CN116652173A - Production process of copper powder for LTCC - Google Patents
Production process of copper powder for LTCC Download PDFInfo
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- CN116652173A CN116652173A CN202310882639.6A CN202310882639A CN116652173A CN 116652173 A CN116652173 A CN 116652173A CN 202310882639 A CN202310882639 A CN 202310882639A CN 116652173 A CN116652173 A CN 116652173A
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- copper
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 126
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 41
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims abstract description 38
- 239000005751 Copper oxide Substances 0.000 claims abstract description 33
- 229910000431 copper oxide Inorganic materials 0.000 claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 17
- 230000009467 reduction Effects 0.000 claims abstract description 13
- 230000001590 oxidative effect Effects 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims abstract description 6
- 238000000034 method Methods 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 19
- 239000010949 copper Substances 0.000 claims description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 14
- 230000008569 process Effects 0.000 claims description 9
- 239000007789 gas Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 5
- 239000003595 mist Substances 0.000 claims description 4
- 238000004062 sedimentation Methods 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 239000012498 ultrapure water Substances 0.000 claims description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 229910002091 carbon monoxide Inorganic materials 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000009700 powder processing Methods 0.000 abstract description 2
- 238000012545 processing Methods 0.000 abstract description 2
- 230000000052 comparative effect Effects 0.000 description 8
- 239000000843 powder Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000001354 calcination Methods 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 238000005070 sampling Methods 0.000 description 6
- 238000000889 atomisation Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000000498 ball milling Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010835 comparative analysis Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000009791 electrochemical migration reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/14—Treatment of metallic powder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
- B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
- B22F9/22—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds using gaseous reductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The application relates to the technical field of copper powder processing, and particularly discloses a production process of copper powder for LTCC, which comprises the following steps of; step 1: heating and oxidizing the atomized copper powder in air atmosphere to obtain copper oxide; step 2: placing the agglomerated copper oxide into crushing equipment for crushing and separating to obtain copper oxide particles; step 3: placing the copper oxide particles in a reduction furnace, heating and introducing reducing gas to reduce to obtain hardened copper powder blocks; step 4: feeding the hardened copper powder blocks into an airflow crusher to crush and then separating to obtain nano-scale solid copper powder; step 5: and (3) carrying out air classification and classification again to remove most of bonding particles and flat particles. The patent aims to solve the problems that the existing nanometer copper powder manufacturing process is high in cost, the prepared nanometer copper powder is small in occupied ratio, low in sphericity and poor in fluidity, and the LTCC manufacturing and processing requirements cannot be met.
Description
Technical Field
The application relates to the technical field of copper powder processing, in particular to a production process of copper powder for LTCC.
Background
Low temperature cofired ceramics (Low Temperature Co-fired Ceramic LTCC), a remarkable integrated component technology developed in recent years, have become the dominant technology for passive integration. The LTCC technology is to make low temperature sintered ceramic powder into compact ceramic belt, to make required circuit pattern on the ceramic belt via laser drilling, micro-hole grouting, precise conductor slurry printing, etc. and to embed several passive components, such as low capacitance capacitor, resistor, filter, etc. into multilayer ceramic substrate, to laminate, to make internal and external electrodes with silver, copper, gold, etc. metals, to sinter at 900 deg.c to produce three-dimensional non-interfering high density circuit, especially suitable for use in high frequency communication components.
In order to meet the LTCC use requirements, the metal powder should have the following performance characteristics: 1) The purity of the metal powder used is high so as to ensure good conductivity; 2) The morphology of the metal particles is required to be spherical or spheroid, the dispersibility is good, the particle size is controlled at the nanometer level, and the metal particles are required to be uniformly distributed. The spherical metal powder with uniform particle size can ensure the uniformity of the conductive paste, so that metal particles are in good contact after sintering; meanwhile, large particles occasionally existing in the powder can be prevented from penetrating through the dielectric layer to cause the structural defect of no lamination; 3) The tap density of the metal powder is large enough, and the larger the tap density of the metal powder is, the stronger the shrinkage resistance in the sintering process is, so that the metal powder is more suitable for manufacturing qualified slurry layers.
