CN116643469A - Exposure apparatus and manufacturing method - Google Patents

Exposure apparatus and manufacturing method Download PDF

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Publication number
CN116643469A
CN116643469A CN202310794992.9A CN202310794992A CN116643469A CN 116643469 A CN116643469 A CN 116643469A CN 202310794992 A CN202310794992 A CN 202310794992A CN 116643469 A CN116643469 A CN 116643469A
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CN
China
Prior art keywords
substrate
holding
exposure apparatus
feeder
control device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202310794992.9A
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Chinese (zh)
Inventor
青木保夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
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Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of CN116643469A publication Critical patent/CN116643469A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The application provides an exposure apparatus and a manufacturing method. In order to achieve miniaturization of the apparatus, i.e., narrowing of the occupied area, the exposure apparatus includes: an optical system irradiating the substrate; a stage device that moves while holding the substrate; a holding portion for holding the substrate; a chamber for accommodating the optical system, the stage device, and the holding unit; and a control device for moving the stage device. The stage device includes a holding device. The holding portion is located at a position capable of holding the substrate when the substrate is located in the opening of the chamber. The control device makes the holding device hold the part which is not overlapped with the exposure area in the substrate held by the holding part under the holding part, makes the holding device receive the substrate from the holding part, moves the stage device to keep the stage device away from the holding part under the state that the part of the substrate is held by the holding device, and makes the optical system irradiate the substrate while moving the stage device for holding the substrate relative to the optical system.

Description

Exposure apparatus and manufacturing method
Related divisional application
The present application is a divisional application of patent application of application number 202080036828.6, entitled "Exposure apparatus, flat Panel display manufacturing method, and device manufacturing method", filed on 12 th month of 2020.
Technical Field
The present invention relates to an exposure apparatus and a manufacturing method.
Background
In a photolithography process for manufacturing electronic devices such as liquid crystal display devices and semiconductor devices, an exposure apparatus is used in which a pattern formed on a mask (or reticle) is transferred onto a substrate (a substrate including glass, plastic, or the like, a semiconductor wafer, or the like) using an energy beam.
In such an exposure apparatus, a substrate carrying device is used to carry out an exposed substrate on a stage device holding the substrate and to carry in a new substrate onto the stage device. As a method for transporting a substrate, for example, a method described in patent document 1 is known.
Prior art literature
Patent literature
Patent document 1: international publication No. 2013/150787
Disclosure of Invention
Technical means for solving the problems
The exposure device includes: an exposure apparatus body; a chamber for accommodating the exposure apparatus body; a substrate holding unit which receives and holds a substrate carried by an external carrying robot outside the chamber and is provided in the chamber; and a substrate transfer device that transfers the substrate from the external transfer robot to the substrate holding unit, transfers the substrate from the substrate holding unit to a holding device provided in the exposure apparatus main body, and transfers the substrate from the holding device to the external transfer robot.
The structure of the embodiment described below may be modified as appropriate, and at least a part of the structure may be replaced with another structure. The configuration elements are not particularly limited, and may be arranged at positions where the functions can be achieved, without being limited to the configurations disclosed in the embodiments.
Drawings
Fig. 1 (a) is a view schematically showing an exposure apparatus according to the first embodiment, and fig. 1 (b) is a sectional view taken along line A-A of fig. 1 (a).
Fig. 2 is a cross-sectional view of fig. 1 (a).
Fig. 3 (a) is a view showing the substrate carrying-in/out unit of fig. 1 (a), and fig. 3 (b) is a view showing the state of the substrate carrying-in/out unit of fig. 3 (a) viewed from the +x side.
Fig. 4 (a) and 4 (b) are plan views of the vicinity of the stage device and A-A cross-sectional view of fig. 1 (a), and are diagrams (one) for explaining the substrate replacement operation according to the first embodiment.
Fig. 5 (a) and 5 (b) are plan views of the vicinity of the stage device and A-A cross-sectional view of fig. 1 (a), and are diagrams (two) for explaining the substrate replacement operation according to the first embodiment.
Fig. 6 (a) and 6 (b) are plan views of the vicinity of the stage device and A-A cross-sectional view of fig. 1 (a), and are views (third) for explaining the substrate replacement operation according to the first embodiment.
Fig. 7 (a) and 7 (b) are plan views of the vicinity of the stage device and A-A cross-sectional view of fig. 1 (a), and are views (fourth) for explaining the substrate replacement operation according to the first embodiment.
Fig. 8 (a) and 8 (b) are plan views of the vicinity of the stage device and A-A cross-sectional view of fig. 1 (a), and are diagrams (fifth) for explaining the substrate replacement operation according to the first embodiment.
Fig. 9 (a) and 9 (b) are plan views of the vicinity of the stage device and A-A cross-sectional view of fig. 1 (a), and are diagrams (sixth) for explaining the substrate replacement operation according to the first embodiment.
Fig. 10 (a) and 10 (b) are plan views of the vicinity of the stage device and A-A cross-sectional view of fig. 1 (a), and are diagrams (seventh) for explaining the substrate replacement operation according to the first embodiment.
Fig. 11 (a) and 11 (b) are plan views of the vicinity of the stage device and A-A cross-sectional views of fig. 1 (a), and are diagrams (eighth) for explaining the substrate replacement operation according to the first embodiment.
Fig. 12 is a diagram (first) showing an exposure apparatus according to a second embodiment.
Fig. 13 is a diagram showing an exposure apparatus according to the second embodiment (second).
Fig. 14 is a cross-sectional view of an exposure apparatus according to the third embodiment.
Fig. 15 (a) and 15 (b) are a plan view and a longitudinal cross-sectional view of the vicinity of the stage device, and are diagrams (one) for explaining the substrate replacement operation according to the third embodiment.
Fig. 16 (a) and 16 (b) are a plan view and a longitudinal cross-sectional view of the vicinity of the stage device, and are diagrams for explaining the substrate replacement operation according to the third embodiment (second).
Fig. 17 (a) and 17 (b) are a plan view and a longitudinal cross-sectional view of the vicinity of the stage device, and are diagrams for explaining the substrate replacement operation according to the third embodiment (third).
Fig. 18 (a) and 18 (b) are a plan view and a longitudinal cross-sectional view of the vicinity of the stage device, and are views for explaining the substrate replacement operation according to the third embodiment (fourth).
Fig. 19 (a) and 19 (b) are a plan view and a longitudinal cross-sectional view of the vicinity of a stage device of the exposure apparatus according to the fourth embodiment, and are (one of) the following description of the substrate replacement operation.
Fig. 20 (a) and 20 (b) are a plan view and a longitudinal cross-sectional view of the vicinity of a stage device of the exposure apparatus according to the fourth embodiment, and are (a) and (b) for explaining a substrate replacement operation.
Fig. 21 (a) and 21 (b) are diagrams for explaining a substrate carry-in/out unit according to the fifth embodiment.
Fig. 22 (a) and 22 (b) are a cross-sectional view and a longitudinal-sectional view of the exposure apparatus according to the sixth embodiment, and are diagrams (one of them) for explaining a substrate replacement operation.
Fig. 23 (a) and 23 (b) are a cross-sectional view and a longitudinal-sectional view of the exposure apparatus according to the sixth embodiment, and are views for explaining a substrate replacement operation (second).
Fig. 24 is a longitudinal sectional view of the exposure apparatus according to the sixth embodiment, and is a view (third) for explaining a substrate replacement operation.
Fig. 25 is a longitudinal sectional view of an exposure apparatus according to a seventh embodiment.
Fig. 26 (a) and 26 (b) are a cross-sectional view and a longitudinal-sectional view of the exposure apparatus according to the eighth embodiment, and are diagrams (one) for explaining a substrate replacement operation.
Fig. 27 (a) and 27 (b) are diagrams for explaining the substrate replacement operation according to the eighth embodiment (second).
Fig. 28 (a) and 28 (b) are diagrams for explaining the substrate replacement operation according to the eighth embodiment (third).
Fig. 29 (a) and 29 (b) are diagrams for explaining the substrate replacement operation according to the eighth embodiment (fourth).
Fig. 30 (a) and 30 (b) are diagrams for explaining the substrate replacement operation according to the eighth embodiment (fifth).
Fig. 31 (a) and 31 (b) are a cross-sectional view and a longitudinal-sectional view of an exposure apparatus according to a ninth embodiment, and are diagrams (one) for explaining a substrate replacement operation.
Fig. 32 (a) and 32 (b) are diagrams for explaining a substrate replacement operation in the exposure apparatus according to the ninth embodiment (second).
Fig. 33 (a) and 33 (b) are cross-sectional views of an exposure apparatus according to a tenth embodiment, and are views (one of them) for explaining a substrate replacement operation.
Fig. 34 (a) and 34 (b) are cross-sectional views of an exposure apparatus according to a tenth embodiment, and are views for explaining a substrate replacement operation (second).
Fig. 35 (a) and 35 (b) are a cross-sectional view and a longitudinal-sectional view of the exposure apparatus according to the eleventh embodiment, and are diagrams (one of them) for explaining a substrate replacement operation.
Fig. 36 (a) and 36 (b) are a cross-sectional view and a longitudinal-sectional view of the exposure apparatus according to the eleventh embodiment, and are views (second) for explaining a substrate replacement operation.
Fig. 37 (a) and 37 (b) are a cross-sectional view and a longitudinal-sectional view of the exposure apparatus according to the eleventh embodiment, and are views (third) for explaining a substrate replacement operation.
Fig. 38 (a) to 38 (c) are longitudinal sectional views of an exposure apparatus according to an eleventh embodiment, and are views (fourth) for explaining a substrate replacement operation.
Fig. 39 (a) is a longitudinal cross-sectional view of the vicinity of the barrier member of the twelfth embodiment, and fig. 39 (B) is a B-B cross-sectional view of fig. 39 (a).
Fig. 40 (a) and 40 (b) are diagrams (one) for explaining the substrate replacement operation in the twelfth embodiment.
Fig. 41 (a) to 41 (c) are diagrams for explaining the substrate replacement operation in the twelfth embodiment (second).
Fig. 42 is a diagram for explaining a modification (first modification) of the substrate feeder.
Fig. 43 (a) and 43 (b) are diagrams for explaining a modification example (second) of the substrate feeder.
[ description of symbols ]
10: exposure device body
12: lighting system
14: mask carrier
16: projection optical system
20: carrier device
22: platen plate
23Y: y driving mechanism
23Z, 344: z driving mechanism
24: substrate platform
25: substrate loading and unloading carrier device
26: supporting device
27: adsorption pad
28: substrate support
28a, 216b: incision
28u: upper surface of
29: air floating component
32Y: y interferometer
34Y: y moving mirror
40: tape feeding mechanism
41. 146, 174, 246, 346: rail track
42: moving member
43: movable body
45: belt with a belt body
47: hammer component
48: pulley wheel
78: supporting frame
100. 100A to 100C: exposure apparatus
140: base plate sliding hand
142. 242, 342: adsorption pad
144: up-down moving mechanism
150. 150', 150A: substrate carry-in/out unit
152. 172: barrier member
152L, 172L: carrying-out port
152U, 172U: carrying-in port
154: carry-in port stop gate
155: holding part
156. 156': outlet stop gate
156a, 162, 176: rotary shaft
160. 161, 163, 165, 166, 167, 168, 169, 264, 364: substrate feeder
165a: first part
165b: second part
165c: driving mechanism
169a: groove(s)
171. 173: space of
172M: substrate through hole
172N: an opening
182: surrounding member
183: air exhaust device
186: suspension mechanism
196: rope cable
198a, 198b: opening and closing door
199: cover for vehicle
200: chamber chamber
200a: an opening
210: shockproof device
212: carrier base
214: side column
216: lens cone platen
218: mask stage guide
240: first sliding hand
265: block-shaped member
300. 300', 301: external carrying robot
300F, 300F': mechanical arm
301F: finger part
340: second sliding hand
A1 to A4, B1 to B5, C1, C2, D1 to D4, E1 to E7, F1 to F3, G1 to G4, H1, H2, J1 to J3, K1 to K4, L1 to L5, N1 to N3, Q1, Q2, R1 to R8, S1, S2, T1 to T13, U1, U2, V1 to V4, α1 to α9, α11 to α13, β1 to β3: arrows
A5: black arrow
F: floor board
IL: illumination light
M: mask for mask
P, P1, P2: substrate board
α10: dashed arrow
Detailed Description
First embodiment
A first embodiment of the present invention will be described below with reference to fig. 1 to 11.
Fig. 1 (a) is a vertical cross-sectional view schematically showing the structure of an exposure apparatus 100 according to the first embodiment. Fig. 1 (b) is a cross-sectional view taken along line A-A of fig. 1 (a), and fig. 2 is a cross-sectional view taken along line a of fig. 1 (a). In fig. 1 (b), the chamber 200 and the illumination system 12 are not shown for convenience.
As shown in fig. 1 (a), the exposure apparatus 100 includes a chamber 200, an exposure apparatus body 10 accommodated in the chamber 200, a substrate carry-in/out unit 150, and a substrate slide hand 140. An external transfer robot 300 is provided outside the chamber 200 of the exposure apparatus 100, and the external transfer robot 300 transfers the substrate P from an external apparatus (not shown) to the exposure apparatus 100 and transfers the substrate P from the exposure apparatus 100 to the external apparatus.
(Chamber 200)
The chamber 200 forms a space in which the internal environment (at least one of temperature, humidity, pressure, and cleanliness) is adjusted, and an opening 200a for carrying in and out the substrate P is formed in a part thereof.
(Exposure apparatus body 10)
The exposure apparatus body 10 is, for example, a so-called scanner, which is a projection exposure apparatus of a step-and-scan type using a rectangular (square) glass substrate P (hereinafter simply referred to as substrate P) used in a liquid crystal display (flat panel display) or the like as an exposure target.
