CN116593847A - Annular fixing jig for semiconductor chip test - Google Patents
Annular fixing jig for semiconductor chip test Download PDFInfo
- Publication number
- CN116593847A CN116593847A CN202310310846.4A CN202310310846A CN116593847A CN 116593847 A CN116593847 A CN 116593847A CN 202310310846 A CN202310310846 A CN 202310310846A CN 116593847 A CN116593847 A CN 116593847A
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- fixedly connected
- carrier plate
- adjusting
- rotating
- plate
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- 238000012360 testing method Methods 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 230000001360 synchronised effect Effects 0.000 claims abstract description 12
- 230000000712 assembly Effects 0.000 claims description 23
- 238000000429 assembly Methods 0.000 claims description 23
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 230000009471 action Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses an annular fixing jig for testing a semiconductor chip, which relates to the technical field of testing jigs and comprises a base, wherein a fixing ring is fixedly connected to the base, an annular groove is formed in the outer wall of the fixing ring, a rotating ring is rotationally connected to the annular groove, the rotating ring is fixedly connected to the inner wall of a carrier plate, a rotating mechanism connected with the bottom of the carrier plate is arranged on the base, and a multi-station synchronous clamping mechanism is fixedly arranged at the bottom of the carrier plate.
Description
Technical Field
The invention relates to the technical field of test jigs, in particular to an annular fixing jig for testing a semiconductor chip.
Background
The purpose of chip testing is to find out a chip without problems and save the cost as much as possible, the complexity of the chip is higher and higher, in order to ensure that the quality of the chip leaving the factory does not have any problems, the chip needs to be tested before leaving the factory to ensure the functional integrity and the like, and the chip is used as a mass production object, and the mass automatic testing is a solution, and the manual or reference testing is not capable of completing the task, so that the testing work needs to be completed by using other detection equipment.
At present, when putting into check out test set with the chip and testing, need fix the chip onto the tool earlier, but current fixed tool fixed quantity is limited, is difficult to be applicable to big chip test work in batches, and the size of chip self also has the difference, and the fixed size of its fixed tool is single, when facing the chip of different sizes, need change the fixed tool of other models, both increased the cost, need make a round trip the dismouting again and change different tools, influence test efficiency, also for this reason, we propose a semiconductor chip test with cyclic annular fixed tool.
Disclosure of Invention
The present invention is directed to an annular fixture for testing semiconductor chips, which solves the above-mentioned problems.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a semiconductor chip test is with cyclic annular fixed tool, includes the base, the rigid coupling has the solid fixed ring on the base, has seted up the ring channel on the outer wall of solid fixed ring, and the ring channel swivelling joint has the swivel becket, and the swivel becket rigid coupling is on the inner wall of carrier plate, installs the rotary mechanism who is connected with the carrier plate bottom on the base, and the bottom of carrier plate has set firmly the synchronous fixture of multistation.
Preferably, mounting holes are formed in four corners of the bottom of the base.
Preferably, the rotating mechanism comprises a first motor arranged on the base, a worm is fixedly connected to an output shaft of the first motor, the worm is meshed with a lower toothed ring, and the lower toothed ring is fixedly connected to the outer wall of the bottom of the carrier plate.
Preferably, the multi-station synchronous clamping mechanism comprises a rotating assembly, a plurality of adjusting assemblies, a plurality of clamping assemblies and a plurality of fixing plates, wherein the rotating assembly is meshed with the adjusting assemblies, the adjusting assemblies and the clamping assemblies are all rotationally connected to the fixing plates, the fixing plates are fixedly connected to the outer walls of the bottoms of the carrier plates, and the adjusting assemblies are connected with the clamping assemblies.
Preferably, the rotating assembly comprises a second motor arranged at the bottom of the carrier plate, a first gear is fixedly connected to an output shaft of the second motor, the first gear is meshed with an upper toothed ring, and the upper toothed ring is rotatably connected to the outer wall of the bottom of the carrier plate.
Preferably, the adjusting component comprises a rotating shaft which is rotationally connected to the fixed plate, a second gear meshed with the upper toothed ring is fixedly connected to the outer wall of the rotating shaft, a rotating block is fixedly connected to the rotating shaft, an adjusting hole is formed in the inner side of the rotating block, an adjusting screw is rotationally connected to the adjusting hole, an adjusting block which is slidably arranged in the adjusting hole is spirally connected to the outer wall of the adjusting screw, and a sliding block is fixedly connected to the adjusting block.
