CN116610508A

CN116610508A - Heat dissipation test method and device, electronic equipment and storage medium

Info

Publication number: CN116610508A
Application number: CN202310456730.1A
Authority: CN
Inventors: 胡博; 黄帅; 梁盛楠
Original assignee: Suzhou Inspur Intelligent Technology Co Ltd
Current assignee: Suzhou Inspur Intelligent Technology Co Ltd
Priority date: 2023-04-25
Filing date: 2023-04-25
Publication date: 2023-08-18

Abstract

The embodiment of the invention provides a heat dissipation test method, a heat dissipation test device, electronic equipment and a storage medium, wherein equipment address information aiming at switch equipment and node information aiming at a heat dissipation module are determined; determining a target heat dissipation module from the heat dissipation modules through the equipment address information and the node information of the heat dissipation modules; acquiring first instant running state information and on-site information of a target heat radiation module, and constructing a data bus interface aiming at the heat radiation module by adopting the on-site information and the first instant running state information; the method comprises the steps of determining a preset test temperature range and a preset temperature change frequency, and carrying out heat dissipation test on the target heat dissipation module based on a data bus interface through the preset test temperature range and the preset temperature change frequency, so that the problem that the temperature change control target heat dissipation module executes a heat dissipation strategy by manually constructing an incubator is avoided, and further the test efficiency of the heat dissipation strategy of the heat dissipation module of the switch is improved.

Description

Heat dissipation test method and device, electronic equipment and storage medium

Technical Field

The present invention relates to the field of heat dissipation testing technology, and in particular, to a heat dissipation testing method, a heat dissipation testing device, an electronic device, and a computer readable storage medium.

Background

When the exchanger operates, a lot of heat is generated when a plurality of hardware units of the exchanger operate, so that a heat dissipation regulation function is necessary. The heat dissipation strategy of the switch has the main functions of dynamically adjusting the rotating speed of the fan module according to the fan regulation parameters and algorithms by collecting the temperature data of the sensor and the working state of the fan in real time, so that the whole machine can be ensured to operate at normal ambient temperature, and the influence of high temperature on the operation of the machine is avoided. Meanwhile, an alarm and error processing mechanism is provided, so that emergency situations such as fan redundancy or missing can be dealt with to the maximum extent. Therefore, before the switch is put into use, the heat dissipation strategy of the machine must be tested to ensure that the switch can perform correct processing on the temperature and complete the speed regulation operation of the fan, and simultaneously complete alarm and exception mechanism response to an exception condition.

In the related art, the function test of machine heat dissipation mainly adopts manual test, and a tester is required to build an incubator to realize temperature change, which is time-consuming and labor-consuming, so that the efficiency of the heat dissipation strategy test of the switch is reduced.

Disclosure of Invention

The embodiment of the invention provides a heat dissipation testing method, a heat dissipation testing device, electronic equipment and a computer readable storage medium, so as to solve the problem of how to improve the testing efficiency of a heat dissipation strategy of a switch.

The embodiment of the invention discloses a heat dissipation testing method, which is applied to a heat dissipation testing system aiming at switch equipment, wherein the switch equipment comprises a heat dissipation module and can comprise the following steps:

determining device address information for the switch device and node information for the heat dissipation module;

determining a target heat dissipation module from the heat dissipation modules through the equipment address information and the node information of the heat dissipation modules;

acquiring first instant running state information and on-site information of the target heat dissipation module, and constructing a data bus interface aiming at the heat dissipation module by adopting the on-site information and the first instant running state information;

and determining a preset test temperature range and a preset temperature change frequency, and carrying out heat dissipation test on the target heat dissipation module based on the data bus interface through the preset test temperature range and the preset temperature change frequency.

Optionally, the heat dissipation testing system is configured with a web user interface, and the step of determining device address information for the switch device and node information for the heat dissipation module may include:

determining device address information for the switch device and node information for the heat sink module using the web user interface;

The step of determining the preset test temperature range and the preset temperature change frequency comprises the following steps:

and determining a preset test temperature range and a preset temperature change frequency by adopting the web user interface.

Optionally, the heat dissipation test system has a corresponding test server device, the heat dissipation test system is loaded on a server, the server is configured with a corresponding baseboard management controller, the heat dissipation test system performs data interaction with the test server device through the baseboard management controller, the step of obtaining first instant running state information and on-site information of the target heat dissipation module, and constructing a data bus interface for the heat dissipation module by adopting the on-site information and the first instant running state information may include:

the node information is sent to the test server side equipment through the baseboard management controller so as to control the test server side equipment to identify the target heat dissipation module through the node information, and first instant running state information and in-place information of the target heat dissipation module are obtained;

and constructing a data bus interface aiming at the heat dissipation module by the test server side equipment by adopting the in-place information and the first instant running state information.