The exposure apparatus main body 10 includes an illumination system 12, a mask stage 14 for holding a mask M having a pattern such as a circuit pattern formed thereon, a projection optical system 16, a stage device 20 for holding a substrate P having a surface (a surface facing the +z side in fig. 1 a) coated with a resist (a sensor), and a control system for the same. As shown in fig. 1 (a), the exposure apparatus body 10 is set with the X-axis, the Y-axis, and the Z-axis orthogonal to each other, and the mask M and the substrate P are assumed to be scanned relative to each other in the X-axis direction and the Y-axis is set in a horizontal plane during exposure. The directions of rotation (tilt) about the X-axis, Y-axis, and Z-axis will be described as θx, θy, and θz directions, respectively. The X-axis, Y-axis, and Z-axis positions will be described as X-position, Y-position, and Z-position, respectively.
The illumination system 12 is configured in the same manner as the illumination system disclosed in, for example, us patent No. 5,729,331, and irradiates the mask M with exposure illumination light (illumination light) IL. As the illumination light IL, for example, light having at least one wavelength of i-line (wavelength 365 nm), g-line (wavelength 436 nm), and h-line (wavelength 405 nm) is used. The wavelength of the light source used in the illumination system 12 and the illumination light IL irradiated from the light source is not particularly limited, and may be, for example, arF excimer laser (wavelength 193 nm) or KrF excimer laser (wavelength 248 nm) or the like, or F 2 Vacuum ultraviolet light such as laser (wavelength 157 nm).
The mask stage 14 holds a light-transmitting mask M. The mask stage 14 is mounted in a non-contact state on a pair of mask stage guides 218 fixed to the barrel platen 216. The pair of mask stage guides 218 are prismatic members whose X-axis direction is the longitudinal direction, and are arranged at predetermined intervals along the Y-axis direction as shown in fig. 1 (b). The mask stage 14 is driven in a scanning direction (X-axis direction) by a mask stage driving system (not shown) including a linear motor, for example. The mask stage 14 is driven by a micro-motion driving system that moves the X position or the Y position by a stroke to adjust the relative position to at least one of the illumination system 12, the stage device 20, and the projection optical system 16. The position information of the mask stage 14 is obtained by, for example, a mask stage position measurement system (not shown) including a linear encoder system or an interferometer system.
The projection optical system 16 is supported by a lens barrel platen 216 below the mask stage 14 (-Z side). The projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as that of the projection optical system disclosed in, for example, U.S. Pat. No. 6,552,775, and includes, for example, a plurality of optical systems having telecentricity (tele) on both sides for forming an orthographic image. In addition, the projection optical system 16 may be other than a multi-lens type. A projection optical system as used in a semiconductor exposure apparatus may also be included.
In the exposure apparatus main body 10, when the mask M located in a predetermined illumination area of the illumination light IL from the illumination system 12 is illuminated, a projection image (partial pattern image) of the pattern of the mask M in the illumination area is formed in the exposure area by the projection optical system 16. Then, the mask M is moved relative to the illumination region (illumination light IL) in the scanning direction, and the substrate P is moved relative to the exposure region in the scanning direction, whereby scanning exposure is performed on the substrate P, and the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred.
Stage assembly 20 includes platen 22, substrate stage 24, support assembly 26, and substrate support 28.
The platen 22 is provided on a pair of stage bases 212, and the pair of stage bases 212 are supported from the lower side by shock-absorbing devices 210 provided on the floor F. In addition, a pair of side columns (side columns) 214 are supported by a pair of stage bases 212, and a lens barrel platen 216 is supported by the pair of side columns 214. The platen 22 includes, for example, a rectangular plate-like member in plan view (as viewed from the +z side) arranged such that the upper surface (+z plane) is parallel to the XY plane.
The support device 26 is placed on the platen 22 in a noncontact state, and supports the substrate stage 24 from below in a noncontact state. The substrate holder 28 is disposed on the substrate stage 24, and the substrate stage 24 and the substrate holder 28 are integrally driven by a stage driving system, not shown, included in the stage device 20. The stage driving system includes: a coarse movement system including, for example, a linear motor, etc., can drive the substrate stage 24 in the X-axis and Y-axis directions (along the upper surface of the platen 22) by a predetermined stroke; and a micro-motion system including, for example, a voice coil motor, for finely driving the substrate stage 24 in the six degrees of freedom (X-axis, Y-axis, Z-axis, θx, θy, and θz) directions. The stage device 20 includes a stage measurement system including, for example, an optical interferometer system, an encoder system, and the like, and obtains positional information of the substrate stage 24 in the six-degree-of-freedom direction. Fig. 1 (b) and 2 illustrate a Y interferometer 32Y included in the stage measurement system, and a Y movable mirror (bar mirror) 34Y having a reflection surface orthogonal to the Y axis. The Y moving mirror 34Y is fixed to the substrate stage 24.
The substrate holder 28 has a rectangular upper surface 28u (+z-side surface) in plan view, and the substrate P is placed on the upper surface 28 u. As shown in fig. 2, the upper surface 28u of the substrate holder 28 has an aspect ratio substantially the same as that of the substrate P. As an example, the lengths of the long side and the short side of the upper surface 28u are set to be slightly shorter than the lengths of the long side and the short side of the substrate P, respectively.
The upper surface 28u of the substrate holder 28 is finished flat throughout the entire surface. A plurality of minute holes (not shown) for air blowing and minute holes (not shown) for vacuum suction are formed in the upper surface 28u of the substrate holder 28. Further, the fine holes for air blowing and the fine holes for vacuum suction may be used in combination. The substrate holder 28 may suck air between the upper surface 28u and the substrate P through the plurality of holes by using a vacuum suction force supplied from a vacuum apparatus (not shown), thereby sucking the substrate P on the upper surface 28u (plane correction). The substrate holder 28 is a so-called pin chuck type holder in which a plurality of pins (pins having a very small diameter, for example, a diameter of about 1 mm) are arranged at substantially uniform intervals. By providing the plurality of support rods, the substrate holder 28 can reduce the possibility of holding the substrate P by sandwiching refuse or foreign matter on the back surface thereof, and can reduce the possibility of deformation of the substrate P due to the sandwiching of the foreign matter. The substrate P is held (supported) on the upper surfaces of the plurality of struts. An XY plane formed by the upper surfaces of the plurality of struts is set as the upper surface of the substrate holder 28. The substrate holder 28 supplies (supplies) pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) between the upper surface 28u and the substrate P through the hole, and thereby the rear surface of the substrate P adsorbed to the substrate holder 28 can be isolated from the upper surface 28u (the substrate P can be lifted). In addition, the time difference is generated at the timing of supplying the pressurized gas in each of the holes formed in the substrate holder 28, or the place where the hole for vacuum suction and the hole for supplying the pressurized gas are appropriately replaced, or the air pressure is appropriately changed at the time of suction and supply, so that the ground contact state of the substrate P can be controlled (for example, the occurrence of air accumulation between the back surface of the substrate P and the upper surface 28u of the substrate holder 28 is avoided).
The substrate holder 28 may perform the plane correction of the substrate P in a floating and supporting state without sucking the substrate P to the upper surface 28u. At this time, the substrate holder 28 supplies (supplies) the pressurized gas (for example, air) supplied from the pressurized gas supply device (not shown) to the rear surface of the substrate P through the hole portion, thereby sandwiching the gas between the lower surface of the substrate P and the upper surface 28u of the substrate holder 28 (that is, forming a gas film). The substrate holder 28 sucks the gas between the substrate holder 28 and the substrate P through the holes for vacuum suction by using a vacuum suction device, and applies a force (preload) in the gravity direction to the substrate P, thereby imparting rigidity to the gas film in the gravity direction. The substrate holder 28 may hold (support) the substrate P in a noncontact manner with a slight play therebetween by balancing the pressure and flow rate of the pressurized gas and the vacuum suction force, and may apply a force for controlling the flatness (for example, a force for correcting or correcting the flatness) to the substrate P. The holes may be formed by machining the substrate holder 28, or the substrate holder 28 may be formed of a porous material, so that air is supplied or sucked. The upper surface 28u of the substrate holder 28 for floating and supporting the substrate P is not a surface on which the hole is formed, but a virtual surface above the surface by the above-described amount of play, that is, an upper surface of the substrate subjected to plane correction is set as the upper surface 28u.
As shown in fig. 1 (a) and 2, two cutouts 28a are formed at the-X-side end of the upper surface 28u of the substrate holder 28, for example, so as to be spaced apart in the Y-axis direction. A substrate loading carrier (loader) device 25 is provided near the two cutouts 28a. The substrate loading carrier device 25 includes: a suction pad 27 for sucking and holding the lower surface of the substrate P by a vacuum suction force supplied from a vacuum device not shown; a Z driving mechanism 23Z for driving the suction pad 27 along the Z axis direction; and a Y driving mechanism 23Y for driving the Z driving mechanism 23Z (and the suction pad 27) along the Y axis direction. The suction pad 27 is positioned on the most-Z side, and enters the slit 28a formed in the substrate holder 28. The suction pad 27 is located above the substrate holder 28 in a state of being located at the +z-most side.
In the exposure apparatus main body 10, the mask M is loaded onto the mask stage 14 by a mask loader, not shown, under the management of a main control device, not shown, and the substrate P is carried into the substrate holder 28 by a substrate carrying-in/out unit 150 or a substrate slide hand 140, which will be described later. Subsequently, the main control device executes alignment measurement using an alignment detection system (not shown), and after the alignment measurement is completed, the exposure operation of the step-and-scan method is successively performed on a plurality of exposure irradiation (shot) areas set on the substrate P. The exposure operation is similar to the exposure operation of the step-and-scan system that has been conventionally performed, and therefore the X direction is set as the scanning direction. Further, a detailed description about the exposure operation of the step-and-scan system will be omitted. Then, the substrate P after the exposure process is completed is carried out from the substrate holder 28 by the substrate slide hand 140 or the like, and another substrate P to be exposed next is carried into the substrate holder 28, whereby the substrate P on the substrate holder 28 is replaced, and a series of exposure operations for the plurality of substrates P is continuously performed.
(substrate carry-in/out Unit 150)
As shown in fig. 1 (a), the substrate carry-in/out unit 150 is provided near the opening 200a of the chamber 200. Fig. 3 (a) shows a state in which the substrate carrying-in/out unit 150 is taken out from fig. 1 (a), and fig. 3 (b) shows a state in which the substrate carrying-in/out unit 150 of fig. 3 (a) is viewed from the +x side.
As shown in fig. 3 (a), the substrate carry-in/out unit 150 includes: the XZ cross section is inverted L-shaped barrier member 152, carry-in shutter 154 and carry-out shutter 156 provided in the barrier member 152, and substrate feeder 160 fixed to the barrier member 152.
As shown in fig. 3 (a) and 3 (b), the barrier member 152 includes a carry-in port 152U and a carry-out port 152L, and the carry-in port 152U and the carry-out port 152L are rectangular in shape as viewed in the X-axis direction and are formed to penetrate in the X-axis direction. The size of the carry-in port 152U and the carry-out port 152L is a small opening through which the substrate P can pass, and it is difficult for the garbage to enter the chamber 200 through the carry-in port 152U and the carry-out port 152L. In the vicinity of the carry-in port 152U, a carry-in port shutter 154 that opens and closes the carry-in port 152U by sliding in the up-down direction (Z-axis direction) is provided. Further, in the vicinity of the carry-out port 152L, a carry-out port shutter 156 is provided that opens and closes the carry-out port 152L by rotating about a rotation shaft 156a extending in the Y-axis direction.
The substrate feeder 160 is cantilever-supported by the barrier member 152 at a predetermined height from the floor F by the barrier member 152. Here, the "predetermined height position" refers to a height position to which the stage device 20 can be positioned below the substrate feeder 160 when the stage device 20 is moved to the substrate replacement position (see fig. 8 (b)). The substrate feeder 160 includes a plate-like member having an XZ cross section in a substantially rectangular triangle shape, and an upper surface of the substrate feeder 160 is inclined with respect to the XY plane. In the example of fig. 3 (a), the +x side end of the upper surface of the substrate feeder 160 is parallel to the XY plane. On the upper surface of the substrate feeder 160, although not shown, a plurality of minute holes (not shown) for air blowing are formed. In the substrate feeder 160, a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (supplied) to the back surface of the substrate P placed on the upper surface of the substrate feeder 160 via the hole portion, whereby the back surface of the substrate P can be isolated from the upper surface of the substrate feeder 160 (the substrate P can be floated). The substrate feeder 160 has a hole for sucking and holding the lower surface of the substrate P by a vacuum suction force supplied from a vacuum apparatus not shown. The hole for supplying the pressurized gas and the hole for vacuum suction may be common holes. As shown in fig. 2, the substrate feeder 160 is provided above the corner of the +x side and +y side of the platen 22. As shown in fig. 1 (a), the end of the substrate feeder 160 on the-X side extends below the lens barrel platen 216, and a cutout 216a for avoiding contact with the substrate P held by the substrate feeder 160 is formed in a part of the lens barrel platen 216.
(substrate sliding hand 140)
As shown in fig. 2, the substrate sliding hand 140 is provided at the +y side of the substrate feeder 160. The substrate slide hand 140 includes a suction pad 142 and an up-and-down movement mechanism 144 for moving the suction pad 142 up and down (reciprocally driven in the Z-axis direction). The up-and-down movement mechanism 144 is movable in the X-axis direction along a rail 146, and the rail 146 is laid at a predetermined height from the floor F along the X-axis direction. That is, the suction pad 142 is movable in the X-axis direction and the Z-axis direction. The suction pad 142 can suction and hold the lower surface of the substrate P by a vacuum suction force supplied from a vacuum apparatus not shown.