Copper powder has the advantages of good conductivity, low electrochemical migration behavior, low material cost and the like, and is increasingly focused by researchers. The nanometer superfine copper powder with high purity, good dispersivity, small particle size, narrow particle size distribution and good conductivity is a good material for LTCC manufacture. The existing nano copper powder is mainly prepared by evaporating copper at a high temperature of 2700 ℃, condensing copper steam, and then obtaining nano copper powder; the copper evaporating temperature is up to 2700 ℃, a large amount of fuel is needed to maintain, the production cost is high, and a large amount of cooling medium is needed for heat dissipation of high-temperature copper steam, so that the production cost of the nanoscale copper powder is further increased. The granularity of the copper powder manufactured by adopting a low-cost atomization mode is generally 3-45 mu m, the nanoscale copper powder has small proportion, the copper powder is in an irregular shape, and the granularity and the appearance can not meet the LTCC manufacturing requirement; the nanometer copper powder is prepared by ball-inking crude copper powder by a ball mill, but the nanometer copper powder prepared by the method is mainly flaky due to good ductility and plasticity of copper.
Disclosure of Invention
Aiming at the defects of the prior art, the application provides a production process of copper powder for LTCC, and solves the problems of high cost, small occupation ratio, low sphericity and poor fluidity of the prepared nanometer copper powder with low cost in the existing nanometer copper powder preparation process.
In order to solve the problems, the application adopts the technical scheme that the production process of the copper powder for the LTCC comprises the following steps: step 1: heating and oxidizing the atomized copper powder in air atmosphere to obtain copper oxide; step 2: placing the agglomerated copper oxide into crushing equipment for crushing and separating to obtain copper oxide particles; step 3: placing the copper oxide particles in a reduction furnace, heating and introducing reducing gas to reduce to obtain hardened copper powder blocks; step 4: feeding the hardened copper powder blocks into an airflow crusher to crush and then separating to obtain nano-scale solid copper powder; step 5: and (3) carrying out air classification and classification again to remove most of bonding particles and flat particles.
Further, the heating temperature in the step 1 is 350-400 ℃ and the heating time is 2-3 hours.
Further, the fluidized bed reduction temperature in the step 3 is 500-600 ℃, and the reduction time is 1.5-3 hours.
Further, the reducing gas is hydrogen or carbon monoxide.
Further, the particle size of the crude copper powder in the step 1 is 1-10 mu m.
Further, the particle size of the copper oxide particles after crushing in the step 2 is 0.45-0.65 mu m.
Further, the preparation of the atomized copper powder in the step 1 comprises the following steps:
s101: atomizing the high-pressure water, wherein the atomizing angle of the water mist spray head is 15-20 degrees;
s102: the atomized copper powder is separated by sedimentation, copper powder with the diameter of 1-10 mu m is screened out, and the copper powder is dried by adopting a baking oven.
Further, the high-pressure water pressure is 125-145MPa; the high-pressure water is high-purity water with conductivity less than 5 mu s/cm at 25 ℃.
The technical principle and the beneficial effects of the scheme are as follows: the method comprises the steps of adopting crude copper powder as a processing raw material, firstly heating and oxidizing the crude copper powder to obtain copper oxide, wherein at the moment, the copper oxide has adhesion agglomeration phenomenon, crushing the agglomerated copper oxide and then reducing the copper oxide in the next step, and reducing the copper oxide on a fluidized bed to ensure that copper oxide particles are not aggregated in a fluidized state, and fully contacting reducing gas with the copper oxide particles to ensure the reduction effect; porous copper particles are obtained after reduction, and the porous copper particles have holes due to the internal structure, so that the structural strength is reduced, and the porous copper particles are convenient to crush; high-energy crushing is carried out by adopting an air flow crusher, and porous copper particles are crushed to the nanometer level; and closing the gaps in the copper powder into solid copper powder under the impact of high-energy air flow and the mutual impact among particles, and finally separating to obtain the nanoscale copper powder.
The nanometer copper powder prepared by the method has uniform components, high density and high sphericity; tap density of 4.1-4.3g/cm 3 The method comprises the steps of carrying out a first treatment on the surface of the The copper content of the nano-scale copper powder prepared by the method is 99.95% -99.98%, the oxygen content is lower than 600ppm, the iron content is lower than 100ppm, and the content of the rest elements is lower than 20ppm; the heating and reducing temperature of the nano-scale copper powder prepared by the method is far lower than the temperature required by evaporation, and the energy consumption of the copper powder prepared by the method is low compared with that of the copper powder prepared by the evaporation method; compared with an atomization method, the copper powder prepared by the scheme has small granularity and high sphericity; meets the use requirement of LTCC.
Drawings
Fig. 1 is a diagram of the nano copper powder prepared in example 1 of the present application.
Fig. 2 is a graph of copper powder produced in the comparative example.
