CN116713409A - Automatic rib cutting equipment for semiconductor processing - Google Patents
Automatic rib cutting equipment for semiconductor processing Download PDFInfo
- Publication number
- CN116713409A CN116713409A CN202310537113.4A CN202310537113A CN116713409A CN 116713409 A CN116713409 A CN 116713409A CN 202310537113 A CN202310537113 A CN 202310537113A CN 116713409 A CN116713409 A CN 116713409A
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- mounting seat
- face
- auxiliary block
- auxiliary
- door plate
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- 238000005520 cutting process Methods 0.000 title claims abstract description 69
- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 238000004140 cleaning Methods 0.000 claims description 19
- 238000001816 cooling Methods 0.000 claims description 14
- 238000001125 extrusion Methods 0.000 claims description 5
- 230000001681 protective effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 6
- 238000009835 boiling Methods 0.000 abstract 1
- 239000002699 waste material Substances 0.000 description 10
- 238000009434 installation Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 210000003205 muscle Anatomy 0.000 description 2
- 206010053615 Thermal burn Diseases 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Shearing Machines (AREA)
Abstract
The application provides automatic rib cutting equipment for semiconductor processing, and relates to the technical field of rib cutting equipment. When the door plant is closed, interval between first auxiliary block and the second auxiliary block aligns with first mount pad position, but first mount pad reciprocates this moment, then when the door plant is not closed to the staff, block first mount pad unable downwardly moving through the second auxiliary block, the security when having improved the part processing this moment, the guard plate that is used for the staff protection is all installed generally on the semiconductor rib cutting equipment is solved, but partial staff's safety consciousness is light, do not close the guard plate in the semiconductor rib cutting course of working, just take place the incident this moment easily, simultaneously cut the cutter in the semiconductor rib in-process and send out the boiling hot easily, influence cutter life's problem this moment.
Description
Technical Field
The application relates to the technical field of rib cutting equipment, in particular to automatic rib cutting equipment for semiconductor processing.
Background
The semiconductor refers to a material with conductivity between that of a conductor and an insulator at normal temperature, and the material needs to be subjected to rib cutting treatment in the process of processing the semiconductor, so that rib cutting equipment is needed.
The guard plate that is used for the staff protection can be installed generally on the semiconductor rib cutting equipment, but partial staff's safety consciousness is light thin, does not close the guard plate in the semiconductor rib cutting course of working, just takes place the incident easily this moment, and the cutter is sent out easily to scald at the semiconductor rib cutting in-process simultaneously, influences the life of cutter this moment.
Disclosure of Invention
In view of the above, the present application provides an automatic bar cutting device for semiconductor processing, which has a safety part, and by setting the safety part, a first auxiliary block and a second auxiliary block are welded on the rear end surface of a door plate, and the first auxiliary block and the second auxiliary block are both rectangular block structures; the top end surfaces of the first auxiliary block and the second auxiliary block are flush with the bottom end surface of the first mounting seat, the distance between the first auxiliary block and the second auxiliary block is equal to the width of the first mounting seat, when the door plate is closed, the distance between the first auxiliary block and the second auxiliary block is aligned with the position of the first mounting seat, at the moment, the first mounting seat can move up and down, and when a worker does not close the door plate, the first mounting seat cannot move downwards through the blocking of the second auxiliary block, so that the safety of part processing is improved;
the cutter is also provided with a rib cutting part, and the auxiliary cooling of the cutter can be realized in the rib cutting process through the arrangement of the rib cutting part, so that the service life of the cutter is ensured.
