CN116634727A - Profiling welding structure - Google Patents
Profiling welding structure Download PDFInfo
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- CN116634727A CN116634727A CN202310281754.8A CN202310281754A CN116634727A CN 116634727 A CN116634727 A CN 116634727A CN 202310281754 A CN202310281754 A CN 202310281754A CN 116634727 A CN116634727 A CN 116634727A
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- sealing
- end plate
- plate
- liquid cooling
- lug
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- 238000003466 welding Methods 0.000 title claims abstract description 79
- 238000007789 sealing Methods 0.000 claims abstract description 159
- 238000001816 cooling Methods 0.000 claims abstract description 64
- 239000007788 liquid Substances 0.000 claims abstract description 63
- 229910000679 solder Inorganic materials 0.000 claims description 48
- 210000000078 claw Anatomy 0.000 claims description 38
- 238000004891 communication Methods 0.000 claims description 34
- 229910000676 Si alloy Inorganic materials 0.000 claims description 14
- -1 aluminum-manganese Chemical compound 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 12
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 claims description 8
- 229910000914 Mn alloy Inorganic materials 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 6
- 210000005069 ears Anatomy 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 238000005452 bending Methods 0.000 claims 2
- 229910000838 Al alloy Inorganic materials 0.000 description 8
- 238000009434 installation Methods 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 229910000553 6063 aluminium alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000452 restraining effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20872—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20881—Liquid coolant with phase change
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
Abstract
The application relates to a profiling welding structure which comprises a first sealing lug, a second sealing lug and an annular main body part, wherein a connecting hole is formed in the middle of the annular main body part, the profiling welding structure can be sleeved on a connecting pipe through the connecting hole, the first sealing lug and the second sealing lug are respectively connected to two ends of the annular main body part, one end of the first sealing lug, which is far away from the annular main body part, extends along a connecting seam between a first end plate and a second end plate in a direction away from the second sealing lug, and one end of the second sealing lug, which is far away from the annular main body part, extends along a connecting seam between the first end plate and the second end plate in a direction away from the first sealing lug, so that the profiling welding structure can be welded between a liquid cooling plate and the connecting pipe and is covered on an opening of the whole welding gap in a sealing manner. The profiling welding structure solves the problem that the existing triangular cavity areas on two sides of the assembly hole of the liquid cooling plate are difficult to connect with the assembly hole of the liquid cooling plate and the pipeline in a sealing mode.
Description
Technical Field
The application relates to the technical field of liquid cooling plate welding structures, in particular to a profiling welding structure.
Background
At present, more and more parts of the new energy automobile need cooling, including but not limited to parts such as a power battery, an IGBT chip and a domain controller, and the more and more complicated the structure and the installation environment of the parts, the more and more challenges are presented to the sealing performance of the liquid cooling plate.
Generally, the liquid cooling plate includes upper end plate and lower end plate, and upper end plate and lower end plate welding formation liquid cooling plate, and when the installation environment of liquid cooling plate requires the exit position of liquid cooling plate to set up in the side of liquid cooling plate, the pipeline of intercommunication outside pipeline also sets up in the side of liquid cooling plate, at this moment, in order to make things convenient for the installation of pipeline, can form semicircular intercommunication mouth with upper end plate and lower end plate punching press respectively, and the intercommunication mouth of upper end plate and the intercommunication mouth of lower end plate surround and form circular pipeline intercommunication mouth. However, in the process of stamping forming, the upper end plate or the lower end plate can generate arc chamfer angles between the side wall of the semicircular communication port and the bottom wall of the upper end plate (or the lower end plate), so that triangular cavity areas can be formed on two sides of the circular communication port, and the risk of leakage of cooling liquid is increased.
In order to reduce the risk of leakage of the cooling liquid from the triangular cavity area, the conventional solution is to add a welding ring to fill the triangular cavity area, but the area of the triangular cavity area is too large, which can cause the problems of cold joint and the like, so the arrangement is difficult to completely eliminate the risk of leakage. Or, can also reduce the size of arc top chamfer through increasing a punching process, and then reduce the size of triangle cavity region, however, so set up, not only improved the processing degree of difficulty of liquid cooling board, triangle cavity region still can not eliminate completely moreover.
