the present invention;
FIG. 10 is a schematic block diagram of a conduction detection mechanism and a first controller according to the present invention;
fig. 11 is a schematic block diagram of the appearance detecting mechanism and the second controller according to the present invention.
In the figure: 1. a conveying support; 2. a conveyor belt assembly; 3. a conduction detection mechanism; 31. a first side plate; 32. a second side plate; 33. an insulating mounting block; 34. a movable groove; 35. a conductive assembly; 351. a conductive metal plate; 352. a graphite plate; 353. a column; 354. a first spring; 36. a detection box; 37. a driving block; 4. a diode loading mechanism; 41. a loading seat; 42. a top block; 43. a placement groove; 44. a mounting groove; 45. a cleaning roller; 46. a gear; 47. an adjustment aperture; 48. a corrective component; 481. a cross bar; 482. a telescopic rod; 483. a push rod; 484. a second spring; 485. a stress block; 5. a discharging mechanism; 51. a storage bin; 52. a carrier; 53. a square groove; 54. a material control assembly; 541. a partition plate; 542. a spool; 543. a third spring; 544. a rotating seat; 545. a stop block; 6. an electric push rod I; 7. a side plate; 8. a camera mount; 9. a CCD camera; 10. appearance detection means; 11. an electric push rod II; 12. a rack.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention provides four technical schemes:
fig. 1-2, 10, 11 show a first embodiment: the intelligent detection system for the defective products of the semiconductor devices comprises a conveying support 1 and a conveying belt assembly 2 arranged in the conveying support 1, wherein a conduction detection mechanism 3 is arranged on one side of the top of the conveying support 1, a diode loading mechanism 4 is uniformly arranged on the outer wall of the conveying belt assembly 2, a discharging mechanism 5 is fixedly arranged on the top of the conduction detection mechanism 3, an electric push rod I6 is fixedly arranged on the side wall of the conduction detection mechanism 3, a side plate 7 is fixedly arranged on the top of the conveying support 1 and positioned on one side of the conduction detection mechanism 3, a second outlet for removing the defective diodes is arranged on one side of the side plate 7, a camera support 8 is arranged on the top of the side plate 7, CCD cameras 9 are distributed on the top of the camera support 8 from left to right at equal intervals, an appearance detection mechanism 10 and an electric push rod II 11 are fixedly arranged on the side wall of the side plate 7, a rack 12 is arranged on the top of the conveying support 1, the rack 12 is arranged on the right side of the conveying support 1, the length of the rack is identical with the side plate 7, and one end of the rack 12 and one end of the side plate 7 are on the same straight line; the conveying support 1 comprises a left-right distributed strip-shaped transverse frame and supporting legs for supporting the two strip-shaped transverse frames, the conveying belt assembly 2 is arranged between the two strip-shaped transverse frames, the conveying belt assembly 2 comprises two rotating rollers and a conveying belt sleeved on the two rotating rollers, one driving roller is driven by a servo motor, the servo motor is fixedly arranged on the outer wall of the side plate 7, one end of the conduction detection mechanism 3 is connected with a first controller, one end of the controller is connected with an electric push rod 6, the first controller comprises a first processor and a first time relay, the output end of the conduction detection mechanism 3 is connected with the input end of the first processor, and the first time relay and the first electric push rod are in bidirectional connection with the first processor. One end of the appearance detection mechanism 10 is connected with a second controller, the second controller comprises a second processor and a second time relay, the output end of the appearance detection mechanism 10 is connected with the input end of the second processor, the second processor is connected with the second time relay and the second electric push rod 11 in a bidirectional mode, and the output end of the CCD camera 9 is connected with the input end of the appearance detection mechanism 10.
