CN116682770A - Dual-arm robot scheduling method of EFEM (electronic extended electromagnetic) machine equipment - Google Patents

Dual-arm robot scheduling method of EFEM (electronic extended electromagnetic) machine equipment Download PDF

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Publication number
CN116682770A
CN116682770A CN202310860882.8A CN202310860882A CN116682770A CN 116682770 A CN116682770 A CN 116682770A CN 202310860882 A CN202310860882 A CN 202310860882A CN 116682770 A CN116682770 A CN 116682770A
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mechanical arm
executes
aligner
wafer
cavity
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旷贤国
丁德新
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Wuxi Xinyun Intelligent Technology Co ltd
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Wuxi Xinyun Intelligent Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application relates to a double-arm robot scheduling method of EFEM machine equipment, which is characterized in that scheduling periods are set for the time length of each step of processing flow S1 to S8 of each wafer under a specific working condition, the processing flow of two wafers is completed in each scheduling period, when the process starts in each scheduling period, the states of two mechanical arms are idle, and the states of an Aligner and a processing cavity are idle; after the two mechanical arms execute the S1 in sequence, the subsequent operation is carried out; for the Aligner, selecting one mechanical arm to execute S4, and immediately selecting the other mechanical arm to execute S2, so that the Aligner has no empty state; for the processing cavity, selecting one mechanical arm to execute S7, and immediately selecting the other mechanical arm to execute S5, so that the processing cavity is free of an empty state; the two mechanical arms do not act at the same time, and at any moment, one mechanical arm has no wafer. The wafer processing flow of the double-arm robot under the condition of multiple processing chambers is optimized to minimize the processing time.

Description

Dual-arm robot scheduling method of EFEM (electronic extended electromagnetic) machine equipment
Technical Field
The application relates to the technical field of wafer processing, in particular to a double-arm robot scheduling method of EFEM (electronic beam bending) machine equipment.
Background
EFEM (Equipment Front End Module) the wafer is transferred from the carrier (Cassette) to the processing chamber by docking with the process equipment, and the main components of the EFEM equipment include a Robot manipulator (single arm or double arm), a wafer handler (LoadPort), a wafer edge finder (Aligner), an FFU (fan filter unit), an ion rod, an electrical part and the like, and the docking with the process equipment is achieved by controlling each component in a coordinated manner through a software system, so that the transfer and the process of the wafer are completed. Loadport is a platform for placing a carrier, and Aligner is a device for performing edge-finding operation on a wafer.
In semiconductor wafer processing, single or dual arm robots are commonly used to transfer and process wafers. In the operation process of the single-arm robot, the processing flow of the wafer is low in efficiency, and the processing time is long. In order to improve the production efficiency, a double-arm robot is used for processing the wafer. However, in the operation process of the double-arm robot, the scheduling flow of the double arms is unreasonable, the waiting time is long, and finally the total processing time of the wafer is long, so that the production efficiency is affected.
Disclosure of Invention
Aiming at the defects of the prior art, the application provides a dual-arm robot scheduling method of EFEM (electronic beam-forming) machine equipment, which aims to optimize the wafer processing flow of the dual-arm robot under the condition of multiple processing chambers so as to minimize the processing time.
The technical scheme adopted by the application is as follows:
the application provides a double-arm robot scheduling method of EFEM machine equipment, which aims at the processing flow of each wafer:
s1, taking a wafer from the material box;
s2, placing the wafer into an Aligner;
s3, performing edge searching operation on the wafer;
s4, taking out the wafer with the edge being found at the Aligner;
s5, placing the wafer into a processing cavity;
s6, processing the wafer in a processing cavity;
s7, taking out the processed wafer from the processing cavity;
s8, placing the processed wafer back to the material box;
under a specific working condition, setting a scheduling period according to the time length of each step from S1 to S8, and completing the processing flow of two wafers in each scheduling period, wherein the specific working condition is as follows: the mechanical arms are arranged in two, the processing cavities are arranged in two, and the alignment is arranged in one;
in each scheduling period, the mechanical arm, the Aligner and the processing chamber meet the following conditions:
initially, the states of the two mechanical arms are idle, and the states of the Aligner and the processing cavity are idle;
when the method is started, after the two mechanical arms execute the S1 in sequence, the subsequent operation is carried out;
for the Aligner, selecting one mechanical arm to execute S4, taking out the wafer with the edge being found, immediately selecting the other mechanical arm to execute S2, and putting the other wafer into the Aligner to enable the Aligner to have no empty state;
for the processing cavity, selecting one mechanical arm to execute S7, immediately selecting the other mechanical arm to execute S5 after the processed wafer is taken out, and placing the other wafer into the processing cavity to enable the processing cavity to have no empty state;
the two mechanical arms do not act at the same time, and at any moment, one mechanical arm has no wafer.