Disclosure of Invention
Based on this, it is necessary to provide a profiling welding structure to solve the problem that the existing triangular cavity areas on two sides of the assembly hole of the liquid cooling plate are difficult to be connected with the pipeline in a sealing way.
The profiling welding structure provided by the application is used for sealing and welding between the cylindrical connecting pipe and the liquid cooling plate. The liquid cooling plate comprises a first end plate and a second end plate, wherein the first end plate and the second end plate enclose to form a heat exchange cavity and a plurality of communication ports which are respectively communicated with the heat exchange cavity, a plurality of connecting pipes are respectively inserted into the corresponding communication ports between the first end plate and the second end plate, and welding gaps are formed between the outer walls of the connecting pipes and the inner walls of the communication ports. The profiling welding structure comprises a first sealing lug, a second sealing lug and an annular main body part, wherein a connecting hole is formed in the middle of the annular main body part, the profiling welding structure can be sleeved on a connecting pipe through the connecting hole, the first sealing lug and the second sealing lug are respectively connected to two ends of the annular main body part, one end of the first sealing lug, which is far away from the annular main body part, extends along a connecting seam between a first end plate and a second end plate in a direction far away from the second sealing lug, and one end of the second sealing lug, which is far away from the annular main body part, extends along a connecting seam between the first end plate and the second end plate in a direction far away from the first sealing lug, so that the profiling welding structure can be welded between a liquid cooling plate and the connecting pipe and is sealed to cover an opening part of the whole welding gap.
In one embodiment, the profiling welding structure comprises a first solder filling layer, a second solder filling layer and a covering sealing layer, wherein the first solder filling layer and the second solder filling layer are respectively attached to two sides of the covering sealing layer; the first solder filling layer is arranged on one side of the covering sealing layer, which is close to the liquid cooling plate, and can be melted and filled in a welding gap between the connecting pipe and the communication port, so that the covering sealing layer can be connected to the liquid cooling plate and can be covered at an opening of the welding gap in a sealing manner; the second solder filling layer is arranged on one side of the covering sealing layer far away from the liquid cooling plate, and can be melted and filled in a connecting gap between the connecting pipe and the covering sealing layer so as to be in sealing connection with the covering sealing layer and the connecting pipe.
In one embodiment, the first solder filling layer and the second solder filling layer are both made of aluminum-silicon alloy plates.
In one embodiment, the material of the covering sealing layer is an aluminum-manganese alloy plate or an aluminum-magnesium-silicon alloy plate.
In one embodiment, the profiling welding structure further comprises a first clamping jaw and a second clamping jaw, one end of the first clamping jaw is connected with the first sealing lug, the other end of the first clamping jaw extends along a connecting seam between the first end plate and the second end plate in a direction away from the first sealing lug, the first clamping jaw is provided with a first clamping groove, and the first end plate and the second end plate can be clamped into the first clamping groove and welded with the inner wall of the first clamping groove; the second sealing lug is connected to second jack catch one end, and the other end extends along the direction of keeping away from the second sealing lug along the connection seam between first end plate and the second end plate, and the second jack catch is equipped with the second draw-in groove, and first end plate and second end plate can block into the second draw-in groove and with the inner wall welding of second draw-in groove.
In one embodiment, the first jaw, the second jaw, the first sealing ear, the second sealing ear and the annular body portion are of an integrally formed construction.
In one embodiment, the first claw comprises a first claw body, a first flanging and a second flanging, the first claw body is connected with the first sealing lug, one end of the first claw body is bent towards the direction close to the liquid cooling plate to form a first flanging, and the other end of the first claw body is bent towards the direction close to the liquid cooling plate to form a second flanging.
In one embodiment, the second claw comprises a second claw body, a third flanging and a fourth flanging, the second claw body is connected with the second sealing lug, one end of the second claw body is bent towards the direction close to the liquid cooling plate to form the third flanging, and the other end of the second claw body is bent towards the direction close to the liquid cooling plate to form the fourth flanging.