The substrate slide hand 140 suctions and holds a portion of the lower surface of the substrate P conveyed by the external conveyance robot 300 and moves in the-X direction, thereby pulling the substrate P from the outside of the chamber 200 into the inside. The substrate slider 140 moves along the upper surface of the substrate feeder 160 while holding the substrate P that has been pulled into the chamber 200, and thereby delivers the substrate P to the substrate feeder 160. Further, the substrate slide hand 140 suctions and holds a portion of the lower surface of the exposed substrate P mounted on the substrate holder 28 and moves the substrate P in the +x direction, thereby sending the substrate P from the inside of the chamber 200 to the outside.
The external transfer robot 300 transfers the substrate P between an external device (not shown) such as a coater/developer (coater/developer) provided outside the exposure apparatus 100 (chamber 200) and the exposure apparatus 100. As shown in fig. 1 (a) or fig. 2, the external conveyance robot 300 has a flat plate-like manipulator 300F. On the upper surface of the robot 300F, although not shown, a plurality of minute holes (not shown) for air blowing are formed. In the robot 300F, a pressurized gas (for example, air) supplied from a pressurized gas supply device (not shown) is supplied (supplied) to the back surface of the substrate P placed on the upper surface of the robot 300F through the hole, whereby the back surface of the substrate P can be isolated from the upper surface of the robot 300F (the substrate P can be lifted). The robot 300F has a hole for sucking and holding the lower surface of the substrate P by a vacuum suction force of a vacuum apparatus, not shown. The hole for supplying the pressurized gas and the hole for vacuum suction may be common holes.
(substrate replacement action)
Next, the replacement operation of the substrate P on the substrate holder 28 in the exposure apparatus 100 will be described in detail with reference to fig. 1 (a) to 2 and fig. 4 (a) to 11 (b). The following substrate replacement operation is controlled by a main control device, not shown. In each of fig. 4 (a) to 11 (b) for explaining the substrate replacement operation, the running direction of the constituent elements is schematically shown by an outline arrow for the sake of understanding. Further, the state of sucking or supplying (supplying) the gas is schematically represented by a black arrow or a broken line arrow. Fig. 4 (a) and 4 (b) show a plan view of the vicinity of the stage device 20 at the same timing and A-A cross-sectional view of fig. 1 (a), and fig. 5 (a) and 5 (b), fig. 6 (a) and 6 (b), … and 11 (a) and 11 (b) show a plan view of the vicinity of the stage device at the same timing and A-A cross-sectional view. In fig. 4 (a) to 11 (b), illustration of unnecessary configuration in the description of the configuration of the exposure apparatus 100 is omitted.
On the premise of the explanation of the substrate replacement operation, it is assumed that the substrate P1 is mounted in advance on the substrate holder 28 of the stage device 20. In the substrate replacement operation, it is assumed that the operation of carrying out the exposed substrate P1 and the operation of carrying in (placing) the newly exposed substrate P2 (different from the substrate P1) to the substrate holder 28 are performed. The substrate P2 may be an unexposed (not exposed at all) substrate or may be a substrate subjected to a second or subsequent exposure.
As shown in fig. 1 (a) or fig. 2, in a state in which exposure is being performed on the substrate P1 in the exposure apparatus main body 10, the main control device drives the external conveyance robot 300 that holds the substrate P2 before exposure to the vicinity of the chamber 200 (the vicinity of the carry-in port 152U). Further, it is assumed that the hand 300F of the external transfer robot 300 is in contact with most of the lower surface (-Z surface) of the substrate P2, but is not in contact with the lower surface of the-X side end of the substrate P2.
(actions of (a) of FIG. 4 and (b) of FIG. 4)
From this state, the main control device opens the carry-in port 152U by sliding the carry-in port shutter 154 in the +z direction (see arrow A1 in fig. 4 (b)). Next, the main control device drives the external conveyance robot 300 in the-X direction (see arrow A2 in fig. 4 (a) and 4 (b)) to bring the end of the substrate P2 on the-X side into the chamber 200. Thus, the-X side end of the substrate P2 will be located above the substrate feeder 160. In the first embodiment, it is assumed that the external transfer robot 300 does not enter the chamber 200. This can prevent dust from entering the chamber 200 as much as possible.
Next, the main control device drives the substrate sliding hand 140 to move the suction pad 142 in the +x direction (the arrow A3 direction of fig. 4 b) and the +z direction (the arrow A4 direction), thereby bringing the suction pad 142 into contact with a portion of the lower surface (-X side and +y side end) of the substrate P2. Then, the main control device starts the suction and holding of the suction pad 142 to a part of the lower surface (-Z surface) of the substrate P2 (see a black arrow A5 in fig. 4 (b)).
(actions of (a) of FIG. 5 and (b) of FIG. 5)
Next, the main control device starts supply (gas supply) of the pressurized gas from the upper surface of the hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 160 (see arrows B1 and B2 in fig. 5B). Thereby, the substrate P2 floats from the upper surface of the robot 300F and the upper surface of the substrate feeder 160, and friction between the lower surface of the substrate P2 and the upper surface of the robot 300F and the upper surface of the substrate feeder 160 becomes negligible (low friction state). From this state, the main control device drives the suction pad 142 of the substrate slide hand 140 in the-X direction (the arrow B2 direction of fig. 5 (B)) and the-Z direction (the arrow B3 direction). That is, the suction pad 142 is moved in a direction along the upper surface of the substrate feeder 160 (in the direction of arrow B5 in fig. 5 (a) and 5 (B), and in a direction inclined from the X-axis and the Z-axis in the XZ plane). Thereby, the substrate P2 is conveyed into the chamber 200 along the upper surface of the robot 300F and the upper surface of the substrate feeder 160. The substrate P2 is moved by the substrate slider 140 while being supported on the upper surface of the robot 300F and the upper surface of the substrate feeder 160.
(actions of (a) of FIG. 6 and (b) of FIG. 6)
As described above, when the substrate P2 is conveyed along the upper surface of the robot 300F and the upper surface of the substrate feeder 160 to reach the positions shown in fig. 6 (a) and 6 (b), the main control device slides the carry-in shutter 154 in the-Z direction to close the carry-in 152U (see arrow C1 in fig. 6 (b)). This prevents the waste from entering the inside from the outside of the chamber 200 through the carry-in port 152U. The main control device drives the external conveyance robot 300 in the-X direction (see arrow C2 in fig. 6 (a) and 6 (b)). In addition, exposure to the substrate P1 is continued in the exposure apparatus body 10.
(actions of (a) of FIG. 7 and (b) of FIG. 7)
Next, the main control device drives a vacuum device, not shown, of the substrate feeder 160, and suctions and holds the substrate P2 by a vacuum suction force. Then, the main control device releases the suction and holding of the suction pad 142 of the substrate slide hand 140, and drives the suction pad 142 to descend in the-Z direction (see arrow D1 in fig. 7 (b)). The main control device drives the external conveyance robot 300 in the-Z direction (see arrow D2) and drives the external conveyance robot 300 in the-X direction (see arrow D3), thereby bringing the-X end of the hand 300F close to the carry-out port 152L. Further, the main control device drives the carry-out port shutter 156 to rotate in the counterclockwise direction (arrow D4 direction), thereby opening the carry-out port 152L. Thereby, the replacement preparation of the substrate on the substrate holder 28 is completed. Further, it is assumed that at this stage, the exposure operation for the substrate P1 on the substrate holder 28 ends.
(actions of (a) of FIG. 8 and (b) of FIG. 8)
After the exposure operation is completed, the main control device drives the stage device 20 to the substrate replacement position (below the substrate feeder 160) (see arrow E1 in fig. 8 a and 8 b). Next, the main control device slightly lifts the suction pad 27 of the substrate loading carrier device 25 (see arrow E2), and suctions and holds the lower surface of the substrate P1 to the suction pad 27 (see arrow E3). Then, the main control device starts the supply (supply) of the pressurized gas from the upper surface 28u of the substrate holder 28 (see arrow E4), and thereby slightly floats the substrate P1 with respect to the upper surface 28u of the substrate holder 28. Further, the main control device moves the suction pad 27 holding the substrate P1 in the +y direction (see arrow E5), and thereby slightly shifts the substrate P1 in the +y direction from the substrate holder 28. By this shift, the suction pad 142 of the substrate slide hand 140 can hold the corner of the lower surface of the substrate P1 on the-X side and the +y side.
The main control device drives the suction pad 142 of the substrate slider 140 to rise (see arrow E6) in a state where the substrate P1 is offset from the substrate holder 28, and suctions and holds the lower surface of the substrate P1 to the suction pad 142. It is assumed that the main control device starts supply (gas supply) of the pressurized gas from the upper surface of the hand 300F of the external transfer robot 300 at the stage of fig. 8 (a) and 8 (b) (see arrow E7). In addition, in the stage (b) of fig. 7, the main control device drives the carry-out port shutter 156 to rotate in the counterclockwise direction (the direction of arrow D4) to open the carry-out port 152L, but the carry-out port 152L may be opened in the stage (b) of fig. 8.
(actions of (a) of FIG. 9 and (b) of FIG. 9)
Next, the main control device drives the suction pad 142 of the substrate slide hand 140 in the +x direction (see arrow F1 in fig. 9 (a) and 9 (b)), and slides and conveys the substrate P1 from the substrate holder 28 to the robot 300F. Thereby, the exposed substrate P1 is transferred to the robot 300F. That is, the substrate P1 is moved by the substrate slide hand 140 while being supported on the upper surface of the substrate holder 28 and the upper surface of the robot 300F. The main control device stops the supply (intake) of the pressurized gas from the robot 300F at the timing when the robot 300F receives the substrate P1, and drives a vacuum device (not shown) to suction and hold the substrate P1 to the robot 300F by the vacuum suction force.
Then, the main control device drives the suction pad 27 of the substrate loading carrier device 25 to rise (see arrow F2) so as to be in contact with the-X end portion of the lower surface of the substrate P2 held by the substrate feeder 160, and starts suction holding of the substrate P2 by the suction pad 27 (see arrow F3).
(actions of (a) of FIG. 10 and (b) of FIG. 10)
Next, the main control device drives the stage device 20 in the-X direction with the substrate P2 held by the suction pads 27 of the substrate loading stage device 25 (see arrow G1). At this time, as the stage device 20 moves away from the substrate feeder 160, the area of the substrate P2 held by the substrate feeder 160 gradually decreases, and the area of the substrate P2 supported by the substrate holder 28 gradually increases. As a result, as shown in fig. 10 (a), the substrate P2 is transferred from the substrate feeder 160 to the substrate holder 28.
The main control device drives the suction pad 142, which has delivered the substrate P1 to the robot 300F, to descend (see arrow G2), and drives the carry-out port shutter 156 to rotate in the clockwise direction (see arrow G3), thereby closing the carry-out port 152L. This prevents the waste from entering the inside from the outside of the chamber 200 through the carry-out port 152L. The main control device drives the external transfer robot 300 (see arrow G4) holding the substrate P1 in the +x direction, and transfers the substrate P1 to an external apparatus.
(actions of (a) of FIG. 11 and (b) of FIG. 11)
When the transfer of the substrate P2 from the substrate feeder 160 to the substrate holder 28 is completed, the main control device stops the supply (gas supply) of the pressurized gas from the upper surface of the substrate feeder 160. Then, the main control device finely drives the suction pad 27 to align (adjust the position of) the substrate P2 (see arrow H1). Subsequently, the main control device drives the suction pad 27 to descend (see arrow H2), and starts suction holding of the substrate P2 by the substrate holder 28, thereby starting exposure of the substrate P2 newly mounted on the substrate holder 28.
Subsequently, the processes of fig. 4 (a), fig. 4 (b) to fig. 11 (a), and fig. 11 (b) are repeatedly performed, whereby exposure is repeatedly performed for a plurality of substrates P.
As described in detail above, according to the present first embodiment, the exposure apparatus 100 includes: an exposure apparatus body 10; a chamber 200 for accommodating the exposure apparatus body 10; a substrate feeder 160 for receiving and holding the substrate P transferred from the external transfer robot 300 outside the chamber 200; and a substrate slide hand 140 and a substrate loading carrier device 25 for transferring the substrate P from the external transfer robot 300 to the substrate feeder 160, transferring the substrate P from the substrate feeder 160 to the substrate holder 28 of the exposure apparatus body 10, and transferring the substrate P from the substrate holder 28 to the external transfer robot 300. Thus, a substrate transfer port portion conventionally provided for transferring the substrate P from the external transfer robot 300 to the substrate feeder 160 (for example, japanese patent application laid-open No. 2001-332600) is not required. Since the substrate transfer port is provided between the exposure apparatus main body 10 and the external transfer robot 300, in the exposure apparatus 100 in which the substrate transfer port is not provided, the apparatus can be miniaturized (the occupied area can be reduced) in accordance with the substrate transfer port. Further, by omitting the substrate transfer port portion, cost reduction of the exposure apparatus 100 can be achieved. Further, in the exposure apparatus having the substrate transfer port portion, the substrate P is transferred from the external transfer robot 300 to the substrate transfer port portion and from the substrate transfer port portion to the substrate holder 28 twice. Each time the substrate transfer operation is performed, the substrate P receives excessive stress, and the substrate P may be deformed or broken. Therefore, as in the first embodiment, when only one substrate transfer operation occurs between the exposure apparatus main body 10 and the external transfer robot 300, there is an effect that deformation or breakage of the substrate P is less likely to occur.
In the first embodiment, the substrate slider 140 moves in a direction including the X-axis direction in which the substrate feeder 160 and the substrate holder 28 are aligned when the substrate P is transferred from the substrate feeder 160 to the substrate holder 28 while holding a part of the substrate P. Thereby, the substrate P can be transferred from the substrate feeder 160 to the substrate holder 28 with the movement of the substrate slide hand 140.
In the first embodiment, the upper surface (substrate supporting surface) of the substrate feeder 160 is inclined with respect to the upper surface of the substrate holder 28, and the stage device 20 is moved in the-X direction while the substrate loading stage device 25 holds a part of the substrate P, whereby the substrate P is transferred from the substrate feeder 160 to the substrate holder 28. Accordingly, the substrate P can be transferred to the substrate holder 28 while sliding along the upper surface of the substrate feeder 160, and therefore, deflection or the like of the substrate P at the time of transferring the substrate P to the substrate holder 28 can be suppressed.
