CN116640496A - Conductive material composition, product with conductive coating and preparation method thereof - Google Patents
Conductive material composition, product with conductive coating and preparation method thereof Download PDFInfo
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- CN116640496A CN116640496A CN202310674153.3A CN202310674153A CN116640496A CN 116640496 A CN116640496 A CN 116640496A CN 202310674153 A CN202310674153 A CN 202310674153A CN 116640496 A CN116640496 A CN 116640496A
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- 238000000576 coating method Methods 0.000 title claims abstract description 77
- 239000011248 coating agent Substances 0.000 title claims abstract description 76
- 239000000203 mixture Substances 0.000 title claims abstract description 59
- 239000004020 conductor Substances 0.000 title claims abstract description 55
- 238000002360 preparation method Methods 0.000 title abstract description 28
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000011347 resin Substances 0.000 claims abstract description 19
- 229920005989 resin Polymers 0.000 claims abstract description 19
- 239000002994 raw material Substances 0.000 claims abstract description 13
- 238000002156 mixing Methods 0.000 claims abstract description 10
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims abstract description 5
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 42
- 239000011521 glass Substances 0.000 claims description 27
- 238000003756 stirring Methods 0.000 claims description 16
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 9
- 229920000642 polymer Polymers 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 7
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 4
- -1 polyethylene terephthalate Polymers 0.000 claims description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 239000007788 liquid Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000003973 paint Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 229920000144 PEDOT:PSS Polymers 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- HJOVHMDZYOCNQW-UHFFFAOYSA-N isophorone Chemical compound CC1=CC(=O)CC(C)(C)C1 HJOVHMDZYOCNQW-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
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- 239000003960 organic solvent Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3405—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of organic materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/47—Levelling agents
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Wood Science & Technology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Paints Or Removers (AREA)
Abstract
The application provides a conductive material composition, a product with a conductive coating and a preparation method thereof, and relates to the technical field of conductive materials. The conductive material composition comprises the following raw materials in parts by weight: 0.7-1.2 parts of poly (benzodifurandione), 0-3 parts of resin, 0-0.15 part of curing agent, 0.01-0.2 part of flatting agent and 70-140 parts of solvent. A method of preparing a conductive material composition comprising: and mixing the raw materials to obtain the conductive material composition. The product with the conductive coating comprises a substrate and the conductive coating arranged on the surface of the substrate, wherein the conductive coating is obtained by curing the conductive material composition. The conductive material composition provided by the application has good coating effect, good film forming property, mechanical property, conductivity, transparency and storage stability.
Description
Technical Field
The application relates to the field of conductive materials, in particular to a conductive material composition, a product with a conductive coating and a preparation method thereof.
Background
The PEDOT PSS, namely poly (3, 4-ethylenedioxythiophene) polystyrene sulfonate, has wide application prospect in the field of conductive materials due to the characteristics of conductivity, transparency, easiness in processing and the like.
However, in the application of the conductive coating, the PEDOT-PSS has weaker mechanical strength, and the coating is easy to drop due to scraping of external force, so that the use is affected.
For this reason, it is important to develop a conductive material having high mechanical strength.
Disclosure of Invention
The application aims to provide a conductive material composition, a product with a conductive coating and a preparation method thereof, so as to solve the problems.
In order to achieve the above purpose, the application adopts the following technical scheme:
the conductive material composition comprises the following raw materials in parts by weight:
0.7-1.2 parts of poly (benzodifurandione), 0-3 parts of resin, 0-0.15 part of curing agent, 0.01-0.2 part of flatting agent and 70-140 parts of solvent.
Preferably, the leveling agent includes one or more of BYK333, BYK348, BYK378, MODARZ MFP, TEGO Glide 450, TEGO Rad 2100, and X043.
Preferably, the conductive material composition is used in an amount of 0.1 to 3 parts of resin;
the resin includes one or more of polyacrylate resin, thermoplastic polyurethane, epoxy resin, and polyvinyl alcohol.
Preferably, the conductive material composition contains 0.005-0.15 part of curing agent;
the curing agent comprises one or more of toluene diisocyanate or a polymer thereof, hexamethylene diisocyanate or a polymer thereof, diphenylmethane diisocyanate or a polymer thereof.