Preferably, the clamping assembly comprises a rotating shaft rotationally connected to the fixed plate, a gear III is fixedly connected to the outer wall of the rotating shaft and meshed with a toothed plate, the toothed plate is sleeved in a fixed sleeve, the fixed sleeve is fixedly connected to the bottom of the carrier plate, the toothed plate is L-shaped, one end of the toothed plate is provided with a sliding hole, a sliding block is slidably arranged in the sliding hole, a turntable is fixedly connected to the rotating shaft, the edge of the surface of the turntable is hinged to the bottom of the four connecting blocks through four connecting rods, clamping plates are fixedly connected to the four connecting blocks, the connecting blocks are slidably arranged in through holes formed in the carrier plate, and the clamping plates are slidably arranged in clamping plate grooves formed in the carrier plate.
Preferably, a positioning groove for placing the chip is formed in the middle position of the four clamping plate grooves on the carrier plate.
Compared with the prior art, the invention has the beneficial effects that:
1. the whole design is annular, so that more chips can be accommodated, the fixed number of the chips is increased, and the chip testing device is applicable to large-batch chip testing work;
2. through the arrangement of the rotating mechanism, each chip on the carrier plate can rotate in turn to replace the test position, and test work can be carried out on each chip step by step;
3. through the setting of the synchronous fixture of multistation, can enough fix the chip of equidimension, possess synchronous fixed effect again, improved detection efficiency greatly, the chip of equidimension is all applicable, reduces the cost of change, and fixes it from the chip four sides, has both ensured that the central point position after the chip is fixed is accurate, does not influence the test of chip again.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the overall bottom of the present invention;
FIG. 3 is a schematic view of the bottom of the carrier plate according to the present invention;
FIG. 4 is a schematic structural view of a multi-station synchronous clamping mechanism according to the present invention;
FIG. 5 is a schematic view of the structure of the surface of the carrier plate according to the present invention;
FIG. 6 is a schematic view of the structure of the components on the base of the present invention;
FIG. 7 is a schematic view of the structure of the adjusting assembly of the present invention;
fig. 8 is a schematic view of a clamping assembly according to the present invention.
In the figure: 1. a base; 2. a fixing ring; 3. an annular groove; 4. a rotating ring; 5. a carrier plate; 6. a rotation mechanism; 61. a first motor; 62. a worm; 63. a lower toothed ring; 7. a multi-station synchronous clamping mechanism; 71. a rotating assembly; 711. a second motor; 712. a first gear; 713. an upper toothed ring; 72. a fixing plate; 73. an adjustment assembly; 731. a rotation shaft; 732. a second gear; 733. a rotating block; 734. adjusting a screw; 735. an adjusting block; 736. a sliding block; 74. a clamping assembly; 741. a toothed plate; 742. a sliding hole; 743. a fixed sleeve; 744. a third gear; 745. a rotating shaft; 746. a turntable; 747. a connecting rod; 748. a connecting block; 749. a clamping plate; 8. a through hole; 9. a clamping plate groove; 10. and a positioning groove.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
Referring to fig. 1-8, an annular fixing jig for testing semiconductor chips in the drawings comprises a base 1, wherein a fixing ring 2 is fixedly connected to the base 1, an annular groove 3 is formed in the outer wall of the fixing ring 2, a rotating ring 4 is rotationally connected to the annular groove 3, the rotating ring 4 is fixedly connected to the inner wall of a carrier plate 5, a rotating mechanism 6 connected with the bottom of the carrier plate 5 is mounted on the base 1, and a multi-station synchronous clamping mechanism 7 is fixedly arranged at the bottom of the carrier plate 5.
Wherein, four corners of the bottom of the base 1 are provided with mounting holes; the installation is convenient.
The multi-station synchronous clamping mechanism 7 consists of a rotating assembly 71, a plurality of adjusting assemblies 73, a plurality of clamping assemblies 74 and a plurality of fixing plates 72, wherein the rotating assembly 71 is meshed with the adjusting assemblies 73, the adjusting assemblies 73 and the clamping assemblies 74 are both rotationally connected to the fixing plates 72, the fixing plates 72 are fixedly connected to the outer wall of the bottom of the carrier plate 5, and the adjusting assemblies 73 are connected with the clamping assemblies 74; the chip fixing device can fix chips with different sizes, has synchronous fixing effect, and greatly improves detection efficiency.