The application discloses an automatic rib cutting device for semiconductor processing, which is characterized by comprising the following specific technical means:
the application provides automatic rib cutting equipment for semiconductor processing, which specifically comprises: the device comprises a base, a rib cutting part, a cooling part and a safety part; the base is fixed on the workbench; the rib cutting part consists of two sliding rods, a connecting block, a hydraulic telescopic rod, a first mounting seat, a cutter, through holes and auxiliary rods, wherein the two sliding rods are welded on the top end surface of the base; the two sliding rods are connected with a first mounting seat in a sliding manner, cutters are arranged at the bottom ends of the first mounting seats in a rectangular array shape, the cutters are aligned with the rib cutting holes Kong Xiangpi, and the cutters are positioned above the placing grooves; the bottom end surface of the connecting block is provided with a hydraulic telescopic rod, one end below the hydraulic telescopic rod is fixed on the first mounting seat, and when the hydraulic telescopic rod stretches, the first mounting seat and the cutter are in a downward movement state; the cooling part consists of a second installation seat, a fan, an installation arm and a contact switch, and the second installation seat is fixed on the rear end surface of the base; the safety part consists of a sliding seat, a door plate, a first auxiliary block and a second auxiliary block, and the sliding seat is fixed on the front end surface of the base.
Further, a placing groove is formed in the center of the top end face of the base, the placing groove is of a rectangular groove-shaped structure, a semiconductor needing to be cut into ribs is placed in the placing groove, the semiconductor is clamped with the placing groove, and the semiconductor is in a limiting state.
Further, the base is provided with rib cutting holes in a rectangular array shape, and the rib cutting holes are contacted with the left side and the right side of the placing groove;
a cleaning groove is formed in the front end face of the base and is communicated with the rib cutting hole, and the end face of the bottom of the cleaning groove is of an inclined structure.
Further, grooves are formed in the left end face and the right end face of the base in a linear array shape, and the grooves are of semi-cylindrical groove structures;
the left end face and the right end face of the first mounting seat are welded with an auxiliary rod, the two auxiliary rods are of bent rod-shaped structures, the two auxiliary rods are clamped with the grooves, the auxiliary rods are clamped with the grooves continuously when the hydraulic telescopic rods are telescopic, and the base is in a continuous vibration state.
Further, the through hole has been seted up to rectangular array form is personally submitted on first mount pad top, and the through hole is cylindrical hole form structure, and the through hole that rectangular array form was seted up aligns with the cutter position of rectangular array form installation, and first mount pad is the state of upwards moving when the shrink of hydraulic telescoping rod, and external air current is the extrusion form this moment.
Further, the first mounting seat is of a rectangular box-shaped structure.
Further, the sliding seat is connected with a door plate in a sliding manner, when the door plate is closed through sliding, the door plate is located at the position right in front of the cutter, and the door plate is a protective structure for workers.
Further, a fan is arranged on the second mounting seat, and the fan is aligned with the cutter;
the left end face of the sliding seat is provided with a mounting arm, the right end face of the mounting arm is provided with a contact switch, the contact switch is electrically connected with the fan, the fan is in an electrified state when the contact switch is extruded, and the left end face of the door plate is in elastic contact with the contact switch when the door plate is closed.
Further, a first auxiliary block and a second auxiliary block are welded on the rear end face of the door plate, and the first auxiliary block and the second auxiliary block are of rectangular block structures;
the top end surfaces of the first auxiliary block and the second auxiliary block are flush with the bottom end surface of the first mounting seat, the distance between the first auxiliary block and the second auxiliary block is equal to the width of the first mounting seat, and when the door plate is closed, the distance between the first auxiliary block and the second auxiliary block is aligned with the position of the first mounting seat, so that the first mounting seat can move up and down.
Advantageous effects
1. According to the application, through the arrangement of the safety part, as the sliding seat is connected with the door plate in a sliding way, when the door plate is closed by sliding, the door plate is positioned right in front of the cutter, and the door plate is a protective structure for workers, so that the workers can be prevented from being hurt by waste materials of accessories in the cutting process; because the second mounting seat is provided with the fan, the fan is aligned with the cutter; the left end face of the sliding seat is provided with a mounting arm, the right end face of the mounting arm is provided with a contact switch, the contact switch is electrically connected with the fan, when the contact switch is extruded, the fan is in an electrified state, when the door plate is closed, the left end face of the door plate is in elastic contact with the contact switch, and at the moment, the temperature of the cutter can be reduced through the fan; the first auxiliary block and the second auxiliary block are welded on the rear end face of the door plate and are of rectangular block structures; the top end face of first auxiliary block and second auxiliary block is parallel and level with the bottom end face of first mount pad, and interval between first auxiliary block and the second auxiliary block equals with the width of first mount pad, and interval between first auxiliary block and the second auxiliary block aligns with first mount pad position when the door plant is closed, but first mount pad reciprocates this moment, then when the staff does not close the door plant, stops first mount pad unable downwardly moving through the second auxiliary block, has improved the security when part processing this moment.