The second embodiment, shown in fig. 3-4, differs from the first embodiment primarily in that: the utility model provides a semiconductor device defective products intelligent detection system, switch on detection mechanism 3 includes first curb plate 31 and with first curb plate 31 parallel arrangement's second curb plate 32, one side of first curb plate 31 is provided with the first outlet that is used for rejecting the diode defective products, all fixed being provided with insulating installation piece 33 on the relative lateral wall of first curb plate 31 and second curb plate 32, movable groove 34 has been seted up on the insulating installation piece 33 outer wall, the inside activity of movable groove 34 is provided with electrically conductive component 35, fixed being provided with detection box 36 on the lateral wall of second curb plate 32, on the relative lateral wall of first curb plate 31 and second curb plate 32 and be located the left side of insulating installation piece 33 and all fixed being provided with driving piece 37, be provided with through wire electric connection between two electrically conductive component 35 and the detection box 36, be used for detecting whether diode that is in between two electrically conductive component 35 can normally switch on, the diode includes the diode body and the metal pin of diode body both ends, electrically conductive component 35 includes electrically conductive metal plate 351 and fixedly set up graphite plate 352 on electrically conductive metal plate 351 outer wall, four corner plate 351 side wall's four fixedly arranged with graphite plate 352, four movable sleeve's flexible stand columns 352 are provided with four movable sleeve's movable hole's 353 in four stand column's movable sleeve's setting up in four stand column 352.
The third embodiment is shown in fig. 5-7, and differs from the second embodiment mainly in that: the intelligent detection system for the defective products of the semiconductor devices comprises a loading seat 41, a jacking block 42 fixedly arranged on two sides of the outer wall of the loading seat 41 and a placing groove 43 arranged at the top of the loading seat 41, wherein mounting grooves 44 are formed on two sides of the bottom of the placing groove 43, a cleaning roller 45 is rotatably arranged in the mounting grooves 44 through a rotating shaft, one end of the rotating shaft penetrates through the mounting grooves 44 and is fixedly provided with a gear 46, the gear 46 is meshed with a rack 12, adjusting holes 47 are formed in the front side wall and the rear side wall of the loading seat 41, a correction assembly 48 is slidably arranged in the adjusting holes 47, the correction assembly 48 comprises a cross rod 481 and telescopic rods 482 fixedly arranged on two sides of the outer wall of the cross rod 481, a push rod 483 is fixedly arranged between the two telescopic rods 482, a second spring 484 is sleeved on the outer wall of the telescopic rods 482, the cross rod 481 is fixedly provided with a force-bearing block 485 on the outer wall of the push rod 483, the two telescopic rods 482 are respectively slidably arranged in the two adjusting holes 47, when the force-bearing block 485 is not acted by external force, one end of the push rod 483, which is far from the push rod 483, is positioned outside the push rod 483, and a rubber protection sleeve is sleeved outside the end part; the stress block 485 and the driving block 37 have the same height from the ground, and the driving block 37 is used for pushing the stress block 485.
The fourth embodiment is shown in fig. 8-9, and differs from the third embodiment mainly in that: the intelligent detection system for defective products of semiconductor devices comprises a storage box 51, a bearing frame 52 fixedly sleeved on the outer wall of the storage box 51, and a square groove 53 formed on the outer wall of the storage box 51, wherein a material control component 54 is slidably arranged in the square groove 53, the bearing frame 52 is fixedly arranged at the top of the conduction detection mechanism 3, a cavity for storing diodes is formed in the storage box 51, a discharging hole for releasing the diodes is formed in the bottom of the storage box 51, the height of the discharging hole is equal to that of the diode loading mechanism 4 after the diodes are placed in the diode loading mechanism 4, the topmost part of the diodes is not contacted with the bottom end of the storage box 51, the material control component 54 comprises a baffle 541 and rotating seats 544 fixedly arranged on two sides of the outer wall of the baffle 541, a stop block 545 is rotatably arranged in the rotating seats 544, a torsion spring is arranged between the stop block 545 and the rotating seats 544, sliding columns 542 are fixedly arranged on two sides of the side walls of the baffle 541 away from the rotating seats 544, the outer wall of the sliding column 542 is sleeved with a third spring 543, the elasticity of the third spring 543 is smaller than that of the torsion spring, the baffle 541 can be completely opened after the baffle 545 is pushed by the top block 42, one end of the sliding column 542 penetrates through the storage box 51 and extends to the outside, the end of the sliding column 542 far away from the baffle 541 is provided with a spring baffle for blocking the movement of the third spring 543, the baffle 541 can be pushed out of the square groove 53 by the top block 42 after the baffle 545 pushed by the top block 42 is pushed out of the square groove 53 by the top block is satisfied due to the fact that the elasticity of the third spring 543 is smaller than the torsion spring, a discharge hole at the bottom of the storage box 51 is exposed, a diode in the storage box 51 just falls into the diode loading mechanism 4 at the bottom of the storage box 51, when the diode loading mechanism 4 continuously moves, the baffle 545 rotates and is separated from the top block 42 due to the elasticity generated by the third spring 543 being larger than that of the torsion spring, the baffle 545 returns to the original position of the control material component 54, the discharge opening is blocked, so that the purpose of accurately discharging materials every time is realized.
