CN116590681B - Radio frequency plane cathode - Google Patents
Radio frequency plane cathode Download PDFInfo
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- CN116590681B CN116590681B CN202310869021.6A CN202310869021A CN116590681B CN 116590681 B CN116590681 B CN 116590681B CN 202310869021 A CN202310869021 A CN 202310869021A CN 116590681 B CN116590681 B CN 116590681B
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- 239000011248 coating agent Substances 0.000 abstract description 12
- 238000000576 coating method Methods 0.000 abstract description 12
- 238000010586 diagram Methods 0.000 description 12
- 238000001816 cooling Methods 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000004544 sputter deposition Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000010963 304 stainless steel Substances 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229910000589 SAE 304 stainless steel Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3444—Associated circuits
Abstract
The invention discloses a radio frequency planar cathode, wherein a plurality of radio frequency interfaces are arranged on a cathode component, radio frequency electric connection ends are respectively connected with the radio frequency interfaces, and the impedance between each radio frequency electric connection end and any radio frequency interface is equal. Through the radio frequency plane cathode with the optimal design, the impedance from the radio frequency power-receiving end to the power-receiving point is equal, so that radio frequency power is uniformly distributed on the cathode assembly, the power-receiving point can obtain the same voltage equipotential point, the target utilization rate is ensured, and the uniformity of the coating film is greatly improved.
Description
Technical Field
The invention relates to the technical field of radio frequency plane cathodes, in particular to a radio frequency plane cathode.
Background
Radio frequency sputter coating is often used for sputter depositing dielectric films of insulators. The radio frequency sputtering cathode adopts the method that a radio frequency power supply is connected to the cathode, plasma is formed on the surface of the cathode by discharging, and the target is bombarded by ions in the plasma.
Since the mass of electrons in plasma formed by glow discharge by radio frequency sputtering is small, the moving direction can be changed with a high-speed change of the direction of the electric field. Compared with the direct current sputtering device, electrons emitted from a cathode and directly flown to an anode, electrons generated by radio frequency sputtering oscillate for multiple times along with an external electric field in a discharge space and finally reach the anode, so that the actual travelling path of the electrons is prolonged, the collision probability of each electron and working gas atoms is increased, the gas atom ionization rate is high, and sputtering deposition can be realized under high vacuum.
Therefore, as shown in fig. 1 and 2, the conventional middle single-point power-on mode introduces the radio frequency power, and the radio frequency power further from the power-on point becomes smaller gradually, so that the two sides of the coating film are thin, the middle is thick, and the uniformity is poor. In order to solve the above problems, as shown in fig. 3 and 4, the industry generally adopts a method of connecting one end of a target to an rf cathode coating to solve the problem of coating uniformity. But the target utilization rate is lower in this way. The uniformity of the coating can be improved to a certain extent by simply increasing the power connection point, however, the uniformity of the thickness of the obtained coating still has a defect due to different lengths of radio frequency transmission paths.
Disclosure of Invention
In order to solve the technical problems in the background technology, the invention provides a radio frequency planar cathode.
The invention provides a radio frequency planar cathode, which comprises: a cathode assembly and a radio frequency electrical terminal;
the cathode component is provided with a plurality of radio frequency interfaces, the radio frequency power-on end is respectively connected with the radio frequency interfaces, and the impedance between the radio frequency power-on end and any radio frequency interface is equal.
Preferably, the cathode assembly comprises a cathode base, a magnetic circuit and a target, wherein a plurality of radio frequency interfaces are positioned on one side of the cathode base, the magnetic circuit and the target are arranged on one side of the cathode base away from the radio frequency interfaces, and the magnetic circuit is positioned between the target and the cathode base.
Preferably, the power connector further comprises a power connector, wherein the power connector is provided with a radio frequency input end and a plurality of radio frequency output ends, the radio frequency power connector is connected with the radio frequency input end, each radio frequency interface is connected with one radio frequency output end, and the radio frequency input end is connected with the plurality of radio frequency output ends through a circuit, and the lengths of any two circuits are equal.
Preferably, the power connector is provided with a branch circuit, and each branch circuit comprises a plurality of stages of branches connected in sequence, wherein each stage of branch circuit is provided with a sub-input end connected with the output end of the upper stage of branch circuit and a plurality of sub-output ends connected with the sub-input ends of the lower stage of branch circuit, the sub-input end of the first stage of branch circuit is used as a radio frequency input end, and the sub-output end of the final stage of branch circuit is used as a radio frequency output end.