2. By arranging the rib cutting parts, as the two sliding rods are connected with a first mounting seat in a sliding way, the bottom ends of the first mounting seats are provided with cutters in a rectangular array shape, the cutters are aligned with the rib cutting Kong Xiangpi, and the cutters are positioned above the placing grooves; a hydraulic telescopic rod is installed on the bottom end face of the connecting block, one end of the lower portion of the hydraulic telescopic rod is fixed on the first installation seat, and when the hydraulic telescopic rod stretches, the first installation seat and the cutter are in a downward movement state, and at the moment, the cutting of the semiconductor can be completed through the cutter.
3. The left end face and the right end face of the base are provided with grooves in a linear array shape, and the grooves are of semi-cylindrical groove structures; the left end face and the right end face of the first mounting seat are welded with an auxiliary rod, the two auxiliary rods are of bent rod-shaped structures, the two auxiliary rods are clamped with the grooves, the auxiliary rods are clamped with the grooves continuously when the hydraulic telescopic rods are telescopic, the base is in a continuous vibration state, and waste materials can be prevented from remaining in the cleaning grooves.
4. Because the top end of the first mounting seat is provided with the through holes in a rectangular array shape, the through holes are in a cylindrical hole-shaped structure, the through holes in the rectangular array shape are aligned with the positions of the cutters in the rectangular array shape, when the hydraulic telescopic rod is contracted, the first mounting seat is in an upward moving state, at the moment, the external air flow is in an extrusion shape, at the moment, the external air flow passes through the through holes and contacts with the cutters, and at the moment, the rapid cooling of the cutters can be realized; and because the first mounting seat is of a rectangular box-shaped structure, the flow speed of the air flow at the through hole can be improved when the first mounting seat moves upwards, and the cooling effect of the cutter can be improved at the moment.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings of the embodiments will be briefly described below.
The drawings described below are only for illustration of some embodiments of the application and are not intended to limit the application.
In the drawings:
FIG. 1 is a schematic diagram of an isometric view of an automatic bar cutting apparatus for semiconductor processing according to the present application;
FIG. 2 is a schematic diagram showing a front view of an automatic bar cutting apparatus for semiconductor processing according to the present application;
FIG. 3 is a schematic left-hand view of the automatic bar cutting apparatus for semiconductor processing according to the present application;
FIG. 4 is a schematic view of a left side view of an automatic bar cutting apparatus for semiconductor processing according to the present application, partially cut away;
FIG. 5 is a schematic diagram of the isometric view of FIG. 4 in accordance with the present application;
FIG. 6 is a schematic diagram of the rotated isometric view of FIG. 5 in accordance with the present application;
FIG. 7 is a schematic diagram of an isometric view of a first mount and safety portion of the present application;
fig. 8 is a schematic diagram of the rotated isometric view of fig. 7 in accordance with the present application.
Map marker list
1. A base; 101. cutting rib holes; 102. cleaning the groove; 103. a groove; 104. a placement groove; 2. a rib cutting part; 201. a slide bar; 202. a connecting block; 203. a hydraulic telescopic rod; 204. a first mount; 205. a cutter; 206. a through hole; 207. an auxiliary lever; 3. a cooling part; 301. a second mounting base; 302. a fan; 303. a mounting arm; 304. a contact switch; 4. a safety part; 401. a sliding seat; 402. a door panel; 403. a first auxiliary block; 404. and a second auxiliary block.
Detailed Description
Embodiments of the present application are described in further detail below with reference to the accompanying drawings and examples.