In the first embodiment, the external conveyance robot 300 does not enter the chamber 200 of the exposure apparatus 100, and dust adhering to the external conveyance robot 300 can be prevented from entering the chamber 200. Further, since the volume of the chamber 200 can be reduced, temperature management in the chamber 200 becomes easy. Further, since the external transfer robot 300 does not enter the chamber 200, contact between the external transfer robot 300 and each part of the exposure apparatus 100 can be suppressed as much as possible. Further, the opening connecting the inside of the chamber 200 to the outside of the chamber 200 is provided with only the carry-in port 152U and the carry-out port 152L having the size enough to move the substrate P, so that the entry of the garbage into the chamber can be prevented.
In the first embodiment, the +x side end of the upper surface of the substrate feeder 160 is parallel to the XY plane. Thus, the substrate slide hand 140 can easily receive the substrate P conveyed by the external conveyance robot 300.
In the first embodiment, the substrate P on the substrate holder 28 is transferred to the external transfer robot 300 while the substrate P is held on the upper surface of the substrate feeder 160, and then the substrate P held by the substrate feeder 160 is immediately transferred to the substrate holder 28. Thus, even without the substrate transfer port portion, the substrate on the substrate holder 28 can be quickly replaced.
In the first embodiment, since the carry-in port 152U and the carry-out port 152L of the barrier member 152 are provided independently, the carry-in port 152U and the carry-out port 152L are not simultaneously opened during the substrate replacement operation, and the carry-in port 152U and the carry-out port 152L are opened and closed individually, so that entry of dust can be suppressed.
In the first embodiment, the case where the suction pad 27 of the substrate loading carrier device 25 is movable in the Y-axis direction has been described, but the present invention is not limited thereto. For example, even if the substrate P on the substrate holder 28 is not moved (offset) in the Y-axis direction, the suction pad 142 of the substrate slide hand 140 can suction and hold the lower surface of the substrate P, and the suction pad 27 may not be moved in the Y-axis direction.
In the first embodiment, the case where the hand 300F of the external transfer robot 300 is a flat plate-like member capable of floating the substrate P in air on the upper surface has been described, but the present invention is not limited thereto. For example, the robot 300F may be a fork-shaped member or the like as long as the substrate P can be slid without dust generation. Further, the robot 300F may have a rotating roller that conveys the substrate P in the X-axis direction by rolling contact. By providing the rotating roller in the robot 300F, friction when the substrate P contacts the robot 300F can be reduced, and dust generation can be suppressed.
In the first embodiment, a mechanism for providing a buoyancy force to the substrate P by supplying (supplying) pressurized gas may be provided near the carry-in port 152U or the carry-out port 152L of the substrate carry-in/carry-out unit 150. Further, a rotating roller for conveying the substrate P in the X-axis direction by rolling contact may be provided near the carry-in port 152U or the carry-out port 152L of the substrate carry-in/carry-out unit 150.
In the first embodiment, the case where the substrate feeder 160 is fixed to the barrier member 152 of the substrate carry-in/out unit 150 has been described, but the present invention is not limited thereto. The substrate feeder 160 may also be secured to a member different from the barrier member 152.
In the first embodiment, the substrate feeder 160 is provided above the corner portion on the +x side and the +y side of the platen 22, but the present invention is not limited thereto. The substrate feeder 160 may be provided above, for example, the center portion in the Y axis direction at the +x side end portion of the platen 22 as long as the exposure operation is not obstructed.
In the first embodiment, the description has been made of the case where the carry-in shutter 154 and the carry-out shutter 156 are provided in the barrier member 152 of the substrate carry-in/out unit 150, but the present invention is not limited thereto. That is, at least one of the carry-in shutter 154 and the carry-out shutter 156 may be provided in the chamber 200.
Second embodiment
Next, an exposure apparatus according to a second embodiment will be described with reference to fig. 12 and 13. The configuration of the exposure apparatus 100A according to the second embodiment is the same as that of the first embodiment except that the configuration and operation of a part of the substrate feeder are different, and therefore only the differences will be described below, and elements having the same configuration and function as those of the first embodiment are denoted by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.
Fig. 12 is a diagram showing an exposure apparatus 100A according to the second embodiment (corresponding to fig. 1 (a) of the first embodiment).
In the first embodiment, the substrate feeder 160 is fixed to the barrier member 152 of the substrate carry-in/out unit 150, but in the substrate carry-in/out unit 150A of the second embodiment, as shown in fig. 12, the substrate feeder 161 is attached to the rotation shaft 162 provided in the barrier member 152.
The shape and function of the substrate feeder 161 are the same as those of the substrate feeder 160 of the first embodiment, but the substrate feeder 161 is attached to a rotation shaft 162 extending in the Y-axis direction, so that rotation about the rotation shaft 162 becomes possible. Although not shown in fig. 12 and 13, the substrate feeder 161 is rotated by a driving mechanism (including a motor, etc.) not shown.
In the second embodiment, the notch 216b formed in the barrel platen 216 is set larger than the notch 216a of the first embodiment along with the substrate feeder 161 being rotatable, so as to avoid mechanical interference with the substrate feeder 161 or the substrate slider 140.
The substrate feeder 161 shifts between a state in which the upper surface (substrate supporting surface) shown in fig. 12 is parallel to the XY plane and a state in which the substrate supporting surface shown in fig. 13 is inclined with respect to the XY plane (the same state as the first embodiment).
(substrate replacement action)
In the second embodiment, when the substrate P (P2) is carried in from the outside of the chamber 200 by the substrate slide hand 140, the main control device controls the driving mechanism so that the substrate support surface (upper surface) is kept parallel to the XY surface as shown in fig. 12. When the substrate slide hand 140 pulls the substrate P (P2) into the substrate feeder 161, the main control device supplies (supplies) pressurized gas from the upper surface of the external transfer robot 300 and the substrate support surface of the substrate feeder 161. Thereby, the substrate support surface (upper surface) of the substrate feeder 161 and the support surface of the external transfer robot can be flush (in the same plane). In this state, the main control device moves the substrate P2 by the substrate slide hand 140, and thus can prevent deformation or breakage of the substrate due to excessive stress applied to the substrate P2.
As shown in fig. 12, when the substrate P (P2) is transferred to the substrate feeder 161, the main control device starts the suction holding of the substrate P (P2) by the substrate feeder 161. Then, the main control device controls the driving mechanism to rotate the substrate feeder 161 in the counterclockwise direction as shown in fig. 13, and after tilting the substrate support surface of the substrate feeder 161 with respect to the XY plane, the substrate on the substrate holder 28 is replaced as in the first embodiment.
As described above, according to the present second embodiment, the substrate feeder 161 can be shifted between the state in which the substrate support surface is parallel to the XY plane and the state in which the substrate support surface is inclined, and therefore, can be set to an appropriate state (posture) when the substrate P is received from the external conveyance robot 300 or when the substrate P is transferred to the substrate holder 28. This reduces the possibility that the carry-in port 152U or the substrate feeder 161 contacts the substrate P.
Further, the substrate slide hand 140 does not need to change the height position (the position in the Z axis direction) of the suction pad 142 when the substrate P (P2) is carried into the chamber 200 from the external carrying robot 300, and thus control of the suction pad 142 can be simplified.
In the second embodiment, since the substrate support surface of the substrate feeder 161 can be inclined and the-X end of the substrate P (P2) newly placed on the substrate holder 28 can be brought close to the upper surface of the substrate holder 28 at the time of substrate replacement, the stroke (or 0) in the Z direction of the suction pad 142 of the substrate carry-in carrier device 25 can be shortened, and transfer of the substrate P (P2) to the substrate holder 28 can be smoothly performed without an impact.
In the second embodiment, the case where the rotation shaft 162 is located at the +x end of the substrate feeder 161 has been described, but the present invention is not limited thereto, and the rotation shaft 162 may be located at the middle of the substrate feeder 161 in the X axis direction, for example.
Third embodiment
Next, an exposure apparatus according to a third embodiment will be described with reference to fig. 14 to 18. Fig. 14 shows a cross-sectional view of an exposure apparatus 100B according to the third embodiment (corresponding to fig. 2 of the first embodiment).
The exposure apparatus 100 according to the first embodiment includes the substrate slider 140, but the exposure apparatus 100B according to the third embodiment includes the first slider 240 and the second slider 340 instead of the substrate slider 140.
The first slider 240 is provided on an upper surface (substrate supporting surface) of the substrate feeder 163. The substrate feeder 163 has the same structure and function as the substrate feeder 160 of the first embodiment. The first slider 240 has: a rail 246 provided on the substrate supporting surface of the substrate feeder 163; and a suction pad 242 moving along a rail 246. In addition, assuming that the rail 246 is fitted into the substrate feeder 163, there is no step between the upper surface of the rail 246 and the upper surface (substrate supporting surface) of the substrate feeder 163. The first slider 240 adsorbs and holds a part of the substrate P transferred by the external transfer robot 300 and moves in the-X direction, and thereby the substrate P can be pulled into the chamber 200 (onto the substrate feeder 163).
The second slider 340 is provided on the +x side surface of the stage device 20 (substrate stage 24). The second slider 340 has the same structure as the substrate slider 140 of the first embodiment, and includes a rail 346 extending in the X-axis direction, a Z drive mechanism 344 moving in the X-axis direction along the rail 346, and a suction pad 342 driven in the Z-axis direction by the Z drive mechanism 344. The second slider 340 adsorbs and holds a part of the substrate P mounted on the substrate holder 28 and moves in the +x direction, whereby the substrate P can be transferred from the substrate holder 28 to the external transfer robot 300.
That is, in the third embodiment, the same function as the substrate slider 140 of the first embodiment is realized by the first slider 240 and the second slider 340.
The other configuration of the exposure apparatus 100B is the same as that of the exposure apparatus 100 of the first embodiment.
(substrate replacement action)
Next, the replacement operation of the substrate P on the substrate holder 28 in the exposure apparatus 100B will be described in detail with reference to fig. 14 to 18 (B). Fig. 15 (a) and 15 (b) show a plan view and a longitudinal section view of the vicinity of the stage device 20 at the same timing, and fig. 16 (a) and 16 (b), fig. 17 (a) and 17 (b), and fig. 18 (a) and 18 (b) show a plan view and a longitudinal section view of the vicinity of the stage device at the same timing. In fig. 15 (a) to 18 (B), illustration of unnecessary configuration in the description of the configuration of the exposure apparatus 100B is omitted.
In the substrate replacement operation, it is assumed that the operation of carrying out the exposed substrate P1 and the operation of carrying in (placing) the newly exposed substrate P2 (different from the substrate P1) to the substrate holder 28 are performed. In a state in which exposure is being performed on the substrate P1 on the substrate holder 28 in the exposure apparatus main body 10, the main control device drives the external transfer robot 300 that holds the substrate P2 before exposure to the vicinity of the chamber 200 (the vicinity of the carry-in port 152U), as shown in fig. 14. Further, it is assumed that at this stage, the suction pad 242 of the first slider 240 is located at the +x end of the rail 246.
(actions of (a) of FIG. 15 and (b) of FIG. 15)
From this state, the main control device opens the carry-in port 152U by sliding the carry-in port shutter 154 in the +z direction (see arrow J1 in fig. 15 (b)). Next, the main control device drives the external conveyance robot 300 in the-X direction (see arrow J2 in fig. 15 (a) and 15 (b)) to bring the end of the substrate P2 on the-X side into the chamber 200. Thereby, the-X side end of the lower surface of the substrate P2 will approach or contact the suction pad 242. Then, the main control device starts the suction and holding of the suction pad 242 on a part of the lower surface of the substrate P2 (see arrow J3 in fig. 15 (b)).
(actions of (a) of FIG. 16 and (b) of FIG. 16)
Next, the main control device starts supply (supply) of the pressurized gas from the upper surface of the hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 163, and drives the suction pad 242 of the first slider 240 toward the-X side (the arrow K1 direction in fig. 16 (a) and 16 (b)) along the rail 246. Thereby, the substrate P2 is conveyed into the chamber 200 along the upper surface of the robot 300F and the upper surface of the substrate feeder 163. After the substrate P2 is transferred onto the substrate feeder 163, the main control device stops the supply of the pressurized gas from the substrate feeder 163 and the robot 300F, and starts the suction and holding of the substrate P2 by the substrate feeder 163. The main control device closes the carry-in shutter 154 and opens the carry-out shutter 156. When the exposure of the substrate P1 in the stage device 20 is completed, the main control device drives the stage device 20 to the position (substrate replacement position) shown in fig. 16 a and 16 b (see arrow K2).
When the stage device 20 moves to the vicinity of the substrate replacement position, the main control device starts the supply of the pressurized gas from the upper surface 28u of the substrate holder 28, and drives the suction pad 27 of the substrate loading stage device 25 in the +z direction and the +y direction so that the substrate P1 is shifted from the substrate holder 28 to the +y side (see arrow K3 in fig. 16 (a)). The main control device drives the external conveyance robot 300 in the +x direction (see arrow K4).
(actions of (a) of FIG. 17 and (b) of FIG. 17)
The main control device drives the external conveyance robot 300 in the-Z direction and the-X direction (see arrows L1 and L2 in fig. 17 b), thereby bringing the-X end of the hand 300F close to the carry-out port 152L. The main control device starts supply (gas supply) of the pressurized gas from the upper surface of the robot 300F.
The main control device drives the suction pad 342 of the second slider 340 to rise, and the lower surface of the substrate P1 is sucked and held by the suction pad 342. Then, the main control device drives the suction pad 342 along the rail 346 in the +x direction (see arrow L3), and slides and conveys the substrate P1 from the substrate holder 28 to the robot 300F. After the substrate P1 is slidingly transferred to the robot 300F, the main control device drives the robot 300F in the +x direction, withdraws the substrate P1 to the outside of the chamber 200, and closes the carry-out port shutter 156.
