CN116713837A - Wafer carrying table and wafer thinning machine - Google Patents
Wafer carrying table and wafer thinning machine Download PDFInfo
- Publication number
- CN116713837A CN116713837A CN202310994412.0A CN202310994412A CN116713837A CN 116713837 A CN116713837 A CN 116713837A CN 202310994412 A CN202310994412 A CN 202310994412A CN 116713837 A CN116713837 A CN 116713837A
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- Prior art keywords
- carrier
- bracket
- wafer
- stud
- support
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- 239000012528 membrane Substances 0.000 claims description 16
- 230000007246 mechanism Effects 0.000 claims description 5
- 238000004378 air conditioning Methods 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/068—Table-like supports for panels, sheets or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention belongs to the technical field of wafer thinning, and discloses a wafer carrying table and a wafer thinning machine. According to the invention, a plurality of screws do not need to be disassembled and assembled, and the locking piece is arranged on the first bracket, namely, the locking piece is not placed in a loose piece all the time, so that the loss of parts can be avoided.
Description
Technical Field
The invention relates to the technical field of wafer thinning, in particular to a wafer carrying table and a wafer thinning machine.
Background
The current wafer thinning machine generally loads a wafer to be thinned on a wafer carrying table, and then adopts a grinding wheel arranged on a main shaft to polish and thin the wafer. In the prior art, a wafer is generally placed on a wafer carrying table through a film frame, specifically, the film frame is an annular bracket, a film is adhered on the annular bracket, and the wafer is adhered on the film and is located in the middle area of the annular bracket. After the membrane frame is placed on the wafer carrying platform, the wafer can be positioned only by fixing the membrane frame, in the prior art, the structure of the wafer carrying platform for fixing the membrane frame is generally an annular edge fastening ring, specifically, the edge fastening ring comprises a clamp and a clamping ring, the clamp is fixedly connected with the carrying platform of the wafer carrying platform, the clamping ring is arranged at the top of the clamp and is coaxially arranged with the clamp, the inner diameter of the clamp is equal to the outer diameter of the membrane frame, the clamp can be sleeved on the periphery of the membrane frame, the distance between the inner side of the clamping ring and the inner side of the clamp is smaller than the width of the membrane frame, the clamping ring can be arranged above the membrane frame in a covering manner, and a plurality of screws uniformly arranged along the circumferential direction of the clamping ring are arranged at the top of the clamping ring to fix the clamping ring and the clamp together, so that the membrane frame is locked on the wafer carrying platform.
Based on the above, in the process of taking down the film frame from the wafer carrying table and placing and locking the film frame to the wafer carrying table, a plurality of screws are required to be disassembled and assembled, the whole process is complex, time and labor are wasted, and the working efficiency of the wafer thinning machine is low. Moreover, after the screws are disassembled, parts are easy to lose because a plurality of screws are arranged in a scattered way.
Therefore, the above-described problems are to be solved.
Disclosure of Invention
The invention aims to provide a wafer carrying table and a wafer thinning machine, which are used for simplifying the processes of taking down a film frame from the wafer carrying table and placing and locking the film frame on the wafer carrying table, saving time and labor, improving the working efficiency of the wafer thinning machine and avoiding the loss of parts.
To achieve the purpose, the invention adopts the following technical scheme:
in one aspect, the present invention provides a wafer carrier for fixing a film frame carrying a wafer, a film is adhered to the film frame, the wafer is adhered to the film, and the wafer carrier includes:
a carrier on which the film can be carried; and
the fixing mechanism comprises a first support, a second support and a locking piece, wherein the first support is sleeved on the periphery of the carrying platform and is provided with a first carrying surface and a second carrying surface, the second carrying surface is located on one side, away from the carrying platform, of the first carrying surface, the membrane frame can be carried on the first carrying surface, the second support is sleeved on the periphery of the first support and is carried on the second carrying surface, a pressing piece is arranged on the second support and is located above the first carrying surface, the locking piece is arranged on the first support, the first support is provided with the locking piece along the two radial sides of the carrying platform, the locking piece is provided with a first working position and a second working position, when the locking piece is located at the first working position, the locking piece applies a first pressing force and a second pressing force to the corresponding positions on the second support, the first pressing force is enabled to be applied to the second support along the first pressing force, the second support is enabled to be directed downwards along the second pressing force, and the second pressing force is enabled to be applied to the second support along the second pressing force when the second support is directed towards the second pressing position.
