CN116716459A - Surface flatness improvement method for etching type heat dissipation alloy strip - Google Patents
Surface flatness improvement method for etching type heat dissipation alloy strip Download PDFInfo
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- CN116716459A CN116716459A CN202310617163.3A CN202310617163A CN116716459A CN 116716459 A CN116716459 A CN 116716459A CN 202310617163 A CN202310617163 A CN 202310617163A CN 116716459 A CN116716459 A CN 116716459A
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 124
- 239000000956 alloy Substances 0.000 title claims abstract description 124
- 238000000034 method Methods 0.000 title claims abstract description 74
- 238000005530 etching Methods 0.000 title claims abstract description 61
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 52
- 238000011282 treatment Methods 0.000 claims abstract description 68
- 238000000137 annealing Methods 0.000 claims abstract description 34
- 238000010008 shearing Methods 0.000 claims description 15
- 238000003892 spreading Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 26
- 230000000694 effects Effects 0.000 description 17
- 238000012545 processing Methods 0.000 description 9
- 238000005452 bending Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- 238000001953 recrystallisation Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000007655 standard test method Methods 0.000 description 2
- 230000001502 supplementing effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D1/00—Straightening, restoring form or removing local distortions of sheet metal or specific articles made therefrom; Stretching sheet metal combined with rolling
- B21D1/02—Straightening, restoring form or removing local distortions of sheet metal or specific articles made therefrom; Stretching sheet metal combined with rolling by rollers
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D7/00—Modifying the physical properties of iron or steel by deformation
- C21D7/13—Modifying the physical properties of iron or steel by deformation by hot working
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- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
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- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Straightening Metal Sheet-Like Bodies (AREA)
Abstract
The application relates to a surface flatness improvement method of an etching type heat dissipation alloy strip, which comprises the following steps: sequentially carrying out first leveling treatment and second leveling treatment on the etched heat-dissipating alloy strip; wherein the first leveling process includes: stacking a plurality of etching type heat dissipation alloy strips into etching type heat dissipation alloy strip groups, applying 20kg-500kg of compressive stress to the etching type heat dissipation alloy strip groups at the annealing temperature of 100-400 ℃ and keeping for 1-5 h so as to perform first leveling treatment on the etching type heat dissipation alloy strips; the second leveling process includes: allowing the etched heat-dissipating alloy strip subjected to the first leveling treatment to pass through a leveling device for a plurality of times at a speed of 5-30 m/min, so as to perform a second leveling treatment on the etched heat-dissipating alloy strip; the leveling device includes: a plurality of pairs of leveling rollers. The surface flatness improving method can fully meet the index requirement and the stability requirement of the flatness of the etching type heat-dissipating alloy strip through the first leveling treatment and the second leveling treatment.
Description
Technical Field
The application relates to the technical field of nonferrous metal smelting and processing, in particular to a method for improving the surface flatness of an etching type heat dissipation alloy strip.
Background
Along with the continuous development of micro-electronic devices such as smart phones and the like towards ultra-thin and high-performance, the energy consumption of electronic elements in the micro-electronic devices is also increased, and heat generated in operation is easy to rapidly accumulate to form high temperature, so that the performance, reliability and service life of the electronic devices are directly affected; therefore, the heat dissipation performance of the heat dissipation module in the microelectronic device is very important, and the heat dissipation material used in the heat dissipation module mainly takes copper alloy strips or aluminum alloy strips and is mostly made into a plate shape, a sheet shape, a multi-sheet shape and the like by adopting an etching processing mode; in order to ensure good heat dissipation effect, the etched heat dissipation copper sheet and aluminum sheet are required to have high surface flatness, so that high fit between heat sources such as CPU chips and the heat dissipation sheet is realized, the contact surface is stable, and the problem of local overheating of heating electronic elements is solved, and in general, the etching manufacturer requires that the surface flatness of the heat dissipation alloy strip is less than 0.1mm, and the surface flatness of the etched surface is less than 0.05mm.
