CN116779562A - High-temperature-resistant high-safety high-power diode - Google Patents
High-temperature-resistant high-safety high-power diode Download PDFInfo
- Publication number
- CN116779562A CN116779562A CN202310866197.6A CN202310866197A CN116779562A CN 116779562 A CN116779562 A CN 116779562A CN 202310866197 A CN202310866197 A CN 202310866197A CN 116779562 A CN116779562 A CN 116779562A
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- China
- Prior art keywords
- diode
- cooling
- outer sealing
- sealing shell
- water pump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 43
- 238000001816 cooling Methods 0.000 claims abstract description 36
- 238000007789 sealing Methods 0.000 claims abstract description 27
- 239000000919 ceramic Substances 0.000 claims description 18
- 239000011521 glass Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 9
- 239000010425 asbestos Substances 0.000 claims description 8
- 229910052895 riebeckite Inorganic materials 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 2
- 239000000498 cooling water Substances 0.000 abstract description 16
- 230000000694 effects Effects 0.000 abstract description 9
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application discloses a high-temperature-resistant high-safety high-power diode which comprises a diode outer sealing shell, a cooling cavity sleeve shell, a water pump and a cooling water inlet pipe, wherein the cooling cavity sleeve shell is fixed outside the diode outer sealing shell, limiting blocks are symmetrically fixed at one end of the top of the cooling cavity sleeve shell, a mounting seat is arranged between the two limiting blocks, the top of the mounting seat is fixedly provided with the water pump, and the side part of the water pump is connected with the top of the cooling cavity sleeve shell through the cooling water inlet pipe. According to the application, the external power supply is connected, the water pump starts to work through the communicated control switch, cooled water enters the cooling cavity sleeve shell through the cooling water inlet pipe to start to cool the diode which generates heat in a transitional way, the cooled water flows out through the cooling water outlet pipe, and the cooled water reenters the water pump after cooling, so that the effect of cooling the diode is achieved, the use is convenient and quick, and the service life of the diode is prolonged to a certain extent.
Description
Technical Field
The application relates to the technical field of diodes, in particular to a high-temperature-resistant high-safety high-power diode.
Background
The diode is one of the earliest semiconductor devices, is mainly applied to various electronic circuits, reasonably connects components such as a diode, a resistor, a capacitor, an inductor and the like to form circuits with different functions, and can realize multiple functions such as rectification of alternating current, detection of modulated signals, amplitude limiting, clamping, voltage stabilization of power supply voltage and the like.
The high-temperature-resistant high-safety high-power diode disclosed in the Chinese patent application publication No. CN215069950U has the advantages that a vacuum area is isolated in a shell through a ceramic piston, meanwhile, the ceramic piston can also play a role in insulation protection, a vacuum isolating cavity is covered outside a glass transistor, the space inside the glass transistor and the external vacuum are in two independent space states, the inside of the transistor can conduct current, the vacuum can isolate the influence of heat of the external environment on the inside of the transistor, the current conduction can be avoided, the safety and the heat resistance of the structure are improved, meanwhile, a layer of asbestos gasket is additionally arranged on the basis of vacuum heat insulation, the heat transfer can be effectively blocked, but the probability of temperature rise cannot be completely eliminated due to the addition of heat insulation by the aid of materials, the diode is damaged, the problem of resource waste is caused, the service life of the diode is shortened, and the development is needed.
Disclosure of Invention
The application aims to provide a high-temperature-resistant high-safety high-power diode so as to solve the problems in the background technology.
In order to achieve the above purpose, the present application provides the following technical solutions: high-temperature-resistant high-safety high-power diode comprises a diode outer sealing shell, a cooling cavity sleeve shell, a water pump and a cooling water inlet pipe, wherein the cooling cavity sleeve shell is fixed on the outer portion of the diode outer sealing shell, limiting blocks are symmetrically fixed at one end of the top of the cooling cavity sleeve shell, a mounting seat is arranged between the two limiting blocks, the water pump is fixed at the top of the mounting seat, the side portion of the water pump is connected with the top of the cooling cavity sleeve shell through the cooling water inlet pipe, and the back of the water pump is connected with the bottom of the back of the cooling cavity sleeve shell through the cooling water outlet pipe.