Preferably, the radio frequency input end is located in the middle of the electrical connector, and the radio frequency electrical connector is installed on the electrical connector.
Preferably, the power connector adopts a power connection plate, and the branch circuit is arranged on the power connection plate;
preferably, the radio frequency input end is positioned at the top of the power connection plate, and the plurality of radio frequency output ends are positioned at the bottom of the power connection plate;
preferably, the middle part of the power connection plate is provided with a radio frequency power connection rod extending upwards from the radio frequency input end, and the radio frequency power connection end is arranged at the upper end of the radio frequency power connection rod.
Preferably, the cathode assembly is provided with a receiving groove for receiving the power connector.
Preferably, the branch circuits are symmetrically distributed on both sides of the radio frequency power connection terminal.
Preferably, the branch circuit comprises N-level branches, wherein the X-level branch is positioned between the X-1 level branch and the X-2 level branch, X and N are natural numbers, and X is more than or equal to 2 and less than or equal to N;
preferably, each stage branch of the branching circuit is provided with two sub-outputs.
Preferably, each sub-input end is provided with a positioning hole, and a positioning screw fixed with the cathode base is arranged at the positioning hole.
In the invention, a plurality of radio frequency interfaces are arranged on the cathode component, the radio frequency power-on end is respectively connected with the radio frequency interfaces, and the impedance between the radio frequency power-on end and any radio frequency interface is equal. Through the radio frequency plane cathode with the optimal design, the impedance from the radio frequency power-receiving end to the power-receiving point is equal, so that radio frequency power is uniformly distributed on the cathode assembly, the power-receiving point can obtain the same voltage equipotential point, the target utilization rate is ensured, and the uniformity of the coating film is greatly improved.
Drawings
Fig. 1 is a schematic diagram of a radio frequency power connection mode in the prior art of the present invention.
Fig. 2 is a schematic diagram of a shape of a plating film in the rf power-on mode of fig. 1.
Fig. 3 is a schematic diagram of another rf power connection mode according to the prior art of the present invention.
Fig. 4 is a schematic diagram of a shape of a plating film of the rf power-on method of fig. 3.
Fig. 5 is a schematic structural diagram of an embodiment of a radio frequency planar cathode according to the present invention.
Fig. 6 is a schematic diagram of a shape of a coating film of an embodiment of a radio frequency planar cathode according to the present invention.
Fig. 7 is a schematic structural diagram of a power connector according to an embodiment of a radio frequency planar cathode according to the present invention.
Fig. 8 is a schematic diagram of a branch circuit structure of a power connector according to an embodiment of a radio frequency planar cathode according to the present invention.
Fig. 9 is a schematic structural diagram of a power connector according to an embodiment of a radio frequency planar cathode according to the present invention.
Fig. 10 is a schematic structural diagram of a power connection plate of an embodiment of a radio frequency planar cathode according to the present invention.
Fig. 11 is a schematic structural diagram of an electrical connection plate of an embodiment of a radio frequency planar cathode according to the present invention mounted on a cathode base.
Fig. 12 is a schematic structural diagram of an embodiment of an rf planar cathode according to the present invention.
Fig. 13 is a partial schematic view of the structure of fig. 12.
Detailed Description
As shown in fig. 5 to 13, fig. 5 is a schematic structural view of an embodiment of a radio frequency planar cathode according to the present invention, fig. 6 is a schematic film plating shape of an embodiment of a radio frequency planar cathode according to the present invention, fig. 7 is a schematic structural view of a power connector according to an embodiment of a radio frequency planar cathode according to the present invention, fig. 8 is a schematic branch circuit structure of a power connector according to an embodiment of a radio frequency planar cathode according to the present invention, fig. 9 is a schematic structural view of a power connector according to an embodiment of a radio frequency planar cathode according to the present invention, fig. 10 is a schematic structural view of a power connector according to an embodiment of a radio frequency planar cathode according to the present invention, fig. 11 is a schematic structural view of a power connector according to an embodiment of a radio frequency planar cathode according to the present invention mounted on a cathode base, fig. 12 is a schematic structural view of an embodiment of a radio frequency planar cathode according to the present invention, and fig. 13 is a partial structural view of fig. 12.
Referring to fig. 5 and 6, a radio frequency planar cathode according to the present invention includes: a cathode assembly and a radio frequency power connection terminal 1;
the cathode component is provided with a plurality of radio frequency interfaces, the radio frequency power-on terminal 1 is respectively connected with the radio frequency interfaces, and the impedance between the radio frequency power-on terminal 1 and any radio frequency interface is equal.