At present, the method for maintaining the surface flatness of the etched heat-dissipating alloy strip mainly comprises the following steps: (1) carrying out on-line stress relief annealing treatment on the etching type heat dissipation alloy strip, and releasing the processing internal stress inside the etching type heat dissipation alloy strip by adjusting parameters such as annealing temperature, annealing speed, tension and the like so as to improve the surface flatness of the etching type heat dissipation alloy strip; (2) leveling and annealing the etching type heat-dissipating alloy strip by using a specific leveling and annealing device, wherein after the etching type heat-dissipating alloy strip is softened at a high temperature, pressing blocks are used for applying pressure in the vertical direction to the etching type heat-dissipating alloy strip so as to correct and improve the surface flatness of the etching type heat-dissipating alloy strip;
for example: patent CN115287495A discloses a copper alloy strip for half-etched lead frame and a preparation method thereof, wherein the annealing temperature is adjusted to 470-520 ℃, the annealing speed is adjusted to 70-90m/min, and the straightening tension is adjusted to 200N/mm 2 -300N/mm 2 So that the plate shape degree of the copper alloy strip is not higher than 3I, and the warp degree of the lead frame after half etching is not higher than 0.10mm; however, the equipment investment is high, and it is difficult to ensure that all the processing internal stress is released, and the residual processing internal stress still causes poor surface flatness, so that the surface flatness is unstable.
Also for example: patent CN111500843a discloses a leveling annealing tool and process for a metal substrate for electronic packaging, and the etching type heat-dissipating alloy strip is kept at 800 ℃ for 1 hour through a specific leveling annealing tool, so as to achieve a good leveling effect; however, the annealing temperature is higher than the recrystallization temperature, which affects the structure and performance of the material, and is unfavorable for the use of the heat-dissipating strip.
Therefore, there is a need for a method for improving the surface flatness of etched heat sink alloy strips.
Disclosure of Invention
The application aims to overcome the defects in the prior art and provides a method for improving the surface flatness of an etching type heat dissipation alloy strip.
In order to achieve the above purpose, the technical scheme adopted by the application is as follows:
a first aspect of the present application provides a method for improving surface flatness of an etching type heat dissipation alloy strip, comprising:
sequentially carrying out first leveling treatment and second leveling treatment on the etched heat-dissipating alloy strip; wherein,,
the first leveling process includes: stacking a plurality of etching type heat dissipation alloy strips into etching type heat dissipation alloy strip groups, applying 20kg-500kg of compressive stress to the etching type heat dissipation alloy strip groups at the annealing temperature of 100-400 ℃ and keeping for 1-5 h so as to perform first leveling treatment on the etching type heat dissipation alloy strips;
the second leveling process includes: passing the etched heat-dissipating alloy strip subjected to the first leveling treatment through a leveling device several times at a speed of 5-30 m/min to perform a second leveling treatment on the etched heat-dissipating alloy strip;
the leveling device includes: a plurality of pairs of leveling rollers.
The surface flatness of the alloy strip is mainly related to the shape and residual stress of the alloy strip, the shape defect determines the macroscopic flatness defect, such as lateral bending, and the residual stress after processing determines the microscopic flatness defect, such as slight deformation and low flatness, so that the processing precision requirement cannot be met; in general, the shape of an alloy coiled material can be ensured through two working procedures of coiled material stress relief annealing and online stretch bending straightening, and the shape can be generally within 10I, but the high-requirement surface evenness of an alloy strip is far from enough; on the premise of performing conventional plate shape control, the application adds the first leveling treatment and the second leveling treatment to jointly improve the surface flatness of the alloy strip.
The first leveling treatment is a thermal leveling mode, and the material is heated to a temperature below the recrystallization temperature, so that the effect of low-temperature stress relief is achieved, recrystallization does not occur, the structure and the performance of the material are affected, and meanwhile, a certain compressive stress is applied, so that each part of the material is selectively extended, and the surface leveling of the material is promoted; therefore, the control of the annealing temperature, the annealing time and the compressive stress in the first leveling treatment is very important, and when the annealing temperature is too high and the annealing time is too long, the material is easy to recover and recrystallize, so that the structure and the performance of the material are changed, the hardness and the strength are reduced, the material is soft, and the use requirement is difficult to meet; when the annealing temperature is too low and the annealing time is too short, the recovery distortion caused by annealing is insufficient, the effect of eliminating internal stress is difficult to play, and the flatness improvement is not obvious.