The further technical scheme is as follows:
the two processing cavities are respectively a cavity A and a cavity B, the two mechanical arms are respectively a mechanical arm A and a mechanical arm B, and the dispatching flow in each dispatching cycle comprises:
1) Initializing: setting a time stamp and recording the current time; setting the states of the two mechanical arms to be idle; setting states of an Aligner and a processing chamber to be idle;
2) The mechanical arm A executes S1;
3) The mechanical arm B executes S1;
4) The mechanical arm A executes S2, and then the Aligner executes S3;
5) After the Aligner completes S3, the mechanical arm A executes S4;
6) The mechanical arm B executes S2, and then the Aligner executes S3;
7) The mechanical arm A executes S5, the wafer is placed in the cavity A, and then the cavity A executes S6;
8) The mechanical arm A re-executes S1;
9) Judging whether the Aligner in the step 6) is completed or not, if not, completing the Aligner, and then performing the step 10);
10 The mechanical arm B executes S4;
11 The mechanical arm a performs S2, and then the Aligner performs S3;
12 The mechanical arm B executes S5, the wafer is placed in the cavity B, and then the cavity B executes S6;
13 The mechanical arm B executes S1;
14 Judging whether the Aligner is completed S3, if not, waiting for completion, and then performing step 15);
15 The mechanical arm A executes S4;
16 The mechanical arm B performs S2, and then the Aligner performs S3;
17 Judging whether the cavity A is finished in S6, if not, waiting for finishing, and then performing step 18);
18 The mechanical arm B executes S7, and the processed wafer is taken out of the cavity A;
19 The mechanical arm A executes S5, the wafer is placed in the cavity A, and then the cavity A executes S6;
20 The mechanical arm B executes S8;
21 The mechanical arm A executes S1;
22 Judging whether the Aligner in the step 16) is completed S3, if not, waiting for completion, and then performing the step 23);
23 The mechanical arm B executes S4;
24 The mechanical arm a performs S2, and then the Aligner performs S3;
25 Judging whether the cavity B is finished in S6, if not finished, waiting for finishing, and then performing step 26);
26 S7, the mechanical arm A takes out the processed wafer from the cavity B;
27 The mechanical arm B executes S5, the wafer is placed in the cavity B, and then the cavity B executes S6;
28 The robot arm a performs S8.
Repeating steps 13) to 28) in the dispatching cycle until all wafers in the material box are processed and replaced in the material box.
When executing S1, S4, S7, and S8, the robot arm starts moving from the initial position of the robot arm.
Setting a weight coefficient according to the type of the material box, the type of the mechanical arm and the type of the Aligner, and limiting the total time of adjustment based on the weight coefficient and the time length corresponding to each step from S1 to S8:
TIME=（T 1 ×（C1+C3）+T 2 ×（C2+C3）+T 3 ×C2+T 4 ×C3+T 5 ×C3+T 6 +T 7 ×C3+T 8 ×（C1+C3））×N 1 /N 2 +(T 1 +T 2 +T 3 +T 4 +T 5 +T 6 +T 7 +T 8 )/ N 2
in the method, in the process of the application,TIMEthe total time required to complete the process flow for all wafers in one cassette;T i (i=1, 2,3 …, 8) is the length of time required for each step S1 to S8;C1、C2、C3 are respectively weight coefficients for characterizing the type of the material box, the type of the Aligner and the type of the mechanical arm,C1+C2+C3=1；N 1 ,N 2 the total number of wafers in one material box and the number of processing cavities are respectively.