In a specific design manner, the cathode assembly of the present embodiment includes a cathode base 11, a magnetic circuit 15 and a target 17, a plurality of radio frequency interfaces are located on one side of the cathode base 11, the magnetic circuit 15 and the target 17 are installed on one side of the cathode base 11 away from the radio frequency interfaces, and the magnetic circuit 15 is located between the target 17 and the cathode base 11.
In the specific operation of the rf planar cathode of this embodiment, rf current is uniformly transmitted from the rf power connection terminal to the cathode base 11 via a plurality of rf interfaces. A magnetic circuit 15 is arranged between the cathode base 11 and the target 17, and a magnetic field generated by the magnetic circuit 15 can capture secondary electrons, prolong the electron movement path and effectively inhibit the bombardment of high-energy electrons on the substrate. The radio frequency power is transmitted by adopting an equal impedance power connection mode, so that the electric field intensity on the surface of the target 17 is ensured to be uniform, the target is uniformly consumed, the thickness of a coating film on a substrate is further ensured to be uniform, the height difference (higher uniformity of the coating film) meets the requirements, and the utilization rate of the target is improved.
In this embodiment, the cathode assembly is provided with a plurality of rf interfaces, the rf power-on terminals are respectively connected with the plurality of rf interfaces, and the impedance between the rf power-on terminals and any rf interface is equal. Through the radio frequency plane cathode with the optimal design, the impedance from the radio frequency power-receiving end to the power-receiving point is equal, so that radio frequency power is uniformly distributed on the cathode assembly, the power-receiving point can obtain the same voltage equipotential point, the target utilization rate is ensured, and the uniformity of the coating film is greatly improved.
In actual operation, the radio frequency power connection end and the radio frequency interface can be respectively connected by directly adopting leads with equal length so as to ensure that the impedance of the connection paths is equal.
In a specific embodiment, in order to facilitate the equal impedance connection of the radio frequency, the radio frequency planar cathode of the present embodiment further includes a power connector, on which a radio frequency input end 61 and a plurality of radio frequency output ends 62 are disposed, the radio frequency power connector 1 is connected with the radio frequency input end 61, each radio frequency interface is connected with one radio frequency output end 62, and the radio frequency input end 61 is connected with the plurality of radio frequency output ends 62 through a line, and any two lines have equal lengths. The structure of the electrical connector can be designed according to the shape of the target material. For example, to fit a circular target, the structure shown in fig. 7 may be designed. During installation, the radio frequency output end of the electric connector is connected with the radio frequency interface of the cathode assembly respectively, and the radio frequency electric connection end is connected with the radio frequency input end of the electric connector, so that the impedance of each radio frequency connection path is equal.
In the specific design mode of the electric connector, a one-to-many branching mode can be adopted, and a multi-stage branch circuit mode can also be adopted.
Referring to fig. 7 and 8, in one embodiment, the branching circuit includes multiple stages of branches connected in sequence, each stage of branches having one sub-input connected to the output of the upper stage branch and multiple sub-outputs connected to the sub-inputs of the lower stage branch, the sub-input of the first stage branch being the radio frequency input 61 and the sub-output of the last stage branch being the radio frequency output 62. The branch circuits are designed in a multi-stage branch way, so that the design is convenient, and the radio frequency output of different output ends is ensured to be equal.
Further, as shown in fig. 7, the rf input terminal 61 is located in the middle of the electrical connector, and the rf electrical connector 1 is mounted on the electrical connector. In practical design, as shown in fig. 9, the rf input terminal may be located in the middle of the connector, and the branch circuits may be led out to both sides or up and down.
In order to facilitate the manufacture of the branch circuit, referring to fig. 10, the power connector adopts the power connector board 6, and the branch circuit is arranged on the power connector board 6, so that the space occupation rate is reduced during installation. Specifically, the rf input 61 is located at the top of the power board 6, and the rf outputs 62 are located at the bottom of the power board 6. The middle part of the power connection plate 6 is provided with a radio frequency power connection rod 2 which extends upwards from a radio frequency input end 61, and a radio frequency power connection end 1 is arranged at the upper end of the radio frequency power connection rod 2.
Referring to fig. 11, in a specific installation mode of the power receiving plate, a receiving groove for placing the power receiving device is formed in the cathode assembly, on one hand, space occupation of the power receiving plate can be reduced, on the other hand, the power receiving plate can be placed in the receiving groove during installation, positioning is performed on the power receiving plate, and then the radio frequency output ends are connected with the radio frequency interfaces respectively.
