CN116609894A - Interconnection supporting interconnector device, platform device and method - Google Patents

Interconnection supporting interconnector device, platform device and method Download PDF

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Publication number
CN116609894A
CN116609894A CN202310447606.9A CN202310447606A CN116609894A CN 116609894 A CN116609894 A CN 116609894A CN 202310447606 A CN202310447606 A CN 202310447606A CN 116609894 A CN116609894 A CN 116609894A
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CN
China
Prior art keywords
package
pad
bond
bond pad
pcb
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CN202310447606.9A
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Chinese (zh)
Inventor
徐新宇
李希俊
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Zhongheyi Technology Shenyang Co ltd
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Zhongheyi Technology Shenyang Co ltd
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Priority to CN202310447606.9A priority Critical patent/CN116609894A/en
Publication of CN116609894A publication Critical patent/CN116609894A/en
Pending legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4278—Electrical aspects related to pluggable or demountable opto-electronic or electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

The invention relates to an interconnection supporting interconnector device, a platform device and a method, which relate to an interface platform supporting interconnection of electric ports of two OSFP-XD modules, a connection method and a connection technical idea establishment, and belong to the technical fields of telecommunication and data communication: the two electric connector PCB packages of the OSFP-XD optical module are respectively placed on the front side and the back side of a PCB board to be aligned with each other in a special mode, the bonding pads of the two electric connector packages placed on the front side and the back side of the PCB are connected with the through holes through PCB metal wires, the two OSFP-XD optical module electric connectors are respectively welded on the two electric connector PCB packages, when the two OSFP-XD optical modules are respectively inserted into the two electric connectors, the two high-speed electric signals of the two modules are directly connected in the shortest mode, and any one of the two OSFP-XD modules can be designed as a testing instrument of the OSFP-XD module for directly testing the other OSFP-XD module.

Description

Interconnection supporting interconnector device, platform device and method
Technical Field
The present invention relates to product development, test tools and instruments, and industrial production test equipment in the fields of telecommunications and data communications, and more particularly to an interconnect-supporting interconnect device, platform device, and method.
Background
OSFP-XD optical modules will be widely used for information exchange of spans in the fields of data centers, data storage and super computing. The optical-electrical transceiver is a modular optical transceiver which can support the highest number density and the highest speed of high-speed telecommunication channels, has a system end interface which can support the maximum 16-channel electric receiving and transmitting, and the single-channel signal speed can support 224Gbps or higher. Such high signal channel densities and signal rates also present unprecedented challenges to test equipment for modules. The method of adding a test board to a high-speed signal cable of a tester in the traditional test method has the defects that the requirement of maintaining the integrity of the high-speed signal is met due to some constraints such as signal loss of an RF cable, larger approach space required by an RF cable PCB connector, forced lengthening of RF wires from the RF cable connector on the PCB to a module electric connector and the like. Nevertheless, there is a method that can support direct electrical connection between modules, but has the potential to break through this bottleneck, because this method will create a basic platform that helps to achieve the shortest interconnection between the high-speed signals of the two modules. Based on this interface platform, many new applications will be developed successfully, and the design level and product application space of some existing products will be improved by adopting this platform. It will be shown how this basic interface platform enables all high-speed electrical signals between two OSFP-XD optical modules to be directly connected in a manner that minimizes the channels and is entirely structurally identical.
Disclosure of Invention
Based on the technical problems, the invention provides a basic platform supporting the interconnection of the electric ports of two OSFP-XD (see 'OSFP-XD_specification_Rev1.0') optical modules, and the platform realizes the direct connection of all high-speed electric signals of the two OSFP-XD optical modules in a mode that the channels are shortest and the structures and the lengths of all the channels are completely consistent.