The rotating assembly 71 comprises a second motor 711 installed at the bottom of the carrier plate 5, a first gear 712 is fixedly connected to an output shaft of the second motor 711, the first gear 712 is meshed with an upper toothed ring 713, and the upper toothed ring 713 is rotatably connected to the outer wall of the bottom of the carrier plate 5; for driving the plurality of clamping assemblies 74 to operate in synchronization.
The adjusting assembly 73 comprises a rotating shaft 731 rotatably connected to the fixed plate 72, a second gear 732 meshed with the upper toothed ring 713 is fixedly connected to the outer wall of the rotating shaft 731, a rotating block 733 is fixedly connected to the rotating shaft 731, an adjusting hole is formed in the inner side of the rotating block 733, an adjusting screw 734 is rotatably connected to the adjusting hole, an adjusting block 735 slidably arranged in the adjusting hole is spirally connected to the outer wall of the adjusting screw 734, and a sliding block 736 is fixedly connected to the adjusting block 735; for adjusting the moving distance of the tooth plate 741 so that the moving distance of the clamping plate 749 is changed accordingly, thereby enabling fixing of chips of different sizes.
The clamping assembly 74 comprises a rotating shaft 745 rotationally connected to the fixed plate 72, a gear three 744 is fixedly connected to the outer wall of the rotating shaft 745, the gear three 744 is meshed with a toothed plate 741, the toothed plate 741 is sleeved in a fixed sleeve 743, the fixed sleeve 743 is fixedly connected to the bottom of the carrier plate 5, the toothed plate 741 is L-shaped, one end of the toothed plate 741 is provided with a sliding hole 742, a sliding block 736 is slidably arranged in the sliding hole 742, a turntable 746 is fixedly connected to the rotating shaft 745, the edge of the surface of the turntable 746 is hinged to the bottom of four connecting blocks 748 through four connecting rods 747, clamping plates 749 are fixedly connected to the four connecting blocks 748, the connecting blocks 748 are slidably arranged in through holes 8 formed in the carrier plate 5, and the clamping plates 749 are slidably arranged in clamping plate grooves 9 formed in the carrier plate 5; the fixing device is used for fixing the chip from four sides of the chip, so that the accuracy of the center position of the chip after the chip is fixed is ensured, and the test of the chip is not influenced.
Wherein, the carrier plate 5 is provided with a positioning groove 10 for placing chips at the middle position of the four clamping plate grooves 9; the chip is convenient to place.
In this embodiment, the first motor 711 in the rotating assembly 71 is utilized to drive the first gear 712 to rotate, the first gear 712 can synchronously drive the second gear 732 in the plurality of adjusting assemblies 73 to rotate through the meshing action with the upper toothed ring 713, the second gear 732 drives the rotating shaft 731 to rotate, the rotating shaft 731 drives the rotating block 733 to rotate, the rotating block 733 drives the sliding hole 742 on the adjusting block 735 to rotate, the sliding block 736 can drive the toothed plate 741 in the clamping assembly 74 to move, the toothed plate 741 drives the rotating shaft 745 to rotate through the meshing action with the third gear 744, the rotating shaft 745 drives the turntable 746 to rotate, the turntable 746 drives the connecting block 748 to move through the connecting block 747, and the connecting block 748 drives the clamping plate 749 to move, so that chips can be firmly clamped in the positioning groove 10.
Example two
In addition to the first embodiment and the description thereof, referring to fig. 1, 3 and 6, the rotating mechanism 6 in the illustrated embodiment includes a first motor 61 mounted on the base 1, an output shaft of the first motor 61 is fixedly connected with a worm 62, the worm 62 is meshed with a lower gear ring 63, and the lower gear ring 63 is fixedly connected to an outer wall of the bottom of the carrier plate 5.
In this embodiment, the first motor 61 is started and drives the worm 62 to rotate, and the worm 62 drives the carrier 5 to rotate through the meshing action with the lower toothed ring 63, so that each chip on the carrier 5 can rotate in turn to replace the test position.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a cyclic annular fixed tool is used in semiconductor chip test, includes base (1), its characterized in that: the base (1) is fixedly connected with a fixed ring (2), an annular groove (3) is formed in the outer wall of the fixed ring (2), a rotating ring (4) is rotationally connected to the annular groove (3), the rotating ring (4) is fixedly connected to the inner wall of the carrier plate (5), a rotating mechanism (6) connected with the bottom of the carrier plate (5) is mounted on the base (1), and a multi-station synchronous clamping mechanism (7) is fixedly arranged at the bottom of the carrier plate (5).