Preferably, the inner side of the second support is provided with a groove, the groove extends around the axis of the carrying platform, the first support is provided with a channel along the radial direction of the carrying platform, and the locking piece comprises:
the wedge block is arranged on the first bracket and can move in the channel along the radial direction of the carrier, the wedge block is provided with an inclined surface so that the height of the wedge block in the vertical direction gradually decreases from one side close to the carrier to one side far away from the carrier, one side of the wedge block far away from the carrier can extend into the groove, and the inclined surface can be propped against the edge of the groove; a kind of electronic device with high-pressure air-conditioning system
And the driving part is configured to drive the wedge block to move along the radial direction of the carrier.
Preferably, the driving unit includes:
the stud extends along the radial direction of the carrier and passes through the first bracket, a first thread is arranged on one side of the stud, which is far away from the carrier along the axial direction of the stud, and the wedge block is fixedly connected with the stud through a mounting plate; a kind of electronic device with high-pressure air-conditioning system
The first nut is in threaded connection with the stud through the first thread and is abutted to one side, far away from the carrier, of the first bracket.
Preferably, the stud is provided with a second thread along one side of the stud, which is axially close to the carrying platform, the driving part further comprises a second nut, the second nut is in threaded connection with the stud through the second thread, the stud is provided with a protruding portion, the protruding portion is located between the first thread and the second thread and protrudes in the radial direction of the stud, and the mounting plate is sleeved on the periphery of the stud and is limited between the protruding portion and the second nut in a propping mode.
Preferably, the first bracket is provided with a through hole, the stud passes through the first bracket through the through hole, and the width of the protruding part along the radial direction of the stud is larger than the diameter of the through hole.
Preferably, the second support may be sleeved on the first support and the periphery of the film frame, and the first support is provided with a positioning portion, and the positioning portion is disposed on the first bearing surface and configured to position the film frame.
Preferably, the first support comprises a first annular portion, the upper surface of the first annular portion forms the first bearing surface, the positioning portion is arranged on the upper surface of the first annular portion, a first positioning surface is formed on one side of the positioning portion, which faces the carrying platform, of the positioning portion, the first positioning surface is parallel to the axis of the carrying platform, a second positioning surface is formed on the outer side of the membrane frame, and the first positioning surface can be attached to the second positioning surface.
Preferably, the first support is provided with two or more positioning portions, and the two or more positioning portions are uniformly arranged around the axis of the carrier.
Preferably, the second support is provided with more than two pressing pieces, and the more than two pressing pieces are uniformly arranged around the axis of the carrier.
The invention also provides a wafer thinning machine, which comprises the wafer carrying platform, wherein the carrying platform can adsorb the film, and the wafer carrying platform can rotate around the axis of the carrying platform.
The invention has the beneficial effects that: according to the invention, the film frame can be taken down from the wafer carrying platform or placed and locked onto the wafer carrying platform only by switching the working positions of the locking pieces, so that the processes of taking down the film frame from the wafer carrying platform and placing and locking the film frame onto the wafer carrying platform are simplified, time and labor are saved, and the working efficiency of the wafer thinning machine is improved. In addition, the invention does not need to disassemble and assemble a plurality of screws, and the locking piece used for realizing the purpose of taking down the film frame from the wafer carrying platform or placing and locking the film frame to the wafer carrying platform is arranged on the first bracket, namely the locking piece is not placed in a loose piece all the time, thereby avoiding the loss of parts. The wafer thinning machine comprising the wafer carrying platform has higher working efficiency.
Drawings
FIG. 1 is a schematic view of a wafer carrier and a film frame according to an embodiment of the present invention;
FIG. 2 is an exploded view of a wafer carrier and film frame in accordance with an embodiment of the present invention;
FIG. 3 is a top view of a wafer carrier and film frame in an embodiment of the invention;
FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;
fig. 5 is a partial enlarged view at B in fig. 4.
In the figure:
110. a membrane frame; 111. a second positioning surface;
210. a carrier;
220. a fixing mechanism; 221. a first bracket; 2211. a first annular portion; 22111. a first bearing surface; 2212. a second annular portion; 22121. a second bearing surface; 2213. a channel; 2214. perforating; 2215. a positioning part; 22151. a first positioning surface; 222. a second bracket; 2221. a groove; 223. a locking member; 2231. wedge blocks; 22311. an inclined plane; 2232. a driving section; 22321. a stud; 223211 and a projection; 22322. a first nut; 22323. a second nut; 2233. a mounting plate; 224. tabletting.