It was first proposed to connect the package pads of OSFP-XD electrical connectors placed on the upper and lower sides of a PCB in a type I and type II manner, respectively. I.e. connected in a type I manner: pads of a PCB package A of an OSFP-XD electrical connector A are placed on the front surface of a PCB board, and pads of a PCB package B of an OSFP-XD electrical connector B are placed on the bottom surface of the PCB board. As shown in table 3, the specific connection relationship is: pad 2 of package A to pad 29 of package B, pad 3 of package A to pad 28 of package B, pad 5 of package A to pad 26 of package B, pad 6 of package A to pad 25 of package B, pad 8 of package A to pad 23 of package B, pad 9 of package A to pad 22 of package B, pad 11 of package A to pad 20 of package B, pad 12 of package A to pad 19 of package A, pad 19 of package A to pad 12 of package B, pad 20 of package A to pad 11 of package B, pad 22 of package A to pad 9 of package B, pad 23 of package A to pad 8 of package B, pad 25 of package A to pad 6 of package A to pad 5 of package B, pad 28 of package A to pad 3 of package B, pad 29 of package A to pad 2 of package B, pad 32 of package A to pad 59 of package B pad 33 of package A to pad 58 of package B, pad 35 of package A to pad 56 of package B, pad 36 of package A to pad 55 of package B, pad 38 of package A to pad 53 of package B, pad 39 of package A to pad 52 of package B, pad 41 of package A to pad 50 of package B, pad 42 of package A to pad 49 of package B, pad 49 of package A to pad 42 of package A to pad 50 of package B, pad 52 of package A to pad 39 of package B, pad 53 of package A to pad 38 of package B, pad 55 of package A to pad 36 of package B, pad 56 of package A to pad 35 of package B, pad 58 of package A to pad 33 of package B, pad 59 of package A to pad 32 of package B, pad 62 of package A to pad 89 of package B, pad 63 of package A to pad 88 of package B, pad 65 of package A to pad 86 of package B, pad 66 of package A to pad 85 of package B, pad 68 of package A to pad 83 of package B, pad 69 of package A to pad 82 of package B, pad 71 of package A to pad 80 of package B, pad 79 of package A to pad 79 of package B, pad 80 of package A to pad 71 of package B, pad 82 of package A to pad 69 of package B, pad 83 of package A to pad 68 of package A to pad 66 of package B, pad 86 of package A to pad 65 of package B, pad 88 of package A to pad 63 of package B, pad 89 of package A to pad 62 of package B, pad 92 of package A to pad 119 of package B package a bond pad 93 to package B bond pad 118, package a bond pad 95 to package B bond pad 116, package a bond pad 96 to package B bond pad 115, package a bond pad 98 to package B bond pad 113, package a bond pad 99 to package B bond pad 112, package a bond pad 101 to package B bond pad 110, package a bond pad 102 to package B bond pad 109, package a bond pad 109 to package B bond pad 102, package a bond pad 110 to package B bond pad 101, package a bond pad 112 to package B bond pad 99, package a bond pad 113 to package B bond pad 98, package a bond pad 115 to package B bond pad 96, package a bond pad 116 to package B bond pad 95, package a bond pad 118 to package B bond pad 93, package a bond pad 119 to package B bond pad 92.