Preferably, the poly (benzodifurandione) is used in an amount of 0.9 to 1.1 parts and the leveling agent is used in an amount of 0.05 to 0.1 parts.
Preferably, the solvent used in the conductive material composition is N, N-dimethylformamide and/or dimethylsulfoxide.
The application also provides a preparation method of the conductive material composition, which comprises the following steps:
and mixing the raw materials to obtain the conductive material composition.
Preferably, before the raw materials are mixed, the raw materials are respectively prepared into corresponding dimethyl sulfoxide solutions in advance;
the mixing is carried out at 20-50 ℃ and stirring speed of 500-1500 rpm for 10-60 minutes.
The application also provides a product with the conductive coating, which comprises a substrate and the conductive coating arranged on the surface of the substrate, wherein the conductive coating is obtained by curing the conductive material composition.
Preferably, the temperature of the curing is 20-60 ℃;
the substrate comprises any one of glass, polyethylene terephthalate and polyimide.
Compared with the prior art, the application has the beneficial effects that:
the conductive material composition provided by the application adopts poly (benzodifurandione) to replace the prior PEDOT: PSS (poly (3, 4-ethylenedioxythiophene) polystyrene sulfonate), and has stronger mechanical strength under the conditions of excellent conductivity and high transmittance. The leveling agent is used for improving the film forming property and the coating effect of poly (benzodifurandione), so that the composition has good coating effect on different substrates. The conductive material composition has good physical properties, conductivity, transparency and storage stability.
The product with the conductive coating provided by the application is cured by using the conductive material composition to obtain the conductive coating, so that the product has good physical properties, conductivity and transparency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope of the present application.
Fig. 1 is a schematic structural diagram of a product with a conductive coating according to an embodiment of the present application.
Reference numerals:
1-a substrate; 2-conductive coating.
Detailed Description
The term as used herein:
"prepared from … …" is synonymous with "comprising". The terms "comprising," "including," "having," "containing," or any other variation thereof, as used herein, are intended to cover a non-exclusive inclusion. For example, a composition, step, method, article, or apparatus that comprises a list of elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, step, method, article, or apparatus.
The conjunction "consisting of … …" excludes any unspecified element, step or component. If used in a claim, such phrase will cause the claim to be closed, such that it does not include materials other than those described, except for conventional impurities associated therewith. When the phrase "consisting of … …" appears in a clause of the claim body, rather than immediately following the subject, it is limited to only the elements described in that clause; other elements are not excluded from the stated claims as a whole.
When an equivalent, concentration, or other value or parameter is expressed as a range, preferred range, or a range bounded by a list of upper preferable values and lower preferable values, this is to be understood as specifically disclosing all ranges formed from any pair of any upper range limit or preferred value and any lower range limit or preferred value, regardless of whether ranges are separately disclosed. For example, when ranges of "1 to 5" are disclosed, the described ranges should be construed to include ranges of "1 to 4", "1 to 3", "1 to 2 and 4 to 5", "1 to 3 and 5", and the like. When a numerical range is described herein, unless otherwise indicated, the range is intended to include its endpoints and all integers and fractions within the range.
In these examples, the parts and percentages are by mass unless otherwise indicated.
"parts by mass" means a basic unit of measurement showing the mass ratio of a plurality of components, and 1 part may be any unit mass, for example, 1g may be expressed, 2.689g may be expressed, and the like. If we say that the mass part of the a component is a part and the mass part of the B component is B part, the ratio a of the mass of the a component to the mass of the B component is represented as: b. alternatively, the mass of the A component is aK, and the mass of the B component is bK (K is an arbitrary number and represents a multiple factor). It is not misunderstood that the sum of the parts by mass of all the components is not limited to 100 parts, unlike the parts by mass.
"and/or" is used to indicate that one or both of the illustrated cases may occur, e.g., a and/or B include (a and B) and (a or B).
The conductive material composition comprises the following raw materials in parts by weight:
0.7-1.2 parts of poly (benzodifurandione), 0-3 parts of resin, 0-0.15 part of curing agent, 0.01-0.2 part of flatting agent and 70-140 parts of solvent.