Preferably, the method further comprises: and carrying out stress relief annealing treatment, stretching straightening treatment and shearing treatment on the etched heat dissipation alloy strip in sequence, and then carrying out first leveling treatment.
Preferably, in the stress relief annealing treatment, the first annealing temperature is 100 ℃ to 400 ℃.
Preferably, in the stress relief annealing treatment, the first annealing time is 2h to 5h.
Preferably, in the stretch straightening process, the unit tension is 10N/mm 2 -50N/mm 2 。
Preferably, in the stretch straightening process, the speed is from 10m/min to 100m/min.
Preferably, the shearing treatment comprises: and (3) longitudinal shearing treatment or/and transverse shearing treatment.
Preferably, in the slitting process, the width is 50mm to 500mm.
Preferably, in the shearing process, the length is 50mm to 500mm.
Preferably, in the first leveling treatment, the annealing temperature is 200 ℃ to 400 ℃.
Preferably, in the first leveling treatment, a ratio (F/t ') of the compressive stress (F) applied to the etched heat sink alloy strip group to a stacking thickness (t') of the etched heat sink alloy strip group is not lower than 0.5kg/mm and not higher than 4.0kg/mm.
The compressive stress with a certain magnitude is beneficial to selectively extending all parts of the material and promoting the surface of the material to be flat, but when the compressive stress is annealed and leveled in a stacking mode, the thickness of the material stack has a certain influence on the extending effect of the compressive stress; when the ratio (F/t ') of the compressive stress (F) to the stacking thickness (t') of the etched heat dissipating strip group is lower than 0.5kg/mm, the overall compressive stress does not reach the yield limit of the heat dissipating strip group, the effect of extension deformation is difficult to take place, and the flatness improvement effect is not obvious; when the ratio (F/t ') of the compressive stress (F) to the stacking thickness (t') of the etched heat dissipating strip group is higher than 4.0kg/mm, the overall compressive stress to which the heat dissipating strip group is subjected easily exceeds the yield limit, thereby generating serious negative deformation and greatly affecting the flatness of the strips; thus, the ratio (F/t ') of the compressive stress (F) applied by the etched heat dissipating alloy strip group to the stacking thickness (t') of the etched heat dissipating alloy strip group in the present application is not lower than 0.5kg/mm and not higher than 4.0kg/mm.
Preferably, in the first leveling process, the compressive stress is 50kg to 200kg.
Preferably, in the first leveling process, the holding time is 3h to 4.5h.
Preferably, in the second leveling process, the leveling device includes: at least 21 pairs of leveling rollers.
Preferably, in the second leveling treatment, a roller diameter of the leveling roller is not more than 30mm.
The second leveling treatment is a cold leveling mode, materials are circularly and reciprocally bent up and down through a plurality of pairs of leveling rollers which are staggered up and down with smaller curvature radius to generate plastic reverse deformation, and the surfaces of the materials are restored to a flat state by means of elastic recovery, so that the leveling rollers in the cold leveling process have high requirements, and the number of the leveling rollers and the roller diameter of the leveling rollers determine the effect of up and down bending leveling; when the number of the leveling rollers is too small, the material is easy to bend up and down for a small number of times, the plastic deformation is uneven, and the surface flatness improvement effect is not obvious; when the number of the leveling rollers is too large, the leveling process is complex to control, and the multiple rollers are contacted, so that the surface quality of the material is not facilitated, and the surface scratch risk is easily increased.
In addition, when the diameter of the leveling roller is too large, the material is easy to be bent up and down in the leveling process, and the surface flatness is not facilitated; when the leveling roller diameter is too small, the curvature radius of the up-and-down bending deformation is too small, and the leveling effect is not obvious, so that the number of the leveling rollers and the roller diameter are very important.
Preferably, in the second leveling process, the etched heat-dissipating alloy strip is passed through the leveling device a number of times of 2 to 12.