Examples: please refer to fig. 1 to 8:
the application provides automatic rib cutting equipment for semiconductor processing, which comprises: the device comprises a base 1, a rib cutting part 2, a cooling part 3 and a safety part 4;
the base 1 is fixed on a workbench;
the rib cutting part 2 consists of two sliding rods 201, a connecting block 202, a hydraulic telescopic rod 203, a first mounting seat 204, a cutter 205, a through hole 206 and an auxiliary rod 207, wherein the number of the sliding rods 201 is two, the two sliding rods 201 are welded on the top end surface of the base 1, and one end above the two sliding rods 201 is welded with the bottom end surface of the connecting block 202;
the cooling part 3 consists of a second mounting seat 301, a fan 302, a mounting arm 303 and a contact switch 304, wherein the second mounting seat 301 is fixed on the rear end face of the base 1;
the safety part 4 is composed of a sliding seat 401, a door plate 402, a first auxiliary block 403 and a second auxiliary block 404, and the sliding seat 401 is fixed on the front end surface of the base 1.
Wherein, a standing groove 104 has been seted up to base 1 top face central point put, and standing groove 104 is rectangular groove form structure, has placed the semiconductor that needs cut the muscle in the standing groove 104, and semiconductor and standing groove 104 joint are the spacing state this moment, then can prevent that the semiconductor from appearing the displacement when cutting the muscle to the semiconductor.
Wherein, the base 1 is provided with rib cutting holes 101 in a rectangular array shape, and the rib cutting holes 101 are contacted with the left side and the right side of the placing groove 104;
the cleaning groove 102 is formed in the front end face of the base 1, the cleaning groove 102 is communicated with the rib cutting hole 101, the bottom end face of the cleaning groove 102 is of an inclined structure, waste materials after cutting can directly fall into the cleaning groove 102 when falling in the use process, and at the moment, the waste materials can be automatically discharged through the cleaning groove 102.
The two sliding rods 201 are slidably connected with a first mounting seat 204, cutters 205 are mounted on the bottom ends of the first mounting seats 204 in a rectangular array, the cutters 205 are matched with the rib cutting holes 101, the cutters 205 are aligned with the rib cutting holes 101, and the cutters 205 are located above the placing grooves 104;
the bottom end surface of the connecting block 202 is provided with a hydraulic telescopic rod 203, one end below the hydraulic telescopic rod 203 is fixed on a first mounting seat 204, and when the hydraulic telescopic rod 203 stretches, the first mounting seat 204 and a cutter 205 are in a downward movement state, and at the moment, the cutter 205 can cut the ribs of the semiconductor.
The left end face and the right end face of the base 1 are provided with grooves 103 in a linear array shape, and the grooves 103 are of semi-cylindrical groove structures;
the left end face and the right end face of the first mounting seat 204 are both welded with an auxiliary rod 207, the two auxiliary rods 207 are of a bent rod-shaped structure, the two auxiliary rods 207 are clamped with the groove 103, the auxiliary rods 207 are continuously clamped with the groove 103 when the hydraulic telescopic rod 203 stretches out and draws back, the base 1 is in a continuous vibration state, and waste materials can be prevented from remaining in the cleaning groove 102.
Wherein, through hole 206 has been seted up to rectangular array form in first mount pad 204 top, and through hole 206 is cylindrical hole column structure, and rectangular array form through hole 206 that sets up aligns with the cutter 205 position of rectangular array form installation, and first mount pad 204 is the upward movement state when hydraulic telescoping rod 203 shrink, and external air current is the extrusion form this moment, and external air current passes through hole 206 and contacts with cutter 205 this moment, can realize the rapid cooling of cutter 205 this moment.
The first mounting seat 204 has a rectangular box-shaped structure, so that the flow speed of the air flow at the through hole 206 can be increased when the first mounting seat 204 moves upwards, and the cooling effect of the cutter 205 can be improved.
Wherein, sliding connection has a door plant 402 on the sliding seat 401, and when the door plant 402 was closed through the slip, the door plant 402 was located the position in the place ahead of cutter 205 this moment, and door plant 402 is staff's protective structure, can avoid the waste material of annex to hurt staff in the cutting process.