The film-forming property of the pure poly (benzodifurandione) (PBFDO) is poor, and the adhesion force on a substrate is also poor, so that the solution needs to be selected as an auxiliary agent. The leveling agent is added, so that the slurry can be better and faster leveled during coating, and a complete and uniform coating is obtained. But not all leveling agents can be adapted to poly (benzodifurandione).
Alternatively, the amount of poly (benzodifurandione) in the raw material of the conductive material composition may be any value between 0.7 parts, 0.8 parts, 0.9 parts, 1.0 parts, 1.1 parts, 1.2 parts, or 0.7 to 1.2 parts, the amount of the resin may be any value between 0 parts, 1 parts, 2 parts, 3 parts, or 0 to 3 parts, the amount of the curing agent may be any value between 0 parts, 0.05 parts, 0.10 parts, 0.15 parts, or 0 to 0.15 parts, the amount of the leveling agent may be any value between 0.01 parts, 0.05 parts, 0.1 parts, 0.15 parts, 0.2 parts, or 0.01 to 0.2 parts, the amount of the solvent may be any value between 70 parts, 80 parts, 90 parts, 100 parts, 110 parts, 120 parts, 130 parts, 140 parts, or 70 to 140 parts, as calculated by weight.
In a preferred embodiment, the leveling agent comprises one or more of BYK333, BYK348, BYK378, MODARZ MFP, TEGO Glide 450, TEGO Rad 2100, and X043.
Leveling agents fall into two general categories: one is by adjusting the viscosity of the paint film and the leveling time, and most of such leveling agents are high boiling organic solvents or mixtures thereof, such as isophorone, diacetone alcohol, solvesso150, and the like; the other is effected by adjusting the surface properties of the paint film, and the leveling agents are mostly referred to as leveling agents. The leveling agent migrates to the surface of a paint film through limited compatibility, influences the interfacial tension and other surface properties of the paint film, and enables the paint film to obtain good leveling. According to different chemical structures, three main types of leveling agents exist at present: acrylic, silicone, and fluorocarbon. The application uses organosilicon and acrylic leveling agent.
In an alternative embodiment, the conductive material composition is used in an amount of 0.1 to 3 parts of resin;
the resin includes one or more of polyacrylate resin, thermoplastic polyurethane, epoxy, and polyvinyl alcohol.
The addition of the resin to the coating can enhance the strength of the coating, enhance the scratch resistance of the coating, and provide the PBFDO film forming property.
Alternatively, the conductive material composition may contain the resin in an amount of any one of 0.1 part, 0.5 part, 1 part, 1.5 part, 2 parts, 2.5 parts, 3 parts, or 0.1 to 3 parts by weight.
In an alternative embodiment, the conductive material composition includes a curing agent in an amount of 0.005 to 0.15 parts;
the curing agent comprises one or more of toluene diisocyanate or a polymer thereof, hexamethylene diisocyanate or a polymer thereof, diphenylmethane diisocyanate or a polymer thereof.
Alternatively, the curing agent may be used in an amount of any one of 0.005 parts, 0.01 parts, 0.05 parts, 0.10 parts, 0.15 parts, or 0.005 to 0.15 parts by weight in the conductive material composition.
In an alternative embodiment, the poly (benzodifurandione) is used in an amount of 0.9 to 1.1 parts and the leveling agent is used in an amount of 0.05 to 0.1 parts.
In an alternative embodiment, the solvent used in the conductive material composition is N, N-dimethylformamide and/or dimethylsulfoxide.
The application also provides a preparation method of the conductive material composition, which comprises the following steps:
and mixing the raw materials to obtain the conductive material composition.
In an alternative embodiment, the raw materials are respectively pre-formulated into corresponding dimethyl sulfoxide solutions before the mixing;
the mixing is carried out at 20-50 ℃ and stirring speed of 500-1500 rpm for 10-60 minutes.
Alternatively, the temperature of the mixing may be any value between 20 ℃, 30 ℃, 40 ℃, 50 ℃, or 20-50 ℃, the stirring speed may be any value between 500 revolutions per minute, 800 revolutions per minute, 1000 revolutions per minute, 1200 revolutions per minute, 1500 revolutions per minute, or 500-1500 revolutions per minute, and the time may be any value between 10 minutes, 20 minutes, 40 minutes, 60 minutes, or 10-60 minutes.