Detailed Description
The invention is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present invention are shown in the drawings.
In the description of the present invention, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the present invention, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
The present embodiment provides a wafer thinning machine, which includes a wafer stage, as shown in fig. 1 and 3, for fixing a film frame 110 carrying a wafer, where a film (not shown) is adhered to the film frame 110, and the wafer is adhered to the film.
Referring to fig. 1 to 5, the wafer carrier in this embodiment includes a carrier 210 and a fixing mechanism 220, the film can be carried on the carrier 210, when the film is carried on the carrier 210, the wafer is coaxial with the carrier 210, the fixing mechanism 220 includes a first bracket 221, a second bracket 222 and a locking member 223, the first bracket 221 is sleeved on the periphery of the carrier 210 and is provided with a first carrying surface 22111 and a second carrying surface 22121, the second carrying surface 22121 is located at one side of the first carrying surface 22111 away from the carrier 210, the film frame 110 can be carried on the first carrying surface 22111, the second bracket 222 is sleeved on the periphery of the first bracket 221 and is carried on the second carrying surface 22121, the second bracket 222 is provided with a pressing piece 224, the pressing piece 224 is located above the first carrying surface 22111, the locking member 223 is mounted on the first bracket 221, both sides of the first bracket 221 along the radial direction of the carrier 210 are provided with locking members 223, the locker 223 has a first working position and a second working position, when the locker 223 is located at the first working position, the locker 223 applies a first pressing force and a second pressing force to a position on the second bracket 222 corresponding thereto, wherein the first pressing force is downward in a vertical direction so that the pressing sheet 224 presses the film frame 110, i.e., the film frame 110 can be pressed between the pressing sheet 224 and the first bracket 221, the second pressing force is directed to the second bracket 222 in a horizontal direction by the first bracket 221, the second bracket 222 can be tightened when all the locker 223 respectively disposed at both sides of the first bracket 221 in a radial direction of the stage 210 apply the second pressing force to the second bracket 222, thereby fixing the second bracket 222 in the horizontal direction, and when all the locker 223 applies the first pressing force to the second bracket 222, the second bracket 222 can be pressed between the locker 223 and the second bearing surface 22121 of the first bracket 221, thereby fixing the second bracket 222 in the vertical direction, and thus fixing the second bracket 222, and the pressing piece 224 can press the film frame 110 in the vertical direction when the second bracket 222 is fixed, thereby fixing the film frame 110 through the fixed second bracket 222, and thus fixing the wafer to the carrier 210.
When the locking member 223 is located at the second working position, the locking member 223 releases the first pressing force and the second pressing force applied to the second bracket 222, so that the fixation of the second bracket 222 can be released, that is, the worker can remove the second bracket 222 from the first bracket 221, so that the film frame 110 can be removed.
Based on the above, in this embodiment, the film frame 110 can be removed from the wafer carrier or the film frame 110 can be placed on and locked to the wafer carrier by only switching the working positions of the locking members 223, so that the processes of removing the film frame 110 from the wafer carrier and placing and locking the film frame 110 to the wafer carrier are simplified, time and labor are saved, and the working efficiency of the wafer thinning machine is improved. In addition, in this embodiment, a plurality of screws are not required to be assembled and disassembled, and the locking member 223 for removing the film frame 110 from the wafer carrier or placing and locking the film frame 110 to the wafer carrier is mounted on the first bracket 221, that is, the locking member 223 is not placed in a loose piece all the time, so that the loss of parts can be avoided.
Specifically, the first bracket 221 includes a first annular portion 2211 and a second annular portion 2212, the second annular portion 2212 is located at a side of the first annular portion 2211 away from the carrier 210, an upper surface of the first annular portion 2211 is higher than an upper surface of the second annular portion 2212, the upper surface of the first annular portion 2211 forms a first bearing surface 22111, an upper surface of the second annular portion 2212 forms a second bearing surface 22121, the film frame 110 can be borne on the first bearing surface 22111, the second bracket 222 is annular and can be borne on the second bearing surface 22121, a locking member 223 mounted on the first bracket 221 can fix the second bracket 222, and the pressing piece 224 is pressed down by the second bracket 222 so that the pressing piece 224 can press against the film frame 110, thereby fixing the film frame 110. After the wafer is thinned, the locking member 223 can release the second bracket 222, and the worker can remove the second bracket 222 from the first bracket 221, so that the film frame 110 can be removed.