A fan 302 is mounted on the second mounting seat 301, and the fan 302 is aligned with the cutter 205;
the left end face of the sliding seat 401 is provided with a mounting arm 303, the right end face of the mounting arm 303 is provided with a contact switch 304, the contact switch 304 is electrically connected with the fan 302, when the contact switch 304 is extruded, the fan 302 is in an electrified state, when the door plate 402 is closed, the left end face of the door plate 402 is elastically contacted with the contact switch 304, and at the moment, the temperature reduction of the cutter 205 can be completed through the fan 302.
The rear end face of the door plate 402 is welded with a first auxiliary block 403 and a second auxiliary block 404, and the first auxiliary block 403 and the second auxiliary block 404 are both rectangular block structures;
the top end surfaces of the first auxiliary block 403 and the second auxiliary block 404 are flush with the bottom end surface of the first mounting seat 204, the distance between the first auxiliary block 403 and the second auxiliary block 404 is equal to the width of the first mounting seat 204, when the door plate 402 is closed, the distance between the first auxiliary block 403 and the second auxiliary block 404 is aligned with the position of the first mounting seat 204, at the moment, the first mounting seat 204 can move up and down, and when the door plate 402 is not closed by a worker, the first mounting seat 204 cannot move downwards due to the blocking of the second auxiliary block 404, and at the moment, the safety of part processing is improved.
Specific use and action of the embodiment:
when the semiconductor device is used, firstly, a semiconductor is placed in the placing groove 104, then the door plate 402 is closed, at the moment, because the door plate 402 is connected with the sliding seat 401 in a sliding way, when the door plate 402 is closed by sliding, the door plate 402 is positioned right in front of the cutter 205, and the door plate 402 is a protective structure for staff, so that the staff can be prevented from being hurt by waste materials of accessories in the cutting process; because the second mounting seat 301 is provided with the fan 302, the fan 302 is aligned with the cutter 205; the left end face of the sliding seat 401 is provided with a mounting arm 303, the right end face of the mounting arm 303 is provided with a contact switch 304, the contact switch 304 is electrically connected with the fan 302, when the contact switch 304 is extruded, the fan 302 is in an electrified state, when the door plate 402 is closed, the left end face of the door plate 402 is elastically contacted with the contact switch 304, and at the moment, the temperature reduction of the cutter 205 can be completed through the fan 302; because the rear end face of the door plate 402 is welded with the first auxiliary block 403 and the second auxiliary block 404, the first auxiliary block 403 and the second auxiliary block 404 are both rectangular block structures; the top end surfaces of the first auxiliary block 403 and the second auxiliary block 404 are flush with the bottom end surface of the first mounting seat 204, the distance between the first auxiliary block 403 and the second auxiliary block 404 is equal to the width of the first mounting seat 204, when the door plate 402 is closed, the distance between the first auxiliary block 403 and the second auxiliary block 404 is aligned with the position of the first mounting seat 204, at the moment, the first mounting seat 204 can move up and down, when the door plate 402 is not closed by a worker, the first mounting seat 204 cannot move downwards due to the blocking of the second auxiliary block 404, and at the moment, the safety of part processing is improved;
then, the hydraulic telescopic rods 203 are started, at this time, as the two sliding rods 201 are connected with a first mounting seat 204 in a sliding way, the bottom ends of the first mounting seats 204 are provided with cutters 205 in a rectangular array shape, the cutters 205 are matched with the rib cutting holes 101, the cutters 205 are aligned with the rib cutting holes 101, and the cutters 205 are positioned above the placing grooves 104; a hydraulic telescopic rod 203 is arranged on the bottom end surface of the connecting block 202, one end below the hydraulic telescopic rod 203 is fixed on a first mounting seat 204, when the hydraulic telescopic rod 203 stretches, the first mounting seat 204 and a cutter 205 are in a downward movement state, and at the moment, the cutter 205 can cut the ribs of a semiconductor;