Optionally, the step of determining a preset test temperature range and a preset temperature change frequency, and performing a heat dissipation test on the target heat dissipation module based on the data bus interface through the preset test temperature range and the preset temperature change frequency may include:

determining a preset test temperature range and a preset temperature change frequency, and sending a first test command to the test server device, wherein the test server device responds to the first test command and acquires the preset test temperature range and the preset temperature change frequency based on the data bus interface;

the test server device is used for generating a first analog signal according to a preset algorithm based on the preset test temperature range and the preset temperature change frequency;

the test server side equipment is used for acquiring second instant running state information of the target radiating module under the first analog signal based on the data bus interface, and sending the instant running state information to the radiating test system so as to display the second instant running state information on the web user interface.

Optionally, the method may further include:

Generating a first test report for the second immediate operational status information; the first test report includes a graph of change in curve for the second immediate operating state information.

Optionally, the method may further include:

sending a second test command to the test server side equipment, wherein the test server side equipment responds to the second test command and generates a second analog signal for expressing that the target heat dissipation module generates an abnormality through the node information;

the test server side equipment is used for acquiring third instant running state information of the target radiating module under the second analog signal based on the data bus interface, and sending the third instant running state information to the radiating test system so as to display the third instant running state information on the web user interface.

Optionally, the method may further include:

generating a second test report for the third immediate operational status information.

The embodiment of the invention also discloses a heat radiation testing device which is applied to a heat radiation testing system aiming at the switch equipment, wherein the switch equipment comprises a heat radiation module and can comprise:

an information determining module for determining device address information for the switch device and node information for the heat dissipating module;

The target heat dissipation module determining module is used for determining a target heat dissipation module from the heat dissipation modules through the equipment address information and the node information of the heat dissipation modules;

the data bus interface construction module is used for acquiring first instant running state information and in-situ information of the target heat radiation module and constructing a data bus interface aiming at the heat radiation module by adopting the in-situ information and the first instant running state information;

and the heat radiation test module is used for determining a preset test temperature range and a preset temperature change frequency, and carrying out heat radiation test on the target heat radiation module based on the data bus interface through the preset test temperature range and the preset temperature change frequency.

Optionally, the heat dissipation testing system is configured with a web user interface, and the information determining module may include:

an information determination sub-module for determining device address information for the switch device and node information for the heat sink module using the web user interface;

the heat dissipation test module includes:

and the preset temperature change frequency determining submodule is used for determining a preset test temperature range and a preset temperature change frequency by adopting the web user interface.

Optionally, the heat dissipation test system has a corresponding test server device, the heat dissipation test system is loaded on a server, the server is configured with a corresponding baseboard management controller, the heat dissipation test system performs data interaction with the test server device through the baseboard management controller, and the data bus interface building module may include:

the information acquisition sub-module is used for sending the node information to the test server side equipment through the baseboard management controller so as to control the test server side equipment to identify the target heat dissipation module through the node information and acquire first instant running state information and in-place information of the target heat dissipation module;

and the data bus interface construction submodule is used for constructing a data bus interface aiming at the heat radiation module by adopting the in-place information and the first instant running state information through the test server equipment.

Optionally, the heat dissipation test module may include:

the first test command sending submodule is used for determining a preset test temperature range and a preset temperature change frequency, and sending a first test command to the test server side equipment, wherein the test server side equipment responds to the first test command and acquires the preset test temperature range and the preset temperature change frequency based on the data bus interface;

Optionally, the method may further include:

a first test report generating module for generating a first test report for the second immediate operational status information; the first test report includes a graph of change in curve for the second immediate operating state information.

Optionally, the method may further include:

the second test command sending module is used for sending a second test command to the test server side equipment, and the test server side equipment responds to the second test command and generates a second analog signal for expressing that the target heat dissipation module generates an abnormality through the node information;

Optionally, the method may further include:

and the second test report generating module is used for generating a second test report aiming at the third instant running state information.

The embodiment of the invention also discloses electronic equipment, which comprises a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory are communicated with each other through the communication bus;

the memory is used for storing a computer program;

the processor is configured to implement the method according to the embodiment of the present invention when executing the program stored in the memory.

Embodiments of the present invention also disclose a computer-readable storage medium having instructions stored thereon, which when executed by one or more processors, cause the processors to perform the method according to the embodiments of the present invention.

The embodiment of the invention has the following advantages:

according to the embodiment of the invention, the equipment address information aiming at the switch equipment and the node information aiming at the heat dissipation module are determined; determining a target heat dissipation module from the heat dissipation modules through the equipment address information and the node information of the heat dissipation modules; acquiring first instant running state information and on-site information of a target heat radiation module, and constructing a data bus interface aiming at the heat radiation module by adopting the on-site information and the first instant running state information; the method comprises the steps of determining a preset test temperature range and a preset temperature change frequency, and carrying out heat dissipation test on the target heat dissipation module based on a data bus interface through the preset test temperature range and the preset temperature change frequency, so that the problem that the temperature change control target heat dissipation module executes a heat dissipation strategy by manually constructing an incubator is avoided, and further the test efficiency of the heat dissipation strategy of the heat dissipation module of the switch is improved.