In addition, the wafer thinning machine comprising the wafer carrying platform has higher working efficiency.
Besides the wafer carrying table, the wafer thinning machine further comprises a driving piece (not shown in the figure), wherein the carrying table 210 in the embodiment is an adsorption table, that is, the carrying table 210 can adsorb a film, the driving piece can drive the wafer carrying table to rotate around the axis of the carrying table 210, that is, the wafer carrying table can rotate around the axis of the carrying table 210, so that the wafer is driven to rotate, and polishing and thinning of the wafer are realized.
Further, the second bracket 222 can be sleeved on the first bracket 221 and the periphery of the film frame 110, so as to position the film frame 110 along the radial direction thereof, the first bracket 221 is provided with a positioning portion 2215, the positioning portion 2215 is disposed on the first bearing surface 22111, and the positioning portion 2215 is configured to position the film frame 110, so as to ensure that the position of the film frame 110 after being placed on the first bearing surface 22111 meets the requirement.
Based on the above, the first support 221 in this embodiment includes the first annular portion 2211, the upper surface of the first annular portion 2211 forms the first bearing surface 22111, the positioning portion 2215 is disposed on the upper surface of the first annular portion 2211, the side of the positioning portion 2215 facing the carrier 210 is formed with the first positioning surface 22151, the first positioning surface 22151 is parallel to the axis of the carrier 210, the outer side of the film frame 110 is formed with the second positioning surface 111, the first positioning surface 22151 can be adhered to the second positioning surface 111, so as to position the film frame 110 along the circumferential direction thereof, and the positioning portion 2215 and the second support 222 cooperate to achieve accurate positioning of the film frame 110.
In addition, the first support 221 is provided with more than two positioning portions 2215, the more than two positioning portions 2215 are uniformly arranged around the axis of the carrier 210, all the positioning portions 2215 are formed with first positioning surfaces 22151, and the outer side of the film frame 110 is formed with more than two second positioning surfaces 111, so that the film frame 110 is further positioned along the radial direction thereof while the film frame 110 is further positioned along the circumferential direction thereof, so as to further realize accurate positioning of the film frame 110.
Preferably, the second bracket 222 is provided with more than two pressing pieces 224, and the more than two pressing pieces 224 are uniformly arranged around the axis of the carrier 210, so as to compress the membrane frame 110 at different positions along the circumferential direction thereof, thereby further stably fixing the membrane frame 110.
In this embodiment, the groove 2221 is formed on the inner side of the second bracket 222, the groove 2221 extends around the axis of the carrier 210, the channel 2213 is formed on the first bracket 221 along the radial direction of the carrier 210, the locking member 223 includes a wedge 2231 and a driving part 2232, the wedge 2231 is mounted on the first bracket 221 and can move in the channel 2213 along the radial direction of the carrier 210, the wedge 2231 is provided with an inclined surface 22311, so that the height of the wedge 2231 along the vertical direction is gradually reduced from one side close to the carrier 210 to one side far away from the carrier 210, the wedge 2231 can move in the radial direction of the carrier 210 to one side far away from the carrier 210 in the channel 2213 so that the wedge 2231 can extend into the groove 2221, and the inclined surface 22311 can be pressed onto the edge of the groove 2221, when the inclined surface 22311 presses the edge of the groove 2221, the wedge 2231 can apply a first pressing force along the vertical direction and a second pressing force directed by the first bracket 221 to the second bracket 222 along the horizontal direction, so that the height of the wedge 2231 is gradually reduced from one side close to one side far away from the carrier 210, namely, the wedge 2231 can be driven by the driving part 223 along the radial direction to the carrier 210, so that the wafer 2231 can move along the radial direction along the first direction or the carrier 210, thereby the carrier 2 can be driven to move along the radial direction, and the carrier 2 easily.
Further, the driving portion 2232 includes a stud 22321 and a first nut 22322, the stud 22321 extends along the radial direction of the carrier 210 and passes through the first bracket 221, a portion of the stud 22321 extending into the first bracket 221 is located in the passage 2213, a first thread (not shown in the drawing) is provided on a side of the stud 22321 along the axial direction thereof away from the carrier 210, the wedge 2231 is fixedly connected to the stud 22321 by the mounting plate 2233, the first nut 22322 is screwed to the stud 22321 by the first thread and abuts against a side of the first bracket 221 away from the carrier 210, and a worker can move the wedge 2231 along the radial direction of the carrier 210 away from the carrier 210 or towards the carrier 210 by only turning the first nut 22322, thereby switching the working position of the locking member 223.