The number of second leveling treatments directly affects the surface flatness of the leveled piece and the uniformity thereof, i.e., the machining process index; the sheet material contains multiple groups of dimension directions such as parallel rolling direction and vertical rolling direction, front and back directions of a plane, and besides, inlet side and outlet side of leveling processing and the like due to processing; the uniformity of the surface flatness is required to be realized, and the material is required to be subjected to multi-roller cyclic reciprocating extension deformation in all directions; when the number of passes through the leveling device is less than 2, it is difficult to ensure uniformity of at least one set of dimension directions of the leveling member, which is disadvantageous for improvement of surface flatness; when the number of times of passing through the leveling device is more than 12, the more the number of times of leveling is, the more the surface quality of the material is not facilitated, and the surface scratch risk is easily increased; thus, the etched heat-spreading alloy strip of the present application is passed through the leveling device a number of times ranging from 2 to 12.
Preferably, in the second leveling process, a roll gap between the leveling rolls through which the etching type heat sink alloy strip passes each time is not lower than a roll gap between the corresponding leveling rolls through which the etching type heat sink alloy strip passes last time.
Preferably, in the second leveling process, a ratio (l/t) of a roll gap (l) between a first pair of the leveling rolls to a thickness (t) of the etching type heat sink alloy strip is not lower than-11.5 and not higher than-5.5.
Preferably, in the second leveling process, a ratio (l/t) of a roll gap (l) between a final pair of the leveling rolls to a thickness (t) of the etching type heat radiation alloy strip is not lower than-4 and not higher than-0.5.
The key point of the second leveling treatment is that the leveling piece must exceed the yield point when bending and deforming, and the gap between the upper and lower staggered leveling roller sets directly determines the leveling force applied to the leveling piece; therefore, the gap between the leveling roller groups is a core factor for determining the leveling effect, the leveling of the etched heat-dissipating alloy strip requires the roll gap between the leveling rollers passing through each time to be in an increasing trend, so that the bending moment is ensured to be gradually reduced, and the overall flatness of the surface is improved; under the general condition, the roll gap between the first pair of leveling rollers can ensure that the internal load on the material can lead the specific part of the section to start flowing comprehensively, thereby playing a role in large-range bending deformation, and the roll gap between the last pair of leveling rollers can require local flowing, thereby playing a role in supplementing deformation; meanwhile, the thickness and the shape of the material are directly related to the size setting of the roll gap; when the ratio (l/t) of the roll gap (l) between the first pair of leveling rolls to the thickness (t) of the etched heat-dissipating alloy strip exceeds the range of-11.5 to-5.5 and is higher than-5.5, the leveling effect is not obvious; when the temperature is lower than-11.5, negative deformation occurs on the surface of the material, which is unfavorable for the flatness improvement effect; when the ratio (l/t) of the roll gap (l) between the last pair of leveling rolls and the thickness (t) of the etched heat-dissipating alloy strip exceeds the range of-4 to-0.5 and is higher than-0.5, the effect of supplementing deformation is not achieved; below-4, the flatness effect is lost at the outlet.
Further, in the second leveling process, the number of times the etched heat-radiating alloy strip passes through the leveling device is 6; when the etching type heat dissipation alloy strip passes through the leveling device twice before passing through the leveling device, the ratio (l/t) of the roll gap (l) between the first pair of leveling rollers to the thickness (t) of the etching type heat dissipation alloy strip is not lower than-11.5 and not higher than-9.5, and the ratio (l/t) of the roll gap (l) between the last pair of leveling rollers to the thickness (t) of the etching type heat dissipation alloy strip is not lower than-4 and not higher than-2.5; when the etching type heat dissipation alloy strip passes through the leveling device twice in the middle, the ratio (l/t) of the roll gap (l) between the first pair of leveling rollers to the thickness (t) of the etching type heat dissipation alloy strip is not lower than-9.5 and not higher than-7.5, and the ratio (l/t) of the roll gap (l) between the last pair of leveling rollers to the thickness (t) of the etching type heat dissipation alloy strip is not lower than-2.5 and not higher than-1.0; when the etched heat-dissipating alloy strip passes through the leveling device twice after passing through the leveling device, the ratio (l/t) of the roll gap (l) between the first pair of leveling rolls to the thickness (t) of the etched heat-dissipating alloy strip is not lower than-7.0 and not higher than-5.5, and the ratio (l/t) of the roll gap (l) between the last pair of leveling rolls to the thickness (t) of the etched heat-dissipating alloy strip is not lower than-2.0 and not higher than-0.5.