In addition, the middle part of the power connection plate 6 is provided with a radio frequency power connection rod 2 which extends upwards, and a radio frequency power connection end 1 is arranged at the upper end of the radio frequency power connection rod 2.
In the specific arrangement mode of the branch circuits, the branch circuits are symmetrically distributed on two sides of the radio frequency power connection end 1.
Specifically, the branch circuit comprises N-level branches, wherein the X-level branch is positioned between the X-1 level branch and the X-2 level branch, X and N are natural numbers, and X is more than or equal to 2 and less than or equal to N. As shown in fig. 10 and 11, the branch circuit forms a loop structure to improve the space utilization on the power board.
In the preferred design, each stage of branch circuit is provided with two sub-output ends, so that a branch of one-to-two and four-to-one is formed, and the design convenience and the radio frequency uniformity are further improved.
Referring to fig. 12 and 13, in the installation of the power connection plate, a positioning hole may be provided at each sub-input end, a positioning screw 8 fixed to the cathode base 11 is installed at the positioning hole, and the multi-point positioning of the power connection plate is performed by the positioning screw, so as to ensure the connection reliability of the radio frequency output end on the power connection plate and the radio frequency interface on the cathode base.
A radio frequency planar cathode of the present embodiment is described in detail below by way of example.
The radio frequency power-receiving end 1 is connected with a water-cooling interface of the power-receiving end, cooling circulating water is provided for the radio frequency power-receiving rod 2, the power-receiving base 4 is arranged at the bottom of the radio frequency power-receiving rod 2, contact pretightening force is provided for the power-receiving plate 6 and the radio frequency power-receiving rod 2, and the power-receiving base is used as a waterway sealing baffle of the radio frequency power-receiving rod 2.
The radio frequency power is transmitted to the electric connection plate 6 by the radio frequency electric connection rod 2, the electric connection plate 6 adopts an equal impedance structure, the impedance of each electric connection point is equal, the electric connection points can obtain equal voltage equal potential points, the radio frequency power is transmitted to the surface of the target 17 through the conducting ring 7, radio frequency current transmission parts such as the radio frequency electric connection rod 2, the electric connection base 4, the electric connection plate 6 and the conducting ring 7 all adopt oxygen-free high-conductivity copper, the radio frequency current transmission efficiency can be effectively improved, and 99 alumina ceramic ring gaskets are arranged on the upper portion and the lower portion of the evenly distributed node positions and used for maintaining the operation stability of the electric connection plate 6, and the functions of supporting and electric insulation are achieved.
The radio frequency power is transmitted by adopting an equal impedance power connection mode, and the radio frequency power can be uniformly transmitted to the cathode base 11 on the back of the target 17. The cathode base 11 is made of 304 stainless steel, is used for installing a magnetic circuit, and provides a passage and a closed space for cooling the magnetic circuit. The bottom of the cathode base 11 is provided with a copper back plate 16 for magnetic circuit water cooling sealing and radio frequency power transmission, a fluororubber O ring is used for sealing between the copper back plate 16 and the cathode base 11, and a target 17 is arranged at the bottom of the copper back plate 16.
The cathode base 11 is internally provided with two paths of annularly distributed magnetic circuits, the magnetic circuits are positioned on the back surface of the target 17, the magnetic field generated by the magnetic circuits can capture secondary electrons, the electron motion path is prolonged, the collision probability of electrons and ionized gas is improved, the gas ionization rate is further improved, the deposition rate and the coating quality are improved, and the bombardment of high-energy electrons on the substrate can be effectively inhibited. A water cooling channel is arranged in the middle of the magnetic circuit, and a circulating water cooling system is externally connected with the magnetic circuit water cooling inlet and outlet through a magnetic circuit water cooling connecting pipe.
The cathode base 11 is provided with a back insulating plate 27 made of polytetrafluoroethylene, the back insulating plate 27 is provided with an anode backboard, a PEEK insulating cover is arranged between the anode backboard and the radio frequency electric pole 2, an anode side plate and an anode baffle are arranged below the anode backboard, the anode top plate is arranged below the anode side plate, the anode is made of aluminum alloy materials for reducing weight, and the surface facing the target 17 is subjected to sand blasting treatment.
The cathode base 11 of the present invention is designed to be located inside the vacuum chamber, and the water path cooling structure is adopted, which is not necessarily limited thereto. The back of the cathode base 11 can be arranged at the outer side of vacuum, the magnetic circuit and the power-on parts are uniformly distributed at the outer side of vacuum, and the outer side of vacuum can cool the magnet in a cooling mode except water cooling.