The second thread (not shown) is disposed on a side of the stud 22321 along the axial direction thereof, which is adjacent to the carrier 210, the driving portion 2232 further includes a second nut 22323, the second nut 22323 is screwed to the stud 22321 by the second thread, a protrusion 223211 is disposed on the stud 22321, the protrusion 223211 is disposed between the first thread and the second thread and protrudes radially from the stud 22321, and a mounting plate 2233 is sleeved on the periphery of the stud 22321 and is pressed between the protrusion 223211 and the second nut 22323, so as to fix the wedge 2231 on the stud 22321, thereby ensuring that the wedge 2231 can move along with the stud 22321.
It should be noted that, the worker needs to operate the first nuts 22322 of all the locking pieces 223 respectively provided at both sides of the first bracket 221 in the radial direction of the carrier 210 to rotate synchronously, so that the first nuts 22322 of all the locking pieces 223 respectively provided at both sides of the first bracket 221 in the radial direction of the carrier 210 apply the second pressing force to the second bracket 222 at the same time, thereby tightening the second bracket 222.
Further, the first support 221 is provided with a through hole 2214, the stud 22321 passes through the first support 221 through the through hole 2214, and the width of the protruding portion 223211 along the radial direction of the stud 22321 is larger than the diameter of the through hole 2214, so that the side of the protruding portion 223211 away from the carrier 210 can abut against the first support 221, thereby limiting the travel of the stud 22321.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the invention. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (10)
1. The wafer holds piece platform for fixed membrane frame (110) that carries the wafer, adhere to on membrane frame (110) film, the wafer bond on the film, its characterized in that, wafer holds piece platform includes:
-a carrier (210), the film being loadable on the carrier (210); and
the fixing mechanism (220) comprises a first bracket (221), a second bracket (222) and a locking piece (223), wherein the first bracket (221) is sleeved on the periphery of the carrier (210) and is provided with a first bearing surface (22111) and a second bearing surface (22121), the second bearing surface (22121) is positioned on one side of the first bearing surface (22111) far away from the carrier (210), the membrane frame (110) can bear on the first bearing surface (22111), the second bracket (222) is sleeved on the periphery of the first bracket (221) and is supported on the second bearing surface (22121), the second bracket (222) is provided with a pressing piece (224), the pressing piece (224) is positioned above the first bearing surface (22111), the locking piece (223) is arranged on one side of the first bracket (221), the first bracket (221) can bear on the first bearing surface (22111), the second bracket (222) is provided with a pressing piece (223) along the radial direction, and the second bracket (223) has a pressing piece pressing force, and the pressing piece (223) is arranged at a pressing position along the second direction, and the pressing piece (223) is pressed down along the second pressing piece (223), the second pressing force is directed from the first bracket (221) to the second bracket (222) along the horizontal direction, and when the locking member (223) is located at the second working position, the locking member (223) releases the first pressing force and the second pressing force applied to the second bracket (222).
2. The wafer carrier of claim 1, wherein a groove (2221) is formed in an inner side of the second support (222), the groove (2221) extends around an axis of the carrier (210), a channel (2213) is formed in the first support (221) along a radial direction of the carrier (210), and the locking member (223) includes:
a wedge (2231) mounted on the first bracket (221) and capable of moving in the passage (2213) along the radial direction of the carrier (210), the wedge (2231) being provided with a slope (22311) so that the height of the wedge (2231) in the vertical direction gradually decreases from a side close to the carrier (210) to a side away from the carrier (210), the side of the wedge (2231) away from the carrier (210) being capable of extending into the groove (2221), and the slope (22311) being capable of pressing against the edge of the groove (2221); a kind of electronic device with high-pressure air-conditioning system
And a driving part (2232) configured to drive the wedge (2231) to move in the radial direction of the stage (210).