In one embodiment, the profiling welding structure further comprises a connecting strip extending along the connecting seam between the first end plate and the second end plate, the connecting strip is connected with the first sealing lug and the second sealing lug of the adjacent profiling welding structure, the connecting strip is welded at the connecting seam of the first end plate and the second end plate in a sealing manner, and the adjacent annular main body part and the connecting strip are integrally formed.
In one embodiment, the profiling welding structure further comprises a first set of edges and a second set of edges, wherein the first set of edges are arranged between the first sealing lug and the second sealing lug and are arranged at one end of the annular main body part, the second set of edges are arranged between the first sealing lug and the second sealing lug and are arranged at the other end of the annular main body part, one end of the first set of edges is connected with the annular main body part, the other end of the first set of edges extends to the outer wall of the communication port towards the direction close to the first end plate, one end of the second set of edges is connected with the annular main body part, and the other end of the second set of edges extends to the outer wall of the communication port towards the direction close to the second end plate, so that the profiling welding structure can be sleeved at the outer side of the communication port through the first set of edges and the second set of edges.
In one embodiment, the first set of edges, the second set of edges, the first sealing ear, the second sealing ear and the annular body portion are integrally formed.
Compared with the prior art, the profiling welding structure provided by the application has the advantages that the annular main body part is arranged, the leakage of the annular welding seam between the connecting pipe and the communication port can be prevented, and the triangular cavity areas on two sides of the circular communication port can be effectively covered by arranging the first sealing lug and the second sealing lug, so that the leakage of the triangular cavity areas is prevented. And, first seal ear and second seal ear locate the connecting pipe through annular main part cover, improved the assembly strength of first seal ear and second seal ear greatly, and further, through setting up annular main part, can assemble first seal ear and second seal ear in the connecting pipe in advance, braze welding connecting pipe, profile modeling welded structure and liquid cooling board again, greatly reduced the degree of difficulty of brazing, improved brazed welding efficiency.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments or the conventional techniques of the present application, the drawings required for the descriptions of the embodiments or the conventional techniques will be briefly described below, and it is apparent that the drawings in the following descriptions are only some embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort for those skilled in the art.
FIG. 1 is an assembled side view of a connecting tube, liquid cooled plate and contoured weld construction according to one embodiment of the present application;
FIG. 2 is an exploded view of an assembly of a connecting tube, a liquid cooling plate and a contoured weld according to one embodiment of the present application;
FIG. 3 is a schematic structural view of a profile welding structure according to an embodiment of the present application;
FIG. 4 is a schematic structural view of a contoured weld construction according to another embodiment of the present application;
FIG. 5 is a schematic structural view of a contoured weld construction according to yet another embodiment of the present application;
fig. 6 is a cross-sectional view of a contoured weld construction according to yet another embodiment of the present application.
Reference numerals: 100. a liquid cooling plate; 110. a first end plate; 120. a second end plate; 130. a heat exchange cavity; 140. a communication port; 200. a connecting pipe; 210. a positioning ring; 300. welding gaps; 310. a triangular cavity region; 400. profiling welding structure; 410. a first sealing ear; 420. a second sealing ear; 430. an annular body portion; 431. a connection hole; 440. a first claw; 441. a first clamping groove; 442. a first claw body; 443. a first flanging; 444. a second flanging; 450. a second claw; 451. a second clamping groove; 452. a second claw body; 453. a third flanging; 454. fourth flanging; 460. a connecting strip; 471. a first set of edges; 472. a second set of edges; 481. a first solder filling layer; 482. a second solder filling layer; 483. covering the sealing layer.
Detailed Description
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
At present, more and more parts of the new energy automobile need cooling, including but not limited to parts such as a power battery, an IGBT chip and a domain controller, and the more and more complicated the structure and the installation environment of the parts, the more and more challenges are presented to the sealing performance of the liquid cooling plate.