Drawings

FIG. 1 is a flow chart of steps of a heat dissipation testing method according to an embodiment of the present invention;

FIG. 2 is a flow chart of another heat dissipation testing method according to an embodiment of the present invention;

FIG. 3 is a block diagram of a heat dissipation testing device according to an embodiment of the present invention;

FIG. 4 is a block diagram of the hardware architecture of an electronic device provided in various embodiments of the invention;

fig. 5 is a schematic diagram of a computer readable medium provided in an embodiment of the invention.

Detailed Description

In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.

Referring to fig. 1, a step flowchart of a heat dissipation testing method provided in an embodiment of the present invention may specifically include the following steps:

step 101, determining device address information for the switch device and node information for the heat dissipation module;

102, determining a target heat dissipation module from the heat dissipation modules through the equipment address information and the node information of the heat dissipation modules;

step 103, obtaining first instant running state information and on-site information of the target heat dissipation module, and constructing a data bus interface aiming at the heat dissipation module by adopting the on-site information and the first instant running state information;

Step 104, determining a preset test temperature range and a preset temperature change frequency, and performing a heat dissipation test on the target heat dissipation module based on the data bus interface through the preset test temperature range and the preset temperature change frequency.

In a specific implementation, the embodiment of the invention can be applied to a heat dissipation test system for switch equipment.

In practical application, the switch may be a network communication device, and form a "routing" service for the network, and connect to each node in the network, so as to implement interconnection and interworking between network nodes, so as to transmit network traffic. The method can switch a large amount of data, is beneficial to accelerating the flow on the network and improving the efficiency of the network. The exchanger adopts quite complex hardware technology, and comprises a plurality of functional subsystems, wherein each functional subsystem has own characteristics and can support the development of specific protocols so as to meet different service requirements. By using the correct accessories and technology, the switch can meet the network requirement, support the circuit throughput and network security protection required by different applications, thereby ensuring that resources are effectively allocated for tasks.

Switches are the most important components of the network, and an efficient, reliable switch device plays an important role in the performance of the network. The method supports the continuous development of the data center network, can meet the requirements of server, storage and quick information transmission among network devices, is a main switching device for maintaining the core data center network, and has high congestion capacity and high security capacity.

Switches are classified into switches and routers, and can be classified according to transmission medium (ethernet or fiber), architecture type (cross-type, load balancing, and three-layer network architecture), management characteristics (simple management or higher level management), bandwidth size, and scalability (number of slots). The switch separates Vlan, can carry on the logical grouping to the network information, support "user" and "Internet", the module between different networks is independent each other, reduce the network congestion, raise reliability and security of the network.

For a plurality of devices of the switch, a plurality of heat dissipation modules, for example, a heat dissipation fan, a liquid cooling heat dissipation system, and the like, may be respectively configured for the plurality of devices.

The embodiment of the invention can determine the equipment address information aiming at the switch equipment and the node information aiming at the heat dissipation module, and can determine the IP address of the switch to which the heat dissipation module to be tested belongs and the i2c node information of the heat dissipation module to be tested in the switch by way of example.

The management bus I2C is a simple, bi-directional two-wire synchronous serial bus. The management bus I2C requires only two wires to transfer information between devices connected to the bus. The master device is used to activate the bus to transfer data and generate a clock to open the transferred device, where any addressed device is considered a slave device, and the relationship of master and slave, transmit and receive on the bus is not constant, but depends on the direction of data transfer at that time. If the host computer is to send data to the slave device, the host computer firstly addresses the slave device, then actively sends the data to the slave device, and finally the host computer terminates the data transmission; if the host is to receive data from the slave, the slave is addressed by the master first, then the host receives data sent from the slave, and finally the host terminates the receiving process. In this case, the host is responsible for generating the timing clock and terminating the data transfer.

After the equipment address information and the node information are determined, the target heat dissipation module is determined from the heat dissipation module through the equipment address information and the node information of the heat dissipation module, the first instant running state information and the on-site information of the target heat dissipation module are obtained, and the data bus interface aiming at the heat dissipation module is constructed by adopting the on-site information and the first instant running state information.

Specifically, the first instant running state information may be instant running state information obtained for a heat dissipation module of the switch before a heat dissipation test is performed on a heat dissipation policy of the switch, for example, may be a fan rotation speed of a heat dissipation fan, a liquid flow rate of a heat dissipation liquid cooling system, and the like; the in-place information may be information indicating whether the target heat dissipating module is in place, for example, a heat dissipating fan should be disposed on a certain i2c, if the in-place information of the fan is yes, a heat dissipating fan is disposed on the i2c, and if the in-place information of the fan is no, no heat dissipating fan is disposed on the i2 c.

The data Bus interface D-Bus is an advanced inter-process communication mechanism, and the most main purpose of the D-Bus is to provide communication for processes in a Linux desktop environment, and simultaneously can transmit Linux desktop environment and Linux kernel events as messages to the processes. The main concept of the D-Bus is a Bus, a registered process can receive or transmit a message through the Bus, and the process can also wait for a kernel event response after registering, for example, wait for the transition of a network state or send a shutdown instruction by a computer. D-Bus has been adopted by most Linux distribution boards, and developers can use D-Bus to realize various complex inter-process communication tasks.