meanwhile, as the left end face and the right end face of the base 1 are provided with the grooves 103 in a linear array shape, the grooves 103 are of a semi-cylindrical groove-shaped structure; the left end face and the right end face of the first mounting seat 204 are welded with an auxiliary rod 207, the two auxiliary rods 207 are of a bent rod-shaped structure, the two auxiliary rods 207 are clamped with the groove 103, when the hydraulic telescopic rod 203 stretches, the auxiliary rods 207 are continuously clamped with the groove 103, the base 1 is in a continuous vibration state, and waste materials can be prevented from remaining in the cleaning groove 102;
meanwhile, as the top end of the first mounting seat 204 is provided with the through holes 206 in a rectangular array shape, the through holes 206 are in a cylindrical hole-shaped structure, the rectangular array-shaped through holes 206 are aligned with the rectangular array-shaped cutters 205, when the hydraulic telescopic rod 203 is contracted, the first mounting seat 204 is in an upward moving state, at the moment, the external air flow is in an extrusion shape, at the moment, the external air flow passes through the through holes 206 and contacts with the cutters 205, and at the moment, the rapid cooling of the cutters 205 can be realized; because the first mounting seat 204 is in a rectangular box-shaped structure, when the first mounting seat 204 moves upwards, the flow speed of the air flow at the through hole 206 can be increased, and at the moment, the cooling effect of the cutter 205 can be improved;
in the use process, as the center of the top end surface of the base 1 is provided with the placing groove 104, the placing groove 104 is of a rectangular groove-shaped structure, a semiconductor needing to be cut is placed in the placing groove 104, the semiconductor is clamped with the placing groove 104, and at the moment, the semiconductor is in a limiting state, so that the semiconductor can be prevented from being displaced when the semiconductor is cut; the base 1 is provided with the rib cutting holes 101 in a rectangular array shape, and the rib cutting holes 101 are contacted with the left side and the right side of the placing groove 104; the cleaning groove 102 is formed in the front end face of the base 1, the cleaning groove 102 is communicated with the rib cutting hole 101, the bottom end face of the cleaning groove 102 is of an inclined structure, waste materials after cutting can directly fall into the cleaning groove 102 when falling in the use process, and at the moment, the waste materials can be automatically discharged through the cleaning groove 102.
Claims (9)
1. The automatic rib cutting equipment for semiconductor processing is characterized by comprising a base (1), a rib cutting part (2), a cooling part (3) and a safety part (4); the base (1) is fixed on the workbench; the rib cutting part (2) consists of two sliding rods (201), two connecting blocks (202), a hydraulic telescopic rod (203), a first mounting seat (204), a cutter (205), a through hole (206) and an auxiliary rod (207), wherein the two sliding rods (201) are welded on the top end surface of the base (1), and one ends above the two sliding rods (201) are welded with the bottom end surface of the connecting block (202); the two sliding rods (201) are connected with a first mounting seat (204) in a sliding manner, cutters (205) are mounted on the bottom ends of the first mounting seats (204) in a rectangular array, the cutters (205) are matched with the rib cutting holes (101), the cutters (205) are aligned with the rib cutting holes (101), and the cutters (205) are located above the placing grooves (104); a hydraulic telescopic rod (203) is arranged on the bottom end surface of the connecting block (202), one end below the hydraulic telescopic rod (203) is fixed on a first mounting seat (204), and when the hydraulic telescopic rod (203) stretches, the first mounting seat (204) and a cutter (205) are in a downward movement state; the cooling part (3) consists of a second mounting seat (301), a fan (302), a mounting arm (303) and a contact switch (304), wherein the second mounting seat (301) is fixed on the rear end face of the base (1); the safety part (4) consists of a sliding seat (401), a door plate (402), a first auxiliary block (403) and a second auxiliary block (404), and the sliding seat (401) is fixed on the front end face of the base (1).
2. An automatic bar cutting apparatus for semiconductor processing as claimed in claim 1, wherein: a placement groove (104) is formed in the center of the top end face of the base (1), the placement groove (104) is of a rectangular groove-shaped structure, a semiconductor which needs to be cut into ribs is placed in the placement groove (104), and the semiconductor is clamped with the placement groove (104), so that the semiconductor is in a limiting state.