Preferably, pairs of said levelling rolls of said levelling means define a first direction; in the second leveling process, the etched heat-dissipating alloy strip enters the leveling device in a direction parallel to the first direction; or/and, in the second leveling process, the etched heat-dissipating alloy strip enters the leveling device in a direction intersecting the first direction.
Preferably, each pair of the leveling rollers of the leveling device includes: a first leveling roller positioned at the lower side and a second leveling roller positioned at the upper side; the etched heat-dissipating alloy strip has a first surface and a second surface opposite the first surface; in the second leveling process, the first surface and the second surface alternately act as surfaces of the etched heat-sink alloy strip that are adjacent to the first leveling roller when entering the leveling device.
In order to ensure the flatness improving effect and obtain good flatness stability, materials are required to enter the leveling device from different sets of dimension directions in sequence, and the roll gap when each set of dimension directions enter the leveling device accords with the principle that the leveling roll gap is gradually increased, so that the uniformity and comprehensiveness of the bending deformation of repeated and reciprocating in the repeated leveling process are ensured. Therefore, the application designs the leveling device which is sequentially overlapped from multiple groups of dimension directions.
A second aspect of the present application is to provide an etched heat sink alloy strip produced by the surface flatness improvement method as described above.
Preferably, the residual stress of the etched heat-dissipating alloy strip is not higher than 35Mpa.
Preferably, the standard deviation of the residual stress of the etched heat sink alloy strip is not higher than 10Mpa.
Preferably, the flatness of the etched heat sink alloy strip is less than 0.1mm.
Preferably, the etching-type heat sink alloy strip has a process capability index higher than 1.33.
Compared with the prior art, the application has the following technical effects:
the surface flatness improving method provided by the application can fully meet the index requirement and the stability requirement of flatness of the etching type heat-dissipating alloy strip through the first leveling treatment and the second leveling treatment, and does not need to additionally input high-cost equipment.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other.
The application will be further illustrated, but is not limited, by the following examples.
Examples
The embodiment provides a surface flatness improvement method for an etching type heat dissipation alloy strip, which comprises the following steps:
sequentially carrying out stress relief annealing treatment, stretching straightening treatment, shearing treatment, first leveling treatment, second leveling treatment and surface cleaning treatment on the etched heat-radiating alloy strip; wherein,,
the parameters of the stress relief annealing treatment comprise: a first annealing temperature and a first annealing time;
the parameters of the stretch straightening process include: unit tension and speed;
the shearing process includes: performing longitudinal shearing treatment and transverse shearing treatment;
the first leveling process includes: stacking a plurality of etching type heat dissipation alloy strips into etching type heat dissipation alloy strip groups, and then applying compressive stress to the etching type heat dissipation alloy strip groups at an annealing temperature for a certain time to perform first leveling treatment on the etching type heat dissipation alloy strips;
the second leveling process includes: passing the etched heat-dissipating alloy strip subjected to the first leveling treatment through a leveling device several times at a certain speed to perform a second leveling treatment on the etched heat-dissipating alloy strip;
the parameters of the second leveling process further include: the leveling device comprises a pair of leveling rollers, a roller diameter of the leveling rollers, a ratio (l/t) of a roller gap (l) between a first pair of the leveling rollers to the thickness (t) of the etching type heat-dissipating alloy strip, a ratio (l/t) of a roller gap (l) between a last pair of the leveling rollers to the thickness (t) of the etching type heat-dissipating alloy strip, a direction of the etching type heat-dissipating alloy strip entering the leveling device, and a surface, close to the first leveling roller, of the etching type heat-dissipating alloy strip entering the leveling device.
Those skilled in the art will appreciate that the stretch straightening process and the shear process described herein are conventional in the art and do not require additional definition.
It should be noted that stacking in the present application means that one of the etching type heat dissipation alloy strips is stacked on the other etching type heat dissipation alloy strip, and the overlapping rate between two adjacent etching type heat dissipation alloy strips is not less than 99.5%.