The application also provides a product with the conductive coating, which comprises a substrate and the conductive coating arranged on the surface of the substrate, wherein the conductive coating is obtained by curing the conductive material composition.
In an alternative embodiment, the temperature of the curing is 20-60 ℃;
the substrate comprises any one of glass, polyethylene terephthalate and polyimide.
Alternatively, the temperature of the curing may be 20 ℃, 40 ℃, 60 ℃, or any value between 20-60 ℃.
Embodiments of the present application will be described in detail below with reference to specific examples, but it will be understood by those skilled in the art that the following examples are only for illustrating the present application and should not be construed as limiting the scope of the present application. The specific conditions are not noted in the examples and are carried out according to conventional conditions or conditions recommended by the manufacturer. The reagents or apparatus used were conventional products commercially available without the manufacturer's attention.
Example 1
The embodiment provides a conductive material composition, which specifically comprises the following components:
1wt% PBFDO (Poly (benzodifurandione) in dimethyl sulfoxide, 100 parts by weight from Dongguan voltammetric photoelectric Co., ltd.) and 5 parts by weight of 1wt% BYK333 in dimethyl sulfoxide.
The conductive material composition is used for preparing conductive coating liquid, and the preparation method comprises the following steps:
the materials are added into a stirrer, the temperature is 20 ℃, the rotating speed is 500 revolutions per minute, and the stirring is carried out for 50 minutes until the stirring is uniform.
As shown in fig. 1, the present embodiment also provides a product with a conductive coating, which includes a glass substrate 1 and a conductive coating 2 disposed on the surface of the glass substrate, and the preparation method thereof is as follows:
the conductive coating liquid is uniformly coated on a glass substrate 1 by using a four-side preparation device with a gap of 50um, and the coated glass is placed in a vacuum environment of 60 ℃ and baked for one hour, and the vacuum degree is-0.1 Mpa, so that a product with a conductive coating 2 is obtained.
Example 2
The embodiment provides a conductive material composition, which specifically comprises the following components:
100 parts of 1wt% PBFDO (poly (benzodifurandione) in dimethyl sulfoxide, available from Dongguan voltammetric photoelectric Co., ltd.), 10 parts of 1wt% BYK333 in dimethyl sulfoxide and 150 parts of 1% resin A21 (polyacrylate resin, available from Rongshimoto).
The conductive material composition is used for preparing conductive coating liquid, and the preparation method comprises the following steps:
the materials are added into a stirrer, the temperature is 30 ℃, the rotating speed is 1000 revolutions per minute, and the stirring is carried out for 30 minutes until the stirring is uniform.
The embodiment also provides a product with a conductive coating, which comprises a glass substrate 1 and a conductive coating 2 arranged on the surface of the glass substrate, and the preparation method comprises the following steps:
the conductive coating liquid is uniformly coated on a glass substrate 1 by using a four-side preparation device with a gap of 50um, and the coated glass is placed in a vacuum environment at 50 ℃ and baked for one hour, and the vacuum degree is-0.1 Mpa, so that a product with a conductive coating 2 is obtained.
Example 3
The embodiment provides a conductive material composition, which specifically comprises the following components:
100 parts of 1wt% PBFDO (dimethyl sulfoxide solution of poly (benzodifurandione) produced by Dongguan voltammetric photoelectric Co., ltd.), 10 parts of 1wt% BYK333 dimethyl sulfoxide solution, 150 parts of 1% resin A21 (polyacrylate resin, available from Rongshimoto) dimethyl sulfoxide solution and a curing agent N3300.
The conductive material composition is used for preparing conductive coating liquid, and the preparation method comprises the following steps:
the materials are added into a stirrer, the temperature is 50 ℃, the rotating speed is 1500 revolutions per minute, and the stirring is carried out for 10 minutes until the stirring is uniform.
The embodiment also provides a product with a conductive coating, which comprises a glass substrate 1 and a conductive coating 2 arranged on the surface of the glass substrate, and the preparation method comprises the following steps:
the conductive coating liquid is uniformly coated on a glass substrate 1 by using a four-side preparation device with a gap of 50um, and the coated glass is placed in a vacuum environment at 40 ℃ and baked for one hour, and the vacuum degree is-0.1 Mpa, so that a product with a conductive coating 2 is obtained.