Detailed Description
The following is a further detailed description of the embodiments:
example 1: a production process of copper powder for LTCC comprises the following steps of;
step 1: preparing crude copper powder with granularity below 10 mu m by adopting an atomization method, wherein the purity of the crude copper powder is more than 99.99 percent, placing the crude copper powder in a DHZY rotary calcining kiln, calcining and oxidizing in air atmosphere, and heating at 380 ℃ for 2.5 hours to obtain copper oxide;
step 2: placing the agglomerated copper oxide into crushing equipment for crushing and separating, and destroying the bonding force among copper oxide particles to obtain copper oxide particles with the diameter of 0.45-0.65 mu m;
step 3: placing copper oxide particles in a reduction furnace, controlling the temperature of the reduction furnace at 550 ℃, and introducing hydrogen to reduce for 2 hours to obtain hardened copper powder blocks;
step 4: crushing the hardened copper powder blocks by an air flow crusher to separate copper powder with granularity of 600nm-1 mu m, 1-3 mu m and 3-5 mu m, wherein the copper powder accounts for 60%, 30% and 10% respectively;
step 5: and (5) carrying out secondary classification by adopting an air classifier to remove the binding particles and the flat particles.
The nano-scale solid copper powder prepared by the scheme is shown in figure 1, and has high sphericity and few needle-like particles.
The crushing equipment adopted in the step 2 is a high-energy stirring ball mill, the ball ink machine adopts a pure copper inner cylinder body, and the grinding medium is a 0.5mm pure copper ball, so that the impurity elements are prevented from being brought in.
The preparation of the atomized copper powder in the step 1 comprises the following steps:
s101: atomizing by using 130MPa high-pressure water, wherein the atomizing angle of a water mist spray head is 18 degrees, and the high-pressure water is high-purity water with conductivity less than 5 mu s/cm at 25 ℃;
s102: the atomized copper powder is separated by sedimentation, copper powder with the diameter of 1-10 mu m is screened out, and the copper powder is dried by adopting a baking oven.
Parameters of 4 different positions of the nano copper powder of example 1 were measured according to the MPIF sampling method as shown in table 1 below;
table 1: EXAMPLE 1 nanometer copper powder sampling Performance parameters
Example 2: a production process of copper powder for LTCC comprises the following steps of;
step 1: preparing coarse copper powder with granularity below 10 mu m by adopting an atomization method, wherein the purity of the coarse copper powder is 99.99%, placing the coarse copper powder in a DHZY rotary calcining kiln, and calcining and oxidizing in an air atmosphere to obtain copper oxide with oxygen content xx%; the heating temperature of the calciner is 350 ℃, the heating time is 3 hours,
step 2: placing the agglomerated copper oxide into crushing equipment for separation, and destroying the bonding force among copper oxide particles to obtain copper oxide particles, thereby obtaining copper oxide particles with the diameter of 0.65 mu m;
step 3: placing copper oxide particles in a reduction furnace, controlling the temperature of the reduction furnace at 580 ℃, introducing carbon monoxide gas, and reducing for 1 hour and 40 minutes to obtain hardened copper powder blocks;
step 4: the hardened copper powder blocks are fed into an air flow pulverizer to be pulverized, copper powder with the granularity of 600nm-1 mu m, 1-3 mu m and 3-5 mu m is separated, and the proportion is 61%, 30% and 9% respectively.
The crushing equipment adopted in the step 2 is a high-energy stirring ball mill, the ball ink machine adopts a pure copper inner cylinder body, the grinding medium is a 0.5mm pure copper ball, the impurity elements are prevented from being brought in, and the duration of the ball ink is 2 hours.
The preparation of the atomized copper powder in the step 1 comprises the following steps:
s101: atomizing by using high-pressure water of 135MPa, wherein the atomizing angle of a water mist spray head is 15 degrees, and the high-pressure water is high-purity water with conductivity less than 5 mu s/cm at 25 ℃;
s102: the atomized copper powder is separated by sedimentation, copper powder with the diameter of 1-10 mu m is screened out, and the copper powder is dried by adopting a baking oven.
Parameters for 4 different positions of the nano copper powder of example 2 were measured according to the MPIF sampling method as shown in table 2 below;
table 2: EXAMPLE 2 example nanometer copper powder sampling Performance parameters
Comparative example:
step 1: preparing coarse copper powder with granularity below 75 mu m by adopting an atomization method, controlling the purity of the coarse copper powder to be above 99.5%, placing the coarse copper powder in a DHZY rotary calcining kiln, and calcining and oxidizing in an air atmosphere to obtain copper oxide; the heating temperature of the calciner is 900 ℃, the heating time is 3 hours,
step 3: taking out the copper oxide powder, and then placing the copper oxide powder into a high-energy ball mill for ball milling to obtain nano-scale copper oxide powder;
step 4: the nano-scale copper oxide powder is placed into a fluidized bed, the temperature of the fluidized bed is controlled at 500 ℃, and ammonia decomposition atmosphere is introduced, so that the nano-scale copper oxide powder is reduced in a fluidized state for 2 hours, and the nano-scale copper powder is obtained.