The foregoing is only a preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art, who is within the scope of the present invention, should make equivalent substitutions or modifications according to the technical scheme of the present invention and the inventive concept thereof, and should be covered by the scope of the present invention.
Claims (7)
1. A radio frequency planar cathode, comprising: a cathode assembly and a radio frequency electrical terminal (1);
the cathode component is provided with a plurality of radio frequency interfaces, the radio frequency power-on end (1) is respectively connected with the radio frequency interfaces, and the impedance between the radio frequency power-on end (1) and any radio frequency interface is equal;
the cathode assembly comprises a cathode base (11), a magnetic circuit (15) and a target (17), a plurality of radio frequency interfaces are arranged on one side of the cathode base (11), the magnetic circuit (15) and the target (17) are arranged on one side of the cathode base (11) far away from the radio frequency interfaces, and the magnetic circuit (15) is arranged between the target (17) and the cathode base (11);
the power-on device further comprises a power-on device, wherein a radio frequency input end (61) and a plurality of radio frequency output ends (62) are arranged on the power-on device, the radio frequency power-on end (1) is connected with the radio frequency input end (61), each radio frequency interface is connected with one radio frequency output end (62), the radio frequency input end (61) is connected with the plurality of radio frequency output ends (62) through a circuit, and the lengths of any two circuits are equal;
the power connector is provided with a branch circuit, the branch circuit comprises a plurality of stages of branches which are sequentially connected, each stage of branch circuit is provided with a sub-input end connected with the output end of the upper stage of branch circuit and a plurality of sub-output ends connected with the sub-input ends of the lower stage of branch circuit, the sub-input end of the first stage of branch circuit is used as a radio frequency input end (61), and the sub-output end of the final stage of branch circuit is used as a radio frequency output end (62);
the radio frequency input end (61) is positioned in the middle of the power connector, and the radio frequency power connector (1) is arranged on the power connector;
the power connector adopts a power connection plate (6), and the branch circuit is arranged on the power connection plate (6);
the branch circuit comprises N-level branches, wherein the X-level branch is positioned between the X-1 level branch and the X-2 level branch, X and N are natural numbers, and X is more than or equal to 2 and less than or equal to N.
2. The rf planar cathode of claim 1, wherein the rf input (61) is located at the top of the power plate (6) and the plurality of rf outputs (62) are located at the bottom of the power plate (6).
3. The radio frequency planar cathode according to claim 2, wherein the radio frequency power receiving rod (2) extending upwards from the radio frequency input end (61) is arranged in the middle of the power receiving plate (6), and the radio frequency power receiving end (1) is arranged at the upper end of the radio frequency power receiving rod (2).
4. The radio frequency planar cathode according to claim 1, wherein the cathode assembly is provided with a receiving slot for receiving a power connector.
5. The radio frequency planar cathode according to claim 1, characterized in that the branch circuits are symmetrically distributed on both sides of the radio frequency terminal (1).
6. The radio frequency planar cathode according to claim 1, wherein each stage branch of the branching circuit is provided with two sub-outputs.
7. The radio frequency planar cathode according to claim 1, characterized in that a positioning hole is provided at each sub-input, said positioning Kong Chuan being provided with a positioning screw (8) fixed to the cathode assembly.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310728698 | 2023-06-16 | ||
| CN2023107286988 | 2023-06-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN116590681A CN116590681A (en) | 2023-08-15 |
| CN116590681B true CN116590681B (en) | 2023-10-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202310869021.6A Active CN116590681B (en) | 2023-06-16 | 2023-07-17 | Radio frequency plane cathode |
| CN202311172272.5A Pending CN117276045A (en) | 2023-06-16 | 2023-09-12 | Radio frequency plane cathode and radio frequency power connection plate thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN202311172272.5A Pending CN117276045A (en) | 2023-06-16 | 2023-09-12 | Radio frequency plane cathode and radio frequency power connection plate thereof |
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| US7520244B2 (en) * | 2003-04-04 | 2009-04-21 | Asm Japan K.K. | Plasma treatment apparatus |
| WO2009142016A1 (en) * | 2008-05-22 | 2009-11-26 | 株式会社イー・エム・ディー | Plasma generating apparatus and plasma processing apparatus |
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| CN218596493U (en) * | 2022-10-24 | 2023-03-10 | 柳州长虹数控机床有限责任公司 | Target cathode magnetic steel arrangement structure and magnetron sputtering device adopting same |
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| CN117276045A (en) | 2023-12-22 |
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