The beneficial effects of the application are as follows:
the application designs the optimal scheduling method for the wafer processing flow of the double-arm robot under the condition of the duplex cavity, and the operation of the double-arm robot is effectively coordinated and scheduled, so that the double-arm scheduling flow is optimal, the waiting time is reduced, the total processing time of each wafer is minimized, the production efficiency is improved, and the manufacturing cost is reduced.
The application sets the weight coefficient for representing different types of characteristics, and reasonably plans the total scheduling time while scheduling according to the cyclic scheduling flow so as to achieve the aim of optimizing the mechanical arm scheduling flow and minimizing the total scheduling time.
Additional features and advantages of the application will be set forth in the description which follows, or may be learned by practice of the application.
Detailed Description
The following describes specific embodiments of the present application.
The embodiment of a dual-arm robot scheduling method of EFEM machine equipment aims at the processing flow of each wafer:
s1, taking a wafer from the material box;
s2, placing the wafer into an Aligner;
s3, performing edge searching operation on the wafer;
s4, taking out the wafer with the edge being found at the Aligner;
s5, placing the wafer into a processing cavity;
s6, processing the wafer in a processing cavity;
s7, taking out the processed wafer from the processing cavity;
s8, placing the processed wafer back to the material box;
under a specific working condition, setting a scheduling period according to the time length of each step from S1 to S8, and completing the processing flow of two wafers in each scheduling period, wherein the specific working condition is as follows: the mechanical arms are two, namely a mechanical arm A and a mechanical arm B, the processing cavities are two, and one is arranged for the cavities A and B and the alignment;
in each scheduling period, the mechanical arm, the Aligner and the processing chamber meet the following conditions:
initially, the states of the two mechanical arms are idle, and the states of the Aligner and the processing cavity are idle;
when the method is started, after the two mechanical arms execute the S1 in sequence, the subsequent operation is carried out;
for the Aligner, selecting one mechanical arm to execute S4, taking out the wafer with the edge being found, immediately selecting the other mechanical arm to execute S2, and putting the other wafer into the Aligner to enable the Aligner to have no empty state;
for the processing cavity, selecting one mechanical arm to execute S7, immediately selecting the other mechanical arm to execute S5 after the processed wafer is taken out, and placing the other wafer into the processing cavity to enable the processing cavity to have no empty state;
the two mechanical arms do not act at the same time, and at any moment, one mechanical arm has no wafer.
Specifically, the scheduling process in each scheduling period includes:
1) Initializing: setting a time stamp and recording the current time; setting the states of the two mechanical arms to be idle; setting states of an Aligner and a processing chamber to be idle;
2) The mechanical arm A executes S1;
3) The mechanical arm B executes S1;
4) The mechanical arm A executes S2, and then the Aligner executes S3;
5) After the Aligner completes S3, the mechanical arm A executes S4;
6) The mechanical arm B executes S2, and then the Aligner executes S3;
7) The mechanical arm A executes S5, the wafer is placed in the cavity A, and then the cavity A executes S6;
8) The mechanical arm A re-executes S1;
9) Judging whether the Aligner in the step 6) is completed or not, if not, completing the Aligner, and then performing the step 10);
10 The mechanical arm B executes S4;
11 The mechanical arm a performs S2, and then the Aligner performs S3;
12 The mechanical arm B executes S5, the wafer is placed in the cavity B, and then the cavity B executes S6;
13 The mechanical arm B executes S1;
14 Judging whether the Aligner is completed S3, if not, waiting for completion, and then performing step 15);
15 The mechanical arm A executes S4;
16 The mechanical arm B performs S2, and then the Aligner performs S3;
17 Judging whether the cavity A is finished in S6, if not, waiting for finishing, and then performing step 18);
18 The mechanical arm B executes S7, and the processed wafer is taken out of the cavity A;
19 The mechanical arm A executes S5, the wafer is placed in the cavity A, and then the cavity A executes S6;
20 The mechanical arm B executes S8;
21 The mechanical arm A executes S1;
22 Judging whether the Aligner in the step 16) is completed S3, if not, waiting for completion, and then performing the step 23);
23 The mechanical arm B executes S4;
24 The mechanical arm a performs S2, and then the Aligner performs S3;
25 Judging whether the cavity B is finished in S6, if not finished, waiting for finishing, and then performing step 26);
26 S7, the mechanical arm A takes out the processed wafer from the cavity B;
27 The mechanical arm B executes S5, the wafer is placed in the cavity B, and then the cavity B executes S6;
28 The robot arm a performs S8.
Repeating steps 13) to 28) in the dispatching cycle until all wafers in the material box are processed and replaced in the material box.