After determining a target heat dissipation module and constructing a data Bus interface D-Bus for the target heat dissipation module, the embodiment of the invention can determine the preset test temperature range and the preset temperature change frequency for the target heat dissipation module, and carry out heat dissipation test on the target heat dissipation module based on the data Bus interface through the preset test temperature range and the preset temperature change frequency, namely, the embodiment of the invention can provide an analog temperature signal for heat dissipation strategy test for the target heat dissipation module through the data Bus interface D-Bus so that the target heat dissipation module can execute the heat dissipation strategy based on the analog temperature signal, thereby avoiding the realization of temperature change control of the target heat dissipation module to execute the heat dissipation strategy through manual construction of an incubator.

On the basis of the above embodiments, modified embodiments of the above embodiments are proposed, and it is to be noted here that only the differences from the above embodiments are described in the modified embodiments for the sake of brevity of description.

In an alternative embodiment of the present invention, the heat dissipation test system is configured with a web user interface, and the step of determining device address information for the switch device and node information for the heat dissipation module includes:

In practical application, in order to further improve the test efficiency of the heat dissipation strategy of the heat dissipation module of the switch, the embodiment of the invention can further optimize the heat dissipation test system so as to reduce the control difficulty of related technicians on the heat dissipation test system.

In particular, embodiments of the present invention may be configured with a web user interface for a thermal test system, which may be, for example, a web page web (World Wide Web), a global wide area network, also known as the world wide web, which is a hypertext and HTTP based, global, dynamic interactive, cross-platform distributed graphical information system. The network service is established on the Internet, a graphical and easily-accessible visual interface is provided for a browser to search and browse information on the Internet, and documents and hyperlinks organize information nodes on the Internet into a mutually-associated network structure.

For example, the user may set a test machine ip address, i2c node information of the fan, a preset test temperature range, and a preset temperature change frequency in the web page.

In the embodiment of the invention, the device address information for the switch device and the node information for the heat dissipation module are determined by adopting the world wide web user interface; the world wide web user interface is adopted to determine the preset test temperature range and the preset temperature change frequency, so that the control difficulty of related technicians on the heat dissipation test system is reduced, and the test efficiency of the heat dissipation strategy of the heat dissipation module of the switch is further improved.

In an optional embodiment of the present invention, the heat dissipation test system has a corresponding test server device, the heat dissipation test system is loaded on a server, the server is configured with a corresponding baseboard management controller, the heat dissipation test system performs data interaction with the test server device through the baseboard management controller, the step of obtaining first instant running state information and on-site information of the target heat dissipation module, and constructing a data bus interface for the heat dissipation module by adopting the on-site information and the first instant running state information includes:

Redfish is a management standard based on HTTPs service, and uses RESTful interface to realize device management. RESTful is an adjective that indicates a program or design conforming to the principle of REST (Representational State Transfer). The Redfish may be used on a Server device, specifically, the baseboard management controller BMC on the Server is the Redfish Server, and the Redfish Client may be a Redfish program in a computer, through which a user may access, modify, update, and delete service instances.

The baseboard management controller, also known as a baseboard management controller (baseboard management controller, BMC), is a specialized service processor that uses sensors to monitor the status of a computer, web server, or other hardware driven device and communicates with the system administrator via separate connection lines. BMCs are part of the intelligent platform control interface (IPMI, intelligent Platform Management Interface) and are typically contained within a motherboard or main circuit board of a device being monitored. The sensors of the BMC are used to measure internal physical variables such as: temperature, humidity, power supply voltage, fan speed, communication parameters, and Operating System (OS) functions. If any of these variables is outside the scope of the established limits, it will inform the user that the user can take the correct action using the remote control. The monitoring device may be power cycled or restarted when necessary. In this way, a single user can remotely control numerous servers and other devices simultaneously. This saves the overall cost of the network and ensures reliability.

In a specific implementation, the embodiment of the invention can configure a corresponding test server device for a heat dissipation test system, the heat dissipation test system can be loaded on a server, the server can be configured with a baseboard management controller BMC loaded with a Redfish program, the heat dissipation test system can realize data interaction with the test server device through the Redfish program, on the basis, the embodiment of the invention can send node information to the test server device through the Redfish program so as to control the test server device to identify a target heat dissipation module through the node information, acquire first instant running state information and on-site information of the target heat dissipation module, and then construct a fan d-bus interface for simulating the on-site condition of a fan and a temperature d-bus interface for simulating temperature change through the test server device by adopting the on-site information and the first instant running state information.

According to the embodiment of the invention, the node information is sent to the test server equipment through the baseboard management controller so as to control the test server equipment to identify the target heat dissipation module through the node information and obtain the first instant running state information and the in-place information of the target heat dissipation module; and constructing a data bus interface aiming at the heat dissipation module by the test server equipment by adopting the in-place information and the first instant running state information, thereby improving the control efficiency of a user on the test server equipment and further improving the test efficiency of a heat dissipation strategy of the heat dissipation module aiming at the switch.