Generally, the liquid cooling plate includes upper end plate and lower end plate, and upper end plate and lower end plate welding formation liquid cooling plate, and when the installation environment of liquid cooling plate requires the exit position of liquid cooling plate to set up in the side of liquid cooling plate, the pipeline of intercommunication outside pipeline also sets up in the side of liquid cooling plate, at this moment, in order to make things convenient for the installation of pipeline, can form semicircular intercommunication mouth with upper end plate and lower end plate punching press respectively, and the intercommunication mouth of upper end plate and the intercommunication mouth of lower end plate surround and form circular pipeline intercommunication mouth. However, in the process of stamping forming, the upper end plate or the lower end plate can generate arc chamfer angles between the side wall of the semicircular communication port and the bottom wall of the upper end plate (or the lower end plate), so that triangular cavity areas can be formed on two sides of the circular communication port, and the risk of leakage of cooling liquid is increased.
In order to reduce the risk of leakage of the cooling liquid from the triangular cavity area, the conventional solution is to add a welding ring to fill the triangular cavity area, but the area of the triangular cavity area is too large, which can cause the problems of cold joint and the like, so the arrangement is difficult to completely eliminate the risk of leakage. Or, can also reduce the size of arc top chamfer through increasing a punching process, and then reduce the size of triangle cavity region, however, so set up, not only improved the processing degree of difficulty of liquid cooling board, triangle cavity region still can not eliminate completely moreover.
Referring to fig. 1-6, in order to solve the problem that the existing triangular cavity regions on two sides of the assembly hole of the liquid cooling plate 100 cause difficulty in sealing connection between the assembly hole and the pipeline of the liquid cooling plate 100. The present application provides a profiling welding structure 400, and the profiling welding structure 400 is used for sealing welding between a cylindrical connecting pipe 200 and a liquid cooling plate 100.
As shown in fig. 1 and 2, the liquid cooling plate 100 includes a first end plate 110 and a second end plate 120, the first end plate 110 and the second end plate 120 enclose a heat exchange cavity 130 and form a plurality of communication ports 140 respectively communicating with the heat exchange cavity 130, a plurality of connection pipes 200 are respectively inserted in corresponding communication ports 140 between the first end plate 110 and the second end plate 120, and a welding gap 300 is formed between an outer wall of the connection pipe 200 and an inner wall of the communication port 140.
Typically, the number of communication ports 140 is two, one inlet and one outlet.
As shown in fig. 3 to 5, the profiling welding structure 400 includes a first sealing lug 410, a second sealing lug 420 and an annular main body 430, a connecting hole 431 is provided in the middle of the annular main body 430, the profiling welding structure 400 is sleeved on the connecting pipe 200 through the connecting hole 431, the first sealing lug 410 and the second sealing lug 420 are respectively connected to two ends of the annular main body 430, one end of the first sealing lug 410, which is far away from the annular main body 430, extends along a connecting seam between the first end plate 110 and the second end plate 120 in a direction away from the second sealing lug 420, and one end of the second sealing lug 420, which is far away from the annular main body 430, extends along a connecting seam between the first end plate 110 and the second end plate 120 in a direction away from the first sealing lug 410, so that the profiling welding structure 400 can be welded between the liquid cooling plate 100 and the connecting pipe 200 and is sealed and covered at an opening of the whole welding gap 300.
By providing the annular body portion 430, leakage of the circumferential weld between the connection pipe 200 and the communication port 140 can be prevented, and by providing the first sealing lug 410 and the second sealing lug 420, the triangular cavity regions 310 on both sides of the circular communication port 140 can be effectively covered, and leakage of the triangular cavity regions 310 can be prevented. And, first sealing ear 410 and second sealing ear 420 are located connecting pipe 200 through annular main part 430 cover, improved the assembly intensity of first sealing ear 410 and second sealing ear 420 greatly, and furthermore, through setting up annular main part 430, can assemble first sealing ear 410 and second sealing ear 420 in connecting pipe 200 in advance, braze welding connecting pipe 200, profile modeling welded structure 400 and liquid cooling board 100 again, greatly reduced the degree of difficulty of brazing, improved the welded efficiency of brazing.
In one embodiment, the first sealing ear 410, the second sealing ear 420, and the annular body portion 430 are an integrally formed structure.
In this way, the structural strength of the contoured weld structure 400 is improved.
In one embodiment, as shown in fig. 2, the connecting tube 200 is provided with a positioning ring 210, and the positioning ring 210 abuts against the profiling welding structure 400.