Preferably, ceramic pistons are connected to two ends of the inside of the diode outer sealing shell, a vacuum separation cavity is formed in the inside of the diode outer sealing shell through the ceramic pistons, and asbestos cushions are connected between the top and the bottom of the inside of the diode outer sealing shell and the connection positions of the diode outer sealing shell and the top and the bottom of the ceramic pistons.
Preferably, a glass transistor is arranged in the diode outer sealing shell and fixed between the two ceramic pistons, and the positive terminal and the negative terminal are respectively connected in the two ends of the diode outer sealing shell.
Preferably, resin ferrules are arranged in the two ends of the diode outer sealing shell and between the two ends of the diode outer sealing shell and the connection parts of the diode outer sealing shell and the end parts of the positive electrode terminal and the negative electrode terminal.
Preferably, metal leads are arranged in the glass transistor in a penetrating manner in the glass transistor, and the metal leads are arranged in the glass transistor in the positive electrode end and the negative electrode end.
Preferably, sliding blocks are arranged in the limiting blocks in a sliding mode, clamping pieces are arranged on the side portions of the sliding blocks and on the inner sides of the two limiting blocks, and the side portions of the sliding blocks are connected with the inner sides of the limiting blocks through elastic pieces.
Preferably, the two sides of the mounting seat are internally connected with clamping grooves.
Compared with the prior art, the application has the beneficial effects that:
(1) According to the high-temperature-resistant high-safety high-power diode, the external power supply is connected, the water pump starts to work through the communicated control switch, cooled water enters the cooling cavity sleeve shell through the cooling water inlet pipe to cool the diode which generates heat in a transitional mode, the cooled water flows out through the cooling water outlet pipe, and the cooled water reenters the water pump after being cooled, so that the effect of cooling the diode is achieved, the use is convenient and quick, and the service life of the diode is prolonged to a certain extent;
(2) The high-temperature-resistant high-safety high-power diode can be clamped with the clamping groove all the time through the sliding connection effect of the sliding block and the limiting blocks and the cooperation of the elastic piece, so that the mounting seat is convenient to clamp, the water pump is stably fixed between the two limiting blocks, and the water pump can be conveniently detached for maintenance or replacement in the later period;
(3) The high-safety high-power diode with high temperature resistance has the advantages that the ceramic piston is utilized to play an insulating protection role, the metal lead wire is matched in the glass transistor to conduct current, the asbestos cushion layer can effectively block heat transfer, and the safety and heat resistance of the whole diode structure are improved.
Drawings
FIG. 1 is a schematic elevational view of the present application;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1A according to the present application;
FIG. 3 is a schematic diagram showing the side view of the connection of the diode outer seal housing of the present application with the positive terminal, the negative terminal, the resin ferrule and the cooling cavity housing;
FIG. 4 is a schematic top view of the present application;
FIG. 5 is a schematic diagram of a split structure of a water pump and two limiting blocks according to the present application;
fig. 6 is a schematic diagram of a connection structure between a glass transistor and a metal lead according to the present application.
In the figure: 1. a diode outer seal housing; 2. a ceramic piston; 3. a vacuum isolation chamber; 4. an asbestos cushion; 5. a glass transistor; 6. a positive terminal; 7. a negative terminal; 8. a resin ferrule; 9. a metal lead; 10. cooling the cavity sleeve shell; 11. a limiting block; 12. a clamping piece; 1201. a sliding block; 13. a mounting base; 1301. a clamping groove; 14. a water pump; 15. cooling the water inlet pipe; 16. an elastic member; 17. and cooling the water outlet pipe.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
Referring to fig. 1-6, an embodiment of the present application is provided: the high-temperature-resistant high-safety high-power diode comprises a diode outer sealing shell 1, a cooling cavity sleeve shell 10, a water pump 14 and a cooling water inlet pipe 15, wherein the cooling cavity sleeve shell 10 is fixed on the outer portion of the diode outer sealing shell 1, limiting blocks 11 are symmetrically fixed at one end of the top of the cooling cavity sleeve shell 10, a mounting seat 13 is arranged between the two limiting blocks 11, the water pump 14 is fixed at the top of the mounting seat 13, the side part of the water pump 14 is connected with the top of the cooling cavity sleeve shell 10 through the cooling water inlet pipe 15, the back of the water pump 14 is connected with the bottom of the back of the cooling cavity sleeve shell 10 through the cooling water outlet pipe 17, the water pump 14 starts to work, cooled water enters the cooling cavity sleeve shell 10 through the cooling water inlet pipe 15 to cool down for the diode which generates heat in a transition mode, and the cooled water flows out through the cooling water outlet pipe 17 and reenters the water pump 14 after cooling, so that the effect of cooling the diode is achieved.