In a preferred embodiment, the leveling device in the present application is a high precision leveling device, but it will be understood by those skilled in the art that the pairs of leveling rollers in the present application are not only provided by the high precision leveling device.
The high-precision leveling device comprises a plurality of pairs of leveling rollers which are staggered up and down, and when the metal strip is conveyed between the pairs of leveling rollers, the metal strip is alternately bent for a plurality of times through the deformation degree which is continuously reduced so as to remove the internal stress of the metal strip, and further, the good surface flatness is obtained; when a pair of leveling rollers are tangent to the same horizontal line, the roller gap between the pair of leveling rollers is 0; as such, one skilled in the art will appreciate that when any one of the pair of leveling rollers should have a horizontal tangent line, the roll gap between the pair of leveling rollers is below 0 if the other leveling roller intersects the horizontal tangent line. As an example, in the i-th second leveling process, the etched heat-radiating alloy strip enters the leveling device in a direction parallel to the first direction, and the first surface of the etched heat-radiating alloy strip is disposed close to the first leveling roller; in the (i+1) -th second leveling process, the etched heat-dissipating alloy strip enters the leveling device in a direction parallel to the first direction, and a second surface of the etched heat-dissipating alloy strip is disposed close to a first leveling roller; in the j-th second leveling process, the etched heat-dissipating alloy strip enters the leveling device in a direction perpendicular to the first direction, and a first surface of the etched heat-dissipating alloy strip is disposed close to a first leveling roller; in the j+1th second leveling process, the etched heat-dissipating alloy strip enters the leveling device in a direction perpendicular to the first direction, and the second surface of the etched heat-dissipating alloy strip is disposed close to the first leveling roller.
Examples 1 to 7
Examples 1-7 only differ in the parameters, as shown in the following table:
the relationship in the above table refers to the relationship between the direction in which the etched heat-dissipating alloy strip enters the leveling roller and the directions defined by the pairs of leveling rollers in each second leveling process; the surface refers to the surface of the etched heat-dissipating alloy strip that is adjacent to the first leveling roller when it enters the leveling device in each second leveling process, wherein the surface is designated as forward if it is an etched surface and as reverse if it is a surface opposite the etched surface.
Comparative example
This comparative example provides another method for improving the surface flatness of an etched heat sink alloy strip, comprising:
and sequentially carrying out tension annealing treatment, stretching straightening treatment and shearing treatment on the etched heat-dissipating alloy strip.
Comparative examples 1 to 2
Comparative examples 1-2 only differ in the parameters, as shown in the following table:
detection examples
Examples 1-7 and comparative examples 1-2 were tested, and the test contents and test methods were as follows:
detecting residual stress of the etching type heat dissipation alloy strip according to ASTM E1426-2014 Standard Test Method for Determing the X-RayElastic Constants for Use in the Measurement of Residual Stress using X-RayDiffracte;
taking a sample of 50mm multiplied by 50mm on the etched heat dissipation alloy strip, randomly taking 20 points on the sample, detecting residual stress according to ASTM E1426-2014 Standard Test Method for Determing the X-Ray Elastic Constants for Usein the Measurement of Residual Stress using X-Ray diffractation, and counting standard deviation;
randomly taking 4 multiplied by 4 grids on the etching type heat dissipation alloy strip, detecting flatness according to CN202310329999.3, and counting process capability indexes;
the test results are shown in the following table:
as can be seen from the table, the surface flatness improvement method provided by the application has the advantages that the residual stress of the obtained etching type heat-dissipating alloy strip is not higher than 35Mpa, the standard deviation of the residual stress is not higher than 10Mpa, the flatness is lower than 0.1mm, the process capability index is higher than 1.33 through the first leveling treatment and the second leveling treatment, and the index requirement and the stability requirement of the flatness of the etching type heat-dissipating alloy strip are fully met.
In summary, the surface flatness improving method of the present application not only can fully satisfy the index requirement and stability requirement of flatness of the etching type heat dissipation alloy strip through the first leveling treatment and the second leveling treatment, but also does not need to input extra high-cost equipment.