3. An automatic bar cutting apparatus for semiconductor processing as claimed in claim 1, wherein: the base (1) is provided with rib cutting holes (101) in a rectangular array shape, and the rib cutting holes (101) are contacted with the left side and the right side of the placing groove (104);
a cleaning groove (102) is formed in the front end face of the base (1), the cleaning groove (102) is communicated with the rib cutting hole (101), and the bottom end face of the cleaning groove (102) is of an inclined structure.
4. An automatic bar cutting apparatus for semiconductor processing as claimed in claim 1, wherein: grooves (103) are formed in the left end face and the right end face of the base (1) in a linear array mode, and the grooves (103) are of semi-cylindrical groove structures;
the left end face and the right end face of the first mounting seat (204) are welded with an auxiliary rod (207), the two auxiliary rods (207) are of a bent rod-shaped structure, the two auxiliary rods (207) are clamped with the groove (103), when the hydraulic telescopic rod (203) stretches, the auxiliary rods (207) are in continuous clamping connection with the groove (103), and at the moment, the base (1) is in continuous vibration.
5. An automatic bar cutting apparatus for semiconductor processing as claimed in claim 1, wherein: through holes (206) are formed in the top end of the first mounting seat (204) in a rectangular array mode, the through holes (206) are of cylindrical hole-shaped structures, the rectangular array-shaped through holes (206) are aligned with the positions of cutters (205) mounted in the rectangular array mode, when the hydraulic telescopic rod (203) is contracted, the first mounting seat (204) is in an upward moving state, and at the moment, external air flows are in an extrusion mode.
6. An automatic bar cutting apparatus for semiconductor processing as claimed in claim 1, wherein: the first mounting seat (204) is of a rectangular box-shaped structure.
7. An automatic bar cutting apparatus for semiconductor processing as claimed in claim 1, wherein: the sliding seat (401) is connected with a door plate (402) in a sliding manner, when the door plate (402) is closed through sliding, the door plate (402) is positioned right in front of the cutter (205), and the door plate (402) is a protective structure for workers.
8. An automatic bar cutting apparatus for semiconductor processing as claimed in claim 1, wherein: a fan (302) is arranged on the second mounting seat (301), and the fan (302) is aligned with the cutter (205);
the left end face of the sliding seat (401) is provided with a mounting arm (303), the right end face of the mounting arm (303) is provided with a contact switch (304), the contact switch (304) is electrically connected with the fan (302), when the contact switch (304) is extruded, the fan (302) is in an electrified state, and when the door plate (402) is closed, the left end face of the door plate (402) is in elastic contact with the contact switch (304).
9. An automatic bar cutting apparatus for semiconductor processing as claimed in claim 1, wherein: a first auxiliary block (403) and a second auxiliary block (404) are welded on the rear end face of the door plate (402), and the first auxiliary block (403) and the second auxiliary block (404) are of rectangular block structures;
the top end surfaces of the first auxiliary block (403) and the second auxiliary block (404) are flush with the bottom end surface of the first mounting seat (204), the distance between the first auxiliary block (403) and the second auxiliary block (404) is equal to the width of the first mounting seat (204), and when the door plate (402) is closed, the distance between the first auxiliary block (403) and the second auxiliary block (404) is aligned with the position of the first mounting seat (204), at the moment, the first mounting seat (204) can move up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310537113.4A CN116713409B (en) | 2023-05-13 | 2023-05-13 | Automatic rib cutting equipment for semiconductor processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310537113.4A CN116713409B (en) | 2023-05-13 | 2023-05-13 | Automatic rib cutting equipment for semiconductor processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116713409A true CN116713409A (en) | 2023-09-08 |
| CN116713409B CN116713409B (en) | 2024-03-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310537113.4A Active CN116713409B (en) | 2023-05-13 | 2023-05-13 | Automatic rib cutting equipment for semiconductor processing |
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| CN (1) | CN116713409B (en) |
Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| FR1371845A (en) * | 1963-06-25 | 1964-09-11 | Sorelecma Soc Civ Ile De Rech | Wire and profile cutting process |
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|---|---|
| CN116713409B (en) | 2024-03-08 |
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