The diode outer seal shell 1 is characterized in that ceramic pistons 2 are connected to two ends of the inside of the diode outer seal shell 1, a vacuum separation cavity 3 is formed in the inside of the diode outer seal shell 1 through the ceramic pistons 2, and asbestos cushions 4 are connected between the top and the bottom of the inside of the diode outer seal shell 1 and the connection positions of the diode outer seal shell 1 and the top and the bottom of the ceramic pistons 2.
The inside of diode outer seal casing 1 just is fixed in the middle of two ceramic pistons 2 and has glass transistor 5, be connected with anodal end 6 and negative pole end 7 in the both ends of diode outer seal casing 1 respectively, utilize ceramic piston 2 to play insulating protection's effect, the inside cooperation metal lead 9 of glass transistor 5 can carry out the conduction of electric current, and the heat transfer can be effectually blocked in the setting of asbestos bed course 4.
A resin ferrule 8 is arranged in the two ends of the diode outer sealing shell 1 and between the two ends of the diode outer sealing shell and the end connection parts of the anode end 6 and the cathode end 7.
Metal leads 9 are arranged in the glass transistor 5 in a penetrating manner at the two ends and the positive electrode end 6 and the negative electrode end 7.
The inside slip of stopper 11 is equipped with slider 1201, the lateral part of slider 1201 just locates the inboard of two stoppers 11 and has fastener 12, the lateral part of slider 1201 realizes being connected with stopper 11 inboard through elastic component 16, and slider 1201 and stopper 11 sliding connection's effect and cooperation elastic component 16 realize can be all the time with the joint of card solid groove 1301, be convenient for play the clamping effect to mount pad 13.
The clamping grooves 1301 are formed in the two sides of the mounting seat 13, and the water pump 14 is stably fixed between the two limiting blocks 11, so that the water pump 14 can be conveniently detached for maintenance or replacement in the later period.
When the embodiment of the application is used, the following steps are adopted: the ceramic piston 2 is utilized to play an insulating protection role, the metal lead 9 is matched in the glass transistor 5 to conduct current, the asbestos cushion 4 can effectively block heat transfer, the safety and heat resistance of the whole diode structure are improved, an external power supply is connected, the water pump 14 starts to work through a communicated control switch, cooled water enters the cooling cavity sleeve shell 10 through the cooling water inlet pipe 15 to start to cool the diode which generates heat in a transitional mode, cooled water flows out through the cooling water outlet pipe 17 and then enters the water pump 14 again, the effect of cooling the diode is achieved, the sliding block 1201 and the limiting blocks 11 are in sliding connection, and the clamping and fixing effect on the mounting seat 13 is achieved through the elastic piece 16, so that the water pump 14 is stably fixed between the two limiting blocks 11, and the water pump 14 is convenient to disassemble for maintenance or replacement in later period.
Claims (7)
1. High-temperature-resistant high-safety high-power diode, a serial communication port, including diode external seal casing (1), cooling cavity cover casing (10), water pump (14) and cooling inlet tube (15), the outside of diode external seal casing (1) is fixed with cooling cavity cover casing (10), the one end symmetry at cooling cavity cover casing (10) top is fixed with stopper (11), and is equipped with mount pad (13) in the middle of two stopper (11), the top of mount pad (13) is fixed with water pump (14), the lateral part of water pump (14) is realized being connected with the top of cooling cavity cover casing (10) through cooling inlet tube (15), the back of water pump (14) is realized being connected with the bottom at cooling cavity cover casing (10) back through cooling outlet pipe (17).