When connected in a type II manner: pads of a PCB package A of an OSFP-XD electrical connector A are placed on the front surface of a PCB board, and pads of a PCB package B of an OSFP-XD electrical connector B are placed on the bottom surface of the PCB board. As shown in table 4, the specific connection relationship is: package a with bond pad 2 to package B with bond pad 28, package a with bond pad 3 to package B with bond pad 29, package a with bond pad 5 to package B with bond pad 25, package a with bond pad 6 to package B with bond pad 26, package a with bond pad 8 to package B with bond pad 22, package a with bond pad 9 to package B with bond pad 23, package a with bond pad 11 to package B with bond pad 19, package a with bond pad 12 to package B with bond pad 20, package a with bond pad 19 to package B with bond pad 11, package a with bond pad 20 to package B with bond pad 12, package a with bond pad 22 to package B with bond pad 8, package a with bond pad 23 to package B with bond pad 9, package a with bond pad 25 to package B with bond pad 5, package a with bond pad 26 to package B with bond pad 6, package a with bond pad 28 to package B with bond pad 2, package a with bond pad 29 to package B with bond pad 3, package a bond pad 32 to package B bond pad 58, package a bond pad 33 to package B bond pad 59, package a bond pad 35 to package B bond pad 55, package a bond pad 36 to package B bond pad 56, package a bond pad 38 to package B bond pad 52, package a bond pad 39 to package B bond pad 53, package a bond pad 41 to package B bond pad 49, package a bond pad 42 to package B bond pad 50, package a bond pad 49 to package B bond pad 41, package a bond pad 50 to package B bond pad 42, package a bond pad 52 to package B bond pad 38, package a bond pad 53 to package B bond pad 39, package a bond pad 55 to package B bond pad 35, package a bond pad 56 to package B bond pad 36, package a bond pad 58 to package B bond pad 32, package a bond pad 59 to package B bond pad 33; package a bond pad 62 to package B bond pad 88, package a bond pad 63 to package B bond pad 89, package a bond pad 65 to package B bond pad 85, package a bond pad 66 to package B bond pad 86, package a bond pad 68 to package B bond pad 82, package a bond pad 69 to package B bond pad 83, package a bond pad 71 to package B bond pad 79, package a bond pad 72 to package B bond pad 80, package a bond pad 79 to package B bond pad 71, package a bond pad 80 to package B bond pad 72, package a bond pad 82 to package B bond pad 68, package a bond pad 83 to package B bond pad 69, package a bond pad 85 to package B bond pad 65, package a bond pad 86 to package B bond pad 66, package a bond pad 88 to package B bond pad 62, package a bond pad 89 to package B bond pad 63, package a bond pad 92 to package B bond pad 118, package a bond pad 93 to package B bond pad 119, package a bond pad 95 to package B bond pad 115, package a bond pad 96 to package B bond pad 116, package a bond pad 98 to package B bond pad 112, package a bond pad 99 to package B bond pad 113, package a bond pad 101 to package B bond pad 109, package a bond pad 102 to package B bond pad 110, package a bond pad 109 to package B bond pad 101, package a bond pad 110 to package B bond pad 102, package a bond pad 112 to package B bond pad 98, package a bond pad 113 to package B bond pad 99, package a bond pad 115 to package B bond pad 95, package a bond pad 116 to package B bond pad 96, package a bond pad 118 to package B bond pad 92, package a bond pad 119 to package B bond pad 93.
Each of the above type I or type II pad-to-pad connections may be implemented by at least one metallized via in addition to an adjustable length PCB metal trace, and the adjustable length PCB metal trace implementing the respective pad-to-pad connection may be entirely uniform symmetrical or non-symmetrical, as desired. Here, the electrical connector a is soldered or adhered by conductive paste to the above-mentioned PCB package a, and the electrical connector B is soldered or adhered by conductive paste to the above-mentioned PCB package B. On the basis of the interface device established above, a first OSFP-XD optical module I is inserted into the electrical connector A, and a second OSFP-XD optical module II is inserted into the electrical connector B; in this way, the high-speed electric signals in the first OSFP-XD optical module I and the second OSFP-XD optical module II are directly connected by the golden fingers of the two modules, the electric connectors of the two modules, the PCB packages of the two modules, the PCB metal wires and the through holes; the technical platform is realized, namely when one of the first OSFP-XD optical module I or the second OSFP-XD optical module II is a signal quality analyzer or a network signal flow analyzer, the technical aim of providing an electric signal for the other optical module or testing the signal performance and the working performance of the other optical module is realized by the technical ideas.
Drawings
Fig. 1 is a pad of a PCB package a of an OSFP-XD electrical connector a placed on the front surface of a PCB, as seen perpendicularly from the front surface of the PCB.
Fig. 2 is a front vertical perspective view of a PCB, showing pads of a PCB package B of an OSFP-XD electrical connector B placed on the bottom surface of the PCB.