Preferably, the robot arms start moving with the initial position of each robot arm as the starting point when executing S1, S4, S7, S8. I.e. the mechanical arm returns to the initial position to wait when being idle.
The embodiment sets a weight coefficient according to the type of the material box, the type of the mechanical arm and the type of the Aligner, and limits the total adjustment time based on the weight coefficient and the time length corresponding to each step from S1 to S8:
TIME=（T 1 ×（C1+C3）+T 2 ×（C2+C3）+T 3 ×C2+T 4 ×C3+T 5 ×C3+T 6 +T 7 ×C3+T 8 ×（C1+C3））×N 1 /N 2 +(T 1 +T 2 +T 3 +T 4 +T 5 +T 6 +T 7 +T 8 )/ N 2
in the method, in the process of the application,TIMEthe total time required to complete the process flow for all wafers in one cassette;T i (i=1, 2,3 …, 8) is the length of time required for each step S1 to S8;C1、C2、C3 are respectively weight coefficients for characterizing the type of the material box, the type of the Aligner and the type of the mechanical arm,C1+C2+C3=1；N 1 ,N 2 the total number of wafers in one material box and the number of processing cavities are respectively.
Specifically, for the material box, generally, each material box has 13 or 25 upper and lower slots, each slot is provided with a wafer, the mechanical arm takes the wafers from bottom to top, and the material box has main types of Foup, foup insert, open Cassette and the like. The Aligner is mainly divided into a vacuum adsorption type and an edge clamping type, and is a device for performing edge searching operation on wafers, and only one wafer is placed at the same time. The processing chamber is used to process wafers, such as photoresist, etching, cleaning, etc., and only one wafer can be placed at a time. For different types of material boxes, mechanical arms and aligners, the time length required by each step from S1 to S8 is different, so the embodiment sets the weight coefficient for representing different types of characteristics, and reasonably plans the total dispatching time while dispatching according to the above cyclic dispatching flow so as to achieve the purposes of optimal mechanical arm dispatching flow and minimum dispatching time.
Those of ordinary skill in the art will appreciate that: the foregoing description is only a preferred embodiment of the present application, and the present application is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present application has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (5)

1. A dual-arm robot scheduling method of EFEM machine equipment aims at the processing flow of each wafer:
s1, taking a wafer from the material box;
s2, placing the wafer into an Aligner;
s3, performing edge searching operation on the wafer;
s4, taking out the wafer with the edge being found at the Aligner;
s5, placing the wafer into a processing cavity;
s6, processing the wafer in a processing cavity;
s7, taking out the processed wafer from the processing cavity;
s8, placing the processed wafer back to the material box;
the method is characterized in that under a specific working condition, a scheduling period is set according to the duration of each step from S1 to S8, and the processing flow of two wafers is completed in each scheduling period, wherein the specific working condition is as follows: the mechanical arms are arranged in two, the processing cavities are arranged in two, and the alignment is arranged in one;
in each scheduling period, the mechanical arm, the Aligner and the processing chamber meet the following conditions:
initially, the states of the two mechanical arms are idle, and the states of the Aligner and the processing cavity are idle;
when the method is started, after the two mechanical arms execute the S1 in sequence, the subsequent operation is carried out;
for the Aligner, selecting one mechanical arm to execute S4, taking out the wafer with the edge being found, immediately selecting the other mechanical arm to execute S2, and putting the other wafer into the Aligner to enable the Aligner to have no empty state;
for the processing cavity, selecting one mechanical arm to execute S7, immediately selecting the other mechanical arm to execute S5 after the processed wafer is taken out, and placing the other wafer into the processing cavity to enable the processing cavity to have no empty state;
the two mechanical arms do not act at the same time, and at any moment, one mechanical arm has no wafer.