In this manner, the contoured weld structure 400 is prevented from shifting during brazing.
In an embodiment, as shown in fig. 3 to 4, the profile welding structure 400 further includes a first claw 440 and a second claw 450, one end of the first claw 440 is connected to the first sealing lug 410, the other end extends along a connecting seam between the first end plate 110 and the second end plate 120 in a direction away from the first sealing lug 410, the first claw 440 is provided with a first clamping groove 441, and the first end plate 110 and the second end plate 120 can be clamped into the first clamping groove 441 and welded with an inner wall of the first clamping groove 441. The second clamping jaw 450 has one end connected to the second sealing lug 420 and the other end extending along a connecting seam between the first end plate 110 and the second end plate 120 in a direction away from the second sealing lug 420, and the second clamping jaw 450 is provided with a second clamping groove 451, and the first end plate 110 and the second end plate 120 can be clamped into the second clamping groove 451 and welded with an inner wall of the second clamping groove 451.
So configured, the first end plate 110 and the second end plate 120 can provide a restraining effect on the contour welded structure 400 during brazing, preventing thermal stress deformation of the contour welded structure 400. And, by this arrangement, the assembly strength of the profiling welded structure 400 is significantly improved.
In one embodiment, the first jaw 440, the second jaw 450, the first sealing ear 410, the second sealing ear 420, and the annular body portion 430 are integrally formed.
Further, in an embodiment, the cross section of the first claw 440 is U-shaped, and the shape of the inner wall of the first clamping groove 441 is adapted to the shape of the first end plate 110 and the second end plate 120.
Likewise, the second jaw 450 has a U-shaped cross section, and the shape of the inner wall of the second clamping groove 451 is adapted to the shape of the first and second end plates 110 and 120.
Further, in an embodiment, as shown in fig. 3-4, the first claw 440 includes a first claw body 442, a first flange 443 and a second flange 444, the first claw body 442 is connected to the first sealing ear 410, one end of the first claw body 442 is bent towards the direction close to the liquid cooling plate 100 to form the first flange 443, and the other end of the first claw body 442 is bent towards the direction close to the liquid cooling plate 100 to form the second flange 444.
Similarly, in an embodiment, as shown in fig. 3 to 4, the second claw 450 includes a second claw body 452, a third flange 453 and a fourth flange 454, the second claw body 452 is connected to the second sealing ear 420, one end of the second claw body 452 is bent towards the direction close to the liquid cooling plate 100 to form the third flange 453, and the other end of the second claw body 452 is bent towards the direction close to the liquid cooling plate 100 to form the fourth flange 454.
In one embodiment, as shown in fig. 4, the contour welded structure 400 further includes a connecting strip 460 extending along the connecting seam between the first end plate 110 and the second end plate 120, the connecting strip 460 connects the first sealing lug 410 and the second sealing lug 420 of the adjacent contour welded structure 400, the connecting strip 460 is sealed and welded at the connecting seam between the first end plate 110 and the second end plate 120, and the adjacent annular body portion 430 and the connecting strip 460 are integrally formed.
In this manner, the sealability of the first and second end plates 110, 120 is further improved, and the ability of the contoured weld structure 400 to resist thermal stress deformation is greatly improved by the interconnection of adjacent annular body portions 430.
In an embodiment, as shown in fig. 5, the profile welding structure 400 further includes a first set of edges 471 and a second set of edges 472, the first set of edges 471 is disposed between the first sealing ear 410 and the second sealing ear 420 and is disposed at one end of the annular main body 430, the second set of edges 472 is disposed between the first sealing ear 410 and the second sealing ear 420 and is disposed at the other end of the annular main body 430, one end of the first set of edges 471 is connected to the annular main body 430, the other end extends to the outer wall of the communication port 140 toward the direction approaching the first end plate 110, one end of the second set of edges 472 is connected to the annular main body 430, and the other end extends to the outer wall of the communication port 140 toward the direction approaching the second end plate 120, so that the profile welding structure 400 can be sleeved outside the communication port 140 through the first set of edges 471 and the second set of edges 472.