Then, the main control device drives the suction pad 27 of the substrate loading carrier device 25 to rise (see arrow L4), and starts suction holding of the suction pad 27 on the-X end portion of the substrate P2 (see arrow L5). Further, the main control device starts the supply of the pressurized gas from the upper surface of the substrate feeder 163.
(actions of (a) of FIG. 18 and (b) of FIG. 18)
The main control device drives the stage device 20 in the-X direction in a state where the substrate P2 is sucked and held by the suction pads 27 of the substrate loading stage device 25 (see arrow N1). Thereby, the substrate P2 is transferred from the substrate feeder 163 to the substrate holder 28. In addition, while the substrate P2 is transferred from the substrate feeder 163 to the substrate holder 28, pressurized gas is supplied from the upper surface of the substrate holder 28.
On the other hand, when the entire substrate P2 is transferred from the substrate feeder 163 to the substrate holder 28, the main control device stops the supply of the pressurized gas from the upper surface of the substrate feeder 163. The main control device finely drives the suction pad 27 to align (adjust the position of) the substrate P2. Subsequently, the main control device drives the suction pad 27 to descend (see arrow N2), and starts exposure of the substrate P2 newly mounted on the substrate holder 28.
Then, the main control device drives the external transfer robot 300 (see arrow N3) in the +x direction, and thereby transfers the substrate P1 to the external device.
Subsequently, the above-described processes of fig. 15 (a), 15 (b) to 18 (a), and 18 (b) are repeatedly performed, whereby exposure is repeatedly performed on a plurality of substrates P.
As described in detail above, the third embodiment includes: a first slider 240 for pulling the substrate P from the outside of the chamber 200 into the chamber 200; and a second slider 340 for carrying the substrate P out of the chamber 200 from the inside of the chamber 200. This improves the degree of freedom in design, and therefore, for example, the substrate replacement position of the stage device 20 can be set to the +x side end portion of the platen 22, the vicinity of the Y axis direction center portion, and the like.
In the third embodiment, since the first slider 240 is provided at the center of the substrate feeder 163 in the Y-axis direction, a space is created on the +y side and the-Y side of the substrate feeder 163. This allows design changes such as holding of the substrate feeder 163 from the Y-axis direction.
In the third embodiment, since the second slider 340 is provided to the stage device 20, the substrate carrying-out operation can be started before the stage device 20 reaches the substrate replacement position.
In the third embodiment, since the rail 246 of the first slider 240 is provided along the upper surface (substrate supporting surface) of the substrate feeder 163, control can be simplified as compared with the case where control in the X-axis and Z-axis directions is performed at the time of driving the suction pad 242 as in the first embodiment. Further, the rail 146 does not need to be provided as in the first and second embodiments, and the number of parts can be reduced.
In the third embodiment, since the second slider 340 is provided to the stage device 20, the substrate carrying-out operation can be started before the stage device 20 reaches the substrate replacement position.
In the third embodiment, the posture (inclination of the substrate support surface) of the substrate feeder 163 may be changed as in the second embodiment.
Fourth embodiment
Next, an exposure apparatus 100C according to a fourth embodiment will be described with reference to fig. 19 and 20. As shown in fig. 19 (a) and 19 (b), the exposure apparatus 100C of the fourth embodiment has substantially the same configuration as the exposure apparatus 100 of the first embodiment, but is different in that the substrate feeder 160 has a function of holding the substrate P in a non-contact overhang manner on the lower surface.
For example, holes for discharging pressurized gas are formed in the lower surface of the substrate feeder 160, and air is discharged according to the known Bernoulli's suction cup (Bernoulli's suction cup), whereby a negative pressure can be generated between the upper surface of the substrate P and the lower surface of the substrate feeder 160. Therefore, in the fourth embodiment, the substrate P can be held in a non-contact overhang manner (that is, the upper surface of the substrate P is held in a non-contact manner on the lower surface of the substrate feeder 160) by the negative pressure generated between the upper surface of the substrate P and the lower surface of the substrate feeder 160. However, the present invention is not limited thereto, and a hole for vacuum suction and a hole for pressurized gas exhaust may be provided in advance in the lower surface of the substrate feeder 160, and the substrate P may be held in a non-contact state by balancing vacuum suction and air exhaust using these holes.
(substrate replacement action)
Fig. 19 (a) and 19 (b) show diagrams corresponding to fig. 8 (a) and 8 (b) of the first embodiment. The states of fig. 19 (a) and 19 (b) are such that the substrate P2 before exposure is held on the upper surface of the substrate feeder 160, and the stage device 20 and the exposed substrate P1 are positioned to face the lower surface of the substrate feeder 160. In this state, the substrate P1 is slightly offset in the +y direction with respect to the substrate holder 28, and the pressurized gas is supplied from the upper surface 28u of the substrate holder 28, whereby the lower surface of the substrate P1 and the upper surface of the substrate holder 28 are brought into a non-contact state. The suction pad 142 of the substrate slide hand 140 is in a state of suctioning and holding a part of the lower surface of the substrate P1.
From this state, the main control device discharges the pressurized gas from the lower surface of the substrate feeder 160, thereby holding the substrate P1 in a non-contact overhang at the lower surface of the substrate feeder 160 by the principle of the bernoulli chuck.
Next, the main control device suctions and holds a part of the substrate P2 on the substrate feeder 160 to the suction pad 27 of the substrate loading carrier device 25, and starts supply of the pressurized gas from the upper surface of the substrate feeder 160. As shown in fig. 20 a and 20 b, the main control device starts transfer of the substrate P1 to the external transfer robot 300 by moving the suction pad 142 of the substrate slide hand 140 in the +x direction (see arrow Q1), and transfers the substrate P2 from the substrate feeder 160 to the substrate holder 28 by driving the stage device 20 in the-X direction (see arrow Q2). Further, since the substrate P1 is held by the lower surface of the substrate feeder 160 while being held in contact with the lower surface by the negative pressure as described above, as shown in fig. 20 (b), when the substrate P1 is slidingly conveyed by the substrate loading carrier device 25, the substrate P1 can be smoothly slidingly conveyed to the external conveying robot 300 even if the substrate holder 28 is not present on the lower side of the substrate P1.
As described above, according to the fourth embodiment, the substrate P1 carried out to the outside is held in a non-contact overhang on the lower surface of the substrate feeder 160, and therefore the stage device 20 may not stand by at the substrate replacement position until the substrate P1 is transferred from the substrate holder 28 to the external transfer robot 300. As a result, as shown in fig. 20 (b), the operation of placing a new substrate P2 on the substrate holder 28 can be started at a stage before the substrate P1 is transferred to the external transfer robot 300. Therefore, according to the fourth embodiment, the time required for substrate replacement can be shortened. Further, after the substrate P2 is placed on the substrate holder 28 and the stage device 20 is moved in the-X direction, the substrate P1 held on the lower surface of the substrate feeder 160 in a noncontact manner may be transferred to the external transfer robot 300. Accordingly, when the stage device 20 is located near the carry-out port 152L, the carry-out port shutter 156 can be closed, and therefore, even if garbage enters the chamber 200 from the carry-out port 152L, the possibility that the garbage adheres to the stage device 20 is low.
In addition, the substrate feeder 160 of the fourth embodiment may be provided with the barrier member 152 rotatably in the same manner as in the second embodiment. That is, the upper surface of the substrate feeder 160 may be shifted between a state horizontal to the XY plane and a state inclined.
In the fourth embodiment, the first slider 240 and the second slider 340 may be provided in place of the substrate slider 140, as in the third embodiment.
Fifth embodiment
Next, a fifth embodiment will be described with reference to fig. 21. Fig. 21 (a) shows a substrate carry-in/out unit 150' according to a fifth embodiment. The substrate carry-in/out unit 150 'has a substrate feeder 165 instead of the substrate feeder 160 of the substrate carry-in/out unit 150 of the first embodiment, and has an carry-out shutter 156' instead of the carry-out shutter 156.
The substrate feeder 165 has: a first portion 165a fixed to the-X side surface of the barrier member 152, and a second portion 165b slidably movable with respect to the first portion 165 a. The sliding movement direction of the second portion 165b is assumed to be the same direction as the inclination direction of the upper surface (substrate supporting surface) of the second portion 165b (the direction inclined with respect to the X-axis and the Z-axis in the XZ-plane). As shown in fig. 21 (b), for example, a driving mechanism 165c of a feed screw type is provided between the first portion 165a and the second portion 165b. The drive mechanism 165c drives the second portion 165b to alter the spacing between the second portion 165b and the first portion 165 a. The driving mechanism 165c is not limited to the feed screw type, and may be another type of driving mechanism including a linear motor.
In the fifth embodiment, the substrate feeder 165 is configured as described above, and therefore, the first portion 165a and the second portion 165b are brought close to each other as shown in fig. 21 (a) except for the replacement of the substrate. This can prevent the substrate feeder 165 from being an obstacle to an exposure operation, maintenance, or other operations. Further, at the time of substrate replacement, the second portion 165b of the substrate feeder 165 is moved as shown in fig. 21 (b), whereby the substrate replacement position can be set to a position closer to the-X side. This can shorten the stroke in the X axis direction when the stage device 20 moves to the substrate replacement position.
In the fifth embodiment, the substrate feeder 165 is used as described above, and the substrate replacement position is set to the X side of the first embodiment or the like, so that the distance between the substrate holder 28 and the external transfer robot 300 may be increased during substrate replacement. However, in the fifth embodiment, as shown in fig. 21 (b), the length in the X-axis direction of the carry-out port shutter 156 'when the carry-out port 152L is opened is set longer than the carry-out port shutter 156 shown in fig. 1 (b) or the like, and the carry-out port shutter 156' is provided with a buoyancy imparting mechanism for supplying pressurized gas from the +z side surface to the upper side in the state of fig. 21 (b). The carry-out port shutter 156' moves in the opposite direction to the carry-out port shutter 156 (moves clockwise when the carry-out port 152L is opened and moves counterclockwise when the carry-out port 152L is closed) when the carry-out port 152L is opened and closed. Thus, the carry-out gate 156' can bridge the substrate P between the substrate holder 28 and the external transfer robot 300. Therefore, according to the fifth embodiment, the substrate P can be transferred from the substrate holder 28 to the external transfer robot 300 without bending the substrate.
In the fifth embodiment, when the carry-out port shutter 156 'opens the carry-out port 152L (fig. 21 (b)), the +x end of the carry-out port shutter 156' is located at substantially the same position as the +x end of the carry-out port 152L. As a result, the external transfer robot 300 can receive the substrate from the substrate holder 28 at a position closer to the +x side than the transfer outlet 152L, and therefore, entry of dust into the chamber 200 can be suppressed as much as possible.
In the fifth embodiment, the same carry-out shutter 156 as in the first to fourth embodiments may be used instead of the carry-out shutter 156'.
In addition, as in the case of the carry-out port shutter 156' according to the fifth embodiment, the carry-out port shutter 156 described in the first to fourth embodiments may be provided with a function of supplying pressurized gas from the upper surface in a state where the carry-out port 152L is opened.
In the fifth embodiment, the substrate feeder 165 may be rotatably provided in the same manner as in the second embodiment.
Sixth embodiment
Next, a sixth embodiment will be described with reference to fig. 22 to 24. Fig. 22 (a) and 22 (b) show a cross-sectional view and a longitudinal cross-sectional view of an exposure apparatus according to a sixth embodiment. The sixth embodiment is a modification of the third embodiment (fig. 14 to 18), and as shown in fig. 22 (a), the width of the substrate feeder 166 in the Y-axis direction is set to be wider than the width of the substrate feeder 163 in the Y-axis direction in fig. 14. As shown in fig. 22 (b), the substrate feeder 166 is rotatably supported near the +x end thereof by a rotation shaft 176 extending in the Y-axis direction. The substrate feeder 166 is suspended and supported by suspension mechanisms 186 provided in the barrier member 152 at two positions near both ends in the Y-axis direction. In addition, in the barrier member 152 according to the sixth embodiment, unlike the barrier members 152 according to the first to fifth embodiments, a holding portion 155 for holding a hanging mechanism 186 is provided.
The suspension mechanism 186 has two cables 196 that suspend and support the substrate feeder 166, and the inclination of the upper surface (substrate supporting surface) of the substrate feeder 166 is adjusted by winding or unwinding the two cables 196 to adjust the length. In the sixth embodiment, the substrate feeder 166 is configured as described above, and therefore, even when the rigidity in the vicinity of the rotation axis 176 of the substrate feeder 166 is low, the deflection of the substrate feeder 166 can be suppressed by the small force of the suspension mechanism 186, and the posture of the substrate feeder 166 can be accurately controlled.
(substrate replacement action)
In the sixth embodiment, the main control device controls the suspension mechanism 186 to maintain the upper surface (substrate supporting surface) of the substrate feeder 166 horizontal as shown in fig. 22 b when the substrate replacement operation is performed. Then, the main control device slides the carry-in shutter 154 in the +z direction to open the carry-in 152U (see arrow R1), and brings the external transfer robot 300 close to the carry-in 152U (see arrow R2), thereby positioning the-X end of the substrate P2 near the +x end of the substrate support surface of the substrate feeder 166. Further, it is assumed that at this stage, the suction pad 242 of the first slider 240 is located at the +x end of the rail 246.
Next, the main control device starts the suction and holding of the suction pad 242 on a part of the lower surface of the substrate P2 (see arrow R3 in fig. 22 (b)).