Fig. 3 shows packages a and B of OSFP-XD electrical connectors a and B, respectively, placed on the front and back sides of a PCB. When the PCB board is seen vertically from the front of the PCB, the pads of package a and the pads of package B overlap completely.
Fig. 4 shows bonding pads of OSFP-XD electrical connector packages a and B placed on the front and back sides of a PCB connected in a type I manner by PCB metal traces and vias.
Fig. 5 shows bonding pads of OSFP-XD electrical connector packages a and B placed on the front and back sides of a PCB connected in a type II manner by PCB metal traces and vias.
Fig. 6 is a three-dimensional schematic diagram of a PCB package a of an OSFP-XD electrical connector a placed on the front side of the PCB.
Fig. 7 is a three-dimensional schematic diagram of a package a and a package B of a PCB board and OSFP-XD electrical connectors placed on the front and back sides of the PCB, respectively.
Fig. 8 is a three-dimensional schematic diagram of an OSFP-XD electrical connector a and an OSFP-XD electrical connector B mounted (soldered or bonded) on a specially placed package a and package B, respectively.
Fig. 9 is a three-dimensional schematic diagram of an OSFP-XD optical module I and an OSFP-XD optical module II inserted into a corresponding electrical connector a and electrical connector B, respectively.
Fig. 10 shows that the high-speed signal of the OSFP-XD optical module I and the high-speed signal of the OSFP-XD optical module II are electrically connected to the metal wire of the PCB board and the PCB via the golden finger, the electrical connector, the package pad, and the minimum.
Table 1 is a pad definition for all high speed signals and ground signals of PCB package A of OSFP-XD electrical connector A.
Table 2 is a pad definition for all high speed signals and ground signals of PCB package B of OSFP-XD electrical connector B.
Table 3 shows the connection relationship between all high-speed signals and ground signals in the pads of the PCB package A of OSFP-XD electrical connector A and all high-speed signals and ground signals in the pads of the PCB package B of OSFP-XD electrical connector B when connection type I is used.
Wherein the numbers in the reverse diagonal line ("\" is called reverse diagonal line "/" is called forward diagonal line ") are from the pads of the PCB package A of the OSFP-XD electrical connector A and the numbers in the forward diagonal line are from the pads of the PCB package B of the OSFP-XD electrical connector B. The numbers in the horizontal lines come from the pads of the PCB package A of OSFP-XD electrical connector A and the numbers in the vertical lines come from the pads of the PCB package B of OSFP-XD electrical connector B.
Table 4 shows the connection relationship between all high-speed signals and ground signals in the pads of the PCB package A of OSFP-XD electrical connector A and all high-speed signals and ground signals in the pads of the PCB package B of OSFP-XD electrical connector B when connection type II is used.
Wherein the numbers in the reverse diagonal line are from the pads of the PCB package A of the OSFP-XD electrical connector A and the numbers in the forward diagonal line are from the pads of the PCB package B of the OSFP-XD electrical connector B. The numbers in the horizontal lines come from the pads of the PCB package A of OSFP-XD electrical connector A and the numbers in the vertical lines come from the pads of the PCB package B of OSFP-XD electrical connector B.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
In the description of the present invention, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; may be an electrical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
As shown in fig. 1 to 10, the PCB packages a and B of the two electrical connectors a and B of the OSFP-XD optical module are to be placed on the front and back sides of the same PCB board, respectively, as shown in fig. 6 and fig. 7, and are aligned with each other in a special manner. That is, when the PCB board is seen vertically from the front side of the PCB, the pads of package a and the pads of package B are completely overlapped as shown in fig. 3.
The connection relationship between the high-speed electrical signals of the OSFP-XD optical module electrical connectors a and B is defined as shown in the accompanying table 3 or 4. The pads of the high-speed electric signals to be connected with each other on different surfaces of the same PCB board are connected by metal wiring of the PCB board and at least one PCB via hole, as shown in figure 4 or figure 5. The length of the metal wiring of the PCB can be adjusted to be longer and shorter as required; the type of the PCB board through holes can be selected as required, and the through holes are overlapped or staggered; the number of the PCB through holes can be increased or decreased as required.