It should be noted that, the first set of edges 471 are disposed between the first sealing ear 410 and the second sealing ear 420 and disposed at one end of the annular main body 430, the second set of edges 472 are disposed between the first sealing ear 410 and the second sealing ear 420 and disposed at the other end of the annular main body 430, and the first set of edges 471, the second set of edges 472, the first sealing ear 410 and the second sealing ear 420 are disposed at four orientations of the annular main body 430, respectively, and the first set of edges 471 and the second set of edges 472 are disposed opposite to each other, and the first sealing ear 410 and the second sealing ear 420 are disposed opposite to each other.
Because the first sealing lug 410 and the second sealing lug 420 are present, the first set of edges 471 and the second set of edges 472 cannot form a closed sleeve, and therefore, the profiling welding structure 400 is sleeved outside the communication port 140 through the first set of edges 471 and the second set of edges 472, not only improves the assembly strength of the profiling welding structure 400, but also does not interfere with the sealing of the triangular cavity area 310.
Specifically, the first set of edges 471 and the second set of edges 472 are each in an arc-shaped structure.
Further, in one embodiment, the first set of sides 471, the second set of sides 472, the first sealing ear 410, the second sealing ear 420, and the annular body portion 430 are integrally formed.
But is not limited thereto, in other embodiments, the first set of edges 471, the second set of edges 472, the first sealing ears 410, the second sealing ears 420, and the annular body portion 430 may also be welded.
Further, in an embodiment, as shown in fig. 6, the profiling soldering structure 400 includes a first solder filling layer 481, a second solder filling layer 482 and a cover sealing layer 483, and the first solder filling layer 481 and the second solder filling layer 482 are respectively attached to two sides of the cover sealing layer 483. The first solder filling layer 481 is disposed on one side of the cover sealing layer 483 near the liquid cooling plate 100, and the first solder filling layer 481 can be melted and filled in the soldering gap 300 between the connection pipe 200 and the communication port 140, so that the cover sealing layer 483 can be connected to the liquid cooling plate 100 and seal and cover the opening of the soldering gap 300. The second solder filling layer 482 is provided on a side of the cover sealing layer 483 away from the liquid cooling plate 100, and the second solder filling layer 482 can be melted and filled in a connection gap between the connection pipe 200 and the cover sealing layer 483 to seal-connect the cover sealing layer 483 and the connection pipe 200.
The first sealing ear 410, the second sealing ear 420 and the annular body 430 are all three-layer structures, that is, the first sealing ear 410 includes a first solder filling layer 481, a second solder filling layer 482 and a cover sealing layer 483, the second sealing ear 420 also includes the first solder filling layer 481, the second solder filling layer 482 and the cover sealing layer 483, and the annular body 430 also includes the first solder filling layer 481, the second solder filling layer 482 and the cover sealing layer 483.
Further, the first solder filling layer 481 and the second solder filling layer 482 are both meltable solder material layers, and the cover sealing layer 483 is a non-meltable fixed connection layer.
Specifically, in one embodiment, the materials of the first solder filling layer 481 and the second solder filling layer 482 are aluminum-silicon alloy plates (also called as 4×× aluminum alloy).
The aluminum-silicon alloy plate takes silicon as a main alloy element. Typically, the silicon content in the aluminum-silicon alloy sheet is between 4.5-6.0%. The aluminum-silicon alloy plate has the advantages of low melting point, good melt fluidity, easy shrinkage, good wear resistance, good heat resistance and the like. Thus, the aluminum-silicon alloy plate is used as the welding material layer, so that the welding strength of the profiling welding structure 400 is greatly improved.
More specifically, the materials of the first solder filling layer 481 and the second solder filling layer 482 include, but are not limited to, 4045 aluminum alloy, 4104 aluminum alloy, and 4343 aluminum alloy.
In one embodiment, the material of the covering sealing layer 483 is an aluminum-manganese alloy plate (also called 3× aluminum alloy) or an aluminum-magnesium-silicon alloy plate (also called 6× aluminum alloy).