Next, the main control device starts supply (gas supply) of the pressurized gas from the upper surface of the hand 300F of the external transfer robot 300 and the upper surface of the substrate feeder 166, and drives the suction pad 242 of the first slider 240 toward the-X side along the rail 246 as shown in fig. 23 a and 23 b (see arrow R4). Thereby, the substrate P2 is pulled into the chamber 200 along the upper surface of the robot 300F and the upper surface of the substrate feeder 166. After the substrate P2 is transferred onto the substrate feeder 166, the main control device stops the supply of the pressurized gas from the substrate feeder 166 and the robot 300F, and starts the suction and holding of the substrate P2 by the substrate feeder 166.
Next, the main control device closes the carry-in shutter 154 and opens the carry-out shutter 156. When the exposure of the substrate P1 in the stage device 20 is completed, the main control device drives the stage device 20 to the position (substrate replacement position) shown in fig. 24 (see arrow R5).
Next, as shown in fig. 24, the main control device controls the suspension mechanism 186 to adjust the length of the cable 196 (see arrow R6), thereby tilting the substrate support surface of the substrate feeder 166. Then, the main control device starts the supply of the pressurized gas from the upper surface 28u of the substrate holder 28, drives the suction pad 27 of the substrate loading carrier device 25 in the +z direction and the +y direction, and shifts the substrate P1 from the substrate holder 28 to the +y side. The main control device positions the external transfer robot 300 to a position near the transfer outlet 152L shown in fig. 24, and starts supply (gas supply) of the pressurized gas from the upper surface of the robot arm 300F.
The main control device drives the suction pad 342 of the second slider 340 to rise, and the lower surface of the substrate P1 is sucked and held by the suction pad 342. The main control device drives the suction pad 342 along the rail 346 in the +x direction, and slides and conveys the substrate P1 from the substrate holder 28 to the robot 300F. After the substrate P1 is slidingly transferred to the robot 300F, the main control device drives the robot 300F in the +x direction, withdraws the substrate P1 to the outside of the chamber 200, and closes the carry-out port shutter 156. The main control device drives the external transfer robot 300 in the +x direction to transfer the substrate P1 to the external device.
Then, the main control device drives the suction pad 27 of the substrate loading carrier device 25 to rise (see arrow R7), and starts suction holding of the suction pad 27 on the-X end portion of the substrate P2 (see arrow R8). Further, the main control device starts the supply of the pressurized gas from the upper surface of the substrate feeder 166.
The main control device drives the stage device 20 in the-X direction in a state where the substrate P2 is sucked and held by the suction pads 27 of the substrate loading stage device 25. As a result, as in fig. 18 (b), the substrate P2 is transferred from the substrate feeder 166 to the substrate holder 28. In addition, during the time that the substrate P2 is transferred from the substrate feeder 166 to the substrate holder 28, the pressurized gas is supplied from the upper surface of the substrate holder 28.
On the other hand, when the substrate P2 is transferred from the substrate feeder 166 to the substrate holder 28, the main control device stops the supply of the pressurized gas from the upper surface of the substrate feeder 166. After the alignment (position adjustment) of the substrate P2 is performed, the main control device drives the suction pad 27 to descend, and starts exposure of the substrate P2 newly mounted on the substrate holder 28.
Subsequently, the above-described process is repeatedly performed, whereby exposure is repeatedly performed for a plurality of substrates P.
In the sixth embodiment, the substrate feeder 166 is suspended and held by the pair of ropes 196, but the present invention is not limited thereto. For example, the support may be suspended by a mechanism having no flexibility. For example, the substrate feeder 166 may be suspended and supported by a cylinder or the like.
The substrate feeder 166 may be a substrate feeder having a first portion and a second portion as in the fifth embodiment (see fig. 21 a).
Seventh embodiment
Next, a seventh embodiment will be described with reference to fig. 25. Fig. 25 shows a state in which the stage device 20 has been positioned to the substrate replacement position in the exposure apparatus of the seventh embodiment.
In the seventh embodiment, the substrate feeder 167 is supported on its upper surface by a support frame 78 provided on the +y side of the substrate feeder 167. The substrate feeder 167 is characterized in that a substrate P (P2) newly carried onto the substrate holder 28 is held in a non-contact overhang on the lower surface side. The mechanism for non-contact overhang holding is the same as the fourth embodiment. In the seventh embodiment, the barrier members 152 of the first to sixth embodiments are not provided, and the opening/closing doors 198a and 198b for opening/closing the opening 200a are provided in the chamber 200.
In the seventh embodiment, since the barrier member 152 is omitted as described above, the occupied area of the entire exposure apparatus can be reduced. Further, since the substrate feeder 167 is supported on the upper surface side, the occurrence of deflection of the substrate feeder 167 can be suppressed as compared with the case where the substrate feeder 167 is cantilever-supported.
(substrate replacement action)
The main control device opens the open/close doors 198a and 198b (see arrow S1) during the exposure operation in the stage device 20, and controls the external transfer robot 300 to position the-X end of the newly loaded substrate P2 below the +x end of the lower surface of the substrate feeder 167. Then, the main control device starts non-contact hanging holding of the substrate P2 on the lower surface of the substrate feeder 167, and conveys the substrate P2 to the position shown in fig. 25 using the substrate slider 140.
The main control device holds the substrate P1 on the substrate holder 28 by the substrate slide hand 140 and drives the substrate P1 in the +x direction, as in the previous embodiment, and slides and conveys the exposed substrate P1 from the substrate holder 28 to the hand 300F of the external conveyance robot 300 (see arrow S2).
Subsequently, the main control device suctions and holds the substrate P2 to the suction pad 27 of the substrate loading carrier device 25, and drives the carrier device 20 in the-X direction, thereby transferring the substrate P2 from the substrate feeder 167 to the substrate holder 28.
The following operations are the same as those of the third embodiment.
Eighth embodiment
Next, an eighth embodiment will be described in detail with reference to fig. 26 to 30. Fig. 26 (a) and 26 (b) show a cross-sectional view and a longitudinal-sectional view of an exposure apparatus according to an eighth embodiment. In fig. 26 to 30, the chamber 200 is not shown for convenience.
In the eighth embodiment, the hand 300F 'of the external transfer robot 300' has a flat plate-like member in which the end on the-X side is processed into a comb-like shape. However, as in the previous embodiments, the robot 300F' supplies pressurized gas from the upper surface, thereby supporting the substrate P by air floating and vacuum sucking the substrate P.
In the eighth embodiment, the barrier member 172 is used instead of the barrier member 152 described in the first embodiment and the like. The barrier member 172 has a box-like portion forming a space 173, and a substrate feeder 168 is provided on an upper surface of an upper wall (+z-side wall) of the box-like portion. The conveyance outlet 172L is provided in the wall on the +x side of the box-shaped portion, and the substrate passage opening 172M is provided in the wall on the-X side of the box-shaped portion. Further, a carry-in port 172U is provided above the carry-out port 172L of the barrier member 172. The carry-out port shutter 156 is provided near the carry-out port 172L, and the carry-in port shutter 154 is provided near the carry-in port 172U. Further, since fig. 26 (b) is a cross-sectional view, the +y side and-Y side of the box-shaped portion are closed by a wall, although not shown.
The substrate feeder 168 is reciprocally movable in the X-axis direction along a pair of rails 174 laid along the X-axis direction on the upper surface of the upper wall of the box-shaped portion of the barrier member 172. The movable range of the substrate feeder 168 in the X-axis direction is about half the length of the substrate P in the X-axis direction.
In the eighth embodiment, a plurality of (four in fig. 26 a) rod-shaped air floating members 29 are provided on the +x side end surface of the substrate holder 28 at predetermined intervals in the Y axis direction. An opening, not shown, is provided in the upper surface (+z-plane) of the air-floating member 29, and pressurized gas is supplied from the opening.
(substrate replacement action)
Next, a substrate replacement operation in the eighth embodiment will be described with reference to fig. 26 to 30. Fig. 26 (a) and 26 (b), fig. 27 (a) and 27 (b), and fig. 28 (a) and 28 (b) show a cross-sectional view and a longitudinal cross-sectional view of the vicinity of the stage device at the same timing. In fig. 26 (a) to 30 (b), illustration of unnecessary configuration in the description of the configuration of the exposure apparatus is omitted.
(actions of (a) of FIG. 26 and (b) of FIG. 26)
In the state of fig. 26 (a) and 26 (b), the substrate P1 is exposed in the stage device 20. On the other hand, the main control device opens the carry-in port 152U by sliding the carry-in port shutter 154 in the +z direction in order to receive the substrate P2 to be exposed next into the chamber 200 (see arrow T1 in fig. 26 (b)). Next, the main control device drives the external conveyance robot 300' (see arrow T2 in fig. 26 (a) and 26 (b)) in the-X direction to bring the end of the substrate P2 on the-X side into the chamber 200. Thus, the-X side end of the substrate P2 will be above the +X end of the substrate feeder 168. Then, the main control device starts the suction holding by bringing the suction pad 142 of the substrate slider 140 into contact with a part of the lower surface of the substrate P2. The main control device starts supply of the pressurized gas from the upper surface of the hand 300F 'of the external transfer robot 300' and the upper surface of the substrate feeder 168.
(actions of (a) of FIG. 27 and (b) of FIG. 27)
The main control device drives the suction pad 142 to move the substrate P2 along the substrate support surface (upper surface) of the substrate feeder 168 (see arrow T3).
(actions of (a) of FIG. 28 and (b) of FIG. 28)
When the substrate P2 is moved to the position shown in fig. 28 (a) and 28 (b) by the movement of the suction pad 142, the main control device drives the external conveyance robot 300' (see arrow T4) downward (-Z direction) and positions the substrate P to the vicinity of the carry-out port 172L. Then, the main control device slides the carry-in port shutter 154 in the-Z direction to close the carry-in port 172U (see arrow T5).
(action of (a) of FIG. 29)
Subsequently, when the exposure of the substrate P1 in the stage device 20 is completed, the main control device moves the stage device 20 to the substrate replacement position (see arrow T6). In a state where the stage device 20 is positioned to the substrate replacement position, as shown in fig. 29 (a), the air floating member 29 enters the space 173 through the substrate passage port 172M. Then, the main control device starts the suction and holding of the substrate P2 by the substrate feeder 168, and drives the substrate feeder 168 in the-X direction along the rail 174 (see arrow T7). In addition, the suction pad 142 holding the substrate P2 may be moved in the-X direction in synchronization with the movement of the substrate feeder 168, or the suction pad 142 may be moved in the-X direction by previously releasing the suction and holding of the substrate P2 by the suction pad 142 when the substrate feeder 168 is moved.
Then, the main control device opens the outlet 172L by sliding the outlet shutter 156 in the-Z direction (see arrow T8). Then, the main control device drives the external conveyance robot 300' in the-X direction, and thereby causes the external conveyance robot 300 to enter the space 173 formed by the barrier member 172 (see arrow T9). In this state, the substrate holder 28 and the air floating member 29 are substantially aligned with the upper surface of the hand 300F 'of the external transfer robot 300'. Further, the air floating member 29 is in a nested state with the comb-tooth-shaped portion of the robot 300F', so that mechanical interference (contact) is avoided.
(action of (b) of FIG. 29)
Next, the main control device slightly lifts the suction pad 27 of the substrate loading carrier device 25, and suctions and holds the lower surface of the substrate P1 to the suction pad 27. The main control device starts supply (gas supply) of the pressurized gas from the upper surface of the substrate holder 28, and moves the suction pad 27 that suctions and holds the substrate P1 in the +y direction, thereby slightly shifting the substrate P1 from the substrate holder 28 in the +y direction. By this shift, the suction pad 142 of the substrate slide hand 140 can hold the corner of the lower surface of the substrate P1 on the-X side and the +y side.
Next, the main control device suctions and holds a portion of the lower surface of the substrate P1 by the suction pad 142 of the substrate slider 140. It is assumed that the main control device starts supply (gas supply) of the pressurized gas from the upper surfaces of the air floating member 29 and the robot 300F' at the stage (b) of fig. 29.
Next, the main control device starts the movement of the suction pad 142 of the substrate slide hand 140 in the +x direction (see arrow T10). Then, the main control device drives the suction pad 27 (see arrow T11) of the substrate loading carrier device 25 in the +z direction at a timing when the substrate P1 has moved a predetermined distance in the-X direction, and starts suction and holding of the-X end portion of the substrate P2 on the substrate feeder 168 by the suction pad 27.
(action of (a) of FIG. 30)
Next, the main control device starts supply (gas supply) of the pressurized gas from the upper surface of the substrate feeder 168. The main control device drives the stage device 20 in the-X direction while the substrate P2 is sucked and held by the suction pads 27 of the substrate loading stage device 25 (see arrow T12). The main control device drives the stage device 20 in the-X direction and moves the substrate feeder 168 in the +x direction. Thereby, as shown in fig. 10 (a), the substrate P2 is transferred from the substrate feeder 168 to the substrate holder 28. Accordingly, the substrate P2 can be carried into the substrate holder 28 at a higher speed by driving the stage device 20 and the substrate feeder 168 away from each other in the X direction than by driving the stage device 20 in the-X direction alone. This is possible because of the device structure in which the space 173 is provided in the chamber 200, and the substrate feeder 168 can be driven in the +x direction. The timing of driving the stage device 20 in the-X direction may be different from the timing of moving the substrate feeder 168 in the +x direction. The main control device may move the substrate feeder 168 in the +x direction after the substrate P2 has been transferred to the substrate holder 28.
(action of (b) of FIG. 30)
The main control device continues the movement of the suction pad 142 in the +x direction, and thereby transfers the substrate P1 to the hand 300F 'of the external transfer robot 300', as shown in fig. 30 (b). When the transfer is completed, the main control device stops the suction and holding of the suction pad 142 on the substrate P1. The main control device drives the external transfer robot 300' (see arrow T13) holding the substrate P1 in the +x direction, and transfers the substrate P1 to an external device. Then, the main control device slides the carry-out port shutter 156 in the +z direction to close the carry-out port 172L (see arrow T14).
The subsequent operations are the same as those of the first embodiment and the like.