In practical application, before executing the heat dissipation policy, the heat dissipation module needs to acquire the temperature of the switch through the heat dissipation policy module including the temperature sensing device to control the heat dissipation module to execute the heat dissipation policy, that is, the switch is configured with a corresponding heat dissipation policy module, so in order to reduce the test cost, in an alternative embodiment of the present invention, the heat dissipation policy module originally configured for the switch may be directly used as a test server device, and two modes may be configured for the test server device, the mode a may be a test mode, and may be a test mode, by modifying the temperature d-bus interface, to provide an analog temperature signal for the heat dissipation policy module to control the heat dissipation module to execute the heat dissipation policy, thereby implementing a test on the heat dissipation policy of the heat dissipation module, and reducing the test cost for the heat dissipation policy of the heat dissipation module of the switch.

In an optional embodiment of the present invention, the step of determining a preset test temperature range and a preset temperature variation frequency, and performing a heat dissipation test on the target heat dissipation module based on the data bus interface through the preset test temperature range and the preset temperature variation frequency includes:

In practical application, the heat dissipation module of the switch may have two situations of normal running state and abnormal running state, so the embodiment of the invention can test the heat dissipation strategy in the two situations respectively.

For example, for the situation that the running state of the cooling fan is normal, the user may set a test temperature range and a change frequency in a web page displaying the cooling test system, and send a first test command to the test server device, after receiving the first test command, the test server device may adjust the cooling policy module for the switch to a test mode in response to the first test command, and control the cooling policy module to obtain a temperature simulation actual temperature range and a change frequency from the temperature d-bus interface, the test server device generates a first simulation signal according to the temperature range and the change frequency set by the user, and a preset algorithm to sequentially modify the temperature d-bus interface value to simulate temperature rise and temperature fall, the cooling policy module reads the temperature value and executes cooling policy calculation, sends the obtained fan rotation speed parameter to the cooling fan to regulate speed, and the test server device may then read the fan rotation speed of the cooling fan under the first simulation signal in real time, synchronize the fan rotation speed of the cooling fan to the fan d-bus interface based on the fan i2c node information, and then send the fan rotation speed of the cooling fan under the first simulation signal to the test system, so as to display the i2c node information of the cooling fan and the fan rotation speed of the cooling policy under the web page.

In the embodiment of the invention, a preset test temperature range and a preset temperature change frequency are determined, and a first test command is sent to the test server device, and the test server device responds to the first test command and acquires the preset test temperature range and the preset temperature change frequency based on the data bus interface; the test server device is used for generating a first analog signal according to a preset algorithm based on the preset test temperature range and the preset temperature change frequency; the test server side equipment is used for acquiring second instant running state information of the target heat dissipation module under the first analog signal based on the data bus interface, and sending the instant running state information to the heat dissipation test system so as to display the second instant running state information on the web user interface, thereby realizing heat dissipation strategy test when the heat dissipation module normally runs, and further improving test efficiency of heat dissipation strategy of the heat dissipation module of the switch.

In an alternative embodiment of the present invention, further comprising:

In a specific implementation, the embodiment of the invention can generate the first test report aiming at the second instant running state information so as to express the running state information of the heat dissipation module under the first analog signal, for example, the first test report can express the position of the heat dissipation fan, and in a preset time period, the change condition of the rotating speed parameter of the heat dissipation fan under the first analog signal is used for the operation and maintenance personnel to quickly locate and troubleshoot.

To more intuitively express the operation state change condition of the heat dissipation module under the first mode analog signal, optionally, the first test report includes a curve change chart for the second instant operation state information.

According to the embodiment of the invention, a first test report aiming at the second instant running state information is generated; the first test report includes a graph of change in curve for the second immediate operating state information. Therefore, conditions are created for quick positioning and troubleshooting of maintenance personnel, and the test efficiency of the heat dissipation strategy of the heat dissipation module of the switch is further improved.

In an alternative embodiment of the present invention, further comprising:

For example, when the running state of the cooling fan is abnormal, an alarm function of the cooling strategy needs to be tested, a second test command may be sent to the test server device, and the test server device may modify fan in-place information by modifying the i2c node data of the cooling fan and the fan d-bus interface in response to the second test command to generate a second analog signal for expressing the loss and the plug situation of the analog fan to control the cooling fan to execute the cooling strategy, and then send the fan rotation speed of the cooling fan under the second analog signal to the cooling test system to display the i2c node information of the cooling fan and the fan rotation speed of the cooling fan under the second analog signal on a web page.

Optionally, the embodiment of the invention can also generate a second test report aiming at the third instant running state information, and express whether the heat dissipation module generates the alarm information when running abnormally so as to realize the test of the alarm function of the heat dissipation strategy.

According to the embodiment of the invention, a second test command is sent to the test server side equipment, and the test server side equipment responds to the second test command and generates a second analog signal for expressing that the target heat dissipation module generates an abnormality through the node information; the test server side equipment is used for acquiring third instant running state information of the target heat dissipation module under the second analog signal based on the data bus interface, and sending the third instant running state information to the heat dissipation test system so as to display the third instant running state information on the web user interface and generate a second test report aiming at the third instant running state information, thereby realizing heat dissipation strategy test when the heat dissipation module operates abnormally and further improving test efficiency of heat dissipation strategies of the heat dissipation module aiming at the switch.