OSFP-XD electrical connector A and OSFP electrical connector B are soldered or bonded to specially placed packages A and B, respectively, as shown in FIG. 8.
The OSFP-XD optical module I and OSFP-XD optical module I I are inserted into the module electrical connectors A and B, respectively, as shown in FIG. 9.
The high-speed electrical signal of the OSFP-XD optical module I is shown in the accompanying table 1 and the high-speed electrical signal of the OSFP-XD optical module I I is shown in the accompanying table 2, and the electrical connector a, the package a, the PCB metal trace (coplanar with the electrical connector a), the PCB via, the PCB metal trace (coplanar with the electrical connector B) and the gold finger of the module I I are respectively connected together as shown in fig. 10 according to the correspondence defined in the accompanying table 3 or the accompanying table 4.
The above method achieves the shortest connection of the high-speed electric signal paths between the OSFP-XD optical module I and the OSFP-XD optical module I I, and simultaneously maintains the complete consistency of the structures and the lengths of the high-speed signal connection paths of each group.
The scheme occupies the minimum space, and needs no other original chip devices or original devices for high-speed signal transmission and coaxial cables supporting high-frequency signals, so that the high-speed electric signal connection and the optimal transmission quality are ensured.
In special cases, the length of the PCB metal wire connecting the pads of the electric connector A and the B can be adjusted to be longer, so as to increase the line loss of high-speed signals, and the PCB metal wire is applied to pressure test of signal transmission.
In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any person skilled in the art will readily recognize that changes and substitutions are within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (7)

1. An interconnect-supporting interconnect device, comprising: the PCB package A of the first OSFP-XD electrical connector A and the PCB package B of the second OSFP-XD electrical connector B are connected through the PCB, i.e. the high-speed signal pads of the PCB package A of the connector A are connected to the high-speed signal pads of the PCB package B of the connector B, when the connection relationship is of type I: pad 2 of package A to pad 29 of package B, pad 3 of package A to pad 28 of package B, pad 5 of package A to pad 26 of package B, pad 6 of package A to pad 25 of package B, pad 8 of package A to pad 23 of package B, pad 9 of package A to pad 22 of package B, pad 11 of package A to pad 20 of package B, pad 12 of package A to pad 19 of package A, pad 19 of package A to pad 12 of package B, pad 20 of package A to pad 11 of package B, pad 22 of package A to pad 9 of package B, pad 23 of package A to pad 8 of package B, pad 25 of package A to pad 6 of package A to pad 5 of package B, pad 28 of package A to pad 3 of package B, pad 29 of package A to pad 2 of package B, pad 32 of package A to pad 59 of package B pad 33 of package A to pad 58 of package B, pad 35 of package A to pad 56 of package B, pad 36 of package A to pad 55 of package B, pad 38 of package A to pad 53 of package B, pad 39 of package A to pad 52 of package B, pad 41 of package A to pad 50 of package B, pad 42 of package A to pad 49 of package B, pad 49 of package A to pad 42 of package A to pad 50 of package B, pad 52 of package A to pad 39 of package B, pad 53 of package A to pad 38 of package B, pad 55 of package A to pad 36 of package B, pad 56 of package A to pad 35 of package B, pad 58 of package A to pad 33 of package B, pad 59 of package A to pad 32 of package B, pad 62 of package A to pad 89 of package B, pad 63 of package A to pad 88 of package B, pad 65 of package A to pad 86 of package B, pad 66 of package A to pad 85 of package B, pad 68 of package A to pad 83 of package B, pad 69 of package A to pad 82 of package B, pad 71 of package A to pad 80 of package B, pad 79 of package A to pad 79 of package B, pad 80 of package A to pad 71 of package B, pad 82 of package A to pad 69 of package B, pad 83 of package A to pad 68 of package A to pad 66 of package B, pad 86 of package A to pad 65 of package B, pad 88 of package A to pad 63 of package B, pad 89 of package A to pad 62 of package B, pad 92 of package A to pad 119 of package B pad 93 of package a to pad 118 of package B, pad 95 of package a to pad 116 of package B, pad 96 of package a to pad 115 of package B, pad 98 of package a to pad 113 of package B, pad 99 of package a to pad 112 of package B, pad 101 of package a to pad 110 of package B, pad 102 of package a to pad 109 of package B, pad 109 of package a to pad 102 of package