2. The method of claim 1, wherein the two processing chambers are chamber a and chamber B, respectively, the two robots are robot arm a and robot arm B, respectively, and the scheduling process in each scheduling cycle comprises:
1) Initializing: setting a time stamp and recording the current time; setting the states of the two mechanical arms to be idle; setting states of an Aligner and a processing chamber to be idle;
2) The mechanical arm A executes S1;
3) The mechanical arm B executes S1;
4) The mechanical arm A executes S2, and then the Aligner executes S3;
5) After the Aligner completes S3, the mechanical arm A executes S4;
6) The mechanical arm B executes S2, and then the Aligner executes S3;
7) The mechanical arm A executes S5, the wafer is placed in the cavity A, and then the cavity A executes S6;
8) The mechanical arm A re-executes S1;
9) Judging whether the Aligner in the step 6) is completed or not, if not, completing the Aligner, and then performing the step 10);
10 The mechanical arm B executes S4;
11 The mechanical arm a performs S2, and then the Aligner performs S3;
12 The mechanical arm B executes S5, the wafer is placed in the cavity B, and then the cavity B executes S6;
13 The mechanical arm B executes S1;
14 Judging whether the Aligner is completed S3, if not, waiting for completion, and then performing step 15);
15 The mechanical arm A executes S4;
16 The mechanical arm B performs S2, and then the Aligner performs S3;
17 Judging whether the cavity A is finished in S6, if not, waiting for finishing, and then performing step 18);
18 The mechanical arm B executes S7, and the processed wafer is taken out of the cavity A;
19 The mechanical arm A executes S5, the wafer is placed in the cavity A, and then the cavity A executes S6;
20 The mechanical arm B executes S8;
21 The mechanical arm A executes S1;
22 Judging whether the Aligner in the step 16) is completed S3, if not, waiting for completion, and then performing the step 23);
23 The mechanical arm B executes S4;
24 The mechanical arm a performs S2, and then the Aligner performs S3;
25 Judging whether the cavity B is finished in S6, if not finished, waiting for finishing, and then performing step 26);
26 S7, the mechanical arm A takes out the processed wafer from the cavity B;
27 The mechanical arm B executes S5, the wafer is placed in the cavity B, and then the cavity B executes S6;
28 The robot arm a performs S8.
3. The method of dual arm robotic scheduling of an EFEM tool apparatus of claim 2 wherein steps 13) through 28) are repeated during said scheduling period until all wafers in the pod are processed and replaced into the pod.
4. The method of claim 1, wherein the robotic arms start moving from an initial position of the robotic arms when performing S1, S4, S7, S8.
5. The method for scheduling the two-arm robot of the EFEM tool apparatus of claim 1, wherein a weight coefficient is set according to a cartridge type, a robot type, and an Aligner type, and a total scheduling time is defined based on the weight coefficient and a time length corresponding to each of steps S1 to S8:
TIME=（T 1 ×（C1+ C3）+ T 2 ×（C2+ C3）+ T 3 ×C2+ T 4 ×C3+T 5 ×C3+ T 6 + T 7 ×C3+ T 8 ×（C1+ C3））×N 1 / N 2 +( T 1 + T 2 + T 3 + T 4 + T 5 + T 6 + T 7 + T 8 ) / N 2
in the method, in the process of the application,TIMEthe total time required to complete the process flow for all wafers in one cassette;T i (i=1, 2,3 …, 8) is the length of time required for each step S1 to S8;C1、C2、C3 are respectively weight coefficients for characterizing the type of the material box, the type of the Aligner and the type of the mechanical arm,C1+C2+C3=1；N 1 , N 2 the total number of wafers in one material box and the number of processing cavities are respectively.
CN202310860882.8A 2023-07-14 2023-07-14 Dual-arm robot scheduling method of EFEM (electronic extended electromagnetic) machine equipment Pending CN116682770A (en)

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CN202310860882.8A CN116682770A (en) 2023-07-14 2023-07-14 Dual-arm robot scheduling method of EFEM (electronic extended electromagnetic) machine equipment

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