When in use, firstly, the anodes and cathodes of the diodes are arranged in the same direction, the diodes are vertically distributed in the storage box 51 from top to bottom, after a servo motor for driving the conveyor belt assembly 2 to rotate is started, the diode loading mechanism 4 moves from left to right along with the conveyor belt assembly 2, when one diode loading mechanism 4 approaches the discharging mechanism 5, the top block 42 pushes the stop block 545, because the elasticity of the third spring 543 is smaller than that of the torsion spring, the stop block 545 pushed by the top block 42 can meet the requirement that the top block pushes the partition plate 541 out of the square groove 53, the discharging hole at the bottom of the storage box 51 is exposed, the diodes in the storage box 51 just fall into the diode loading mechanism 4 reaching the bottom of the storage box 51, and when the diode loading mechanism 4 continues to move, because the elasticity generated by the third spring 543 is larger than that of the torsion spring, the stop block 545 rotates and is separated from the top block 42, the material control assembly 54 is restored to the original position, the material discharging hole is blocked, the purpose of accurate material discharging can be realized each time, then when the diode loading mechanism 4 is close to the left side of the driving block 37, the stress blocks 485 on the side walls of the two correction assemblies 48 are pushed by the driving block 37, the telescopic rod 482 enters the adjusting hole 47, the two push rods 483 synchronously push the diodes in the loading seat 41 in opposite directions to be positioned in the middle position of the placing groove 43, so that the distance between the pins at the two ends of the diodes and the side walls of the two conductive assemblies 35 is equal, the pins and the graphite plate 352 can be ensured to be just stably contacted, the diode pins are not deformed due to the extrusion of the conductive assemblies 35 due to the deviation of the positions, meanwhile, the electrifying stability between the diodes and the conductive assemblies 35 can be ensured, the two pins of the diodes are contacted with the two conductive assemblies 35, the detection box 36, the two conductive components 35 and the diode together form a communicated circuit, the detection box 36 detects the diode which cannot be normally conducted, the detection box 36 sends a defective product signal to the first processor, meanwhile, the time relay sends a signal to the first processor, the first processor sends an instruction to the electric push rod after 3-5 seconds, the electric push rod 6 rapidly pushes out the residual diode in the diode loading mechanism 4, then the diode loading mechanism 4 moves to the left side of the camera support 8, the gear 46 is meshed with the rack 12, the two cleaning rollers 45 synchronously rotate, the diode positioned in the placing groove 43 continuously shoots the diode passing through the lower side of the positioning groove according to three hundred sixty degrees, the appearance detection mechanism 10 judges whether the surface of the diode has defects according to picture information, once the crack or fracture condition is found, the information is sent to the second processor, meanwhile, the time relay sends an electric signal to the second processor, the electric push rod 11 is controlled to push out the residual diode after 3-5 seconds, and the second CCD camera 9 continuously shoots the diode according to three hundred sixty degrees, the diode passes through the time delay mechanism 2, and the time delay speed of the relay is adjusted according to the time delay speed of the time delay transmission component 2.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. The utility model provides a semiconductor device defective products intelligent detection system, includes conveying support (1) and sets up at conveying belt assembly (2) of conveying support (1) inside, its characterized in that: the conveying support is characterized in that a conduction detection mechanism (3) is arranged on one side of the top of the conveying support (1), diode loading mechanisms (4) are uniformly arranged on the outer wall of the conveying belt assembly (2), a discharging mechanism (5) is fixedly arranged on the top of the conduction detection mechanism (3), an electric push rod I (6) is fixedly arranged on the side wall of the conduction detection mechanism (3), a side plate (7) is fixedly arranged on the top of the conveying support (1) and positioned on one side of the conduction detection mechanism (3), a camera support (8) is arranged on the top of the side plate (7), CCD cameras (9) are distributed on the top of the camera support (8) from left to right at equal intervals, an appearance detection mechanism (10) and an electric push rod II (11) are fixedly arranged on the side wall of the side plate (7), and a rack (12) is arranged on the top of the conveying support (1).