In order that those skilled in the art will better understand the embodiments of the present invention, a complete example will be described below.

Referring to fig. 2, fig. 2 is a flow chart of another heat dissipation testing method provided in the embodiment of the present invention, a tester logs in to a web page of a testing system first, and then sets an ip address of a testing machine, algorithm parameters of a heat dissipation policy, and i2c node information of a fan in a configuration page. The test system interacts with the heat dissipation test service through the redfish, transmits the information of the i2c node of the fan to the heat dissipation test service, reads the i2c node of the switch through algorithm parameters, and generates a fan d-bus interface according to the read fan in-place state and the current rotating speed information. The service returns the fan information to the testing system in real time, and the fan information is displayed on the web page, so that a tester can conveniently and directly check the on-site information and the rotating speed information of the fan, and the rotating speed of the fan can be directly regulated and controlled.

The automatic test of heat dissipation regulation and control can comprise two test items, namely a heat dissipation strategy test and an abnormal alarm strategy test.

When the heat dissipation strategy test is carried out, a tester sets a temperature range and a change frequency on a test page. And after receiving the test command, the heat radiation test service generates a temperature d-bus interface, and adjusts the heat radiation strategy module of the switch to obtain a temperature simulation actual temperature range and change frequency from the temperature d-bus interface. And the heat radiation test service sequentially modifies the temperature d-bus interface value according to the set temperature range and the change frequency to realize temperature heating and cooling simulation, and the heat radiation strategy module reads the temperature value and carries out heat radiation strategy calculation and sends the obtained fan rotating speed to the fan for speed regulation. Meanwhile, the heat radiation test system supports the modification that a fan rotating speed state is acquired for a specific temperature point. The heat radiation test service reads the information of the i2c node of the fan in real time and synchronizes the information to the d-bus interface of the fan, and then transmits the information to the test system, and the test system receives the data to generate a fan rotating speed conversion curve graph and a test report.

When an abnormal alarm strategy test is carried out, the heat radiation test service modifies the fan in-place information by modifying the i2c node data of the fan so as to simulate the fan loss and plugging situation; the temperature information loss and recovery is simulated by modifying the temperature d-bus interface. And then monitoring abnormal information record of the system log and fan rotation speed adjustment, and returning the data to the test system. The test system analyzes the returned data to judge whether the abnormal alarm strategy is normal or not and generates a test report.

And after the test is finished, the heat radiation test service restores the heat radiation strategy module to read the real sensor temperature.

By adopting the mode, the method is realized through the two modules of the test system and the heat dissipation test service, and the information interaction is carried out through the redfish. The test personnel realize test configuration through the test system and acquire test results to generate a test report, the heat dissipation test service module generates a fan d-bus interface and a temperature d-bus interface through configuration information, data simulation of the heat dissipation strategy module is realized through data interaction, whether the heat dissipation strategy module is normal or not is tested, meanwhile, the test personnel can also test whether the rotating speed control function of the fan is normal or not through directly issuing the rotating speed or the temperature of the fan, so that test automation of the heat dissipation strategy of the switch is realized, the manual configuration of the incubator for testing is avoided, and the test efficiency of the heat dissipation strategy of the switch is improved.

It should be noted that, for simplicity of description, the method embodiments are shown as a series of acts, but it should be understood by those skilled in the art that the embodiments are not limited by the order of acts, as some steps may occur in other orders or concurrently in accordance with the embodiments. Further, those skilled in the art will appreciate that the embodiments described in the specification are presently preferred embodiments, and that the acts are not necessarily required by the embodiments of the invention.

Referring to fig. 3, a block diagram of a heat dissipation testing device provided in an embodiment of the present invention is shown, which may specifically include the following modules:

an information determining module 301, configured to determine device address information for the switch device, and node information for the heat dissipation module;

the target heat dissipation module determining module 302 is configured to determine a target heat dissipation module from the heat dissipation modules according to the device address information and the node information of the heat dissipation modules;

the data bus interface construction module 303 is configured to obtain first instant running state information and on-site information of the target heat dissipation module, and construct a data bus interface for the heat dissipation module by using the on-site information and the first instant running state information;

The heat dissipation testing module 304 is configured to determine a preset test temperature range and a preset temperature variation frequency, and perform a heat dissipation test on the target heat dissipation module based on the data bus interface through the preset test temperature range and the preset temperature variation frequency.

the heat dissipation test module includes:

Optionally, the heat dissipation test module may include:

Optionally, the method may further include:

For the device embodiments, since they are substantially similar to the method embodiments, the description is relatively simple, and reference is made to the description of the method embodiments for relevant points.

In addition, the embodiment of the invention also provides electronic equipment, which comprises: the processor, the memory, store the computer program on the memory and can run on the processor, this computer program realizes each process of the above-mentioned heat dissipation test method embodiment when being carried out by the processor, and can reach the same technical result, in order to avoid repetition, will not be repeated here.