2. The annular fixture for testing semiconductor chips as defined in claim 1, wherein: mounting holes are formed in four corners of the bottom of the base (1).
3. The annular fixture for testing semiconductor chips as defined in claim 1, wherein: the rotating mechanism (6) comprises a first motor (61) arranged on the base (1), a worm (62) is fixedly connected to an output shaft of the first motor (61), the worm (62) is meshed with a lower toothed ring (63), and the lower toothed ring (63) is fixedly connected to the outer wall of the bottom of the carrier plate (5).
4. The annular fixture for testing semiconductor chips as defined in claim 1, wherein: the multi-station synchronous clamping mechanism (7) is composed of a rotating assembly (71), a plurality of adjusting assemblies (73), a plurality of clamping assemblies (74) and a plurality of fixing plates (72), wherein the rotating assembly (71) is meshed with the adjusting assemblies (73), the adjusting assemblies (73) and the clamping assemblies (74) are all rotationally connected to the fixing plates (72), the fixing plates (72) are fixedly connected to the outer walls of the bottoms of the carrier plates (5), and the adjusting assemblies (73) are connected with the clamping assemblies (74).
5. The annular fixture for testing semiconductor chips as defined in claim 4, wherein: the rotating assembly (71) comprises a second motor (711) arranged at the bottom of the carrier plate (5), a first gear (712) is fixedly connected to an output shaft of the second motor (711), the first gear (712) is meshed with an upper toothed ring (713), and the upper toothed ring (713) is rotationally connected to the outer wall of the bottom of the carrier plate (5).
6. The annular fixture for testing semiconductor chips as defined in claim 5, wherein: the adjusting component (73) comprises a rotating shaft (731) which is rotationally connected to the fixed plate (72), a gear II (732) which is meshed with the upper toothed ring (713) is fixedly connected to the outer wall of the rotating shaft (731), an adjusting hole is formed in the inner side of the rotating block (733), an adjusting screw (734) is rotationally connected to the adjusting hole, an adjusting block (735) which is arranged in the adjusting hole in a sliding mode is connected to the outer wall of the adjusting screw (734) in a spiral mode, and a sliding block (736) is fixedly connected to the adjusting block (735).
7. The annular fixture for testing semiconductor chips as defined in claim 6, wherein: the clamping assembly (74) comprises a rotating shaft (745) which is rotationally connected to a fixed plate (72), a gear three (744) is fixedly connected to the outer wall of the rotating shaft (745), the gear three (744) is meshed with a toothed plate (741), the toothed plate (741) is sleeved in a fixed sleeve (743), the fixed sleeve (743) is fixedly connected to the bottom of a carrier plate (5), the toothed plate (741) is L-shaped, one end of the toothed plate (741) is provided with a sliding hole (742), a sliding block (736) is slidably arranged in the sliding hole (742), a rotary table (746) is fixedly connected to the rotating shaft (745), edges of the surface of the rotary table (746) are hinged to the bottoms of four connecting blocks (748) through four connecting rods (747), clamping plates (749) are fixedly connected to the four connecting blocks (748), the connecting blocks (748) are slidably arranged in through holes (8) formed in the carrier plate (5), and the clamping plates (749) are slidably arranged in clamping plates (9) formed in the carrier plate (5).
8. The annular fixture for testing semiconductor chips as defined in claim 7, wherein: and positioning grooves (10) for placing chips are formed in the middle positions of the four clamping plate grooves (9) on the carrier plate (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310310846.4A CN116593847A (en) | 2023-03-28 | 2023-03-28 | Annular fixing jig for semiconductor chip test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310310846.4A CN116593847A (en) | 2023-03-28 | 2023-03-28 | Annular fixing jig for semiconductor chip test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN116593847A true CN116593847A (en) | 2023-08-15 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310310846.4A Pending CN116593847A (en) | 2023-03-28 | 2023-03-28 | Annular fixing jig for semiconductor chip test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN116593847A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116953491A (en) * | 2023-09-21 | 2023-10-27 | 深圳市日声数码科技有限公司 | Bluetooth chip test fixture |
-
2023
- 2023-03-28 CN CN202310310846.4A patent/CN116593847A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116953491A (en) * | 2023-09-21 | 2023-10-27 | 深圳市日声数码科技有限公司 | Bluetooth chip test fixture |
| CN116953491B (en) * | 2023-09-21 | 2023-12-15 | 深圳市盟祺科技有限公司 | Bluetooth chip test fixture |
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