The aluminum-manganese alloy plate and the aluminum-magnesium-silicon alloy plate can be subjected to heat treatment, and have high structural strength, so that the welding strength of the profiling welding structure 400 can be remarkably improved. Further, since the aluminum-manganese alloy sheet material, the aluminum-magnesium-silicon alloy sheet material, and the aluminum-silicon alloy sheet material are made of aluminum as the main element, the strength of the connection between the first solder filling layer 481, the second solder filling layer 482, and the cover sealing layer 483 can be greatly improved by the welding between the same metal elements, and since the liquid cooling plate 100 is made of aluminum alloy, the strength of the connection between the liquid cooling plate 100 and the cover sealing layer 483 can be improved by the arrangement.
More specifically, the material of the cover sealing layer 483 includes, but is not limited to, 3003 aluminum alloy and 6063 aluminum alloy.
Further, the melting point of the aluminum-manganese alloy plate and the melting point of the aluminum-magnesium-silicon alloy plate are both about 660 ℃ and about 580 ℃.
Thus, the contoured solder structure 400 can be soldered at a temperature controlled between 580 ℃ (not included) and 660 ℃ (not included) so that the first solder filling layer 481 and the second solder filling layer 482 on both sides are melted, while the middle cover sealing layer 483 is not melted.
In the contour welding structure 400, during welding, the first solder filling layer 481 can be melted and filled in the welding gap 300 between the connection pipe 200 and the communication port 140, so that the cover sealing layer 483 can be connected to the liquid cooling plate 100 and seal-cover the opening of the welding gap 300, and the second solder filling layer 482 can be melted and filled in the connection gap between the connection pipe 200 and the cover sealing layer 483, so as to seal-connect the cover sealing layer 483 and the connection pipe 200. Thus, the whole profiling welding structure 400 can be respectively connected with the connecting pipe 200 and the liquid cooling plate 100 in a sealing way, the connection tightness of the connecting pipe 200 and the liquid cooling plate 100 is greatly improved, and the welding difficulty is reduced.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of the application should be determined from the following claims.
Claims (10)
1. A profiling welding structure is used for sealing welding between a cylindrical connecting pipe (200) and a liquid cooling plate (100); the liquid cooling plate (100) comprises a first end plate (110) and a second end plate (120), wherein the first end plate (110) and the second end plate (120) are surrounded to form a heat exchange cavity (130) and form a plurality of communication ports (140) which are respectively communicated with the heat exchange cavity (130), a plurality of connecting pipes (200) are respectively inserted into the corresponding communication ports (140) between the first end plate (110) and the second end plate (120), and a welding gap (300) is formed between the outer wall of each connecting pipe (200) and the inner wall of each communication port (140);
the profiling welding structure (400) is characterized by comprising a first sealing lug (410), a second sealing lug (420) and an annular main body part (430), wherein a connecting hole (431) is formed in the middle of the annular main body part (430), the profiling welding structure (400) can be sleeved on a connecting pipe (200) through the connecting hole (431), the first sealing lug (410) and the second sealing lug (420) are respectively connected to two ends of the annular main body part (430), one end of the first sealing lug (410) away from the annular main body part (430) extends along the direction of a connecting seam between a first end plate (110) and a second end plate (120) towards the direction away from the second sealing lug (420), and one end of the second sealing lug (420) away from the annular main body part (430) extends along the direction of the connecting seam between the first end plate (110) and the second end plate (120) towards the direction away from the first sealing lug (410), so that the profiling welding structure (400) can be welded on the liquid cooling plate (100) and the connecting pipe (200) and covers the whole welding seam (300).
2. The profiling soldering structure according to claim 1, comprising a first solder filling layer (481), a second solder filling layer (482) and a cover sealing layer (483), the first solder filling layer (481) and the second solder filling layer (482) being respectively attached to both sides of the cover sealing layer (483); the first solder filling layer (481) is arranged on one side of the covering sealing layer (483) close to the liquid cooling plate (100), and the first solder filling layer (481) can be melted and filled in a welding gap (300) between the connecting pipe (200) and the communication port (140), so that the covering sealing layer (483) can be connected to the liquid cooling plate (100) and can be covered at an opening of the welding gap (300) in a sealing manner; the second solder filling layer (482) is arranged on one side, far away from the liquid cooling plate (100), of the cover sealing layer (483), and the second solder filling layer (482) can be melted and filled in a connection gap between the connecting pipe (200) and the cover sealing layer (483) so as to be used for sealing and connecting the cover sealing layer (483) and the connecting pipe (200).