B, pad 110 of package a to pad 101 of package B, pad 112 of package a to pad 99 of package B, pad 113 of package a to pad 98 of package B, pad 115 of package a to pad 96 of package B, pad 116 of package a to pad 95 of package B, pad 118 of package a to pad 93 of package B, pad 119 of package a to pad 92 of package B; when the connection relationship is type II: package a with bond pad 2 to package B with bond pad 28, package a with bond pad 3 to package B with bond pad 29, package a with bond pad 5 to package B with bond pad 25, package a with bond pad 6 to package B with bond pad 26, package a with bond pad 8 to package B with bond pad 22, package a with bond pad 9 to package B with bond pad 23, package a with bond pad 11 to package B with bond pad 19, package a with bond pad 12 to package B with bond pad 20, package a with bond pad 19 to package B with bond pad 11, package a with bond pad 20 to package B with bond pad 12, package a with bond pad 22 to package B with bond pad 8, package a with bond pad 23 to package B with bond pad 9, package a with bond pad 25 to package B with bond pad 5, package a with bond pad 26 to package B with bond pad 6, package a with bond pad 28 to package B with bond pad 2, package a with bond pad 29 to package B with bond pad 3, package a bond pad 32 to package B bond pad 58, package a bond pad 33 to package B bond pad 59, package a bond pad 35 to package B bond pad 55, package a bond pad 36 to package B bond pad 56, package a bond pad 38 to package B bond pad 52, package a bond pad 39 to package B bond pad 53, package a bond pad 41 to package B bond pad 49, package a bond pad 42 to package B bond pad 50, package a bond pad 49 to package B bond pad 41, package a bond pad 50 to package B bond pad 42, package a bond pad 52 to package B bond pad 38, package a bond pad 53 to package B bond pad 39, package a bond pad 55 to package B bond pad 35, package a bond pad 56 to package B bond pad 36, package a bond pad 58 to package B bond pad 32, package a bond pad 59 to package B bond pad 33; package a bond pad 62 to package B bond pad 88, package a bond pad 63 to package B bond pad 89, package a bond pad 65 to package B bond pad 85, package a bond pad 66 to package B bond pad 86, package a bond pad 68 to package B bond pad 82, package a bond pad 69 to package B bond pad 83, package a bond pad 71 to package B bond pad 79, package a bond pad 72 to package B bond pad 80, package a bond pad 79 to package B bond pad 71, package a bond pad 80 to package B bond pad 72, package a bond pad 82 to package B bond pad 68, package a bond pad 83 to package B bond pad 69, package a bond pad 85 to package B bond pad 65, package a bond pad 86 to package B bond pad 66, package a bond pad 88 to package B bond pad 62, package a bond pad 89 to package B bond pad 63, pad 92 of package a to pad 118 of package B, pad 93 of package a to pad 119 of package B, pad 95 of package a to pad 115 of package B, pad 96 of package a to pad 116 of package B, pad 98 of package a to pad 112 of package B, pad 99 of package a to pad 113 of package B, pad 101 of package a to pad 109 of package B, pad 102 of package a to pad 110 of package B, pad 109 of package a to pad 101 of package B, pad 110 of package a to pad 102 of package B, pad 112 of package a to pad 98 of package B, pad 113 of package a to pad 99 of package B, pad 115 of package a to pad 95 of package B, pad 116 of package a to pad 96 of package B, pad 118 of package a to pad 92 of package B, pad 119 of package a to pad 93 of package B; each pad-to-pad connection in either type I or type II above may be made by adding at least one metallized via outside of the length-adjustable PCB metal trace; or the metal wiring of the PCB with adjustable length is externally added with at least two metallized PCB opposite stacked holes; or by PCB metal wires with adjustable length and at least two metallized PCB staggered stacked holes; or by adding capacitance or resistance to the PCB metal wire with adjustable length; or by adding capacitance and resistance to the PCB metal wire with adjustable length; or by adding capacitance or resistance and metallized via holes to the PCB metal wire with adjustable length; or by PCB metal wiring with adjustable length and added capacitor, resistor and metallized via hole; the above adjustable length PCB metal traces that enable pad-to-pad each connection are further defined as follows: the sum of the lengths of all the line segments of each length-adjustable PCB metal line is between 0 mm and 500 mm, and the sum of the lengths of all the line segments is 0 mm; in addition, the above adjustable length PCB metal traces that enable individual pad-to-pad connections may be symmetrical with full uniformity or asymmetrical with variability as desired.