The foregoing description is only illustrative of the preferred embodiments of the present application and is not to be construed as limiting the scope of the application, and it will be appreciated by those skilled in the art that equivalent substitutions and obvious variations may be made using the teachings of the present application, which are intended to be included within the scope of the application.
Claims (10)
1. A method for improving the surface flatness of an etched heat-dissipating alloy strip, comprising:
sequentially carrying out first leveling treatment and second leveling treatment on the etched heat-dissipating alloy strip; wherein,,
the first leveling process includes: stacking a plurality of etching type heat dissipation alloy strips into etching type heat dissipation alloy strip groups, applying 20kg-500kg of compressive stress to the etching type heat dissipation alloy strip groups at the annealing temperature of 100-400 ℃ and keeping for 1-5 h so as to perform first leveling treatment on the etching type heat dissipation alloy strips;
the second leveling process includes: passing the etched heat-dissipating alloy strip subjected to the first leveling treatment through a leveling device several times at a speed of 5-30 m/min to perform a second leveling treatment on the etched heat-dissipating alloy strip;
the leveling device includes: a plurality of pairs of leveling rollers.
2. The surface evenness improving method according to claim 1, characterized by further comprising:
and carrying out stress relief annealing treatment, stretching straightening treatment and shearing treatment on the etched heat dissipation alloy strip in sequence, and then carrying out first leveling treatment.
3. The surface flatness improvement method according to claim 2, characterized in that in the stretch straightening process, the unit tension is 10N/mm 2 -50N/mm 2 The speed is 10m/min-100m/min.
4. The surface flatness improvement method according to claim 2, characterized in that the shearing treatment includes: performing longitudinal shearing treatment or/and transverse shearing treatment; in the slitting treatment, the width is 50mm-500mm; in the cross shearing process, the length is 50mm-500mm.
5. The surface flatness improvement method according to claim 1, characterized in that in the first leveling treatment, a ratio of the compressive stress applied to the etched heat radiating alloy strip group to a stacking thickness of the etched heat radiating strip group is not lower than 0.5kg/mm and not higher than 4.0kg/mm.
6. The surface evenness improving method according to claim 1, wherein in the second leveling treatment, the leveling device includes: at least 21 pairs of leveling rollers; the roller diameter of the leveling roller is not higher than 30mm; the number of times that the etching type heat dissipation alloy strip passes through the leveling device is 2-12; and the roll gap between the leveling rollers through which the etching type heat dissipation alloy strip passes each time is not lower than the roll gap between the corresponding leveling rollers through which the etching type heat dissipation alloy strip passes last time.
7. The surface flatness improvement method of claim 6, wherein a ratio of a roll gap between a first pair of the leveling rolls to a thickness of the etched heat spreading alloy strip is not lower than-11.5 and not higher than-5.5; the ratio of the roll gap between the final pair of leveling rolls to the thickness of the etched heat sink alloy strip is not less than-4 and not more than-0.5.
8. The surface flatness improvement method according to claim 1, characterized in that pairs of the leveling rollers of the leveling device define a first direction; in the second leveling process, the etched heat-dissipating alloy strip enters the leveling device in a direction parallel to the first direction; or/and, in the second leveling process, the etched heat-dissipating alloy strip enters the leveling device in a direction intersecting the first direction.
9. The surface evenness improving method according to claim 1, wherein each pair of the leveling rollers of the leveling device includes: a first leveling roller positioned at the lower side and a second leveling roller positioned at the upper side; the etched heat-dissipating alloy strip has a first surface and a second surface opposite the first surface; in the second leveling process, the first surface and the second surface alternately act as surfaces of the etched heat-sink alloy strip that are adjacent to the first leveling roller when entering the leveling device.
10. An etched heat sink alloy strip produced by the surface flatness improvement method according to any one of claims 1-9.
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|---|---|---|---|
| CN202310617163.3A CN116716459A (en) | 2023-05-29 | 2023-05-29 | Surface flatness improvement method for etching type heat dissipation alloy strip |
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|---|---|---|---|
| CN202310617163.3A CN116716459A (en) | 2023-05-29 | 2023-05-29 | Surface flatness improvement method for etching type heat dissipation alloy strip |
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