3. The profiling welded structure according to claim 2, wherein the first solder filling layer (481) and the second solder filling layer (482) are both made of aluminum silicon alloy sheet material.
4. The profiling welding structure according to claim 2, wherein the material of the covering sealing layer (483) is an aluminum-manganese alloy plate or an aluminum-magnesium-silicon alloy plate.
5. The profiling welding structure according to claim 1, further comprising a first jaw (440) and a second jaw (450), wherein one end of the first jaw (440) is connected to the first sealing lug (410), the other end extends along a connecting seam between the first end plate (110) and the second end plate (120) in a direction away from the first sealing lug (410), and the first jaw (440) is provided with a first clamping groove (441), and the first end plate (110) and the second end plate (120) can be clamped into the first clamping groove (441) and welded with an inner wall of the first clamping groove (441); the second jack catch (450) one end is connected second seal lug (420), and the other end is along the connection seam orientation between first end plate (110) and second end plate (120) keep away from the direction of second seal lug (420), just second jack catch (450) are equipped with second draw-in groove (451), first end plate (110) and second end plate (120) can block into second draw-in groove (451) and with the inner wall welding of second draw-in groove (451).
6. The contoured weld of claim 5, wherein said first jaw (440), said second jaw (450), said first sealing ear (410), said second sealing ear (420), and said annular body portion (430) are an integrally formed structure.
7. The profiling welding structure according to claim 5, wherein the first claw (440) comprises a first claw body (442), a first flange (443) and a second flange (444), the first claw body (442) is connected with the first sealing lug (410), one end of the first claw body (442) is bent towards a direction approaching the liquid cooling plate (100) to form the first flange (443), and the other end of the first claw body (442) is bent towards a direction approaching the liquid cooling plate (100) to form the second flange (444);
and/or, second jack catch (450) include second claw body (452), third turn-ups (453) and fourth turn-ups (454), second claw body (452) are connected second sealed ear (420), the one end of second claw body (452) is towards being close to the direction bending type of liquid cooling board (100) and is formed third turn-ups (453), the other end of second claw body (452) is towards being close to the direction bending type of liquid cooling board (100) and is formed fourth turn-ups (454).
8. The contour welded structure according to claim 1, further comprising a connecting strip (460) extending along a connecting seam between the first end plate (110) and the second end plate (120), the connecting strip (460) connecting the first sealing lug (410) and the second sealing lug (420) adjacent to the contour welded structure (400), the connecting strip (460) being seal-welded at the connecting seam of the first end plate (110) and the second end plate (120), and the adjacent annular body portion (430) and the connecting strip (460) being integrally formed.
9. The contour welding structure according to claim 1, further comprising a first set of sides (471) and a second set of sides (472), the first set of sides (471) being provided between the first sealing ear (410) and the second sealing ear (420) and being provided at one end of the annular body portion (430), the second set of sides (472) being provided between the first sealing ear (410) and the second sealing ear (420) and being provided at the other end of the annular body portion (430), the first set of sides (471) having one end connected to the annular body portion (430) and the other end extending to the outer wall of the communication port (140) in a direction approaching the first end plate (110), the second set of sides (472) having one end connected to the annular body portion (430) and the other end extending to the outer wall of the communication port (140) in a direction approaching the second end plate (120), such that the contour welding structure (400) can be provided outside the communication port (140) through the first set of sides (471) and the second set of sides (140).
10. The contoured weld construction of claim 9, wherein said first set of edges (471), said second set of edges (472), said first sealing ears (410), said second sealing ears (420) and said annular body portion (430) are integrally formed.
Priority Applications (1)
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CN202310281754.8A CN116634727A (en) | 2023-03-16 | 2023-03-16 | Profiling welding structure |
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CN202310281754.8A CN116634727A (en) | 2023-03-16 | 2023-03-16 | Profiling welding structure |
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