2. The high temperature resistant high safety high power diode of claim 1, wherein: the diode outer sealing shell is characterized in that ceramic pistons (2) are connected to two ends of the inside of the diode outer sealing shell (1), vacuum isolation cavities (3) are formed in the inside of the diode outer sealing shell (1) through the ceramic pistons (2), and asbestos cushions (4) are connected between the top and the bottom of the inside of the diode outer sealing shell (1) and the connection positions of the diode outer sealing shell (1) and the top and the bottom of the ceramic pistons (2).
3. The high temperature resistant high safety high power diode of claim 2, wherein: the diode outer sealing shell (1) is internally fixed in the middle of the two ceramic pistons (2) and is provided with a glass transistor (5), and the two ends of the diode outer sealing shell (1) are respectively connected with an anode end (6) and a cathode end (7).
4. A high temperature resistant high safety high power diode as claimed in claim 3, wherein: resin ferrules (8) are arranged in the two ends of the diode outer sealing shell (1) and between the two ends of the diode outer sealing shell and the connection parts of the diode outer sealing shell and the end parts of the anode end (6) and the cathode end (7).
5. A high temperature resistant high safety high power diode as claimed in claim 3, wherein: and metal leads (9) are arranged in the glass transistor (5) in a penetrating manner in the positive electrode end (6) and the negative electrode end (7) at both ends.
6. The high temperature resistant high safety high power diode of claim 1, wherein: the inside slip of stopper (11) is equipped with sliding block (1201), the lateral part of sliding block (1201) just locates the inboard of two stoppers (11) and has fastener (12), the lateral part of sliding block (1201) is realized being connected with stopper (11) inboard through elastic component (16).
7. The high temperature resistant high safety high power diode of claim 1, wherein: clamping grooves (1301) are formed in two sides of the mounting seat (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310866197.6A CN116779562A (en) | 2023-07-14 | 2023-07-14 | High-temperature-resistant high-safety high-power diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310866197.6A CN116779562A (en) | 2023-07-14 | 2023-07-14 | High-temperature-resistant high-safety high-power diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116779562A true CN116779562A (en) | 2023-09-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310866197.6A Pending CN116779562A (en) | 2023-07-14 | 2023-07-14 | High-temperature-resistant high-safety high-power diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116779562A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN212782853U (en) * | 2020-07-24 | 2021-03-23 | 廊坊沈新电线电缆有限公司 | Cable manufacture cooling device |
| CN214558073U (en) * | 2020-12-23 | 2021-11-02 | 芜湖德纳美半导体有限公司 | Diode vacuum welding rapid cooling setting device |
| CN215069950U (en) * | 2021-07-14 | 2021-12-07 | 江苏佑风微电子有限公司 | High-temperature-resistant diode |
| WO2022000900A1 (en) * | 2020-07-03 | 2022-01-06 | 苏州众创阳光贸易有限公司 | Vacuum pump base convenient to install |
| CN115788831A (en) * | 2022-12-01 | 2023-03-14 | 江西艾威尔压缩机有限公司 | Air compressor machine pipeline rapid cooling mechanism |
-
2023
- 2023-07-14 CN CN202310866197.6A patent/CN116779562A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022000900A1 (en) * | 2020-07-03 | 2022-01-06 | 苏州众创阳光贸易有限公司 | Vacuum pump base convenient to install |
| CN212782853U (en) * | 2020-07-24 | 2021-03-23 | 廊坊沈新电线电缆有限公司 | Cable manufacture cooling device |
| CN214558073U (en) * | 2020-12-23 | 2021-11-02 | 芜湖德纳美半导体有限公司 | Diode vacuum welding rapid cooling setting device |
| CN215069950U (en) * | 2021-07-14 | 2021-12-07 | 江苏佑风微电子有限公司 | High-temperature-resistant diode |
| CN115788831A (en) * | 2022-12-01 | 2023-03-14 | 江西艾威尔压缩机有限公司 | Air compressor machine pipeline rapid cooling mechanism |
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