3. The wafer carrier of claim 2, wherein the drive section (2232) comprises:
a stud (22321) extending along the radial direction of the carrier (210) and passing through the first bracket (221), wherein a first thread is arranged on one side of the stud (22321) away from the carrier (210) along the axial direction of the stud, and the wedge (2231) is fixedly connected with the stud (22321) through a mounting plate (2233); a kind of electronic device with high-pressure air-conditioning system
And a first nut (22322) screwed to the stud (22321) by the first thread and abutting against one side of the first bracket (221) away from the carrier (210).
4. A wafer carrier according to claim 3, wherein the stud (22321) is provided with a second thread along a side of the stud (22321) axially adjacent to the carrier (210), the driving portion (2232) further comprises a second nut (22323), the second nut (22323) is screwed to the stud (22321) through the second thread, the stud (22321) is provided with a protrusion (223211), the protrusion (223211) is located between the first thread and the second thread and protrudes in a radial direction of the stud (22321), and the mounting plate (2233) is sleeved on an outer circumference of the stud (22321) and is pressed between the protrusion (223211) and the second nut (22323).
5. The wafer carrier of claim 4, wherein the first support (221) is provided with a through hole (2214), the stud (22321) passes through the first support (221) through the through hole (2214), and a width of the projection (223211) along a radial direction of the stud (22321) is larger than a diameter of the through hole (2214).
6. The wafer carrier of claim 1, wherein the second support (222) is capable of being sleeved on the first support (221) and the periphery of the film frame (110), the first support (221) is provided with a positioning portion (2215), the positioning portion (2215) is disposed on the first bearing surface (22111), and the positioning portion (2215) is configured to position the film frame (110).
7. The wafer carrier of claim 6, wherein the first support (221) includes a first annular portion (2211), an upper surface of the first annular portion (2211) forms the first bearing surface (22111), the positioning portion (2215) is disposed on the upper surface of the first annular portion (2211), a first positioning surface (22151) is formed on a side of the positioning portion (2215) facing the carrier (210), the first positioning surface (22151) is parallel to an axis of the carrier (210), a second positioning surface (111) is formed on an outer side of the film frame (110), and the first positioning surface (22151) can be adhered to the second positioning surface (111).
8. The wafer carrier of claim 7, wherein the first support (221) is provided with two or more positioning portions (2215), and the two or more positioning portions (2215) are uniformly arranged around an axis of the carrier (210).
9. The wafer carrier of claim 1, wherein the second support (222) has two or more press pieces (224) thereon, and wherein the two or more press pieces (224) are uniformly arranged around an axis of the carrier (210).
10. Wafer thinning machine, characterized in that it comprises a wafer support according to any of claims 1-9, said carrier (210) being able to absorb said film, said wafer support being able to rotate about the axis of said carrier (210).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310994412.0A CN116713837A (en) | 2023-08-09 | 2023-08-09 | Wafer carrying table and wafer thinning machine |
Applications Claiming Priority (1)
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| CN202310994412.0A CN116713837A (en) | 2023-08-09 | 2023-08-09 | Wafer carrying table and wafer thinning machine |
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| CN116713837A true CN116713837A (en) | 2023-09-08 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004247660A (en) * | 2003-02-17 | 2004-09-02 | Disco Abrasive Syst Ltd | Frame fixture |
| JP2006032661A (en) * | 2004-07-16 | 2006-02-02 | Disco Abrasive Syst Ltd | Cutting apparatus |
| JP2008124292A (en) * | 2006-11-14 | 2008-05-29 | Disco Abrasive Syst Ltd | Wafer positioning jig of processing apparatus |
| CN202564198U (en) * | 2011-02-10 | 2012-11-28 | 富士机械制造株式会社 | Bare chip supply device |
| US20180099375A1 (en) * | 2016-10-07 | 2018-04-12 | Disco Corporation | Frame fixing jig |
-
2023
- 2023-08-09 CN CN202310994412.0A patent/CN116713837A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004247660A (en) * | 2003-02-17 | 2004-09-02 | Disco Abrasive Syst Ltd | Frame fixture |
| JP2006032661A (en) * | 2004-07-16 | 2006-02-02 | Disco Abrasive Syst Ltd | Cutting apparatus |
| JP2008124292A (en) * | 2006-11-14 | 2008-05-29 | Disco Abrasive Syst Ltd | Wafer positioning jig of processing apparatus |
| CN202564198U (en) * | 2011-02-10 | 2012-11-28 | 富士机械制造株式会社 | Bare chip supply device |
| US20180099375A1 (en) * | 2016-10-07 | 2018-04-12 | Disco Corporation | Frame fixing jig |
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