Example 4
The embodiment provides a conductive material composition, which specifically comprises the following components:
100 parts of 1wt% PBFDO (poly (benzodifurandione) dimethyl sulfoxide solution, available from Dongguan voltammetric photoelectric Co., ltd.), 10 parts of 1wt% BYK333 dimethyl sulfoxide solution and 150 parts of 1% resin Pearlstick 5778 (thermoplastic polyurethane, available from Libo).
The conductive material composition is used for preparing conductive coating liquid, and the preparation method comprises the following steps:
the materials are added into a stirrer, the temperature is 30 ℃, the rotating speed is 1000 revolutions per minute, and the stirring is carried out for 30 minutes until the stirring is uniform.
The embodiment also provides a product with a conductive coating, which comprises a glass substrate 1 and a conductive coating 2 arranged on the surface of the glass substrate, and the preparation method comprises the following steps:
the conductive coating liquid is uniformly coated on a glass substrate 1 by using a four-side preparation device with a gap of 50um, and the coated glass is placed in a vacuum environment at 50 ℃ and baked for one hour, and the vacuum degree is-0.1 Mpa, so that a product with a conductive coating 2 is obtained.
Example 5
The embodiment provides a conductive material composition, which specifically comprises the following components:
1wt% of PBFDO (Poly (benzodifurandione) in dimethyl sulfoxide, produced by Dongguan voltammetric photoelectric Co., ltd.), 100 parts of 1wt% of MODARZ MFP (acrylic leveling agent, available from Innovative chemical) in dimethyl sulfoxide, 10 parts, and 150 parts of 1% of resin A21 (polyacrylate resin, available from Rongmen Hasi).
The conductive material composition is used for preparing conductive coating liquid, and the preparation method comprises the following steps:
the materials are added into a stirrer, the temperature is 30 ℃, the rotating speed is 1000 revolutions per minute, and the stirring is carried out for 30 minutes until the stirring is uniform.
The embodiment also provides a product with a conductive coating, which comprises a glass substrate 1 and a conductive coating 2 arranged on the surface of the glass substrate, and the preparation method comprises the following steps:
the conductive coating liquid is uniformly coated on a glass substrate 1 by using a four-side preparation device with a gap of 50um, and the coated glass is placed in a vacuum environment at 50 ℃ and baked for one hour, and the vacuum degree is-0.1 Mpa, so that a product with a conductive coating 2 is obtained.
Example 6
The embodiment provides a conductive material composition, which specifically comprises the following components:
100 parts of 1wt% PBFDO (poly (benzodifurandione) in dimethyl sulfoxide, available from Dongguan voltammetric photoelectric Co., ltd.), 2 parts of 1wt% BYK333 in dimethyl sulfoxide and 150 parts of 1% resin A21 (polyacrylate resin, available from Rongshimoto).
The conductive material composition is used for preparing conductive coating liquid, and the preparation method comprises the following steps:
the materials are added into a stirrer, the temperature is 30 ℃, the rotating speed is 1000 revolutions per minute, and the stirring is carried out for 30 minutes until the stirring is uniform.
The embodiment also provides a product with a conductive coating, which comprises a glass substrate 1 and a conductive coating 2 arranged on the surface of the glass substrate, and the preparation method comprises the following steps:
the conductive coating liquid is uniformly coated on a glass substrate 1 by using a four-side preparation device with a gap of 50um, and the coated glass is placed in a vacuum environment at 50 ℃ and baked for one hour, and the vacuum degree is-0.1 Mpa, so that a product with a conductive coating 2 is obtained.
Comparative example 1
The conductive coating of comparative example 1 comprises the following material components: german He Lishi clevelos PH1000 100 parts, dimethyl sulfoxide 5 parts.
The conductive coating liquid of comparative example 1 and the preparation method of the conductive coating were the same as those of example.
Comparative example 2
The material composition of the conductive coating of comparative example 2: he Lishi Clevelos pH1000 100, dimethyl sulfoxide 5, 1wt% SF-331 fluorosurfactant (available from Guangdong standard SiF New Material Co., ltd.) in water 5.