The copper powder prepared in the comparative example is shown in fig. 2, the copper powder is in irregular particle shape, the sphericity is poor, and the finished product is porous copper powder, so that closed solid copper powder cannot be obtained.
Parameters of 4 different positions of the nano copper powder of the comparative example are measured according to the MPIF sampling method as shown in the following Table 3;
table 3: comparative example nano copper powder sampling performance parameter
The average properties of examples 1-2 and comparative examples are shown in Table 4 below:
table 4: average performance parameters of examples 1-2 and comparative examples
| Tap density (g/cm) 3 ) | Median diameter (mum) | Oxygen content (ppm) | Copper content (%) | |
| Example 1 | 4.2 | 0.94 | 275 | 99.96 |
| Example 2 | 4.2 | 0.98 | 402.5 | 99.95 |
| Comparative example | 3.68 | 2.1 | 537.5 | 99.96 |
As can be seen from the experimental data and the comparative analysis of the accompanying figures 1 and 2, the nanometer copper powder prepared by the method has uniform components,The density is high, and the sphericity is high; tap density of 4.1-4.3g/cm 3 The method comprises the steps of carrying out a first treatment on the surface of the The copper content of the nano-scale copper powder prepared by the method is 99.95% -99.98%, the oxygen content is lower than 600ppm, the iron content is lower than 100ppm, and the content of the rest elements is lower than 20ppm.
The foregoing is merely exemplary embodiments of the present application, and specific structures and features that are well known in the art are not described in detail herein. It should be noted that modifications and improvements can be made by those skilled in the art without departing from the structure of the present application, and these should also be considered as the scope of the present application, which does not affect the effect of the implementation of the present application and the utility of the patent. The protection scope of the present application is subject to the content of the claims, and the description of the specific embodiments and the like in the specification can be used for explaining the content of the claims.
Claims (9)
1. A production process of copper powder for LTCC is characterized by comprising the following steps: comprises the following steps of;
step 1: heating and oxidizing the atomized copper powder in air atmosphere to obtain copper oxide;
step 2: placing the agglomerated copper oxide into crushing equipment for crushing and separating to obtain copper oxide particles;
step 3: placing the copper oxide particles in a reduction furnace, heating and introducing reducing gas to reduce to obtain hardened copper powder blocks;
step 4: feeding the hardened copper powder blocks into an airflow crusher to crush and then separating to obtain nano-scale solid copper powder;
step 5: and (3) carrying out air classification and classification again to remove most of bonding particles and flat particles.
2. The process for producing copper powder for LTCC according to claim 1, wherein: the heating temperature in the step 1 is 350-400 ℃ and the heating time is 2-3 hours.
3. The process for producing copper powder for LTCC according to claim 1, wherein: the reduction temperature in the step 3 is 500-600 ℃, and the reduction time is 1.5-3 hours.
4. The process for producing copper powder for LTCC according to claim 1, wherein: the reducing gas is hydrogen or carbon monoxide.
5. The process for producing copper powder for LTCC according to claim 1, wherein: the particle size of the coarse copper powder in the step 1 is 1-10um.
6. The process for producing copper powder for LTCC according to claim 1, wherein: the particle size of the copper oxide particles after crushing in the step 2 is 0.45-0.65 mu m.
7. The process for producing copper powder for LTCC according to claim 1, wherein: the preparation of the atomized copper powder in the step 1 comprises the following steps:
s101: atomizing the high-pressure water, wherein the atomizing angle of the water mist spray head is 15-20 degrees;
s102: the atomized copper powder is separated by sedimentation, copper powder with the diameter of 1-10 mu m is screened out, and the copper powder is dried by adopting a baking oven.
8. The process for producing copper powder for LTCC according to claim 7, wherein: the high-pressure water pressure is 125-145MPa; the high-pressure water is high-purity water with conductivity less than 5 mu s/cm at 25 ℃.
9. The process for producing copper powder for LTCC according to claim 1, wherein: the crushing equipment is a high-energy stirring ball mill, the ball ink machine adopts a pure copper inner cylinder body, and the grinding medium is 0.5mm pure copper balls.
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| CN202310882639.6A CN116652173A (en) | 2023-07-18 | 2023-07-18 | Production process of copper powder for LTCC |
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| CN202310882639.6A CN116652173A (en) | 2023-07-18 | 2023-07-18 | Production process of copper powder for LTCC |
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