As described in detail above, according to the eighth embodiment, the loading operation of the substrate P2 into the substrate holder 28 and the unloading operation of the substrate P1 from the substrate holder 28 can be performed in parallel, and therefore, the time required for the substrate replacement operation can be shortened.
In the eighth embodiment, the air floating member 29 is provided on the +x side of the substrate holder 28, and the-X side end of the hand 300F 'of the external transfer robot 300' is comb-shaped. As a result, the air floating member 29 and the robot 300F' are nested, and therefore, deflection of the substrate P at the time of transferring the substrate P can be suppressed.
In the eighth embodiment, as in the fourth embodiment, the substrate (the carried substrate) may be supported on the lower surface of the substrate feeder 168 in a noncontact manner.
In the eighth embodiment, a shutter for opening and closing the substrate passage opening 172M may be provided. Further, a shutter for opening and closing the substrate passage opening 172M may be provided, and the carry-out port shutter 156 may be omitted.
In the eighth embodiment, the rail 146 of the substrate slide hand 140 may be provided to the substrate feeder 168. At this time, since the substrate feeder 168 may move in the X-axis direction, the length of the rail 146, that is, the X-stroke of the suction pad 142 may be shortened.
Ninth embodiment
Next, a ninth embodiment will be described with reference to fig. 31 and 32. Fig. 31 (a) and 31 (b) show a cross-sectional view and a longitudinal-sectional view of an exposure apparatus according to a ninth embodiment.
The exposure apparatus according to the ninth embodiment is characterized in that a substrate feeder 169 is used instead of the substrate feeder 168 according to the eighth embodiment. A plurality of grooves 169a (three grooves in fig. 31 a) are formed on the +x side of the upper surface of the substrate feeder 169. The dimensions and the intervals of the grooves 169a are set so that the substrate feeder 169 does not come into contact with the robot 300F ' even when the robot 300F ' of the external transfer robot 300' enters from the carry-in port 172U. The other structure is the same as that of the eighth embodiment.
(substrate replacement action)
Next, a substrate replacement operation in the ninth embodiment will be described with reference to fig. 31 and 32. Fig. 31 (a) and 31 (b), and fig. 32 (a) and 32 (b) show a cross-sectional view and a longitudinal cross-sectional view of the vicinity of the stage device at the same timing. In fig. 31 (a) to 32 (b), illustration of unnecessary configuration in the description of the configuration of the exposure apparatus is omitted.
It is assumed that exposure is being performed on the substrate P1 mounted on the substrate holder 28 in the stage device 20 in the states of fig. 31 (a) and 31 (b). In this state, the main control device opens the carry-in port 172U by sliding the carry-in port shutter 154 in the +z direction in order to receive the substrate P2 to be exposed next into the chamber 200 (see arrow U1 in fig. 31 b). Next, the main control device drives the external conveyance robot 300' (see arrow U2 in fig. 31 (a) and 31 (b)) in the-X direction. By the operation of the external transfer robot 300', as shown in fig. 32 (a) and 32 (b), about half of the robot arm 300F' on the-X side and about half of the robot arm P2 on the-X side are positioned above the substrate feeder 169.
Next, the main control device drives the robot 300F' to descend, thereby delivering a part of the substrate P2 to the substrate feeder 169.
The main control device starts supply of the pressurized gas from the substrate support surface (upper surface) of the substrate feeder 169 and the upper surface of the robot 300F'. The main control device drives the suction pad 142 to suction and hold the end portions on the +y side and the-X side of the substrate P2 to the suction pad 142.
Subsequently, the main control device performs the same operation as in the eighth embodiment, and thereby performs substrate replacement on the substrate holder 28.
As described above, according to the ninth embodiment, the external transfer robot 300' enters the chamber 200 and transfers about half of the X side of the substrate P2 to the substrate feeder 169, so that the movement range (stroke) in the X direction and the movement range in the Z direction of the substrate slide hand 140 (suction pad 142) that pulls the substrate P2 into the chamber 200 can be shortened. In addition, the movement time of the suction pad 142 can be shortened.
Further, since the substrate is transferred from above when the substrate is transferred from the external transfer robot 300' to the substrate feeder 169, the possibility that the substrate contacts the substrate feeder 169 due to the deflection (sagging) of the front end of the substrate can be reduced as compared with the case where the substrate is slid and transferred.
Tenth embodiment
Next, a tenth embodiment will be described with reference to fig. 33 and 34. Fig. 33 (a) to 34 (b) show cross-sectional views of an exposure apparatus according to a tenth embodiment. As shown in fig. 33 (a), the exposure apparatus according to the tenth embodiment is different from the ninth embodiment in that the rail 146 of the substrate slide hand 140 is fixed to the substrate feeder 169. The other configuration is the same as that of the ninth embodiment.
(substrate replacement action)
Next, a substrate replacement operation in the exposure apparatus according to the tenth embodiment will be described with reference to fig. 33 (a) to 34 (b).
In fig. 33 (a), it is assumed that exposure is being performed in the stage device 20 for the substrate P1 mounted on the substrate holder 28. In this state, the main control device opens the carry-in port 172U by sliding the carry-in port shutter 154 in the +z direction in order to receive the substrate P2 to be exposed next into the chamber 200. Next, the main control device drives the external conveyance robot 300' in the-X direction (see arrow V1). By the operation of the external transfer robot 300', as shown in fig. 33 (b), about half of the-X side of the robot 300F' and about half of the-X side of the substrate P2 are positioned above the substrate feeder 169.
Next, the main control device drives the robot 300F 'to descend to a height at which the upper surface of the robot 300F' substantially coincides with the upper surface of the substrate feeder 169, thereby delivering a part of the substrate P2 to the substrate feeder 169. Next, the main control device starts the supply of the pressurized gas from the substrate support surface (upper surface) of the substrate feeder 169 and the upper surface of the robot 300F'. The main control device drives the suction pad 142 to suction and hold the end portions on the +y side and the-X side of the substrate P2 to the suction pad 142.
Next, as shown in fig. 34 (a), the main control device drives the suction pad 142 in the-X direction, thereby moving the substrate P2 along the substrate support surface of the substrate feeder 169 (see arrow V2). Subsequently, when the exposure of the substrate P1 in the stage device 20 is completed, the main control device drives the substrate feeder 169 in the-X direction (see arrow V3) and drives the external conveyance robot 300' in the +x direction to retract from the chamber 200 (see arrow V4) as shown in fig. 34 b. Subsequently, the main control device performs the same operation as that of the eighth embodiment (operation (fig. 29 (a) to 30)) to perform the substrate replacement on the substrate holder 28.
As described above, according to the tenth embodiment, the external transfer robot 300' enters the chamber 200 and transfers about half of the X side of the substrate P2 to the substrate feeder 169, so that the movement range (stroke) in the X direction and the movement range in the Z direction of the substrate slide hand 140 (suction pad 142) that pulls the substrate P2 into the chamber 200 can be shortened. In addition, the movement time of the suction pad 142 can be shortened.
Further, when the substrate is transferred from the external transfer robot 300' to the substrate feeder 169, the substrate is transferred from above, so that the possibility of the substrate coming into contact with the substrate feeder 169 due to the deflection (sagging) of the front end of the substrate can be reduced as compared with the case of transferring the substrate by sliding.
In the tenth embodiment, the rail 146 of the substrate slider 140 is provided on the substrate feeder 169, so that the movement range (stroke) of the substrate slider 140 in the X-axis direction can be shortened as compared with the ninth embodiment.
Eleventh embodiment
Next, an exposure apparatus according to an eleventh embodiment will be described with reference to fig. 35 to 38.
Fig. 35 (a) and 35 (b) show a cross-sectional view and a longitudinal-sectional view of an exposure apparatus according to the eleventh embodiment. In fig. 35 (a), 35 (b), and the like, the illustration of the chamber 200 is omitted for convenience.
As shown in fig. 35 (a) and 35 (b), in the eleventh embodiment, an external conveyance robot 301 is used instead of the external conveyance robot 300' of the ninth embodiment. The barrier member 172 is provided with an enclosure member 182 that covers the space 171 of the substrate feeder 169.
As shown in fig. 35 (a), the external conveyance robot 301 has a plurality of (e.g., five) fingers 301F, but unlike the external conveyance robots 300 and 300', does not have a function of floating the substrate P. The length of the groove 169a of the substrate feeder 169 in the X-axis direction is set longer than that of the ninth embodiment in accordance with the finger 301F of the external conveyance robot 301. Further, a concave-convex member such as a substrate support pad may be provided on the upper surface of the finger 301F of the external transfer robot 301.
An opening 172N is formed in an enclosure member 182 provided in the barrier member 172. In the eleventh embodiment, the finger 301F of the external transfer robot 301 enters the chamber 200, but the entering range is limited to the space 171 and the space 173. In the eleventh embodiment, an air exhaust device 183 for exhausting air in the +z direction is provided in the space 173. With the air discharge device 183, high-pressure air may also be supplied from a compressor commonly used as a factory equipment. The air exhaust device 183 may be a device using a fan as disclosed in japanese patent application laid-open No. 2009-073660, for example.
The other structure is the same as that of the ninth embodiment.
(substrate replacement action)
Next, the substrate replacement operation in the eleventh embodiment will be described in detail with reference to fig. 35 (a) to 38 (c). Fig. 35 (a) and 35 (b), fig. 36 (a) and 36 (b), and fig. 37 (a) and 37 (b) show a cross-sectional view and a longitudinal cross-sectional view of the vicinity of the stage device at the same timing. In fig. 35 (a) to 38 (c), illustration of unnecessary configuration in the description of the configuration of the exposure apparatus is omitted.
(actions of (a) of FIG. 35 and (b) of FIG. 35)
In the states of fig. 35 (a) and 35 (b), the substrate P1 is exposed in the stage device 20. On the other hand, the main control device opens the transfer port 152U by sliding the transfer port shutter 154 in the +z direction in order to receive the substrate P2 to be exposed next into the chamber 200 (into the space 171) (see an arrow α1 in fig. 35 b).
(actions of (a) of FIG. 36 and (b) of FIG. 36)
Next, the main control device drives the external conveyance robot 301 in the-X direction (see an arrow α2 in fig. 36 (a) and 36 (b)). By the operation of the external transfer robot 301, as shown in fig. 36 (a) and 36 (b), about half of the finger 301F of the external transfer robot 301 and about half of the finger of the substrate P2 are positioned above the substrate feeder 169. In this state, the main control device drives the external conveyance robot 301 to descend, and thereby transfers a part of the substrate P2 to the substrate feeder 169. The main control device starts the supply of the pressurized gas from the substrate feeder 169. The main control device drives the suction pad 142 to suction and hold the end portions on the +y side and the-X side of the substrate P2 to the suction pad 142.
(actions of (a) of FIG. 37 and (b) of FIG. 37)
Next, the main control device drives the suction pad 142 (see arrow α3) in a direction intersecting the X-axis and the Z-axis in the XZ plane (the direction of inclination of the substrate support surface of the substrate feeder 169), thereby moving the substrate P2 to the position shown in fig. 37 (a) and 37 (b). The main control device drives the external conveyance robot 301 in the +x direction, thereby withdrawing the finger 301F out of the space 171. When the +x end of the substrate P2 is located on the-X side with respect to the carry-in shutter 154, and the-X end of the finger 301F of the external transfer robot 301 is located on the +x side with respect to the carry-in shutter 154, the main control device slides the carry-in shutter 154 in the-Z direction to close the carry-in 172U (see arrow α4). The main control device drives the external conveyance robot 301 in the-Z direction to position the-X end of the finger 301F in the vicinity of the conveyance outlet 172L (see arrow α5).
(action of (a) of FIG. 38)
Next, the main control device starts suction holding of the substrate P2 by the substrate feeder 169, and drives the substrate feeder 169 in the-X direction (see arrow α6). In addition, the suction pad 142 holding the substrate P2 may be moved in the-X direction in synchronization with the movement of the substrate feeder 169, or the suction pad 142 may be moved in the-X direction by previously removing the suction and holding of the substrate P2 by the suction pad 142 when the substrate feeder 169 is moved. Then, the main control device opens the outlet 172L by sliding the outlet shutter 156 in the-Z direction (see arrow α7). Further, the main control device drives the external conveyance robot 301 in the-X direction (see arrow α8), and thereby the finger 301F is in a state of penetrating the conveyance port 172L and the substrate passage port 172M.
(action of (b) of FIG. 38)
Subsequently, when the exposure for the substrate P1 in the stage device 20 is completed, the main control device moves the stage device 20 to the substrate replacement position below the substrate feeder 169 (refer to an arrow α9). At this time, the air floating member 29 provided on the substrate holder 28 is nested with the finger 301F of the external transfer robot 301.
Then, the main control device controls the air discharge device 183 to start the discharge of the high-pressure air upward (see the dotted arrow α10). The main control device starts the supply of the pressurized gas from the upper surface of the substrate holder 28 and the upper surface of the air floating member 29. The main control device also shifts the substrate P1 in the +y direction using the substrate loading carrier device 25, suctions and holds a part of the substrate P2 to the suction pad 27, and drives the suction pad 27 in the +x direction (see an arrow α11 in fig. 38 (c)).