2. An interconnect-supporting interconnect device according to claim 1, wherein the interconnect-supporting interconnect device of claim 1 is modified as follows: the bonding pads may be added, the bonding pads may be reduced, the bonding pad size may be changed, the angle between bonding pads may be trimmed or the bonding pad position may be offset to the PCB package a of the OSFP-XD electrical connector a and the PCB package B of the OSFP-XD electrical connector B, or one of the PCB package a of the OSFP-XD electrical connector a and the PCB package B of the OSFP-XD electrical connector B, without departing from the spirit of the connection relation in claim 1.
3. An interconnect device in accordance with claim 1 wherein the pad-to-pad electrical connection in claim 1 is also scalable defined as any differential-to-differential-pair connection of the high-speed signal pads of the PCB package a of the OSFP-XD electrical connector a to the high-speed signal pads of the PCB package B of the OSFP-XD electrical connector B.
4. A platform apparatus comprising: an interconnect-supporting interconnect device of claim 1; the OSFP-XD electrical connector a of claim 1 being soldered or glued by conductive glue to its PCB package a, the OSFP-XD electrical connector B of claim 1 being soldered or glued by conductive glue to its PCB package B; the first OSFP-XD optical module I is inserted into the OSFP-XD electrical connector a in claim 1, and the second OSFP-XD optical module II is inserted into the OSFP-XD electrical connector B in claim 1.
5. The platform device according to claim 4 provides a method, characterized in that the high-speed electric signals in the OSFP-XD optical module I according to claim 4 and the high-speed electric signals in the OSFP-XD optical module II according to claim 4 are directly connected by the metal traces and vias of the OSFP-XD electric connector a and its PCB package A, OSFP-XD electric connector B and its PCB package B, PCB without any integrated circuit chip and without any supporting high-frequency signal coaxial cable, and the connection form of the individual channels can be made completely uniform, non-completely uniform or completely non-uniform.
6. A platform device according to claim 4, characterized in that one of the OSFP-XD optical module I in claim 4 and the OSFP-XD optical module II in claim 4 can be a 16-way transmit/receive signal quality analyzer, a network signal flow analyzer or any test instrument and production test equipment designed for measuring the electrical, optical and opto-electronic properties of the OSFP-XD optical module.
7. The 16-way transmit/receive signal quality analyzer, network signal flow analyzer or any test equipment and production test equipment designed for measuring the electrical, optical and electro-optical properties of OSFP-XD optical module as claimed in claim 6, wherein their external shape, size and fixing means are not limited by "OSFP-xd_specification_rev1.0" and its subsequent modified version.
CN202310447606.9A 2023-04-24 2023-04-24 Interconnection supporting interconnector device, platform device and method Pending CN116609894A (en)

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CN202310447606.9A CN116609894A (en) 2023-04-24 2023-04-24 Interconnection supporting interconnector device, platform device and method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202310447606.9A CN116609894A (en) 2023-04-24 2023-04-24 Interconnection supporting interconnector device, platform device and method

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