The conductive coating liquid of comparative example 2 and the preparation method of the conductive coating were the same as those of example.
Comparative example 3
The material composition of the conductive coating of comparative example 2: he Lishi Clevelos pH1000 100, dimethyl sulfoxide 5, 1wt% SF-331 fluorosurfactant (available from Guangdong standard SiF New materials Co., ltd.) in water 5, resin 332 (Naxiong) 2, 10% curative N3300 (Kogyo Co.) in water 1.
The conductive coating liquid of comparative example 3 and the preparation method of the conductive coating were the same as those of example.
Performance testing
(1) Sheet resistance test
The instrument used for the sheet resistance test is a precision four-probe resistivity tester of HPS2661 of Hexapa electronic technologies, inc.
(2) Transmittance test
The transmittance test instrument is Shenzhen Uygur autonomous science and technology company LS108H optical transmittance tester.
(3) Wear test
The abrasion test uses Testfabrics AATC ISO abrasion test white cotton cloth for dry friction, and the instrument is a steel wool abrasion tester of Shenzhen city induced good instrument equipment limited company, the weight of the weight is 50g, the test speed is 40 times/min, the back and forth test times are 10 times, and finally, the abrasion condition of the coating is the standard.
(4) Adhesion test
According to the GB/T9286-1998 test (national standard test requires a grippable knife).
The test results are shown in table 1 below:
table 1 test results
As can be seen from Table 1, the coating layer after the conductive coating liquid is dried has excellent conductive performance, high transmittance and good scratch resistance. In the embodiment, as the leveling agent and other components are added, the leveling property of the conductive coating is adjusted, so that the conductive coating is better coated in the subsequent coating process, and the coating is more uniform. The comparison results of the example 1 and the comparative example 1 prove that the PBFDO has stronger mechanical strength and better wear resistance than the PEDOT: PSS of the comparative example.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.
Furthermore, those skilled in the art will appreciate that while some embodiments herein include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the application and form different embodiments. For example, in the claims below, any of the claimed embodiments may be used in any combination. The information disclosed in this background section is only for enhancement of understanding of the general background of the application and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.
Claims (10)
1. The conductive material composition is characterized by comprising the following raw materials in parts by weight:
0.7-1.2 parts of poly (benzodifurandione), 0-3 parts of resin, 0-0.15 part of curing agent, 0.01-0.2 part of flatting agent and 70-140 parts of solvent.
2. The conductive material composition of claim 1, wherein the leveling agent comprises one or more of BYK333, BYK348, BYK378, MODARZ MFP, TEGO Glide 450, TEGO Rad 2100, and X043.
3. The conductive material composition according to claim 1, wherein the resin is used in an amount of 0.1 to 3 parts;
the resin includes one or more of polyacrylate resin, thermoplastic polyurethane, epoxy resin, and polyvinyl alcohol.
4. The conductive material composition according to claim 1, wherein the curing agent is used in an amount of 0.005 to 0.15 parts;
the curing agent comprises one or more of toluene diisocyanate or a polymer thereof, hexamethylene diisocyanate or a polymer thereof, diphenylmethane diisocyanate or a polymer thereof.
5. The conductive material composition according to claim 1, wherein the poly (benzodifurandione) is used in an amount of 0.9 to 1.1 parts and the leveling agent is used in an amount of 0.05 to 0.1 parts.
6. The composition of any one of claims 1 to 5, wherein the solvent used in the composition is N, N-dimethylformamide and/or dimethylsulfoxide.
7. A method of preparing the conductive material composition of any one of claims 1-6, comprising:
and mixing the raw materials to obtain the conductive material composition.
8. The method of producing a conductive material composition according to claim 7, wherein the raw materials are prepared in advance as respective dimethyl sulfoxide solutions, respectively, before the mixing;
the mixing is carried out at 20-50 ℃ and stirring speed of 500-1500 rpm for 10-60 minutes.
9. A product having a conductive coating, characterized by comprising a substrate and a conductive coating provided on the surface of the substrate, the conductive coating being obtained by curing the conductive material composition according to any one of claims 1 to 6.
10. The product with conductive coating according to claim 9, wherein the temperature of curing is 20-60 ℃;
the substrate comprises any one of glass, polyethylene terephthalate and polyimide.
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