The embodiment of the invention also provides a computer readable storage medium, on which a computer program is stored, which when executed by a processor, realizes the processes of the above-mentioned embodiments of the heat dissipation test method, and can achieve the same technical effects, and for avoiding repetition, the description is omitted here. Wherein the computer readable storage medium is selected from Read-Only Memory (ROM), random access Memory (Random Access Memory, RAM), magnetic disk or optical disk.

Fig. 4 is a schematic hardware structure of an electronic device implementing various embodiments of the present invention.

The electronic device 400 includes, but is not limited to: radio frequency unit 401, network module 402, audio output unit 403, input unit 404, sensor 405, display unit 406, user input unit 407, interface unit 408, memory 409, processor 410, and power source 411. Those skilled in the art will appreciate that the electronic device structure shown in fig. 4 is not limiting of the electronic device and that the electronic device may include more or fewer components than shown, or may combine certain components, or a different arrangement of components. In the embodiment of the invention, the electronic equipment comprises, but is not limited to, a mobile phone, a tablet computer, a notebook computer, a palm computer, a vehicle-mounted terminal, a wearable device, a pedometer and the like.

It should be understood that, in the embodiment of the present invention, the radio frequency unit 401 may be used for receiving and transmitting signals during the process of receiving and transmitting information or communication, specifically, receiving downlink data from a base station and then processing the received downlink data by the processor 410; and, the uplink data is transmitted to the base station. Typically, the radio frequency unit 401 includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency unit 401 may also communicate with networks and other devices through a wireless communication system.

The electronic device provides wireless broadband internet access to the user through the network module 402, such as helping the user to send and receive e-mail, browse web pages, and access streaming media, etc.

The audio output unit 403 may convert audio data received by the radio frequency unit 401 or the network module 402 or stored in the memory 409 into an audio signal and output as sound. Also, the audio output unit 403 may also provide audio output (e.g., a call signal reception sound, a message reception sound, etc.) related to a specific function performed by the electronic device 400. The audio output unit 403 includes a speaker, a buzzer, a receiver, and the like.

The input unit 404 is used to receive an audio or video signal. The input unit 404 may include a graphics processor (Graphics Processing Unit, GPU) 4041 and a microphone 4042, the graphics processor 4041 processing image data of still pictures or video obtained by an image capturing device (e.g., a camera) in a video capturing mode or an image capturing mode. The processed image frames may be displayed on the display unit 406. The image frames processed by the graphics processor 4041 may be stored in memory 409 (or other storage medium) or transmitted via the radio frequency unit 401 or the network module 402. The microphone 4042 may receive sound and may be capable of processing such sound into audio data. The processed audio data may be converted into a format output that can be transmitted to the mobile communication base station via the radio frequency unit 401 in the case of a telephone call mode.

The electronic device 400 also includes at least one sensor 405, such as a light sensor, a motion sensor, and other sensors. Specifically, the light sensor includes an ambient light sensor that can adjust the brightness of the display panel 4061 according to the brightness of ambient light, and a proximity sensor that can turn off the display panel 4061 and/or the backlight when the electronic device 400 is moved to the ear. As one of the motion sensors, the accelerometer sensor can detect the acceleration in all directions (generally three axes), and can detect the gravity and direction when stationary, and can be used for recognizing the gesture of the electronic equipment (such as horizontal and vertical screen switching, related games, magnetometer gesture calibration), vibration recognition related functions (such as pedometer and knocking), and the like; the sensor 405 may further include a fingerprint sensor, a pressure sensor, an iris sensor, a molecular sensor, a gyroscope, a barometer, a hygrometer, a thermometer, an infrared sensor, etc., which are not described herein.

The display unit 406 is used to display information input by a user or information provided to the user. The display unit 406 may include a display panel 4061, and the display panel 4061 may be configured in the form of a liquid crystal display (Liquid Crystal Display, LCD), an Organic Light-Emitting Diode (OLED), or the like.

The user input unit 407 may be used to receive input numeric or character information and to generate key signal inputs related to user settings and function control of the electronic device. Specifically, the user input unit 407 includes a touch panel 4071 and other input devices 4072. The touch panel 4071, also referred to as a touch screen, may collect touch operations thereon or thereabout by a user (e.g., operations of the user on the touch panel 4071 or thereabout using any suitable object or accessory such as a finger, stylus, etc.). The touch panel 4071 may include two parts, a touch detection device and a touch controller. The touch detection device detects the touch azimuth of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts it into touch point coordinates, and sends the touch point coordinates to the processor 410, and receives and executes commands sent from the processor 410. In addition, the touch panel 4071 may be implemented in various types such as resistive, capacitive, infrared, and surface acoustic wave. The user input unit 407 may include other input devices 4072 in addition to the touch panel 4071. In particular, other input devices 4072 may include, but are not limited to, a physical keyboard, function keys (e.g., volume control keys, switch keys, etc.), a trackball, a mouse, and a joystick, which are not described in detail herein.