Subsequently, the main control device drives the suction pad 27 of the substrate loading carrier device 25 to rise, and the suction pad 27 suctions and holds the-X end portion of the substrate P2. The main control device starts supply (gas supply) of the pressurized gas from the upper surface of the substrate feeder 169. The main control device drives the stage device 20 in the-X direction (see arrow α12) while the substrate P2 is sucked and held by the suction pads 27 of the substrate loading stage device 25, and moves the substrate feeder 169 in the +x direction (see arrow α13). As a result, as shown in fig. 38 (c), the substrate P2 is transferred from the substrate feeder 169 to the substrate holder 28. Accordingly, the substrate P2 can be carried into the substrate holder 28 at a higher speed by driving the stage device 20 and the substrate feeder 169 in a direction away from each other with respect to the X direction than by driving the stage device 20 in the-X direction alone to carry the substrate P2 into the substrate holder 28. This is possible because of the device structure in which the space 173 is provided in the chamber 200, and the substrate feeder 169 can be driven in the +x direction. The timing of driving the stage device 20 in the-X direction may be different from the timing of moving the substrate feeder 169 in the +x direction. The main control device may move the substrate feeder 169 in the +x direction after the substrate P2 has been transferred to the substrate holder 28. The main control device finely drives the suction pad 27 to align (adjust the position of) the substrate P2. Subsequently, the main control device drives the suction pad 27 to descend, starts suction holding of the substrate P2 by the substrate holder 28, and starts exposure of the substrate P2 newly mounted on the substrate holder 28. The main control device may move the substrate feeder 169 (see arrow α13) after the substrate P2 has been transferred to the substrate holder 28 in the +x direction.
Then, the main control device continues to drive the suction pad 142 in the +x direction (see arrow α11), and the substrate P1 is transferred from the substrate holder 28 and the air floating member 29 to the external transfer robot 301. In addition, since high-pressure air is discharged upward from the air exhaust device 183 during the transfer of the substrate P1, contact between the finger 301F of the external transfer robot 301 and the substrate P1 can be prevented even if the external transfer robot 301 does not have a function of supplying pressurized air. Subsequently, the main control device stops the air exhaust device 183, and starts the suction holding of the finger 301F to the substrate P1. Then, the main control device drives the external conveyance robot 301 in the +x direction to carry the substrate P1 out of the chamber 200, and closes the carry-out shutter 156.
Through the above operation, the substrate replacement operation is ended.
As described above, in addition to the effects similar to those of the ninth embodiment, the use of the air exhaust device 183 can prevent the finger 301F from coming into contact with the substrate P1 even if the external transfer robot 301 does not have a mechanism for supplying pressurized gas. Further, since the barrier member 172 has the spaces 171 and 173, dust can be prevented from entering the vicinity of the exposure apparatus body 10.
In the eleventh embodiment, a shutter may be provided in the substrate passage opening 172M or the opening 172N. This can prevent dust from entering the chamber 200.
Twelfth embodiment
Next, a twelfth embodiment will be described in detail with reference to fig. 39 to 41. Fig. 39 (a) shows a longitudinal cross-sectional view of the vicinity of a barrier member 172 according to the twelfth embodiment, and fig. 39 (B) shows a B-B cross-sectional view of fig. 39 (a).
The twelfth embodiment is characterized in that a tape discharging mechanism 40 is provided in addition to the structure of the eleventh embodiment, in an air discharging device 183 provided in a space 173.
The tape discharging mechanism 40 includes: a pair of rails 41 provided in the air exhaust device 183 and having the X-axis direction as the longitudinal direction; a pair of movable bodies 43 movable in the X-axis direction along the rails 41; and moving members 42 connected to the movable body 43, respectively, and having the Y-axis direction as the longitudinal direction. The moving member 42 is provided with a plurality of (for example, four) projections protruding in the Z direction at predetermined intervals along the Y axis direction. The tape discharging mechanism 40 includes: a plurality of (e.g., four) belts 45 each having one end fixed to the convex portion of the moving member 42; and a hammer member 47 fixed to the other end of each of the belts 45. The belts 45 are suspended from pulleys (pulleys) 48, and the pulleys 48 are fixed to shaft members provided in the air exhaust device 183 and extending in the Y-axis direction.
In the tape discharging mechanism 40, when the driving force in the-X direction is not applied to the movable body 43, as shown in fig. 39 (a), the hammer member 47 abuts on the bottom surface of the space 173, and thus the state of fig. 39 (a) is maintained. On the other hand, when a driving force in the-X direction is applied to the movable body 43, the moving member 42 moves in the-X direction, and therefore the length of the portion of the belt 45 extending in the X axis direction becomes longer.
(substrate replacement action)
Next, a substrate replacement operation in the exposure apparatus according to the twelfth embodiment will be described in detail with reference to fig. 40 (a) to 41 (c).
Fig. 40 (a) shows a state in which the exposure of the substrate P1 in the stage device 20 has been completed, the substrate P2 has been transferred onto the substrate feeder 169 by the external transfer robot 301, and the substrate feeder 169 has been moved in the-X direction, similarly to the above-described eleventh embodiment. At this time, the hammer member 47 of the tape discharging mechanism 40 is in contact with the bottom surface of the space 173.
In fig. 40 (a), the main control device opens the carry-out port 172L by sliding the carry-out port shutter 156 in the-Z direction (see arrow β1 in fig. 40 (a)). As shown in fig. 40 b, the main control device drives the stage device 20 to the substrate replacement position (below the substrate feeder 169) (see arrow β3) while the finger 301F of the external transfer robot 301 is moved in from the transfer port 172L (see arrow β2). At this time, as shown in fig. 41 (a), the air floating members 29 provided on the substrate holder 28 are aligned with the respective belts 45. Further, since the finger 301F of the external transfer robot 301 is in a state of being fitted to the belt 45 and the air floating member 29, the finger 301F does not come into contact with the belt 45 and the air floating member 29. Further, since the belt 45 is provided with a large number of small holes, by supplying high-pressure air from the air exhaust device 183, a part of the high-pressure air passes through the holes. Therefore, the belt 45 can be provided with the same function as the air floating member 29. This allows the substrate P1 to slide in a floating state or a semi-floating state with respect to the belt 45.
That is, in the state of fig. 41 (a), the substrate P1 mounted on the substrate holder 28 is slid in the +x direction by the substrate slide hand 140, and thus, even if the finger 301F of the external conveyance robot 301 does not have a function for floating air, the substrate P1 is not deflected, and the substrate P1 can be moved above the finger 301F of the external conveyance robot 301.
Subsequently, as in the eleventh embodiment, the substrate P2 is transferred from the substrate feeder 169 to the substrate holder 28, and the substrate P1 is transferred from the substrate holder 28 to the external transfer robot 300. In this operation, the main control device drives the stage device 20 in the-X direction, but moves the moving member 42 in the-X direction so as to follow the driving of the stage device 20 in the-X direction. As a result, as shown in fig. 41 (b), the air floating member 29 or the belt 45 can be maintained in a state of being disposed substantially without a gap in the gap between the fingers 301F of the external conveyance robot 301.
Fig. 41 (c) shows a state in which the substrate P2 is placed on the substrate holder 28 and the substrate P1 is positioned above the finger 301F of the external transfer robot 301. From this state, the main control device drives the external conveyance robot 301 to move upward, and thereby transfers the substrate P1 to the external conveyance robot 301. Subsequently, the main control device stops the air exhaust device 183, and starts the suction holding of the finger 301F to the substrate P1. The main control device drives the external conveyance robot 301 in the +x direction to retract from the space 173, and slides in the +z direction toward the carry-out gate 156, thereby closing the carry-out port 172L.
In the above description, the case where the substrate P1 is slidingly conveyed into the space 173 with the external conveyance robot 301 being brought into the space 173 has been described, but the present invention is not limited thereto. For example, the external transfer robot 301 may be moved into the space 173 after the substrate P1 is slidingly transferred into the space 173.
(modification)
In the above embodiments, the description has been made of the case where the outlet shutter and the inlet shutter are provided near the outlet and the inlet of the barrier members 152 and 172, but the present invention is not limited to this, and the outlet shutter and the inlet shutter may be provided in the chamber 200.
The substrate feeder of each of the above embodiments may be a substrate feeder 264 shown in fig. 42, and the cover 199 may be fixed to a pair of block members 265 provided on the +y side surface and the-Y side surface of the substrate feeder 264, thereby covering the upper surface of the substrate feeder 264. In the case of the substrate feeder having the groove formed in the upper surface, the cover 199 may be provided so as to cover the upper portion of the groove.
The YZ cross section of the cover 199 has an inverted U shape, and can carry in and out a substrate from the +x side and the-X side between the cover 199 and the substrate feeder 264. In fig. 42, the cover 199 is shown as transparent, but the cover 199 may not be transparent. In this modification, by providing the cover 199, the adhesion of the refuse to the substrate P can be prevented, and the temperature of the substrate P can be fixed.
In the sixth embodiment (fig. 22 (a), 22 (b), etc.), when the substrate feeder 264 of fig. 42 is used, the upper surface of the support cover 199 may be suspended by the suspension mechanism 186. In the seventh embodiment (fig. 25), when the substrate feeder 264 of fig. 42 is used, a cover 199 may be provided on the lower surface side of the substrate feeder.
As the substrate feeder of each of the above embodiments, a substrate feeder 364 shown in fig. 43 (a) may be used. The substrate feeder 364 is in a state in which the upper surface is curved. By bending the upper surface (substrate supporting surface) of the substrate feeder 364 in this manner, the profile coefficient of the substrate can be increased. That is, the substrate is deflected, and the same effect as that of the substrate having a thickness several times to several hundreds times larger than that of the actual substrate can be obtained.
Accordingly, even when the substrate P is placed on the substrate feeder 364 in a state in which the-X end portion protrudes as in fig. 43 (b), the occurrence of the phenomenon of deflection (sagging) of the-X end portion of the substrate P can be suppressed. Further, since occurrence of deflection (sagging) of the substrate P is suppressed, when the substrate P is brought into contact with the substrate holder 28, the substrate P can be brought into contact with the Y-axis direction central portion of the side on the-X side, and therefore, wrinkles can be hardly generated at the-X end portion of the substrate P.
In addition, an ionizer (ionization) may be provided near the substrate feeder. This makes it possible to remove the static electricity as a countermeasure against static electricity of the substrate before being mounted on the substrate holder 28.
The described embodiments are preferred embodiments of the present invention. However, the present invention is not limited thereto, and various modifications may be made without departing from the spirit of the present invention.

Claims (17)

1. An exposure apparatus comprising:
an optical system irradiating the substrate;
a stage device that moves while holding the substrate;
a holding portion that holds the substrate;
a chamber for accommodating the optical system, the stage device, and the holding unit; and
a control device for moving the stage device,
the stage means comprises holding means which,
the holding portion is located at a position capable of holding the substrate when the substrate is located in the opening of the chamber,
the control device
In a state where the stage device is positioned below the holding portion, the holding device is caused to hold a portion of the substrate held by the holding portion that does not overlap with an exposure region,
enabling the holding device to receive the substrate from the holding portion, moving the stage device away from the holding portion in a state where the portion of the substrate is held by the holding device, and
The optical system irradiates the substrate while moving the stage device holding the substrate relative to the optical system.
2. The exposure apparatus according to claim 1, wherein
The holding portion holds a substrate and tilts the substrate with respect to an upper surface of the stage device.
3. The exposure apparatus according to claim 1, wherein
The holding unit changes a posture of holding the substrate, and changes the substrate from a state of being inclined with respect to an upper surface of the stage device to a state of being nearly parallel with respect to the upper surface of the stage device.
4. The exposure apparatus according to any one of claims 1 to 3, wherein
The control device
Contacting and holding the portion held by the holding portion in a noncontact manner by the holding device in a state where the stage device is located below the holding portion,
the holding means is configured to hold the substrate in a noncontact manner, the stage means is moved away from the holding portion in a state where the portion of the substrate is held in contact by the holding means, and
the holding device that contacts and holds the portion of the substrate is lowered, and the substrate is held in contact with the stage device.
5. The exposure apparatus according to claim 4, wherein
The stage device includes holes for supplying gas to the back surface of the substrate,
the control device
The substrate is held in the stage device in a noncontact manner by supplying the gas to the back surface of the substrate through the holes.
6. The exposure apparatus according to claim 1, wherein
The control device slides the substrate on the holding portion, and the holding device is capable of receiving the substrate from the holding portion, and moves the stage device away from the holding portion in a state where the portion of the substrate is held by the holding device.
7. The exposure apparatus according to claim 1, wherein
The holding device is provided at an end of the stage device in a moving direction of the stage device.
8. The exposure apparatus according to claim 1, wherein
The holding portion is located between the opening and the optical system.
9. The exposure apparatus according to claim 1, wherein
The stage device moves in a scanning direction relative to the optical system while holding the substrate,
in the scanning direction, the holding portion is located between the opening and the optical system.
10. The exposure apparatus according to claim 1, wherein
The control device enables the holding device to receive the substrate from the holding portion, and moves the stage device so that the stage device approaches the optical system and is away from the holding portion in a state where the portion of the substrate is held by the holding device.
11. The exposure apparatus according to claim 1, wherein
The stage device moves relative to the optical system while holding the substrate in a state of being opposed to the lowermost portion of the optical system,
the holding portion holds the substrate such that at least a part of the substrate is positioned at a height higher than the lowermost portion of the optical system.
12. The exposure apparatus according to claim 11, comprising:
a platen for supporting the optical system,
the holding portion overlaps the notched portion of the platen at a position higher than the lowermost portion.
13. The exposure apparatus according to claim 1, wherein
The opening can be opened and closed.
14. The exposure apparatus according to claim 1, comprising:
the vibration-proof device is arranged in a first area of the floor and supports the optical system; and
And a supporting member which is provided in the second region of the floor and supports the holding portion.
15. The exposure apparatus according to claim 1, wherein
The holding portion holds the substrate in a noncontact manner on a lower side of the holding portion.
16. The exposure apparatus according to claim 1, wherein
The holding portion moves between a position above a movable region of the stage device and a position above a region outside the movable region.
17. A method of manufacture, comprising:
exposing a substrate using the exposure apparatus according to any one of claims 1 to 3, 6 to 16; and
developing the exposed substrate.
CN202310794992.9A 2019-03-29 2020-03-12 Exposure apparatus and manufacturing method Pending CN116643469A (en)

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US20080225261A1 (en) * 2007-03-13 2008-09-18 Noriyuki Hirayanagi Exposure apparatus and device manufacturing method
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