2. The intelligent detection system for defective semiconductor devices according to claim 1, wherein: the conduction detection mechanism (3) comprises a first side plate (31) and a second side plate (32) which is arranged in parallel with the first side plate (31), insulating installation blocks (33) are fixedly arranged on opposite side walls of the first side plate (31) and the second side plate (32), movable grooves (34) are formed in the outer walls of the insulating installation blocks (33), conductive assemblies (35) are movably arranged in the movable grooves (34), detection boxes (36) are fixedly arranged on the side walls of the second side plate (32), and driving blocks (37) are fixedly arranged on the left sides of the insulating installation blocks (33) on the opposite side walls of the first side plate (31) and the second side plate (32).
3. The intelligent detection system for defective semiconductor devices according to claim 2, wherein: the conductive assembly (35) comprises a conductive metal plate (351) and a graphite plate (352) fixedly arranged on the outer wall of the conductive metal plate (351), four corners of the side wall of the conductive metal plate (351) away from the graphite plate (352) are fixedly provided with upright posts (353), and first springs (354) are sleeved on the outer wall of the upright posts (353) in a sliding mode.
4. The intelligent detection system for defective semiconductor devices according to claim 1, wherein: diode loading mechanism (4) are including loading seat (41) and fixed kicking block (42) that set up in loading seat (41) outer wall both sides and setting up standing groove (43) at loading seat (41) top, mounting groove (44) have all been seted up to standing groove (43) bottom both sides, inside through the pivot rotation of mounting groove (44) be provided with cleaning roller (45), pivot one end rotates and runs through mounting groove (44) and fixedly is provided with gear (46), regulation hole (47) have been seted up on the lateral wall around loading seat (41), inside slip of regulation hole (47) is provided with correction subassembly (48).
5. The intelligent detection system for defective semiconductor device according to claim 4, wherein: the correcting component (48) comprises a cross rod (481) and telescopic rods (482) fixedly arranged on two sides of the outer wall of the cross rod (481), a push rod (483) is fixedly arranged on the outer wall of the cross rod (481) and between the two telescopic rods (482), a second spring (484) is sleeved on the outer wall of the telescopic rod (482), and a stress block (485) is fixedly arranged on the outer wall of the cross rod (481) away from the push rod (483).
6. The intelligent detection system for defective semiconductor devices according to claim 1, wherein: the discharging mechanism (5) comprises a storage box (51), a bearing frame (52) fixedly sleeved on the outer wall of the storage box (51) and a square groove (53) formed in the outer wall of the storage box (51), and a material control assembly (54) is slidably arranged in the square groove (53).
7. The intelligent detection system for defective semiconductor device according to claim 6, wherein: the material control assembly (54) comprises a partition plate (541) and rotating seats (544) fixedly arranged on two sides of the outer wall of the partition plate (541), and a stop block (545) is arranged in the rotating seats (544) in a rotating mode.
8. The intelligent detection system for defective semiconductor device according to claim 7, wherein: a torsion spring is arranged between the stop block (545) and the rotating seat (544), sliding columns (542) are fixedly arranged on two sides of the partition plate (541) away from the side wall of the rotating seat (544), and a third spring (543) is sleeved on the outer wall of each sliding column (542).
9. The intelligent detection system for defective semiconductor devices according to claim 1, wherein: one end of the conduction detection mechanism (3) is connected with a first controller, one end of the controller is connected with an electric push rod I (6), the first controller comprises a processor I and a time relay I, the output end of the conduction detection mechanism (3) is connected with the input end of the processor I, and the time relay I and the electric push rod I are both connected with the processor I in a bidirectional mode.
10. The intelligent detection system for defective semiconductor devices according to claim 1, wherein: one end of the appearance detection mechanism (10) is connected with a second controller, the second controller comprises a second processor and a second time relay, the output end of the appearance detection mechanism (10) is connected with the input end of the second processor, the second processor is connected with the second time relay and the second electric push rod (11) in a bidirectional mode, and the output end of the CCD camera (9) is connected with the input end of the appearance detection mechanism (10).
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