Further, the touch panel 4071 may be overlaid on the display panel 4061, and when the touch panel 4071 detects a touch operation thereon or thereabout, the touch operation is transferred to the processor 410 to determine the type of touch event, and then the processor 410 provides a corresponding visual output on the display panel 4061 according to the type of touch event. Although in fig. 4, the touch panel 4071 and the display panel 4061 are two independent components for implementing the input and output functions of the electronic device, in some embodiments, the touch panel 4071 may be integrated with the display panel 4061 to implement the input and output functions of the electronic device, which is not limited herein.

The interface unit 408 is an interface to which an external device is connected to the electronic apparatus 400. For example, the external devices may include a wired or wireless headset port, an external power (or battery charger) port, a wired or wireless data port, a memory card port, a port for connecting a device having an identification module, an audio input/output (I/O) port, a video I/O port, an earphone port, and the like. The interface unit 408 may be used to receive input (e.g., data information, power, etc.) from an external device and transmit the received input to one or more elements within the electronic apparatus 400 or may be used to transmit data between the electronic apparatus 400 and an external device.

Memory 409 may be used to store software programs as well as various data. The memory 409 may mainly include a storage program area that may store an operating system, application programs required for at least one function (such as a sound playing function, an image playing function, etc.), and a storage data area; the storage data area may store data (such as audio data, phonebook, etc.) created according to the use of the handset, etc. In addition, memory 409 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid-state storage device.

The processor 410 is a control center of the electronic device, connects various parts of the entire electronic device using various interfaces and lines, and performs various functions of the electronic device and processes data by running or executing software programs and/or modules stored in the memory 409 and invoking data stored in the memory 409, thereby performing overall monitoring of the electronic device. Processor 410 may include one or more processing units; preferably, the processor 410 may integrate an application processor that primarily handles operating systems, user interfaces, applications, etc., with a modem processor that primarily handles wireless communications. It will be appreciated that the modem processor described above may not be integrated into the processor 410.

The electronic device 400 may also include a power supply 411 (e.g., a battery) for powering the various components, and preferably the power supply 411 may be logically connected to the processor 410 via a power management system that performs functions such as managing charging, discharging, and power consumption.

In addition, the electronic device 400 includes some functional modules, which are not shown, and are not described herein.

It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

From the above description of the embodiments, it will be clear to those skilled in the art that the above-described embodiment method may be implemented by means of software plus a necessary general hardware platform, but of course may also be implemented by means of hardware, but in many cases the former is a preferred embodiment. Based on such understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art in the form of a software product stored in a storage medium (e.g. ROM/RAM, magnetic disk, optical disk) comprising instructions for causing a terminal (which may be a mobile phone, a computer, a server, an air conditioner, or a network device, etc.) to perform the method according to the embodiments of the present invention.

In yet another embodiment of the present invention, as shown in fig. 5, a computer readable storage medium 501 is provided, which stores instructions that, when executed on a computer, cause the computer to perform the heat dissipation test method described in the above embodiment.

The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present invention.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, and are not repeated herein.

In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments of the present invention may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention may be embodied essentially or in a part contributing to the prior art or in a part of the technical solution, in the form of a software product stored in a storage medium, comprising several instructions for causing a computer device (which may be a personal computer, a server, a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present invention. And the aforementioned storage medium includes: a usb disk, a removable hard disk, a ROM, a RAM, a magnetic disk, or an optical disk, etc.

The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present invention. Therefore, the protection scope of the invention is subject to the protection scope of the claims.

Claims

1. A heat dissipation testing method, wherein the method is applied to a heat dissipation testing system for a switch device, the switch device including a heat dissipation module, comprising:

2. The method of claim 1, wherein the heat dissipation testing system is configured with a web user interface, and wherein the determining device address information for the switch device and node information for the heat dissipation module comprises:

3. The method according to claim 1 or 2, wherein the heat dissipation testing system has a corresponding test server device, the heat dissipation testing system is loaded on a server, the server is configured with a corresponding baseboard management controller, the heat dissipation testing system performs data interaction with the test server device through the baseboard management controller, the steps of obtaining first instant operation state information and on-site information of the target heat dissipation module, and constructing a data bus interface for the heat dissipation module by using the on-site information and the first instant operation state information include:

4. The method of claim 3, wherein the step of determining a predetermined test temperature range and a predetermined temperature variation frequency, and performing a heat dissipation test on the target heat dissipation module based on the data bus interface through the predetermined test temperature range and the predetermined temperature variation frequency comprises:

5. The method as recited in claim 4, further comprising:

6. The method as recited in claim 4, further comprising:

7. The method as recited in claim 6, further comprising:

8. A heat dissipation testing apparatus, the apparatus being applied to a heat dissipation testing system for a switch device, the switch device including a heat dissipation module, comprising:

9. An electronic device comprising a processor, a communication interface, a memory and a communication bus, wherein the processor, the communication interface and the memory communicate with each other via the communication bus;

the memory is used for storing a computer program;

The processor is configured to implement the method according to any one of claims 1-7 when executing a program stored on a memory.

10. A computer-readable storage medium having instructions stored thereon, which when executed by one or more processors, cause the processors to perform the method of any of claims 1-7.